An ultrafast laser bonding sapphire apparatus

Abstract

The application discloses a kind of ultrafast laser bonding sapphire equipment in sapphire processing technical field, including equipment main body, polishing mechanism and transfer mechanism, transfer mechanism can be transferred to equipment main body after the workpiece polished by polishing mechanism flushing, it is characterized by: polishing mechanism is arranged in the side of equipment main body and polishing mechanism includes positioning assembly, polishing assembly and flushing assembly;Polishing assembly can adapt to a variety of different inclined surface workpieces, the workpiece surface can be polished before entering bonding equipment by the application, and polishing mechanism can adapt to the workpiece surface at different inclination angles, ensure that workpiece surface can be polished before entering bonding equipment comprehensively and uniformly, while avoiding the problem that polishing disc is greatly worn due to uneven stress.

Description

Technical Field

[0001] This invention relates to the field of sapphire processing technology, specifically to an ultrafast laser bonding sapphire device. Background Technology

[0002] Laser bonding is essentially a type of thermal bonding, except that heat is applied between the substrate and the cover plate via a laser beam, causing the interface to melt and bond together. The main methods of low-temperature bonding technology include intermetallic bonding, weld bonding, and rapid sintering. Intermetallic bonding refers to bonding two different metals together using the formation of intermetallic compounds; common intermetallic bonding methods include diffusion bonding and thin-film bonding. Weld bonding refers to fusing materials through localized heating or high pressure; common weld bonding methods include laser welding and electron beam welding. Rapid sintering refers to forming strong bonds between material particles through short-time, high-pressure sintering at low temperatures.

[0003] To eliminate scratches that may occur during the transport of sapphire workpieces and ensure the flatness of their surface when entering the bonding equipment, most sapphire workpieces undergo a second precision polishing before entering the bonding equipment. However, in practical applications, the non-bonding contact surfaces of some sapphire workpieces are not uniformly level. Unevenness at the bottom of the workpiece makes it difficult to keep the bonding contact surfaces level during positioning. (See [link to relevant documentation]). Figure 8 Common grinding mechanisms are unable to fully grind bonding contact surfaces with different tilt angles, thus failing to ensure the flatness of the workpiece surface entering the bonding equipment, which in turn affects the yield of workpiece bonding processing. Summary of the Invention

[0004] The technical problem of the present invention is to provide an ultrafast laser bonding sapphire device that can grind the surface of the workpiece before it enters the bonding device, and the grinding mechanism can adapt to the workpiece surface at different tilt angles, ensuring that the workpiece surface can be ground evenly before entering the bonding device, while avoiding the problem of large wear of the grinding disc due to uneven force.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an ultrafast laser bonding sapphire device, comprising a main body, a grinding mechanism, and a transfer mechanism, wherein the transfer mechanism is capable of transferring the workpiece, after being ground and rinsed by the grinding mechanism, into the main body of the device.

[0006] The grinding mechanism is located on one side of the main body of the equipment and includes a positioning component, a grinding component, and a rinsing component.

[0007] Positioning components: The positioning components are symmetrically arranged on both sides of the transfer mechanism. The positioning components include clamping plates, which are slidably arranged on the transfer mechanism and can fix the workpiece in the center on the transfer mechanism.

[0008] Grinding assembly: The grinding assembly is slidably disposed on the grinding mechanism and can reciprocate on the grinding mechanism. The grinding assembly includes: multiple grinding units, which are arranged in a "I" shape along the direction perpendicular to the moving path of the transfer mechanism.

[0009] The polishing unit includes:

[0010] The upper rotating shaft is provided in multiple sets and the multiple sets of upper rotating shafts are evenly distributed.

[0011] The lower rotating shaft is provided in multiple sets, each corresponding to one of the upper rotating shafts. A universal joint is provided between the upper end of the lower rotating shaft and the upper rotating shaft. The universal joint can adjust the tilt angle between the lower rotating shaft and the upper rotating shaft so that the lower surface of the lower rotating shaft can be kept horizontal with the inclined surface of the workpiece on the upper surface. The universal joint can drive the lower rotating shaft to rotate along its axis when the upper rotating shaft rotates.

[0012] A grinding disc is disposed at the lower end of the lower rotating shaft, and the lower surface of the grinding disc can automatically and fully abut against the upper surface of the workpiece.

[0013] As a further aspect of the present invention, the rinsing assembly is disposed above the grinding disc and can move synchronously with the grinding assembly, the rinsing assembly comprising:

[0014] A connector is fixedly installed at the upper end of the spray nozzle, and a suction pump is provided inside the connector;

[0015] A water guide pipe is fixedly installed on one side of the connector, and the end of the water guide pipe away from the connector is led into the water storage tank.

[0016] The spray nozzles are provided in multiple sets and are staggered between the upper rotating shafts. The spray nozzles are fixedly installed on the movable frame. The lower end of the spray nozzles can tilt in the same direction as the angle of the lower rotating shaft changes.

[0017] The telescopic tube is provided in multiple sets and is fixedly installed at the lower end of the spray nozzle. The spray nozzle is fixedly installed on the movable frame, and the telescopic tube is located below the movable frame.

[0018] A traction belt is fixedly installed at the lower end of the telescopic tube, and the traction belt is capable of pulling the telescopic tube to bend and move.

[0019] A connecting ring is fixedly installed at the end of the traction belt away from the retractable tube. The connecting ring is rotatably connected to the lower rotating shaft and can move with the lower rotating shaft.

[0020] As a further aspect of the present invention, the polishing component includes:

[0021] A movable frame is slidably connected to the upper surface of the grinding mechanism, and the upper rotating shaft is evenly distributed on the movable frame and rotatably connected to the movable frame.

[0022] An upper threaded rod is rotatably mounted above the grinding mechanism, and the upper threaded rod is threadedly connected to the lower end of the movable frame.

[0023] An upper fixed plate is fixedly installed at the lower end of the lower rotating shaft;

[0024] A limiting spring is fixedly installed between the grinding disc and the upper fixed disc, and a telescopic rod is fixedly installed between the grinding disc and the upper fixed disc at the position corresponding to the limiting spring.

[0025] A drive unit 1 is disposed at one end of the upper threaded rod, and the drive unit 1 is capable of driving the upper threaded rod to rotate in both forward and reverse directions;

[0026] Drive unit two is mounted on the movable frame and can drive multiple sets of upper rotating shafts to rotate simultaneously.

[0027] As a further aspect of the present invention, the transfer mechanism includes:

[0028] A main threaded rod is symmetrically installed at the bottom of the equipment body, and one end of the main threaded rod extends into the grinding mechanism;

[0029] A movable positioning seat is slidably disposed within the grinding mechanism and the main body of the equipment. Internal threaded parts are rotatably installed on the movable positioning seat at positions corresponding to the main threaded rod.

[0030] A seepage hole is provided on the movable positioning seat, which allows water sprayed from the spray nozzle to flow out of the grinding mechanism.

[0031] The driving mechanism includes a driven gear, which is provided in multiple sets and is fixedly installed on one end of the internal threaded part. A driving gear is rotatably installed on the movable positioning seat on the side corresponding to the driven gear. The driving gear meshes with the driven gear. An internal transmission component is provided between the driving gears. A rotary motor is fixedly installed on the movable positioning seat. The output end of the rotary motor is fixedly connected to the driving gear.

[0032] As a further aspect of the present invention, the positioning component includes:

[0033] The limiting groove is provided on both sides of the upper surface of the movable positioning seat, and the lower end of the clamping plate is embedded in the limiting groove and slidably connected to the limiting groove.

[0034] A threaded rod is rotatably installed in the limiting groove and is threadedly connected to the clamping plate.

[0035] A drive assembly includes an extension shaft, which is rotatably mounted on both sides of a movable positioning seat corresponding to the lower threaded rod. A vertical transmission component is provided between the extension shaft and the lower threaded rod, and a horizontal transmission component is provided between the extension shafts. A first motor is fixedly installed inside the movable positioning seat, and the output end of the first motor is fixedly connected to the extension shaft.

[0036] As a further aspect of the present invention, the driving unit one includes:

[0037] A side drive component is provided at the end of the upper threaded rod away from the main body of the equipment, and the side drive component can drive the upper threaded rods on both sides to rotate synchronously;

[0038] The second motor is fixedly installed at the end of the grinding mechanism away from the main body of the equipment. The output end of the second motor is fixedly connected to the upper threaded rod. The second motor is a bidirectional motor.

[0039] As a further aspect of the present invention, the driving unit two includes:

[0040] An upper transmission component is disposed between the upper rotating shafts, and the upper transmission component is capable of driving multiple sets of upper rotating shafts to rotate synchronously;

[0041] The second gear is fixedly mounted on the upper rotating shaft at the edge;

[0042] The first gear is rotatably mounted on the movable frame, and the first gear meshes with the second gear.

[0043] As a further embodiment of the present invention, a positioning frame is provided above the grinding mechanism, a cylinder is fixedly installed on the upper surface of the positioning frame, a stamping plate is fixedly installed at the output end of the cylinder, and multiple water seepage grooves are provided on the lower surface of the grinding mechanism.

[0044] As a further embodiment of the present invention, an internally threaded rod is rotatably mounted inside the main body of the device, and a laser is threadedly connected to the internally threaded rod. A driving component is provided on one side inside the main body of the device, and the driving component can drive the internally threaded rod to rotate.

[0045] Compared with the prior art, the beneficial effects of the present invention are:

[0046] 1. Before bonding in this invention, the grinding mechanism can grind the surface of the workpiece just before it enters the main body of the equipment to eliminate scratches that may be generated during the transportation process, ensure the smoothness of the workpiece surface when it enters the main body of the equipment, eliminate the oxide layer on the workpiece surface, and ensure the yield of workpiece bonding.

[0047] 2. In practical applications of grinding, this invention cannot guarantee the flatness of the bottom of the workpiece. For workpieces with uneven bottoms (i.e., non-bonded contact surfaces), the clamping plate cannot ensure that the upper surface of the workpiece is horizontal after fixing the workpiece position. When the vertically set grinding disc grinds a workpiece with an inclined upper surface, it is easy to miss grinding spots, resulting in uneven and incomplete grinding of the upper surface of the workpiece. Moreover, the damage to the edge of the grinding disc is also greater during the grinding process. In this invention, the upper rotating shaft is connected to the lower rotating shaft and then to the grinding disc through a universal joint. When the workpiece surface is inclined, after the grinding disc is attached to the workpiece surface, the universal joint can adjust the angle between the lower rotating shaft and the upper rotating shaft in more tilt direction and angle, so that the grinding disc can adapt to workpiece surfaces with different inclination angles and grind them evenly and comprehensively. Attached Figure Description

[0048] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0050] Figure 2 For the present invention Figure 1 A partial structural diagram at point A in the middle;

[0051] Figure 3 For the present invention Figure 1 A partial structural diagram at point B in the middle;

[0052] Figure 4 For the present invention Figure 1 A partial structural diagram at point C;

[0053] Figure 5 This is a top-view structural diagram of the present invention;

[0054] Figure 6 For the present invention Figure 5 A partial structural diagram at point D;

[0055] Figure 7 This is a cross-sectional view of the structure of the present invention;

[0056] Figure 8 This is a schematic diagram illustrating the grinding principle of the present invention.

[0057] The attached diagram lists the components represented by each number as follows:

[0058] 1. Main body of the equipment; 2. Telescopic tube; 3. Traction belt; 4. Upper fixed plate; 5. Connecting ring; 6. Universal joint; 7. Lower rotating shaft; 8. Positioning frame; 9. Cylinder; 10. Stamping plate; 11. Grinding mechanism; 12. Upper threaded rod; 13. Movable frame; 14. Water guide pipe; 15. Connecting piece; 16. Moving positioning seat; 17. Main threaded rod; 18. Clamping plate; 19. Side transmission component; 20. Internal threaded component; 21. Driven gear; 22. Internal transmission component; 23. Drive gear; 24. Water seepage hole; 25. Horizontal transmission component; 26. Grinding disc; 27. Limiting spring; 28. Upper transmission component; 29. ​​Spray nozzle; 30. First gear; 31. Upper rotating shaft; 32. Second gear; 33. Limiting groove; 34. Internal threaded rod; 35. Laser; 36. Extension shaft; 37. Vertical transmission component; 38. Lower threaded rod. Detailed Implementation

[0059] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0060] Please see Figures 1-8 This invention provides a technical solution: an ultrafast laser bonding sapphire device, comprising a main body 1, a grinding mechanism 11, and a transfer mechanism, wherein the transfer mechanism is capable of transferring the workpiece, after being ground and rinsed by the grinding mechanism 11, into the main body 1, characterized in that:

[0061] The grinding mechanism 11 is located on one side of the main body 1 of the equipment and includes a positioning component, a grinding component and a rinsing component.

[0062] Positioning components: The positioning components are symmetrically arranged on both sides of the transfer mechanism. The positioning components include a clamping plate 18, which is slidably arranged on the transfer mechanism and can fix the workpiece in the center on the transfer mechanism.

[0063] Grinding assembly: The grinding assembly is slidably mounted on the grinding mechanism 11 and can reciprocate on the grinding mechanism 11. The grinding assembly includes multiple grinding units, which are arranged in a straight line along the direction perpendicular to the moving path of the transfer mechanism.

[0064] Each grinding unit includes:

[0065] The upper rotating shaft 31 is provided in multiple sets and the multiple sets of upper rotating shafts 31 are evenly distributed.

[0066] The lower rotating shaft 7 is also provided in multiple sets, each corresponding to the upper rotating shaft 31. A universal joint 6 is provided between the upper end of the lower rotating shaft 7 and the upper rotating shaft 31. The universal joint 6 can adjust the tilt angle between the lower rotating shaft 7 and the upper rotating shaft 31 so that the lower surface of the lower rotating shaft 7 can be kept horizontal with the inclined workpiece surface of the upper surface. The universal joint 6 can drive the lower rotating shaft 7 to rotate along its axis when the upper rotating shaft 31 rotates.

[0067] Grinding disc 26 is located at the lower end of the lower rotating shaft 7. The lower surface of grinding disc 26 can automatically and fully contact the upper surface of the workpiece.

[0068] During operation, the sapphire workpiece of this invention is fixed below the polishing mechanism 11 by a positioning component (e.g., Figure 2 The sapphire workpiece shown can be clamped and fixed on the movable positioning seat 16 by the mutual proximity of the clamping plates 18. After polishing, the sapphire workpiece can be moved into the equipment body 1 by the movable positioning seat 16. After the sapphire workpiece is introduced into the equipment body 1, as shown... Figure 7 As shown, the laser 35 can be moved by rotating the internal threaded rod 34 to bond the sapphire workpiece. Before bonding in this invention, the grinding mechanism 11 can grind the workpiece surface just before it enters the equipment body 1 to eliminate scratches that may occur during transportation, ensuring a smooth workpiece surface upon entering the equipment body 1, eliminating the oxide layer on the workpiece surface, and ensuring a high bonding yield. However, in practical applications, this invention cannot guarantee the flatness of the workpiece bottom. For workpieces with uneven bottoms (i.e., non-bonding contact surfaces), the clamping plate 18 cannot ensure that the upper surface of the workpiece is level after fixing the workpiece position (e.g.,...). Figure 8 As shown), when the vertically arranged grinding disc 26 grinds a workpiece with an inclined upper surface, it is easy to miss some areas, resulting in uneven and incomplete grinding of the upper surface of the workpiece (e.g., ...). Figure 8 (As shown on the left), and the grinding process causes significant damage to the edge of the grinding disc 26. In this invention, the upper rotating shaft 31 is connected to the lower rotating shaft 7 via a universal joint 6, which in turn connects to the grinding disc 26. When the workpiece surface is tilted, after the grinding disc 26 is pressed against the workpiece surface, the universal joint 6 can further adjust the angle between the lower rotating shaft 7 and the upper rotating shaft 31 (e.g., as shown on the left). Figure 8 (As shown on the right), this allows the grinding assembly to adapt to workpiece surfaces with different tilt angles, thereby achieving comprehensive and uniform grinding of the workpiece that is about to enter the main body 1 of the equipment.

[0069] As a further aspect of the present invention, the rinsing assembly is disposed above the grinding disc 26 and can move synchronously with the grinding assembly. The rinsing assembly includes:

[0070] Connector 15 is fixedly installed on the upper end of spray nozzle 29, and a suction pump is installed inside connector 15.

[0071] Water pipe 14 is fixedly installed on one side of connector 15, and the end of water pipe 14 away from connector 15 is led into the water storage tank.

[0072] Spray nozzles 29 are provided in multiple sets and are staggered between the upper rotating shaft 31. The spray nozzles 29 are fixedly installed on the movable frame 13. The lower end of the spray nozzles 29 can tilt in the same direction as the angle of the lower rotating shaft 7 changes.

[0073] The telescopic tube 2 has multiple sets, each fixedly installed at the lower end of the spray nozzle 29. The spray nozzle 29 is fixedly installed on the movable frame 13, and the telescopic tube 2 is located below the movable frame 13.

[0074] The traction belt 3 is fixedly installed at the lower end of the telescopic tube 2. The traction belt 3 can pull the telescopic tube 2 to bend and move.

[0075] The connecting ring 5 is fixedly installed at the end of the traction belt 3 away from the telescopic tube 2. The connecting ring 5 is rotatably connected to the lower rotating shaft 7 and can move with the lower rotating shaft 7.

[0076] During operation, the water pipe 14 drives water into the connector 15 during the grinding process, and then the connector 15 sprays water onto the substrate surface from the spray nozzle 29, thereby automatically washing away the grinding dust. The wastewater flows out through the seepage hole 24 on the grinding mechanism 11. When grinding the workpiece with the upper surface tilted, the grinding disc 26 is tilted relative to the workpiece surface. When the lower rotating shaft 7 tilts the grinding disc 26, it drives the connecting ring 5 to move synchronously. The movement of the connecting ring 5 drives the telescopic tube 2 to tilt synchronously through the traction belt 3, ensuring that the lower end of the spray nozzle 29 can always be vertically above the workpiece surface. This means that the spray nozzle 29 can effectively and efficiently clean the workpiece surface, avoiding the situation where the workpiece surface is not thoroughly cleaned due to the misalignment of the spray nozzle 29.

[0077] As a further aspect of the present invention, the polishing component includes:

[0078] The movable frame 13 is slidably connected to the upper surface of the grinding mechanism 11, and the upper rotating shaft 31 is evenly distributed on the movable frame 13 and is rotatably connected to the movable frame 13.

[0079] The upper threaded rod 12 is rotatably mounted above the grinding mechanism 11, and is threadedly connected to the lower end of the movable frame 13.

[0080] Upper fixed plate 4 is fixedly installed at the lower end of lower rotating shaft 7;

[0081] Limiting spring 27 is fixedly installed between grinding disc 26 and upper fixed plate 4. Telescopic rods are fixedly installed between grinding disc 26 and upper fixed plate 4 at positions corresponding to limiting spring 27. Limiting spring 27 can ensure that grinding disc 26 always abuts against the surface of workpiece.

[0082] Drive unit one is located at one end of the upper threaded rod 12. Drive unit one can drive the upper threaded rod 12 to rotate in both directions.

[0083] Drive unit two is mounted on the movable frame 13 and can drive multiple sets of upper rotating shafts 31 to rotate simultaneously.

[0084] During operation, drive unit one drives (the second motor drives the upper threaded rod 12 on one side to rotate, and the rotation of the upper threaded rod 12 drives the upper threaded rods 12 on both sides to rotate through the side transmission component 19. The upper threaded rod 12 interacts with the movable frame 13, thereby driving the movable frame 13 to move on the grinding mechanism 11). The movable frame 13 moves on the grinding mechanism 11. Drive unit two drives the upper rotating shaft 31 to rotate (the motor drives the first gear 30 to rotate, the rotation of the first gear 30 drives the second gear 32 that meshes with it to rotate, the rotation of the second gear 32 drives a set of upper rotating shafts 31 to rotate, and the rotation of the upper rotating shafts 31 drives multiple sets of upper rotating shafts 31 to rotate simultaneously through the upper transmission component 28). The rotation of the upper rotating shaft 31 drives the lower rotating shaft 7 to rotate along its own axis through the universal joint 6. The rotation of the lower rotating shaft 7 then drives the grinding disc 26 to rotate. The grinding disc 26 rotates to grind the surface of the substrate. The grinding disc 26 automatically abuts against the surface of the substrate under the action of the limiting spring 27.

[0085] As a further aspect of the present invention, the transfer mechanism includes:

[0086] The main thread rod 17 is symmetrically installed at the bottom of the equipment body 1, and one end of the main thread rod 17 extends into the grinding mechanism 11;

[0087] The movable positioning seat 16 is slidably disposed within the grinding mechanism 11 and the equipment body 1. Internal threaded parts 20 are rotatably installed on the movable positioning seat 16 at positions corresponding to the main threaded rod 17.

[0088] A water seepage hole 24 is provided on the movable positioning seat 16. The water seepage hole 24 allows the water sprayed from the spray nozzle 29 to flow out of the grinding mechanism 11 through the water seepage hole 24.

[0089] The drive mechanism includes a driven gear 21, which has multiple sets and is fixedly installed on one end of the internal threaded part 20. A drive gear 23 is rotatably installed on the side of the moving positioning seat 16 corresponding to the driven gear 21. The drive gear 23 meshes with the driven gear 21. An internal transmission part 22 is provided between the drive gears 23. A rotary motor is fixedly installed on the moving positioning seat 16. The output end of the rotary motor is fixedly connected to the drive gear 23.

[0090] During operation, the rotating motor drives the drive gear 23 to rotate. The drive gear 23 rotates simultaneously under the action of the internal transmission component 22. The rotation of the drive gear 23 drives the driven gear 21 that meshes with it to rotate. The rotation of the driven gear 21 drives the internal thread component 20 to rotate. The rotation of the internal thread component 20 interacts with the main thread rod 17, thereby moving the positioning seat 16 back and forth between the equipment body 1 and the grinding mechanism 11 to complete the conveying of the substrate and the cover plate.

[0091] As a further aspect of the present invention, the positioning component includes:

[0092] Limiting groove 33 is provided on both sides of the upper surface of the movable positioning seat 16, and the lower end of the clamping plate 18 is embedded in the limiting groove 33 and slidably connected with the limiting groove 33.

[0093] The lower threaded rod 38 is rotatably installed in the limiting groove 33 and is threadedly connected to the clamping plate 18.

[0094] The drive assembly includes an extension shaft 36, which is rotatably mounted on both sides of the movable positioning seat 16 at positions corresponding to the lower threaded rod 38. A vertical transmission component 37 is provided between the extension shaft 36 and the lower threaded rod 38, and a horizontal transmission component 25 is provided between the extension shafts 36. A first motor is fixedly installed inside the movable positioning seat 16, and the output end of the first motor is fixedly connected to the extension shaft 36.

[0095] During operation, after the workpiece or substrate is placed on the movable positioning seat 16, the first motor drives the extension shaft 36 to rotate. The two extension shafts 36 are simultaneously rotated under the action of the horizontal transmission component 25. The rotation of the extension shaft 36 drives the lower threaded rod 38 to rotate through the vertical transmission component 37. The lower threaded rod 38 interacts with the clamping plate 18. The rotation of the lower threaded rod 38, which is a bidirectional threaded rod, drives the clamping plate 18 to move closer to each other, thereby making the clamping plate 18 close together to clamp and fix the substrate, preventing the substrate from shifting horizontally or vertically during the grinding process and ensuring the grinding effect.

[0096] As a further aspect of the present invention, the driving unit one includes:

[0097] Side transmission component 19 is located at the end of the upper threaded rod 12 away from the main body 1 of the equipment. The side transmission component 19 can drive the upper threaded rods 12 on both sides to rotate synchronously.

[0098] The second motor is fixedly installed at the end of the grinding mechanism 11 away from the main body 1 of the equipment. The output end of the second motor is fixedly connected to the upper threaded rod 12. The second motor is a bidirectional motor.

[0099] During operation, the second motor drives the upper threaded rod 12 on one side to rotate. The rotation of the upper threaded rod 12 drives the upper threaded rods 12 on both sides to rotate through the action of the side transmission component 19. The upper threaded rod 12 interacts with the movable frame 13, thereby driving the movable frame 13 to move on the grinding mechanism 11. The movement of the movable frame in turn drives the grinding components on it to move, thereby driving the grinding discs 26 arranged in a "I" shape to move on the surface of the workpiece, and driving the grinding discs 26 to grind the surface of the workpiece comprehensively.

[0100] As a further aspect of the present invention, the driving unit two includes:

[0101] The upper transmission component 28 is disposed between the upper rotating shafts 31, and the upper transmission component 28 can drive multiple sets of upper rotating shafts 31 to rotate synchronously.

[0102] The second gear 32 is fixedly mounted on the rotating shaft 31 on the edge;

[0103] The first gear 30 is rotatably mounted on the movable frame 13, and the first gear 30 meshes with the second gear 32.

[0104] During operation, the motor drives the first gear 30 to rotate, the rotation of the first gear 30 drives the second gear 32 meshing with it to rotate, the rotation of the second gear 32 drives a set of upper rotating shafts 31 to rotate, and the rotation of the upper rotating shafts 31 drives multiple sets of upper rotating shafts 31 to rotate simultaneously through the upper transmission component 28.

[0105] As a further embodiment of the present invention, a positioning frame 8 is provided above the grinding mechanism 11, a cylinder 9 is fixedly installed on the upper surface of the positioning frame 8, a stamping plate 10 is fixedly installed at the output end of the cylinder 9, and a plurality of water seepage grooves are provided on the lower surface of the grinding mechanism 11.

[0106] During operation, as the main thread rod 17 rotates and drives the moving positioning seat 16 to move into the main body 1 of the equipment, the cylinder 9 drives the stamping plate 10 to move continuously downward. The stamping plate 10 presses the stacked substrate and cover plate together, making the substrate and cover plate more tightly pressed together and improving the yield.

[0107] As a further embodiment of the present invention, an internally threaded rod 34 is rotatably installed inside the main body 1, and a laser 35 is threadedly connected to the internally threaded rod 34. A driving component is provided on one side inside the main body 1, and the driving component can drive the internally threaded rod 34 to rotate.

[0108] During operation, the drive assembly drives the internal thread rod 34 to rotate, and the internal thread rod 34 drives the laser 35 to move, thereby controlling the laser 35 to bond the substrate and the cover plate.

Claims

1. An ultrafast laser bonding sapphire device, comprising a main body (1), a grinding mechanism (11), and a transfer mechanism, wherein the transfer mechanism is capable of transferring the workpiece after grinding and rinsing by the grinding mechanism (11) into the main body (1), characterized in that: The grinding mechanism (11) is located on one side of the main body of the equipment (1) and includes a positioning component, a grinding component and a rinsing component. Positioning components: The positioning components are symmetrically arranged on both sides of the transfer mechanism. The positioning components include a clamping plate (18). The clamping plate (18) is slidably arranged on the transfer mechanism and can fix the workpiece in the center on the transfer mechanism. Grinding assembly: The grinding assembly is slidably disposed on the grinding mechanism (11) and can reciprocate on the grinding mechanism (11). The grinding assembly includes: multiple grinding units, which are arranged in a "I" shape along the direction perpendicular to the moving path of the transfer mechanism. Each of the polishing units includes: The upper rotating shaft (31) is provided in multiple sets and the multiple sets of upper rotating shafts (31) are evenly distributed; The lower rotating shaft (7) is also provided in multiple sets and corresponds one-to-one with the upper rotating shaft (31). A universal joint (6) is provided between the upper end of the lower rotating shaft (7) and the upper rotating shaft (31). The universal joint (6) can adjust the tilt angle between the lower rotating shaft (7) and the upper rotating shaft (31) so that the lower surface of the lower rotating shaft (7) can be kept horizontal with the inclined workpiece surface of the upper surface. The universal joint (6) can drive the lower rotating shaft (7) to rotate along its axis when the upper rotating shaft (31) rotates. A grinding disc (26) is disposed at the lower end of the lower rotating shaft (7), and the lower surface of the grinding disc (26) can automatically and fully abut against the upper surface of the workpiece; a rinsing assembly is disposed above the grinding disc (26) and can move synchronously with the grinding assembly, the rinsing assembly comprising: Connector (15), the connector (15) is fixedly installed on the upper end of the spray nozzle (29), and a suction pump is provided inside the connector (15); Water pipe (14), the water pipe (14) is fixedly installed on one side of the connector (15), and the end of the water pipe (14) away from the connector (15) is led into the water storage tank; Spray nozzles (29) are provided in multiple sets and are staggered between the upper rotating shaft (31). The spray nozzles (29) are fixedly installed on the movable frame (13). The lower end of the spray nozzles (29) can tilt in the same direction as the angle of the lower rotating shaft (7) changes. The telescopic tube (2) is provided in multiple sets and is fixedly installed at the lower end of the spray nozzle (29). The telescopic tube (2) is located below the movable frame (13). The traction belt (3) is fixedly installed at the lower end of the telescopic tube (2), and the traction belt (3) can pull the telescopic tube (2) to bend and move; A connecting ring (5) is fixedly installed at one end of the traction belt (3) away from the retractable tube (2). The connecting ring (5) is rotatably connected to the lower rotating shaft (7) and can move with the lower rotating shaft (7). The grinding assembly includes: The movable frame (13) is slidably connected to the upper surface of the grinding mechanism (11), and the upper rotating shaft (31) is evenly distributed on the movable frame (13) and is rotatably connected to the movable frame (13). The upper threaded rod (12) is rotatably mounted above the grinding mechanism (11), and the upper threaded rod (12) is threadedly connected to the lower end of the movable frame (13); Upper fixed plate (4), the upper fixed plate (4) is fixedly installed at the lower end of the lower rotating shaft (7); A limiting spring (27) is fixedly installed between the grinding disc (26) and the upper fixed disc (4). Telescopic rods are fixedly installed between the grinding disc (26) and the upper fixed disc (4) at positions corresponding to the limiting spring (27). When the limiting spring (27) is in its natural state, the grinding disc (26) is at the bottom of the grinding mechanism (11). Drive unit one is disposed at one end of the upper threaded rod (12), and the drive unit one can drive the upper threaded rod (12) to rotate in both directions; Drive unit two is installed on the movable frame (13) and can drive multiple sets of upper rotating shafts (31) to rotate simultaneously; The second driving unit includes: An upper transmission member (28) is disposed between the upper rotating shafts (31), and the upper transmission member (28) can drive multiple sets of upper rotating shafts (31) to rotate synchronously; The second gear (32) is fixedly mounted on the upper rotating shaft (31) at the edge; The first gear (30) is rotatably mounted on the movable frame (13), and the first gear (30) meshes with the second gear (32).

2. The ultrafast laser bonding sapphire device according to claim 1, characterized in that: The transfer mechanism includes: The main thread rod (17) is symmetrically installed at the bottom of the equipment body (1), and one end of the main thread rod (17) extends into the grinding mechanism (11); The movable positioning seat (16) is slidably disposed in the grinding mechanism (11) and the equipment body (1). The movable positioning seat (16) is rotatably installed with internal threaded parts (20) at the positions corresponding to the main thread rod (17). Water seepage hole (24) is provided on the movable positioning seat (16). The water seepage hole (24) allows the water sprayed by the spray nozzle (29) to flow out of the water seepage hole (24) to the outside of the grinding mechanism (11). The driving mechanism includes a driven gear (21), which has multiple sets and is fixedly installed on one end of the internal threaded part (20). A driving gear (23) is rotatably installed on the moving positioning seat (16) on the side corresponding to the driven gear (21). The driving gear (23) meshes with the driven gear (21). An internal transmission member (22) is provided between the driving gears (23). A rotating motor is fixedly installed on the moving positioning seat (16). The output end of the rotating motor is fixedly connected to the driving gear (23).

3. The ultrafast laser bonding sapphire device according to claim 2, characterized in that: The positioning component includes: Limiting groove (33), the limiting groove (33) is provided on both sides of the upper surface of the movable positioning seat (16), and the lower end of the clamping plate (18) is embedded in the limiting groove (33) and slidably connected to the limiting groove (33); The lower threaded rod (38) is rotatably installed in the limiting groove (33) and is threadedly connected to the clamping plate (18). The drive assembly includes an extension shaft (36), which is rotatably mounted on both sides of the movable positioning seat (16) corresponding to the lower threaded rod (38). A vertical transmission member (37) is provided between the extension shaft (36) and the lower threaded rod (38), and a horizontal transmission member (25) is provided between the extension shafts (36). A first motor is fixedly installed inside the movable positioning seat (16), and the output end of the first motor is fixedly connected to the extension shaft (36).

4. The ultrafast laser bonding sapphire device according to claim 3, characterized in that: The drive unit one includes: Side transmission component (19), the side transmission component (19) is disposed at one end of the upper threaded rod (12) away from the main body of the equipment (1), the side transmission component (19) can drive the upper threaded rods (12) on both sides to rotate synchronously; The second motor is fixedly installed at one end of the grinding mechanism (11) away from the main body (1) of the equipment. The output end of the second motor is fixedly connected to the upper threaded rod (12). The second motor is a bidirectional motor.

5. The ultrafast laser bonding sapphire device according to claim 1, characterized in that: A positioning frame (8) is provided above the grinding mechanism (11). A cylinder (9) is fixedly installed on the upper surface of the positioning frame (8). A stamping plate (10) is fixedly installed at the output end of the cylinder (9). Multiple water seepage grooves are provided on the lower surface of the grinding mechanism (11).

6. The ultrafast laser bonding sapphire device according to claim 1, characterized in that: An internal threaded rod (34) is rotatably installed inside the main body (1) of the device. A laser (35) is threaded onto the internal threaded rod (34). A driving component is provided on one side inside the main body (1), and the driving component can drive the internal threaded rod (34) to rotate.

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