Display panel and display device

Abstract

This invention provides a display panel and a display device. The display panel includes an array substrate, a light-emitting film group disposed on one side of the array substrate, and a fingerprint recognition film group disposed on the side of the light-emitting film group away from the array substrate and electrically connected to the array substrate. This invention, by stacking the light-emitting film group and the fingerprint recognition film group, disconnects the lateral connection path between photosensitive sub-pixels and light-emitting sub-pixels, eliminates lateral electrical crosstalk between photosensitive sub-pixels and light-emitting sub-pixels, and improves the signal-to-noise ratio of the photosensitive sub-pixels.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] In recent years, with the continuous development of display technology, more and more display devices have adopted fingerprint recognition to protect user privacy. Currently, OLED (Organic Light-Emitting Diode) devices have become a highly competitive and promising next-generation display technology due to their advantages such as all-solid-state structure, high brightness, wide viewing angle, fast response speed, and flexible display capabilities. Integrating an OPD (Organic Photo Detector) into an OLED panel can extend the fingerprint recognition area to the entire panel and allow for customization of the recognition area according to user needs, thus achieving fingerprint recognition. This technology has attracted widespread research interest from both academia and industry.

[0003] However, in related fingerprint recognition display technologies, the fingerprint recognition module has a low signal-to-noise ratio, resulting in inaccurate fingerprint recognition. Furthermore, the display panel's PPI (pixels per inch) and aperture ratio are also low, further impacting the display quality. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel and display device to solve the problems of poor fingerprint recognition and display effects caused by the low signal-to-noise ratio of the fingerprint recognition module, the low resolution of the display panel, and the low aperture ratio in related fingerprint recognition display technologies.

[0005] To achieve the above objectives, the present invention provides a display panel, the display panel comprising an array substrate, a light-emitting film group disposed on one side of the array substrate, and a fingerprint recognition film group disposed on the side of the light-emitting film group away from the array substrate and electrically connected to the array substrate.

[0006] Furthermore, the display panel also includes a plurality of pixel units, each pixel unit comprising: at least one light-emitting sub-pixel located in the light-emitting film group; and at least one photosensitive sub-pixel located in the fingerprint recognition film group. The orthographic projection of the photosensitive sub-pixel on the array substrate at least partially overlaps with the orthographic projection of the light-emitting sub-pixel on the array substrate.

[0007] Furthermore, each pixel unit includes at least three light-emitting sub-pixels, and the orthographic projection of the photosensitive sub-pixel on the array substrate is located between the orthographic projections of two adjacent light-emitting sub-pixels on the array substrate. Preferably, the orthographic projection of the photosensitive sub-pixel on the array substrate at least partially overlaps with the orthographic projections of two adjacent light-emitting sub-pixels on the array substrate.

[0008] Further, the photosensitive sub-pixel includes a first electrode layer, a photosensitive active layer, and a second electrode layer. The first electrode layer is disposed on the side of the light-emitting film group away from the array substrate and is electrically connected to the array substrate. The photosensitive active layer is disposed on the side of the first electrode layer away from the light-emitting film group. The second electrode layer is disposed on the side of the photosensitive active layer away from the first electrode layer. Preferably, the orthographic projection of the second electrode layer on the array substrate is located within the orthographic projection range of the photosensitive sub-pixel on the array substrate.

[0009] Furthermore, the display panel also includes an organic pattern layer located on the side of the fingerprint recognition film assembly away from the light-emitting film assembly. The orthographic projection of the organic pattern layer on the array substrate does not overlap with the orthographic projection of the second electrode layer on the array substrate. Preferably, the material of the organic pattern layer includes a small organic molecule material.

[0010] Furthermore, the photosensitive sub-pixel also includes a first defining layer disposed on the side of the first electrode layer away from the light-emitting film group. The first defining layer has a first opening, and the photosensitive active layer is disposed in the first opening. Preferably, the material of the first defining layer includes at least one of organic and inorganic materials.

[0011] Furthermore, the photosensitive velocity limiter also includes an overlap region, the orthographic projection of which on the array substrate does not coincide with the orthographic projection of the first opening on the array substrate. The overlap region has at least one overlap hole, through which the second electrode layer is connected to the signal trace.

[0012] Furthermore, the display panel also includes an encapsulation film assembly disposed on the side of the fingerprint recognition film assembly away from the light-emitting film assembly. Preferably, the material of the encapsulation film assembly includes organic and inorganic materials. More preferably, the inorganic material in the first defining layer is the same as the inorganic material in the encapsulation film assembly.

[0013] Furthermore, the display panel also includes an inorganic protective layer and an auxiliary electrode layer. The inorganic protective layer is disposed on the side of the fingerprint recognition film assembly away from the light-emitting film assembly. The auxiliary electrode layer is located on the side of the fingerprint recognition film assembly away from the light-emitting film assembly and is electrically connected to both the fingerprint recognition film assembly and the light-emitting film assembly. Preferably, the auxiliary electrode layer has a mesh structure.

[0014] The present invention also provides a display device, the display device comprising the display panel as described above.

[0015] The advantages of the present invention are: the display panel and display device of the present invention, by staggering the photosensitive sub-pixels and the light-emitting sub-pixels, disconnects the lateral connection path between the photosensitive sub-pixels and the light-emitting sub-pixels, thereby preventing the charge in the light-emitting sub-pixels from being transferred to the photosensitive sub-pixels through the lateral path and misleading the photosensitive sub-pixels to generate incorrect signals, eliminating lateral electrical crosstalk between the photosensitive sub-pixels and the light-emitting sub-pixels, and thus improving the signal-to-noise ratio of the photosensitive sub-pixels. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the layered structure of the display panel in Embodiment 1 of the present invention;

[0018] Figure 2 This is a schematic diagram of the layered structure of the display panel in Embodiment 1 of the present invention;

[0019] Figure 3 This is a schematic diagram of the layered structure of the display panel in another embodiment of the present invention;

[0020] Figure 4 This is a top view of the photosensitive sub-pixel in Embodiment 1 of the present invention;

[0021] Figure 5 for Figure 4 A simplified cross-sectional diagram of the photosensitive sub-pixel emerging from the AA' line;

[0022] Figure 6 This is a schematic diagram of the layered structure of the display panel in Embodiment 2 of the present invention;

[0023] Figure 7 This is a schematic diagram of the layered structure of the display panel in another embodiment of the present invention;

[0024] Figure 8 This is a top view of the auxiliary electrode in another embodiment of the present invention.

[0025] The components in the diagram are shown below:

[0026] Display panel 1; Array substrate 10;

[0027] Substrate 11; Thin-film transistor 12;

[0028] Insulating film assembly 13; Fingerprint recognition film assembly 20;

[0029] Photosensitive sub-pixel 21; First limiting layer 22;

[0030] First opening 23; First electrode layer 24;

[0031] Photosensitive active layer 25; Second electrode layer 26;

[0032] Overlap area 27; Overlap hole 28;

[0033] Organic patterned layer 29; luminescent film assembly 30;

[0034] Light-emitting sub-pixel 31; First light-emitting sub-pixel 311;

[0035] Second light-emitting pixel 312; Third light-emitting pixel 313;

[0036] Second limiting layer 32; Second opening 33;

[0037] Third electrode layer 34; Organic light-emitting layer 35;

[0038] Fourth electrode layer 36; Signal trace 37;

[0039] Inorganic protective layer 40; Encapsulation film assembly 50;

[0040] First protective layer 51; Second protective layer 52;

[0041] Third protective layer 53; Touch film assembly 60;

[0042] Cover plate 70; Auxiliary electrode 80. Detailed Implementation

[0043] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0044] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0045] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0046] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0047] Example 1

[0048] In related display technologies, because OLED and OPD devices are positioned on the same plane and share an organic transport layer, the lateral charge transport in the organic transport layer during fingerprint recognition via optical signals also excites a significant dark current in the OPD device, thus reducing its signal-to-noise ratio. Furthermore, to ensure compatibility with OPD devices, display panels often reduce the PPI and aperture ratio of their OLED devices, impacting image quality and lifespan. However, increasing the PPI and aperture ratio of the OLED to reduce the number of OPD devices would compromise fingerprint recognition sensitivity, making it difficult to achieve optimal fingerprint recognition results.

[0049] To address the aforementioned technical problems, this embodiment of the invention provides a display panel 1, such as... Figure 1 As shown, the display panel 1 includes an array substrate 10, a light-emitting film group 30, a fingerprint recognition film group 20, and an encapsulation film group 50. The array substrate 10 drives the light-emitting film group 30 and the fingerprint recognition film group 20. The light-emitting film group 30 is disposed on one side of the array substrate 10 and is used to convert electrical energy into light energy, thereby providing a light source for the display panel 1 to form a display image. The fingerprint recognition film group 20 is disposed on the side of the light-emitting film group 30 away from the array substrate 10 and is used to convert light signals into electrical signals, thereby realizing full-screen fingerprint recognition. The encapsulation film group 50 is disposed on the side of the fingerprint recognition film group 20 away from the light-emitting film group 30 and is used to encapsulate and protect the light-emitting film group 30 and the fingerprint recognition film group 20.

[0050] The array substrate 10 includes a substrate layer 11, a thin film transistor 12, and an insulating film group 13.

[0051] The substrate 11 includes a flexible substrate and a buffer layer disposed on the flexible substrate. The flexible substrate may be a PI (Polyimide) film, and the buffer layer is made of an inorganic material, such as silicon oxide (SiO) or silicon nitride (SiN). An array of thin-film transistors 12 is arranged on the side of the buffer layer away from the flexible substrate, and serves as a driver device electrically connected to the light-emitting film assembly 30 and the fingerprint recognition film assembly 20.

[0052] The thin-film transistor 12 includes an active layer, a gate layer, and source / drain layers. The gate layer is disposed on the side of the active layer away from the substrate layer 11. The source / drain layers are disposed on the side of the gate layer away from the active layer and are electrically connected to both ends of the active layer. The insulating film group 13 includes multiple insulating film layers, which are used to insulate and protect the conductive structures in the thin-film transistor 12. The active layer can be made of a semiconductor material such as single-crystal silicon, polycrystalline silicon, or metal oxide; the gate layer can be made of one or more conductive metal materials such as silver (Ag), magnesium (Mg), aluminum (Al), copper (Cu), or nickel (Ni); the source / drain layers are a stacked structure of multiple conductive layer materials, which can be a titanium / aluminum / titanium (Ti / Al / Ti) stacked structure, an aluminum / titanium (Al / Ti) stacked structure, an aluminum / molybdenum (Al / Mo) stacked structure, or a molybdenum / aluminum / molybdenum (Mo / Al / Mo) stacked structure.

[0053] The insulating film group 13 includes a gate insulating layer, a capacitor dielectric layer, an interlayer dielectric layer, and a planarization layer. The gate insulating layer is disposed on the substrate layer 11 and covers the exposed surface of the active layer. The gate layer is disposed on the surface of the gate insulating layer away from the active layer. The capacitor dielectric layer is disposed on the gate insulating layer and covers the exposed surface of the gate layer. The interlayer dielectric layer is disposed on the surface of the capacitor dielectric layer away from the gate layer, and the source / drain layers are disposed on the surface of the interlayer dielectric layer away from the gate layer. The planarization layer is disposed on the interlayer dielectric layer and covers the exposed surfaces of the source / drain layers. The materials of the gate insulating layer, capacitor dielectric layer, and interlayer dielectric layer may all contain inorganic materials, such as silicon oxide (SiO) or silicon nitride (SiN); the material of the planarization layer is an organic material, such as optical adhesive or photosensitive polyimide.

[0054] The light-emitting film group 30 is disposed on the side of the planarization layer away from the thin-film transistor 12, and includes a plurality of light-emitting sub-pixels 31. Each light-emitting sub-pixel 31 includes a second defining layer 32, a third electrode layer 34, an organic light-emitting layer 35, and a fourth electrode layer 36. The third electrode layer 34 is disposed on the surface of the planarization layer away from the thin-film transistor 12, and its bottom end is electrically connected to the corresponding thin-film transistor 12 through a via. The second defining layer 32 is disposed on the planarization layer, and a second opening 33 is provided at the location corresponding to the third electrode layer 34, with a portion of the surface of the third electrode layer 34 exposed in the second opening 33. The organic light-emitting layer 35 is disposed in the second opening 33 and covers the exposed surface of the third electrode in the second opening 33. The fourth electrode layer 36 is disposed on the side of the organic light-emitting layer 35 away from the third electrode layer 34. The third electrode layer 34 and the fourth electrode layer 36 respectively introduce electrons and holes into the organic light-emitting layer 35. The electrons and holes combine in the organic light-emitting layer 35 to excite the light-emitting excitons in the organic light-emitting layer 35 to emit light, providing a display light source for the display panel 1. The third electrode layer 34 is a stacked structure of multiple conductive materials, such as an indium zinc oxide / silver / indium zinc oxide (ITO / Ag / ITO) stacked structure, a titanium / aluminum / titanium (Ti / Al / Ti) stacked structure, etc.; the fourth electrode layer 36 can be a transparent or semi-transparent semi-reflective electrode layer, and its materials can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), etc.; the material of the second limiting layer 32 can be an organic insulating material such as polyimide, polyamide, acrylic resin, etc.

[0055] Furthermore, the light-emitting film assembly 30 also includes an inorganic protective layer 40, which is disposed on the side of the second electrode layer 26 away from the organic light-emitting layer 35 and covers each light-emitting sub-pixel 31. This inorganic protective layer 40 serves as insulation protection. The material of the inorganic protective layer 40 can be silicon oxide (SiO) or silicon oxynitride (SiON).

[0056] A fingerprint recognition film assembly 20 is disposed on the surface of the inorganic protective layer 40 opposite to the light-emitting sub-pixels 31. It includes multiple photosensitive sub-pixels 21, each comprising a first defining layer 22, a first electrode layer 24, a photosensitive active layer 25, and a second electrode layer 26. The first electrode layer 24 is disposed on the surface of the inorganic protective layer 40 opposite to the light-emitting sub-pixels 31, and its bottom end is electrically connected to a corresponding thin-film transistor 12 in the array substrate 10 via a via. The first defining layer 22 is disposed on the side of the first electrode layer 24 opposite to the light-emitting film assembly 30 and has a first opening 23 corresponding to the first electrode layer 24, with a portion of the surface of the first electrode layer 24 exposed in the first opening 23. The photosensitive active layer 25 is disposed in the first opening 23 and covers the exposed surface of the first electrode layer 24 in the first opening 23. The second electrode layer 26 is disposed on the side of the photosensitive active layer 25 away from the first electrode layer 24 and extends from the surface of the photosensitive active layer 25 away from the first electrode layer 24 to the surface of the first defining layer 22 away from the first electrode layer 24. The first electrode layer 24 can be a reflective electrode made of metal materials such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), and nickel (Ni), or a transparent or semi-transparent semi-reflective electrode made of metal oxide materials such as indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO); the second electrode layer 26 is a transparent or semi-transparent semi-reflective electrode layer made of metal oxide materials such as indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO); the photosensitive active layer 25 includes an organic photosensitive material that senses red, green, or blue light; preferably, since the light intensity and luminous efficiency of green light-emitting materials are greater, the photosensitive active layer 25 uses an organic photosensitive material that senses green light.

[0057] In this embodiment of the invention, by staggering the photosensitive sub-pixels 21 and the light-emitting sub-pixels 31 to form a stacked structure, the light-emitting film group 30 and the fingerprint recognition film group 20 are constructed to prevent the lateral path of charge in the light-emitting sub-pixels 31 from being transmitted to the photosensitive sub-pixels 21, thereby eliminating the lateral electrical crosstalk between the photosensitive sub-pixels 21 and the light-emitting sub-pixels 31 and improving the signal-to-noise ratio of fingerprint recognition.

[0058] The display panel 1 has multiple pixel units, each pixel unit including at least one light-emitting sub-pixel 31 and at least one photosensitive sub-pixel 21. Preferably, as shown in the figure... Figure 1As shown, each pixel unit has at least three light-emitting sub-pixels 31, namely a first light-emitting sub-pixel 311, a second light-emitting sub-pixel 312, and a third light-emitting sub-pixel 313, which are used to emit red light, green light, and blue light, respectively. The photosensitive sub-pixel 313 is located on the side away from the first light-emitting sub-pixel 311 and the second light-emitting sub-pixel 312, and the orthographic projection of the photosensitive active layer 25 in the photosensitive sub-pixel 21 onto the array substrate 10 does not overlap with the orthographic projection of the light-emitting layer in any of the light-emitting sub-pixels 31 onto the array substrate 10. This prevents the light emitted from the light-emitting sub-pixels 31 from passing through the first electrode layer 24 into the photosensitive active layer 25 and affecting the operation of the fingerprint recognition film assembly 20.

[0059] Furthermore, such as Figure 2 As shown, in the same pixel unit, the orthographic projection of the photosensitive sub-pixel 21 on the array substrate 10 can at least partially overlap with the orthographic projection of the adjacent light-emitting sub-pixel 31 on the array substrate 10. That is, the orthographic projection of the first limiting layer 22 of the photosensitive sub-pixel 21 on the array substrate 10 partially overlaps with the orthographic projection of the second limiting layer 32 of the adjacent light-emitting sub-pixel 31 on the array substrate 10. This reduces the horizontal distance between the photosensitive sub-pixel 21 and the light-emitting sub-pixel 31, reduces the light-emitting area occupied by the photosensitive sub-pixel 21, leaves more area to increase the aperture ratio of the light-emitting sub-pixel 31, and increases the number of light-emitting sub-pixels 31 without reducing the number of photosensitive sub-pixels 21. In this way, the PPI of the display panel 1 is increased without affecting the sensitivity of the fingerprint recognition function. At the same time, reducing the horizontal distance between the photosensitive sub-pixel 21 and the light-emitting sub-pixel 31 can also limit the angle of light when the photosensitive sub-pixel 21 senses green light to a smaller range, such as less than or equal to 30°, thereby avoiding interference signals from the light emitted by the red light-emitting sub-pixel 31 and the blue light-emitting sub-pixel 31 to the photosensitive sub-pixel 21, and further improving the signal-to-noise ratio of the fingerprint recognition film group 20.

[0060] In another embodiment of the invention, such as Figure 3As shown, in the same pixel unit, the photosensitive sub-pixel 21 can also be disposed between two adjacent light-emitting sub-pixels 31, causing the orthographic projection of the photosensitive sub-pixel 21 on the array substrate 10 to be located between the orthographic projections of the two adjacent light-emitting sub-pixels 31 on the array substrate 10, and the orthographic projection of the photosensitive sub-pixel 21 on the array substrate 10 at least partially overlaps with the orthographic projections of the two adjacent light-emitting sub-pixels 31 on the array substrate 10, thereby further reducing the light-emitting area occupied by the photosensitive sub-pixel 21, further improving the PPI and aperture ratio of the display panel 1, and also improving the design flexibility of the shape and PPI of the photosensitive sub-pixel 21, which is beneficial to improving the sensitivity of the fingerprint recognition function of the display panel 1. Specifically, the photosensitive sub-pixel 21 is located between the first light-emitting sub-pixel 311 and the second light-emitting sub-pixel 312, and the orthographic projection of the photosensitive sub-pixel 21 on the array substrate 10 overlaps with the orthographic projection of the second limiting layer 32 located between the first light-emitting sub-pixel 311 and the second light-emitting sub-pixel 312 on the array substrate 10. A via is provided between the first light-emitting sub-pixel 311 and the second light-emitting sub-pixel 312. The via passes through the inorganic protective layer 40, the second limiting layer 32 and the planarization layer to the surface of the source and drain layer. The first electrode layer 24 of the photosensitive sub-pixel 21 is electrically connected to the source and drain layer of the corresponding thin film transistor 12 through the via.

[0061] Furthermore, such as Figure 4 As shown, each photosensitive sub-pixel 21 also has an overlap region 27. The orthographic projection of the overlap region 27 on the array substrate 10 does not overlap with the orthographic projection of the first opening 23 on the array substrate 10. The second electrode layer 26 extends from the first opening 23 to the first limiting layer 22 and covers the overlap region 27, and is connected to the signal trace 37 through the overlap structure in the overlap region 27. Specifically, as shown... Figure 5 As shown, each overlap area 27 is provided with at least one overlap hole 28. The overlap hole 28 passes through the first limiting layer 22, the light-emitting film group 30 and part of the insulating film layer in the array substrate 10 in sequence. The second electrode layer 26 passes through the first limiting layer 22 and the light-emitting film group 30 through the overlap hole 28 to be electrically connected to the signal line 37 located in the array substrate 10, so as to realize the transmission of signals.

[0062] Furthermore, the fingerprint recognition film assembly 20 also includes an organic pattern layer 29, which is located on the side of the fingerprint recognition film assembly 20 away from the light-emitting film assembly 30. The organic pattern layer 29 covers the surface of the fingerprint recognition film assembly 20 opposite to the light-emitting film assembly 30 and surrounds each photosensitive sub-pixel 21, meaning that the orthographic projection of the photosensitive sub-pixel 21 onto the array substrate 10 does not coincide with the orthographic projection of the organic pattern layer 29 onto the array substrate 10. The organic pattern layer 29 contains small organic molecule materials, such as CPM (Cathode Patterning Material), which can be formed by evaporating CPM material in areas other than the photosensitive sub-pixels 21 using a fine metal mask (FMM) before fabricating the second electrode layer 26. The CPM material contained in the organic pattern layer 29 is selectively deposited only on the material of the second electrode layer 26, which reduces the adhesion of the second electrode layer 26. When the second electrode layer 26 is deposited using a Common Metal Mask (CMM), the material of the second electrode layer 26 will be difficult to adhere to where the CPM material is present, causing the second electrode layer 26 to be deposited only on the photosensitive sub-pixel 21. That is, the orthographic projection of the second electrode layer 26 on the array substrate 10 is located within the orthographic projection range of the photosensitive sub-pixel 21 on the array substrate 10. The second electrode layer 26 patterned by the organic pattern layer 29 can prevent the light emitted by the light-emitting sub-pixel 31 from being reflected or refracted into the photosensitive sub-pixel 21 by the second electrode layer 26, thereby reducing the signal-to-noise ratio of the photosensitive sub-pixel 21. At the same time, since the CPM material has high light transmittance in the visible light region, it will not affect the transmittance and brightness of the display panel 1.

[0063] The encapsulation film assembly 50 includes a first protective layer 51, a second protective layer 52, and a third protective layer 53 stacked sequentially. The first protective layer 51 is disposed on the surface of the fingerprint recognition film assembly 20 opposite to the light-emitting film assembly 30 and covers each photosensitive sub-pixel 21. The second protective layer 52 is disposed on the surface of the first protective layer 51 opposite to the fingerprint recognition film assembly 20. The third protective layer 53 is disposed on the side of the second protective layer 52 opposite to the first protective layer 51. Both the first protective layer 51 and the third protective layer 53 are inorganic film layers, which can be one or more of silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiON); the second protective layer 52 is an organic film layer. Furthermore, the material used for the first limiting layer 22 in the photosensitive sub-pixel 21 is the same as the material used for the first protective layer 51 in the encapsulation film assembly 50, thereby preventing reflection and refraction of the light-emitting sub-pixels 31 on the first limiting layer 22, thus reducing the waste of display light and improving the brightness of the display panel 1.

[0064] The display panel 1 also includes a touch film assembly 60 and a cover plate 70. The touch film assembly 60 is disposed on the side of the encapsulation film assembly 50 away from the fingerprint recognition film assembly 20, and the cover plate 70 is disposed on the side of the touch film assembly 60 away from the fingerprint recognition film assembly 20. The touch film assembly 60 is used to realize touch control, and the cover plate 70 is used to protect the surface of the display panel 1.

[0065] This invention also provides a display device, which can be an OLED display device, including the display panel 1 as described above. The display device can be any display device with display functionality, such as a mobile phone, laptop computer, or tablet computer.

[0066] In this embodiment of the invention, by staggering the photosensitive sub-pixels and the light-emitting sub-pixels, the lateral connection path between the photosensitive sub-pixels and the light-emitting sub-pixels is disconnected, thereby preventing the charge in the light-emitting sub-pixels from being transferred to the photosensitive sub-pixels through the lateral path and misleading the photosensitive sub-pixels to generate incorrect signals, eliminating lateral electrical crosstalk between the photosensitive sub-pixels and the light-emitting sub-pixels, and thus improving the signal-to-noise ratio of the photosensitive sub-pixels.

[0067] Meanwhile, in this embodiment of the invention, the light-emitting area occupied by the photosensitive sub-pixels in the display panel is reduced by compressing the arrangement space between the photosensitive sub-pixels and the light-emitting sub-pixels, thereby saving space to increase the number of light-emitting sub-pixels and the aperture ratio. In this way, the PPI and aperture ratio of the light-emitting sub-pixels in the display panel are improved without affecting the sensitivity of the fingerprint recognition function, thus improving the display effect of the display panel.

[0068] Example 2

[0069] This embodiment of the invention also provides a display panel 1, such as... Figure 6 As shown, the display panel 1 includes an array substrate 10, a light-emitting film group 30, a fingerprint recognition film group 20, and an encapsulation film group 50. The array substrate 10 drives the light-emitting film group 30 and the fingerprint recognition film group 20. The light-emitting film group 30 is disposed on one side of the array substrate 10 and is used to convert electrical energy into light energy, thereby providing a light source for the display panel 1 to form a display image. The fingerprint recognition film group 20 is disposed on the side of the light-emitting film group 30 away from the array substrate 10 and is used to convert light signals into electrical signals, thereby realizing full-screen fingerprint recognition. The encapsulation film group 50 is disposed on the side of the fingerprint recognition film group 20 away from the light-emitting film group 30 and is used to encapsulate and protect the light-emitting film group 30 and the fingerprint recognition film group 20.

[0070] The array substrate 10 includes a substrate layer 11, a thin film transistor 12, and an insulating film group 13.

[0071] The substrate 11 includes a flexible substrate and a buffer layer disposed on the flexible substrate. The flexible substrate may be a PI (Polyimide) film, and the buffer layer is made of an inorganic material, such as silicon oxide (SiO) or silicon nitride (SiN). An array of thin-film transistors 12 is arranged on the side of the buffer layer away from the flexible substrate, and serves as a driver device electrically connected to the light-emitting film assembly 30 and the fingerprint recognition film assembly 20.

[0072] The thin-film transistor 12 includes an active layer, a gate layer, and source / drain layers. The gate layer is disposed on the side of the active layer away from the substrate layer 11. The source / drain layers are disposed on the side of the gate layer away from the active layer and are electrically connected to both ends of the active layer. The insulating film group 13 includes multiple insulating film layers, which are used to insulate and protect the conductive structures in the thin-film transistor 12. The active layer can be made of a semiconductor material such as single-crystal silicon, polycrystalline silicon, or metal oxide; the gate layer can be made of one or more conductive metal materials such as silver (Ag), magnesium (Mg), aluminum (Al), copper (Cu), or nickel (Ni); the source / drain layers are a stacked structure of multiple conductive layer materials, which can be a titanium / aluminum / titanium (Ti / Al / Ti) stacked structure, an aluminum / titanium (Al / Ti) stacked structure, an aluminum / molybdenum (Al / Mo) stacked structure, or a molybdenum / aluminum / molybdenum (Mo / Al / Mo) stacked structure.

[0073] The insulating film group 13 includes a gate insulating layer, a capacitor dielectric layer, an interlayer dielectric layer, and a planarization layer. The gate insulating layer is disposed on the substrate layer 11 and covers the exposed surface of the active layer. The gate layer is disposed on the surface of the gate insulating layer away from the active layer. The capacitor dielectric layer is disposed on the gate insulating layer and covers the exposed surface of the gate layer. The interlayer dielectric layer is disposed on the surface of the capacitor dielectric layer away from the gate layer, and the source / drain layers are disposed on the surface of the interlayer dielectric layer away from the gate layer. The planarization layer is disposed on the interlayer dielectric layer and covers the exposed surfaces of the source / drain layers. The materials of the gate insulating layer, capacitor dielectric layer, and interlayer dielectric layer may all contain inorganic materials, such as silicon oxide (SiO) or silicon nitride (SiN); the material of the planarization layer is an organic material, such as optical adhesive or photosensitive polyimide.

[0074] The light-emitting film group 30 is disposed on the side of the planarization layer away from the thin-film transistor 12, and includes a plurality of light-emitting sub-pixels 31. Each light-emitting sub-pixel 31 includes a second defining layer 32, a third electrode layer 34, an organic light-emitting layer 35, and a fourth electrode layer 36. The third electrode layer 34 is disposed on the surface of the planarization layer away from the thin-film transistor 12, and its bottom end is electrically connected to the corresponding thin-film transistor 12 through a via. The second defining layer 32 is disposed on the planarization layer, and a second opening 33 is provided at the location corresponding to the third electrode layer 34, with a portion of the surface of the third electrode layer 34 exposed in the second opening 33. The organic light-emitting layer 35 is disposed in the second opening 33 and covers the exposed surface of the third electrode in the second opening 33. The fourth electrode layer 36 is disposed on the side of the organic light-emitting layer 35 away from the third electrode layer 34. The third electrode layer 34 and the fourth electrode layer 36 respectively introduce electrons and holes into the organic light-emitting layer 35. The electrons and holes combine in the organic light-emitting layer 35 to excite the light-emitting excitons in the organic light-emitting layer 35 to emit light, providing a display light source for the display panel 1. The third electrode layer 34 is a stacked structure of multiple conductive materials, such as an indium zinc oxide / silver / indium zinc oxide (ITO / Ag / ITO) stacked structure, a titanium / aluminum / titanium (Ti / Al / Ti) stacked structure, etc.; the fourth electrode layer 36 can be a transparent or semi-transparent semi-reflective electrode layer, and its materials can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), etc.; the material of the second limiting layer 32 can be an organic insulating material such as polyimide, polyamide, acrylic resin, etc.

[0075] A fingerprint recognition film assembly 20 is disposed on the surface of the inorganic protective layer 40 opposite to the light-emitting sub-pixels 31. It includes multiple photosensitive sub-pixels 21, each comprising a first electrode layer 24, a photosensitive active layer 25, and a second electrode layer 26. The first electrode layer 24 is disposed on the surface of the second defining layer 32 opposite to the array substrate 10, and its bottom end is electrically connected to a corresponding thin-film transistor 12 in the array substrate 10 via a via. The photosensitive active layer 25 is disposed on the surface of the first electrode layer 24 away from the light-emitting film assembly 30. The orthographic projection of the photosensitive active layer 25 in the photosensitive sub-pixel 21 onto the array substrate 10 does not overlap with the orthographic projection of the light-emitting layer in any of the light-emitting sub-pixels 31 onto the array substrate 10. The second electrode layer 26 is disposed on the surface of the photosensitive active layer 25 away from the first electrode layer 24, and the orthographic projection of the second electrode layer 26 onto the array substrate 10 is within the orthographic projection range of the photosensitive sub-pixel 21 onto the array substrate 10. The first electrode layer 24 can be simultaneously fabricated with the fourth electrode layer 36 in the light-emitting sub-pixel 31; the second electrode layer 26 is a transparent or semi-transparent semi-reflective electrode layer formed by metal oxide materials such as indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO); the photosensitive active layer 25 includes an organic photosensitive material that senses red, green, or blue light; furthermore, since the light intensity and luminous efficiency of the green light-emitting material are greater, the photosensitive active layer 25 adopts an organic photosensitive material that senses green light.

[0076] The display panel 1 has multiple pixel units, each including at least one light-emitting sub-pixel 31 and at least one photosensitive sub-pixel 21. Within the same pixel unit, the photosensitive sub-pixel 21 can also be positioned between two adjacent light-emitting sub-pixels 31, causing the orthographic projection of the photosensitive sub-pixel 21 onto the array substrate 10 to lie between the orthographic projections of the two adjacent light-emitting sub-pixels 31 onto the array substrate 10. This reduces the light-emitting area occupied by the photosensitive sub-pixel 21, further improving the PPI and aperture ratio of the display panel 1. It also increases the design flexibility of the shape and PPI of the photosensitive sub-pixel 21, which is beneficial for improving the sensitivity of the fingerprint recognition function of the display panel 1.

[0077] In this embodiment of the invention, the pixel-limiting structure in the photosensitive sub-pixel 21 is removed, thereby reducing the horizontal distance between the photosensitive sub-pixel 21 and the light-emitting sub-pixel 31, reducing the light-emitting area occupied by the photosensitive sub-pixel 21, leaving more area to increase the aperture ratio of the light-emitting sub-pixel 31, and increasing the number of light-emitting sub-pixels 31 without reducing the number of photosensitive sub-pixels 21, thereby increasing the PPI of the display panel 1 without affecting the sensitivity of the fingerprint recognition function. At the same time, reducing the horizontal distance between the photosensitive sub-pixel 21 and the light-emitting sub-pixel 31 can also limit the light angle of the photosensitive sub-pixel 21 when sensing green light to a smaller range, for example, less than or equal to 30°, thereby avoiding interference signals from the light emitted by the red light-emitting sub-pixel 31 and the blue light-emitting sub-pixel 31 to the photosensitive sub-pixel 21, and further improving the signal-to-noise ratio of the fingerprint recognition film group 20. In this embodiment of the invention, the first electrode layer 24 and the fourth electrode layer 36 are also prepared simultaneously. The first electrode layer 24 and the fourth electrode layer 36 can be prepared by the same mask, thus reducing two masking processes (i.e., eliminating the masking process used to pattern the pixel-defining structure in the photosensitive sub-pixel 21 and the masking process used to pattern the first electrode layer 24), improving the production efficiency of the display panel 1 and reducing the production cost.

[0078] The display panel 1 also includes an inorganic protective layer 40, which is disposed on one side of the light-emitting film group 30 and covers each photosensitive sub-pixel 21. This inorganic protective layer 40 serves as insulation protection. The material of the inorganic protective layer 40 can be silicon oxide (SiO) or silicon oxynitride (SiON).

[0079] Furthermore, in another embodiment of the present invention, the display panel 1 further includes an auxiliary electrode layer 80, such as... Figure 7 As shown, the auxiliary electrode layer 80 is disposed on the surface of the inorganic protective layer 40 away from the light-emitting film group 30, and is electrically connected to the fourth electrode layer 36 of the light-emitting sub-pixel 31 and the second electrode layer 26 of the photosensitive sub-pixel 21 through vias. Figure 8 As shown, the auxiliary electrode layer 80 has a mesh structure, which can transmit signals from the second electrode layer 26 and the fourth electrode layer 36 through the signal traces in the non-display area of ​​the frame of the display panel 1. This can reduce the non-uniformity of the current signal caused by the voltage drop of the electrodes when the photosensitive sub-pixel 21 converts the light signal into an electrical signal, and improve the detection sensitivity.

[0080] like Figure 6As shown, the encapsulation film assembly 50 includes a first protective layer 51, a second protective layer 52, and a third protective layer 53 stacked sequentially. The first protective layer 51 is disposed on the surface of the inorganic protective layer 40 facing away from the light-emitting film assembly 30. The second protective layer 52 is disposed on the surface of the first protective layer 51 facing away from the light-emitting film assembly 30. The third protective layer 53 is disposed on the side of the second protective layer 52 facing away from the first protective layer 51. The first protective layer 51 and the third protective layer 53 are both inorganic film layers, which can be one or more of silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiON); the second protective layer 52 is an organic film layer.

[0081] The display panel 1 also includes a touch film assembly 60 and a cover plate 70. The touch film assembly 60 is disposed on the side of the encapsulation film assembly 50 away from the fingerprint recognition film assembly 20, and the cover plate 70 is disposed on the side of the touch film assembly 60 away from the fingerprint recognition film assembly 20. The touch film assembly 60 is used to realize touch control, and the cover plate 70 is used to protect the surface of the display panel 1.

[0082] In this embodiment of the invention, by staggering the photosensitive sub-pixels and the light-emitting sub-pixels, the lateral connection path between the photosensitive sub-pixels and the light-emitting sub-pixels is disconnected, thereby preventing the charge in the light-emitting sub-pixels from being transferred to the photosensitive sub-pixels through the lateral path and misleading the photosensitive sub-pixels to generate incorrect signals, eliminating lateral electrical crosstalk between the photosensitive sub-pixels and the light-emitting sub-pixels, and thus improving the signal-to-noise ratio of the photosensitive sub-pixels.

[0083] Meanwhile, in this embodiment of the invention, the pixel-defining structure in the photosensitive sub-pixels is removed to reduce the space occupied by the photosensitive sub-pixels and the light-emitting area occupied by the photosensitive sub-pixels in the display panel. This saves space to increase the number of light-emitting sub-pixels and the aperture ratio, thereby improving the PPI and aperture ratio of the light-emitting sub-pixels in the display panel without affecting the sensitivity of the fingerprint recognition function, thus improving the display effect of the display panel. Furthermore, the first electrode layer in the photosensitive sub-pixels and the fourth electrode layer in the light-emitting sub-pixels are fabricated simultaneously, eliminating the fabrication step of the pixel-defining structure and the patterning step that removes the original first electrode layer, improving the production efficiency of the display panel and reducing the production cost.

[0084] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A display panel, characterized in that, The display panel includes multiple pixel units, and the display panel includes: Array substrate; A light-emitting film group is disposed on one side of the array substrate and includes multiple light-emitting sub-pixels; A fingerprint recognition film assembly, disposed on the side of the light-emitting film assembly away from the array substrate and electrically connected to the array substrate, includes a plurality of photosensitive sub-pixels. Each photosensitive sub-pixel includes a first electrode layer, a photosensitive active layer, and a second electrode layer sequentially stacked along the path away from the light-emitting film assembly. Each pixel unit includes at least one light-emitting sub-pixel and at least one photosensitive sub-pixel. The orthographic projection of the photosensitive sub-pixel onto the array substrate at least partially overlaps with the orthographic projection of the light-emitting sub-pixel onto the array substrate. An organic pattern layer is located on one side of the light-emitting film group where the fingerprint recognition film group is disposed, and on the side of the fingerprint recognition film group away from the light-emitting film group. The organic pattern layer is made of organic small molecule materials and surrounds the plurality of photosensitive sub-pixels. The organic small molecule material contained in the organic patterned layer is a material selectively deposited on the second electrode layer to reduce the adhesion of the second electrode layer to the surface of the organic patterned layer.

2. The display panel as described in claim 1, characterized in that, Each pixel unit includes at least three light-emitting sub-pixels, and the orthographic projection of the photosensitive sub-pixel on the array substrate is located between the orthographic projections of two adjacent light-emitting sub-pixels on the array substrate.

3. The display panel as described in claim 2, characterized in that, The orthographic projection of the photosensitive sub-pixel on the array substrate at least partially overlaps with the orthographic projections of the two adjacent light-emitting sub-pixels on the array substrate.

4. The display panel as described in claim 1, characterized in that, The photosensitive sub-pixels include: The first electrode layer is disposed on the side of the light-emitting film group away from the array substrate and is electrically connected to the array substrate; The photosensitive active layer is disposed on the side of the first electrode layer away from the light-emitting film assembly; The second electrode layer is disposed on the side of the photosensitive active layer away from the first electrode layer; The orthographic projection of the second electrode layer on the array substrate is located within the orthographic projection range of the photosensitive sub-pixel on the array substrate.

5. The display panel as described in claim 1, characterized in that, The orthographic projection of the organic patterned layer on the array substrate does not overlap with the orthographic projection of the second electrode layer on the array substrate.

6. The display panel as described in claim 4, characterized in that, The photosensitive sub-pixels also include: A first limiting layer is disposed on the side of the first electrode layer away from the light-emitting film group, and has a first opening, wherein the photosensitive active layer is disposed in the first opening.

7. The display panel as described in claim 6, characterized in that, The material of the first defining layer includes at least one of organic and inorganic materials.

8. The display panel as described in claim 6, characterized in that, The photon rate limiting also includes: The overlapping area, wherein the orthographic projection of the overlapping area on the array substrate does not coincide with the orthographic projection of the first opening on the array substrate; The overlap area is provided with at least one overlap hole, and the second electrode layer is connected to the signal trace through the overlap hole.

9. The display panel as described in claim 6, characterized in that, Also includes: An encapsulation film assembly is disposed on the side of the fingerprint recognition film assembly away from the light-emitting film assembly; The materials of the encapsulation membrane assembly include organic materials and inorganic materials; The inorganic material in the first limiting layer is the same as the inorganic material in the encapsulation film assembly.

10. The display panel as claimed in claim 1, characterized in that, Also includes: An inorganic protective layer is disposed on the side of the fingerprint recognition film assembly away from the light-emitting film assembly; An auxiliary electrode layer is located on the side of the fingerprint recognition film group away from the light-emitting film group, and is electrically connected to both the fingerprint recognition film group and the light-emitting film group.

11. The display panel as claimed in claim 10, characterized in that, The auxiliary electrode layer has a mesh structure.

12. A display device, characterized in that, Includes the display panel as described in any one of claims 1-11.

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