Conductive wire de-palletizing method, apparatus, computer device, storage medium and computer program product

Abstract

The application relates to a conductive wire unstacking method and device, computer equipment, a storage medium and a computer program product. The method comprises the following steps: determining the wire type and starting position of the conductive wire to be processed based on a current three-dimensional image containing the conductive wire to be processed and an unstacking environment; determining the end position of the conductive wire to be processed in the current three-dimensional image according to the wire type of the conductive wire to be processed, and determining the unstacking path between the starting position and the end position based on a preset optimization strategy and optimization limiting conditions; generating an unstacking instruction set based on the unstacking path and the starting position; in the case that the unstacking device starts to execute the unstacking instruction set, acquiring a real-time three-dimensional image, and generating an adjusted path corresponding to the conductive wire to be processed based on the unstacking environment in the real-time three-dimensional image and the unstacking path, and updating the unstacking instruction set based on the adjusted path until the unstacking device executes the unstacking instruction set.

Description

Technical Field

[0001] This application relates to the field of industrial component transportation, and in particular to a method, apparatus, computer equipment, storage medium, and computer program product for unpacking and unpacking conductive wires. Background Technology

[0002] Conductive wires are wires made of conductive materials used to transmit electric current. Destacking and unstacking conductive wires refers to the process of stacking or dismantling conductive wires during transportation, storage, and installation. Incorrect stacking may cause the conductive wires to be squeezed, bent, or scratched, thus affecting their performance. Care must be taken to prevent conductive wires from falling or tipping over during destacking to avoid injury to workers and the surrounding environment.

[0003] In related technologies, robotic arms are typically used to de-palletize conductive wires. Workers control the robotic arms to control the conductive wires, thereby completing the palletizing or de-palletizing. However, there are many types of conductive wires and the application scenarios for de-palletizing are complex. Workers cannot rely on experience to execute the optimal de-palletizing and de-palletizing scheme, resulting in insufficient efficiency in de-palletizing and de-palletizing conductive wires. Summary of the Invention

[0004] Therefore, it is necessary to provide a conductive wire depalletizing method, apparatus, computer equipment, computer-readable storage medium, and computer program product that can improve depalletizing efficiency in response to the above-mentioned technical problems.

[0005] Firstly, this application provides a method for destacking and unpacking conductive wires. The method includes:

[0006] Based on the current 3D image containing the conductor to be processed and the depalletizing environment, determine the wire type and starting point location of the conductor to be processed.

[0007] Based on the wire type of the conductive wire to be processed, the endpoint position of the conductive wire to be processed in the current three-dimensional image is determined, and based on a preset optimization strategy and optimization constraints, the unpacking and stacking path between the starting position and the endpoint position is determined; the optimization constraints include unpacking time and stacking stability.

[0008] Based on the depalletizing path and the starting position, a depalletizing instruction set is generated; the depalletizing instruction set is used to control the depalletizing equipment to transport the conductive wire to be processed from the starting position to the ending position;

[0009] When the depalletizing device starts executing the depalletizing instruction set, a real-time three-dimensional image is acquired, and based on the depalletizing environment and the depalletizing path in the real-time three-dimensional image, an adjustment path corresponding to the conductive line to be processed is generated, and the depalletizing instruction set is updated based on the adjustment path until the depalletizing device finishes executing the depalletizing instruction set.

[0010] In one embodiment, determining the wire type and starting point location of the conductor to be processed based on a current 3D image including the conductor to be processed and the depalletizing environment includes:

[0011] Send a shooting command to the shooting device so that the shooting device can take pictures of the conductive wire to be processed and the depalletizing environment, and generate a current three-dimensional image containing the conductive wire to be processed and the depalletizing environment;

[0012] Obtain the color information of the conductive wire to be processed, and determine the wire type of the conductive wire to be processed according to the preset correspondence of the color information;

[0013] The centroid of the conductive line to be processed in the current 3D image is determined as the starting point of the conductive line to be processed.

[0014] In one embodiment, the current three-dimensional image includes a first three-dimensional image and a second three-dimensional image; generating the current three-dimensional image containing the conductive line to be processed and the depalletizing environment includes:

[0015] The camera scans the depalletizing environment to generate a first three-dimensional image containing the conductive wire to be processed, and the sensor obtains the wire shape of the conductive wire to be processed.

[0016] Based on the feature extraction algorithm, the wire features contained in the first three-dimensional image are determined, and the second three-dimensional image of the conductive wire to be processed is determined based on the wire shape and wire features.

[0017] In one embodiment, determining the palletizing / unpacking path between the starting position and the ending position based on a preset optimization strategy and optimization constraints includes:

[0018] Based on the wire type of the conductive wire to be processed, the wire parameters of the conductive wire to be processed are determined; the wire parameters include wire density, wire stiffness, and wire size.

[0019] Based on the wire parameters, the maximum number of stacks and the fastest moving speed of the conductive wire to be processed are determined, and these are identified as the first influencing factor affecting the unpacking time of the conductive wire to be processed.

[0020] Based on the wire parameters and the gripping parameters of the destacking and stacking equipment, the minimum turning radius of the conductive wire to be processed is determined, and is identified as the second influencing factor affecting the stacking stability of the conductive wire to be processed; the gripping parameters include the maximum load-bearing capacity;

[0021] Using the first influence factor and the second influence factor as constraints, the starting position and the ending position as algorithm inputs, and solving the optimization algorithm corresponding to the preset optimization strategy, the destacking and palletizing path is obtained.

[0022] In one embodiment, the depalletizing instruction set includes grab instructions, move instructions, and release instructions; generating the depalletizing instruction set based on the depalletizing path and the starting position includes:

[0023] Based on the wire size and the wire density, the gripping force required by the depalletizing equipment is determined, and a gripping instruction corresponding to the conductive wire to be processed is generated according to the gripping force and the starting position.

[0024] Based on the stacking and unpacking path and the fastest moving speed, a moving instruction corresponding to the conductive line to be processed is generated.

[0025] Determine the release position corresponding to the endpoint position and generate a release command corresponding to the conductive line to be processed; the release position is the position corresponding to a preset distance directly above the endpoint position.

[0026] In one embodiment, generating the path to be adjusted corresponding to the conductive wire to be processed based on the depalletizing environment and the depalletizing path in the real-time 3D image includes:

[0027] If an obstacle overlaps with the depalletizing path in the depalletizing environment, the overlapping path is deleted, and a first path to be adjusted is regenerated to replace the overlapping path; the first path to be adjusted is a movement path that does not overlap with the obstacle.

[0028] If a live object is present directly below the depalletizing path in the depalletizing environment, the dangerous path is deleted, and a second path to be adjusted is generated to replace the dangerous path; there is no live object directly below the second path to be adjusted.

[0029] Send alarm information corresponding to the first path to be adjusted and / or the second path to be adjusted to the control terminal corresponding to the depalletizing and palletizing equipment.

[0030] In one embodiment, updating the depalletizing instruction set until the depalletizing device has finished executing the depalletizing instruction set further includes:

[0031] The depalletizing instruction set and the corresponding operation information are encrypted using digital signatures to obtain an instruction block; the operation information includes operation time, operation location, and operator identity.

[0032] The instruction block is verified through a consensus mechanism to obtain the verification result;

[0033] If the verification result is valid, the instruction block is linked to the previous block based on a hash algorithm to obtain an updated instruction blockchain; the instruction blockchain is used to store the historical operation instruction sets of each operator for each conductor to be processed.

[0034] Secondly, this application also provides a conductive wire depalletizing device. The device includes:

[0035] The conductive wire determination module is used to determine the wire type and starting position of the conductive wire to be processed based on a current three-dimensional image containing the conductive wire to be processed and the depalletizing environment;

[0036] The path determination module is used to determine the endpoint position of the conductive wire to be processed in the current three-dimensional image according to the wire type of the conductive wire to be processed, and to determine the destacking and stacking path between the starting position and the endpoint position based on a preset optimization strategy and optimization constraints; the optimization constraints include destacking time and stacking stability.

[0037] The instruction generation module is used to generate a set of depalletizing instructions based on the depalletizing path and the starting position; the set of depalletizing instructions is used to control the depalletizing equipment to transport the conductive wire to be processed from the starting position to the ending position.

[0038] The instruction update module is used to acquire a real-time three-dimensional image when the depalletizing device starts executing the depalletizing instruction set, and generate an adjustment path corresponding to the conductive wire to be processed based on the depalletizing environment and the depalletizing path in the real-time three-dimensional image, and update the depalletizing instruction set based on the adjustment path until the depalletizing device finishes executing the depalletizing instruction set.

[0039] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the steps of the method described in the first aspect.

[0040] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, implements the steps of the method described in the first aspect.

[0041] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, implements the steps of the method as described in the first aspect.

[0042] The aforementioned conductive wire depalletizing method, apparatus, computer equipment, storage medium, and computer program product analyze a current 3D image containing the conductive wire to be processed and the depalletizing environment through a server. This determines the wire type and starting position of the conductive wire in the current 3D image. Furthermore, the ending position of the conductive wire after depalletizing can be determined based on the wire type. The server plans the path between the starting and ending positions according to a preset optimization strategy and optimization constraints, obtaining the optimal depalletizing path. By optimizing the constraints, the optimal depalletizing path can be obtained while ensuring depalletizing time and stacking stability. A depalletizing instruction set is generated based on the depalletizing path and the starting position. When the depalletizing device executes the depalletizing instruction set, the server can acquire a real-time 3D image and, based on the real-time 3D image's depalletizing environment and path, determine problematic paths that need adjustment and regenerate the depalletizing instructions corresponding to the paths to be adjusted, thus obtaining an updated depalletizing instruction set. Once the depalletizing device has executed the depalletizing instruction set, the depalletizing of the conductive wire to be processed is complete. The server determines the start and end points of the depalletizing path using the current 3D image and generates the path by optimizing constraints, quickly obtaining the optimal path. Based on this, the server automatically generates the depalletizing instruction set corresponding to the depalletizing equipment, enabling the equipment to execute the instruction set automatically. Furthermore, the server can adjust the depalletizing path in real time during the depalletizing process, ensuring it remains at the optimal level, thereby improving the depalletizing efficiency of conductive wires while ensuring safety. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a diagram illustrating the application environment of a conductive wire destacking and depalletizing method in one embodiment.

[0045] Figure 2 This is a flowchart illustrating a method for destacking and unstacking conductive wires in one embodiment.

[0046] Figure 3This is a flowchart illustrating the method for unpacking and destacking conductive wires in another embodiment;

[0047] Figure 4 This is a schematic diagram of a blockchain in one embodiment;

[0048] Figure 5 This is a flowchart illustrating a multi-objective raccoon optimization algorithm in one embodiment;

[0049] Figure 6 This is a flowchart illustrating a 3D visual guidance technology in one embodiment;

[0050] Figure 7 This is a structural block diagram of a conductive wire depalletizing device in one embodiment;

[0051] Figure 8 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0053] The conductive wire destacking and unstacking method provided in this application embodiment can be applied to, for example... Figure 1 In the application environment shown, the depalletizing device 102 communicates with the server 104 via a network. The data storage system can store the data that the server 104 needs to process, such as a 3D image of the depalletizing environment, and the depalletizing instruction set and depalletizing path for the processed conductive wires. The data storage system can be integrated on the server 104 or placed in the cloud or on another network server. The server identifies the wire type and starting position of the conductive wire to be processed based on the image information from the 3D image. The server generates the depalletizing path for the conductive wire to be processed based on the starting and ending positions, as well as preset optimization strategies and constraints. The server generates the depalletizing instruction set corresponding to the depalletizing path. The depalletizing device can execute this instruction set and update it based on the real-time 3D image until the depalletizing device has completed executing the instruction set. The depalletizing device 102 can be, but is not limited to, various robotic arms, gripping robots, or transport devices. The server 104 can be implemented using a standalone server or a server cluster consisting of multiple servers.

[0054] In one exemplary embodiment, such as Figure 2 As shown, a method for destacking and unstacking conductive wires is provided, which can be applied to... Figure 1Taking the server in the example, the explanation includes the following steps S202 to S208. Wherein:

[0055] Step S202: Based on the current 3D image containing the conductive wire to be processed and the depalletizing environment, determine the wire type and starting point location of the conductive wire to be processed.

[0056] The conductive wire to be processed can be a stacked conductive wire of a certain type, which the depalletizing equipment can depalletize. Alternatively, the conductive wire to be processed can be multiple depalletized conductive wires of at least one type, which the depalletizing equipment can stack again. The current 3D image is a panoramic 3D image of the depalletizing environment containing the conductive wire to be processed at the current time.

[0057] Specifically, the server acquires a current 3D image containing the conductive wire to be processed using an imaging device, and obtains a corresponding 3D image of the conductive wire using image recognition technology. Based on the image features of the conductive wire, the server determines the wire type of the conductive wire. Furthermore, the current 3D image may contain 3D coordinate axes. Based on the position of the 3D image of the conductive wire in the depalletizing environment, the current coordinates of the conductive wire can be obtained, and these current coordinates are used as the starting point position of the conductive wire.

[0058] Step S204: Based on the wire type of the conductive wire to be processed, determine the endpoint position of the conductive wire to be processed in the current 3D image, and determine the destacking and stacking path between the starting position and the endpoint position based on the preset optimization strategy and optimization constraints.

[0059] The optimization constraints include unpacking time and stacking stability. Unpacking time is the total time required to unpack or stack the conductive wires to be processed. Stacking stability represents the stability of the conductive wires during the unpacking and stacking process, i.e., the probability that the conductive wires will not fall during transport and the probability that they will not collapse after being placed down. The preset optimization strategy is a path generation strategy, such as a particle swarm optimization algorithm or a multi-objective raccoon optimization algorithm. The optimization constraints are the optimization objectives required when executing the preset optimization strategy.

[0060] Specifically, each type of conductive wire can have its depalletizing or palletizing endpoint position pre-set in the depalletizing or palletizing environment. The server can determine the endpoint position corresponding to the wire type based on the type of conductive wire to be processed. For example, the first type of conductive wire corresponds to the first endpoint position, and the second type of conductive wire corresponds to the second endpoint position. After determining the start and end positions of the conductive wire to be processed, the server can determine the depalletizing and palletizing path at the start and end positions through a preset optimization strategy. The preset optimization strategy takes optimization constraints as optimization objectives during the calculation process, and obtains the optimal depalletizing and palletizing path based on satisfying multiple optimization constraints. Optimization constraints may include the depalletizing and palletizing time and palletizing stability of the conductive wire.

[0061] Optionally, the optimization constraints may also include the range of movement of the depalletizing and palletizing equipment.

[0062] Step S206: Generate a set of depalletizing instructions based on the depalletizing path and starting position.

[0063] The depalletizing instruction set is used to control the depalletizing equipment to transport the conductive wires to be processed from the starting position to the ending position. The depalletizing instruction set contains multiple instructions for controlling the depalletizing equipment. It can control the depalletizing equipment to grasp, move, and release the wires.

[0064] Specifically, the server uses the depalletizing path as the reference path, the starting position as the gripping position, and the ending position as the release position. Based on this, the server, through the control system of the depalletizing device, analyzes the reference path, gripping position, and release position to obtain gripping, moving, and releasing instructions simulating the aforementioned depalletizing path. This serves as the depalletizing instruction set for a single conductive wire to be processed. For other conductive wires to be processed, the depalletizing path needs to be redefined before the corresponding depalletizing instruction set is regenerated.

[0065] Step S208: When the depalletizing device starts executing the depalletizing instruction set, a real-time three-dimensional image is acquired, and based on the depalletizing environment and depalletizing path in the real-time three-dimensional image, an adjustment path corresponding to the conductive wire to be processed is generated, and the depalletizing instruction set is updated based on the adjustment path until the depalletizing device finishes executing the depalletizing instruction set.

[0066] The real-time 3D image refers to the 3D image generated in real time by the camera or sensor when the depalletizing / palletizing equipment executes the depalletizing / palletizing instruction set. The path to be adjusted refers to the problematic parts of the depalletizing / palletizing path. After the server adjusts the path to be adjusted, it needs to update the corresponding depalletizing / palletizing instructions in the depalletizing / palletizing instruction set to match the path to be adjusted.

[0067] Specifically, the server sends a set of depalletizing instructions to the depalletizing device. Once the execution conditions are met, the depalletizing device executes the instructions and begins depalletizing the conductive wires to be processed. Based on this, the server can use cameras or sensors to determine real-time 3D images of the depalletizing path, the depalletizing device, and the conductors to be processed. The server identifies potential safety hazards in the real-time 3D images and identifies these areas as paths requiring adjustment. These paths can be those where the depalletizing device cannot move, for example, where obstructions exist. They can also be paths overlapping with the location of a worker, for example, where an image of a worker exists within a preset range directly below the path. In this case, the server determines the path to be adjusted based on the image size of the obstruction and the corresponding preset safety range, or based on the image size of the worker and the corresponding preset safety range. The server then regenerates the depalletizing instructions for the path to be adjusted and updates them to the depalletizing instruction set. As the depalletizing and depalletizing equipment continuously executes depalletizing and depalletizing instructions, the server maintains monitoring of the path to be adjusted until the depalletizing and depalletizing equipment has completed the set of depalletizing and depalletizing instructions.

[0068] In the aforementioned conductive wire depalletizing method, the server analyzes the current 3D image containing the conductive wire to be processed and the depalletizing environment to determine the wire type and starting position of the conductive wire in the current 3D image. Furthermore, the ending position of the conductive wire after depalletizing can be determined based on the wire type. The server plans the path between the starting and ending positions according to a preset optimization strategy and optimization constraints to obtain the optimal depalletizing path. By optimizing the constraints, the optimal depalletizing path can be obtained while ensuring depalletizing time and stacking stability. A depalletizing instruction set is generated based on the depalletizing path and the starting position. When the depalletizing device executes the depalletizing instruction set, the server can acquire a real-time 3D image and, based on the real-time 3D image's depalletizing environment and path, determine any problematic paths that need adjustment and regenerate the depalletizing instructions corresponding to the paths to be adjusted, thus obtaining an updated depalletizing instruction set. Once the depalletizing device has executed the depalletizing instruction set, the depalletizing of the conductive wire to be processed is complete. The server determines the start and end points of the depalletizing path using the current 3D image and generates the path by optimizing constraints, quickly obtaining the optimal path. Based on this, the server automatically generates the depalletizing instruction set corresponding to the depalletizing equipment, enabling the equipment to execute the instruction set automatically. Furthermore, the server can adjust the depalletizing path in real time during the depalletizing process, ensuring it remains at the optimal level, thereby improving the depalletizing efficiency of conductive wires while ensuring safety.

[0069] In an exemplary embodiment, the specific implementation process of the step "determining the wire type and starting point location of the conductive wire to be processed based on the current 3D image containing the conductive wire to be processed and the depalletizing environment" includes:

[0070] A shooting command is sent to the imaging device to capture images of the conductive wire to be processed and the depalletizing environment, generating a current 3D image containing both the conductive wire to be processed and the depalletizing environment. The color information of the conductive wire to be processed is acquired, and the wire type is determined based on a preset color information correspondence. The centroid of the conductive wire to be processed in the current 3D image is determined as the starting point of the conductive wire to be processed.

[0071] The color information can be the color of the insulation layer of the conductive wire to be processed, or the color of a preset area on the insulation layer of the conductive wire to be processed. The 3D image can include a 3D model of the conductive wire to be processed, which is created based on sensor recognition.

[0072] Specifically, the server sends a shooting command to the imaging devices. Multiple imaging devices perform a panoramic scan around the depalletizing environment, obtaining a panoramic 3D image of the depalletizing environment. Since the depalletizing environment contains the start and end positions of each conductive wire to be processed, and each conductive wire to be processed is stored in the depalletizing environment, the panoramic 3D image of the depalletizing environment includes the 3D images of the conductive wires to be processed. The server determines the panoramic 3D image before the conductive wires are depalletized as the current 3D image.

[0073] The server identifies the 3D images of the conductors to be processed, obtaining images corresponding to each conductor. It also identifies the colors in the images to determine the color information of each conductor. The server stores the wire type corresponding to each color; therefore, the wire type of the conductor can be determined based on its color. For example, red corresponds to type A, and yellow corresponds to type B. The server uses the 3D images of the conductors to determine their 3D models, takes the center of the 3D model as its centroid, and uses the coordinates of the centroid as the starting point of the conductor.

[0074] In this embodiment, the imaging device can identify the depalletizing environment and the conductive wire to be processed before depalletizing, obtain the current three-dimensional image, and obtain the color information of the conductive wire to be processed based on the image of the conductive wire to be processed, and finally determine the wire type of the conductive wire to be processed. Based on the image of the conductive wire to be processed, the center of gravity of the conductive wire to be processed is determined and determined as the starting position. This can quickly identify the wire type and starting position of the conductive wire to be processed, and improve the efficiency of determining the depalletizing path.

[0075] In an exemplary embodiment, the current 3D image includes a first 3D image and a second 3D image. The specific implementation process of the step "generating a current 3D image containing the conductive wire to be processed and the depalletizing environment" includes:

[0076] The system scans the depalletizing and palletizing environment using a camera to generate a first 3D image containing the conductive wire to be processed. Using sensors, the shape of the conductive wire is acquired. Based on a feature extraction algorithm, the wire features contained in the first 3D image are determined, and a second 3D image of the conductive wire to be processed is determined based on the wire shape and features.

[0077] The first three-dimensional image is an overall image of the depalletizing environment, and the second three-dimensional image is a three-dimensional image of the conductive wire to be processed, from which the shape and size of the conductive wire to be processed can be obtained.

[0078] Specifically, the server performs a panoramic scan of the depalletizing environment using a camera to obtain a first 3D image of the entire environment. At this point, the first 3D image contains only image data of objects within the depalletizing environment, without shape data. Based on this, the server sends shooting commands to sensors to control the sensors to identify and obtain 3D models of each object in the depalletizing environment, thereby obtaining the object shape. Objects can be conductive wires to be processed, scene objects in the environment, obstacles, personnel, etc. The server can obtain the wire shape of the conductive wire to be processed from the sensors, or it can identify a panoramic image of the conductive wire to be processed from the first 3D image and process this panoramic image using a feature extraction algorithm to obtain the wire features of the conductive wire to be processed. The server merges the wire features and wire shape of the conductive wire to obtain a second 3D image of the conductive wire to be processed.

[0079] In this embodiment, a first three-dimensional image of the depalletizing environment is obtained through a camera. Feature extraction can be performed on the first three-dimensional image to obtain the wire features of the conductive wire to be processed. The wire shape of the conductive wire to be processed is obtained through a sensor. The wire features and wire shape are then merged to obtain a second three-dimensional image, which can improve the information richness of the acquired three-dimensional image and increase the data dimension of the three-dimensional image.

[0080] In an exemplary embodiment, the specific implementation process of the step "determining the depalletizing and palletizing path between the starting position and the ending position based on a preset optimization strategy and optimization constraints" includes:

[0081] Based on the wire type of the conductive wire to be processed, the wire parameters are determined, including wire density, wire stiffness, and wire size. Based on these parameters, the maximum stacking quantity and fastest moving speed of the conductive wire to be processed are determined, and these are identified as the first influencing factor affecting the unpacking time. Based on the wire parameters and the gripping parameters of the unpacking and depacking equipment, the minimum turning radius of the conductive wire to be processed is determined, and this is identified as the second influencing factor affecting the stacking stability of the conductive wire to be processed; the gripping parameters include maximum load capacity. Using the first and second influencing factors as constraints, and the starting and ending positions as algorithm inputs, the optimization algorithm corresponding to the preset optimization strategy is solved to obtain the unpacking and depacking path.

[0082] Each wire type includes preset wire parameters. For example, type A has a first wire density, a first wire stiffness, and a first wire size. All conductive wires to be processed are standardized production wires, and the wire parameters are identical for each type. The maximum stacking quantity refers to the maximum number of overlapping conductive wires of this type during stacking. Exceeding the maximum stacking quantity may damage the conductive wires and pose a safety hazard. The depalletizing device can be a robotic arm. The robotic arm itself has gripping parameters, which can be used to limit the maximum load capacity, maximum gripping volume, and other parameters. The fastest moving speed describes the moving speed of the depalletizing device after gripping the conductive wire.

[0083] Specifically, the server determines the wire parameters of the conductive wire to be processed based on preset configuration information and the wire type, obtaining the wire density, wire stiffness, and wire size. The server can calculate the weight of the conductive wire using the wire density and size, and the maximum load-bearing capacity based on the wire stiffness. Based on this, the server can determine the maximum number of stacked conductive wires of that type, according to the maximum load-bearing capacity and the weight of each conductive wire. The server can also determine the maximum moving speed for each wire type based on a preset speed calculation strategy or a preset configuration document, according to the weight of each type of conductive wire. The server defines the maximum number of stacked wires and the fastest moving speed as the first influencing factor, which corresponds to the aforementioned unpacking time.

[0084] The server can obtain the grabbing parameters of the depalletizing equipment, namely the maximum load capacity of the depalletizing equipment. Based on the wire density and wire size, the server can determine the weight of the conductive wire to be processed. According to the maximum load capacity, the weight of the conductive wire to be processed, and the fastest moving speed (the first influencing factor), the minimum turning radius of the depalletizing equipment when turning can be calculated, thereby improving safety during depalletizing and preventing the conductive wire from falling during transport. The server determines the minimum turning radius of the conductive wire to be processed as the second influencing factor, which corresponds to the stacking stability.

[0085] Based on this, the server can use the first and second influencing factors as constraints, and the starting and ending positions as algorithm inputs, and solve the optimization algorithm corresponding to the preset optimization strategy to obtain the depalletizing and palletizing path.

[0086] Optionally, the wire parameters can also be determined by identifying the serial number of the conductive wire to be processed based on the image, and then querying the database using the serial number to obtain the wire parameters corresponding to that serial number. Each serial number corresponds to a set of wire parameters.

[0087] In this embodiment, by acquiring wire parameters and grasping parameters, the first influencing factor affecting the unpacking time and the second influencing factor affecting the stacking stability are determined respectively. Finally, based on the first and second influencing factors, the preset optimization strategy is calculated to obtain the optimal unpacking path between the starting position and the ending position. This unpacking path can improve the safety and efficiency of unpacking.

[0088] In an exemplary embodiment, the depalletizing instruction set includes grab instructions, move instructions, and release instructions. The specific implementation process of the step "generating the depalletizing instruction set based on the depalletizing path and starting position" includes:

[0089] Based on the wire size and density, the required gripping force for the depalletizing equipment is determined, and gripping instructions for the conductive wire to be processed are generated according to the gripping force and starting position. Based on the depalletizing path and the fastest moving speed, movement instructions for the conductive wire to be processed are generated. The release position corresponding to the ending position is determined, and release instructions for the conductive wire to be processed are generated.

[0090] The release position is the position corresponding to the preset distance directly above the endpoint position.

[0091] Specifically, the server determines the weight of the wire based on its size and density, and then determines the gripping force of the depalletizing equipment based on that weight. The server generates a movement command based on the starting position, which moves the depalletizing equipment to that position. This movement command can specify a position directly above the starting position, at a certain vertical distance. Based on this vertical distance and the gripping force, the server generates a downward gripping command. The server then combines the movement command and the downward gripping command into a single gripping command.

[0092] The server generates initial movement instructions based on the palletizing / depalletizing path. Control instructions are used to control the palletizing / depalletizing equipment to move along the path. Based on the fastest movement speed, the server generates speed parameters and merges these parameters into the initial movement instructions to obtain the final movement instructions.

[0093] After obtaining the destination position, the server designates a preset distance directly above the destination position as the release position and generates a first release command to move the depalletizing / palletizing equipment to the release position. Based on this, the server adds a second release command to release the conductive wire to be processed after generating the first release command, and combines them to obtain the final release command.

[0094] In this embodiment, by generating grabbing instructions, moving instructions, and releasing instructions for the conductive wire to be processed, a complete depalletizing instruction set can be generated, thereby improving the accuracy of the depalletizing instruction set.

[0095] In an exemplary embodiment, the specific implementation process of the step "generating the path to be adjusted corresponding to the conductive wire to be processed based on the depalletizing environment and depalletizing path in the real-time 3D image" includes:

[0096] If an obstacle overlaps with the depalletizing path in the depalletizing environment, the overlapping path is deleted, and a first adjustment path is regenerated to replace it. If a living person is directly below the depalletizing path in the depalletizing environment, the dangerous path is deleted, and a second adjustment path is regenerated to replace it. Alarm information corresponding to the first and / or second adjustment paths is sent to the control terminal corresponding to the depalletizing equipment.

[0097] The first path to be adjusted is a movement path that does not overlap with obstacles. There are no living objects directly below the second path to be adjusted.

[0098] Specifically, when the depalletizing / palletizing equipment executes the depalletizing / palletizing instruction set, the server needs to monitor the depalletizing / palletizing path and acquire 3D images of the path via cameras or sensors. If an obstacle is detected in the 3D image and overlaps with the depalletizing / palletizing path, the overlapping path is identified and deleted. Based on the current 3D image and the start and end points of the overlapping path, the server regenerates a first path to be adjusted to bypass the obstacle.

[0099] Accordingly, when the server detects a worker in the 3D image of the depalletizing process, and the worker is located in a preset area directly below the depalletizing path, the server determines that the path corresponding to that preset area is a dangerous path and deletes it. Based on the current 3D image and the start and end points of the dangerous path, the server regenerates a second path to be adjusted that bypasses the worker.

[0100] Finally, after generating the first path to be adjusted, the server needs to send an alarm message for the first path to be adjusted to the control terminal corresponding to the depalletizing and palletizing equipment, reminding the control personnel to correct the path. After generating the second path to be adjusted, the server needs to send an alarm message for the second path to be adjusted to the control terminal corresponding to the depalletizing and palletizing equipment, reminding the control personnel to correct the path and also reminding the control personnel that there are personnel in the depalletizing and palletizing work area.

[0101] In this embodiment, by identifying overlapping paths where obstacles overlap with the depalletizing path, and by identifying dangerous paths where living beings overlap with the depalletizing path, different adjustment paths can be generated, thereby improving the safety of depalletizing.

[0102] In an exemplary embodiment, after the step "update the depalletizing instruction set until the depalletizing device has finished executing the depalletizing instruction set", the method further includes:

[0103] The depalletizing instruction set and its corresponding operation information are encrypted using digital signatures to obtain an instruction block. The operation information includes the operation time, location, and operator identity. The instruction block is then verified through a consensus mechanism to obtain the verification result.

[0104] If the verification result is valid, the instruction block is linked with the previous block based on the hash algorithm to obtain the updated instruction blockchain; the instruction blockchain is used to store the historical operation instruction set of each operator for each conductor to be processed.

[0105] Specifically, the server can package and encrypt the executed depalletizing instruction set and its corresponding operation information using a pre-defined digital signature, thereby obtaining the instruction block for that depalletizing instruction set. The server verifies the instruction block according to a pre-defined consensus mechanism in the storage system and obtains the verification result. If the verification passes, the instruction block can be stored in the instruction blockchain. The server can then use a hash algorithm to connect this instruction block with the last block of the instruction blockchain, thus completing the update of the instruction blockchain.

[0106] In this embodiment, the use of blockchain technology to store the depalletizing and palletizing instruction set can ensure the transparency, security, and traceability of the operation data, ensuring that it can be traced back to the specific operator, thereby reducing risks and disputes.

[0107] like Figure 3 As shown, the following describes in detail the specific execution process of the above-mentioned conductive wire de-palletizing method with reference to a specific embodiment, including the following steps:

[0108] 1. Image Acquisition of Conductive Wires: The server acquires images using a camera, sensors, and an image processing unit. The camera captures real-time images of the conductive wires, the sensors acquire environmental parameters, and the image processing unit processes the image data and extracts the position and status information of the conductive wires. This enables real-time monitoring of the conductive wires' position and status, and provides real-time navigation and guidance information.

[0109] 2. Image processing and feature extraction: The server uses a preset image recognition algorithm to determine the features of the conductive lines to be processed in the 3D image, such as the shape, size, and color of the conductive lines.

[0110] 3. Multi-objective optimization algorithm: Based on the starting and ending positions of the conductive wire to be processed, as well as the preset optimization constraints, the multi-objective optimization algorithm is optimized to generate the depalletizing and palletizing path.

[0111] 4. Blockchain records operations. The server can use the depalletizing instruction set after depalletizing as an operation record and store the operation record and operator information in the blockchain.

[0112] 5. Real-time monitoring and early warning system: During the depalletizing and palletizing process, the server can monitor the depalletizing equipment and the conductive wires to be processed using cameras and sensors, and issue early warning information to the operator in real time.

[0113] In one example, this application embodiment includes a conductive wire depalletizing and palletizing system based on blockchain and a multi-objective raccoon optimization algorithm, specifically including:

[0114] Blockchain technology is a distributed database that records transaction information between all participants. Each block contains the hash value of the previous block, forming an immutable chain structure. In the conductive wire depalletizing system, blockchain is used to record depalletizing operation data, including conductive wire information, depalletizing path, and operators. Each participant can share and verify data, ensuring data transparency and security.

[0115] The Multi-Objective Raccoon Optimization Algorithm (MOO) is an evolutionary algorithm that simulates the foraging behavior of raccoons to find the optimal depalletizing and palletizing paths. Its process includes population initialization, selection, crossover, mutation, and evaluation. Algorithm parameters include population size, crossover rate, and mutation rate. By adjusting these parameters, multiple optimization objectives can be balanced, such as depalletizing and palletizing time, cost, and energy consumption.

[0116] The 3D vision guidance technology unit includes components such as a camera, sensors, and an image processing unit. The camera captures real-time images of the conductive wires, the sensors acquire environmental parameters, and the image processing unit processes the image data and extracts the position and status information of the conductive wires. It can monitor the position and status of the conductive wires in real time and provide real-time navigation and guidance information. Operators can view the position of the conductive wires and the unpacking / palletizing path through a visual interface, allowing for guided operation and timely adjustments.

[0117] In one example, such as Figure 4 The image shows a blockchain technology module in the conductive wire depalletizing and palletizing system, used to record and manage data from depalletizing and palletizing operations.

[0118] 1. Blockchain: In the conductor depalletizing system, blockchain is used to record data on depalletizing operations, including conductor information, depalletizing paths, etc. Each block contains a certain number of transaction records and related information.

[0119] 2. Transaction Records: Transaction records are the units of information transmission in the blockchain, used to record each step of the depalletizing operation. Each block contains multiple transaction records, including information such as the status of the conductive wires and the depalletizing path.

[0120] 3. Consensus Mechanism: The consensus mechanism is a key mechanism in blockchain to ensure data consistency and security, used to guarantee that all participants reach a consensus on the data for depalletizing operations. In a wire depalletizing system, a suitable consensus algorithm can be used, such as Proof-of-Work (PoW) or Proof-of-Stake (PoS).

[0121] In one example, such as Figure 5The diagram shown is a schematic of the multi-objective raccoon optimization algorithm technology unit. This is the multi-objective raccoon optimization algorithm technology module in the conductive wire depalletizing and depalletizing system, used to intelligently plan the depalletizing and depalletizing path of the conductive wire to improve operational efficiency and resource utilization.

[0122] 1. Multi-objective Raccoon Optimization Algorithm Module: In the conductor depalletizing system, the multi-objective Raccoon Optimization Algorithm is used to plan the optimal depalletizing path to balance multiple optimization objectives such as depalletizing time, cost, and energy consumption.

[0123] 2. Depalletizing and Palletizing Path Planning and Optimization: The multi-objective raccoon optimization algorithm module is responsible for planning the optimal depalletizing and palletizing path based on the characteristic information of the conductive wire and the operation requirements, making the depalletizing and palletizing operation more efficient and accurate.

[0124] 3. Optimize parameter settings and adjustments: In the multi-objective raccoon optimization algorithm module, some optimization parameters need to be set and adjusted, such as population size, crossover rate, mutation rate, etc., in order to achieve the best depalletizing and palletizing effect.

[0125] 4. Optimization Result Evaluation and Feedback: The optimization algorithm module needs to evaluate the depalletizing and palletizing path and make feedback adjustments based on the actual results in order to continuously optimize and improve the efficiency and quality of the depalletizing and palletizing operation.

[0126] In one example, such as Figure 6 The diagram shown is a schematic of the 3D visual guidance technology unit.

[0127] 1. Input data: The conductive wire depalletizing and unpalletizing system acquires real-time images and related parameters of the conductive wires through cameras or sensors, which are then transmitted to the system as input data.

[0128] 2. Image Processing and Feature Extraction: The input data is processed by image processing and feature extraction algorithms to extract key features from the conductive wire image, such as edges and shapes.

[0129] 3. Position and State Estimation of Conductive Wires: Based on the extracted feature information, the position, orientation, shape, and other states of the conductive wires are estimated and output as the result.

[0130] 4. Output data: The output data is information such as the position, orientation, and shape of the conductive wires, which is processed and provided to other parts of the system.

[0131] In one exemplary embodiment, in the power industry, power grid companies are responsible for managing and operating power transmission and distribution networks, which include a large number of conductive lines, such as high-voltage transmission lines and distribution lines. A conductive wire unpacking and stacking system based on blockchain and a multi-objective raccoon optimization algorithm can help power grid companies manage and optimize the unpacking and stacking process of conductive lines, improving system operational efficiency and security. This is particularly relevant for power grid companies that need to regularly maintain, upgrade, and expand power lines. In this process, the unpacking and stacking of conductive wires is a crucial step, involving the handling of a large number of conductors and accessories.

[0132] Specifically, data collected by smart sensors is encrypted with digital signatures and then packaged into a block. This block contains various information about the depalletizing and palletizing operation, such as the operation time, location, and operator identity, ensuring data integrity and authenticity. Subsequently, this block is linked with the previous block using a hash algorithm to form a chain, which is then propagated to all nodes through the network. Each node maintains a complete copy of the blockchain. When new data is generated, each node verifies and confirms the data's validity through a consensus mechanism (such as Proof-of-Work or Proof-of-Stake). Only verified data is added to the blockchain.

[0133] The multi-objective Raccoon Optimization Algorithm, based on the specific requirements and on-site conditions of the palletizing / depalletizing operation, systematically identifies multiple optimization objectives, such as minimizing depalletizing time and maximizing palletizing stability. These objectives are then transformed into mathematical models, with parameters set according to the actual on-site conditions. Next, the multi-objective Raccoon Optimization Algorithm is used to solve for the optimal palletizing / depalletizing path. During this process, the algorithm iterates and optimizes continuously until it finds the optimal solution or reaches a certain convergence condition. Finally, the optimized path is applied in actual operation, providing intelligent path guidance for operators and directing the palletizing / depalletizing process.

[0134] Real-time 3D image acquisition of the site is performed using devices such as 3D cameras or laser scanners to obtain information on the power line topology and surrounding environment. Then, computer vision and graphics processing technologies are used to process and analyze the acquired 3D images, extracting the unpacking and stacking paths and work areas for the conductive wires. The processed 3D image data is then integrated with the robotic arm control system. The robotic arm, using a multi-objective optimization algorithm and autonomous decision-making mechanism, autonomously plans its path and controls its movements based on the displayed virtual reality scene to complete the unpacking and stacking operations of the conductive wires.

[0135] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0136] Based on the same inventive concept, this application also provides a conductive wire depalletizing device for implementing the conductive wire depalletizing method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the conductive wire depalletizing device provided below can be found in the limitations of the conductive wire depalletizing method described above, and will not be repeated here.

[0137] In one exemplary embodiment, such as Figure 7 As shown, a conductive wire de-palletizing device 700 is provided, including: a conductive wire determination module 701, a path determination module 702, an instruction generation module 703, and an instruction update module 704, wherein:

[0138] Conductor wire determination module 701 is used to determine the wire type and starting position of the conductor wire to be processed based on a current three-dimensional image containing the conductor wire to be processed and the depalletizing environment;

[0139] The path determination module 702 is used to determine the endpoint position of the conductive wire to be processed in the current 3D image according to the wire type of the conductive wire to be processed, and to determine the destacking and stacking path between the starting position and the endpoint position based on the preset optimization strategy and optimization constraints; the optimization constraints include destacking time and stacking stability.

[0140] The instruction generation module 703 is used to generate a depalletizing instruction set based on the depalletizing path and the starting position; the depalletizing instruction set is used to control the depalletizing equipment to transport the conductive wire to be processed from the starting position to the ending position.

[0141] The instruction update module 704 is used to acquire a real-time three-dimensional image when the depalletizing device starts executing the depalletizing instruction set, and generate an adjustment path corresponding to the conductive wire to be processed based on the depalletizing environment and depalletizing path in the real-time three-dimensional image, and update the depalletizing instruction set based on the adjustment path until the depalletizing device finishes executing the depalletizing instruction set.

[0142] Furthermore, the conductive wire determination module 701 is specifically used for: sending a shooting command to the shooting device so that the shooting device can take pictures of the conductive wire to be processed and the depalletizing environment, generating a current three-dimensional image containing the conductive wire to be processed and the depalletizing environment; acquiring the color information of the conductive wire to be processed, and determining the wire type of the conductive wire to be processed according to the preset correspondence of color information; and determining the centroid of the conductive wire to be processed in the current three-dimensional image as the starting position of the conductive wire to be processed.

[0143] Furthermore, the current three-dimensional image includes a first three-dimensional image and a second three-dimensional image. The conductive wire determination module 701 is specifically used to: scan the depalletizing environment based on a camera to generate a first three-dimensional image containing the conductive wire to be processed; obtain the wire shape of the conductive wire to be processed based on a sensor; determine the wire features contained in the first three-dimensional image based on a feature extraction algorithm; and determine the second three-dimensional image of the conductive wire to be processed based on the wire shape and wire features.

[0144] Further, the path determination module 702 is specifically used for: determining the wire parameters of the conductive wire to be processed based on the wire type; the wire parameters include wire density, wire stiffness, and wire size; determining the maximum number of stacked conductive wires and the fastest moving speed based on the wire parameters, and identifying them as the first influencing factor affecting the unpacking time of the conductive wires; determining the minimum turning radius of the conductive wires to be processed based on the wire parameters and the gripping parameters of the unpacking and unpacking equipment, and identifying it as the second influencing factor affecting the stacking stability of the conductive wires; the gripping parameters include the maximum load-bearing capacity; using the first and second influencing factors as constraints, the starting position and the ending position as algorithm inputs, and solving the optimization algorithm corresponding to the preset optimization strategy to obtain the unpacking and unpacking path.

[0145] Furthermore, the depalletizing instruction set includes gripping instructions, moving instructions, and releasing instructions. The instruction generation module 703 is specifically used for: determining the gripping force required by the depalletizing device based on the wire size and wire density, and generating a gripping instruction corresponding to the conductive wire to be processed based on the gripping force and the starting position; generating a moving instruction corresponding to the conductive wire to be processed based on the depalletizing path and the fastest moving speed; determining the release position corresponding to the endpoint position, and generating a release instruction corresponding to the conductive wire to be processed; the release position is the position corresponding to a preset distance directly above the endpoint position.

[0146] Furthermore, the instruction update module 704 is specifically used for: deleting the overlapping path when there is an obstacle in the depalletizing environment that overlaps with the depalletizing path, and regenerating a first path to be adjusted to replace the overlapping path; the first path to be adjusted is a movement path that does not overlap with the obstacle; deleting the dangerous path when there is a living body directly below the depalletizing path in the depalletizing environment, and regenerating a second path to be adjusted to replace the dangerous path; there is no living body directly below the second path to be adjusted; and sending alarm information corresponding to the first path to be adjusted and / or the second path to be adjusted to the control terminal corresponding to the depalletizing equipment.

[0147] Furthermore, the device also includes an instruction storage module, used for: encrypting the depalletizing instruction set and the corresponding operation information based on digital signatures to obtain an instruction block; the operation information includes operation time, operation location, and operator identity; verifying the instruction block through a consensus mechanism to obtain a verification result; if the verification result is valid, establishing a connection between the instruction block and the previous block based on a hash algorithm to obtain an updated instruction blockchain; the instruction blockchain is used to store the historical operation instruction sets of each operator for each conductor to be processed.

[0148] Each module in the aforementioned conductive wire de-palletizing device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each module.

[0149] In one exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 8 As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operating system and computer programs stored in the non-volatile storage media. The database stores data in a blockchain format, such as depalletizing instruction sets and operator-related operation information. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When executed by the processor, the computer program implements a conductive wire depalletizing method.

[0150] Those skilled in the art will understand that Figure 8 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0151] In one exemplary embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above-described method embodiments.

[0152] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0153] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0154] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0155] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0156] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0157] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for unpacking and unpacking conductive wires, characterized in that, The method includes: Send a shooting command to the shooting device so that the shooting device can take pictures of the conductive wire to be processed and the depalletizing environment, and generate a current three-dimensional image containing the conductive wire to be processed and the depalletizing environment; Obtain the color information of the conductive wire to be processed, and determine the wire type of the conductive wire to be processed according to the preset correspondence of the color information; The centroid of the conductive line to be processed in the current three-dimensional image is determined as the starting position of the conductive line to be processed. Based on the wire type of the conductive wire to be processed, the endpoint position of the conductive wire to be processed in the current three-dimensional image is determined, and based on a preset optimization strategy and optimization constraints, the unpacking and stacking path between the starting position and the endpoint position is determined; the optimization constraints include unpacking time and stacking stability. Based on the depalletizing path and the starting position, a depalletizing instruction set is generated; the depalletizing instruction set is used to control the depalletizing equipment to transport the conductive wire to be processed from the starting position to the ending position; When the depalletizing device starts executing the depalletizing instruction set, a real-time three-dimensional image is acquired, and based on the depalletizing environment and the depalletizing path in the real-time three-dimensional image, an adjustment path corresponding to the conductive line to be processed is generated, and the depalletizing instruction set is updated based on the adjustment path until the depalletizing device finishes executing the depalletizing instruction set.

2. The method according to claim 1, characterized in that, The current 3D image includes a first 3D image and a second 3D image; generating the current 3D image containing the conductive wire to be processed and the depalletizing environment includes: The camera scans the depalletizing environment to generate a first three-dimensional image containing the conductive wire to be processed, and the sensor obtains the wire shape of the conductive wire to be processed. Based on the feature extraction algorithm, the wire features contained in the first three-dimensional image are determined, and the second three-dimensional image of the conductive wire to be processed is determined based on the wire shape and wire features.

3. The method according to claim 1, characterized in that, The process of determining the depalletizing / palletizing path between the starting position and the ending position based on a preset optimization strategy and optimization constraints includes: Based on the wire type of the conductive wire to be processed, the wire parameters of the conductive wire to be processed are determined; the wire parameters include wire density, wire stiffness, and wire size. Based on the wire parameters, the maximum number of stacks and the fastest moving speed of the conductive wire to be processed are determined, and these are identified as the first influencing factor affecting the unpacking time of the conductive wire to be processed. Based on the wire parameters and the gripping parameters of the destacking and stacking equipment, the minimum turning radius of the conductive wire to be processed is determined, and is identified as the second influencing factor affecting the stacking stability of the conductive wire to be processed; the gripping parameters include the maximum load-bearing capacity; Using the first influence factor and the second influence factor as constraints, the starting position and the ending position as algorithm inputs, and solving the optimization algorithm corresponding to the preset optimization strategy, the destacking and palletizing path is obtained.

4. The method according to claim 3, characterized in that, The depalletizing instruction set includes grab instructions, move instructions, and release instructions; the generation of the depalletizing instruction set based on the depalletizing path and the starting position includes: Based on the wire size and the wire density, the gripping force required by the depalletizing equipment is determined, and a gripping instruction corresponding to the conductive wire to be processed is generated according to the gripping force and the starting position. Based on the stacking and unpacking path and the fastest moving speed, a moving instruction corresponding to the conductive line to be processed is generated. Determine the release position corresponding to the endpoint position and generate a release command corresponding to the conductive line to be processed; the release position is the position corresponding to a preset distance directly above the endpoint position.

5. The method according to claim 1, characterized in that, The step of generating the adjustment path corresponding to the conductive wire to be processed based on the depalletizing environment and the depalletizing path in the real-time 3D image includes: If an obstacle overlaps with the depalletizing path in the depalletizing environment, the overlapping path is deleted, and a first path to be adjusted is regenerated to replace the overlapping path; the first path to be adjusted is a movement path that does not overlap with the obstacle. If a live object is present directly below the depalletizing path in the depalletizing environment, the dangerous path is deleted, and a second path to be adjusted is generated to replace the dangerous path; there is no live object directly below the second path to be adjusted. Send alarm information corresponding to the first path to be adjusted and / or the second path to be adjusted to the control terminal corresponding to the depalletizing and palletizing equipment.

6. The method according to claim 1, characterized in that, The step of updating the depalletizing instruction set until the depalletizing device has finished executing the depalletizing instruction set further includes: The depalletizing instruction set and the corresponding operation information are encrypted using digital signatures to obtain an instruction block; the operation information includes operation time, operation location, and operator identity. The instruction block is verified through a consensus mechanism to obtain the verification result; If the verification result is valid, the instruction block is linked to the previous block based on a hash algorithm to obtain an updated instruction blockchain; the instruction blockchain is used to store the historical operation instruction sets of each operator for each conductor to be processed.

7. A conductive wire unpacking and unpacking device, characterized in that, The device includes: The conductive wire determination module is used to send a shooting command to the shooting device so that the shooting device can shoot the conductive wire to be processed and the depalletizing environment, generate a current three-dimensional image containing the conductive wire to be processed and the depalletizing environment; acquire the color information of the conductive wire to be processed, and determine the wire type of the conductive wire to be processed according to the preset correspondence of the color information; and determine the centroid of the conductive wire to be processed in the current three-dimensional image as the starting position of the conductive wire to be processed. The path determination module is used to determine the endpoint position of the conductive wire to be processed in the current three-dimensional image according to the wire type of the conductive wire to be processed, and to determine the destacking and stacking path between the starting position and the endpoint position based on a preset optimization strategy and optimization constraints; the optimization constraints include destacking time and stacking stability. The instruction generation module is used to generate a set of depalletizing instructions based on the depalletizing path and the starting position; the set of depalletizing instructions is used to control the depalletizing equipment to transport the conductive wire to be processed from the starting position to the ending position. The instruction update module is used to acquire a real-time three-dimensional image when the depalletizing device starts executing the depalletizing instruction set, and generate an adjustment path corresponding to the conductive wire to be processed based on the depalletizing environment and the depalletizing path in the real-time three-dimensional image, and update the depalletizing instruction set based on the adjustment path until the depalletizing device finishes executing the depalletizing instruction set.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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