Display module and display device

Abstract

The application provides a display module and a display device. The display module has at least one splicing side and comprises a middle area and a peripheral area. The peripheral area comprises a non-splicing area and a splicing area. The splicing area corresponds to the splicing side and comprises a first area and a second area located on both sides of the first area. The display module comprises a substrate arranged in the middle area and the peripheral area, and a heat conduction component arranged on the back of the substrate and comprising a first heat conduction part and a second heat conduction part. The first heat conduction part is arranged at least in the first area, and the second heat conduction part is arranged in the non-splicing area and / or the second area. The heat conduction coefficient of the first heat conduction part is greater than that of the second heat conduction part. By arranging the first heat conduction part with a higher heat conduction coefficient in the first area and the second heat conduction part with a lower heat conduction coefficient in the second area or the non-splicing area, the heat and expansion of the substrate corresponding to the first area and the second area can be effectively balanced, thereby improving the splicing effect.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] Large-size display devices are widely used in various indoor and outdoor applications, and are mainly composed of multiple small MicroLED display modules spliced ​​together. Because MicroLED display modules generate heat during use, uneven heating of the glass substrates within the modules leads to different amounts of thermal expansion on the splicing sides, affecting the splicing effect. Summary of the Invention

[0003] In view of this, this application provides a display module and display device to improve the problem of poor splicing effect of display modules.

[0004] The technical solution adopted in this application to solve the above-mentioned technical problems is as follows:

[0005] In a first aspect, embodiments of this application provide a display module, the display module having at least one splicing side and including a middle area and a peripheral area, the peripheral area including a non-sponge area and a splicing area, the splicing area corresponding to the splicing side and including a first area and a second area located on both sides of the first area, the display module comprising:

[0006] A substrate is disposed in the middle region and the peripheral region;

[0007] A thermally conductive component is disposed on the back side of the substrate and includes a first thermally conductive portion and a second thermally conductive portion. The first thermally conductive portion is disposed at least in the first region, and the second thermally conductive portion is disposed in the non-splicing region and / or the second region.

[0008] The thermal conductivity of the first heat-conducting part is greater than that of the second heat-conducting part.

[0009] In some embodiments of this application, the first heat-conducting part is disposed in the middle region and the first region, the second heat-conducting part is disposed in the non-joined region and the second region, the area of ​​the portion of the second heat-conducting part disposed in the second region is smaller than the area of ​​the second region, and the portion of the second heat-conducting part disposed in the second region is disposed close to the first region.

[0010] In some embodiments of this application, the area of ​​the second heat-conducting part gradually decreases from the middle region toward the first region.

[0011] In some embodiments of this application, the deformation resistance of the portion of the substrate corresponding to the first region is less than the deformation resistance of the portion of the substrate corresponding to the second region.

[0012] In some embodiments of this application, the thermally conductive component includes a thermally conductive coating and a heat sink. The thermally conductive coating is disposed on the back side of the substrate and includes a first sub-coating and a second sub-coating. The first sub-coating is disposed in the middle region and the first region, and the second sub-coating is disposed in the non-joined region and the second region. The heat sink overlaps the first sub-coating on the side away from the substrate to jointly form the first thermally conductive portion, and the second sub-coating forms the second thermally conductive portion.

[0013] In some embodiments of this application, the thermally conductive coating is a graphene coating, and the heat sink is a copper sheet.

[0014] In some embodiments of this application, the substrate has a width direction, and along the width direction, the distance between the outer side of the first region and the center of the substrate is less than the distance between the outer side of the second region and the center of the substrate.

[0015] In some embodiments of this application, the splicing side is concave in the direction toward the center of the substrate.

[0016] In some embodiments of this application, the cross-sectional profile of the splicing side along the width direction is arc-shaped, and / or the cross-sectional profile of the splicing side along the thickness direction of the substrate is arc-shaped.

[0017] Secondly, embodiments of this application provide a display device comprising at least two display modules as described in the first aspect, spliced ​​together.

[0018] In summary, due to the adoption of the above technical solution, this application includes at least the following beneficial effects:

[0019] This application provides a display module and display device, which mainly achieves better heat dissipation for the first region, which receives more heat, by placing a first heat-conducting part with a high thermal conductivity in a first region and a second heat-conducting part with a low thermal conductivity in a second region and / or a non-splicing region. This balances the thermal expansion of the substrate corresponding to the first and second regions, making the expansion deformation on the splicing side more uniform and improving the adverse effects of uneven heating on the splicing effect. Specifically, to address the problem of uneven heating of the substrate, targeted heat dissipation is performed on areas receiving more heat. Specifically, by placing a first heat-conducting part with a high thermal conductivity at least in the first region and a second heat-conducting part with a low thermal conductivity in the second region and / or a non-splicing region, the heat dissipation effect in the first region is improved, balancing the heat of the substrate corresponding to the first and second regions, thereby reducing the difference in the amount of thermal expansion deformation between the portions of the substrate corresponding to the first and second regions. This effectively improves the problem of significant changes in the width of the splicing seam formed by splicing two substrates on the splicing side, and improves the display effect. Attached Figure Description

[0020] Figure 1 A schematic diagram of a display module provided for an embodiment of this application;

[0021] Figure 2 A schematic diagram of another display module provided for an embodiment of this application;

[0022] Figure 3 A schematic diagram illustrating the splicing of two display modules in a display device provided for an embodiment of this application;

[0023] Figure 4 for Figure 3 A schematic diagram of the cross-section of line A-A';

[0024] Figure 5 This is a schematic diagram of a display device provided for an embodiment of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 100. Display module; 110. Substrate; 111. Middle area; 112. Peripheral area; 1121. First area; 1122. Second area; 113. Splicing side; 120. Thermal conductive component; 121. Thermal conductive coating; 1211. First sub-coating; 1212. Second sub-coating; 122. Heat sink; 123. First thermal conductive part; 124. Second thermal conductive part; X, length direction; Y, width direction. Detailed Implementation

[0027] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0028] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0029] In this application, the term "exemplary" is used to mean "used as an example, illustration, or illustration." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments.

[0030] Please see Figure 1 and Figure 2 This application provides a display module 100, which has at least one splicing side 113 and includes a middle region 111 and a peripheral region 112. The peripheral region 112 includes a non-sponge area and a splicing area. The splicing area corresponds to the splicing side 113 and includes a first region 1121 and a second region 1122 located on both sides of the first region 1121. The display module 100 includes:

[0031] Substrate 110 is disposed in the middle region 111 and the peripheral region 112;

[0032] A heat-conducting component 120 is disposed on the back side of the substrate 110 and includes a first heat-conducting part 123 and a second heat-conducting part 124. The first heat-conducting part 123 is at least disposed in a first region 1121, and the second heat-conducting part 124 is disposed in a non-splicing region and / or a second region 1122.

[0033] The thermal conductivity of the first heat-conducting part 123 is greater than that of the second heat-conducting part 124.

[0034] The technical solution provided in this application mainly involves placing a first heat-conducting part 123 with a high thermal conductivity in the first region 1121 and a second heat-conducting part 124 with a low thermal conductivity in the second region 1122 and / or the non-splicing region. This achieves better heat dissipation for the first region 1121, which receives more heat, and balances the expansion of the substrate 110 corresponding to the first region 1121 and the second region 1122 due to thermal expansion. This ensures that the expansion deformation of the splicing side 113 is uniform, improving the adverse effects of uneven heating of the substrate 110 on the splicing effect. Specifically, to address the problem of uneven heating of the substrate 110, targeted heat dissipation is implemented for areas receiving more heat. Specifically, by providing at least a first heat-conducting part 123 with a high thermal conductivity in the first region 1121 and a second heat-conducting part 124 with a low thermal conductivity in the second region 1122 and / or the non-splicing region, the heat dissipation effect in the first region 1121 is improved, the heat of the substrate 110 corresponding to the first region 1121 and the second region 1122 is balanced, and the difference between the amount of thermal expansion deformation of the portion of the substrate 110 corresponding to the first region 1121 and the portion corresponding to the second region 1122 is reduced. This effectively improves the problem of significant changes in the width of the splicing seam formed by splicing the splicing side 113 of the two substrates 110, and improves the display effect.

[0035] In some embodiments, a first heat-conducting portion 123 is disposed in the intermediate region 111 and the first region 1121, and a second heat-conducting portion 124 is disposed in the non-joined region and the second region 1122. The area of ​​the portion of the second heat-conducting portion 124 disposed in the second region 1122 is smaller than the area of ​​the second region 1122, and the portion of the second heat-conducting portion 124 disposed in the second region 1122 is disposed close to the first region 1121. By making the thermal conductivity of the second heat-conducting portion 124 disposed in the second region 1122 less than the thermal conductivity of the first heat-conducting portion 123 disposed in the first region 1121, the first region 1121 and the second region 1122 have different thermal conductivity effects. Specifically, the thermal conductivity of the first region 1121 is greater than that of the second region 1122, thereby enabling the first region 1121, which receives more heat, to achieve better heat dissipation, thus balancing the heat and thermal expansion of the substrate 110 in the first region 1121 and the second region 1122.

[0036] It should be noted that, in some embodiments, the first heat-conducting part 123 may be disposed only in the first region 1121, and the second heat-conducting part 124 may be disposed in the non-splicing region and the second region 1122; in some embodiments, the first heat-conducting part 123 may be disposed in the middle region 111 and the first region 1121, and the second heat-conducting part 124 may be disposed in the non-splicing region and not in the second region 1122; in some embodiments, the first heat-conducting part 123 may be disposed in the middle region 111 and the first region 1121, and the second heat-conducting part 124 may be disposed only in the second region 1122 and not in the non-splicing region. The specific arrangement method adopted is mainly determined according to the heat received at different positions of the substrate 110, and is not limited here. However, in this application, the following embodiments are described based on the technical solution of the first heat-conducting part 123 being disposed in the middle region 111 and the first region 1121, and the second heat-conducting part 124 being disposed in the non-splicing region and the second region 1122.

[0037] In some embodiments, the deformation resistance of the portion of substrate 110 corresponding to the first region 1121 is less than the deformation resistance of the portion of substrate 110 corresponding to the second region 1122. The portion of substrate 110 corresponding to the first region 1121 is defined as the first portion, and the portion of substrate 110 corresponding to the second region 1122 is defined as the second portion. The fact that the deformation resistance of the first portion is less than that of the second portion is mainly determined by the structure of substrate 110 itself. The strength at the corners of a plate-like object is generally higher than the strength at the sides, and the strength is higher closer to the corners. Since the deformation resistance of the first portion is less than that of the second portion, and the heat received by the first portion is greater than that received by the second portion, the thermal expansion of the first portion is greater than that of the second portion, resulting in the splicing side 113 being unable to maintain its original linear shape in the length direction. Substrate 110 has a length direction X. Along the length direction X, the second part is located on both sides of the first part, and the heat received by the splicing side 113 gradually increases from the second part toward the first part, while the strength of the splicing side 113 gradually decreases from the second part toward the first part. In other words, along the length direction X, the first part of the splicing side 113 expands more easily and with a greater expansion amount than the second part of the splicing side 113. Specifically, when the substrate 110 expands due to heat, its center generally receives more heat, resulting in a greater expansion amount at the center than at the edges. This is because the expansion at the center of the substrate 110 further transmits the expansion force to the edges, i.e., the splicing side 113, causing further expansion and deformation of the splicing side 113. Furthermore, based on the structural characteristics of the substrate 110, which is square, the expansion amount of the splicing side 113 is generally greater for the first part than for the second part. Furthermore, the heat received by the first part of the splicing side 113 is greater than that received by the second part, further increasing the difference in expansion between the first and second parts of the splicing side 113. In this embodiment and subsequent embodiments, the description is based on the premise that the expansion of the first part of the splicing side 113 is greater than that of the second part.

[0038] Furthermore, in this application, a glass substrate 110 is used for the substrate 110.

[0039] It should also be noted that the problem of poor splicing effect of multiple substrates 110 due to thermal expansion mainly occurs in Micro LED display modules 100, where the splicing gap between multiple Micro LED display modules 100 ranges from 20 to 80 μm. Because the gap is small, even a small amount of thermal expansion of the substrate 110 can significantly alter the splicing gap, affecting the splicing effect. Furthermore, thermal expansion of the substrate 110 can cause compression between the two spliced ​​substrates 110 on the splicing side 113, affecting the lifespan of the substrate 110. In severe cases, the substrate 110 may even break due to expansion and compression. Therefore, all embodiments in this application are primarily described for Micro LED display devices. However, the technical solution provided in this application, which utilizes different thermal conductivity coefficients at different locations of the thermally conductive component 120 to balance the expansion amount, is also applicable to other display devices.

[0040] In some embodiments, see Figure 1The first heat-conducting part 123 is disposed close to the first region 1121 on the side facing the splicing side 113, and the second heat-conducting part 124 is disposed away from the second region 1122 on the side facing the splicing side 113. The first heat-conducting part 123 is attached to the middle region 111, which refers to the middle position of the plane of the back of the display module 100. The display module 100 is square, and the back is also square. The substrate 110 is also square. The first heat-conducting part 123 can be rectangular, circular, prismatic, etc., and is not limited. In this embodiment, it is preferred that the first heat-conducting part 123 is rectangular, and the geometric center of the first heat-conducting part 123 coincides with the geometric center of the back of the substrate 110, so that the first heat-conducting part 123 is located in the center of the back of the substrate 110. The coincidence of the geometric center of the first heat-conducting part 123 with the geometric center of the back of the substrate 110 is mainly applicable when all the circumferential sides of the substrate 110 participate in the splicing and are all splicing sides 113. If the substrate 110 has only one side as the splicing side 113, the first heat-conducting part 123 is attached to the middle region 111 and positioned close to the first region 1121 of the splicing side 113, allowing the first heat-conducting part 123 to achieve better heat dissipation. Furthermore, the thermal conductivity of the first heat-conducting part 123 is greater than that of the second heat-conducting part 124, enabling the middle region of the substrate 110, which receives more heat, to achieve better heat dissipation, while the outer region 112 of the substrate 110, which receives less heat, receives relatively less heat dissipation, thus achieving a balanced heat dissipation and uniform expansion of the substrate 110. Moreover, the placement of the first heat-conducting part 123 in the middle region 111 effectively prevents the substrate 110 from bulging due to excessive thermal expansion. The second heat-conducting part 124 is positioned away from the second region 1122 on the side facing the splicing side 113. This ensures that no heat-conducting component 120 is provided at the second region 1122 of the substrate 110, or the area of ​​the heat-conducting component 120 attached to the second region 1122 is much smaller than the area of ​​the heat-conducting component 120 attached to the middle region 111 and smaller than the area of ​​the heat-conducting component 120 attached to the first region. This further improves the heat conduction effect of the middle region 111 and reduces the heat conduction effect at the corners, achieving a balance between the thermal expansion of the first region 1121 and the second region 1122 on the splicing side 113. Because the heat received by the second part is less than that of the first part, and based on the structure of the substrate 110 itself, the deformation resistance of the second part is greater than that of the first part, resulting in a smaller expansion of the second part than that of the first part. Thus, by setting the first and second heat-conducting parts, the expansion of the first part and the expansion of the second part can be balanced, avoiding the impact on the splicing effect due to large differences in expansion at different positions on the splicing side 113. Furthermore, by utilizing the first heat-conducting part 123 and the second heat-conducting part 124 to reduce the expansion amount on the outer side of the first part, it is also possible to effectively prevent the splicing side 113 of the two spliced ​​substrates 110 from cracking due to excessive expansion pressure.

[0041] In some embodiments, see Figure 2 From the central region 111 of the display module 100 toward the first region 1121, the area of ​​the second heat-conducting part 124 gradually decreases. By gradually reducing the area of ​​the second heat-conducting part 124 attached to the back of the substrate 110 along the direction from the center of the display module 100 toward the first region 1121, the heat dissipation effect of the second heat-conducting part 124 on the center of the substrate 110 is maximized to address the characteristic that the center of the substrate 110 receives the most heat. The second heat-conducting part 124 moves closer to the first region 1121 and its area gradually decreases, meaning that the closer the second heat-conducting part 124 is to the first region 1121, the further away it is from the second region 1122. This increases the difference in heat dissipation between the first region 1121 and the second region 1122, making the heat dissipation of the first region 1121 greater than that of the second region 1122. This balances the fact that the heat received by the first region 1121 is greater than that received by the second region 1122, thereby improving the problem of uneven expansion of the splicing side 113. Furthermore, the area of ​​the second heat-conducting part 124 gradually decreases, which can also reduce heat dissipation costs. The area of ​​the second heat-conducting part 124 gradually decreases along the direction from the center of the substrate 110 toward the splicing side 113, making the change in heat dissipation smoother and avoiding abrupt changes in heat dissipation of the substrate 110, which is beneficial to maintaining the overall thermal expansion of the substrate 110.

[0042] In some embodiments, the thermally conductive assembly 120 includes a thermally conductive coating 121 and a heat sink 122. The thermally conductive coating 121 is disposed on the back side of the substrate 110 and includes a first sub-coating 1211 and a second sub-coating 1212. The first sub-coating 1211 is disposed in the intermediate region 111 and the first region 1121, and the second sub-coating 1212 is disposed in the non-joined region and the second region 1122. The heat sink 122 overlaps the first sub-coating 1211 on the side away from the substrate 110 to jointly form the first thermally conductive portion 123, and the second sub-coating 1212 forms the second thermally conductive portion 124. By overlapping the heat sink 122 with the first sub-coating 1211, while not overlapping the heat sink 122 on the second sub-coating 1212, the thermally conductive assembly 120 can form two regions with different thermal conductivity coefficients, namely the first thermally conductive portion 123 and the second thermally conductive portion 124.

[0043] Furthermore, the thermally conductive coating 121 is a graphene coating, and the heat sink 122 is a metal sheet, preferably a copper sheet. It should also be noted that the copper sheet is preferably fixed using thermally conductive adhesive. The thickness of the graphene coating ranges from 0.5 to 1 mm, preferably 0.5 mm; the thickness of the copper sheet ranges from 0.5 to 1 mm, preferably 0.5 mm; and the thickness of the thermally conductive adhesive ranges from 0.5 to 1 mm, preferably 1 mm. The substrate 110 is a glass substrate 110 with a thickness of 400 μm, square in shape, 200 mm long and 200 mm wide. In an environment of 80°C, the maximum expansion at the center of the edge of the substrate 110, i.e., the middle position of the side of the substrate 110, is not less than 20 μm, and the maximum expansion at the edges of the substrate 110, i.e., the two ends of the side of the substrate 110, is not less than 15 μm.

[0044] In some embodiments, see Figure 3 The substrate 110 has a width direction Y, which is perpendicular to the length direction X. Along the width direction Y, the distance between the outer side of the first region 1121 and the center of the substrate 110 is less than the distance between the outer side of the second region 1122 and the center of the substrate 110. In other words, the first region 1121 is closer to the center of the substrate 110 in the width direction Y than the second region 1122. When the two substrates 110 are spliced, the splice seam width defined by the outer side of the first region 1121 of the two substrates 110 will be greater than the splice seam width defined by the outer side of the second region 1122. This allows for expansion space for the first region 1121, which has a larger expansion amount, and avoids excessive expansion and compression forces on the outer sides of the first region 1121 of the two substrates 110, which could cause the substrate 110 to break.

[0045] Furthermore, the splicing side 113 is concave in the direction towards the center of the substrate 110. Specifically, the outer side of the first region 1121 and the outer side of the second region 1122 are connected in an arc shape. That is, with the viewing angle perpendicular to the back of the substrate 110, the splicing side 113 formed by the outer sides of the first region 1121 and the second region 1122 is in a concave arc shape. Compared with the straight edge splicing side 113, the arc-shaped splicing side 113 has higher resistance to deformation, and the splicing side 113 can adapt to the arc-shaped change of expansion amount. That is, from the middle of the splicing side 113 towards both ends, the change of expansion amount gradually decreases, and the splicing seam formed by the two splicing sides 113 also gradually decreases, improving the smoothness of the expansion deformation of the splicing side 113.

[0046] In some embodiments, see Figure 4The substrate 110 also has a thickness direction, and the cross-sectional profile of the splicing side 113 along the thickness direction is arc-shaped, which is beneficial to improving the strength of the splicing side 113 against deformation. It should be noted that the technical solution of the cross-sectional profile of the splicing side 113 along the thickness direction being arc-shaped and the technical solution of the splicing side 113 being concave in the direction towards the center of the substrate 110 can coexist, or only one of the technical solutions can be chosen, which is not limited here.

[0047] Embodiments of this application also provide a display device, including a plurality of display modules 100 as described in any of the foregoing embodiments, wherein the plurality of display modules 100 are arranged in an array. The plurality of modules may be two or more. The width of the seam between two adjacent display modules 100 ranges from 0.01 mm to 0.8 mm, and in this embodiment, the width of the seam is preferably from 20 μm to 80 μm.

[0048] In some embodiments, the display device includes two display modules 100, which are spliced ​​together to form a splicing seam. Correspondingly, the side of the two display modules 100 facing each other is the splicing side 113. To avoid poor splicing effect due to thermal expansion of the splicing side 113, the thermally conductive coating 121 can be configured as a convex shape with the protruding part facing the splicing side 113, and the heat sink 122 can be stacked with the thermally conductive coating 121 and extend to the protruding part of the thermally conductive coating 121. Alternatively, the thermally conductive coating 121 can be configured as a trapezoidal shape, with the upper bottom surface of the trapezoid close to the splicing side 113, and the heat sink 122 can be stacked with the thermally conductive coating 121 and extend to the upper bottom surface of the trapezoid, thereby improving the heat dissipation effect of the first region 1121 in the middle region 111 and the peripheral region 112.

[0049] In some embodiments, see Figure 5 The display device includes two or more display modules 100 arranged in an array. The arrayed display modules 100 involve splicing multiple sides of the substrate 110 in each display module 100. To ensure that each side of the substrate 110 can avoid poor splicing effect or even substrate 110 breakage due to overheating expansion, in this embodiment, the thermally conductive coating 121 includes a rectangular first sub-coating 1211 and four rectangular second sub-coatings 1212. The first sub-coating 1211 has four sides with second sub-coatings 1212, and the side length of the first sub-coating 1211 is equal to the side length of the second sub-coating 1212, thus defining a gap between two adjacent second sub-coatings 1212. This gap is aligned with the second region 1122, thereby ensuring that the substrate 110 in each display module 100 can balance the expansion amounts present in the first region 1121 and the second region 1122.

[0050] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0051] Similarly, it should be noted that, in order to simplify the description of the embodiments of this application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of this application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of this application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

Claims

1. A display module, characterized in that, The display module has at least one splicing side and includes a middle area and an outer area. The outer area includes a non-sponge area and a splicing area. The splicing area corresponds to the splicing side and includes a first area and a second area located on both sides of the first area. The first area and the second area are arranged along the length direction of the splicing side. The display module includes: A substrate is disposed in the middle region and the peripheral region; A thermally conductive component is disposed on the back side of the substrate and includes a first thermally conductive portion and a second thermally conductive portion. The first thermally conductive portion is disposed at least in the first region, and the second thermally conductive portion is disposed in the non-splicing region and / or the second region. The thermal conductivity of the first heat-conducting part is greater than that of the second heat-conducting part.

2. The display module as described in claim 1, characterized in that, The first heat-conducting part is disposed in the middle region and the first region, and the second heat-conducting part is disposed in the non-joined region and the second region. The area of ​​the portion of the second heat-conducting part disposed in the second region is smaller than the area of ​​the second region, and the portion of the second heat-conducting part disposed in the second region is disposed close to the first region.

3. The display module as described in claim 2, characterized in that, The area of ​​the second heat-conducting part gradually decreases from the middle region toward the first region.

4. The display module as described in claim 1, characterized in that, The deformation resistance of the portion of the substrate corresponding to the first region is less than the deformation resistance of the portion of the substrate corresponding to the second region.

5. The display module as described in claim 2, characterized in that, The thermally conductive component includes a thermally conductive coating and a heat sink. The thermally conductive coating is disposed on the back side of the substrate and includes a first sub-coating and a second sub-coating. The first sub-coating is disposed in the middle region and the first region, and the second sub-coating is disposed in the non-joined region and the second region. The heat sink overlaps the first sub-coating on the side away from the substrate to jointly form the first thermally conductive part, and the second sub-coating forms the second thermally conductive part.

6. The display module as described in claim 5, characterized in that, The thermally conductive coating is a graphene coating, and the heat sink is a copper sheet.

7. The display module as described in claim 1, characterized in that, The substrate has a width direction, and along the width direction, the distance between the outer side of the first region and the center of the substrate is less than the distance between the outer side of the second region and the center of the substrate.

8. The display module as described in claim 7, characterized in that, The splicing side is concave in the direction of the center of the substrate.

9. The display module as described in claim 8, characterized in that, The cross-sectional profile of the splicing side along the width direction is arc-shaped, and / or the cross-sectional profile of the splicing side along the thickness direction of the substrate is arc-shaped.

10. A display device, characterized in that, It comprises at least two display modules spliced ​​together as described in any one of claims 1 to 9.

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