功率放大芯片、功率放大系统和电子设备
By merging at least two bare chips in a power amplifier chip to form multiple power amplifiers, the problem of excessive board area is solved, resulting in cost and time savings.
CN118943107BActive Publication Date: 2026-07-17VIVO MOBILE COMM CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2024-07-19
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In electronic devices, as the number of speaker channels increases, the number of power amplifiers also increases, resulting in excessively large board area, which limits the promotion of multi-channel systems.
Method used
By setting at least two bare chips in the power amplifier chip, each bare chip having a power amplifier circuit, and encapsulating them as a single chip through a connection layer and pads, at least two power amplifiers are formed, reducing the board area occupied.
Benefits of technology
This effectively reduces the packaging cost and peripheral circuit components of power amplifiers, lowers development time and risk, and saves on the number of cutting tools and packaging time during the packaging process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN118943107B_ABST
Abstract
本申请公开了一种功率放大芯片、功率放大系统和电子设备，所述功率放大芯片包括：壳体、晶圆体和连接层，所述晶圆体包括至少两个相邻连接的裸芯片，且相邻的两个裸芯片之间具有一个划片槽，所述壳体和所述连接层中至少一者开设有安装腔，所述裸芯片嵌设于所述安装腔内；所述连接层与所述壳体层叠设置，且所述连接层与所述壳体连接，所述裸芯片朝向所述连接层一侧的表面设有功率放大电路，且所述连接层背对所述壳体的第一端面的一侧设有焊盘；每个裸芯片包括的功率放大电路通过所述连接层与所述焊盘中对应的引脚电连接。
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