A grinding method and grinding apparatus for radio frequency circuit boards

Abstract

This invention discloses a grinding method and apparatus for radio frequency (RF) circuit boards, relating to the field of RF circuit board processing technology. It includes a clamping mechanism for holding the RF circuit board, comprising toothed wheels and toothed belts. The toothed belts are sleeved on multiple toothed wheels, which drive the toothed belts. The bottom of the toothed belts is parallel to the RF circuit board, and two toothed belts are used to clamp the RF circuit board. This invention achieves clamping through the toothed belts via a clamping mechanism, preventing relative sliding between the toothed belts and the RF circuit board and thus avoiding wear on the clamped portion. Furthermore, as more of the area to be ground is exposed by the toothed belts, the overall clamping area of ​​the toothed belts on the RF circuit board remains constant, without affecting the clamping effect. Moreover, as the grinding mechanism feeds, the exposed portion of the toothed belt remains constant, ensuring a constant clamping force and distance from the edge of the RF circuit board to be ground.

Description

Technical Field

[0001] This invention relates to the field of radio frequency circuit board processing technology, and specifically to a grinding method and grinding apparatus for radio frequency circuit boards. Background Technology

[0002] Radio frequency (RF) circuit boards are printed circuit boards specifically designed and manufactured for radio frequency (RF) circuits. RF circuits refer to high-frequency signal circuits used in fields such as wireless communication, radar, satellite communication, and radio broadcasting, and have strict requirements for circuit layout, design, and circuit board processing.

[0003] Multilayer radio frequency circuit boards are made by stacking the various boards together according to the design requirements and sequence using adhesive layers. For some circuit boards with many processing steps, protrusions need to be set at key parts of the board edge for clamping or fixing to facilitate clamping and processing. After the board is processed, the reserved parts are ground off using grinding equipment to ensure the overall accuracy of the circuit board.

[0004] During the lamination of multilayer boards, when degassing, air bubbles in the center of the board gradually move towards the edge, leaving some bubbles behind. Therefore, although most of the air and bubbles between the boards can be squeezed out, tiny air bubbles remain in the adhesive layer at the edge of the board. This makes it easy for abrasive grains and board powder from the grinding equipment to enter the tiny air bubble pores between the stacked boards during the grinding process. As the grinding equipment continues to process, more abrasive grains and board powder enter the tiny air bubble pores, which will compress the boards and cause debonding and separation between adjacent layers, affecting the quality of the multilayer radio frequency circuit board. Summary of the Invention

[0005] In order to overcome the above-mentioned technical problems, the present invention aims to provide a grinding method and grinding apparatus for radio frequency circuit boards, so as to solve the problem mentioned in the background art that when grinding multilayer radio frequency circuit boards, abrasive particles and board powder generated by grinding will enter and squeeze the tiny air bubbles between the stacked boards, causing debonding and separation between adjacent boards, which affects the quality of multilayer radio frequency circuit boards.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] A grinding device for an RF circuit board includes a clamping mechanism for holding the RF circuit board. The clamping mechanism includes toothed wheels and toothed belts. The toothed belts are sleeved on multiple toothed wheels. The multiple toothed wheels are used to drive the toothed belts. The bottom of the toothed belts is parallel to the RF circuit board. Two toothed belts are used to clamp the RF circuit board.

[0008] The toothed belt includes toothed strips and a first belt, with a plurality of toothed strips disposed on the inner wall of the first belt; when the toothed strips move to the position of the toothed wheel, the toothed strips mesh with the toothed wheel, the toothed strips are rigid structures, and the first belt is a flexible structure.

[0009] As a further embodiment of the present invention: the clamping mechanism further includes a second mounting frame, a first cylinder and a third mounting frame, the first cylinder is mounted on the second mounting frame and the output end of the first cylinder is connected to the third mounting frame, and the plurality of toothed wheels are rotatably connected to the third mounting frame; the third mounting frame is provided with an auxiliary clamping structure, and the auxiliary clamping mechanism is used to provide support for the toothed belt.

[0010] As a further aspect of the present invention: the auxiliary clamping mechanism includes a clamping plate, a clamping rod, and a sliding groove. The clamping plate is disposed on a third mounting frame, and a plurality of clamping rods are disposed at the bottom end of the clamping plate. The sliding groove is formed through the toothed strip. When the toothed strip moves to the position of the clamping rod, the clamping rod slides on the plurality of sliding grooves. The end of the clamping rod is provided with a dome, which is used to assist the clamping rod in sliding on the sliding groove.

[0011] As a further aspect of the present invention, it also includes a positioning mechanism, a grinding mechanism, and an xyz-axis linear module. The positioning mechanism is used to fix and position the RF circuit board, and the grinding mechanism is used to grind the RF circuit board. The positioning mechanism includes a turntable and a clamp disposed on the turntable. The turntable rotates the RF circuit board by a fixed angle, and the clamp is used to hold the RF circuit board. The turntable is disposed at the output end of the xyz-axis linear module, and the xyz-axis linear module is used to drive the RF circuit board to move linearly along the x-axis, y-axis, and z-axis to adjust the position of the RF circuit board and align it with the clamping mechanism. The grinding mechanism includes a first mounting frame, a motor, and a grinding wheel. The motor and the grinding wheel are both disposed on the first mounting frame, and the motor is used to drive the grinding wheel to rotate.

[0012] As a further aspect of the present invention: the second mounting bracket is provided with a moving mechanism for pushing the grinding wheel to move. The moving mechanism includes a second cylinder mounted on the second mounting bracket and a third cylinder mounted on the output end of the second cylinder. The second cylinder is used to push the grinding wheel to move back and forth. The output end of the third cylinder is connected to the first mounting bracket. The third cylinder is used to drive the grinding wheel to move left and right.

[0013] As a further aspect of the present invention: the moving mechanism further includes a synchronization mechanism for driving the clamping mechanism to move synchronously with the grinding wheel. When the grinding wheel moves back and forth towards the RF circuit board for grinding, the clamping mechanism moves back and forth synchronously with the grinding wheel. When the grinding wheel moves left and right for grinding, the clamping mechanism remains stationary in a clamping state. The synchronization mechanism includes a spur gear disposed at the end of the toothed wheel. A rack is slidably connected to the third mounting bracket, and the rack meshes with the spur gear. A baffle is disposed on the first mounting bracket, which is used to push the rack to move. A spring is disposed between the rack and the third mounting bracket, and the spring is used to drive the rack to reset.

[0014] As a further aspect of the present invention, it also includes a cleaning mechanism for cleaning dust particles adhering to the grinding surface of the radio frequency circuit board and the grinding wheel. The cleaning mechanism includes a cleaning cylinder rotatably connected to the first mounting bracket and a cleaning brush disposed on the cleaning cylinder. The cleaning brush is used to clean the grinding position of the radio frequency circuit board and the grinding wheel.

[0015] As a further embodiment of the present invention: the cleaning mechanism further includes a linkage mechanism for driving the cleaning cylinder to rotate, the linkage mechanism including a rotating wheel and a second belt, the two rotating wheels being respectively disposed on the grinding wheel and the cleaning cylinder, and the second belt being tensioned on the two rotating wheels.

[0016] As a further aspect of the present invention: the cleaning cylinder is provided with a dust suction mechanism for cleaning dust particles accumulated in the microbubbles on the radio frequency circuit board. The dust suction mechanism includes a fan, a collection box, and through holes. The fan is located inside the cleaning cylinder and rotates as the cleaning cylinder rotates. Multiple through holes are formed on the cleaning cylinder to connect the inside and outside of the cleaning cylinder. The collection box is located at the bottom of the cleaning cylinder and has an opening. A filter screen is provided on the opening to filter dust and allow air to pass through.

[0017] As a further aspect of the present invention: the vacuuming mechanism further includes a reverse rotation mechanism for driving the cleaning cylinder and the fan to rotate in opposite directions. A gearbox is provided between the first mounting bracket and the cleaning cylinder. The reverse rotation mechanism is located inside the gearbox. The reverse rotation mechanism includes a driving bevel gear, a first driven bevel gear, a second driven bevel gear, and a disc. One of the rotating wheels is located on a connecting shaft, and the rotating wheel is used to drive the connecting shaft to rotate. The driving bevel gear is located at one end of the connecting shaft, and the fan is located at the other end of the driving bevel gear. The fan is rotatably connected to the inside of the cleaning cylinder. The first driven bevel gear is rotatably connected to the gearbox. The driving bevel gear meshes with the first driven bevel gear. The disc is located on the cleaning cylinder, and the second driven bevel gear is located on the disc. The first driven bevel gear meshes with the second driven bevel gear.

[0018] As a further aspect of the present invention: the dust collection mechanism further includes an auxiliary collection mechanism for assisting dust collection. The auxiliary collection mechanism includes a conical cylinder disposed on the through hole and a cross groove opened on the conical cylinder. The conical cylinder is a flexible rubber structure. The conical cylinder is disposed inside the cleaning cylinder, and the inner wall of the conical cylinder is a hollow conical structure that gradually tapers from the through hole to the inside of the cleaning cylinder.

[0019] A grinding process for an RF circuit board includes the following steps:

[0020] Step 1: Circuit board positioning. Fix the RF circuit board on the positioning mechanism. Fix the RF circuit board with the positioning fixture on the positioning mechanism. Adjust the fixing angle of the RF circuit board by the turntable. Then, drive the RF circuit board on the turntable to the clamping mechanism position by the xyz axis linear module so that the position to be ground on the RF circuit board is aligned with the clamping mechanism.

[0021] Step 2: Circuit board clamping. The clamping mechanism clamps the part of the RF circuit board to be ground, and at this time the grinding mechanism is close to the part of the RF circuit board to be ground.

[0022] Step 3: Grinding and cleaning. The grinding mechanism drives the grinding wheel to rotate and grind the RF circuit board. While the grinding wheel is rotating, the second cylinder drives the grinding wheel to move back and forth, and the third cylinder drives the grinding wheel to move left and right, so as to grind the excess parts of the RF circuit board. At the same time, the cleaning cylinder is driven to clean the tiny air bubbles in the multi-layer RF circuit board and the grinding wheel.

[0023] Step 4: Dust collection. After the dust adhering to the tiny air bubbles on the multi-layer RF circuit board and the grinding wheel is cleaned out by the cleaning tube, the dust suction mechanism creates negative pressure inside the cleaning tube, which adsorbs the dust particles into the cleaning tube for collection.

[0024] The beneficial effects of this invention are:

[0025] 1. By setting up a clamping mechanism, the toothed belt achieves clamping. There is no relative sliding between the toothed belt and the RF circuit board, which will not cause wear to the clamping part of the RF circuit board. At the same time, as more of the toothed belt is exposed to be ground, the overall clamping area of ​​the toothed belt on the RF circuit board remains unchanged, which does not affect the clamping effect. Moreover, as the grinding mechanism feeds, the exposed part of the toothed belt remains constant, so that the clamping force and the distance from the edge of the RF circuit board to be ground remain constant. As a result, when powder particles enter the micro-bubble pores between the laminated boards, the laminated boards are stably clamped by a constant clamping force. The compression of the micro-bubble pores by the dust particles will not cause the pores to enlarge, reducing the problem of separation of the adhesive layer of the multilayer RF circuit board caused by grinding vibration and excessive compression of the micro-bubble pores by dust particles.

[0026] 2. By setting a toothed strip and a first belt, when the toothed belt clamps the RF circuit board, the first belt makes direct contact with the RF circuit board, reducing excessive pressure on the RF circuit board and preventing indentations; the toothed strip's rigid structure compresses the parts of the first belt that contact the RF circuit board, ensuring the clamping force of each part of the first belt on the RF circuit board; by setting a clamping plate, clamping rod, and sliding groove, the clamping rod abuts and compresses the toothed strip, thereby providing further clamping force to the first belt, making the force on the contact area between the first belt and the RF circuit board uniform and the clamping effect good; and through the cooperation of the sliding groove, the transmission of the first belt is not affected, nor is the adjustment of the clamping position of the first belt on the RF circuit board affected.

[0027] 3. By setting up a cleaning cylinder and cleaning brush, micro-bubbles are cleaned during the grinding process, reducing the accumulation of dust particles inside the micro-bubbles; by setting up a reverse rotation mechanism, the cleaning brush sweeps dust particles in the opposite direction, preventing dust particles from flying towards the contact point between the RF circuit board grinding surface and the grinding wheel, reducing the impact on the grinding work and improving the grinding effect.

[0028] 4. A dust collection mechanism is installed to collect the cleaned dust particles. It should be noted that this is done to reduce the adhesion of dust particles removed by the cleaning brush to the grinding surface of the RF circuit board and the grinding wheel, and to reduce contamination. The rotation of the cleaning cylinder causes the fan to rotate synchronously with the cleaning cylinder. The rotation of the fan increases the airflow inside the cleaning cylinder, creating negative pressure, which draws external dust particles into the cleaning cylinder through the through-holes and collects them through the collection box, thus achieving the purpose of automatic dust particle collection. Attached Figure Description

[0029] The invention will now be further described with reference to the accompanying drawings.

[0030] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0031] Figure 2 This is a three-dimensional structural diagram of the grinding mechanism, synchronization mechanism, and cleaning mechanism of the present invention;

[0032] Figure 3 This is a three-dimensional structural diagram of the clamping mechanism and the moving mechanism of the present invention;

[0033] Figure 4 This is a side-view cross-sectional three-dimensional structural diagram of the clamping mechanism of the present invention;

[0034] Figure 5 This is a partially cross-sectional, three-dimensional enlarged structural diagram of the clamping mechanism of the present invention;

[0035] Figure 6 This is a three-dimensional enlarged structural diagram of the clamping plate of the present invention;

[0036] Figure 7 This is a three-dimensional enlarged structural schematic diagram of the cleaning mechanism of the present invention;

[0037] Figure 8 This is a partially cross-sectional, three-dimensional enlarged structural diagram of the cleaning mechanism of the present invention;

[0038] Figure 9 This is a three-dimensional enlarged structural schematic diagram of the cleaning cylinder of the present invention;

[0039] Figure 10 This is a schematic diagram of the process flow of the present invention.

[0040] In the diagram: 1. Positioning mechanism; 2. Grinding mechanism; 21. First mounting bracket; 22. Motor; 23. Grinding wheel; 3. Clamping mechanism; 31. Second mounting bracket; 32. First cylinder; 33. Third mounting bracket; 34. Toothed wheel; 35. Toothed belt; 351. Toothed rack; 352. First belt; 36. Clamping plate; 37. Clamping rod; 38. Dome; 39. Slide groove; 4. Moving mechanism; 41. Second cylinder; 42. Synchronization mechanism; 421. Spur gear; 422. Rack; 4 23. Baffle; 5. Cleaning mechanism; 51. Cleaning cylinder; 52. Cleaning brush; 53. Linkage mechanism; 531. Rotary wheel; 532. Second belt; 6. Vacuuming mechanism; 61. Connecting shaft; 62. Gearbox; 63. Reverse rotation mechanism; 631. Driving bevel gear; 632. First driven bevel gear; 633. Second driven bevel gear; 634. Disc; 64. Fan; 65. Collection box; 66. Through hole; 67. Auxiliary collection mechanism; 671. Conical cylinder; 672. Cross groove. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example 1

[0043] like Figure 1-9As shown, this embodiment provides a grinding device for an RF circuit board, including a positioning mechanism 1, a grinding mechanism 2, and an xyz axis linear module. The positioning mechanism 1 is used to fix and position the RF circuit board, and the grinding mechanism 2 is used to grind the RF circuit board. It also includes a clamping mechanism 3 for clamping the RF circuit board. The clamping mechanism 3 includes toothed wheels 34 and toothed belts 35. The toothed belts 35 are sleeved on multiple toothed wheels 34. The multiple toothed wheels 34 are used to drive the toothed belts 35. The bottom of the toothed belts 35 is parallel to the RF circuit board, and two toothed belts 35 are used to clamp the RF circuit board.

[0044] It should be noted that the positioning mechanism 1 fixes and controls the angle of the RF circuit board, and the linear module of the xyz axis moves the positioned RF circuit board to the toothed belt 35, so that the RF circuit board is between the two toothed belts 35. In order to improve the clamping effect of the RF circuit board during grinding, the toothed belt 35 clamps the RF circuit board. At the same time, as the grinding mechanism 2 advances and feeds for grinding, the toothed wheel 34 drives the toothed belt 35 to drive synchronously. This allows the toothed belt 35 to maintain stable clamping of the RF circuit board while exposing more of the RF circuit board, making it easier for the grinding mechanism 2 to grind. During the transmission of the toothed belt 35 on the RF circuit board, there is no relative slippage between the toothed belt 35 and the RF circuit board. The movement of the toothed belt 35 will not cause wear to the clamping parts of the RF circuit board. At the same time, as more of the toothed belt 35 is exposed, the overall clamping area of ​​the toothed belt 35 on the RF circuit board remains unchanged, without affecting the clamping effect. Furthermore, as the grinding mechanism 2 feeds and grinds, the exposed part of the toothed belt 35 remains constant, ensuring that the clamping force and the distance to the edge of the RF circuit board to be ground remain constant. Consequently, when powder particles enter the micro-bubble pores between the laminated boards, the stable compression of the laminated boards by the clamping force prevents the dust particles from enlarging the pores, reducing the problem of separation of the adhesive layer of the multilayer RF circuit board caused by grinding vibration and excessive compression of the micro-bubble pores by dust particles.

[0045] like Figure 4-5 As shown, the toothed belt 35 includes toothed strips 351 and a first belt 352. Multiple toothed strips 351 are disposed on the inner wall of the first belt 352. When the toothed strips 351 move to the position of the toothed wheel 34, the toothed strips 351 mesh with the toothed wheel 34. The toothed strips 351 are rigid structures, and the first belt 352 is a flexible structure.

[0046] It should be noted that when the toothed belt 35 clamps the RF circuit board, the flexible design of the first belt 352 facilitates the transmission of the toothed belt 35 around the toothed wheel 34 while the first belt 352 directly contacts the RF circuit board, reducing excessive compression on the RF circuit board and preventing indentations. The rigid structure of the toothed bar 351 facilitates engagement with the toothed wheel 34, thereby driving the first belt 352 to transmit power stably. At the same time, the toothed bar 351 is a long strip structure with the same width as the first belt 352. At the clamping position of the RF circuit board, the toothed bar 351 compresses the parts of the first belt 352 that contact the RF circuit board, ensuring the clamping force of each part of the first belt 352 on the RF circuit board.

[0047] like Figure 3 As shown, it is understood that this application does not limit the specific structure and installation method of the second mounting bracket 31, the first cylinder 32 and the third mounting bracket 33, as long as the toothed belt 35 can be driven to clamp the radio frequency circuit board. The following only provides a specific structure for reference. The clamping mechanism 3 also includes the second mounting bracket 31, the first cylinder 32 and the third mounting bracket 33. The first cylinder 32 is mounted on the second mounting bracket 31 and the output end of the first cylinder 32 is connected to the third mounting bracket 33. Multiple toothed wheels 34 are rotatably connected to the third mounting bracket 33.

[0048] It should be noted that the first cylinder 32 drives the third mounting bracket 33 to move, thereby driving the toothed belt 35 to clamp the radio frequency circuit board. The output end of the first cylinder 32 and the third mounting bracket 33 are slidably connected. As long as the third mounting bracket 33 can be driven to move along the axis of the output shaft of the first cylinder 32, the third mounting bracket 33 can slide freely in the direction perpendicular to the axis of the output shaft of the first cylinder 32, so as to drive the toothed belt 35 to clamp the radio frequency circuit board, and the toothed belt 35 can drive the transmission on the radio frequency circuit board.

[0049] like Figure 5-6 As shown, the third mounting bracket 33 is provided with an auxiliary clamping structure. The auxiliary clamping mechanism is used to provide further support for the toothed belt 35. The auxiliary clamping mechanism includes a clamping plate 36, a clamping rod 37, and a sliding groove 39. The clamping plate 36 is provided on the third mounting bracket 33, and multiple clamping rods 37 are provided at the bottom end of the clamping plate 36. The sliding groove 39 is formed through the toothed strip 351. When the toothed strip 351 moves to the position of the clamping rod 37, the clamping rod 37 slides on the multiple sliding grooves 39. The end of the clamping rod 37 is provided with a dome 38. The dome 38 is used to assist the clamping rod 37 in sliding on the sliding groove 39. When there is a slight misalignment between the clamping rod 37 and the sliding groove 39, the dome 38 can provide a certain guide to facilitate the sliding groove 39 to return to the correct position.

[0050] It should be noted that when the toothed belt 35 clamps the RF circuit board, the clamping rod 37 on the clamping plate 36 abuts and squeezes the toothed strip 351, thereby providing further clamping force to the first belt 352, so that the contact area between the first belt 352 and the RF circuit board is evenly stressed and the clamping effect is good. When the toothed belt 35 moves, with the transmission of the first belt 352, the multiple grooves 39 on the toothed strip 351 approach the clamping rod 37, so that the clamping rod 37 slides on the multiple grooves 39 at the same time. While maintaining stable clamping, it does not affect the transmission of the first belt 352, nor does it affect the adjustment of the clamping position of the first belt 352 on the RF circuit board.

[0051] like Figure 1-3 As shown, it is understood that this application does not limit the specific structure and installation method of the moving mechanism 4. The following only provides a specific structure for reference. The second mounting frame 31 is provided with a moving mechanism 4 for pushing the grinding mechanism 2 to move. The moving mechanism 4 includes a second cylinder 41 mounted on the second mounting frame 31 and a third cylinder mounted on the output end of the second cylinder 41. The second cylinder 41 is used to push the grinding mechanism 2 to move back and forth. The output end of the third cylinder is connected to the first mounting frame 21. The third cylinder is used to drive the grinding mechanism 2 to move left and right.

[0052] It should be noted that the grinding mechanism 2 is driven to move left and right by the third cylinder to grind the length of the part of the RF circuit board to be ground, and the grinding mechanism 2 is driven to move forward by the second cylinder 41 to get closer to the part of the RF circuit board to be ground, so as to grind the width of the part of the RF circuit board to be ground.

[0053] like Figure 2-3 As shown, the moving mechanism 4 also includes a synchronization mechanism 42 for driving the clamping mechanism 3 to move synchronously with the grinding mechanism 2. When the grinding mechanism 2 moves back and forth to grind the RF circuit board, the clamping mechanism 3 moves back and forth synchronously with the grinding mechanism 2. When the grinding mechanism 2 moves left and right to grind, the clamping mechanism 3 remains stationary in the clamping state. The synchronization mechanism 42 includes a spur gear 421 disposed at the end of the toothed wheel 34. A rack 422 is slidably connected to the third mounting bracket 33, and the rack 422 meshes with the spur gear 421. A baffle 423 is disposed on the first mounting bracket 21. The baffle 423 is used to push the rack 422 to move. A spring is disposed between the rack 422 and the third mounting bracket 33. The spring is used to drive the rack 422 to reset.

[0054] It should be noted that when the first mounting bracket 21 is connected to the third mounting bracket 33, and the first mounting bracket 21 pushes the third mounting bracket 33 to move back and forth synchronously, the toothed belt 35 can maintain the clamping of the RF circuit board and synchronously adjust the clamping position. At this time, the synchronous adjustment of the clamping position by the toothed belt 35 is achieved by the friction between the toothed belt 35 and the RF circuit board, which is a passive transmission. However, when the friction between the toothed belt 35 and the RF circuit board is insufficient, friction will occur between the toothed belt 35 and the RF circuit board, causing scratches on the RF circuit. Therefore, a synchronization mechanism 42 is set up. Synchronous movement; during use, as the grinding mechanism 2 moves back and forth to grind, it drives the baffle 423 to push the rack 422 to move. The rack 422 drives the spur gear 421 to rotate, which in turn drives the toothed wheel 34 to rotate. Through the cooperation of the toothed rack 351, it drives the first belt 352 to drive, so that the first belt 352 can drive on the RF circuit while maintaining a constant clamping force. When adjusting the clamping position, the synchronization mechanism 42 drives the toothed belt 35 to perform active transmission, so that when adjusting the clamping position, the first belt 352 will not slip between itself and the RF circuit board, reducing the generation of scratches.

[0055] like Figure 1-2 As shown, it is understood that this application does not limit the specific structure and installation method of the positioning mechanism 1, the grinding mechanism 2, and the xyz axis linear module. The following only provides a specific structure for reference. The positioning mechanism 1 includes a turntable and a clamp set on the turntable. The turntable rotates the RF circuit board at a fixed angle, and the clamp is used to hold the RF circuit board. The turntable is set at the output end of the xyz axis linear module. The xyz axis linear module is used to drive the RF circuit board to move linearly along the x-axis, y-axis, and z-axis, and is used to adjust the position of the RF circuit board to align with the clamping mechanism 3. The grinding mechanism 2 includes a first mounting frame 21, a motor 22, and a grinding wheel 23. The motor 22 and the grinding wheel 23 are both set on the first mounting frame 21. The motor 22 is used to drive the grinding wheel 23 to rotate.

[0056] It should be noted that the xyz axis linear module is existing technology and is not shown in the figure. The xyz axis linear module can also be installed on the second mounting bracket 31, as long as the part to be ground on the RF circuit board can be aligned with the first belt 352 on the clamping mechanism 3. Alignment means that the part to be ground on the RF circuit board is moved to the middle position between the two first belts 352. In use, the RF circuit board is clamped and fixed by the clamp, and then the angle of the RF circuit board is adjusted by the turntable so that the RF circuit board is aligned with the toothed belt 35. Then the position of the RF circuit board is adjusted by the xyz axis linear module so that the RF circuit board is aligned with the first belt 352.

[0057] Example 2

[0058] like Figure 2 and Figure 7 As shown, the difference from Embodiment 1 is that it also includes a cleaning mechanism 5 for cleaning dust particles adhering to the micro-bubbles on the grinding surface of the RF circuit board and on the grinding wheel 23. The cleaning mechanism 5 includes a cleaning cylinder 51 rotatably connected to the first mounting bracket 21 and a cleaning brush 52 disposed on the cleaning cylinder 51. The cleaning brush 52 is used to clean the grinding position of the RF circuit board and the grinding wheel 23.

[0059] It should be noted that during the grinding process, dust particles accumulate inside the microbubbles. As grinding continues, the accumulation of dust particles inside the microbubbles increases, which increases the pressure on the RF circuit board. At this time, during the grinding process, the rotation of the cleaning cylinder 51 drives the cleaning brush 52 to clean the microbubbles, reducing the accumulation of dust particles inside the microbubbles. At the same time, as the cleaning cylinder 51 rotates, the cleaning brush 52 cleans the grinding wheel 23, reducing the adhesion of dust on the grinding wheel 23 and ensuring the stability of the grinding effect of the grinding wheel 23. It is worth mentioning that the cleaning brush 52 is composed of multiple fine bristles, the diameter of which is much smaller than the gaps formed by the microbubbles, so that the bristles will not get stuck in the gaps, thus improving the cleaning effect of dust particles inside the microbubbles.

[0060] like Figure 7 As shown, it is understood that this application does not limit the specific structure and installation method of the linkage mechanism 53. The following only provides a specific structure for reference. The cleaning mechanism 5 also includes a linkage mechanism 53 for driving the cleaning cylinder 51 to rotate. The linkage mechanism 53 includes a rotating wheel 531 and a second belt 532. The two rotating wheels 531 are respectively disposed on the grinding wheel 23 (e.g., Figure 2 As shown in the diagram, the second belt 532 is tensioned on the two pulleys 531 on the cleaning cylinder 51.

[0061] It should be noted that the rotation of the grinding wheel 23 drives the rotating wheel 531 on the grinding wheel 23 to rotate. With the cooperation of the second belt 532 and another rotating wheel 531, the cleaning cylinder 51 is driven to rotate, thus realizing the rotation cleaning of the grinding position of the radio frequency circuit board and the grinding wheel 23.

[0062] Example 3

[0063] like Figure 7-8As shown, the difference from Embodiment 2 is that the cleaning cylinder 51 is provided with a dust suction mechanism 6 for cleaning dust particles accumulated in the microbubbles on the radio frequency circuit board. The dust suction mechanism 6 includes a fan 64, a collection box 65, and through holes 66. The fan 64 is located inside the cleaning cylinder 51 and rotates as the cleaning cylinder 51 rotates. Multiple through holes 66 are formed on the cleaning cylinder 51 to connect the inside and outside of the cleaning cylinder 51. The collection box 65 is located at the bottom of the cleaning cylinder 51 and has an opening. A filter screen is provided on the opening to filter dust and allow air to pass through.

[0064] It should be noted that, in order to reduce the continued adhesion of dust particles cleaned by the cleaning brush 52 to the grinding surface of the RF circuit board and the grinding wheel 23, and to reduce pollution, a dust collection mechanism 6 is set up to collect the cleaned dust particles. The rotation of the cleaning cylinder 51 causes the fan 64 to rotate synchronously with the cleaning cylinder 51. The rotation of the fan 64 increases the airflow inside the cleaning cylinder 51, generating negative pressure, which in turn draws external dust particles into the cleaning cylinder 51 through the through hole 66 and collects them through the collection box 65, thus achieving the purpose of automatic dust particle collection.

[0065] Example 4

[0066] like Figure 8 As shown, the difference from Embodiment 3 is that the vacuuming mechanism 6 also includes a reverse rotation mechanism 63 for driving the cleaning cylinder 51 to rotate in the opposite direction to the fan 64. A gearbox 62 is provided between the first mounting bracket 21 and the cleaning cylinder 51. The reverse rotation mechanism 63 is located inside the gearbox 62. The input end of the reverse rotation mechanism 63 is connected to the connecting shaft 61, and the output end of the reverse rotation mechanism 63 is connected to the cleaning cylinder 51. The reverse rotation mechanism 63 is used to drive the cleaning cylinder 51 to rotate in the opposite direction to the rotation of the grinding wheel 23.

[0067] It should be noted that by setting the reverse rotation mechanism 63, the cleaning cylinder 51 rotates in the opposite direction to the grinding wheel 23, so that the cleaning cylinder 51 only cleans the dust inside the microbubbles, improving the cleaning effect of dust particles inside the microbubbles. Through the rotation of the rotating wheel 531 on the grinding wheel 23, and the cooperation of another rotating wheel 531 and the second belt 532, the connecting shaft 61 is driven to rotate. Through the transmission of the reverse rotation mechanism 63, the cleaning cylinder 51 is driven to rotate in the opposite direction, so that the grinding wheel 23 and the fan 64 rotate in the same direction, but the cleaning cylinder 51 rotates in the opposite direction. By rotating in the opposite direction, the cleaning brush 52 sweeps the dust particles in the opposite direction, preventing the dust particles from flying towards the contact position between the RF circuit board grinding surface and the grinding wheel 23, reducing the impact on the grinding work and improving the grinding effect.

[0068] like Figure 8As shown, it is understood that this application does not limit the specific structure and installation method of the reverse rotation mechanism 63. The following only provides a specific structure for reference. The reverse rotation mechanism 63 includes a driving bevel gear 631, a first driven bevel gear 632, a second driven bevel gear 633, and a disc 634. One of the rotating wheels 531 is disposed on the connecting shaft 61 and is used to drive the connecting shaft 61 to rotate. The driving bevel gear 631 is disposed at one end of the connecting shaft 61, and the fan 64 is disposed at the other end of the driving bevel gear 631 and is rotatably connected to the inside of the cleaning cylinder 51. The first driven bevel gear 632 is rotatably connected to the gearbox 62. The driving bevel gear 631 meshes with the first driven bevel gear 632. The disc 634 is disposed on the cleaning cylinder 51, and the second driven bevel gear 633 is disposed on the disc 634. The first driven bevel gear 632 meshes with the second driven bevel gear 633.

[0069] It should be noted that the rotation of the grinding wheel 23 on the grinding wheel 23, in conjunction with another grinding wheel 531 and the second belt 532, drives the connecting shaft 61 to rotate. The connecting shaft 61 drives the driving bevel gear 631 to rotate. In conjunction with the first driven bevel gear 632, it drives the second driven bevel gear 633 to rotate in the opposite direction. The second driven bevel gear 633 drives the cleaning cylinder 51 on the disc 634 to rotate, so that the rotation direction of the cleaning cylinder 51 is opposite to the rotation direction of the grinding wheel 23.

[0070] like Figure 8-9 As shown, the dust collection mechanism 6 also includes an auxiliary collection mechanism 67 for assisting dust collection. The auxiliary collection mechanism 67 includes a conical cylinder 671 disposed on the through hole 66 and a cross groove 672 opened on the conical cylinder 671. The conical cylinder 671 is a flexible rubber structure. The conical cylinder 671 is disposed inside the cleaning cylinder 51, and the inner wall of the conical cylinder 671 is a hollow conical structure that gradually tapers from the through hole 66 to the inside of the cleaning cylinder 51.

[0071] It should be noted that as the fan 64 rotates, a negative pressure is generated inside the cleaning cylinder 51, which in turn generates suction to the outside, causing the conical cylinder 671 to be drawn in. This causes the cross groove 672 to expand its opening due to the airflow, allowing dust to enter. When the fan 64 stops rotating, the conical cylinder 671 is unaffected and automatically closes, making the inside and outside of the cleaning cylinder 51 relatively sealed, reducing dust scattering and improving dust collection efficiency. Furthermore, during the dust intake process, the hollow conical structure of the conical cylinder 671 forms a Venturi tube-like structure, increasing the dust flow rate at the through hole 66 and improving dust entry efficiency.

[0072] like Figure 1-10 As shown, a grinding method for an RF circuit board, using the aforementioned grinding apparatus, includes the following steps:

[0073] Step 1: Circuit board positioning. Fix the RF circuit board on the positioning mechanism 1. Fix the RF circuit board with the positioning fixture on the positioning mechanism 1. Adjust the fixing angle of the RF circuit board by the turntable. Then, drive the RF circuit board on the turntable to move to the position of the clamping mechanism 3 by the xyz axis linear module so that the position to be ground on the RF circuit board is aligned with the clamping mechanism 3.

[0074] Step 2: Circuit board clamping. The clamping mechanism 3 clamps the RF circuit board at the position to be ground. At this time, the grinding mechanism 2 is just close to the position of the RF circuit board to be ground.

[0075] Step 3: Grinding and cleaning. The grinding mechanism 2 drives the grinding wheel 23 to rotate and grind the RF circuit board. While the grinding wheel 23 is rotating and grinding, the second cylinder 41 drives the grinding wheel 23 to move back and forth, and the third cylinder drives the grinding wheel 23 to move left and right, so as to grind the excess parts of the RF circuit board. At the same time, the cleaning cylinder 51 is driven to clean the tiny air bubbles on the multilayer RF circuit board and the grinding wheel 23.

[0076] Step 4: Dust collection. After the dust adhering to the tiny air bubbles on the multi-layer RF circuit board and the grinding wheel 23 is cleaned out by the cleaning cylinder 51, the dust suction mechanism 6 creates a negative pressure inside the cleaning cylinder 51, which adsorbs the dust particles into the cleaning cylinder 51 for collection.

[0077] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation or specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0078] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0079] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A grinding device for an RF circuit board, comprising a positioning mechanism (1), a grinding mechanism (2), and an xyz-axis linear module, wherein the positioning mechanism (1) is used to fix and position the RF circuit board, the grinding mechanism (2) is used to grind the RF circuit board, and the xyz-axis linear module is used to drive the positioning mechanism (1) to move; characterized in that, It also includes a clamping mechanism (3) for clamping the radio frequency circuit board. The clamping mechanism (3) includes toothed wheels (34) and toothed belts (35). The toothed belts (35) are sleeved on multiple toothed wheels (34). The multiple toothed wheels (34) are used to drive the toothed belts (35) to drive. The bottom of the toothed belts (35) is parallel to the radio frequency circuit board. Two toothed belts (35) are used to clamp the radio frequency circuit board. The toothed belt (35) includes toothed strips (351) and a first belt (352), with a plurality of toothed strips (351) disposed on the inner wall of the first belt (352); when the toothed strips (351) move to the position of the toothed wheel (34), the toothed strips (351) mesh with the toothed wheel (34), the toothed strips (351) are rigid structures, and the first belt (352) is a flexible structure; The clamping mechanism (3) further includes a second mounting bracket (31), a first cylinder (32), and a third mounting bracket (33). The first cylinder (32) is mounted on the second mounting bracket (31), and the output end of the first cylinder (32) is connected to the third mounting bracket (33). A plurality of toothed wheels (34) are rotatably connected to the third mounting bracket (33). An auxiliary clamping mechanism is provided on the third mounting bracket (33), which is used to provide support for the toothed belt (35). The auxiliary clamping mechanism includes a clamping plate (36), clamping rods (37), and a sliding groove (39). The clamping plate (36) is mounted on a third mounting bracket (33). Multiple clamping rods (37) are mounted on the bottom end of the clamping plate (36). The sliding groove (39) is formed through a toothed strip (351). When the toothed strip (351) moves to the position of the clamping rod (37), the clamping rod (37) slides on the multiple sliding grooves (39). The end of the clamping rod (37) is provided with a dome (38), which is used to assist the clamping rod (37) in sliding on the sliding groove (39). The second mounting bracket (31) is provided with a moving mechanism (4) for pushing the grinding wheel (23) to move. The moving mechanism (4) includes a second cylinder (41) mounted on the second mounting bracket (31) and a third cylinder mounted on the output end of the second cylinder (41). The second cylinder (41) is used to push the grinding wheel (23) to move back and forth. The output end of the third cylinder is connected to the first mounting bracket (21). The third cylinder is used to drive the grinding wheel (23) to move left and right. The moving mechanism (4) further includes a synchronization mechanism (42) for driving the clamping mechanism (3) to move synchronously with the grinding wheel (23). When the grinding wheel (23) moves back and forth to grind the radio frequency circuit board, the clamping mechanism (3) moves synchronously with the grinding wheel (23). When the grinding wheel (23) moves left and right to grind, the clamping mechanism (3) remains in a clamping state. The synchronization mechanism (42) includes a spur gear (421) disposed at the end of the toothed wheel (34). A rack (422) is slidably connected on the third mounting bracket (33), and the rack (422) meshes with the spur gear (421). A baffle (423) is disposed on the first mounting bracket (21). The baffle (423) is used to push the rack (422) to move. A spring is disposed between the rack (422) and the third mounting bracket (33). The spring is used to drive the rack (422) to reset. It also includes a cleaning mechanism (5) for cleaning dust particles adhering to the grinding surface of the radio frequency circuit board and the grinding wheel (23). The cleaning mechanism (5) includes a cleaning cylinder (51) rotatably connected to the first mounting bracket (21) and a cleaning brush (52) disposed on the cleaning cylinder (51). The cleaning brush (52) is used to clean the grinding position of the radio frequency circuit board and the grinding wheel (23). The cleaning mechanism (5) also includes a linkage mechanism (53) for driving the cleaning cylinder (51) to rotate. The linkage mechanism (53) includes a rotating wheel (531) and a second belt (532). The two rotating wheels (531) are respectively disposed on the grinding wheel (23) and the cleaning cylinder (51), and the second belt (532) is tensioned on the two rotating wheels (531). The cleaning cylinder (51) is provided with a dust suction mechanism (6) for cleaning dust particles accumulated in tiny bubbles on the radio frequency circuit board. The dust suction mechanism (6) includes a fan (64), a collection box (65), and through holes (66). The fan (64) is located inside the cleaning cylinder (51) and rotates with the rotation of the cleaning cylinder (51). Multiple through holes (66) are opened on the cleaning cylinder (51) to connect the inside and outside of the cleaning cylinder (51). The collection box (65) is located at the bottom of the cleaning cylinder (51) and has an opening. A filter screen is provided on the opening to filter dust and allow air to pass through.

2. The grinding apparatus for an RF circuit board according to claim 1, characterized in that, The vacuuming mechanism (6) further includes a reverse rotation mechanism (63) for driving the cleaning cylinder (51) and the fan (64) to rotate in opposite directions. A gearbox (62) is provided between the first mounting bracket (21) and the cleaning cylinder (51). The reverse rotation mechanism (63) is located inside the gearbox (62). The reverse rotation mechanism (63) includes a driving bevel gear (631), a first driven bevel gear (632), a second driven bevel gear (633), and a disc (634). One of the rotating wheels (531) is located on the connecting shaft (61). The rotating wheel (531) is used to drive the connecting shaft (61) to rotate. The driving bevel gear (631) is disposed at one end of the connecting shaft (61), the fan (64) is disposed at the other end of the connecting shaft (61), and the fan (64) is rotatably connected to the inside of the cleaning cylinder (51). The first driven bevel gear (632) is rotatably connected to the inside of the gearbox (62). The driving bevel gear (631) meshes with the first driven bevel gear (632). The disc (634) is disposed on the cleaning cylinder (51), and the second driven bevel gear (633) is disposed on the disc (634). The first driven bevel gear (632) meshes with the second driven bevel gear (633).

3. The grinding apparatus for an RF circuit board according to claim 2, characterized in that, The dust collection mechanism (6) also includes an auxiliary collection mechanism (67) for assisting dust collection. The auxiliary collection mechanism (67) includes a conical cylinder (671) disposed on the through hole (66) and a cross groove (672) opened on the conical cylinder (671). The conical cylinder (671) is a flexible rubber structure.

4. The grinding apparatus for an RF circuit board according to claim 1, characterized in that, The positioning mechanism (1) includes a turntable and a clamp set on the turntable. The turntable rotates the RF circuit board by a fixed angle, and the clamp is used to hold the RF circuit board. The turntable is set at the output end of the xyz axis linear module. The xyz axis linear module is used to drive the RF circuit board to move linearly along the x-axis, y-axis and z-axis, and is used to adjust the position of the RF circuit board to align with the clamping mechanism (3). The grinding mechanism (2) includes a first mounting frame (21), a motor (22) and a grinding wheel (23). The motor (22) and the grinding wheel (23) are both set on the first mounting frame (21). The motor (22) is used to drive the grinding wheel (23) to rotate.

5. A grinding method for an RF circuit board, characterized in that, Processing using the grinding apparatus according to any one of claims 1-4 includes the following steps: Step 1: Circuit board positioning. Fix the RF circuit board on the positioning mechanism (1). Fix the RF circuit board with the positioning fixture on the positioning mechanism (1). Adjust the fixing angle of the RF circuit board by the turntable. Then drive the RF circuit board on the turntable to the position of the clamping mechanism (3) by the xyz axis linear module so that the position to be ground on the RF circuit board is aligned with the clamping mechanism (3). Step 2: Circuit board clamping. The RF circuit board to be ground is clamped by the clamping mechanism (3). At this time, the grinding mechanism (2) is close to the RF circuit board to be ground. Step 3: Grinding and cleaning. The grinding mechanism (2) drives the grinding wheel (23) to rotate and grind the radio frequency circuit board. While the grinding wheel (23) is rotating and grinding, the second cylinder (41) drives the grinding wheel (23) to move back and forth, and the third cylinder drives the grinding wheel (23) to move left and right, so as to grind the excess parts of the radio frequency circuit board. At the same time, the cleaning cylinder (51) is driven to clean the tiny air bubbles on the multilayer radio frequency circuit board and the grinding wheel (23). Step 4: Dust collection. After the dust adhering to the tiny air bubbles on the multi-layer RF circuit board and the grinding wheel (23) is cleaned out by the cleaning tube (51), the dust is drawn into the cleaning tube (51) by the dust suction mechanism (6) to create negative pressure inside the cleaning tube (51) and collect the dust particles.

Images