Multi-plane copper sheet semiconductor device, copper sheet manufacturing method and assembly method

Abstract

The present invention relates to the field of semiconductor technology, and in particular to a multi-plane copper sheet semiconductor device, a copper sheet manufacturing method and an assembly method, wherein the semiconductor device comprises a copper connection frame, a first chip, a second chip, a first copper jumper and a second copper jumper, the copper connection frame comprises at least one connection substrate and at least one connection frame; the connection substrate is connected to the connection frame through a first pin, and the connection frame is provided with a second pin and a third pin; the first chip comprises a first contact and two second contacts; the second chip comprises a third contact; one end of the first copper jumper is connected to the two second contacts and the third contact, and the other end of the first copper jumper is connected to the second pin; one end of the second copper jumper is connected to the first contact, and the other end of the second copper jumper is connected to the third pin. The advantage of the present invention is that the present invention solves the problem of long aluminum wire bonding time and low efficiency through the first copper jumper and the second copper jumper, and improves the production efficiency of the bonding process.

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