Feeding mechanism, electronic component packaging apparatus, and packaging method

Abstract

The application discloses a feeding mechanism, an electronic component packaging device and a packaging method. The feeding mechanism comprises a material receiving frame, a frame grabbing assembly, a pressing assembly and a film clamping assembly. The film clamping assembly comprises two clamping pieces. The clamping piece comprises a clamping part and a clamping finger part. The distance between the clamping parts of the two clamping pieces is greater than the width of the material receiving frame and less than the width of the release film. The clamping finger part comprises an open state away from the lower surface of the clamping part and a clamping state close to the lower surface of the clamping part. In the open state, the distance between the clamping finger parts of the two clamping pieces is greater than the width of the release film. In the clamping state, the distance between the clamping finger parts of the two clamping pieces is less than the width of the release film. The feeding mechanism, the electronic component packaging device and the packaging method provided by the application avoid unnecessary contact with the release film through the design of the clamping finger part of the film clamping assembly, and reduce the curling and wrinkling of the release film caused by mechanical interference.

Description

Technical Field

[0001] This invention belongs to the field of electronic component packaging technology, specifically relating to a feeding mechanism, electronic component packaging equipment, and packaging method. Background Technology

[0002] In modern electronic devices, chip packaging technology is of paramount importance. Packaging technology not only protects chips from external environmental influences but also enhances their mechanical strength, improves heat dissipation, and ensures reliability and stability during use. Among existing chip packaging technologies, compression molding is widely used due to its ability to achieve high-precision packaging results.

[0003] The basic principle of compression molding is that in a packaging device, resin particles are supplied to a molding die and heated to melt the resin particles into molten resin. Next, the molding die is closed, immersing the chip on the substrate in the molten resin. Pressure is applied to the molten resin through the molding die, causing it to harden and form hardened resin, thereby encapsulating the chip on the substrate.

[0004] Despite the significant advantages of compression molding in chip packaging, several technical challenges remain in practical applications. Among these, the uniformity of resin material supply is particularly prominent. Specifically, uneven distribution of resin particles during the feeding of the molding die can lead to uneven distribution of molten resin within the die during packaging, resulting in packaging defects. These defects may manifest as voids, air bubbles, or incomplete filling within the package, severely impacting packaging yield and the performance of the packaged chip.

[0005] Therefore, it is necessary to provide a new solution to the above-mentioned technical problems. Summary of the Invention

[0006] The purpose of this invention is to provide a feeding mechanism, electronic component packaging equipment and packaging method, which are capable of...

[0007] To achieve the above objectives, the technical solution provided by the present invention is as follows:

[0008] In a first aspect, the present invention provides a feeding mechanism, comprising:

[0009] A material receiving frame has a through hole running vertically through it. The material receiving frame is provided with an adsorption member for adsorbing a release film onto the lower surface of the material receiving frame. When the release film is adsorbed onto the lower surface of the material receiving frame, it covers the lower side of the through hole, and the periphery of the release film extends beyond both sides of the material receiving frame.

[0010] A frame gripping component is used to grip the material receiving frame. When the frame gripping component grips the material receiving frame, it can interfere with the material receiving frame in the vertical direction.

[0011] The pressing component is used to press the material receiving frame when the frame gripping component grips the material receiving frame, so that the frame gripping component and the pressing component cooperate to clamp and fix the material receiving frame in the vertical direction;

[0012] The film clamping assembly includes two clamping members respectively disposed on both sides of the frame gripping assembly. Each clamping member includes a clamping part and a clamping finger part that can move relative to each other to cooperate in clamping the upper and lower surfaces of the periphery of the release film. The distance between the clamping parts of the two clamping members is greater than the width of the material receiving frame and less than the width of the release film. The clamping finger part includes an open state when it is away from the lower surface of the clamping part and a clamping state when it is close to the lower surface of the clamping part.

[0013] In the open state, the distance between the clamping fingers of the two clamping members is greater than the width of the release film; in the clamping state, the distance between the clamping fingers of the two clamping members is less than the width of the release film.

[0014] In one or more embodiments, a membrane tension member is provided in the through hole of the material receiving frame, the membrane tension member is vertically and flexibly disposed on the inner side of the material receiving frame, and the membrane tension member can be lowered to exceed the lower surface of the material receiving frame.

[0015] In one or more embodiments, the box gripping assembly includes two grippers that can move closer to each other to grip the material receiving box and move further apart to release the material receiving box.

[0016] In one or more embodiments, the two grippers are provided with slots, the opening directions of the slots on the two grippers are opposite, the material receiving frame is provided with a holding part corresponding to the slot, and the two grippers are brought close to each other so that the holding part is held in the slot.

[0017] In one or more embodiments, the outer side of the holding portion is provided with a clearance groove for avoiding the gripper.

[0018] In one or more embodiments, the pressing assembly includes a liftable pressing plate and a drive member for driving the pressing plate to move up and down; when the frame gripping assembly grips the material receiving frame, the pressing plate can abut against the upper surface of the material receiving frame under the movement of the drive member.

[0019] In one or more embodiments, the pressing plate is provided with a negative pressure connector for connecting a negative pressure source, and the adsorption component includes a negative pressure interface and an adsorption hole communicating with the negative pressure interface, the adsorption hole penetrating the lower surface of the material receiving frame; when the pressing plate abuts against the upper surface of the material receiving frame, the negative pressure connector is connected to the negative pressure interface.

[0020] In one or more embodiments, the finger clamping portion is rotatably disposed on the clamping portion, and rotating the finger clamping portion can move the finger clamping portion away from or closer to the lower surface of the clamping portion, so that the finger clamping portion can switch between an open state and a clamping state.

[0021] Secondly, the present invention provides an electronic component packaging device, comprising: a molding mold, a mold closing mechanism, a feeding mechanism, and the aforementioned loading mechanism; the molding mold includes an upper mold and a lower mold disposed opposite to each other, the lower mold having a cavity; the mold closing mechanism is used to close the upper mold and the lower mold; the feeding mechanism is used to supply packaging material to the material receiving frame of the loading mechanism when a release film is covered on the lower surface of the material receiving frame of the loading mechanism, so that the packaging material is carried on the release film; the loading mechanism is used to transport the release film and the packaging material carried on the release film to the cavity.

[0022] Thirdly, the present invention provides an electronic component packaging method, the method being applied to the aforementioned electronic component packaging equipment, the method comprising:

[0023] A material receiving frame is configured on the release film so that the release film can cover the lower surface of the material receiving frame and the lower side of the material receiving frame hole, and the periphery of the release film extends beyond both sides of the material receiving frame.

[0024] The encapsulation material is supplied into the through hole of the material receiving frame through the feeding mechanism, so that the encapsulation material is supported on the release film.

[0025] After moving the frame gripping assembly, pressing assembly, and film clamping assembly to align above the material receiving frame, lower the frame gripping assembly, pressing assembly, and film clamping assembly to a position where they can cooperate with the material receiving frame to grip, so that the lower surface of the clamping part of the film clamping assembly is close to the upper surface of the periphery of the release film; wherein, during the descent, the clamping fingers of the film clamping assembly are in an open state;

[0026] The start frame gripping component grips the material receiving frame, and the pressing component is pressed down to make the gripping component and the pressing component cooperate to clamp and fix the material receiving frame in the vertical direction, and the adsorption component of the material receiving frame adsorbs the release film onto the lower surface of the material receiving frame.

[0027] Switch the finger clamping part to the clamping state, clamping the periphery of the release film between the clamping part and the finger clamping part;

[0028] The moving feeding mechanism transports the release film and the packaging material carried on the release film to the cavity of the lower mold;

[0029] The adsorption component releases the release film, allowing the release film and the encapsulation material supported on the release film to be supplied into the cavity together.

[0030] Compared with the prior art, the feeding mechanism, electronic component packaging equipment and packaging method provided by the present invention firmly adsorb the release film onto the material receiving frame through the adsorption component, and with the precise clamping of the film clamping component, the problem of uneven distribution of packaging material is effectively avoided; the coordinated work of the frame gripping component and the pressing component realizes the stable clamping of the material receiving frame in the vertical direction, reducing the instability factors in the handling process; the design of the clamping fingers of the film clamping component avoids unnecessary contact with the release film, reducing the curling and wrinkling of the release film caused by mechanical interference. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the feeding mechanism in a working state according to an embodiment of the present invention;

[0033] Figure 2 for Figure 1 The diagram shows a structural schematic of the feeding mechanism in another operating state.

[0034] Figure 3 This is a schematic diagram of the feeding mechanism in one embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the structure of a material receiving frame in one embodiment of the present invention;

[0036] Figure 5 for Figure 4 A cross-sectional view of the material receiving box shown;

[0037] Figure 6 for Figure 4 The material receiving box shown is a cross-sectional view in its usage state.

[0038] Figure 7 This is a schematic diagram of the clamping member in use according to an embodiment of the present invention;

[0039] Figure 8 for Figure 7A schematic diagram of the clamping component in another usage state is shown.

[0040] Figure 9 for Figure 7 The diagram shows the structure of the clamping device holding the release film.

[0041] Explanation of key figure labels:

[0042] 1-Material receiving frame, 11-Through hole, 12-Adsorption component, 121-Negative pressure interface, 122-Adsorption hole, 13-Membrane tension component, 131-Limiting part, 14-Protrusion, 15-Holding part, 16-Apartment opening, 2-Frame gripping assembly, 21-Gripper, 211-Slot, 3-Pressing assembly, 31-Pressing plate, 32-Driver, 33-Negative pressure connector, 4-Membrane clamping assembly 41-Clamping component, 42-Fixed base, 421-Clamping part, 43-Driver, 431-Telescopic rod, 432-Linkage base, 433-Pin, 44-Linkage structure, 45-First link, 46-Second link, 461-Intermediate part, 462-Finger clamping part, 463-Limiting groove, 464-Elastic clamping piece, 47-Third link, 5-Mounting base, 6-Release film, 7-Encapsulation material. Detailed Implementation

[0043] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0044] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0045] In the field of modern electronic component packaging, especially in chip packaging, compression molding is widely used due to its advantages of high precision and efficiency. However, existing compression molding methods face some technical challenges in practical applications, particularly the uniformity of resin particle supply. This problem manifests itself in the uneven distribution of resin particles during the supply process to the molding die. If the resin particles are not evenly distributed, it leads to uneven distribution of molten resin within the die during packaging, resulting in packaging defects such as voids, air bubbles, or incomplete filling within the package. These defects severely affect packaging yield and the performance of the packaged chip.

[0046] To overcome the aforementioned technical problems, this invention proposes a novel approach to the feeding mechanism. The core of this approach lies in ensuring that the release film remains flat and taut throughout the feeding process, thereby stably supporting the encapsulation material and guaranteeing the uniformity and consistency of the encapsulation material distribution throughout the entire feeding process.

[0047] Specifically, this invention designs a material receiving frame with a through hole and provides an adsorption component on its lower surface to firmly adsorb the release film onto the lower surface of the material receiving frame, ensuring that the release film covers the lower side of the through hole. A frame gripping component and a pressing component are designed, which, through vertical cooperation, ensure the stability of the material receiving frame during the loading process. A film clamping component is designed, including two clamping members, respectively located on both sides of the frame gripping component. These clamping members can clamp and tension the release film without interfering with the periphery of the release film, preventing curling or wrinkling of the release film and ensuring uniform distribution of the encapsulation material.

[0048] Please refer to Figures 1 to 9 As shown, the feeding mechanism in one embodiment of the present invention includes a material receiving frame 1, a frame gripping component 2, a pressing component 3, and a film clamping component 4. The frame gripping component 2, the pressing component 3, and the film clamping component 4 are mounted on the same mounting base 5, and can be driven to move synchronously by driving the mounting base 5.

[0049] Please refer to Figures 4 to 6 As shown, the material receiving frame 1 has a through hole 11 extending in the vertical direction. The material receiving frame 1 is provided with an adsorption member 12 for adsorbing the release film 6 onto the lower surface of the material receiving frame 1. When the release film 6 is adsorbed onto the lower surface of the material receiving frame 1, it covers the lower side of the through hole 11, and the periphery of the release film 6 extends beyond both sides of the material receiving frame 1.

[0050] The material receiving frame 1 can be made of high-strength, lightweight materials, such as aluminum alloy or engineering plastics, to ensure its durability under high temperature and pressure conditions. The adsorption component 12 can use negative pressure adsorption to ensure that the release film 6 will not fall off or shift during the loading process. The release film 6 covers the lower side of the through hole 11, and its periphery extends beyond both sides of the material receiving frame 1, providing operating space for subsequent clamping and handling. When the release film 6 covers the lower side of the through hole 11, it can together with the through hole 11 form a receiving space for containing the encapsulation material 7 (such as powdered or granular resin material).

[0051] Please refer to Figures 1 to 3As shown, the frame gripping component 2 is used to grip the material receiving frame 1. When the frame gripping component 2 grips the material receiving frame 1, it can interfere with the material receiving frame 1 in the vertical direction. The frame gripping component 2 can achieve vertical gripping of the material receiving frame 1 through a robotic arm or similar device. During the gripping process, the frame gripping component 2 interferes with the material receiving frame 1 in the vertical direction, ensuring the stability and accuracy of the gripping.

[0052] The frame gripping assembly 2 can adopt a mechanical clamping structure, including two grippers 21 that can move closer and further apart, and can achieve stable gripping of the material receiving frame 1 through a drive device (such as a cylinder or electric actuator). Anti-slip pads can be provided on the grippers 21 to improve gripping stability.

[0053] Please refer to Figures 1 to 3 As shown, the pressing component 3 is used to press the material receiving frame 1 when the frame gripping component 2 grips it, so that the frame gripping component 2 and the pressing component 3 cooperate to clamp and fix the material receiving frame 1 in the vertical direction. The pressing component 3 works in conjunction with the frame gripping component 2, and can apply appropriate pressure to the material receiving frame 1 through the liftable pressing plate 31 to prevent the material receiving frame 1 from shaking, displacing or tilting during the handling process, and to ensure the stability of the material receiving frame 1 during the handling process.

[0054] Please refer to Figures 1 to 3 As shown, the film clamping assembly 4 includes two clamping members 41 respectively disposed on both sides of the frame gripping assembly 2. Each clamping member 41 includes a clamping portion 421 and a clamping finger portion 462 that are relatively movable to clamp the upper and lower surfaces of the release film 6. The distance d1 between the clamping portions 421 of the two clamping members 41 is greater than the width d2 of the material receiving frame 1 and less than the width d3 of the release film 6. The clamping finger portion 462 includes an open state away from the lower surface of the clamping portion 421 and a clamping state close to the lower surface of the clamping portion 421. In the open state, the distance d4 between the clamping finger portions 462 of the two clamping members 41 is greater than the width d3 of the release film 6; in the clamping state, the distance d4 between the clamping finger portions 462 of the two clamping members 41 is less than the width d3 of the release film 6.

[0055] Please refer to Figure 1 and Figure 2 As shown, in the open state, the spacing between the clamping fingers 462 is greater than the width of the release film 6, avoiding interference with the release film 6; in the clamping state, the spacing between the clamping fingers 462 is less than the width of the release film 6, ensuring stable clamping of the release film 6. The spacing of the clamping parts 421 is designed to be greater than the width of the material receiving frame 1 and less than the width of the release film 6. This ensures that in the clamping state, the release film 6 is firmly clamped between the clamping parts 421 and the clamping fingers 462, while in the open state, the clamping fingers 462 will not interfere with the release film 6.

[0056] The clamping part 421 can be made of rubber or silicone material to provide sufficient friction and flexible protection to ensure that the release film 6 is not damaged during clamping. The clamping finger part 462 can switch between open and clamping states through a rotating mechanism.

[0057] During the loading process, the material receiving frame 1 is first placed on the release film 6, so that the release film 6 covers the lower surface of the material receiving frame 1 and the lower side of the through hole 11, ensuring that the encapsulation material 7 will not leak during processing. In addition, the periphery of the release film 6 extends beyond both sides of the material receiving frame 1, providing sufficient operating space for subsequent clamping and tensioning.

[0058] The encapsulation material 7 is supplied into the through hole 11 of the material receiving frame 1 by a feeding mechanism, so that the encapsulation material 7 is supported on the release film 6. The feeding mechanism may be designed to include a precision feeding device to ensure that the encapsulation material 7 (such as resin particles) is evenly distributed on the release film 6.

[0059] After the material is fed, the drive mounting base 5 moves the frame gripping component 2, the pressing component 3, and the film clamping component 4 above the material receiving frame 1, aligns them (so that the vertical projection of the material receiving frame 1 falls between the two clamping parts 421), and then begins to descend. The key to this step is to ensure that the three components can be accurately aligned with the material receiving frame 1 to avoid deviations in subsequent operations.

[0060] The frame gripping assembly 2, pressing assembly 3, and film clamping assembly 4 begin to descend synchronously until they reach a position where they can cooperate with the material receiving frame 1 to achieve gripping. During this process, the gripping fingers 462 of the film clamping assembly 4 are in an open state, so that the distance between the gripping fingers 462 is greater than the width of the release film 6. The purpose of this design is to avoid the gripping fingers 462 touching and interfering with the periphery of the release film 6 during the descent, and to prevent the release film 6 from curling or wrinkling due to interference.

[0061] After the frame gripping component 2 descends to its designated position, it activates to grip the material receiving frame 1. The frame gripping component 2 can grip the material receiving frame 1 through its gripping structure, ensuring that the material receiving frame 1 will not move throughout the entire loading process.

[0062] While the frame gripping component 2 grips the material receiving frame 1, the pressing component 3 begins to apply pressure. The pressing component 3 applies downward pressure to the material receiving frame 1 through its pressing structure, cooperating with the frame gripping component 2 to clamp and fix the material receiving frame 1 in the vertical direction. The function of the pressing component 3 is not only to fix the material receiving frame 1, but also to ensure that the release film 6 is firmly adsorbed on the lower surface of the material receiving frame 1, preventing loosening or displacement.

[0063] During the application of pressure by the pressing component 3, the adsorption component 12 can be connected to the negative pressure source to generate negative pressure, which adsorbs the release film 6 onto the lower surface of the material receiving frame 1. The negative pressure of the adsorption component 12 ensures that the release film 6 adheres tightly to the material receiving frame 1, covering the lower side of the through hole 11, and providing a flat carrier for the uniform distribution of the encapsulation material 7.

[0064] With the action of the frame gripping component 2 and the pressing component 3, the clamping fingers 462 of the film clamping component 4 switch to the clamping state. The clamping action of the clamping fingers 462 clamps the periphery of the release film 6 between the clamping parts 421 and the clamping fingers 462, ensuring that the release film 6 remains taut throughout the processing. The spacing between the clamping parts 421 is designed to be greater than the width of the material receiving frame 1 but less than the width of the release film 6, ensuring that the release film 6 is accurately clamped.

[0065] After completing the above series of operations, the entire loading mechanism begins to move. The loading mechanism transports the release film 6 and the encapsulation material 7 supported on the release film 6 to the cavity of the lower mold. The movement process maintains stability and precision to ensure that the release film 6 and the encapsulation material 7 on it do not shift or tilt, thus affecting subsequent encapsulation operations.

[0066] After the feeding mechanism delivers the release film 6 and the encapsulation material 7 to the cavity of the lower mold, the adsorption component 12 releases its adsorption on the release film 6. At this time, the release film 6 and the encapsulation material 7 on it are supplied into the cavity together, ready for the encapsulation molding operation. The process of releasing the adsorption needs to ensure that the release film 6 can be smoothly separated from the material receiving frame 1 and accurately fall into the cavity of the lower mold, avoiding material scattering or uneven distribution.

[0067] After the release film 6 and the encapsulation material 7 are accurately placed into the cavity of the lower mold, further processing and molding operations can be performed. This step typically involves closing the mold, heating the encapsulation material 7 to melt it, and molding it under certain pressure to finally form the encapsulated electronic component.

[0068] In one exemplary embodiment, please refer to Figures 4 to 6 As shown, a membrane tension member 13 is provided in the through hole 11 of the material receiving frame 1. The membrane tension member 13 is vertically and vertically disposed on the inner side of the material receiving frame 1, and the membrane tension member 13 can be lowered to exceed the lower surface of the material receiving frame 1.

[0069] The membrane tension member 13 is vertically and flexibly disposed on the inner side of the material receiving frame 1. Its main function is to adjust the tension of the release membrane 6 through its lifting and lowering motion. When the membrane tension member 13 descends beyond the lower surface of the material receiving frame 1, it applies downward pressure to the release membrane 6. This pressure causes the release membrane 6 to adhere tightly to the lower surface of the membrane tension member 13, thereby maintaining the release membrane 6 in a taut state. The design of the membrane tension member 13 must ensure that its surface is smooth to avoid friction or damage when pressing the release membrane 6. The surface of the membrane tension member 13 can be coated with a low-friction material, such as polytetrafluoroethylene (PTFE), to reduce friction between the release membrane 6 and the member and improve the membrane tensioning effect.

[0070] After the membrane tension member 13 presses down on the release film 6, it not only makes the release film 6 adhere tightly to its lower surface, but also effectively blocks the lateral movement of the encapsulation material 7 on the release film 6, thereby preventing the encapsulation material 7 from entering between the lower surface of the material receiving frame 1 and the upper surface of the release film 6, ensuring that the encapsulation material 7 can be evenly distributed on the release film 6, and avoiding encapsulation defects caused by uneven material distribution.

[0071] Specifically, please refer to Figure 5 and Figure 6 As shown, the inner side of the material receiving frame 1 has a protruding portion 14 for restricting the descent of the membrane tension member 13, and the protruding portion 14 is disposed near the lower surface of the material receiving frame 1. The outer side of the membrane tension member 13 has a limiting portion 131 corresponding to the protruding portion 14, and the limiting portion 131 cooperates with the protruding portion 14 to restrict the descent of the membrane tension member 13.

[0072] The main function of the protrusion 14 is to ensure that the membrane tension member 13 remains in a predetermined position during descent, preventing damage or malfunction of the release membrane 6 caused by excessive descent of the membrane tension member 13. The protrusion 14 can be fixed to the inner side of the material receiving frame 1 by integral molding or post-installation. Its shape and size match the design of the membrane tension member 13 to ensure that it can effectively limit the descent of the membrane tension member 13.

[0073] The outer surface of the membrane tension member 13 is provided with a limiting part 131 corresponding to the protrusion 14 of the material receiving frame 1. The limiting part 131 cooperates with the protrusion 14 to ensure that the membrane tension member 13 stops descending after reaching a predetermined position. The main function of the limiting part 131 is to provide a physical restriction to prevent the membrane tension member 13 from descending excessively.

[0074] In one exemplary embodiment, please refer to Figures 1 to 3 As shown, the frame gripping assembly 2 includes two grippers 21 that can move closer to each other and further apart. The two grippers 21 move closer to each other to grip the material receiving frame 1 and move further apart to release the material receiving frame 1.

[0075] The frame gripping assembly 2 is the component in the entire feeding mechanism used to grip and release the material receiving frame 1. Two grippers 21 are designed to move closer and further apart to achieve gripping and releasing actions. The grippers 21 can be made of high-strength materials, such as stainless steel or aluminum alloy, to ensure their durability and reliability during frequent operation. The inner surface of the grippers 21 can be reinforced with anti-slip material, such as rubber pads, to enhance gripping stability. The approaching and moving movements of the grippers 21 can be controlled by a drive mechanism. The drive mechanism can include cylinders, servo motors, or electric actuators. These drive mechanisms provide precise control and rapid response to ensure smooth and accurate movement of the grippers 21.

[0076] Specifically, please refer to Figure 2 As shown, the two grippers 21 are provided with slots 211, and the opening directions of the slots 211 on the two grippers 21 are opposite. The material receiving frame 1 is provided with a holding part 15 corresponding to the slot 211. The two grippers 21 are close to each other so that the holding part 15 can be held in the slot 211.

[0077] The openings of the slots 211 face each other to ensure that the gripping parts 15 of the material receiving frame 1 can be gripped simultaneously when the grippers 21 approach each other. The shape and size of the gripping parts 15 need to match the slots 211 on the grippers 21 to ensure that the gripping parts 15 can smoothly engage in the slots 211 when the grippers 21 approach each other, thus achieving gripping.

[0078] When the gripping component 2 descends to a position where it can cooperate with the material receiving box 1 to grip, the slot 211 on the gripper 21 corresponds to the holding part 15 on the material receiving box 1, so that when the two grippers 21 approach each other, the holding part 15 can be engaged in the slot 211 to grip the material receiving box 1.

[0079] Specifically, please refer to Figures 2 to 4 As shown, in order to prevent the gripper 21 from colliding with the material receiving box 1 during gripping and releasing, the outer side of the holding part 15 is provided with a clearance opening 16 for avoiding the gripper 21. The clearance opening 16 can provide enough space for the gripper 21 to move, ensuring that the gripper 21 does not collide with the material receiving box 1 during gripping and releasing.

[0080] In one exemplary embodiment, please refer to Figures 1 to 3 As shown, the pressing assembly 3 includes a lifting pressing plate 31 and a driving member 32 for driving the pressing plate 31 to rise and fall; when the frame gripping assembly 2 grips the material receiving frame 1, the pressing plate 31 can abut against the upper surface of the material receiving frame 1 under the movement of the driving member 32.

[0081] The pressing component 3 is used in the feeding mechanism to further fix the material receiving frame 1 after it has been gripped by the frame gripping component 2. The pressing component 3 includes a liftable pressing plate 31 and a driving component 32. The pressing plate 31 can be raised and lowered under the action of the driving component 32 and presses against the upper surface of the material receiving frame 1, thereby achieving stable pressing of the material receiving frame 1.

[0082] The surface of the pressing plate 31 can be padded with a flexible pad, such as rubber or silicone, to avoid damage to the surface of the material receiving frame 1. The pressing plate 31 needs to be designed to be flat and have sufficient area to ensure that pressure can be applied evenly during pressing, thus ensuring the stability of the material receiving frame 1.

[0083] After the frame gripping component 2 grips the material receiving frame 1, the pressing plate 31 of the pressing component 3 begins to move, slowly descending under the action of the driving component 32 until it abuts against the upper surface of the material receiving frame 1. The main function of the pressing plate 31 is to keep the material receiving frame 1 stable by applying downward pressure, preventing it from moving or tilting during subsequent operations.

[0084] Specifically, please refer to Figure 3 and Figure 5 As shown, the pressing plate 31 is provided with a negative pressure connector 33 for connecting a negative pressure source. The adsorption component 12 includes a negative pressure interface 121 and an adsorption hole 122 communicating with the negative pressure interface 121. The adsorption hole 122 penetrates the lower surface of the material receiving frame 1. When the pressing plate 31 abuts against the upper surface of the material receiving frame 1, the negative pressure connector 33 connects with the negative pressure interface 121 to form a complete negative pressure channel, thereby providing adsorption force through the negative pressure source.

[0085] In one exemplary embodiment, please refer to Figures 1 to 3 As shown, the finger clamping part 462 is rotatably provided on the clamping part 421. Rotating the finger clamping part 462 can move the finger clamping part 462 away from or closer to the lower surface of the clamping part 421, so that the finger clamping part 462 can switch between the open state and the clamping state.

[0086] The gripper 462 is a component rotatably mounted on the clamping part 421. Its main function is to switch between an open state and a gripping state through rotation. In the gripping state, the gripper 462 can firmly clamp the release film 6, while in the open state, it can release the release film 6, thereby completing the gripping and releasing operation. The gripper 462 is designed as a rotatable structure and can be connected to the clamping part 421 via a hinge or bearing to achieve flexible rotational movement.

[0087] The finger clamping part 462 switches between an open state and a clamping state by rotating. When the finger clamping part 462 rotates outward, it moves away from the lower surface of the clamping part 421, increasing the distance between the two finger clamping parts 462 and entering the open state; when the finger clamping part 462 rotates inward, it moves closer to the lower surface of the clamping part 421, decreasing the distance between the two finger clamping parts 462 and entering the clamping state.

[0088] In one exemplary embodiment, please refer to Figures 7 to 9 As shown, the clamping member 41 includes a fixed base 42, an actuator 43, and a linkage structure 44. The fixed base 42 has a clamping portion 421 at its bottom. The actuator 43 (which may be a pneumatic cylinder, hydraulic cylinder, electric cylinder, etc.) is fixed to the fixed base 42. The actuator 43 has a telescopic rod 431, and a linkage base 432 is fixedly connected to the telescopic rod 431. The linkage structure 44 includes a first linkage 45, a second linkage 46, and a third linkage 47. The first end of the first linkage 45 is hinged to the fixed base 42, and the second end is hinged to the middle portion 461 of the second linkage 46. One end of the second linkage 46 away from the clamping portion 421 is hinged to the linkage base 432, and the other end has a finger-clamping portion 462 for cooperating with the clamping portion 421 to clamp the release film 6. The second connecting rod 46 has a limiting groove 463 at one end away from the clamping part 421. A pin 433 is fixedly provided on the connecting rod base 432. The pin 433 is hinged in the limiting groove 463 and can slide along the limiting groove 463. One end of the third connecting rod 47 is hinged to the connecting rod base 432, and the other end is hinged to the middle of the first connecting rod 45.

[0089] When the telescopic rod 431 extends, the second end of the first connecting rod 45 can rotate toward the clamping part 421, thereby driving the second connecting rod 46 to move closer to the clamping part 421; and the second connecting rod 46 can rotate around the second end of the first connecting rod 45, thereby driving the finger clamping part 462 to move closer to the clamping part 421.

[0090] A limiting groove 463 is located at the end of the second link 46 furthest from the clamping part 421. Its main function is to provide a certain displacement space for the second link 46, allowing it to flexibly adjust its position during movement. Through the limiting groove 463, the second link 46 can smoothly transition between being near and far from the clamping part 421. The length and shape design of the limiting groove 463 need to be optimized according to specific motion requirements to ensure that the second link 46 has sufficient freedom of movement.

[0091] The function of pin 433 is to transmit the motion of connecting rod base 432 to the second connecting rod 46, and to achieve the displacement of the second connecting rod 46 through the sliding of limiting groove 463. When the actuator 43 drives the connecting rod base 432 to move, pin 433 slides in limiting groove 463, allowing the second connecting rod 46 to obtain a certain degree of displacement freedom. The design of pin 433 must ensure that it can slide smoothly in limiting groove 463, and it can be made of high-strength, low-friction materials, such as high-strength steel or alloys coated with low-friction materials.

[0092] Specifically, the third link 47 is configured such that when the telescopic rod 431 is at its first extended length, the angle between the third link 47 and the telescopic rod 431 is an obtuse angle. Figure 7 (Mean angle α); When the telescopic rod 431 is at its second extended length, the angle between the third link 47 and the telescopic rod 431 is an acute angle ( ). Figure 9 (middle angle α). When the telescopic rod 431 is at the first extension length, the finger clamping part 462 is away from the clamping part 421; when the telescopic rod 431 is at the second extension length, the finger clamping part 462 is close to the clamping part 421.

[0093] Please refer to Figure 7 As shown, when the telescopic rod 431 is at its first extended length, the entire film clamping mechanism is in its initial state. In this state, the telescopic rod 431 is relatively short, and the clamping fingers 462 are far from the clamping part 421. At this time, a large gap is maintained between the clamping fingers 462 and the clamping part 421, allowing the release film 6 to be freely placed or adjusted. When the telescopic rod 431 extends to its second extended length, the clamping fingers 462 come close to the clamping part 421, achieving clamping of the release film 6. In this state, the length of the telescopic rod 431 reaches its maximum, and the various components in the linkage structure 44 move in a coordinated manner, ensuring that the clamping fingers 462 and the clamping part 421 are tightly fitted together.

[0094] With the telescopic rod 431 at its first extended length (initial state), and the finger clamp 462 in position... Figure 7 When in the open state (as shown), the angle between the third link 47 and the telescopic rod 431 is an obtuse angle. This means that the line connecting the two hinge points of the third link 47 forms an angle greater than 90 degrees with the axis of the telescopic rod 431. In this state, the height of the hinge point (first hinge point 471) between the third link 47 and the link base 432 is higher than the height of the hinge point (second hinge point 472) between the third link 47 and the first link 45. At this time, the finger clamping part 462 is away from the clamping part 421, and the release film 6 can be freely placed or adjusted.

[0095] As the telescopic rod 431 extends, the angle between the third link 47 and the telescopic rod 431 begins to decrease. Since the distance between the first hinge point 471 and the second hinge point 472 is constant, the extension of the telescopic rod 431 causes the height of the first hinge point 471 to gradually decrease. When the height of the first hinge point 471 decreases to be level with the second hinge point 472 (e.g., ...), ... Figure 8 As shown, the angle between the third link 47 and the telescopic rod 431 becomes a right angle. During this process, the third link 47 pushes the first link 45 to rotate towards the clamping part 421, causing the second link 46 to also move towards the clamping part 421. The finger clamping part 462 gradually approaches the clamping part 421, preparing for subsequent clamping actions.

[0096] Please refer to Figure 9 As shown, as the telescopic rod 431 continues to extend, the angle between the third link 47 and the telescopic rod 431 further decreases, becoming an acute angle (less than 90 degrees). During this process, the height of the first hinge point 471 continues to decrease and becomes lower than the height of the second hinge point 472. Since the hinge point of the third link 47 and the first link 45 maintains a constant distance, the third link 47 pulls the first link 45 to rotate away from the clamping part 421. This movement causes the second link 46 to also move away from the clamping part 421. During this process, the clamping finger 462 continues to approach the clamping part 421, achieving clamping of the release film 6. The movement of the second link 46 away from the clamping part 421 not only causes the clamping finger 462 to clamp the release film 6, but also generates an outward pulling effect on the release film 6. This outward pulling effect further tightens the release film 6, ensuring that the surface of the release film 6 is flat. This tensioning effect is beneficial to the uniform distribution of resin material and avoids uneven distribution caused by the loosening of the release film 6.

[0097] Further, please refer to Figure 7 As shown, the clamping finger portion 462 has an elastic clamping piece 464 on the side near the clamping portion 421. The elastic clamping piece 464 is a component that cooperates with the clamping portion 421 to achieve film clamping. The elastic clamping piece 464 can be made of a highly elastic and wear-resistant material, such as spring steel or engineering plastics. The material selection must ensure that the elastic clamping piece 464 can maintain good elastic deformation capability and durability during frequent use. The shape design of the elastic clamping piece 464 needs to be optimized according to the characteristics of the release film 6 and the structure of the clamping portion 421 to ensure that it can fit tightly against the release film 6 during clamping and prevent the film from slipping or falling off.

[0098] Please refer to Figure 9As shown, when the telescopic rod 431 extends to a predetermined length, it can bring the clamping finger part 462 closer to the clamping part 421, and cause the elastic clamping piece 464 to abut against the clamping part 421, achieving a stable clamping function. The elastic clamping piece 464 has a certain elastic deformation function, which can better conform to the surface of the release film 6 when clamping it. The elastic deformation capability of the elastic clamping piece 464 allows it to automatically adjust the adhesion force during the clamping process to adapt to release films 6 of different thicknesses and materials.

[0099] One embodiment of the present invention provides an electronic component packaging device, comprising: a molding mold, a mold closing mechanism, a feeding mechanism, and the aforementioned loading mechanism. The molding mold includes an upper mold and a lower mold disposed opposite to each other, the lower mold having a cavity; the mold closing mechanism is used to close the upper mold and the lower mold; the feeding mechanism is used to supply packaging material to the material receiving frame of the loading mechanism when a release film is covered on the lower surface of the material receiving frame, so that the packaging material is supported on the release film; the loading mechanism is used to transport the release film and the packaging material supported on the release film to the cavity.

[0100] The mold-closing mechanism controls the closing and opening operations of the upper and lower molds via a drive device. During the encapsulation process, the mold-closing mechanism provides sufficient closing force to ensure a tight fit between the upper and lower molds, forming a sealed mold cavity. Under the action of the mold-closing mechanism, the molding die maintains the pressure and temperature of the mold cavity during the curing process of the encapsulation material, ensuring uniform curing and molding of the encapsulation material.

[0101] When the material receiving frame of the feeding mechanism is covered with a release film, the feeding mechanism supplies the encapsulation material to the material receiving frame. The feeding mechanism uses negative pressure to adsorb the release film, ensuring the uniformity of the encapsulation material during the conveying process. The cooperation between the feeding mechanism and the feeding mechanism ensures that the encapsulation material can be evenly distributed on the release film and accurately conveyed into the cavity of the lower mold by the feeding mechanism.

[0102] The feeding mechanism transports the release film and the encapsulation material supported on the release film into the cavity of the lower mold. After the upper and lower molds are closed, the encapsulation material solidifies and forms within the cavity.

[0103] In one embodiment of the present invention, an electronic component packaging method applied to the aforementioned electronic component packaging equipment is also provided, the method specifically including the following steps:

[0104] S1: A material receiving frame is disposed on the release film, such that the release film can cover the lower surface of the material receiving frame and the lower side of the material receiving frame hole, and the periphery of the release film extends beyond both sides of the material receiving frame.

[0105] S2: The encapsulation material is supplied into the through hole of the material receiving frame through the feeding mechanism, so that the encapsulation material is supported on the release film.

[0106] S3: After moving the frame gripping assembly, pressing assembly, and film clamping assembly to the top of the material receiving frame and aligning them, lower the frame gripping assembly, pressing assembly, and film clamping assembly to a position where they can cooperate with the material receiving frame to grip, so that the lower surface of the clamping part of the film clamping assembly is close to the upper surface of the periphery of the release film; wherein, during the descent, the clamping fingers of the film clamping assembly are in an open state;

[0107] S4: The start frame gripping component grips the material receiving frame, and the pressing component is pressed down to make the frame gripping component and the pressing component cooperate to clamp and fix the material receiving frame in the vertical direction, and the adsorption component of the material receiving frame adsorbs the release film onto the lower surface of the material receiving frame.

[0108] S5: Switch the finger clamping part to the clamping state, clamping the periphery of the release film between the clamping part and the finger clamping part;

[0109] S6: The moving feeding mechanism transports the release film and the packaging material carried on the release film to the cavity of the lower mold;

[0110] S7: Release the adsorption component from the release film, allowing the release film and the encapsulation material supported on the release film to be supplied into the cavity together.

[0111] S8: After the release film and encapsulation material are supplied into the cavity of the lower mold, the encapsulation material is heated to melt it;

[0112] S9: The upper and lower molds are closed to immerse the electronic components in molten encapsulation material. Pressure is applied to the molten encapsulation material through the molding die to harden the molten encapsulation material and encapsulate the electronic components.

[0113] The feeding mechanism, electronic component packaging equipment, and packaging method provided by this invention firmly adsorb the release film onto the material receiving frame through the adsorption component. With the precise clamping of the film clamping component, the problem of uneven distribution of packaging material is effectively avoided. The coordinated work of the frame gripping component and the pressing component realizes stable clamping of the material receiving frame in the vertical direction, reducing instability factors during the handling process. The design of the clamping fingers of the film clamping component avoids unnecessary contact with the release film, reducing release film curling and wrinkling caused by mechanical interference.

[0114] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0115] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A feeding mechanism, characterized in that, include: A material receiving frame has a through hole running vertically through it. The material receiving frame is provided with an adsorption member for adsorbing a release film onto the lower surface of the material receiving frame. When the release film is adsorbed onto the lower surface of the material receiving frame, it covers the lower side of the through hole, and the periphery of the release film extends beyond both sides of the material receiving frame. A membrane tension member is provided inside the through hole of the material receiving frame. The membrane tension member is vertically and flexibly disposed on the inner side of the material receiving frame, and the membrane tension member can be lowered to exceed the lower surface of the material receiving frame. A frame gripping component is used to grip the material receiving frame. When the frame gripping component grips the material receiving frame, it can interfere with the material receiving frame in the vertical direction. A pressing component is used to press the material receiving frame when the frame gripping component grips it, so that the frame gripping component and the pressing component cooperate to clamp and fix the material receiving frame in the vertical direction; the pressing component includes a liftable pressing plate and a driving member for driving the pressing plate to move up and down; when the frame gripping component grips the material receiving frame, the pressing plate can abut against the upper surface of the material receiving frame under the drive of the driving member; the pressing plate is provided with a negative pressure connector for connecting a negative pressure source, and the adsorption component includes a negative pressure interface and an adsorption hole communicating with the negative pressure interface, the adsorption hole penetrating the lower surface of the material receiving frame; when the pressing plate abuts against the upper surface of the material receiving frame, the negative pressure connector is connected to the negative pressure interface; The film clamping assembly includes two clamping members respectively disposed on both sides of the frame gripping assembly. Each clamping member includes a clamping part and a clamping finger part that can move relative to each other to cooperate in clamping the upper and lower surfaces of the periphery of the release film. The distance between the clamping parts of the two clamping members is greater than the width of the material receiving frame and less than the width of the release film. The clamping finger part includes an open state when it is away from the lower surface of the clamping part and a clamping state when it is close to the lower surface of the clamping part. In the open state, the distance between the clamping fingers of the two clamping members is greater than the width of the release film; in the clamping state, the distance between the clamping fingers of the two clamping members is less than the width of the release film.

2. The feeding mechanism according to claim 1, characterized in that, The frame gripping assembly includes two grippers that can move closer to each other and further apart, the two grippers moving closer to each other to grip the material receiving frame and moving further apart to release the material receiving frame.

3. The feeding mechanism according to claim 2, characterized in that, The two grippers are provided with slots, and the openings of the slots on the two grippers are opposite to each other. The material receiving frame is provided with a holding part corresponding to the slot. When the two grippers are brought close to each other, the holding part can be held in the slot.

4. The feeding mechanism according to claim 3, characterized in that, The outer side of the clamping part is provided with a clearance groove for avoiding the gripper.

5. The feeding mechanism according to claim 1, characterized in that, The finger clamping part is rotatably disposed on the clamping part. Rotating the finger clamping part can move the finger clamping part away from or closer to the lower surface of the clamping part, so that the finger clamping part can switch between an open state and a clamping state.

6. An electronic component packaging device, characterized in that, include: A molding die, a mold closing mechanism, a material feeding mechanism, and a loading mechanism as described in any one of claims 1 to 5; The molding die includes an upper die and a lower die arranged opposite to each other, and the lower die has a cavity; The mold closing mechanism is used to close the upper mold and the lower mold; The feeding mechanism is used to supply encapsulation material to the material receiving frame when the lower surface of the material receiving frame of the feeding mechanism is covered with a release film, so that the encapsulation material is supported on the release film. The feeding mechanism is used to transport the release film and the packaging material carried on the release film to the cavity.

7. An electronic component packaging method, said method being applied to the electronic component packaging equipment of claim 6, characterized in that, The method includes: A material receiving frame is disposed on the release film, such that the release film can cover the lower surface of the material receiving frame and the lower side of the through hole of the material receiving frame, and the periphery of the release film extends beyond both sides of the material receiving frame. The encapsulation material is supplied into the through hole of the material receiving frame through the feeding mechanism, so that the encapsulation material is supported on the release film. After moving the frame gripping assembly, pressing assembly, and film clamping assembly to align above the material receiving frame, lower the frame gripping assembly, pressing assembly, and film clamping assembly to a position where they can cooperate with the material receiving frame to grip, so that the lower surface of the clamping part of the film clamping assembly is close to the upper surface of the periphery of the release film; wherein, during the descent, the clamping fingers of the film clamping assembly are in an open state; The start frame gripping component grips the material receiving frame, and the pressing component is pressed down to make the gripping component and the pressing component cooperate to clamp and fix the material receiving frame in the vertical direction, and the adsorption component of the material receiving frame adsorbs the release film onto the lower surface of the material receiving frame. Switch the finger clamping part to the clamping state, clamping the periphery of the release film between the clamping part and the finger clamping part; The moving feeding mechanism transports the release film and the packaging material carried on the release film to the cavity of the lower mold; The adsorption component releases the release film, allowing the release film and the encapsulation material supported on the release film to be supplied into the cavity together.

Images