Display panel and its manufacturing method, display device

Abstract

This application relates to a display panel, a method for manufacturing the display panel, and a display device. The display panel includes a substrate, an isolation structure, and multiple light-emitting structures of different colors. The isolation structure has multiple spaced-apart isolation openings and includes conductive overlap portions and shielding portions sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion onto the substrate lies within the orthographic projection of the shielding portion onto the substrate. The sidewalls of the conductive overlap portion are inclined, and in a cross-section perpendicular to the substrate, the size of the conductive overlap portion gradually increases in the direction towards the substrate. The light-emitting structures are located within the isolation openings and include a light-emitting unit and a first electrode. The first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion. Among the different colored light-emitting structures, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode. This application can effectively improve the poor overlap of the first electrode.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] With the development of display technology, a technique has emerged that uses photolithography to pattern pixels. This technique is not limited by the precision of fine mirror masks (FMMs), and pixel density can be effectively improved.

[0003] However, when using photolithography to pattern pixels, poor cathode bonding often occurs. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel that can improve cathode bonding problems, a method for manufacturing the display panel, and a display device to address the aforementioned technical issues.

[0005] One embodiment of this application provides a display panel, including:

[0006] substrate;

[0007] An isolation structure is provided, comprising a plurality of isolation openings spaced apart, and the isolation structure includes a conductive overlap portion and a shielding portion sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion on the substrate is located within the orthographic projection of the shielding portion on the substrate, and the sidewall of the conductive overlap portion is inclined. On a cross section perpendicular to the substrate, the size of the conductive overlap portion gradually increases in the direction toward the substrate.

[0008] A light-emitting structure is located within the isolation opening and includes a light-emitting unit and a first electrode, wherein the first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion;

[0009] Furthermore, the display panel includes multiple light-emitting structures of different colors. Among the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode.

[0010] In one embodiment, the length by which the blocking portion protrudes relative to the conductive overlap portion in the direction facing the same isolation opening is the blocking length. In the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the corresponding blocking length.

[0011] In one embodiment, the isolation structure includes a support portion, the orthographic projection of the support portion on the substrate being located within the orthographic projection of the shielding portion on the substrate, and the surface of the support portion away from the substrate being connected to the shielding portion; the conductive overlap portion includes the support portion, and the first electrode is connected to the sidewall of the support portion;

[0012] Optionally, the isolation structure further includes an adhesive portion located between the support portion and the substrate;

[0013] Optionally, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the adhesive portion on the substrate;

[0014] Optionally, the orthographic projection of the adhesive portion on the substrate is located within the orthographic projection of the shielding portion on the substrate.

[0015] In one embodiment, the isolation structure includes an adhesive portion and a support portion, the support portion being located between the adhesive portion and the shielding portion, and the orthographic projections of the support portion and the adhesive portion on the substrate are both located within the orthographic projection of the shielding portion on the substrate; the conductive overlap portion includes the adhesive portion, and the first electrode is connected to the sidewall of the adhesive portion.

[0016] In one embodiment, the orthographic projection of the support portion on the substrate lies within the orthographic projection of the adhesive portion on the substrate, and the first electrode extends from the sidewall of the adhesive portion to the top surface of the adhesive portion away from the substrate.

[0017] In one embodiment, the substrate includes a pixel definition layer and a second electrode, the pixel definition layer covering the second electrode, and the pixel definition layer including a pixel opening exposing the second electrode, the pixel opening communicating with the isolation opening, and the isolation structure located on the pixel definition layer;

[0018] Optionally, the material of the pixel definition layer includes inorganic materials.

[0019] In the display panel provided in the above embodiments, in the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode. The greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode, the greater the thickness of the first electrode on the sidewall of the conductive overlap portion, thereby reducing the impedance between the first electrode and the conductive overlap portion. Therefore, by setting the light-emitting structure of different colors such that the thickness of the light-emitting unit is greater and the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode is greater, the thickness of the light-emitting unit and the inclination angle of the sidewall of the conductive overlap portion can be effectively matched, thereby effectively improving the problem of poor cathode overlap.

[0020] Another embodiment of this application provides a display panel, including:

[0021] substrate;

[0022] An isolation structure is provided, comprising a plurality of isolation openings spaced apart, and the isolation structure includes a conductive overlap portion and a shielding portion sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion on the substrate is located within the orthographic projection of the shielding portion on the substrate. In the direction toward the same isolation opening, the length by which the shielding portion protrudes relative to the conductive overlap portion is the shielding length.

[0023] A light-emitting structure is located within the isolation opening and includes a light-emitting unit and a first electrode. The first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion.

[0024] Furthermore, the display panel includes multiple light-emitting structures of different colors, and among the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the corresponding blocking length.

[0025] In one embodiment, the sidewall of the conductive overlap portion is inclined, and the size of the conductive overlap portion gradually increases in the direction toward the substrate on a cross section perpendicular to the substrate. In the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode.

[0026] In one embodiment, the isolation structure includes a support portion, the orthographic projection of the support portion on the substrate being located within the orthographic projection of the shielding portion on the substrate, and the surface of the support portion away from the substrate being connected to the shielding portion; the conductive overlap portion includes the support portion, and the first electrode is connected to the sidewall of the support portion;

[0027] Optionally, the isolation structure further includes an adhesive portion located between the support portion and the substrate;

[0028] Optionally, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the adhesive portion on the substrate;

[0029] Optionally, the orthographic projection of the adhesive portion on the substrate is located within the orthographic projection of the shielding portion on the substrate.

[0030] In one embodiment, the isolation structure includes an adhesive portion and a support portion, the support portion being located between the adhesive portion and the shielding portion, and the orthographic projections of the support portion and the adhesive portion on the substrate are both located within the orthographic projection of the shielding portion on the substrate; the conductive overlap portion includes the adhesive portion, and the first electrode is connected to the sidewall of the adhesive portion.

[0031] Optionally, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the adhesive portion on the substrate, and the first electrode extends from the sidewall of the adhesive portion to the top surface of the adhesive portion away from the substrate.

[0032] In one embodiment, the substrate includes a pixel definition layer and a second electrode, the pixel definition layer covering the second electrode, and the pixel definition layer including a pixel opening exposing the second electrode, the pixel opening communicating with the isolation opening, and the isolation structure located on the pixel definition layer;

[0033] Optionally, the material of the pixel definition layer includes inorganic materials.

[0034] In the display panel provided in the above embodiments, in the setting of light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the corresponding shielding length. With a fixed vapor deposition angle and isolation structure height, a greater shielding length results in a larger shielding area of ​​the vapor-deposited material on the light-emitting unit by the eaves of the shielding portion, a smaller climbing length of the light-emitting unit on the sidewall of the conductive overlap portion, and a greater length of the first electrode extending beyond the light-emitting unit and contacting the conductive overlap portion on the sidewall of the conductive overlap portion. This effectively reduces the impedance between the first electrode and the conductive overlap portion. Therefore, in the setting of light-emitting structures of different colors, a greater thickness of the light-emitting unit and a greater corresponding shielding length can effectively match the thickness of the light-emitting unit with the shielding length, thereby effectively improving the problem of poor cathode overlap.

[0035] Another embodiment of this application provides a method for manufacturing a display panel, comprising:

[0036] Provide substrate;

[0037] An initial isolation structure is formed on the substrate. The initial isolation structure includes a plurality of isolation openings spaced apart. The initial isolation structure includes a conductive overlap portion and a shielding portion sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion on the substrate is located within the orthographic projection of the shielding portion on the substrate.

[0038] Multiple light-emitting structures of different colors are sequentially formed within different isolation openings. Each light-emitting structure includes a light-emitting unit and a first electrode. The first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion. After multiple light-emitting structures of different colors are formed, the sidewall of the conductive overlap portion is inclined. On a cross-section perpendicular to the substrate, the size of the conductive overlap portion gradually increases in the direction toward the substrate. Among the different colored light-emitting structures, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode.

[0039] In one embodiment, in the initial isolation structure, the sidewall inclination angle of the conductive overlap within each isolation opening is the same.

[0040] The method of sequentially forming multiple light-emitting structures of different colors within different isolation openings includes:

[0041] A light-emitting material layer of the target color and a first electrode material layer are formed inside each of the isolation openings and above the shielding portion;

[0042] A patterned photoresist is formed to create an isolation opening covering the target color;

[0043] Wet etching is used to remove the first electrode material layer and the light-emitting material layer exposed by the patterned photoresist, and the conductive overlap portion exposed by the patterned photoresist is etched laterally. During the wet etching process, the etching rate is adjusted to increase the sidewall tilt angle of the conductive overlap portion exposed by the patterned photoresist.

[0044] In one embodiment, the length by which the shielding portion protrudes relative to the conductive overlap portion in the direction toward the isolation opening is the shielding length. During the wet etching process, the shielding length within the isolation opening exposed by the patterned photoresist is increased. Among the light-emitting structures of different colors, the thicker the light-emitting unit, the later it is formed.

[0045] In the display panel fabrication method provided in the above embodiments, in the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode. The greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode, the greater the thickness of the first electrode on the sidewall of the conductive overlap portion, thereby reducing the impedance between the first electrode and the conductive overlap portion. Therefore, by setting the light-emitting structure of different colors such that the thickness of the light-emitting unit is greater and the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode is greater, the thickness of the light-emitting unit and the inclination angle of the sidewall of the conductive overlap portion can be effectively matched, thereby effectively improving the problem of poor cathode overlap.

[0046] Another embodiment of this application provides a method for manufacturing a display panel, comprising:

[0047] Provide substrate;

[0048] An initial isolation structure is formed on the substrate. The initial isolation structure includes a plurality of spaced-apart isolation openings and includes a conductive overlap portion and a blocking portion sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion on the substrate lies within the orthographic projection of the blocking portion on the substrate, and the length by which the blocking portion protrudes relative to the conductive overlap portion in the direction toward the isolation opening is the blocking length.

[0049] Multiple light-emitting structures of different colors are sequentially formed in different isolation openings. Each light-emitting structure includes a light-emitting unit and a first electrode. The first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion. During the formation of the light-emitting structure of the preceding color, the conductive overlap portion in the isolation opening corresponding to the following color is etched laterally to increase the blocking length corresponding to the following color.

[0050] In one embodiment, among the different colored light-emitting structures, the thicker the light-emitting unit, the later it is formed.

[0051] In one embodiment, in the initial isolation structure, the shielding length within each of the isolation openings is the same.

[0052] In one embodiment, the sequential formation of multiple light-emitting structures of different colors within different isolation openings includes:

[0053] A light-emitting material layer of the target color and a first electrode material layer are formed inside each of the isolation openings and above the shielding portion;

[0054] A patterned photoresist is formed to create an isolation opening covering the target color;

[0055] Wet etching is used to remove the first electrode material layer and the light-emitting material layer exposed by the patterned photoresist, and the conductive overlap exposed by the patterned photoresist is etched laterally to increase the masking length corresponding to the background color of the target color.

[0056] In one embodiment, the sidewalls of the conductive overlap are inclined, and in a cross-section perpendicular to the substrate, the size of the conductive overlap gradually increases in the direction toward the substrate.

[0057] The wet etching process removes the light-emitting material layer and the first electrode material layer exposed by the patterned photoresist, and laterally etches the conductive overlap portion exposed by the patterned photoresist, including:

[0058] Adjust the etching rate to increase the tilt angle of the sidewalls of the conductive overlap exposed by the patterned photoresist.

[0059] In one embodiment, forming the initial isolation structure on the substrate includes:

[0060] An isolation material layer is formed on the substrate. The isolation material layer includes a support material layer and a shielding material layer formed on the upper surface of the support material layer. The material of the support material layer is a conductive material.

[0061] The isolation material layer is patterned and etched to form a support portion and a shielding portion. The orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate. The conductive overlap portion includes the support portion. The first electrode is connected to the sidewall of the support portion.

[0062] Optionally, the isolation material layer further includes an adhesive material layer, and the support material layer is formed on the upper surface of the adhesive material layer. After the isolation material layer is patterned and etched, the adhesive material layer forms an adhesive portion.

[0063] Optionally, the orthographic projection of the adhesive portion on the substrate is located within the orthographic projection of the shielding portion on the substrate;

[0064] Optionally, the substrate includes a pixel definition layer and a second electrode, the pixel definition layer covers the second electrode, and the pixel definition layer includes a pixel opening that exposes the second electrode, the pixel opening communicating with the isolation opening, and the adhesive portion located on the pixel definition layer.

[0065] In one embodiment, forming the initial isolation structure on the substrate includes:

[0066] An isolation material layer is formed on the substrate. The isolation material layer includes an adhesive material layer, a support material layer, and a shielding material layer formed sequentially. The adhesive material layer is made of a conductive material.

[0067] The insulating material layer is patterned and etched to form an adhesive portion, a support portion, and a shielding portion. The orthographic projections of the support portion and the adhesive portion on the substrate are both located within the orthographic projection of the shielding portion on the substrate. The conductive overlap portion includes the adhesive portion, and the first electrode is connected to the sidewall of the adhesive portion.

[0068] In the display panel fabrication method provided in the above embodiments, in the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the corresponding shielding length. With a fixed evaporation angle and isolation structure height, a greater shielding length results in a larger shielding area of ​​the evaporated material on the light-emitting unit by the eaves of the shielding portion, a smaller ramp length of the light-emitting unit on the sidewall of the conductive overlap portion, and a greater length of the first electrode extending beyond the light-emitting unit and contacting the conductive overlap portion on the sidewall of the conductive overlap portion. This effectively reduces the impedance between the first electrode and the conductive overlap portion. Therefore, in the light-emitting structures of different colors, a greater thickness of the light-emitting unit and a greater corresponding shielding length allow for an effective match between the thickness of the light-emitting unit and the shielding length, thereby effectively improving the problem of poor cathode overlap.

[0069] Another embodiment of this application provides a display device including a display panel as described in any of the preceding claims. Attached Figure Description

[0070] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0071] Figure 1 This is a partial cross-sectional schematic diagram of the corresponding blue light-emitting structure of the display panel in one embodiment of this application;

[0072] Figure 2 This is a partial cross-sectional structural diagram of the corresponding green light-emitting structure of the display panel in one embodiment of this application;

[0073] Figure 3 This is a partial cross-sectional schematic diagram of the corresponding red light-emitting structure of the display panel in one embodiment of this application;

[0074] Figure 4 A schematic diagram illustrating the principle of increasing the shielding length SA to reduce the impedance between the first electrode and the conductive overlap.

[0075] Figure 5 This is a partial cross-sectional structural diagram of the display panel in another embodiment of this application;

[0076] Figure 6 This is a partial cross-sectional structural diagram of the display panel in another embodiment of this application;

[0077] Figure 7 This is a schematic diagram of the manufacturing process of the display panel in one embodiment of this application;

[0078] Figure 8 This is a schematic diagram of the manufacturing process of the display panel in another embodiment of this application.

[0079] Explanation of reference numerals in the attached figures:

[0080] 100-Substrate, 110-Substrate, 120-Second electrode, 130-Pixel definition layer, 200-Isolation structure, 210-Conductive overlap, 220-Shielding portion, 230-Support portion, 240-Adhesive portion, 300-Light-emitting structure, 310-Light-emitting unit, 320-First electrode, 400-Encapsulation layer. Detailed Implementation

[0081] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0082] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0083] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0084] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as "on" another layer or substrate, the layer or element may be directly on said other layer or substrate, or there may be intermediate layers. Furthermore, it is understood that when a layer is referred to as "between two layers," the layer may be the only layer between said two layers, or there may be one or more intermediate layers. Additionally, the same reference numerals always denote the same elements.

[0085] In the following embodiments, when a layer, region, or element is “connected,” it can be interpreted as the layer, region, or element being connected not only directly but also through other constituent elements placed therebetween. For example, when a layer, region, element, etc., is described as being connected or electrically connected, the layer, region, element, etc., can not only be directly connected or directly electrically connected, but can also be connected or electrically connected through another layer, region, element, etc., placed therebetween.

[0086] In the following text, although terms such as “first” and “second” may be used to describe various components, these components are not necessarily limited to the terms above. The terms above are only used to distinguish one component from another. It will also be understood that expressions used in the singular form include plural expressions, unless the singular form has a distinctly different meaning in the context.

[0087] When a phrase such as “at least one of…” follows a list of elements, it modifies the entire list of elements, not individual elements within that list. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items. As used in the application documents, the term “and / or” includes any and all combinations of one or more of the associated listed items. It should also be understood that terms such as “comprising / including” or “having” specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0088] Electronic or electrical devices and / or any other related devices or components (e.g., display devices including a display panel and a display panel driver, wherein the display panel driver further includes a drive controller, a gate driver, a gamma reference voltage generator, a data driver, and a transmit driver) according to embodiments of the concepts described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of these devices may be formed on an integrated circuit (IC) chip or on a separate IC chip. Additionally, various components of these devices may be implemented on a flexible printed circuit film, a tape-on-a-package (TCP), a printed circuit board (PCB), or formed on a substrate. Furthermore, various components of these devices may be processes or threads running on one or more processors in one or more computing devices to execute computer program instructions and interact with other system components to perform the various functions described herein. Computer program instructions are stored in memory, which may be implemented in a computing device using standard storage devices such as random access memory (RAM). Computer program instructions may also be stored in other non-transitory computer-readable media such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices, without departing from the spirit and scope of the exemplary embodiments of the present application.

[0089] While exemplary embodiments of the display panel and display apparatus including the display panel have been specifically described herein, many modifications and variations will be apparent to those skilled in the art. Therefore, it will be understood that this application can also protect display panels and display apparatuses including the display panel configured according to the principles of this application, other than those specifically described herein. This application is also defined in the claims and their equivalents.

[0090] In one embodiment, see Figures 1 to 3 A display panel is provided. The display panel includes a substrate 100, an isolation structure 200, and multiple light-emitting structures 300 of different colors.

[0091] The substrate 100 may include a substrate 110 and a circuit layer (not shown) formed on the substrate 110. The substrate 110 may be a rigid substrate 110 or a flexible substrate 110. The circuit layer may include multiple wiring layers and dielectric layers that isolate the wiring layers, and pixel circuits may be formed in the circuit layer.

[0092] An isolation structure 200 is located on the substrate 100. The isolation structure 200 includes a plurality of spaced-apart isolation openings. Specifically, the isolation structure 200 may be a mesh structure, and the isolation openings may be mesh holes within the mesh structure. The relevant content of the isolation structure 200 is described in patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310771124.9, 202311499823.9, and 202311616249.0, and is provided for reference.

[0093] The isolation structure 200 includes a conductive overlap portion 210 and a shielding portion 220.

[0094] The shielding portion 220 is located on the side of the conductive overlap portion 210 away from the substrate 100. The shielding portion 220 can be made of a conductive material or an insulating material. The conductive overlap portion 210 is used for conductive overlap. The conductive overlap portion 210 is made of a conductive material; for example, the material of the conductive overlap portion 210 can include, but is not limited to, titanium (Ti). The conductive overlap portion 210 and the shielding portion 220 can be separate structures or an integral structure; there is no limitation on this.

[0095] The orthographic projection of the conductive overlap portion 210 onto the substrate 100 lies within the orthographic projection of the shielding portion 220 onto the substrate 100. The portion of the shielding portion 220 extending beyond the conductive overlap portion 210 can form an eave. The sidewalls of the conductive overlap portion are inclined, and in a cross-section perpendicular to the substrate, the size of the conductive overlap portion gradually increases in the direction toward the substrate. (See also...) Figure 4 That is, the sidewall of the conductive overlap portion 210 is inclined outward in the direction from top to bottom. At this time, the longitudinal cross-sectional shape of the conductive overlap portion 210 is a trapezoid, which facilitates the overlap between the first electrode 320 and the sidewall of the conductive overlap portion 210.

[0096] The light-emitting structures 300 of different colors are those used to emit light of different colors. For example, the light-emitting structures 300 of different colors include a red light-emitting structure 300, a green light-emitting structure 300, and a blue light-emitting structure 300. The red light-emitting structure 300 is used to emit red light, the green light-emitting structure 300 is used to emit green light, and the blue light-emitting structure 300 is used to emit blue light.

[0097] The light-emitting structure 300 is located within the isolation structure 200. The light-emitting structure 300 includes a light-emitting unit 310 and a first electrode 320.

[0098] The materials of the light-emitting units 310 in the light-emitting structures 300 of different colors are different, thus they can emit light of different colors.

[0099] Meanwhile, in the light-emitting structures 300 of different colors, the thickness of the light-emitting unit 310 can be different. Furthermore, in the light-emitting structures 300 of different colors, the greater the thickness of the light-emitting unit 310, the greater the inclination angle of the sidewall of the conductive overlap portion 210 connected to the first electrode 320. It can be understood that the inclination angle here represents the angle between the sidewall of the conductive overlap portion 210 and the direction perpendicular to the substrate. Please refer to... Figure 4 The tilt angle c is the angle between the side wall of the conductive overlap 210 and the vertical direction.

[0100] For example, the thickness of the light-emitting unit 310 in the red light-emitting structure 300, the thickness of the light-emitting unit 310 in the green light-emitting structure 300, and the thickness of the light-emitting unit 310 in the blue light-emitting structure 300 decrease sequentially. Let α1 be the angle of inclination of the sidewall of the conductive overlap portion 210 connected to the first electrode 320 of the red light-emitting structure 300, α2 be the corresponding blocking length of the green light-emitting structure 300, and α3 be the corresponding blocking length of the blue light-emitting structure 300. Then α1, α2, and α3 decrease sequentially.

[0101] During the fabrication of the display panel, the light-emitting unit 310 and the first electrode 320 in the light-emitting structure 300 can be formed by processes such as vapor deposition. During the vapor deposition process, the eaves of the shielding part 220 shield the vapor deposition material of the light-emitting unit 310 and the first electrode 320, thereby isolating the light-emitting unit 310 and the first electrode 320 in the isolation opening from the outside.

[0102] Furthermore, by adjusting the vapor deposition angle, the light-emitting unit 310 and the first electrode 320 can be extended laterally, allowing the first electrode 320 to connect with the sidewall of the conductive overlap portion 210. Simultaneously, the thicker the light-emitting unit 310 in the light-emitting structure 300, and the more laterally extended the light-emitting unit 310, the more light-emitting units 310 may be formed between the first electrode 320 and the sidewall of the conductive overlap portion 210. Since the material of the light-emitting unit 310 is an insulating material, the thicker the light-emitting unit 310 in the light-emitting structure 300, the greater the impedance between the first electrode 320 and the conductive overlap portion 210 may be.

[0103] In this embodiment, among the light-emitting structures 300 with different colors, the greater the thickness of the light-emitting unit 310, the greater the inclination angle of the sidewall of the conductive overlap portion 210 to which the first electrode 320 is connected. The greater the inclination angle of the sidewall of the conductive overlap portion 210, the gentler the slope of the sidewall of the conductive overlap portion 210. The first electrode 320 is typically formed through processes such as vapor deposition, and its thickness on the sidewall of the conductive overlap portion 210 is reduced relative to its thickness on the horizontal plane. Furthermore, the steeper the slope of the sidewall of the conductive overlap portion 210, the greater the reduction in thickness of the first electrode 320 on the sidewall of the conductive overlap portion 210; conversely, the gentler the slope of the sidewall of the conductive overlap portion 210, the slower the reduction in thickness of the first electrode 320 on the sidewall of the conductive overlap portion 210. Therefore, the greater the inclination angle of the sidewall of the conductive overlap portion 210 to which the first electrode 320 is connected, the greater the thickness of the first electrode 320 on the sidewall of the conductive overlap portion 210, thereby reducing the impedance between the first electrode 320 and the conductive overlap portion 210. Thus, in the light-emitting structures 300 with different colors, the greater the thickness of the light-emitting unit 310 and the greater the inclination angle of the sidewall of the conductive overlap portion 210 to which the first electrode 320 is connected, the more effectively the thickness of the light-emitting unit 310 can match the inclination angle of the sidewall of the conductive overlap portion 210, thereby effectively improving the problem of poor cathode overlap.

[0104] In one embodiment, the length by which the shielding portion 220 protrudes relative to the conductive overlap portion 210 in the direction toward the isolation opening is called the shielding length SA. The larger the shielding length SA, the larger the shielding area of ​​the eaves of the shielding portion 220.

[0105] Among the light-emitting structures 300 of different colors, the greater the thickness of the light-emitting unit 310, the greater the corresponding blocking length SA.

[0106] For example, please see Figures 1 to 3 The thickness of the light-emitting unit 310 in the red light-emitting structure 300, the thickness of the light-emitting unit 310 in the green light-emitting structure 300, and the thickness of the light-emitting unit 310 in the blue light-emitting structure 300 decrease sequentially. Let the occlusion length corresponding to the red light-emitting structure 300 be SAR, the occlusion length corresponding to the green light-emitting structure 300 be SAG, and the occlusion length corresponding to the blue light-emitting structure 300 be SAB; then SAR, SAG, and SAB decrease sequentially.

[0107] As explained above, the thicker the light-emitting unit 310 in the light-emitting structure 300, the greater the impedance between the first electrode 320 and the conductive overlap portion 210 may be.

[0108] With a fixed vapor deposition angle and a fixed height of the isolation structure 200, a larger shielding length SA results in a larger shielding area of ​​the eaves of the shielding portion 220 on the vapor deposition material of the light-emitting unit 310. This leads to a smaller ramp length of the light-emitting unit 310 on the sidewall of the conductive overlap portion 210, and a larger length of the first electrode 320 extending beyond the light-emitting unit 310 to contact the conductive overlap portion 210. This effectively reduces the impedance between the first electrode 320 and the conductive overlap portion 210. For example, please refer to... Figure 4 The evaporation angle of the light-emitting unit 310 is a, and the evaporation angle of the first electrode 320 is b. When the shielding length increases from SA1 to SA2, the length of the first electrode 320 on the side wall of the conductive overlap portion 210 that extends beyond the light-emitting unit 310 and contacts the conductive overlap portion 210 increases from d1 to d2, thereby effectively reducing the impedance between the first electrode 320 and the conductive overlap portion 210.

[0109] In this embodiment, in the light-emitting structures 300 with different colors, the greater the thickness of the light-emitting unit 310, the greater the corresponding blocking length SA, which can effectively match the thickness of the light-emitting unit 310 with the blocking length, thereby effectively improving the problem of poor cathode connection.

[0110] In one embodiment, see Figure 1 The substrate 100 includes a pixel definition layer 130 and a second electrode 120.

[0111] The second electrode 120 can form a light-emitting device with the light-emitting structure 300 (including the light-emitting unit 310 and the first electrode 320). The second electrode 120 can be configured as the anode and the first electrode 320 as the cathode. Alternatively, the second electrode 120 can be configured as the cathode and the first electrode 320 as the anode.

[0112] The pixel definition layer 130 covers the second electrode 120, and the pixel definition layer 130 includes a pixel opening that exposes the second electrode 120. The pixel opening is in communication with an isolation opening, thereby allowing the light-emitting structure 300 to connect to the second electrode 120.

[0113] The isolation structure 200 is located on the pixel definition layer 130. The material of the pixel definition layer 130 may include, but is not limited to, inorganic materials, and the pixel definition layer 130 may extend from the display area of ​​the display panel to the non-display area, thereby preventing water, oxygen, etc. from intruding into the isolation structure 200.

[0114] In one embodiment, the isolation structure 200 includes a support portion 230. The orthographic projection of the support portion 230 onto the substrate 100 lies within the orthographic projection of the shielding portion 220 onto the substrate 100. Furthermore, the surface of the support portion 230 away from the substrate 100 is connected to the shielding portion 220, thereby supporting the shielding portion 220.

[0115] The support portion 230 is made of a conductive material. For example, the conductive material can be a metal (such as aluminum).

[0116] The conductive overlap portion 210 includes a support portion 230, and the first electrode 320 is connected to the side wall of the support portion 230.

[0117] In this case, as an example, the blocking length SA can be the length by which the blocking part 220 protrudes relative to the support part 230 in the direction toward the isolation opening.

[0118] In the light-emitting structures 300 of different colors, the greater the thickness of the light-emitting unit 310, the greater the corresponding blocking length SA, thereby effectively matching the thickness of the light-emitting unit 310 with the blocking length SA, and thus effectively improving the problem of poor cathode connection.

[0119] As another example, the sidewalls of the support portion 230 are inclined, and in a cross-section perpendicular to the substrate 100, the dimensions of the support portion 230 gradually increase in the direction toward the substrate 100. As shown in the figure, the longitudinal cross-sectional shape of the support portion 230 can be a trapezoid.

[0120] In the light-emitting structures 300 of different colors, the greater the thickness of the light-emitting unit 310, the greater the tilt angle of the side wall of the support portion 230 connected to the first electrode 320. This allows the thickness of the light-emitting unit 310 to be effectively matched with the tilt angle of the side wall of the support portion 230, thereby effectively improving the problem of poor cathode bonding.

[0121] As an example, the isolation structure 200 may also include an adhesive portion 240. The adhesive portion 240 is located between the support portion 230 and the substrate 100. The material of the adhesive portion 240 may be a conductive material or an insulating material. For example, the material of the adhesive portion 240 may include, but is not limited to, molybdenum (Mo).

[0122] The adhesive portion 240 can improve the adhesion between the isolation structure 200 and the substrate 100. For example, the adhesive portion 240 can be formed on the pixel definition layer 130, thereby improving the adhesion between the isolation structure 200 and the pixel definition layer 130.

[0123] Optionally, the orthographic projection of the support portion 230 on the substrate 100 is located within the orthographic projection of the adhesive portion 240 on the substrate 100, thereby enabling the support portion 230 to be effectively bonded to the substrate 100 through the adhesive portion 240.

[0124] Optionally, the orthographic projection of the adhesive portion 240 on the substrate 100 may lie within the orthographic projection of the shielding portion 220 on the substrate 100. In this case, the presence of the adhesive portion 240 does not affect the size of the isolation opening, and thus does not affect the pixel aperture ratio.

[0125] Of course, the isolation structure 200 may also include only the support part 230 and the shielding part 220.

[0126] In one embodiment, see Figure 5 The isolation structure 200 includes an adhesive portion 240 and a support portion 230.

[0127] The support portion 230 is located between the adhesive portion 240 and the shielding portion 220. Furthermore, the orthographic projection of the support portion 230 on the substrate 100 lies within the orthographic projection of the shielding portion 220 on the substrate 100, thereby serving to support the shielding portion 220. The material of the support portion 230 can be a conductive material or an insulating material.

[0128] The orthographic projection of the adhesive portion 240 on the substrate 100 is also located within the orthographic projection of the shielding portion 220 on the substrate 100. The material of the adhesive portion 240 is a conductive material.

[0129] The conductive overlap portion 210 includes an adhesive portion 240, and the first electrode 320 is connected to the side wall of the adhesive portion 240.

[0130] In this case, as an example, the blocking length SA can be the length by which the blocking portion 220 protrudes relative to the adhesive portion 240 in the direction toward the isolation opening.

[0131] In the light-emitting structures 300 of different colors, the greater the thickness of the light-emitting unit 310, the greater the corresponding blocking length SA, thereby effectively matching the thickness of the light-emitting unit 310 with the blocking length SA, and thus effectively improving the problem of poor cathode connection.

[0132] As another example, the sidewalls of the adhesive portion 240 are inclined, and in a cross-section perpendicular to the substrate 100, the size of the adhesive portion 240 gradually increases in the direction toward the substrate 100. Figure 5 As shown, the longitudinal cross-sectional shape of the adhesive portion 240 can be a trapezoid.

[0133] In the light-emitting structures 300 of different colors, the greater the thickness of the light-emitting unit 310, the greater the tilt angle of the sidewall of the adhesive portion 240 connected to the first electrode 320. This allows the thickness of the light-emitting unit 310 to be effectively matched with the tilt angle of the sidewall of the adhesive portion 240, thereby effectively improving the problem of poor cathode bonding.

[0134] In one embodiment, see Figure 6 The orthographic projection of the support portion 230 on the substrate 100 is located within the orthographic projection of the adhesive portion 240 on the substrate 100. At this time, the orthographic projection size of the support portion 230 on the substrate 100 is smaller than the orthographic projection of the adhesive portion 240 on the substrate 100, thereby exposing the top surface of the adhesive portion 240 away from the substrate 100.

[0135] The first electrode 320 extends from the sidewall of the adhesive portion 240 to the top surface of the adhesive portion 240 away from the substrate 100, thereby effectively increasing the reliability of the overlap between the first electrode 320 and the adhesive portion 240.

[0136] In one embodiment, see Figure 7 A method for manufacturing a display panel is provided, comprising the following steps:

[0137] Step S100: Provide substrate 100.

[0138] The substrate 100 may include a substrate 110 and a circuit layer formed on the substrate 110. The substrate 110 may be a rigid substrate 110 or a flexible substrate 110. The circuit layer may include multiple wiring layers and a dielectric layer that isolates the wiring layers, and pixel circuits may be formed in the circuit layer.

[0139] As an example, the substrate 100 may also provide a second electrode 120 and a pixel defining layer 130. The second electrode 120 may be, but is not limited to, an anode. The pixel defining layer 130 covers the second electrode 120 and includes pixel openings that expose the second electrode 120. Of course, in other examples, the form of the substrate 100 is not limited to this. In other examples, the second electrode 120 may also be formed subsequently within an isolation opening in the isolation structure 200.

[0140] In step S200, an initial isolation structure 200 is formed on the substrate 100. The initial isolation structure 200 includes a plurality of isolation openings spaced apart, and the initial isolation structure 200 includes a conductive overlap portion 210 and a shielding portion 220 sequentially disposed on the substrate 100. The orthographic projection of the conductive overlap portion 210 on the substrate 100 is located within the orthographic projection of the shielding portion 220 on the substrate 100.

[0141] An isolation structure material layer can first be formed on the substrate 100. Then, the isolation structure material layer can be patterned by wet etching to form the initial isolation structure 200. During wet etching, the etching rates for the conductive overlap portion 210 and the shielding portion 220 can be different. For example, the etching rate for the conductive overlap portion 210 can be greater than the etching rate for the shielding portion 220, so that the orthographic projection of the conductive overlap portion 210 on the substrate 100 is located within the orthographic projection of the shielding portion 220 on the substrate 100.

[0142] As an example, the isolation structure 200 can be formed on the pixel definition layer 130. The opening of the isolation structure 200 can be connected to the pixel opening.

[0143] In step S300, multiple light-emitting structures 300 of different colors are sequentially formed in different isolation openings. Each light-emitting structure 300 includes a light-emitting unit 310 and a first electrode 320. The first electrode 320 covers the light-emitting unit 310 and is connected to the sidewall of the conductive overlap portion 210. After multiple light-emitting structures of different colors are formed, the sidewall of the conductive overlap portion 210 is inclined. On a cross section perpendicular to the substrate 100, the size of the conductive overlap portion 210 gradually increases in the direction toward the substrate 100. Among the light-emitting structures 300 of different colors, the greater the thickness of the light-emitting unit 310, the greater the inclination angle of the sidewall of the conductive overlap portion 210 connected to the first electrode 320.

[0144] In one embodiment, in the initial isolation structure 200, the sidewalls of the conductive overlap portions 210 within each isolation opening have the same inclination angle.

[0145] Step S300 includes:

[0146] In step S310, a light-emitting material layer of the target color and a material layer of the first electrode 320 are formed in each isolation opening and above the shielding portion 220.

[0147] First, the target color luminescent material layer can be vapor-deposited onto the entire surface, and then the first electrode 320 material layer can be vapor-deposited onto the entire surface.

[0148] The target color is the currently prepared color. The material and thickness of the light-emitting material layer of the light-emitting structure 300 are different for different colors. However, the material and thickness of the first electrode 320 material layer of the light-emitting structure 300 can be the same for different colors.

[0149] Step S320: A patterned photoresist is formed to cover the isolation openings of the target color.

[0150] Before forming the patterned photoresist, an encapsulation material layer can be formed on the first electrode 320 material layer using processes such as chemical vapor deposition (CVD). Then, the patterned photoresist is formed on the encapsulation material layer.

[0151] Patterned photoresist covers the isolation openings of the target color. As an example, the patterned photoresist may also extend from the isolation openings to the portion above the shielding portions 220 on both sides.

[0152] Step S330: Wet etching, removing the material layer of the first electrode 320 exposed by the patterned photoresist and the light-emitting material layer, and laterally etching the conductive overlap portion 210 exposed by the patterned photoresist. During the wet etching process, the etching rate is adjusted to increase the sidewall tilt angle of the conductive overlap portion exposed by the patterned photoresist.

[0153] Before wet etching the material layer of the first electrode 320 and the light-emitting material layer, the encapsulation material layer exposed by the patterned photoresist can be removed by dry etching, thereby forming the encapsulation layer 400 in the isolation opening corresponding to the target color.

[0154] When performing wet etching on the first electrode 320 material layer and the light-emitting material layer exposed by the patterned photoresist, the first electrode 320 material layer exposed by the patterned photoresist can be removed first by wet etching, thereby forming the first electrode 320 within the isolation opening corresponding to the target color. Then, the light-emitting material layer exposed by the patterned photoresist is removed by wet etching, thereby forming the light-emitting unit 310 of the target color within the isolation opening corresponding to the target color. Afterwards, the conductive overlap portion 210 within the isolation opening corresponding to a non-target color is exposed, and can be further wet-etched. At this time, the etching conditions can be adjusted so that the etching rate on the upper side of the conductive overlap portion 210 is greater than the etching rate on the lower side of the conductive overlap portion 210, thereby increasing the sidewall tilt angle of the conductive overlap portion 210 exposed by the patterned photoresist, and further increasing the sidewall tilt angle of the conductive overlap portion 210 corresponding to other colors prepared after the target color.

[0155] In this embodiment, the tilt angle of the sidewall of the conductive overlap portion 210 corresponding to the later-processed color light-emitting structure 300 can be increased. In different color light-emitting structures 300, the thickness of the light-emitting unit 310 is increased, and it is formed later. This effectively ensures that in different color light-emitting structures 300, the greater the thickness of the light-emitting unit 310, the greater the tilt angle of the sidewall of the conductive overlap portion 210 connected to the first electrode 320, and the greater the thickness of the first electrode 320 on the sidewall of the conductive overlap portion 210. This effectively reduces the impedance of the first electrode 320, allowing the thickness of the light-emitting unit 310 to effectively match the tilt angle of the sidewall of the conductive overlap portion 210, thereby effectively improving the problem of poor cathode overlap.

[0156] For example, if blue is initially selected as the target color, after wet etching of the blue luminescent material layer, the conductive overlap portions 210 within the isolation openings corresponding to green and red are exposed and can be further etched, thereby increasing the sidewall tilt angle of the conductive overlap portions 210 corresponding to green and red. After completing the fabrication of the blue luminescent structure 300, green can be selected as the target color. After wet etching of the green luminescent material layer, the conductive overlap portions 210 within the isolation openings corresponding to red are exposed and can be further etched, thereby further increasing the sidewall tilt angle of the conductive overlap portions 210 corresponding to red. It can be understood that after wet etching of the green luminescent material layer, although the isolation openings corresponding to the already fabricated blue structure are also exposed by the patterned photoresist, the conductive overlap portions 210 within them are covered by the encapsulation layer 400 and are not exposed, thus not being further etched.

[0157] Therefore, in the final isolation structure 200, the sidewall tilt angle of the conductive overlap portion 210 corresponding to the red light-emitting structure 300, the sidewall tilt angle of the conductive overlap portion 210 corresponding to the green light-emitting structure 300, and the sidewall tilt angle of the conductive overlap portion 210 corresponding to the blue light-emitting structure 300 increase sequentially.

[0158] In one embodiment, the length by which the shielding portion 220 protrudes relative to the conductive overlap portion 210 in the direction toward the isolation opening is the shielding length SA.

[0159] Meanwhile, during the wet etching process in step S330, the shielding length within the isolation opening exposed by the patterned photoresist is increased.

[0160] The isolation openings exposed by the patterned photoresist include isolation openings corresponding to other colors prepared after the target color.

[0161] During the wet etching process in step S330, the conductive overlap portion 210 in the isolation opening corresponding to other colors prepared after the target color is etched laterally, thereby causing the conductive overlap portion 210 in the isolation opening corresponding to other colors prepared after the target color to shrink inward, while the blocking portion 220 is not etched or is etched very little, thereby increasing the blocking length SA corresponding to other colors prepared after the target color.

[0162] Among the light-emitting structures 300 of different colors, the thicker the light-emitting unit 310 is, and the later it is formed, the larger the thickness of the light-emitting unit 310 in the light-emitting structure 300, the larger the corresponding blocking length SA.

[0163] For example, the light-emitting structures 300 of different colors include a red light-emitting structure 300, a green light-emitting structure 300, and a blue light-emitting structure 300. The thickness of the light-emitting unit 310 in the red light-emitting structure 300, the thickness of the light-emitting unit 310 in the green light-emitting structure 300, and the thickness of the light-emitting unit 310 in the blue light-emitting structure 300 decrease sequentially. In this case, the blue light-emitting structure 300 can be prepared first, then the green light-emitting structure 300, and finally the red light-emitting structure 300.

[0164] When the evaporation angle and the height of the isolation structure 200 are constant, the larger the shielding length SA is, the smaller the climbing length of the light-emitting unit 310 on the side wall of the conductive overlap portion 210, and the larger the length of the first electrode 320 on the side wall of the conductive overlap portion 210 that extends beyond the light-emitting unit 310 and contacts the conductive overlap portion 210, thereby effectively reducing the impedance between the first electrode 320 and the conductive overlap portion 210.

[0165] In one embodiment, see Figures 1 to 3A display panel is provided. The display panel includes a substrate 100, an isolation structure 200, and light-emitting structures 300 of different colors.

[0166] The substrate 100 may include a substrate 110 and a circuit layer (not shown) formed on the substrate 110. The substrate 110 may be a rigid substrate 110 or a flexible substrate 110. The circuit layer may include multiple wiring layers and dielectric layers that isolate the wiring layers, and pixel circuits may be formed in the circuit layer.

[0167] An isolation structure 200 is located on the substrate 100. The isolation structure 200 includes a plurality of spaced-apart isolation openings. Specifically, the isolation structure 200 may be a mesh structure, and the isolation openings may be mesh holes within the mesh structure. The relevant content of the isolation structure 200 is described in patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310771124.9, 202311499823.9, and 202311616249.0, and is provided for reference.

[0168] The isolation structure 200 includes a conductive overlap portion 210 and a shielding portion 220.

[0169] The shielding portion 220 is located on the side of the conductive overlap portion 210 away from the substrate 100. The shielding portion 220 can be made of a conductive material or an insulating material. The conductive overlap portion 210 is used for conductive overlap. The conductive overlap portion 210 is made of a conductive material; for example, the material of the conductive overlap portion 210 can include, but is not limited to, titanium (Ti). The conductive overlap portion 210 and the shielding portion 220 can be separate structures or an integral structure; there is no limitation on this.

[0170] The orthographic projection of the conductive overlap portion 210 on the substrate 100 lies within the orthographic projection of the shielding portion 220 on the substrate 100. The portion of the shielding portion 220 extending beyond the conductive overlap portion 210 can form an eave. The length by which the shielding portion 220 protrudes relative to the conductive overlap portion 210 in the direction toward the isolation opening is called the shielding length SA. The larger the shielding length SA, the larger the shielding area of ​​the eaves of the shielding portion 220.

[0171] The light-emitting structures 300 of different colors are those used to emit light of different colors. For example, the light-emitting structures 300 of different colors include a red light-emitting structure 300, a green light-emitting structure 300, and a blue light-emitting structure 300. The red light-emitting structure 300 is used to emit red light, the green light-emitting structure 300 is used to emit green light, and the blue light-emitting structure 300 is used to emit blue light.

[0172] The light-emitting structure 300 is located within the isolation structure 200. The light-emitting structure 300 includes a light-emitting unit 310 and a first electrode 320.

[0173] The materials of the light-emitting units 310 in the light-emitting structures 300 of different colors are different, thus they can emit light of different colors.

[0174] Meanwhile, in different colored light-emitting structures 300, the thickness of the light-emitting unit 310 can be different. Furthermore, in different colored light-emitting structures 300, the greater the thickness of the light-emitting unit 310, the greater the corresponding blocking length SA.

[0175] For example, please see Figures 1 to 3 The thickness of the light-emitting unit 310 in the red light-emitting structure 300, the thickness of the light-emitting unit 310 in the green light-emitting structure 300, and the thickness of the light-emitting unit 310 in the blue light-emitting structure 300 decrease sequentially. Let the occlusion length corresponding to the red light-emitting structure 300 be SAR, the occlusion length corresponding to the green light-emitting structure 300 be SAG, and the occlusion length corresponding to the blue light-emitting structure 300 be SAB; then SAR, SAG, and SAB decrease sequentially.

[0176] The first electrode 320 covers the light-emitting unit 310 and is connected to the sidewall of the conductive overlap portion 210. As an example, the first electrode 320 can be a cathode. The first electrodes 320 of the light-emitting structures 300 within each isolation opening can be electrically connected through the conductive overlap portion 210.

[0177] As explained above, the thicker the light-emitting unit 310 in the light-emitting structure 300, the greater the impedance between the first electrode 320 and the conductive overlap portion 210 may be.

[0178] With a fixed vapor deposition angle and a fixed height of the isolation structure 200, a larger shielding length SA results in a larger shielding area of ​​the eaves of the shielding portion 220 on the vapor deposition material of the light-emitting unit 310. This leads to a smaller ramp length of the light-emitting unit 310 on the sidewall of the conductive overlap portion 210, and a larger length of the first electrode 320 extending beyond the light-emitting unit 310 to contact the conductive overlap portion 210. This effectively reduces the impedance between the first electrode 320 and the conductive overlap portion 210. For example, please refer to... Figure 4 The evaporation angle of the light-emitting unit 310 is a, and the evaporation angle of the first electrode 320 is b. When the shielding length increases from SA1 to SA2, the length of the first electrode 320 on the side wall of the conductive overlap portion 210 that extends beyond the light-emitting unit 310 and contacts the conductive overlap portion 210 increases from d1 to d2, thereby effectively reducing the impedance between the first electrode 320 and the conductive overlap portion 210.

[0179] In this embodiment, in the light-emitting structures 300 with different colors, the greater the thickness of the light-emitting unit 310, the greater the corresponding blocking length SA, which can effectively match the thickness of the light-emitting unit 310 with the blocking length, thereby effectively improving the problem of poor cathode connection.

[0180] In one embodiment, the isolation structure 200 includes a support portion 230. The orthographic projection of the support portion 230 on the substrate 100 lies within the orthographic projection of the shielding portion 220 on the substrate 100, and the surface of the support portion 230 away from the substrate 100 is connected to the shielding portion 220. The conductive overlap portion 210 includes the support portion 230, and the first electrode 320 is connected to the sidewall of the support portion 230.

[0181] At this time, the blocking length SA can be the length by which the blocking part 220 protrudes relative to the support part 230 in the direction toward the isolation opening.

[0182] In one embodiment, the isolation structure 200 includes an adhesive portion 240 and a support portion 230. The support portion 230 is located between the adhesive portion 240 and the shielding portion 220. The orthographic projections of both the support portion 230 and the adhesive portion 240 on the substrate 100 are within the orthographic projection of the shielding portion 220 on the substrate 100. The conductive overlap portion 210 includes the adhesive portion 240, and the first electrode 320 is connected to the sidewall of the adhesive portion 240.

[0183] At this time, the shielding length SA can be the length by which the shielding part 220 protrudes relative to the adhesive part 240 in the direction toward the isolation opening.

[0184] In one embodiment, see Figure 8 A method for manufacturing a display panel is provided, comprising the following steps:

[0185] Step S10: Provide substrate 100.

[0186] The substrate 100 may include a substrate 110 and a circuit layer formed on the substrate 110. The substrate 110 may be a rigid substrate 110 or a flexible substrate 110. The circuit layer may include multiple wiring layers and a dielectric layer that isolates the wiring layers, and pixel circuits may be formed in the circuit layer.

[0187] As an example, the substrate 100 may also provide a second electrode 120 and a pixel defining layer 130. The second electrode 120 may be, but is not limited to, an anode. The pixel defining layer 130 covers the second electrode 120 and includes pixel openings that expose the second electrode 120. Of course, in other examples, the form of the substrate 100 is not limited to this. In other examples, the second electrode 120 may also be formed subsequently within an isolation opening in the isolation structure 200.

[0188] In step S20, an initial isolation structure 200 is formed on the substrate 100. The isolation structure 200 includes a plurality of isolation openings spaced apart, and the isolation structure 200 includes a conductive overlap portion 210 and a shielding portion 220 sequentially disposed on the substrate 100. The orthographic projection of the conductive overlap portion 210 on the substrate 100 is located within the orthographic projection of the shielding portion 220 on the substrate 100, and the length of the shielding portion 220 protruding relative to the conductive overlap portion 210 in the direction toward the isolation opening is the shielding length SA.

[0189] An isolation structure material layer can first be formed on the substrate 100. Then, the isolation structure material layer can be patterned by wet etching to form the initial isolation structure 200. During wet etching, the etching rates for the conductive overlap portion 210 and the shielding portion 220 can be different. For example, the etching rate for the conductive overlap portion 210 can be greater than the etching rate for the shielding portion 220, so that the orthographic projection of the conductive overlap portion 210 on the substrate 100 is located within the orthographic projection of the shielding portion 220 on the substrate 100.

[0190] As an example, the isolation structure 200 can be formed on the pixel definition layer 130. The opening of the isolation structure 200 can be connected to the pixel opening.

[0191] In step S30, multiple light-emitting structures 300 of different colors are sequentially formed in different isolation openings. Each light-emitting structure 300 includes a light-emitting unit 310 and a first electrode 320. The first electrode 320 covers the light-emitting unit 310 and is connected to the sidewall of the conductive overlap portion 210. During the process of forming the light-emitting structure 300 of the previous color, the conductive overlap portion 210 in the isolation opening corresponding to the next color is etched laterally to increase the blocking length corresponding to the next color.

[0192] As an example, among the light-emitting structures 300 of different colors, the thicker the light-emitting unit 310, the later it is prepared and formed.

[0193] Different colored luminescent structures 300 can be formed separately. After the preparation of one color of luminescent structure 300 is completed, another color of luminescent structure 300 is prepared. The preceding color luminescent structure 300 can be the luminescent structure 300 of the color prepared earlier. The following color luminescent structure 300 can be the luminescent structure 300 of the color prepared later.

[0194] The process of forming each color-emitting structure 300 can include multiple etching steps. Therefore, during the formation of the front-color emitting structure 300, the conductive overlap portion 210 in the isolation opening corresponding to the rear color can be etched laterally using etching processes such as wet etching. This causes the conductive overlap portion 210 in the isolation opening corresponding to the rear color to shrink inward, while the blocking portion 220 in the isolation opening corresponding to the rear color is not etched or is etched very little, thereby increasing the blocking length SA corresponding to the rear color.

[0195] Among the light-emitting structures 300 of different colors, the thicker the light-emitting unit 310 is, and the later it is formed, the larger the thickness of the light-emitting unit 310 in the light-emitting structure 300, the larger the corresponding blocking length SA.

[0196] For example, the light-emitting structures 300 of different colors include a red light-emitting structure 300, a green light-emitting structure 300, and a blue light-emitting structure 300. The thickness of the light-emitting unit 310 in the red light-emitting structure 300, the thickness of the light-emitting unit 310 in the green light-emitting structure 300, and the thickness of the light-emitting unit 310 in the blue light-emitting structure 300 decrease sequentially. In this case, the blue light-emitting structure 300 can be prepared first, then the green light-emitting structure 300, and finally the red light-emitting structure 300.

[0197] When the evaporation angle and the height of the isolation structure 200 are constant, the larger the shielding length SA is, the smaller the climbing length of the light-emitting unit 310 on the side wall of the conductive overlap portion 210, and the larger the length of the first electrode 320 on the side wall of the conductive overlap portion 210 that extends beyond the light-emitting unit 310 and contacts the conductive overlap portion 210, thereby effectively reducing the impedance between the first electrode 320 and the conductive overlap portion 210.

[0198] In this embodiment, the fabrication order of the light-emitting structures 300 of different colors is set according to the thickness of the light-emitting units 310 in the light-emitting structures 300 of different colors. This can effectively match the thickness of the light-emitting units 310 with the shielding length SA, thereby effectively improving the problem of poor cathode overlap.

[0199] In one embodiment, in the initial isolation structure 200 formed in step S20, the shielding length in each isolation opening is the same, thereby reducing the complexity of the initial isolation structure 200 and thus reducing its fabrication difficulty.

[0200] It is understandable that there are process errors in the actual manufacturing process. Here, "same shielding length" means that the shielding length is the same within the range of process error, not that the shielding length in each isolation opening is absolutely the same.

[0201] Of course, in other embodiments, the blocking length SA within each isolation opening in the initial isolation structure 200 formed in step S20 can also be different. For example, in the initial isolation structure 200, the blocking length SA within the isolation opening corresponding to the red light-emitting structure 300 is set to be greater than the blocking length SA within the isolation opening corresponding to the green light-emitting structure 300, and greater than the blocking length SA within the isolation opening corresponding to the blue light-emitting structure 300.

[0202] In one embodiment, step S30 includes:

[0203] Step S31: A light-emitting material layer of the target color and a material layer of the first electrode 320 are formed in each isolation opening and above the shielding part 220.

[0204] First, the target color luminescent material layer can be vapor-deposited onto the entire surface, and then the first electrode 320 material layer can be vapor-deposited onto the entire surface.

[0205] The target color is the currently prepared color. The material and thickness of the light-emitting material layer of the light-emitting structure 300 are different for different colors. However, the material and thickness of the first electrode 320 material layer of the light-emitting structure 300 can be the same for different colors.

[0206] Step S32: Form a patterned photoresist that covers the isolation openings of the target color.

[0207] Before forming the patterned photoresist, an encapsulation material layer can be formed on the first electrode 320 material layer using processes such as chemical vapor deposition (CVD). Then, the patterned photoresist is formed on the encapsulation material layer.

[0208] Patterned photoresist covers the isolation openings of the target color. As an example, the patterned photoresist may also extend from the isolation openings to the portion above the shielding portions 220 on both sides.

[0209] Step S33, wet etching, removes the material layer of the first electrode 320 exposed by the patterned photoresist and the light-emitting material layer, and laterally etches the conductive overlap portion 210 exposed by the patterned photoresist to increase the masking length corresponding to the back color of the target color.

[0210] Before wet etching the material layer of the first electrode 320 and the light-emitting material layer, the encapsulation material layer exposed by the patterned photoresist can be removed by dry etching, thereby forming the encapsulation layer 400 in the isolation opening corresponding to the target color.

[0211] When performing wet etching on the first electrode 320 material layer and the light-emitting material layer exposed by the patterned photoresist, the first electrode 320 material layer exposed by the patterned photoresist can be removed first by wet etching, thereby forming the first electrode 320 within the isolation opening corresponding to the target color. Then, the light-emitting material layer exposed by the patterned photoresist is removed by wet etching, thereby forming the light-emitting unit 310 of the target color within the isolation opening corresponding to the target color. Afterwards, the conductive overlap portion 210 within the isolation opening corresponding to a non-target color is exposed, and can be further wet-etched, thereby increasing the masking length SA corresponding to the background color of the target color.

[0212] For example, if blue is initially selected as the target color, after wet etching of the blue luminescent material layer, the conductive overlap portions 210 within the isolation openings corresponding to green and red are exposed and can be further etched, thereby increasing the blocking length SA corresponding to green and red. After completing the fabrication of the blue luminescent structure 300, green can be selected as the target color. After wet etching of the green luminescent material layer, the conductive overlap portions 210 within the isolation openings corresponding to red are exposed and can be further etched, thereby further increasing the blocking length SA corresponding to red. It can be understood that after wet etching of the green luminescent material layer, although the isolation openings corresponding to the already fabricated blue structure are also exposed by the patterned photoresist, the conductive overlap portions 210 within them are covered by the encapsulation layer 400 and will not be exposed, thus preventing further etching.

[0213] Therefore, in the final isolation structure 200, the blocking length SA corresponding to the red light-emitting structure 300, the blocking length SA corresponding to the green light-emitting structure 300, and the blocking length SA corresponding to the blue light-emitting structure 300 increase sequentially.

[0214] In one embodiment, the sidewall of the conductive overlap portion 210 is inclined, and in a cross section perpendicular to the substrate, the size of the conductive overlap portion 210 gradually increases in the direction toward the substrate 100.

[0215] Meanwhile, step S33 includes:

[0216] Step S331: Adjust the etching rate to increase the tilt angle of the sidewall of the conductive overlap 210 exposed by the patterned photoresist.

[0217] The conductive overlap 210 exposed by the patterned photoresist is the conductive overlap 210 within the isolation opening corresponding to the color following the current color.

[0218] The etching conditions can be adjusted so that the etching rate on the upper side of the conductive overlap portion 210 is greater than the etching rate on the lower side of the conductive overlap portion 210, thereby increasing the smoothness of the sidewall of the conductive overlap portion 210 corresponding to the current color and thus increasing the tilt angle of the sidewall of the conductive overlap portion 210 corresponding to the current color.

[0219] At this point, the tilt angle of the sidewall of the conductive overlap portion 210 corresponding to the later-processed color light-emitting structure 300 can be increased. In different color light-emitting structures 300, the thickness of the light-emitting unit 310 is increased, and it is formed later. This effectively ensures that in different color light-emitting structures 300, the greater the thickness of the light-emitting unit 310, the greater the tilt angle of the sidewall of the conductive overlap portion 210 connected to the first electrode 320, and the greater the thickness of the first electrode 320 on the sidewall of the conductive overlap portion 210. This effectively reduces the impedance of the first electrode 320, allowing the thickness of the light-emitting unit 310 to effectively match the tilt angle of the sidewall of the conductive overlap portion 210, thereby effectively improving the problem of poor cathode overlap.

[0220] In one embodiment, step S20 includes:

[0221] Step S21a: An isolation material layer is formed on the substrate 100. The isolation material layer includes a support material layer and a shielding material layer formed on the upper surface of the support material layer. The material of the support material layer is a conductive material.

[0222] As an example, the insulating material layer also includes an adhesive material layer. A support material layer is formed on the upper surface of the adhesive material layer. When forming the insulating material layer, the adhesive material layer, the support material layer, and the shielding material layer can be formed sequentially on the substrate 100. The material of the adhesive material layer can be a conductive material or an insulating material.

[0223] In step S22a, the isolation material layer is patterned and etched to form a support portion 230 and a shielding portion 220. The orthographic projection of the support portion 230 on the substrate 100 is located within the orthographic projection of the shielding portion 220 on the substrate 100. The conductive overlap portion 210 includes the support portion 230.

[0224] Wet etching can be performed on the isolation material layer, and the etching rates of the support material layer and the shielding material layer can be different, so that the orthogonal projection of the formed support portion 230 on the substrate 100 is located within the orthogonal projection of the shielding portion 220 on the substrate 100.

[0225] The conductive overlap portion 210 includes a support portion 230, and the first electrode 320 is connected to the side wall of the support portion 230. In this case, the shielding length SA can be the length by which the shielding portion 220 protrudes relative to the support portion 230 in the direction toward the isolation opening.

[0226] When the isolation material layer also includes an adhesive material layer, patterning etching of the isolation material layer can also form an adhesive portion 240. The adhesive portion 240 can increase the adhesion between the isolation structure 200 and the substrate 100.

[0227] Optionally, the orthographic projection of the adhesive portion 240 on the substrate 100 is located within the orthographic projection of the shielding portion 220 on the substrate 100, thereby not affecting the pixel aperture ratio.

[0228] Optionally, the substrate 100 includes a pixel definition layer 130 and a second electrode 120. The pixel definition layer 130 covers the second electrode 120 and has a pixel opening that exposes the second electrode 120. The pixel opening is connected to an isolation opening, and the adhesive portion 240 is located on the pixel definition layer 130.

[0229] In one embodiment, step S20 includes:

[0230] Step S21b: An isolation material layer is formed on the substrate 100. The isolation material layer includes an adhesive material layer, a support material layer and a shielding material layer formed sequentially. The adhesive material layer is made of a conductive material.

[0231] The supporting material layer and the shielding material layer can be made of conductive or insulating materials, and the two materials can be the same or different.

[0232] In step S21b, the isolation material layer is patterned and etched to form the adhesive portion 240, the support portion 230, and the shielding portion 220. The orthographic projections of the support portion 230 and the adhesive portion 240 on the substrate 100 are both located within the orthographic projection of the shielding portion 220 on the substrate 100. The conductive overlap portion 210 includes the adhesive portion 240, and the first electrode 320 is connected to the sidewall of the adhesive portion 240.

[0233] Wet etching can be performed on the isolation material layer, and the etching rates of the adhesive material layer, support material layer and shielding material layer can be different, so that the orthogonal projections of the support portion 230 and the adhesive portion 240 on the substrate 100 are both located within the orthogonal projection of the shielding portion 220 on the substrate 100.

[0234] The conductive overlap portion 210 includes an adhesive portion 240, and the first electrode 320 is connected to the side wall of the adhesive portion 240. In this case, the shielding length SA can be the length by which the shielding portion 220 protrudes relative to the adhesive portion 240 in the direction toward the isolation opening.

[0235] Based on the same inventive concept, this application also provides a display device (not shown), which includes the display panel in the above embodiments.

[0236] It is understood that the display device in the embodiments of this application can be any product or component with display function, such as OLED display device, QLED display device, electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc., and the embodiments disclosed in this application do not limit this.

[0237] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0238] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0239] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is provided, comprising a plurality of isolation openings spaced apart, and the isolation structure includes a conductive overlap portion and a shielding portion sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion on the substrate is located within the orthographic projection of the shielding portion on the substrate, and the sidewall of the conductive overlap portion is inclined. On a cross section perpendicular to the substrate, the size of the conductive overlap portion gradually increases in the direction toward the substrate. A light-emitting structure is located within the isolation opening and includes a light-emitting unit and a first electrode, wherein the first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion; Furthermore, the display panel includes multiple light-emitting structures of different colors. Among the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode. The inclination angle represents the angle between the sidewall of the conductive overlap portion and the direction perpendicular to the substrate.

2. The display panel according to claim 1, characterized in that, In the direction toward the same isolation opening, the length by which the blocking portion protrudes relative to the conductive overlap portion is the blocking length. In the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the corresponding blocking length.

3. The display panel according to claim 1, characterized in that, The isolation structure includes a support portion, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate, and the surface of the support portion away from the substrate is connected to the shielding portion; The conductive overlap portion includes the support portion, and the first electrode is connected to the side wall of the support portion.

4. The display panel according to claim 3, characterized in that, The isolation structure further includes an adhesive portion located between the support portion and the substrate.

5. The display panel according to claim 4, characterized in that, The orthographic projection of the support portion on the substrate is located within the orthographic projection of the adhesive portion on the substrate.

6. The display panel according to claim 4, characterized in that, The orthographic projection of the adhesive portion on the substrate is located within the orthographic projection of the shielding portion on the substrate.

7. The display panel according to claim 1, characterized in that, The isolation structure includes an adhesive portion and a support portion. The support portion is located between the adhesive portion and the shielding portion, and the orthographic projections of the support portion and the adhesive portion on the substrate are both located within the orthographic projection of the shielding portion on the substrate. The conductive overlap portion includes the adhesive portion, and the first electrode is connected to the sidewall of the adhesive portion.

8. The display panel according to claim 7, characterized in that, The orthographic projection of the support portion on the substrate is located within the orthographic projection of the adhesive portion on the substrate, and the first electrode extends from the sidewall of the adhesive portion to the top surface of the adhesive portion away from the substrate.

9. The display panel according to claim 1, characterized in that, The substrate includes a pixel definition layer and a second electrode. The pixel definition layer covers the second electrode and includes a pixel opening that exposes the second electrode. The pixel opening communicates with the isolation opening, and the isolation structure is located on the pixel definition layer.

10. The display panel according to claim 9, characterized in that, The material of the pixel definition layer includes inorganic materials.

11. A display panel, characterized in that, include: substrate; An isolation structure is provided, comprising a plurality of isolation openings spaced apart, and the isolation structure includes a conductive overlap portion and a shielding portion sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion on the substrate is located within the orthographic projection of the shielding portion on the substrate. In the direction toward the same isolation opening, the length by which the shielding portion protrudes relative to the conductive overlap portion is the shielding length. A light-emitting structure is located within the isolation opening and includes a light-emitting unit and a first electrode. The first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion. Furthermore, the display panel includes multiple light-emitting structures of different colors, and among the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the corresponding blocking length.

12. The display panel according to claim 11, characterized in that, The sidewall of the conductive overlap portion is inclined. On a cross section perpendicular to the substrate, the size of the conductive overlap portion gradually increases in the direction toward the substrate. In the light-emitting structures of different colors, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode. The inclination angle represents the angle between the sidewall of the conductive overlap portion and the direction perpendicular to the substrate.

13. The display panel according to claim 11, characterized in that, The isolation structure includes a support portion, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate, and the surface of the support portion away from the substrate is connected to the shielding portion; The conductive overlap portion includes the support portion, and the first electrode is connected to the side wall of the support portion.

14. The display panel according to claim 13, characterized in that, The isolation structure further includes an adhesive portion located between the support portion and the substrate.

15. The display panel according to claim 14, characterized in that, The orthographic projection of the support portion on the substrate is located within the orthographic projection of the adhesive portion on the substrate.

16. The display panel according to claim 14, characterized in that, The orthographic projection of the adhesive portion on the substrate is located within the orthographic projection of the shielding portion on the substrate.

17. The display panel according to claim 11, characterized in that, The isolation structure includes an adhesive portion and a support portion. The support portion is located between the adhesive portion and the shielding portion, and the orthographic projections of the support portion and the adhesive portion on the substrate are both located within the orthographic projection of the shielding portion on the substrate. The conductive overlap portion includes the adhesive portion, and the first electrode is connected to the sidewall of the adhesive portion.

18. The display panel according to claim 17, characterized in that, The orthographic projection of the support portion on the substrate is located within the orthographic projection of the adhesive portion on the substrate, and the first electrode extends from the sidewall of the adhesive portion to the top surface of the adhesive portion away from the substrate.

19. The display panel according to claim 11, characterized in that, The substrate includes a pixel definition layer and a second electrode. The pixel definition layer covers the second electrode and includes a pixel opening that exposes the second electrode. The pixel opening communicates with the isolation opening, and the isolation structure is located on the pixel definition layer.

20. The display panel according to claim 19, characterized in that, The material of the pixel definition layer includes inorganic materials.

21. A method for manufacturing a display panel, characterized in that, include: Provide substrate; An initial isolation structure is formed on the substrate. The initial isolation structure includes a plurality of isolation openings spaced apart. The initial isolation structure includes a conductive overlap portion and a shielding portion sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion on the substrate is located within the orthographic projection of the shielding portion on the substrate. Multiple light-emitting structures of different colors are sequentially formed within different isolation openings. Each light-emitting structure includes a light-emitting unit and a first electrode. The first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion. After multiple light-emitting structures of different colors are formed, the sidewall of the conductive overlap portion is inclined. On a cross-section perpendicular to the substrate, the size of the conductive overlap portion gradually increases in the direction toward the substrate. Among the different colored light-emitting structures, the greater the thickness of the light-emitting unit, the greater the inclination angle of the sidewall of the conductive overlap portion connected to the first electrode. The inclination angle represents the angle between the sidewall of the conductive overlap portion and the direction perpendicular to the substrate.

22. The method for manufacturing a display panel according to claim 21, characterized in that, In the initial isolation structure, the sidewall inclination angle of the conductive overlap portion within each isolation opening is the same. The method of sequentially forming multiple light-emitting structures of different colors within different isolation openings includes: A light-emitting material layer of the target color and a first electrode material layer are formed inside each of the isolation openings and above the shielding portion; A patterned photoresist is formed to create an isolation opening covering the target color; Wet etching is used to remove the first electrode material layer and the light-emitting material layer exposed by the patterned photoresist, and the conductive overlap portion exposed by the patterned photoresist is etched laterally. During the wet etching process, the etching rate is adjusted to increase the sidewall tilt angle of the conductive overlap portion exposed by the patterned photoresist.

23. The method for manufacturing a display panel according to claim 22, characterized in that, The length by which the shielding portion protrudes relative to the conductive overlap portion in the direction toward the isolation opening is the shielding length. During the wet etching process, the shielding length within the isolation opening exposed by the patterned photoresist is increased. Among the light-emitting structures of different colors, the thicker the light-emitting unit, the later it is fabricated.

24. A method for manufacturing a display panel, characterized in that, include: Provide substrate; An initial isolation structure is formed on the substrate. The initial isolation structure includes a plurality of spaced-apart isolation openings and includes a conductive overlap portion and a blocking portion sequentially disposed on the substrate. The orthographic projection of the conductive overlap portion on the substrate lies within the orthographic projection of the blocking portion on the substrate, and the length by which the blocking portion protrudes relative to the conductive overlap portion in the direction toward the isolation opening is the blocking length. Multiple light-emitting structures of different colors are sequentially formed within different isolation openings. Each light-emitting structure includes a light-emitting unit and a first electrode. The first electrode covers the light-emitting unit and is connected to the sidewall of the conductive overlap portion. During the formation of the light-emitting structure of the preceding color, the conductive overlap portion within the isolation opening corresponding to the following color is etched laterally to increase the blocking length corresponding to the following color. The preparation order of the light-emitting structures of different colors is set according to the thickness of the light-emitting unit in the light-emitting structure of different colors. The thicker the light-emitting unit, the later it is prepared.

25. The method for manufacturing a display panel according to claim 24, characterized in that, In the initial isolation structure, the shielding length within each isolation opening is the same.

26. The method for manufacturing a display panel according to claim 24, characterized in that, The method of sequentially forming multiple light-emitting structures of different colors within different isolation openings includes: A light-emitting material layer of the target color and a first electrode material layer are formed inside each of the isolation openings and above the shielding portion; A patterned photoresist is formed to create an isolation opening covering the target color; Wet etching is used to remove the first electrode material layer and the light-emitting material layer exposed by the patterned photoresist, and the conductive overlap exposed by the patterned photoresist is etched laterally to increase the masking length corresponding to the background color of the target color.

27. The method for manufacturing a display panel according to claim 26, characterized in that, The sidewalls of the conductive overlap portion are inclined, and in a cross-section perpendicular to the substrate, the size of the conductive overlap portion gradually increases in the direction toward the substrate. The wet etching process removes the light-emitting material layer and the first electrode material layer exposed by the patterned photoresist, and laterally etches the conductive overlap portion exposed by the patterned photoresist, including: The etching rate is adjusted to increase the tilt angle of the sidewall of the conductive overlap exposed by the patterned photoresist, the tilt angle being the angle between the sidewall of the conductive overlap and a direction perpendicular to the substrate.

28. The method for manufacturing a display panel according to claim 24, characterized in that, The formation of the initial isolation structure on the substrate includes: An isolation material layer is formed on the substrate. The isolation material layer includes a support material layer and a shielding material layer formed on the upper surface of the support material layer. The material of the support material layer is a conductive material. The isolation material layer is patterned and etched to form a support portion and a shielding portion. The orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate. The conductive overlap portion includes the support portion. The first electrode is connected to the sidewall of the support portion.

29. The method for manufacturing a display panel according to claim 28, characterized in that, The isolation material layer also includes an adhesive material layer. The support material layer is formed on the upper surface of the adhesive material layer. After the isolation material layer is patterned and etched, the adhesive material layer forms an adhesive portion.

30. The method for manufacturing a display panel according to claim 29, characterized in that, The orthographic projection of the adhesive portion on the substrate is located within the orthographic projection of the shielding portion on the substrate.

31. The method for manufacturing a display panel according to claim 29, characterized in that, The substrate includes a pixel definition layer and a second electrode. The pixel definition layer covers the second electrode and includes a pixel opening that exposes the second electrode. The pixel opening communicates with the isolation opening, and the adhesive portion is located on the pixel definition layer.

32. The method for manufacturing a display panel according to claim 24, characterized in that, The formation of the initial isolation structure on the substrate includes: An isolation material layer is formed on the substrate. The isolation material layer includes an adhesive material layer, a support material layer, and a shielding material layer formed sequentially. The adhesive material layer is made of a conductive material. The insulating material layer is patterned and etched to form an adhesive portion, a support portion, and a shielding portion. The orthographic projections of the support portion and the adhesive portion on the substrate are both located within the orthographic projection of the shielding portion on the substrate. The conductive overlap portion includes the adhesive portion, and the first electrode is connected to the sidewall of the adhesive portion.

33. A display device, characterized in that, Includes the display panel as described in any one of claims 1-20.

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