Uniform flow cavity small hole face processing method and uniform flow device

CN118848444BActive Publication Date: 2026-10-27SHANGHAI RUISHENG SEMICON TECH CO LTD
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Patent Information

Application Number
CN202411042847.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-07-31
Publication Date
2026-10-27
Estimated Expiration
2044-07-31

AI Technical Summary

Technical Problem

目前去除材料余量的手段主要有两种:(1)使用加工中心刀具进行加工,但会使排气孔产生不同程度的堵塞,部分毛刺翻边严重;(2)先使用加工中心刀具进行粗加工,将除了排气孔表面材料余量外的其余面上的材料余量进行切削去除,然后再使用磨床进行磨削精加工,去除排气孔表面材料余量,但这种方式会使得排气孔会被翻边的毛刺堵塞,导致排气孔外观不可见

Benefits of technology

[0024]本发明所提供的匀流腔小孔面加工方法的有益效果:通过先将除了排气孔表面材料余量外的其余面上的材料余量进行切削去除,以初步形成匀流装置的外形构造,再通过第一次开孔和第二次开孔步骤分别加工出匀流腔、进气孔和排气孔,从而可以有效提高加工成型的精度和质量,最后再使用线切割的方式将排气孔表面材料余量进行切割去除。由于线切割是通过电火花放电来实现材料切割和加工,因此在点火花放电过程中,在电极和半成品件之间形成的离子化气体能够防止毛刺的产生,保证了排气孔表面的光洁度,也不会导致排气孔被堵塞,从而能够在不影响排气孔排气的情况下,去除排气孔表面处的材料余量,进而确保了加工工艺质量。

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Abstract

The application belongs to the technical field of semiconductor equipment, and discloses a uniform flow cavity small hole surface processing method and a uniform flow device. The method comprises the following steps: rough machining: removing the material allowance of the surface of the workpiece except the preset surface to form a semi-finished product; first hole machining: penetratingly machining the uniform flow cavity on the surface adjacent to the preset surface; second hole machining: machining a plurality of exhaust holes on the preset surface in the same row, the exhaust holes being communicated with the uniform flow cavity, the arrangement direction of the exhaust holes being parallel to the extension direction of the uniform flow cavity, and machining the air inlet hole on the surface opposite to the preset surface, the air inlet hole being communicated with the uniform flow cavity; cutting: removing the material allowance on the preset surface by using the wire cutting to form a finished product. The uniform flow device prepared by the method ensures the smoothness of the surface of the exhaust hole and prevents the exhaust hole from being blocked, so that the material allowance at the surface of the exhaust hole can be removed without affecting the exhaust of the exhaust hole, and the processing quality is ensured.
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Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment technology, and particularly relates to a method for processing the small hole surface of a uniform flow cavity and a uniform flow device. Background Technology

[0002] In the semiconductor equipment industry, high-pressure airflow is frequently applied to the surface of semiconductor workpieces. A key aspect of using high-pressure airflow is controlling its uniformity; ideally, the airflow intensity should be equal at every point on the semiconductor workpiece surface. Traditionally, a gas diffuser (i.e., a flow equalizer) with numerous small holes is used to achieve this uniformity.

[0003] In the production of existing flow equalization devices, the pre-processed workpiece is first rough-machined into a semi-finished part. Then, holes are drilled at the bottom of the semi-finished part to form an air inlet, and a row of holes are drilled at intervals at the top to form an exhaust outlet. Then, holes are drilled from the left and right ends to form a flow equalization cavity that can connect the air inlet and multiple exhaust outlets. Finally, the excess material at the top of the semi-finished part is removed so that the dimensions of the semi-finished part meet the usage requirements and the top surface remains smooth. Currently, there are two main methods for removing excess material: (1) using machining center tools, but this will cause varying degrees of blockage of the exhaust outlets and severe burr flanging in some areas; (2) first using machining center tools for rough machining to remove the excess material on the remaining surfaces except for the exhaust outlet surface, and then using a grinding machine for finishing to remove the excess material on the exhaust outlet surface. However, this method will cause the exhaust outlets to be blocked by the flanged burrs, making the exhaust outlets invisible.

[0004] Based on the above, a method for processing the small hole surface of a uniform flow cavity and a uniform flow device are proposed to solve the problems existing in the prior art. Summary of the Invention

[0005] The first objective of this invention is to provide a method for machining the small hole surface of a uniform flow cavity, which can remove excess material on the surface of the exhaust hole without affecting the exhaust of the exhaust hole, thereby ensuring the quality of the machining process.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A method for machining small holes in a uniform flow cavity, used to open multiple vent holes arranged in the same row on a preset surface of a pre-machined workpiece, includes the following steps:

[0008] Roughing: Removing excess material from surfaces other than the preset surface on the pre-processed workpiece to form a semi-finished part;

[0009] First opening: A uniform flow cavity is opened through the surface of the semi-finished part adjacent to the preset surface;

[0010] Second opening: On the semi-finished part, multiple exhaust holes are opened in the same row on the preset surface. The exhaust holes are connected to the flow equalization cavity, and the arrangement direction of the exhaust holes is parallel to the extension direction of the flow equalization cavity. An air inlet is opened on the surface opposite to the preset surface. The air inlet is connected to the flow equalization cavity.

[0011] Cutting: Using wire cutting, the excess material on the preset surface is removed to form the finished part.

[0012] Preferably, before performing the cutting step, the following step is also included:

[0013] First sealing: Use the first sealing component to seal the openings at both ends of the flow equalization cavity;

[0014] Abrasive flow: An abrasive flow medium is used to pass sequentially through the air inlet, the flow equalization cavity, and the exhaust port, and the abrasive flow medium can be in close contact with the inner sidewalls of the air inlet, the flow equalization cavity, and the exhaust port to remove impurities on the inner sidewalls of the air inlet, the flow equalization cavity, and the exhaust port.

[0015] Preferably, the first sealing element is sealed and fixed at both ends of the flow equalization cavity by argon arc welding or gas shielded welding.

[0016] Preferably, after the abrasive flow step, the following step is also included:

[0017] Second sealing: The portion of the semi-finished part containing the flow equalization cavity is cut off to remove the first sealing member, and the surface smoothness of the exposed flow equalization cavity is checked. Then, the openings at both ends of the flow equalization cavity are sealed again using the second sealing member.

[0018] Preferably, the second sealing element is sealed and fixed at both ends of the flow equalization cavity by electron beam welding.

[0019] Preferably, between the cutting step and the second sealing step, the following step is also included:

[0020] Refinement: Remove excess material from surfaces other than the preset surface on the semi-finished part again.

[0021] Preferably, the opening size range of the vent hole is: φ0.75mm < a < φ0.85mm.

[0022] Preferably, the thickness range of the material allowance on the preset surface is: 0mm < h < 2.5mm.

[0023] Preferably, the exhaust port is provided with 75 holes.

[0024] The beneficial effects of the flow equalization cavity small hole surface processing method provided by this invention are as follows: By first cutting away the excess material on the remaining surfaces except for the exhaust hole surface, the initial shape of the flow equalization device is formed. Then, the flow equalization cavity, air inlet, and exhaust hole are processed through the first and second hole-opening steps, respectively, thereby effectively improving the processing accuracy and quality. Finally, the excess material on the exhaust hole surface is removed by wire cutting. Since wire cutting achieves material cutting and processing through electrical discharge, the ionized gas formed between the electrode and the semi-finished part during the spark discharge process can prevent burr generation, ensuring the smoothness of the exhaust hole surface and preventing the exhaust hole from being blocked. Thus, the excess material on the exhaust hole surface can be removed without affecting the exhaust, thereby ensuring the processing quality.

[0025] The second objective of this invention is to provide a flow equalization device that can improve processing quality.

[0026] To achieve this objective, the present invention adopts the following technical solution:

[0027] A flow equalization device is manufactured by the above-described flow equalization cavity small hole surface processing method.

[0028] The beneficial effects of the flow equalization device provided by the present invention are as follows: the flow equalization device, through the above-mentioned flow equalization cavity small hole surface processing method, can ensure the smoothness of the exhaust hole surface by utilizing the characteristics of wire cutting, and will not cause the exhaust hole to be blocked by burrs or other impurities. Thus, it can remove the material excess on the surface of the exhaust hole without affecting the exhaust of the exhaust hole, thereby effectively ensuring the production quality and stability of the flow equalization device. Attached Figure Description

[0029] Figure 1 This is a schematic flowchart of the method for processing the small hole surface of the uniform flow cavity provided in an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the flow equalization device provided in the embodiment of the present invention in the state of a semi-finished product;

[0031] Figure 3 This is a partial structural cross-sectional view of the flow equalization device provided in the embodiment of the present invention in a semi-finished product state;

[0032] Figure 4 This is a schematic diagram of the flow equalization device provided in an embodiment of the present invention from a first perspective.

[0033] Figure 5 This is a schematic diagram of the flow equalization device provided in an embodiment of the present invention from a second perspective;

[0034] Figure 6 This is a cross-sectional view of the flow equalization device provided in an embodiment of the present invention;

[0035] Figure 7 yes Figure 6 A magnified view of a section at point A in the middle;

[0036] Figure 8 yes Figure 6 A magnified view of a section at point B in the middle.

[0037] In the picture:

[0038] 10' Semi-finished parts;

[0039] 1. Base; 11. Air inlet;

[0040] 2. Boss; 21. Exhaust port; 22. Flow equalization chamber;

[0041] 3. Second sealing component. Detailed Implementation

[0042] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0043] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0044] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0045] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0046] A semiconductor wafer reaction chamber is a closed space or environment used in semiconductor manufacturing to perform specific chemical or physical processes to alter the properties and structure of the wafer surface or interior. Within the semiconductor wafer reaction chamber, a flow equalization device is typically installed. This device effectively distributes the gas evenly across the wafer surface, ensuring uniformity and consistency during the chemical vapor deposition (CVD) or physical vapor deposition (PVD) reaction process. Alternatively, the flow equalization device can also assist in regulating the temperature distribution within the reaction chamber, ensuring uniform temperature on the wafer surface and thus ensuring uniform heat treatment on the wafer.

[0047] In the existing technology, two main methods are used when processing the uniform flow device: (1) using a machining center tool. However, this method will cause varying degrees of blockage in the exhaust hole 21, and some burrs will be severely turned upside down; (2) first use a machining center tool to perform rough machining, and cut off the material allowance on the other surfaces except for the material allowance on the surface of the exhaust hole 21, and then use a grinding machine to perform fine grinding to remove the material allowance on the surface of the exhaust hole 21. However, this method will cause the exhaust hole 21 to be blocked by the turned-up burrs, making the exhaust hole 21 invisible.

[0048] To address the problems existing in the prior art, this embodiment provides a flow equalization device and a method for machining the small hole surface of the flow equalization cavity. The flow equalization device includes a base 1 and a boss 2. The boss 2 protrudes from the top surface of the base 1, and an exhaust hole 21 is formed on the top surface of the boss 2. A flow equalization cavity 22 is formed inside the boss 2, and an air inlet 11 is formed at the bottom of the base 1. The exhaust hole 21, the flow equalization cavity 22, and the air inlet 11 are connected. The method for machining the small hole surface of the flow equalization cavity can create multiple exhaust holes 21 arranged in the same row on the top surface of the boss 2, and accurately remove excess material from the surface of the exhaust holes 21 without affecting the exhaust of the exhaust holes 21, thereby ensuring the quality of the machining process.

[0049] Specifically, refer to Figure 1 As shown, the method for machining the small hole surface of the uniform flow cavity includes the following steps:

[0050] Roughing: Remove excess material from surfaces other than the preset surface on the pre-machined workpiece to form a semi-finished part 10';

[0051] In practice, first, prepare a pre-machined workpiece in the shape of a block. Set the top surface of the pre-machined workpiece as the preset surface for opening the vent hole 21. Then, use a machining center tool to cut away the remaining part of the top surface of the pre-machined workpiece, excluding the preset surface, at a certain depth. After removal, the pre-machined workpiece is deformed as follows. Figure 2 The semi-finished part 10' shown has an inverted "T" shaped cross-section.

[0052] First opening: A uniform flow cavity 22 is opened through the surface of the semi-finished part adjacent to the preset surface;

[0053] In practice, a drilling device is used on the surface adjacent to the preset surface, such as... Figure 2 The uniform flow cavity 22 is drilled through two surfaces arranged opposite each other along the X-axis shown in the diagram. Optionally, the drilling equipment can be any of a micro handheld electric drill, a benchtop micro drill, or a CNC micro-hole drill, to meet the high-precision hole shape requirements of the uniform flow cavity 22, and is easy and flexible to operate with high stability.

[0054] Second opening: An air inlet 11 is opened on the surface opposite to the preset surface on the semi-finished part. The air inlet 11 is connected to the flow equalization cavity 22. Multiple exhaust holes 21 are opened in the same row on the preset surface. The exhaust holes 21 are connected to the flow equalization cavity 22, and the arrangement direction of the exhaust holes 21 is parallel to the extension direction of the flow equalization cavity 22.

[0055] In specific operation, a suitable tool is selected from the tool machining center, and a row of vent holes 21 is opened on the preset surface. The arrangement direction of the vent holes 21 is parallel to the X-axis direction, so that the gas in the uniform flow cavity 22 can be evenly dispersed into the multiple vent holes 21. Further, as Figure 3 As shown, the opening size range of the exhaust hole 21 is: a is greater than φ0.75mm and less than φ0.85mm. For example, the opening size of the exhaust hole 21 includes, but is not limited to, φ0.76mm, φ0.77mm, φ0.78mm, φ0.79mm, φ0.80mm, φ0.81mm, φ0.82mm, φ0.83mm, or φ0.84mm. Preferably, in this embodiment, the size a of the exhaust hole 21 is 0.87mm, and 75 exhaust holes 21 are provided to meet the usage requirements under actual working conditions.

[0056] Next, a suitable tool is selected on the tool machining center to open an air inlet 11 on the surface opposite to the preset surface, that is, on the bottom surface of the semi-finished part 10', and the air inlet 11 is connected to the uniform flow cavity 22.

[0057] In the above configuration, to improve the machining accuracy of the air inlet 11, the exhaust outlet 21, and the flow equalization cavity 22, the present invention uses a drilling device to first machine the flow equalization cavity 22, and then uses a machining center tool to machine the air inlet 11 and the exhaust outlet 21. In this way, by decomposing the machining process into two steps—the first drilling and the second drilling—suitable equipment or tools for the flow equalization cavity 22, the air inlet 11, and the exhaust outlet 21 can be used respectively, thereby better controlling the machining quality and improving the quality stability of the flow equalization device.

[0058] Cutting: Using wire cutting, excess material is removed from a pre-defined surface to form a finished part.

[0059] It should be noted that, as Figure 3 As shown, the specific thickness h of the material allowance on the preset surface should be greater than 0 mm and less than 2.5 mm to avoid the situation where the material allowance thickness is too large, which will increase the cost of consumables.

[0060] In the above setup, the excess material on all surfaces except the exhaust hole 21 is first removed by cutting to initially form the shape of the flow equalization device. Then, the flow equalization cavity 22, the air inlet 11, and the exhaust hole 21 are machined through the first and second drilling steps, which effectively improves the precision and quality of the machining process. Finally, the excess material on the surface of the exhaust hole 21 is removed by wire cutting. Since wire cutting achieves material cutting and machining through electrical discharge, the ionized gas formed between the electrode and the semi-finished part 10' during the spark discharge process can prevent the generation of burrs, ensuring the smoothness of the exhaust hole 21 surface and preventing the exhaust hole 21 from being blocked. Thus, the excess material on the surface of the exhaust hole 21 can be removed without affecting the exhaust of the exhaust hole 21, thereby ensuring the quality of the machining process.

[0061] Specifically, before the cutting step, the following steps are also included:

[0062] First sealing: Use the first sealing component to seal the openings at both ends of the flow equalization cavity 22;

[0063] Abrasive flow: Abrasive flow medium is used to pass through the air inlet 11, the flow equalization cavity 22 and the exhaust port 21 in sequence, and the abrasive flow medium can be in close contact with the inner sidewalls of the air inlet 11, the flow equalization cavity 22 and the exhaust port 21 to remove impurities on the inner sidewalls of the air inlet 11, the flow equalization cavity 22 and the exhaust port 21.

[0064] To reduce the impact of rough inner walls on gas flow uniformity, this embodiment also requires simultaneous grinding of the air inlet 11, flow uniform cavity 22, and exhaust port 21 to ensure that the inner walls of all three are smooth and regular. Abrasive flow is a surface finishing method that uses abrasive particles suspended in a fluid to process the workpiece surface, reducing surface temperature and roughness. Furthermore, due to the complex internal structure of the flow uniform device, abrasive flow can be well adapted to flow uniform devices with complex internal shapes, and the surface finish of the air inlet 11, exhaust port 21, and flow uniform cavity 22 can be precisely controlled by adjusting the fluid pressure and abrasive concentration.

[0065] When using, refer to Figure 6 and Figure 7 As shown, one end of the air inlet 11 is connected to a fluid pump. The fluid pump can deliver the liquid medium carrying abrasive (i.e., abrasive flow medium) from the air inlet 11 into the flow equalization device. The liquid medium sequentially rubs against the air inlet 11, the flow equalization chamber 22, and the exhaust port 21, and is discharged from one end of the exhaust port 21. During this process, the abrasive can continuously polish the inner walls of the air inlet 11, the flow equalization chamber 22, and the exhaust port 21, thereby achieving the purpose of polishing the inner walls of the three to a smooth finish. In addition, during this process, it is also necessary to ensure that the first sealing component seals the openings at both ends of the flow equalization chamber 22 to prevent the liquid medium from flowing out from the openings at both ends of the flow equalization chamber 22 without polishing the inner wall of the exhaust port 21.

[0066] Optionally, the first sealing element is sealed and fixed at both ends of the flow equalization cavity 22 by argon arc welding or gas shielded welding. In this way, a high-quality welded joint can be formed at the connection between the first sealing element and the flow equalization cavity 22, which has good sealing performance and connection strength, and can effectively prevent leakage of liquid medium.

[0067] More specifically, after the abrasive flow step, the following steps are also included:

[0068] Second sealing: The semi-finished part 10' containing the flow equalization cavity 22 is cut off to remove the first sealing component. At this time, the flow equalization cavity 22 is exposed at both ends again. Those skilled in the art can observe and inspect the grinding effect through the two ends, and at the same time, the length of the boss 2 can be shortened to the required size range. After the smoothness of the inner wall of the flow equalization cavity 22 is qualified, the two ends of the flow equalization cavity 22 are sealed again using the second sealing component 3 to prevent gas from leaking out from the two ends of the flow equalization cavity 22 during use.

[0069] Preferably, in this embodiment, the reference Figure 8As shown, the second sealing component 3 is sealed and fixed at both ends of the uniform flow cavity 22 by electron beam welding. During the electron beam welding process, the heat-affected zone near the weld is relatively small, thereby reducing the thermal damage to the material around the exhaust hole 21. This helps to maintain the original structural shape and integrity of the material around the exhaust hole 21, so that the radial size of the exhaust hole 21 remains consistent before and after the second sealing component 3 is fixed, thus avoiding the shrinkage of the exhaust hole 21.

[0070] Optionally, in this embodiment, a further step is included between the cutting step and the second sealing step:

[0071] Refinement: Remove excess material from surfaces other than the preset surface on the semi-finished part 10'.

[0072] In specific operation, a suitable tool from the machining center can be selected to perform fine finishing on the semi-finished part 10'. Through the fine finishing step, the excess material on the surface part other than the outer surface of the exhaust hole 21 can be further removed, making the uniform flow device more accurate and in line with the design requirements.

[0073] The flow equalization device provided in this embodiment is manufactured using the above-described flow equalization cavity small hole surface processing method.

[0074] For example, in the actual manufacturing process, the excess material on the surfaces other than the exhaust hole 21 is first removed by cutting to initially form the "boss + base" shape of the flow equalization device. Then, the flow equalization cavity 22, the air inlet 11, and the exhaust hole 21 are machined through the first and second drilling steps, which can effectively improve the precision and quality of the machining. Then, the flow equalization cavity 22, the air inlet 11, and the exhaust hole 21 are polished through the first sealing and abrasive flow steps to ensure smooth gas flow. Then, the polishing effect is checked through the second sealing step, and the flow equalization cavity 22 is sealed with the second sealing part 3 to ensure airtightness. Then, the appearance quality of the flow equalization device is further improved through fine finishing to make it more in line with the usage requirements. Finally, the excess material on the surface of the exhaust hole 21 is removed by wire cutting. By utilizing the characteristics of wire cutting, the surface smoothness of the exhaust hole 21 is ensured, preventing the exhaust hole 21 from being blocked by burrs or other impurities. This allows for the removal of excess material from the surface of the exhaust hole 21 without affecting the exhaust, thus effectively ensuring the production quality and stability of the flow equalization device.

[0075] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for machining small holes in a uniform flow cavity, used to open multiple exhaust holes (21) arranged in the same row on a preset surface of a pre-machined workpiece, characterized in that, Includes the following steps: Roughing: Removing excess material from surfaces other than the preset surface on the pre-processed workpiece to form a semi-finished part (10'); First opening: A uniform flow cavity (22) is opened through the surface of the semi-finished part (10') adjacent to the preset surface; Second opening: On the semi-finished part (10'), a plurality of exhaust holes (21) are opened in the same row as the preset surface. The exhaust holes (21) are connected to the flow equalization cavity (22), and the arrangement direction of the exhaust holes (21) is parallel to the extension direction of the flow equalization cavity (22). An air inlet hole (11) is opened on the surface opposite to the preset surface. The air inlet hole (11) is connected to the flow equalization cavity (22). Cutting: Using wire cutting, the excess material on the preset surface is removed to form the finished part.

2. The method for machining the small hole surface of the uniform flow cavity according to claim 1, characterized in that, Before performing the cutting step, the following steps are also included: First sealing: Use the first sealing component to seal the openings at both ends of the uniform flow cavity (22); Abrasive flow: Abrasive flow medium is used to pass through the air inlet (11), the flow equalization cavity (22) and the exhaust hole (21) in sequence, and the abrasive flow medium can be in contact with the inner sidewalls of the air inlet (11), the flow equalization cavity (22) and the exhaust hole (21) to remove impurities on the inner sidewalls of the air inlet (11), the flow equalization cavity (22) and the exhaust hole (21).

3. The method for machining the small hole surface of the uniform flow cavity according to claim 2, characterized in that, The first sealing component is sealed and fixed at both ends of the flow equalization cavity (22) by gas shielded welding.

4. The method for machining the small hole surface of the uniform flow cavity according to claim 2, characterized in that, Following the abrasive flow step, the following steps are also included: Second sealing: The portion of the semi-finished part (10') containing the flow equalization cavity (22) is cut off to remove the first sealing member, and the surface smoothness of the exposed flow equalization cavity (22) is checked. Then, the openings at both ends of the flow equalization cavity (22) are sealed again using the second sealing member (3).

5. The method for machining the small hole surface of the uniform flow cavity according to claim 4, characterized in that, The second sealing component (3) is sealed and fixed at both ends of the uniform flow cavity (22) by electron beam welding.

6. The method for machining the small hole surface of the uniform flow cavity according to claim 4, characterized in that, Between the cutting step and the second sealing step, the following steps are also included: Refinement: Remove excess material from the surfaces other than the preset surface on the semi-finished part (10') again.

7. The method for machining the small hole surface of the uniform flow cavity according to any one of claims 1-6, characterized in that, The opening size range of the exhaust hole (21) is: φ0.75mm < a < φ0.85mm.

8. The method for machining the small hole surface of the uniform flow cavity according to any one of claims 1-6, characterized in that, The thickness range of the material allowance on the preset surface is: 0mm < h < 2.5mm.

9. The method for machining the small hole surface of the uniform flow cavity according to any one of claims 1-6, characterized in that, The exhaust port (21) has 75 holes.

10. A flow equalization device, characterized in that, The flow equalization device is manufactured by the flow equalization cavity small hole surface machining method according to any one of claims 1-9.

Citation Information

Patent Citations

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    CN105718683A

  • Tube electrode electrolytic cutting method and device for mass transfer enhanced by spark discharge

    CN114939699A