Ultrasonic assisted separation method and apparatus for laser cutting

Abstract

The application provides an ultrasonic-assisted separation method and device for laser cutting. The method comprises the following steps: obtaining an ultrathick glass plate subjected to laser cutting, the ultrathick glass plate is formed with a cutting crack under the laser cutting, the cutting crack divides the ultrathick glass plate into a cutting part and a remaining main body, and the cutting crack comprises a closed shape; contacting an ultrasonic working head to the cutting part and supporting the remaining main body in the opposite direction of the ultrasonic working head; and applying ultrasonic waves and a downward pressure to the cutting part by the ultrasonic working head, and separating the cutting part from the ultrathick glass plate. In the scheme, the ultrasonic waves and the downward pressure are applied to the cutting part, the ultrasonic waves make the cutting part vibrate at a high frequency and reduce the friction under the action of the downward pressure, the downward pressure is quickly separated at a smaller force, and the structure of the remaining main body is prevented from being damaged and / or a serious edge collapse problem is avoided.

Description

Technical Field

[0001] This invention relates to an ultrasonic-assisted separation method and apparatus for laser cutting, belonging to the field of laser cutting technology. Background Technology

[0002] This solution involves the auxiliary separation process in laser cutting. Existing methods for cutting ultra-thick rigid glass sheets (thickness greater than 4mm) include mechanical cutting, waterjet cutting, and laser cutting. The mainstream method is waterjet cutting, which uses the impact force generated by high-pressure water jets to break the glass at the cutting line. It is an advanced cutting method with advantages such as strong cutting capability, simple operation, and safety and reliability. However, waterjet cutting also has problems such as high equipment cost, high maintenance cost, and the generation of high-frequency noise and a large amount of wastewater mixed with glass powder during operation. In comparison, laser cutting has advantages such as higher cutting precision, faster cutting speed, and no environmental protection requirements, which has led to its rapid industrialization in recent years. In laser cutting of ultra-thick rigid plates and other plates, CO2 laser cutting is usually used. As a common type of laser, CO2 laser cutting has high power and good cutting effect, and is suitable for rapid cutting of rigid plates and other materials. The laser cutting process in this solution also adopts CO2 laser cutting. First, according to the drawing requirements, a patterned cutting trajectory is cut on the ultra-thick rigid plate by laser cutting. Then, the CO2 laser is used to reheat the cutting trajectory to induce cracking, and then the patterned cutting part separates and falls off from the rigid plate, thus completing the laser cutting process of rigid plates.

[0003] The laser cutting process designed in this application specifically refers to cutting closed shapes such as circular holes in ultra-thick rigid glass sheets, also known as glass laser cutting drilling. Specifically, the circular holes are not small holes, but large holes and extra-large holes with a diameter greater than 100mm. Unlike linear open cutting of ultra-thick rigid glass sheets, the closed-shaped cut part formed by glass laser cutting drilling will remain on the rigid sheet and have a strong bonding force after the cutting trajectory is reheated and cracked by carbon dioxide laser. It requires further external force to fall off.

[0004] The cut portion remaining on the rigid sheet is typically removed using mechanical pushing and pulling methods. However, this process has several drawbacks. First, the high friction between the cut portion and the rigid sheet means that forcibly applying external force can easily cause the brittle sheet to shatter. Second, the high friction also leads to significant glass chipping at the edges of the cut portion, which requires strict control. The yield rate achieved through mechanical pushing and pulling is insufficient to meet industry standards. Third, mechanical pushing and pulling is inefficient. Given the high speed of laser cutting, slow mechanical pushing and pulling can cause rigid sheet accumulation on the production line, reducing overall production efficiency. Therefore, existing methods for removing the closed-loop cut portion after laser cutting of rigid sheets require improvement and solutions. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide an ultrasonic-assisted separation method and apparatus for laser cutting.

[0006] According to an embodiment of the present invention, a first embodiment is provided: an ultrasonic-assisted separation method for laser cutting, comprising the following steps:

[0007] A laser-cut ultra-thick glass sheet is obtained, wherein a cutting crack is formed in the ultra-thick glass sheet under laser cutting, the cutting crack dividing the ultra-thick glass sheet into a cut part and the remaining main body, and the cutting crack includes a closed shape.

[0008] The ultrasonic working head contacts the cutting part and supports the remaining body. The ultrasonic working head applies ultrasonic waves and downward pressure to the cutting part and detaches the cutting part from the ultra-thick glass plate.

[0009] Furthermore, the step of the ultrasonic worktable head applying ultrasonic waves and downward pressure to the cutting portion includes:

[0010] The ultrasonic working head simultaneously applies ultrasonic waves and downward pressure to the cutting part;

[0011] Alternatively, the ultrasonic working head first applies ultrasonic waves to the cutting part and breaks the modified connection between the cutting part and the remaining body, and then simultaneously applies ultrasonic waves and downward pressure to the cutting part.

[0012] Alternatively, the ultrasonic working head first applies a downward pressure force to the cutting part and breaks the modified connection between the cutting part and the remaining main body, and then simultaneously applies ultrasonic waves and the downward pressure force to the cutting part.

[0013] Furthermore, the step of forming cutting cracks in the ultra-thick glass sheet under laser cutting includes: pre-cutting the outer shape trajectory of the cutting part on the ultra-thick glass sheet by laser, then drilling holes in the outer shape trajectory of the cutting part by laser filamentation to form cutting cracks, wherein the cutting cracks coincide with the outer shape trajectory, and the cutting cracks formed on the ultra-thick glass sheet refer to the modified connection state in which cracks are formed between the cutting part and the remaining main body but the connection force is still maintained.

[0014] Furthermore, the closed shape of the cutting crack refers to the fact that the starting point of the cutting crack is inside the ultra-thick glass plate, the ending point of the cutting crack is inside the ultra-thick glass plate, and the starting point and the ending point coincide.

[0015] Furthermore, when the modified connection between the cut portion of the closed shape and the remaining body is broken, the remaining body and the cut portion maintain friction and cannot detach directly.

[0016] Furthermore, the ultrasonic working head simultaneously applies ultrasonic waves and downward pressure to the cutting part, and the cutting part gradually detaches from the remaining main body by vibrating downwards.

[0017] Furthermore, during the process of the cut portion separating from the remaining main body, the remaining main body does not undergo macroscopic deformation under the frictional force generated by the downward movement of the cut portion.

[0018] Furthermore, the closed shape includes circles, squares, ovals, rhombuses, and triangles.

[0019] Furthermore, the ultrasonic working head acts on the cutting part from top to bottom, or the ultrasonic working head acts on the lower surface of the cutting part from bottom to top.

[0020] According to an embodiment of the present invention, utilizing the ultrasonic-assisted separation method for laser cutting in the first embodiment of the present invention, a second embodiment is provided as follows:

[0021] An ultrasonic-assisted separation device for laser cutting, comprising:

[0022] The acquisition module is used to acquire an ultra-thick glass sheet that has been laser-cut. The ultra-thick glass sheet forms a cutting crack under laser cutting, and the cutting crack divides the ultra-thick glass sheet into a cut part and the remaining main body. The cutting crack has a closed shape.

[0023] The detachment module is used to bring the ultrasonic working head into contact with the cutting part and support the remaining body. The ultrasonic working head applies ultrasonic waves and downward pressure to the cutting part and detaches the cutting part from the ultra-thick glass plate.

[0024] A computer device includes a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the following steps:

[0025] A laser-cut ultra-thick glass sheet is obtained, wherein a cutting crack is formed in the ultra-thick glass sheet under laser cutting, the cutting crack dividing the ultra-thick glass sheet into a cut part and the remaining main body, and the cutting crack includes a closed shape.

[0026] The ultrasonic working head contacts the cutting part and supports the remaining body. The ultrasonic working head applies ultrasonic waves and downward pressure to the cutting part and detaches the cutting part from the ultra-thick glass plate.

[0027] A computer-readable storage medium storing a computer program, which, when executed by a processor, causes the processor to perform the following steps:

[0028] A laser-cut ultra-thick glass sheet is obtained, wherein a cutting crack is formed in the ultra-thick glass sheet under laser cutting, the cutting crack dividing the ultra-thick glass sheet into a cut part and the remaining main body, and the cutting crack includes a closed shape.

[0029] The ultrasonic working head contacts the cutting part and supports the remaining body. The ultrasonic working head applies ultrasonic waves and downward pressure to the cutting part and detaches the cutting part from the ultra-thick glass plate.

[0030] Compared with existing technologies, the unique advantages of the technical solution provided in this application are as follows: This method targets ultra-thick glass sheets that have undergone laser cutting processes to complete a closed-shaped cutting section. Due to the modified connection retained between the cutting section and the remaining body of the ultra-thick glass sheet, and the fact that even after the modified connection is broken, there is still a huge frictional force between the cutting section and the remaining body, it is very difficult to efficiently and quickly detach the cutting section from the remaining body while ensuring the structural integrity of the remaining body and controlling edge chipping. This solution applies an ultrasonic working head to the cutting section, applying ultrasonic waves and a downward pressure force to the cutting section. Under the action of ultrasonic waves and the downward pressure force, the cutting section first breaks the modified connection, and then continues to overcome the frictional force between the cutting section and the remaining body. The downward pressure force is an important force for the detachment of the cutting section, while the ultrasonic waves cause the cutting section to vibrate at high frequency under the action of the downward pressure force and reduce the frictional force, helping the downward pressure force to quickly complete the detachment with less force, avoiding excessive downward pressure force that could cause damage to the remaining body structure and / or serious edge chipping problems. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] in:

[0033] Figure 1 This is a flowchart of an ultrasonic-assisted separation method for laser cutting in one embodiment;

[0034] Figure 2 This is a schematic diagram of a scenario for an ultrasonic-assisted separation method for laser cutting in one embodiment;

[0035] Figure 3 This is a structural block diagram of an ultrasonic-assisted separation device for laser cutting in one embodiment;

[0036] Figure 4 This is a structural block diagram of a computer device in one embodiment.

[0037] Figure label:

[0038] 1-Cut section; 2-Remaining main body; 3-Ultrasonic working head; 100-Acquisition module; 200-Disengagement module. Detailed Implementation

[0039] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0040] Example 1

[0041] This embodiment addresses the laser cutting process for sheet materials, specifically ultra-thick glass sheet cutting and ceramic cutting. Taking a glass sheet with a thickness exceeding 4mm as an example, large holes, such as round and square holes, exceeding 100mm in size, need to be cut into the glass sheet. After the laser heats and cracks the cutting trajectory, although the cut part 1 and the remaining body 2 have formed obvious cracks, the closed-shaped cut part 1 will still remain on the rigid sheet and have a strong bonding force. In particular, for ultra-thick glass sheets, the thickness of the glass greatly increases the friction surface between the cut part 1 and the remaining body 2 and generates huge frictional force. Therefore, how to quickly control the cut part 1 to detach from the remaining body 2 while not applying excessive mechanical pressure to avoid the glass sheet from shattering is a technical problem that needs to be solved in current glass cutting.

[0042] To address the aforementioned problems, this embodiment discloses an ultrasonic-assisted separation method for laser cutting, such as... Figure 1 As shown, it includes the following steps:

[0043] S1: Obtain an ultra-thick glass sheet that has been laser-cut. The ultra-thick glass sheet forms a cutting crack under laser cutting. The cutting crack divides the ultra-thick glass sheet into a cut part 1 and a remaining main body 2. The cutting crack has a closed shape.

[0044] S2: The ultrasonic working head 3 is brought into contact with the cutting part 1, and the remaining body 2 is supported in the opposite direction of the ultrasonic working head 3. The ultrasonic working head 3 applies ultrasonic waves and downward pressure to the cutting part 1 and separates the cutting part 1 from the ultra-thick glass plate.

[0045] like Figure 2 As shown, the process of the ultrasonic working head 3 acting on the cutting part 1 and separating the cutting part 1 from the ultra-thick glass plate is demonstrated.

[0046] This solution applies the ultrasonic working head 3 to the cutting part 1, applying ultrasonic waves and downward pressure to the cutting part 1. Under the action of ultrasonic waves and downward pressure, the modified connection of the cutting part 1 is first destroyed, and then the friction between the cutting part 1 and the remaining body 2 is overcome. The downward pressure is an important force for the detachment of the cutting part 1. Under the action of downward pressure, the ultrasonic waves cause the cutting part 1 to vibrate at high frequency and reduce friction, helping the downward pressure to quickly complete the detachment with less force, avoiding excessive downward pressure that could cause structural damage to the remaining body 2 and / or serious edge chipping.

[0047] Example 2

[0048] This embodiment specifically discloses a preferred method for ultrasonic-assisted separation in laser cutting, comprising the following steps:

[0049] S21: The outer shape of the cutting part 1 is laser-cut into the ultra-thick glass plate. Then, the outer shape of the cutting part 1 is laser-wired and drilled to form a cutting crack. The cutting crack coincides with the outer shape. The cutting crack formed on the ultra-thick glass plate refers to the modified connection state in which the cutting part 1 and the remaining main body 2 form a crack but still maintain the connection force. The cutting crack divides the ultra-thick glass plate into the cutting part 1 and the remaining main body 2. The cutting crack includes a closed shape.

[0050] The closed shape of the cutting crack refers to the fact that the starting point of the cutting crack is inside the ultra-thick glass plate, the ending point of the cutting crack is inside the ultra-thick glass plate, and the starting point and the ending point coincide.

[0051] When the modified connection between the cut portion 1 of the closed shape and the remaining body 2 is broken, the remaining body 2 and the cut portion 1 maintain friction and cannot be directly detached.

[0052] Specifically, ultra-thick glass sheets refer to glass sheets with a thickness greater than 4mm, as well as other similar ceramic sheets, jade sheets, etc., that can be cut by laser. During the process of the cut portion 1 separating from the remaining main body 2, the remaining main body 2 does not undergo macroscopic deformation under the frictional force generated by the downward movement of the cut portion 1. While objects deform under external force from a microscopic perspective, it is understandable that thicker glass sheets are less prone to macroscopic deformation. This solution targets glass sheets with a thickness exceeding 10mm; even if such thick glass sheets break under external force, they are unlikely to undergo bending deformation.

[0053] Specifically, forming a cutting pattern with cleavage marks on glass sheets using laser cutting is a common process in this field. However, separating the cut portion 1 with cleavage marks from the remaining main body 2 is a difficult technical challenge. This is because when the cut portion 1 has a closed shape, such as a circle, square, ellipse, rhombus, or triangle, the closed shape of the cleavage marks means that the starting point of the cleavage marks is inside the ultra-thick glass sheet, and the ending point of the cleavage marks is also inside the ultra-thick glass sheet, with the starting and ending points coinciding. The cut portion 1 and the remaining main body 2 are still tightly connected due to the thickness of the sheet, and it is difficult to separate them like an open shape. In terms of shape, for example, when the board is cut in half, the cut part 1 can be bent in one direction based on the support point to break off the cut part 1. Therefore, firstly, the cut part 1 will be tightly surrounded and defined by the remaining body 2, and a modified connection is maintained between the cut part 1 and the remaining body 2. When the cut part 1 is surrounded and defined by the thickness of the remaining body 2, it is difficult to bend the cut part 1 relative to the remaining body 2 at an angle (or bend the cut part 1, or bend the remaining body 2) to break off the cut part 1. Here, bending at an angle refers to the relative bending that forms an angle between the contact surfaces of the cut part 1 and the remaining body 2. Therefore, the modified connection between the cut portion 1 and the remaining body 2 is difficult to break. Secondly, even after the modified connection is broken, it is still difficult to create an angle bend between the cut portion 1 and the remaining body 2 (either the cut portion 1 or the remaining body 2 bends), resulting in a large frictional force between the cut portion 1 and the remaining body 2, preventing direct detachment. Thirdly, taking glass sheets as an example, although glass sheets have a certain rigidity, they are still prone to breakage under large mechanical forces, especially with cracks extending along the edge of the cut portion 1. Fourthly, when detaching the cut portion 1 with a large mechanical force, if the cut portion 1 or the remaining body 2 is tilted at a certain angle around the cut portion 1 during the detachment operation, either the upper or lower edge will be squeezed against each other, resulting in obvious edge chipping. Edge chipping control is a crucial control parameter for glass sheets, and excessive edge chipping is unacceptable. Due to these limitations, detachment between the cut portion 1 and the remaining sheet is extremely difficult.

[0054] S22: The ultrasonic working head 3 is brought into contact with the cutting part 1, and the remaining body 2 is supported in the opposite direction of the ultrasonic working head 3. The ultrasonic working head 3 applies ultrasonic waves and downward pressure to the cutting part 1 and separates the cutting part 1 from the ultra-thick glass plate.

[0055] When the ultrasonic working head 3 acts on the cutting part 1, at least three working modes exist:

[0056] 1. The ultrasonic working head 3 simultaneously applies ultrasonic waves and downward pressure to the cutting part 1.

[0057] Second, the ultrasonic working head 3 first applies ultrasonic waves to the cutting part 1 and breaks the modified connection between the cutting part 1 and the remaining main body 2, and then simultaneously applies ultrasonic waves and downward pressure to the cutting part 1.

[0058] Third, the ultrasonic working head 3 first applies a downward pressure force to the cutting part 1 and breaks the modified connection between the cutting part 1 and the remaining main body 2, and then simultaneously applies ultrasonic waves and a downward pressure force to the cutting part 1.

[0059] When the ultrasonic wave and the downward pressure force act on the cutting part 1 and detach the cutting part 1, the cutting part 1 gradually detaches from the remaining body 2 by vibrating downward.

[0060] The conventional working method of the ultrasonic head and the cutting part 1 includes: the ultrasonic head acts on the cutting part 1 from top to bottom, the remaining main body 2 is placed on the worktable and supported by the worktable, and correspondingly, a hollow structure can be set on the worktable so that the cutting part 1 falls into the hollow structure after it is detached.

[0061] In addition, the ultrasonic head can also act on the cutting part 1 from bottom to top, and the remaining body 2 is pushed upward by the ultrasonic head onto the worktable, or the worktable can adsorb the remaining body 2.

[0062] This method targets ultra-thick glass sheets that have undergone laser cutting of a closed-shaped cutting section 1. Due to the modified connection between the cutting section 1 and the remaining main body 2 of the ultra-thick glass sheet, and the fact that even after the modified connection is broken, there is still a huge frictional force between the cutting section 1 and the remaining main body 2, it is very difficult to efficiently and quickly detach the cutting section 1 from the remaining main body 2 while ensuring the structural integrity of the remaining main body 2 and controlling edge chipping. This solution applies an ultrasonic working head 3 to the cutting section 1, applying ultrasonic waves and a downward pressure force to the cutting section 1. Under the action of ultrasonic waves and the downward pressure force, the modified connection of the cutting section 1 is first broken, and then the frictional force between the cutting section 1 and the remaining main body 2 is overcome. The downward pressure force is an important force for the detachment of the cutting section 1, while the ultrasonic waves cause the cutting section 1 to vibrate at high frequency under the action of the downward pressure force and reduce the frictional force, helping the downward pressure force to quickly complete the detachment with less force, avoiding excessive downward pressure force that could cause structural damage to the remaining main body 2 and / or serious edge chipping problems.

[0063] Example 3

[0064] This embodiment further proposes a preferred method for ultrasonic-assisted separation in laser cutting, including the following steps:

[0065] S31: Shape trajectory cutting, the shape trajectory of the cutting part 1 is cut out by laser on the ultra-thick glass plate, and the shape trajectory is a closed shape;

[0066] S32: Obtain laser adjustment parameters based on the shape trajectory of the closed shape of the cut part 1. The laser adjustment parameters include angle adjustment parameters and intensity adjustment parameters. The angle adjustment parameters are determined based on the curvature of the trajectory point at the projection point of the laser pulse on the glass plate. The larger the curvature of the trajectory point, the more straight the shape trajectory of the projection point is, and the smaller the angle adjustment amount of the angle adjustment parameters. The intensity adjustment parameters include pulse frequency adjustment parameters and / or power adjustment parameters. The intensity adjustment parameters are determined based on the thickness of the glass plate through which the laser pulse passes after the angle adjustment parameters are adjusted. The greater the thickness of the glass plate through which the laser pulse passes, the greater the adjustment amount of the intensity adjustment parameters.

[0067] S33: Obtain laser cutting parameters according to laser adjustment parameters, and complete laser cutting of glass sheet according to laser cutting parameters. The glass sheet forms a cutting crack under laser cutting. The cutting crack divides the ultra-thick glass sheet into a cutting part 1 and the remaining main body 2. The cutting crack includes a closed shape. The cutting crack obtained according to the laser cutting parameters makes the cutting part 1 form a narrow end and a wide end.

[0068] S34: The ultrasonic working head 3 is placed at the narrow end of the cutting part 1, and the remaining body 2 is supported on the flared end side of the cutting part 1. The ultrasonic working head 3 applies ultrasonic waves and downward pressure to the cutting part 1 and separates the cutting part 1 from the ultra-thick glass plate.

[0069] While this auxiliary separation method makes laser cutting control relatively complex, this complex operation can be implemented through algorithms incorporated into the laser controller without increasing hardware costs. Furthermore, when ultrasonic waves and downward pressure act on the cutting part 1, the inclination direction of the cutting crack between the cutting part 1 and the remaining body 2 aligns with the working direction of the ultrasonic working head 3, reducing friction between them and further improving work efficiency. It is important to control the inclination angle of the sidewall of the remaining body 2 in the closed-shape after adjusting the angle adjustment parameters to avoid exceeding the design parameters.

[0070] Example 4

[0071] The technical problem solved by this embodiment is that after the laser heats and cracks the cutting trajectory, although obvious cracks have formed between the cutting part 1 and the remaining body 2, the closed-shaped cutting part 1 will still remain on the rigid plate and have a strong bonding force. In particular, for ultra-thick glass plates, the thickness of the glass will greatly increase the friction surface between the cutting part 1 and the remaining body 2 and generate huge friction force. Therefore, how to quickly control the cutting part 1 to detach from the remaining body 2 while not applying too much mechanical pressure to avoid the glass plate from breaking is a technical problem that needs to be solved in current glass cutting.

[0072] In particular, the closed-shaped cut section 1 is surrounded by the remaining body 2, making it difficult to form an angle between the cross sections. Therefore, it is difficult to form a separation method of relative bending and breaking. Furthermore, the gap between the remaining body 2 and the cut section 1 is very small, resulting in a large frictional force that makes it difficult to separate from the cut section 1.

[0073] Based on the above problems, this embodiment discloses a preferred ultrasonic-assisted separation method for laser cutting, including the following steps:

[0074] A laser-cut ultra-thick glass sheet is obtained, and a cutting crack is formed in the ultra-thick glass sheet under laser cutting. The cutting crack divides the ultra-thick glass sheet into a cut part 1 and a remaining main body 2. The cutting crack has a closed shape.

[0075] The ultrasonic working head 3 contacts the cutting part 1, and the remaining body 2 is supported in the opposite direction of the ultrasonic working head 3. Cold source treatment or a combination of cold and heat source treatment is performed in the opposite direction of the ultrasonic working head 3. The ultrasonic working head 3 applies ultrasonic waves and downward pressure to the cutting part 1, causing it to detach from the ultra-thick glass plate. The cold source treatment refers to cooling the cutting part 1 with a cold source, causing it to shrink. This shrinkage can be used to cut the modified connection and / or increase the gap between the cutting part 1 and the remaining body 2. The combined cold and heat source treatment refers to first heating the cutting part 1 with a heat source, then cooling it with a cold source, causing it to shrink. This combined treatment shrinks the cutting part 1 and cuts the modified connection and / or increases the gap between the cutting part 1 and the remaining body 2. Clearly, the gap created by the combined cold and heat source treatment is larger than the gap created by the cold source treatment.

[0076] Furthermore, by utilizing the larger gap created by cold source treatment or a combination of cold and hot source treatment, the ultrasonic working head 3 makes eccentric contact with the upper surface of the cutting part 1. The eccentric contact means that the structural center of the ultrasonic working head 3 is offset from the structural center of the cutting part 1. This allows the ultrasonic waves transmitted by the ultrasonic working head 3 to vibrate and move downwards in the cutting part 1. The eccentric downward pressure can make greater use of the gap between the cutting part 1 and the remaining body 2 and generate a larger vibration amplitude, thereby accelerating the shedding time of the cutting part 1. At the same time, the temperature of the cold source and the operation time are significantly reduced. This is an optimized implementation method that takes into account the advantages of cold source treatment and ultrasonic treatment.

[0077] Example 5

[0078] The technical problem solved by this embodiment is that after the laser heats and cracks the cutting trajectory, although obvious cracks have formed between the cutting part 1 and the remaining body 2, the closed-shaped cutting part 1 will still remain on the rigid plate and have a strong bonding force. In particular, for ultra-thick glass plates, the thickness of the glass will greatly increase the friction surface between the cutting part 1 and the remaining body 2 and generate huge friction force. Therefore, how to quickly control the cutting part 1 to detach from the remaining body 2 while not applying too much mechanical pressure to avoid the glass plate from breaking is a technical problem that needs to be solved in current glass cutting.

[0079] To address the aforementioned technical problems, this embodiment discloses an ultrasonic-assisted separation device for laser cutting, comprising:

[0080] The acquisition module 100 is used to acquire the ultra-thick glass sheet that has been laser-cut. The ultra-thick glass sheet forms a cutting crack under laser cutting. The cutting crack divides the ultra-thick glass sheet into a cut part 1 and a remaining main body 2. The cutting crack has a closed shape.

[0081] The detachment module 200 is used to bring the ultrasonic working head 3 into contact with the cutting part 1 and to support the remaining body 2 in the opposite direction of the ultrasonic working head 3. The ultrasonic working head 3 applies ultrasonic waves and downward pressure to the cutting part 1 and detaches the cutting part 1 from the ultra-thick glass plate.

[0082] This solution applies the ultrasonic working head 3 to the cutting part 1, applying ultrasonic waves and downward pressure to the cutting part 1. Under the action of ultrasonic waves and downward pressure, the modified connection of the cutting part 1 is first destroyed, and then the friction between the cutting part 1 and the remaining body 2 is overcome. The downward pressure is an important force for the detachment of the cutting part 1. Under the action of downward pressure, the ultrasonic waves cause the cutting part 1 to vibrate at high frequency and reduce friction, helping the downward pressure to quickly complete the detachment with less force, avoiding excessive downward pressure that could cause structural damage to the remaining body 2 and / or serious edge chipping.

[0083] Example 6

[0084] Figure 4 An internal structural diagram of a computer device in one embodiment is shown. This computer device can specifically be a terminal or a server. Figure 4As shown, the computer device includes a processor, memory, and network interface connected via a system bus. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system and may also store a computer program. When executed by the processor, this computer program enables the processor to implement an ultrasonic-assisted separation method for laser cutting. The internal memory may also store a computer program, which, when executed by the processor, enables the processor to implement the ultrasonic-assisted separation method for laser cutting. Those skilled in the art will understand that... Figure 4 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0085] In one embodiment, a computer device is provided, including a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the following steps:

[0086] A laser-cut ultra-thick glass sheet is obtained, and a cutting crack is formed in the ultra-thick glass sheet under laser cutting. The cutting crack divides the ultra-thick glass sheet into a cut part 1 and a remaining main body 2. The cutting crack has a closed shape.

[0087] The ultrasonic working head 3 contacts the cutting part 1 and supports the remaining body 2 in the opposite direction of the ultrasonic working head 3. The ultrasonic working head 3 applies ultrasonic waves and downward pressure to the cutting part 1 and detaches the cutting part 1 from the ultra-thick glass plate.

[0088] In one embodiment, a computer-readable storage medium is provided storing a computer program that, when executed by a processor, causes the processor to perform the following steps:

[0089] A laser-cut ultra-thick glass sheet is obtained, and a cutting crack is formed in the ultra-thick glass sheet under laser cutting. The cutting crack divides the ultra-thick glass sheet into a cut part 1 and a remaining main body 2. The cutting crack has a closed shape.

[0090] The ultrasonic working head 3 contacts the cutting part 1 and supports the remaining body 2 in the opposite direction of the ultrasonic working head 3. The ultrasonic working head 3 applies ultrasonic waves and downward pressure to the cutting part 1 and detaches the cutting part 1 from the ultra-thick glass plate.

[0091] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), and double data rate RAM.

[0092] SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), Rambus Direct RAM (RDRAM), Direct Memory Bus Dynamic RAM (DRDRAM), and Memory Bus Dynamic RAM (RDRAM), etc.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser-cutting ultrasonic-assisted separation method, characterized in that, The process includes the following steps: First, a closed-shaped outline is laser-cut into an ultra-thick glass sheet with a thickness greater than 4mm. Second, laser adjustment parameters are obtained based on the closed-shaped outline of the cut portion. These parameters include angle and intensity adjustment parameters. The angle adjustment parameter is determined based on the radian of the laser pulse's trajectory point on the outline. The intensity adjustment parameter includes pulse frequency and / or power adjustment parameters, determined based on the thickness of the glass sheet through which the laser pulse passes after adjustment using the angle adjustment parameter. Third, laser cutting parameters are obtained based on these parameters. Finally, the laser cutting process is performed on the cut portion according to these laser cutting parameters. A thick glass sheet is laser-cut, creating a cutting crack that divides the sheet into a cut portion and a remaining main body. The cutting crack has a closed shape. Based on the laser cutting parameters, the cutting crack creates a narrow end and a flared end in the cut portion. An ultrasonic working head is placed in contact with the narrow end of the cut portion, and the remaining main body is supported on the flared end side. The ultrasonic working head applies ultrasonic waves and downward pressure to the cut portion, detaching it from the thick glass sheet. The cutting crack has an inclined direction, which is consistent with the working direction of the ultrasonic working head.

2. The ultrasonic-assisted separation method for laser cutting according to claim 1, characterized in that, The greater the curvature of the trajectory point, the more the trajectory of the projection point tends to be straight, and the smaller the angle adjustment amount of the angle adjustment parameter; the greater the thickness of the glass plate through which the laser pulse passes after the angle adjustment parameter is adjusted, the greater the adjustment amount of the intensity adjustment parameter.

3. The ultrasonic-assisted separation method for laser cutting according to claim 1, characterized in that, The outer shape of the cutting portion is pre-cut on the ultra-thick glass plate by laser, and then the outer shape of the cutting portion is drilled by laser filamentation to form the cutting crack, which coincides with the outer shape.

4. The ultrasonic-assisted separation method for laser cutting according to claim 3, characterized in that, The cutting crack formed on the ultra-thick glass plate is a modified connection state in which the cut part and the remaining body form a crack but still maintain a connection force; when the modified connection is broken, the remaining body and the cut part maintain friction and cannot be directly detached.

5. The ultrasonic-assisted separation method for laser cutting according to claim 4, characterized in that, The ultrasonic working head simultaneously applies ultrasonic waves and downward pressure to the cutting part, causing the cutting part to gradually detach from the remaining body by vibrating downwards; during the process of the cutting part detaching from the remaining body, the remaining body does not undergo macroscopic deformation under the frictional force generated by the downward movement of the cutting part.

6. The ultrasonic-assisted separation method for laser cutting according to claim 5, characterized in that, The ultrasonic working head acts on the cutting part from top to bottom, and the remaining main body is placed on the worktable and supported by the worktable. The worktable is provided with a hollow structure for the cutting part to fall into after it is detached.

7. The ultrasonic-assisted separation method for laser cutting according to claim 1, characterized in that, The enclosed shape is circular, and the diameter of the circle is greater than 100mm.

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