Optical module heat sink
By equipping each optical module with an independent liquid cooling plate and utilizing a pluggable elastic mechanism, the problem of insufficient thermal contact between the liquid cooling plate and the optical module is solved, achieving uniform heat dissipation of the optical module and improving the heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN YIPU COMM TECH
- Filing Date
- 2024-09-25
- Publication Date
- 2026-08-04
AI Technical Summary
In existing optical module heat dissipation devices, the liquid cooling plate cannot make sufficient thermal contact with each optical module, resulting in poor heat dissipation.
An independent liquid cooling plate design is adopted, with each optical module equipped with a liquid cooling plate. The liquid cooling plate and the optical module are kept in full contact during insertion and removal through a plug-in resistant elastic mechanism. The plug-in resistant elastic mechanism, such as a fixed spring and a flat tube structure, is used to make the liquid cooling plate float to ensure thermal contact.
This achieves uniform temperature dissipation for each optical module, improving the heat dissipation effect, and in particular solving the heat dissipation problem of the bottom optical module in the stacked design.
Smart Images

Figure CN118962918B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical module heat dissipation technology, and more specifically, to an optical module heat dissipation device. Background Technology
[0002] Currently, optical modules used in switches are typically cooled by air. However, as the number of optical modules increases, power consumption also increases, and air cooling can no longer meet the heat dissipation requirements. Therefore, liquid cooling technology has emerged.
[0003] In related liquid cooling technologies, in order to reduce the number of pipes, a large liquid cooling plate is usually used to dissipate heat from all optical modules. However, since the liquid cooling plate needs to dissipate heat from all optical modules at the same time, it cannot be guaranteed that the liquid cooling plate can make sufficient thermal contact with each optical module. Summary of the Invention
[0004] The purpose of this application is to provide a heat dissipation device for optical modules to solve the technical problem that the liquid cooling plate in the current optical module heat dissipation device cannot make sufficient thermal contact with each optical module.
[0005] To achieve the above objectives, the embodiments of this application provide the following technical solutions:
[0006] A first aspect of this application provides a heat dissipation device for an optical module, comprising: a mounting cage including a first mounting layer and a second mounting layer spaced apart along a first direction, both the first and second mounting layers including a plurality of mounting positions arranged adjacent to each other along a second direction; a plurality of optical modules, each optical module being inserted into one of the mounting positions; a plurality of heat dissipation components, each heat dissipation component being disposed on the top of one of the mounting positions; each heat dissipation component including a liquid cooling plate having a top surface and a bottom surface opposite each other along the first direction, the bottom surface contacting the top of the mounting position; the heat dissipation component further including a plug-in / plug-out resistant elastic mechanism disposed on the top surface, the elastic extension direction of the plug-in / plug-out resistant elastic mechanism being perpendicular to the plug-in / plug-out direction of the optical module; when the optical module is in a plug-in / plug-out state, the optical module provides a resisting force to the liquid cooling plate, and the plug-in / plug-out resistant elastic mechanism provides an elastic force to the liquid cooling plate, the directions of the resisting force and the elastic force being opposite; wherein, the first direction is perpendicular to the second direction.
[0007] In one possible implementation, the insertion-resistant elastic mechanism includes: a first fixing spring; the first fixing spring has a first connecting end and a second connecting end, the first connecting end being connected to the side wall of the liquid cooling plate, and the second connecting end being connected to the top of the mounting position; the elastic extension and retraction direction of the first fixing spring is parallel to the first direction, and when the first fixing spring elastically extends and retracts, the liquid cooling plate floats along the first direction; when the optical module is in an uninserted state, the first fixing spring elastically extends; when the optical module is in an inserted / removed state, the first fixing spring elastically contracts, and the first fixing spring provides the elastic force to the liquid cooling plate.
[0008] In one possible implementation, the optical module heat dissipation device further includes: a liquid cooling pipe and a liquid cooling working fluid; the liquid cooling pipe is provided with a plurality of liquid distributors, each of the liquid distributors being connected to a corresponding liquid cooling plate, so that the plurality of heat dissipation components are connected in parallel through the liquid cooling pipe; the liquid cooling working fluid flows in the liquid cooling pipe, the liquid distributors and the liquid cooling plate.
[0009] In one possible implementation, the insertion-resistant elastic mechanism further includes: a flat tube; the flat tube has a first end and a second end opposite to each other along its axial direction, the top surface of the liquid cooling plate has a boss, the first end is connected to the boss, and the second end is connected to the liquid distributor; when the optical module is in an uninserted state, the first fixing spring elastically extends, and the flat tube deforms; when the optical module is in an inserted state, the first fixing spring elastically contracts, and the deformation of the flat tube disappears.
[0010] In one possible implementation, the width of the boss in the first direction is greater than the floating distance of the liquid cooling plate.
[0011] In one possible implementation, the liquid cooling pipe includes an inlet pipe and a return pipe, and a plurality of liquid distributors are provided on the inlet pipe; the flat tube has a first flow channel, the first flow channel including a first inlet and a first outlet, and the liquid distributors are connected to the first inlet; the liquid cooling plate has a second flow channel, the second flow channel including a second inlet and a second outlet, the first outlet being connected to the second inlet, and the second outlet being connected to the return pipe.
[0012] In one possible implementation, the insertion-resistant elastic mechanism includes: a second fixing spring; the second fixing spring is disposed on the top surface of the liquid cooling plate, and the elastic extension direction of the second fixing spring is parallel to the first direction; when the optical module is in the non-insertion state, the second fixing spring elastically extends, and the second fixing spring is spaced a certain distance from the flat tube; when the optical module is in the insertion state, the second fixing spring elastically contracts, and the second fixing spring abuts against the flat tube.
[0013] In one possible implementation, the sidewall of the liquid cooling plate has a step, and the first connecting end is connected to the step.
[0014] In one possible implementation, the second flow channel includes a plurality of sub-flow channels, which are arranged at equal intervals along the second direction.
[0015] In one possible implementation, the flat tube comprises a stainless steel flat tube.
[0016] In one possible implementation, the optical module heat dissipation device further includes: an inlet hose connector and an outlet hose connector; the inlet hose connector is connected to the inlet of the inlet pipe, and the outlet hose connector is connected to the outlet of the return pipe; the inlet hose connector is configured to introduce the liquid cooling medium, and the outlet hose connector is configured to discharge the liquid cooling medium.
[0017] Compared with related technologies, the optical module heat dissipation device provided in this application has the following advantages:
[0018] In the optical module heat dissipation device provided in this application embodiment, each optical module uses an independent liquid cooling plate for heat dissipation, and the liquid cooling plate can float up and down as the optical module is inserted and removed, which can ensure that the liquid cooling plate and the optical module have sufficient thermal contact and achieve uniform temperature heat dissipation.
[0019] The optical module heat dissipation device provided in this application embodiment is also designed for a double-layer stacked cage design, in which the heat dissipation component of the bottom optical module is placed between the upper and lower layers, thus solving the heat dissipation problem of the bottom optical module in the stacked design.
[0020] In addition to the technical problems solved by the embodiments of this disclosure, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the chassis and mobility scooter provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a top view of the heat dissipation device for an optical module provided in an embodiment of this application.
[0023] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the AA direction;
[0024] Figure 3 for Figure 1 Schematic diagram of cross-sectional structure in the middle BB direction Figure 1 ;
[0025] Figure 4 for Figure 1 Schematic diagram of cross-sectional structure in the middle BB direction Figure 2 ;
[0026] Figure 5 A top view of the heat dissipation assembly of the optical module heat dissipation device provided in the embodiments of this application;
[0027] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure along the CC direction;
[0028] Figure 7 for Figure 6 A magnified view of a portion of region E in the middle;
[0029] Figure 8 for Figure 5 Schematic diagram of cross-sectional structure in the DD direction Figure 1 ;
[0030] Figure 9 for Figure 5 Schematic diagram of cross-sectional structure in the DD direction Figure 2 ;
[0031] Figure 10 A top view of the liquid cooling plate of the heat dissipation assembly provided in an embodiment of this application;
[0032] Figure 11 A side view of the liquid cooling plate of the heat dissipation assembly provided in the embodiments of this application;
[0033] Figure 12 for Figure 11 Schematic diagram of the cross-sectional structure in the FF direction;
[0034] Figure 13 A schematic diagram of the flat tube structure of the heat dissipation assembly provided in the embodiments of this application. Figure 1 ;
[0035] Figure 14 A schematic diagram of the flat tube structure of the heat dissipation assembly provided in the embodiments of this application. Figure 2 ;
[0036] Figure 15 for Figure 14 A schematic diagram of the cross-sectional structure along the GG direction.
[0037] Explanation of reference numerals in the attached figures:
[0038] 100 - Installation cage;
[0039] 101 - First mounting layer; 102 - Second mounting layer; 103 - Mounting position;
[0040] 201-Liquid cooling plate; 202-Flat tube; 203-First fixing spring; 204-Second fixing spring;
[0041] 2011 - Second flow channel; 2012 - Sub-flow channel; 2013 - First step; 2014 - Second step; 2015 - Second inlet; 2016 - Second outlet; 2017 - Boss; 2021 - First flow channel; 2023 - First inlet; 2024 - First outlet;
[0042] 400-Dispenser;
[0043] 500-Inlet hose connector;
[0044] 600 - Discharge hose connector;
[0045] 701 - Inlet pipe; 702 - Return pipe. Detailed Implementation
[0046] In related technologies, liquid cooling devices for optical modules suffer from the problem that the liquid cooling plate cannot achieve sufficient thermal contact with each optical module. The inventors discovered that this problem arises because, in order to reduce the number of pipes, a large liquid cooling plate is used to dissipate heat from all optical modules in the related technologies. However, in a double-layer stacked cage design, the stacking arrangement of each optical module is different. In this case, the liquid cooling plate cannot guarantee sufficient thermal contact with each optical module, resulting in poor heat dissipation.
[0047] To address the aforementioned technical issues, the optical module heat dissipation device provided in this application employs an independent liquid cooling plate for heat dissipation of each optical module. The liquid cooling plate can float up and down as the optical modules are inserted and removed, ensuring sufficient thermal contact between the liquid cooling plate and the optical module for uniform temperature dissipation. Furthermore, for the double-layer stacked cage design, the heat dissipation components of the bottom optical module are placed between the upper and lower layers, solving the heat dissipation problem of the bottom optical module in the stacked design.
[0048] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0049] To facilitate the description of the embodiments of this application, the coordinate system in the accompanying drawings is explained. The Z-axis direction represents the first direction, which can be the upper or lower direction of the double-layer mounting cage; the X-axis direction represents the second direction, which can be the adjacent direction of each optical module in the horizontal direction; the Y-axis direction represents the third direction, which can be the insertion or removal direction of each optical module in the horizontal direction; the first direction, the second direction, and the third direction are perpendicular to each other.
[0050] like Figure 1 and Figure 2 As shown, the optical module heat dissipation device provided in this application embodiment includes: a mounting cage 100, which is a double-layer stacked optical mouse cage, comprising a first direction ( Figure 2 A first mounting layer 101 and a second mounting layer 102 are arranged vertically at intervals along the Z-axis shown in the diagram, with the first mounting layer 101 positioned above the second mounting layer 102; both the first mounting layer 101 and the second mounting layer 102 include multiple components arranged along a second direction (…). Figure 2 The mounting positions 103 are arranged adjacent to each other (as shown on the X-axis).
[0051] The optical module heat dissipation device also includes: multiple optical modules, each of which is plugged into a corresponding mounting position 103; such as Figure 1 As shown, the optical module is inserted into the mounting position 103 from right to left.
[0052] The optical module heat dissipation device also includes: multiple heat dissipation components, each of which is correspondingly disposed on the top of a mounting position 103; that is, the heat dissipation component disposed on the top of the mounting position 103 of the second mounting layer 102 is located between the first mounting layer 101 and the second mounting layer 102.
[0053] The heat dissipation assembly includes a liquid cooling plate 201, which is positioned along a first direction ( Figure 2 The Z-axis shown has a top surface and a bottom surface opposite each other, with the bottom surface contacting the top of the mounting position 103.
[0054] The mounting position 103 has an opening at the top. When the liquid cooling plate 201 is placed at the top of the mounting position 103, the top surface of the liquid cooling plate 201 is accommodated in the mounting position 103. When the optical module is inserted into the mounting position 103, the optical module will abut against the top surface of the liquid cooling plate 201, and the abutting force of the optical module will cause the liquid cooling plate 201 to float upward.
[0055] The heat dissipation assembly also includes a plug-in / plug-out resistant elastic mechanism, which is disposed on the top surface of the liquid cooling plate 201. The elastic extension and retraction direction of the plug-in / plug-out resistant elastic mechanism is as follows: Figure 2 The vertical direction shown is perpendicular to the insertion and removal direction of the optical module. During the insertion and removal of the optical module, the insertion and removal resistant elastic mechanism can prevent the liquid cooling plate 201 from disengaging from the optical module, ensuring full contact between the liquid cooling plate 201 and the optical module and good heat exchange.
[0056] When the optical module is in the unplugged state, the top surface of the liquid cooling plate 201 is accommodated in the mounting position 103, the plugging and unplugging elastic mechanism is in the initial state, and the plugging and unplugging elastic mechanism does not provide elastic force to the liquid cooling plate 201.
[0057] When the optical module is in the plug-in / plug-out state, the optical module provides upward ( Figure 2 An upward resisting force is applied to the liquid cooling plate 201, causing it to float upwards. The state of the insertion / removal resistant elastic mechanism changes, and the mechanism provides a downward (upward) force to the liquid cooling plate 201. Figure 2 The elastic force (downward) acting on the liquid cooling plate 201 is opposite in direction to the contact force, allowing the liquid cooling plate 201 to make full contact with the optical module.
[0058] At the same time, when the liquid cooling plate 201 floats upward, the state of the insertion and removal elastic mechanism changes. The insertion and removal elastic mechanism can also offset part of the change of the liquid cooling plate 201, preventing the liquid cooling plate 201 from disengaging from the optical module.
[0059] like Figure 1 , Figure 5 , Figure 8 and Figure 9 As shown, the liquid cooling plate 201 has a direction along the second direction ( Figure 5 The first and second sidewalls (shown as X-axis) are opposite each other.
[0060] In this embodiment of the application, the insertion and extraction resistant elastic mechanism includes: a first fixing spring 203, which may be disposed on a first side wall or a second side wall; or the first fixing spring 203 may be disposed on both the first side wall and the second side wall.
[0061] The first fixing spring 203 has a first connecting end and a second connecting end. The first connecting end is connected to the side wall of the liquid cooling plate 201, and the second connecting end is connected to the top of the mounting position 103, so that the liquid cooling plate 201 is connected to the top of the mounting position 103 through the first fixing spring 203.
[0062] The elastic extension and retraction direction of the first fixed spring 203 is the same as the first direction ( Figure 8 and Figure 9 When the Z-axis shown is parallel to the optical module and the optical module is in the plug-in / plug-out state, the liquid cooling plate 201 will float along the first direction. At this time, the liquid cooling plate 201 will drive the first fixed spring 203 to elastically extend and retract.
[0063] When the optical module is not plugged in, the first fixing spring 203 is in its initial state and the first fixing spring 203 is elastically extended, and the top surface of the liquid cooling plate 201 is accommodated in the mounting position 103.
[0064] When the optical module is in the plug-in / plug-out state, the liquid cooling plate 201 will float upward along the first direction, and the first fixing spring 203 will elastically contract, providing a downward elastic force to the liquid cooling plate 201.
[0065] In this embodiment of the application, multiple first fixing springs 203 can be provided on both the first sidewall and the second sidewall.
[0066] like Figure 10 , Figure 11 and Figure 12 As shown in the embodiment of this application, the side wall of the liquid cooling plate 201 has a step, and the first connecting end is connected to the step, so that the liquid cooling plate 201 is connected to the top of the mounting position 103 through the first fixing spring 203.
[0067] The first side wall is provided with a first step 2013, and the second side wall is provided with a second step 2014.
[0068] In this embodiment of the application, the optical module heat dissipation device further includes: a liquid cooling pipe and a liquid cooling working fluid; a plurality of liquid distributors are provided on the liquid cooling pipe, each liquid distributor being connected to a corresponding liquid cooling plate 201, so that multiple heat dissipation components are connected in parallel through the liquid cooling pipe to reduce the system flow resistance; the liquid cooling working fluid flows in the liquid cooling pipe, the liquid distributor and the liquid cooling plate 201.
[0069] like Figure 3 and Figure 4As shown in the embodiment of this application, the insertion-removal elastic mechanism further includes: a flat tube 202, the flat tube 202 being positioned along its axial direction ( Figure 3 and Figure 4 The Y-axis shown has a first end and a second end opposite to each other. The top surface of the liquid cooling plate 201 has a boss 2017. The first end is connected to the boss 2017 and the second end is connected to the distributor 400.
[0070] like Figure 3 As shown, when the optical module is not plugged in, the first fixing spring 203 elastically extends, and the top surface of the liquid cooling plate 201 is accommodated in the mounting position 103. The downward extension of the liquid cooling plate 201 causes the flat tube 202 to deform.
[0071] like Figure 4 As shown, when the optical module is in the plug-in / plug-out state, the liquid cooling plate 201 will float along the first direction. At this time, the liquid cooling plate 201 will drive the first fixing spring 203 to elastically extend and retract. The flat tube 202 floats with the liquid cooling plate 201. The deformation of the flat tube 202 disappears. The flat tube 202 can offset part of the change of the liquid cooling plate 201 and prevent the liquid cooling plate 201 from disengaging from the optical module.
[0072] In this embodiment of the application, in the first direction ( Figure 3 and Figure 4 On the Z-axis (as shown), the width of the boss 2017 is greater than the floating distance of the liquid cooling plate 201. There is a certain gap between the flat tube 202 and the liquid cooling plate 201, forming a cantilever beam structure, which makes the flat tube 202 more easily deformable.
[0073] For example, 3. Figure 4 and Figure 5 As shown in the embodiment of this application, the liquid cooling pipeline includes an inlet pipe 701 and a return pipe 702, which separate the inlet and return liquid chambers; the inlet pipe 701 is provided with multiple liquid distributors 400, and the liquid distributors 400 are designed to ensure the temperature uniformity of each optical module and reduce the system flow resistance.
[0074] The flat tube 202 has a first flow channel 2021, which includes a first liquid inlet 2023 and a first liquid outlet 2024. The distributor 400 is connected to the first liquid inlet 2023, so that the cooling medium in the inlet pipe 701 flows into the flat tube 202 first.
[0075] The liquid cooling plate 201 has a second flow channel 2011, which includes a second liquid inlet 2015 and a second liquid outlet 2016. The first liquid outlet 2024 is connected to the second liquid inlet 2015, so that the cooling medium in the flat tube 202 flows into the liquid cooling plate 201. The second liquid outlet 2016 is connected to the return pipe 702, so that the cooling medium that has completed heat dissipation in the liquid cooling plate 201 flows out of the liquid cooling plate 201.
[0076] The liquid cooling plate 201 is welded and formed, and the second flow channel 2011 is milled and formed by machining. The liquid cooling plate 201 is made of copper or aluminum with good thermal conductivity.
[0077] like Figure 12 As shown, the second flow channel 2011 may include multiple sub-flow channels 2012, and the multiple sub-flow channels 2012 are along the second direction ( Figure 12 The X-axis shown is set at equal intervals to achieve uniform temperature design of liquid cooling plate 201.
[0078] In this embodiment, the flat tube 202 includes a stainless steel flat tube.
[0079] Among them, reference Figure 14 and Figure 15 The flat tube 202 can be an ultra-thin stainless steel flat tube, formed by welding two stainless steel plates together. The welding method can be vacuum brazing, laser welding, etc.; one of the stainless steel plates forms the first flow channel 2021 by stamping and embossing.
[0080] Such as 3 and Figure 4 As shown in the embodiment of this application, the insertion-removal elastic mechanism further includes: a second fixing spring 204; the second fixing spring 204 is disposed on the top surface of the liquid cooling plate 201, and the elastic extension direction of the second fixing spring 204 is the same as that of the first direction ( Figure 3 and Figure 4 The Z-axis shown is parallel to the Z-axis.
[0081] like Figure 3 As shown, when the optical module is not plugged in or unplugged, the second fixing spring 204 elastically extends, and the second fixing spring 204 is spaced a certain distance from the flat tube 202. That is to say, the second fixing spring 204 and the flat tube 202 do not contact each other at this time.
[0082] like Figure 4 As shown, when the optical module is in the plug-in / plug-out state, the second fixing spring 204 elastically contracts and abuts against the flat tube 202; the second fixing spring 204 can provide a downward elastic force to the liquid cooling plate 201.
[0083] Such as 1 and Figure 5 As shown in the embodiment of this application, the optical module heat dissipation device further includes: an inlet hose connector 500 and an outlet hose connector 600; the inlet hose connector 500 is connected to the inlet of the inlet pipe 701, and the outlet hose connector 600 is connected to the outlet of the return pipe 702. The inlet hose connector 500 is configured to introduce liquid cooling medium, and the outlet hose connector 600 is configured to discharge liquid cooling medium.
[0084] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.
[0085] It should be noted that the embodiments referred to in the specification, such as "one embodiment," "embodiment," "exemplary embodiment," and "some embodiments," may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.
[0086] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "one" or "" can also be understood to convey either singular or plural usage.
[0087] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).
[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A light module heat sink apparatus, comprising: include: The mounting cage includes a first mounting layer and a second mounting layer spaced apart along a first direction, and both the first mounting layer and the second mounting layer include a plurality of mounting positions arranged adjacent to each other along the second direction. Multiple optical modules, each of which is plugged into one of the mounting positions; Multiple heat dissipation components, each of which is correspondingly disposed on the top of one of the mounting positions; The heat dissipation assembly includes a liquid cooling plate, which has a top surface and a bottom surface opposite each other along the first direction, and the bottom surface contacts the top of the mounting position. The heat dissipation assembly also includes a plug-in / plug-out resistant elastic mechanism, which is disposed on the top surface, and the elastic extension and retraction direction of the plug-in / plug-out resistant elastic mechanism is perpendicular to the plug-in / plug-out direction of the optical module. When the optical module is in the plug-in / plug-out state, the optical module provides a resisting force to the liquid cooling plate, and the plug-in / plug-out resistant elastic mechanism provides an elastic force to the liquid cooling plate. The resisting force and the elastic force are in opposite directions. Wherein, the first direction is perpendicular to the second direction; The optical module heat dissipation device also includes: liquid cooling pipes and liquid cooling working fluid; The liquid cooling pipe is equipped with multiple liquid distributors, each of which is connected to a corresponding liquid cooling plate, so that multiple heat dissipation components are connected in parallel through the liquid cooling pipe. The liquid cooling working fluid flows through the liquid cooling pipe, the distributor, and the liquid cooling plate; The insertion-and-extraction resistant elastic mechanism includes a first fixing spring and a flat tube; The first fixing spring has a first connecting end and a second connecting end, the first connecting end being connected to the side wall of the liquid cooling plate, and the second connecting end being connected to the top of the mounting position; The elastic extension and retraction direction of the first fixing spring is parallel to the first direction. When the first fixing spring elastically extends and retracts, the liquid cooling plate floats along the first direction. When the optical module is not plugged in, the first fixing spring extends elastically. When the optical module is in the plugged-out state, the first fixing spring elastically contracts, and the first fixing spring provides the elastic force to the liquid cooling plate; The flat tube has a first end and a second end opposite to each other along its axial direction, the top surface of the liquid cooling plate has a boss, the first end is connected to the boss, and the second end is connected to the liquid separator; When the optical module is not plugged in, the first fixing spring elastically elongates, and the flat tube deforms. When the optical module is in the plugged-in / plugged-out state, the first fixing spring elastically contracts, and the deformation of the flat tube disappears; In the first direction, the width of the boss is greater than the floating distance of the liquid cooling plate, so that a gap is created between the flat tube and the liquid cooling plate to form a cantilever beam structure.
2. The optical module heat dissipation device according to claim 1, characterized in that, The liquid cooling pipeline includes an inlet pipe and a return pipe, and the inlet pipe is equipped with a plurality of liquid distributors; The flat tube has a first flow channel, the first flow channel including a first liquid inlet and a first liquid outlet, and the liquid distributor is connected to the first liquid inlet; The liquid cooling plate has a second flow channel, which includes a second liquid inlet and a second liquid outlet. The first liquid outlet is connected to the second liquid inlet, and the second liquid outlet is connected to the return pipe.
3. The light module heat sink apparatus of claim 1, wherein, The insertion-and-extraction resistant elastic mechanism includes: a second fixing spring; The second fixing spring is disposed on the top surface of the liquid cooling plate, and the elastic extension and contraction direction of the second fixing spring is parallel to the first direction; When the optical module is in the unplugged state, the second fixing spring extends elastically, and the second fixing spring is spaced a certain distance from the flat tube; When the optical module is in the plugged-in / plugged-out state, the second fixing spring retracts elastically and abuts against the flat tube.
4. The light module heat sink apparatus of claim 1, wherein, The sidewall of the liquid cooling plate has a step, and the first connecting end is connected to the step.
5. The optical module heat dissipation device according to claim 2, characterized in that, The second flow channel includes a plurality of sub-flow channels, which are arranged at equal intervals along the second direction.
6. The optical module heat dissipation device according to claim 1, characterized in that, The flat tube includes a stainless steel flat tube.
7. The optical module heat dissipation device according to claim 2, characterized in that, The optical module heat dissipation device also includes: an inlet hose connector and an outlet hose connector; The inlet hose connector is connected to the inlet of the inlet pipe, and the outlet hose connector is connected to the outlet of the return pipe. The inlet hose connector is configured to introduce the liquid cooling working fluid, and the outlet hose connector is configured to discharge the liquid cooling working fluid.