Sub-area segmentation and interference adaptive adjustment method and system for full-area grinding and polishing of integral blade disk

CN118893529BActive Publication Date: 2025-04-22HUAZHONG UNIV OF SCI & TECH
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Patent Information

Application Number
CN202411058966.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-08-02
Publication Date
2025-04-22
Estimated Expiration
2044-08-02

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Abstract

The invention belongs to the technical field of mechanical manufacturing, and discloses a method and system for sub-region segmentation and interference adaptive adjustment of full-area grinding and polishing of an integral blade disk. The sub-region segmentation of the to-be-grinded and polished area of ​​the integral blade disk is used to establish the to-be-grinded and polished sub-region, and a suitable tool is selected according to the curvature of the sub-region surface and the interference degree; a NURBS surface of the sub-region is constructed, and models of different grinding and polishing tools are established; information of discrete tool position points is obtained according to the NURBS surface parameters, and the minimum principal curvature direction of each tool position point is calculated as the initial tool axis direction; the tool model is simplified, and interference is judged according to the distance between the tool model and an interference inspection surface; a bounded artificial repulsive potential field is added to the interference inspection surface, and when the distance between the tool and the interference inspection surface is less than a certain value, the tool is subjected to a force in the negative direction of the gradient, and a relationship between the force and the adjustment angle is established to realize adaptive non-interference adjustment of the posture; the path transition between all sub-regions is smoothed to obtain a uniform full-area grinding and polishing path of the integral blade disk.
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