一种超薄树脂金刚石软刀的制备方法
By developing a process for preparing ultrathin resin-bonded diamond dicing tools, the problems of slow cutting speed, rapid wear, and low precision of diamond dicing tools in the processing of semiconductor wafers and ceramics have been solved, enabling high-precision, low-stress mass production.
CN118905966BActive Publication Date: 2026-07-17江苏富乐华功率半导体研究院有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 江苏富乐华功率半导体研究院有限公司
- Filing Date
- 2024-09-24
- Publication Date
- 2026-07-17
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Figure CN118905966B_ABST
Abstract
本发明公开了一种超薄树脂金刚石软刀的制备方法，涉及半导体晶圆、陶瓷划切用切割刀技术领域，本发明将混合树脂‑陶瓷浆料均匀涂覆在钢丝网框，进行自动坯体印刷，烘干热压，得到软刀；其中浆料由金刚石微粉、树脂微粉、无氧铜粉、碳化硅粉、石墨烯粉以及有机载体混合均质得到；最终成型的样品刀置于精密划片机中进行实际切割陶瓷操作，测得其性能稳定、加工崩边量小，加工精度更高。
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