A photovoltaic high thermal conductivity electronic device solder paste and preparation method thereof

CN118951474BActive Publication Date: 2024-12-31SUZHOU TONYSHARE ELECTRONICS MATERIALS TECH
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202411463636.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-21
Publication Date
2024-12-31
Estimated Expiration
2044-10-21

AI Technical Summary

Technical Problem

During the welding process, existing solder pastes have problems such as insufficient thermal conductivity, poor oxidation resistance, high void rate and high corrosion, which are difficult to meet the high reliability needs of photovoltaic electronic devices.

Method used

Copolyacrylic resin and acrylic resin are used as main components to modify acrylates, 2-methyl-2-acrylic acid-2,2,6,6-tetramethyl-4-piperidyl ester, and 18-acrylic acid The copolymerization of esters and dimethylammonium methacrylate is prepared to form a comb-like structure to improve thermal conductivity; at the same time, modified rosin resin and composite anhydride are used to enhance the antioxidant function and reduce water vapor to form an anti-corrosion film.

Benefits of technology

It significantly improves the thermal conductivity and oxidation resistance of solder paste, reduces the cavitation rate and corrosion, and enhances the insulation resistance performance and product reliability after welding.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure SMS_1
    Figure SMS_1
  • Figure SMS_2
    Figure SMS_2
Patent Text Reader

Abstract

The invention discloses a photovoltaic high thermal conductivity electronic device solder paste and a preparation method thereof, and relates to the technical field of solder paste. The invention adopts copolymerized acrylic resin and acrylic resin as main film-forming substances, wherein the copolymerized acrylic resin adopts hindered phenol modified acrylate, 2-methyl-2-acrylic acid-2,2,6,6-tetramethyl-4-piperidyl ester, octadecyl acrylate and dimethylaminoethyl methacrylate for copolymerization, and the overall comb-like structure has high intramolecular order, because the presence of high-density grafted side chains makes the repulsion between adjacent side chains strong, so that the polymerized main chain is forced to straighten, thereby forming an ordered one-dimensional structure, and the comb-like structure improves its overall crystallinity, so that it has both high phase change enthalpy and high thermal conductivity, thereby improving the overall thermal conductivity of the solder paste.
Need to check novelty before this filing date? Find Prior Art