An abrasive disc for uniform and efficient polishing of marble and a method for manufacturing the same
Patent Information
- Application Number
- CN202411059294.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-03
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2044-08-03
AI Technical Summary
[0003]金刚石磨片是最常用的大理石抛光磨片之一,其具有高硬度、高耐磨性和高效率的特点,如CN218891731U涉及一种便于大理石抛光的软磨片,该实用新型通过设置磨块、安装柱、限位环、连接柱、第一固定柱、第一连接杆、第二固定柱、卡柱、拉伸弹簧、连接块、卡块、压缩弹簧、第二连接杆和按钮的配合使用,达到了便于对软磨片进行组装和拆卸和对单个磨块进行更换的优点,但没有针对磨片材料进行改进,使得对大理石的打磨仍然存在着打磨不均匀以及打磨效率低的问题
[0023]该用于大理石均匀高效打磨的磨片及其制备方法中,先将粘性最大的环氧树脂和密度最大的材料金刚石粉初步混合均匀,再与其他材料混合均匀,树脂和固化剂在加热情况下会发生反应形成高分子网状结构,将后续所添加的无机填料和金刚石粉末均匀包裹形成性能稳定的金刚石磨片,最后生产出的磨片可以均匀高效的打磨市面上的大理石材料并使其有较好的平整度。
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Figure CN118952059B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of stone abrasive technology, and more specifically, to a grinding disc for uniform and efficient grinding of marble and its preparation method. Background Technology
[0002] A grinding disc is a tool used in grinding processes. It holds abrasive grains in place in various ways to perform surface treatments on a variety of materials. Grinding discs have a wide range of applications, including but not limited to stone processing, metal processing, and pulp fiber processing. The specific application and processing requirements vary depending on the application scenario.
[0003] Diamond grinding discs are among the most commonly used marble polishing discs, characterized by high hardness, high wear resistance, and high efficiency. For example, CN218891731U relates to a soft grinding disc that facilitates marble polishing. This utility model achieves the advantages of easy assembly and disassembly of the soft grinding disc and replacement of individual grinding blocks by using a combination of grinding blocks, mounting posts, limiting rings, connecting posts, first fixing posts, first connecting rods, second fixing posts, locking posts, tension springs, connecting blocks, locking blocks, compression springs, second connecting rods, and buttons. However, it does not improve the grinding disc material, so the polishing of marble still suffers from uneven polishing and low polishing efficiency.
[0004] To achieve uniform grinding and improve grinding efficiency, a grinding disc for uniform and efficient grinding of marble and its preparation method are proposed. Summary of the Invention
[0005] The purpose of this invention is to provide a grinding disc for uniform and efficient grinding of marble and its preparation method, so as to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, one objective of this invention is to provide a grinding disc for uniformly and efficiently polishing marble, comprising the following raw materials in parts by weight:
[0007] 16.5-20.5 parts by weight of epoxy resin, 20-24 parts by weight of diamond, 6.5-8.5 parts by weight of resin curing agent, 12-16 parts by weight of mullite, 8-12 parts by weight of silicon carbide, 8-12 parts by weight of corundum, 11-15 parts by weight of wollastonite, and 4-6 parts by weight of pumice.
[0008] As a further improvement to this technical solution, the epoxy resin is an aminophenol trifunctional epoxy resin, and the resin curing agent is a diethyltoluenediamine epoxy resin curing agent.
[0009] As a further improvement to this technical solution, the diamond is a 50-mesh diamond particle, and the silicon carbide is a 50-mesh silicon carbide.
[0010] A second objective of this invention is to provide a method for preparing a grinding disc for uniform grinding of marble as described above, comprising the following steps:
[0011] S1. First, mix epoxy resin and diamond to form the main material, then put the main material into the mixer and set aside for later use.
[0012] S2. Then, put the resin curing agent, mullite, silicon carbide, corundum, wollastonite, and pumice into the mixer in sequence and mix them with the main material.
[0013] S3. Vibrate and disperse the above raw materials in a mixer to form a preliminary mixture, and then evenly apply the preliminary mixture into the mold.
[0014] S4. Place the mold containing the abrasive into the oven and heat it thoroughly so that the initial mixture is cured. After demolding, produce abrasive discs with the specified shape and perform secondary curing.
[0015] As a further improvement to this technical solution, in step S1, at a room temperature of 15-25°C, 16.5-20.5 parts by weight of epoxy resin are added to a mixing tank, and then 20-24 parts by weight of diamond are slowly added and initially stirred evenly with a polytetrafluoroethylene stirring rod.
[0016] As a further improvement to this technical solution, in step S2, at a humidity level below 40%, 6.5-8.5 parts by weight of resin curing agent, 12-16 parts by weight of mullite, 8-12 parts by weight of silicon carbide, 8-12 parts by weight of corundum, 11-15 parts by weight of wollastonite, and 4-6 parts by weight of pumice are added respectively. After adding the powders, they are initially stirred with a polytetrafluoroethylene stirring rod, and then mixed in a vibrating mixer for 30-40 minutes.
[0017] As a further improvement to this technical solution, in step S3, the material is mixed evenly and then uniformly applied to a mold with a diameter ranging from 80 to 100 mm and a thickness ranging from 2 to 4 mm.
[0018] As a further improvement to this technical solution, in step S3, the coating and scraping are performed when the mold temperature is maintained at 15-25℃.
[0019] As a further improvement to this technical solution, in step S4, the heating temperature range for sufficient heating is 115-145℃, and the curing time range is 0.5-1.0h. Then, the product is demolded and placed in an oven at 145℃ for 2 hours. The product can then be removed, cut, and used with the backing material.
[0020] As a further improvement to this technical solution, in step S4, the roughness range of the produced grinding disc is 50 mesh.
[0021] In this invention, S1 is to initially mix the epoxy resin, the material with the highest viscosity, and the diamond powder, the material with the highest density, to form a uniform mixture. S2 and S3 are to mix the other materials with the material described in S1 to form a stable abrasive. S4 is to convert the uniformly mixed abrasive into a grinding wheel.
[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0023] In the present invention, a grinding disc for uniform and efficient grinding of marble and its preparation method, epoxy resin with the highest viscosity and diamond powder with the highest density are first mixed evenly, and then mixed evenly with other materials. The resin and curing agent react under heating to form a polymer network structure, which uniformly encapsulates the subsequently added inorganic filler and diamond powder to form a diamond grinding disc with stable performance. The final grinding disc can uniformly and efficiently grind marble materials on the market and give them good flatness. Attached Figure Description
[0024] Figure 1 This is the overall flowchart of the present invention. Detailed Implementation
[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0026] Grinding discs are dry grinding discs made by heating liquid resin and diamond materials under specific conditions. Existing grinding discs have low grinding efficiency and cumbersome steps when grinding traditional hard stone materials such as granite, concrete, marble, and quartz stone. They also greatly increase production and material costs, and bring customers troubles such as high investment of time and money with low returns in the later stage of use.
[0027] Therefore, one of the objectives of this invention is to provide a grinding disc for uniformly polishing marble, comprising the following raw materials in parts by weight:
[0028] 16.5-20.5 parts by weight of epoxy resin, 20-24 parts by weight of diamond, 6.5-8.5 parts by weight of resin curing agent, 12-16 parts by weight of mullite, 8-12 parts by weight of silicon carbide, 8-12 parts by weight of corundum, 11-15 parts by weight of wollastonite, and 4-6 parts by weight of pumice.
[0029] Furthermore, the epoxy resin is an aminophenol trifunctional epoxy resin, and the resin curing agent is a diethyltoluene diamine epoxy resin curing agent. Under heating conditions, the resin and curing agent react to form a polymer network structure that uniformly encapsulates the subsequently added inorganic fillers and diamond powder, forming a stable diamond grinding disc. The selected epoxy resin and curing agent have advantages such as stable curing system and high curing efficiency.
[0030] Furthermore, the diamond is made of 50-mesh diamond particles, and the silicon carbide is made of 50-mesh silicon carbide. The diamond and silicon carbide powders of this mesh size create uniform, stable, and efficient scratches on the surface of marble, which also facilitates coating and curing during the production process.
[0031] Please see Figure 1 As shown, a second objective of this invention is to provide a method for preparing a grinding disc for uniformly grinding marble, as described above. The specific steps are as follows:
[0032] S1. First, mix epoxy resin and diamond to form the main material. Then, put the main material into the mixer and set it aside for later use. At room temperature of 15-25℃, add 16.5-20.5 parts by weight of epoxy resin into the mixing tank, and then slowly add 20-24 parts by weight of diamond and stir evenly with a polytetrafluoroethylene stirring rod. The temperature range when adding the diamond is 15-25℃.
[0033] S2. Next, add the resin curing agent, mullite, silicon carbide, corundum, wollastonite, and pumice into the mixer in sequence and mix them with the main material. When the humidity is below 40%, add 6.5-8.5 parts by weight of resin curing agent, 12-16 parts by weight of mullite, 8-12 parts by weight of silicon carbide, 8-12 parts by weight of corundum, 11-15 parts by weight of wollastonite, and 4-6 parts by weight of pumice. After adding the powder, use a polytetrafluoroethylene stirring rod to stir initially, and then put it into a vibrating mixer to mix for 30-40 minutes.
[0034] S3. The above raw materials are vibrated and dispersed evenly in a mixer to form a preliminary mixture. The preliminary mixture is then evenly applied to a mold. The mixture is evenly applied to a mold with a diameter of 80-100mm and a thickness of 2-4mm. The mold temperature during the even application is 15-25℃.
[0035] S4. The mold is fully heated to allow the initial mixture to solidify. After demolding, a grinding disc of the specified shape is produced and cured. The heating temperature range for full heating is 115-145℃, and the curing time range is 0.5-1.0 hours. Then, the product is demolded and placed in an oven at 145℃ for 2 hours. After removing the product, it is cut and can be used with a backing base. The produced grinding disc has a roughness range of 50 mesh and is a stable and efficient marble grinding disc.
[0036] In this invention, S1 is to initially mix the epoxy resin, the material with the highest viscosity, and the diamond powder, the material with the highest density, to form a uniform mixture. S2 and S3 are to mix the other materials with the material in S1 to form a stable abrasive. S4 is to convert the uniformly mixed abrasive into a grinding wheel.
[0037] Based on the differences in raw material usage and process parameters during the preparation process, the following specific examples will further illustrate the grinding disc prepared by the present invention for uniform and efficient grinding of marble.
[0038] Example 1
[0039] S1. First, mix 18.5 parts by weight of epoxy resin with 22 parts by weight of diamond to form the main material, and then put the main material into the mixer for later use.
[0040] S2. Then, add 7.5 parts by weight of resin curing agent, 14 parts by weight of mullite, 10 parts by weight of silicon carbide, 10 parts by weight of corundum, 13 parts by weight of wollastonite, and 5 parts by weight of pumice into the mixer in sequence and mix them with the main material. The temperature at the time of addition is 15°C. After adding the powder, use a polytetrafluoroethylene stirring rod to initially stir it, and then put it into a vibrating mixer to mix for 40 minutes.
[0041] S3. The above raw materials are vibrated and dispersed evenly in a mixer to form a preliminary mixture. The preliminary mixture is then evenly applied to a mold. The mixture is evenly applied to a mold with a diameter of 80 mm and a thickness of 2 mm. The mold temperature during the even application is 15°C.
[0042] S4. Heat the mold thoroughly to ensure the initial mixture is cured. After demolding, produce a grinding disc with the specified shape and dry it. The heating temperature during the thorough heating is 130℃ and the curing time is 1.0h. After curing, demold the product and place it in an oven at 145℃ for 2h. Remove the product, cut off the backing base, and the roughness of the produced grinding disc is 50 mesh.
[0043] Example 2
[0044] S1. First, mix 18.5 parts by weight of epoxy resin with 22 parts by weight of diamond to form the main material, and then put the main material into the mixer for later use.
[0045] S2. Then, add 7.5 parts by weight of resin curing agent, 14 parts by weight of mullite, 10 parts by weight of silicon carbide, 10 parts by weight of corundum, 13 parts by weight of wollastonite, and 5 parts by weight of pumice into the mixer in sequence and mix them with the main material. The temperature at the time of addition is 15°C. After adding the powder, use a polytetrafluoroethylene stirring rod to initially stir it, and then put it into a vibrating mixer to mix for 40 minutes.
[0046] S3. The above raw materials are vibrated and dispersed evenly in a mixer to form a preliminary mixture. The preliminary mixture is then evenly applied to a mold. The mixture is evenly applied to a mold with a diameter of 100 mm and a thickness of 2 mm. The mold temperature during the even application is 15°C.
[0047] S4. Heat the mold thoroughly to ensure the initial mixture is cured. After demolding, produce a grinding disc with the specified shape and dry it. The heating temperature during the thorough heating is 130℃ and the curing time is 1.0h. After curing, demold the product and place it in an oven at 145℃ for 2h. Remove the product, cut off the backing base, and the roughness of the produced grinding disc is 50 mesh.
[0048] Example 3
[0049] S1. First, mix 16.5 parts by weight of epoxy resin with 24 parts by weight of diamond to form the main material, and then put the main material into the mixer for later use.
[0050] S2. Then, add 6 parts by weight of resin curing agent, 11.5 parts by weight of mullite, 10 parts by weight of silicon carbide, 10 parts by weight of corundum, 15 parts by weight of wollastonite, and 7 parts by weight of pumice into the mixer in sequence and mix them with the main material. The temperature at the time of addition is 20°C. After adding the powder, use a polytetrafluoroethylene stirring rod to initially stir it, and then put it into a vibrating mixer to mix for 35 minutes.
[0051] S3. The above raw materials are vibrated and dispersed evenly in a mixer to form a preliminary mixture. The preliminary mixture is then evenly applied to a mold. The mixture is evenly applied to a mold with a diameter of 100 mm and a thickness of 2 mm. The mold temperature during the even application is 20°C.
[0052] S4. Heat the mold thoroughly to ensure the initial mixture is cured. After demolding, produce a grinding disc with the specified shape and dry it. The heating temperature during the thorough heating is 135℃ and the curing time is 0.9h. After curing, demold the product and place it in an oven at 145℃ for 2h. Remove the product, cut off the backing base, and the roughness of the produced grinding disc is 50 mesh.
[0053] Example 4
[0054] S1. First, mix 20.5 parts by weight of epoxy resin with 20 parts by weight of diamond to form the main material, and then put the main material into the mixer for later use.
[0055] S2. Then, add 8.3 parts by weight of resin curing agent, 13 parts by weight of mullite, 9 parts by weight of silicon carbide, 11 parts by weight of corundum, 12.2 parts by weight of wollastonite and 6 parts by weight of pumice into the mixer in sequence and mix them with the main material. The temperature at the time of addition is 25°C. After adding the powder, use a polytetrafluoroethylene stirring rod to stir initially, and then put it into a vibrating mixer to mix for 30 minutes.
[0056] S3. The above raw materials are vibrated and dispersed evenly in a mixer to form a preliminary mixture. The preliminary mixture is then evenly applied to a mold. The mixture is evenly applied to a mold with a diameter of 100 mm and a thickness of 4 mm. The mold temperature during the even application is 25°C.
[0057] S4. Heat the mold thoroughly to ensure the initial mixture is cured. Demold the product to produce a grinding disc of the specified shape and dry it. The heating temperature during the thorough heating is 140℃ and the curing time is 0.8h. After curing, demold the product and place it in an oven at 145℃ for 2h. Remove the product, cut and stick the backing base. The roughness of the produced grinding disc is 50 mesh.
[0058] Table 1 Comparison of raw material usage differences in Examples 1-4
[0059]
[0060] Table 2 Comparison of process parameters in Examples 1-4
[0061]
[0062] Comparative Example 1
[0063] This comparative example uses the preparation method of Example 1, except that the diamond roughness is changed to 60, and the rest remains the same. The specific steps are similar to those of Example 1, and will not be repeated here.
[0064] Comparative Example 2
[0065] This comparative example uses the preparation method of Example 1, except that the diamond roughness is changed to 120, and the rest remains the same. The specific steps are similar to those of Example 1, and will not be repeated here.
[0066] Table 3 Comparison of process parameters in Example 1 and Comparative Examples 1-2
[0067]
[0068] Comparative Example 3
[0069] This comparative example uses the preparation method of Example 3, with the heating temperature set to 150°C and the rest unchanged. The specific steps are similar to those of Example 2, and will not be repeated here.
[0070] Comparative Example 4
[0071] This comparative example uses the preparation method of Example 3, with the curing time set to 1.5h and the rest unchanged. The specific steps are similar to those of Example 2, and will not be repeated here.
[0072] Comparative Example 5
[0073] This comparative example uses the preparation method of Example 3, with the roughness set to 40 mesh and the rest unchanged. The specific steps are similar to those of Example 2, and will not be repeated here.
[0074] Table 4 Comparison of process parameters in Example 3 and Comparative Examples 3-5
[0075]
[0076] Comparative Example 6
[0077] This comparative example uses the preparation method of Example 4, with the input temperature set to 0°C and the rest unchanged. The specific steps are similar to those of Example 3, and will not be repeated here.
[0078] Comparative Example 7
[0079] This comparative example uses the preparation method of Example 4, with the mixing time set to 20 min and the rest unchanged. The specific steps are similar to those of Example 3, and will not be repeated here.
[0080] Comparative Example 8
[0081] This comparative example uses the preparation method of Example 4, with the mold temperature set to 100°C and the rest unchanged. The specific steps are similar to those of Example 3, and will not be repeated here.
[0082] Table 5 Comparison of process parameters in Example 4 and Comparative Examples 6-8
[0083]
[0084] Test case
[0085] Grinding discs were prepared according to the preparation methods provided in Examples 1-4 and Comparative Examples 1-8, respectively. The prepared grinding discs were then bonded to an angle grinder and used to uniformly grind black and white marble. The amount of grinding per minute was recorded, and the average amount of grinding was recorded in Table 6.
[0086] Table 6 compares the grinding amount of the grinding discs in the embodiments and the comparative examples.
[0087] Example 1 8.9 Example 2 11.2 Example 3 10.3 Example 4 10.5 Comparative Example 1 6.3 Comparative Example 2 1.7 Comparative Example 3 (High curing temperature prevents demolding) Comparative Example 4 (Long curing time makes demolding impossible) Comparative Example 5 (Large diamond particles cause severe damage to the abrasive tool; large scratches on the marble surface) Comparative Example 6 (Unable to mix ingredients evenly) Comparative Example 7 / (Insufficient mixing time, uneven mixing, and unstable grinding performance) Comparative Example 8 High mold temperature prolongs the curing time, making demolding impossible.
[0088] As shown in Table 6, compared with Comparative Examples 1-8, the grinding amount of the grinding discs prepared in Examples 1-4 is greater than that of the grinding discs prepared in the comparative examples. Furthermore, the grinding amount of the grinding discs prepared in Examples is stable and the scratches are uniform. In contrast, the grinding amount of the grinding discs prepared in the comparative examples using different raw material amounts and process parameters is reduced or the grinding discs cannot be prepared normally. Therefore, under the working conditions of this example, the grinding efficiency of the prepared grinding disc is better.
[0089] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A method for preparing a grinding disc for uniform and efficient grinding of marble, characterized in that, Includes the following steps: S1. First, mix 16.5-20.5 parts by weight of epoxy resin with 20-24 parts by weight of diamond to form the main material, and then put the main material into the mixer for later use. S2. Then, add 6.5-8.5 parts by weight of resin curing agent, 12-16 parts by weight of mullite, 8-12 parts by weight of silicon carbide, 8-12 parts by weight of corundum, 11-15 parts by weight of wollastonite, and 4-6 parts by weight of pumice into the mixer in sequence and stir and mix with the main material. S3. Vibrate and disperse the above raw materials in a mixer to form a preliminary mixture, and then evenly apply the preliminary mixture into the mold. S4. Place the mold containing the abrasive into the oven and heat it thoroughly so that the initial mixture is cured. After demolding, produce abrasive discs with the specified shape and perform secondary curing.
2. The method for preparing a grinding disc for uniform and efficient grinding of marble according to claim 1, characterized in that: In S1, the epoxy resin is an aminophenol trifunctional epoxy resin, and the diamond is 50-mesh diamond particles.
3. The method for preparing a grinding disc for uniform and efficient grinding of marble according to claim 1, characterized in that: In step S1, epoxy resin is first added to a mixing tank, then diamond is slowly added and initially stirred evenly with a polytetrafluoroethylene stirring rod, and the temperature range during addition is 15-25 ℃.
4. The method for preparing a grinding disc for uniform and efficient grinding of marble according to claim 1, characterized in that: In step S2, the resin curing agent is diethyltoluenediamine epoxy resin curing agent, and the silicon carbide is 50 mesh silicon carbide.
5. The method for preparing a grinding disc for uniform and efficient grinding of marble according to claim 1, characterized in that: In step S2, when the humidity is below 40%, resin curing agent, mullite, silicon carbide, corundum, wollastonite, and pumice are added respectively. After the powder is added, it is initially stirred with a polytetrafluoroethylene stirring rod, and then put into a vibrating mixer for mixing. The mixing time range is 30-40 minutes.
6. The method for preparing a grinding disc for uniform and efficient grinding of marble according to claim 1, characterized in that: In step S3, the material is mixed evenly and then uniformly applied to the mold. The diameter of the mold ranges from 80 to 100 mm, and the thickness ranges from 2 to 4 mm.
7. The method for preparing a grinding disc for uniform and efficient grinding of marble according to claim 6, characterized in that: The mold temperature range for uniform coating is 15-25 ℃.
8. The method for preparing a grinding disc for uniform and efficient grinding of marble according to claim 1, characterized in that: In step S4, the heating temperature range during full heating is 115-145 ℃, and the curing time range is 0.5-1.0 h. After curing, the product is demolded and placed in an oven at 145 ℃ for 2 h. The product is then removed and the backing is cut.
9. The method for preparing a grinding disc for uniform and efficient grinding of marble according to claim 1, characterized in that: In S4, the roughness range of the produced grinding disc is 50 mesh.
10. A grinding disc for uniform and efficient grinding of marble prepared by the preparation method according to any one of claims 1-9.
Citation Information
Patent Citations
Soft abrasive disc facilitating marble polishing
CN218891731U
Epoxy resin type diamond grinding pad and manufacturing method thereof
CN103465155A
Preparation method of superhard resin grinding wheel
CN107775548A