Nitrogen cabinet for drying wafer packaging box and control method thereof
By designing the isolation plate and exhaust slot structure of the placement area inside the nitrogen cabinet, the drying of the wafer packaging box is achieved by utilizing temperature-controlled nitrogen flow, which solves the drying problem of the wafer box after cleaning and improves the cleanliness of the wafer surface and storage stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 杭州中欣晶圆半导体股份有限公司
- Filing Date
- 2024-07-17
- Publication Date
- 2026-08-04
AI Technical Summary
The problem of drying wafer packaging boxes after cleaning has not been effectively solved in the existing technology, which affects the cleanliness of the wafer surface and the stability of the storage process.
A nitrogen cabinet was designed, which includes a placement area isolation plate and an exhaust slot. A pressure difference is formed through nitrogen inlet and exhaust pipes, and temperature-controlled nitrogen flow is used to dry the wafer packaging box.
It achieves effective drying of wafer packaging boxes, improves the cleanliness of wafer surfaces and the stability of the storage process, and has the advantages of simple structure and stable operation.
Smart Images
Figure CN118882300B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer packaging structure processing technology, specifically to a nitrogen cabinet for drying wafer packaging boxes and its control method. Background Technology
[0002] In the fabrication of semiconductor integrated circuits, the cleanliness of the wafer surface is crucial for high-quality silicon device manufacturing. If the wafer surface quality does not meet the requirements, no matter how well other process steps are controlled, it is impossible to obtain high-quality semiconductor devices. Therefore, strict control is required throughout the entire wafer fabrication and storage process.
[0003] At the wafer storage level, current technologies typically store wafers in wafer cassettes, which are then placed in nitrogen-filled cabinets. This process involves frequent storage and retrieval of the wafer cassettes. The wafer packaging cassettes are reused during use and require cleaning and drying. Summary of the Invention
[0004] This invention addresses the shortcomings of existing technologies by providing a nitrogen cabinet and its control method for drying wafer packaging boxes. It features a simple structure and good operational stability, thus solving the problem of drying wafer packaging boxes after cleaning.
[0005] The above-mentioned technical problems of the present invention are mainly solved by the following technical solutions: A nitrogen cabinet for drying wafer packaging boxes includes a nitrogen cabinet with a placement area isolation plate inside. The placement area isolation plate has several exhaust slots. One side of the placement area isolation plate and the nitrogen cabinet form a wafer packaging box placement area I, and the other side of the placement area isolation plate and the nitrogen cabinet form a wafer packaging box placement area II. The side of the nitrogen cabinet is provided with a nitrogen inlet pipe connected to the wafer packaging box placement area I, and the upper end of the nitrogen cabinet is provided with a nitrogen exhaust pipe connected to the wafer packaging box placement area II.
[0006] Preferably, the exhaust slot is a rectangular or oval-shaped hole.
[0007] A method for controlling a nitrogen chamber includes the following operating steps: Step 1: Connect the nitrogen exhaust pipe to the nitrogen exhaust port at the plant end, and connect the nitrogen inlet pipe to the nitrogen inlet at the plant end.
[0008] Step 2: Wafer packaging box placement area I and wafer packaging box placement area II are used to place clean wafer packaging boxes that have been cleaned in the cleaning machine.
[0009] Step 3: Nitrogen gas is introduced into the nitrogen inlet pipe, filling the nitrogen cabinet with nitrogen gas at 27℃~40℃, so that the residual moisture on the surface of the wafer packaging boxes in wafer packaging box placement area I and wafer packaging box placement area II is carried away by the nitrogen gas.
[0010] Step 4: The nitrogen in the nitrogen cabinet is discharged through nitrogen exhaust pipe 2.
[0011] Preferably, the exhaust pressure at the nitrogen exhaust pipe is set to 0–200 kPa, the supply pressure at the nitrogen inlet pipe is 0.50–0.70 MPa, and the temperature is 30°C. A certain pressure difference is formed between the nitrogen inlet pipe and the nitrogen exhaust pipe, so that the nitrogen can flow smoothly in the nitrogen cabinet and be discharged, thereby achieving the purpose of drying the wafer packaging box.
[0012] Preferably, nitrogen in wafer packaging box placement area I enters wafer packaging box placement area II through the exhaust slot on the placement area isolation plate.
[0013] The present invention can achieve the following effects: This invention provides a nitrogen cabinet for drying wafer packaging boxes and its control method, which, compared with existing technologies, has the advantages of simple structure and good operational stability. It solves the problem of drying wafer packaging boxes after cleaning. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of the present invention.
[0015] In the diagram: 1. Nitrogen cabinet; 2. Nitrogen exhaust pipe; 3. Placement area isolation plate; 4. Exhaust slot; 5. Wafer packaging box placement area I; 6. Nitrogen inlet pipe; 7. Wafer packaging box placement area II. Detailed Implementation
[0016] The technical solution of the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.
[0017] Example: Figure 1 As shown, a nitrogen cabinet for drying wafer packaging boxes includes a nitrogen cabinet 1. The nitrogen cabinet 1 has a placement area isolation plate 3 inside, and the placement area isolation plate 3 has 18 exhaust slots 4, which are rectangular or oval-shaped holes. One side of the placement area isolation plate 3 and the nitrogen cabinet 1 form a wafer packaging box placement area I 5, and the other side of the placement area isolation plate 3 and the nitrogen cabinet 1 form a wafer packaging box placement area II 7. A nitrogen inlet pipe 6 connected to the wafer packaging box placement area I 5 is provided on the side of the nitrogen cabinet 1, and a nitrogen exhaust pipe 2 connected to the wafer packaging box placement area II 7 is provided at the top of the nitrogen cabinet 1.
[0018] A method for controlling a nitrogen chamber includes the following operating steps: Step 1: Connect nitrogen exhaust pipe 2 to the nitrogen exhaust port at the plant end, and connect nitrogen inlet pipe 6 to the nitrogen inlet at the plant end.
[0019] Step 2: Place the cleaned wafer packaging boxes in wafer packaging box placement area I5 and wafer packaging box placement area II7.
[0020] Step 3: Nitrogen gas is introduced through nitrogen inlet pipe 6, filling nitrogen cabinet 1 with nitrogen gas at 27℃~40℃. Nitrogen gas in wafer packaging box placement area I5 enters wafer packaging box placement area II7 through exhaust slot 4 on the placement area isolation plate 3. This allows residual moisture on the surface of the wafer packaging boxes in wafer packaging box placement areas I5 and II7 to be carried away by the nitrogen gas.
[0021] Step 4: The nitrogen in nitrogen tank 1 is discharged through nitrogen exhaust pipe 2.
[0022] The exhaust pressure at nitrogen exhaust pipe 2 is set to 100 kPa, the supply pressure at nitrogen inlet pipe 6 is 0.60 MPa, and the temperature is 30℃. A certain pressure difference is formed between nitrogen inlet pipe 6 and nitrogen exhaust pipe 2, so that nitrogen can flow smoothly in nitrogen cabinet 1 and be discharged, thereby achieving the purpose of drying wafer packaging boxes.
[0023] In summary, the nitrogen cabinet and its control method for drying wafer packaging boxes have the advantages of simple structure and good operational stability. They solve the problem of drying wafer packaging boxes after cleaning.
[0024] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present invention are covered by the patent scope of the present invention.
Claims
1. A method for controlling a nitrogen cabinet for drying a wafer packaging box, the method comprising: The nitrogen cabinet (1) is equipped with a placement area isolation plate (3), and the placement area isolation plate (3) is equipped with several exhaust slots (4). One side of the placement area isolation plate (3) and the nitrogen cabinet (1) is a wafer packaging box placement area I (5), and the other side of the placement area isolation plate (3) and the nitrogen cabinet (1) is a wafer packaging box placement area II (7). The side of the nitrogen cabinet (1) is equipped with a nitrogen inlet pipe (6) connected to the wafer packaging box placement area I (5), and the upper end of the nitrogen cabinet (1) is equipped with a nitrogen exhaust pipe (2) connected to the wafer packaging box placement area II (7). The control method for the nitrogen cabinet includes the following operating steps: Step 1: Connect the nitrogen exhaust pipe (2) to the nitrogen exhaust port at the plant end, and connect the nitrogen inlet pipe (6) to the nitrogen inlet at the plant end; Step 2: Place clean wafer packaging boxes in wafer packaging box placement area I (5) and wafer packaging box placement area II (7) after cleaning in the cleaning machine; Step 3: Nitrogen gas is introduced into the nitrogen gas inlet pipe (6) and nitrogen gas at 27℃~40℃ is filled into the nitrogen cabinet (1), so that the moisture remaining on the surface of the wafer packaging box in wafer packaging box placement area I (5) and wafer packaging box placement area II (7) is carried away by the nitrogen gas. Step 4: The nitrogen in the nitrogen cabinet (1) is discharged through the nitrogen exhaust pipe 2; The exhaust pressure at the nitrogen exhaust pipe (2) is set to 0-200 kPa, the supply pressure at the nitrogen inlet pipe (6) is 0.50-0.70 MPa, and the temperature is 30°C. A certain pressure difference is formed between the nitrogen inlet pipe (6) and the nitrogen exhaust pipe (2), so that the nitrogen can flow smoothly in the nitrogen cabinet (1) and be discharged, thereby achieving the purpose of drying the wafer packaging box.
2. The method for controlling the nitrogen cabinet for wafer packaging box drying according to claim 1, wherein: The exhaust slot (4) is a rectangular or oval hole structure.
3. The method for controlling the nitrogen cabinet for wafer packaging box drying according to claim 2, characterized in that: Nitrogen gas in wafer packaging box placement area I (5) enters wafer packaging box placement area II (7) through exhaust slot (4) on the placement area isolation plate (3).