A multi-wafer drying apparatus

Abstract

The application belongs to the field of wafer drying, and particularly relates to a multi-wafer drying device, which comprises a drying box and wafer baskets distributed at equal intervals in the drying box. Nitrogen gas blowing to the wafer body can blow off some impurity particles adhering to the outside of the wafer body, preventing the wafer body from adhering to the outside of the wafer body in the process of being put into the drying box. Secondly, nitrogen gas filled in the drying box forms a barrier in the drying box to prevent external dust and small particles, and prevents the wafer body from contacting oxygen to react, so as to solve the problem that oxygen causes the wafer surface to be oxidized to form an oxide layer, affecting the electrical performance of the wafer and the precision of subsequent processes. If water vapor in the air is adsorbed on the wafer surface, water impurities will be introduced. Chemical reaction between the wafer surface and other components in the air will also cause the problem of impurities on the wafer surface.

Description

Technical Field

[0001] This invention belongs to the field of wafer drying, specifically a multi-wafer drying device. Background Technology

[0002] To remove moisture from the wafer surface and prevent impurities carried by the moisture from remaining in subsequent processes, which could cause residual moisture to react chemically with certain materials on the wafer surface, leading to corrosion and damage, it is necessary to clean and dry the wafer during the wafer processing. This requires the use of wafer drying equipment.

[0003] Existing technologies have also proposed some wafer drying equipment solutions. For example, a Chinese patent with authorization announcement number CN220934045U discloses a multi-size wafer cleaning and drying equipment, including a drive device with a wafer positioning mechanism and cleaning and drying components. This patent ensures that the drying equipment can clamp and dry wafers of different sizes by clamping wafers of different sizes.

[0004] While the above-mentioned technical solution can dry wafers of different sizes, if metal impurity particles in the drying chamber adhere to the wafer surface during the drying process after wafer cleaning, it will lead to uneven etching in the subsequent etching process, affecting the chip's performance and yield.

[0005] Therefore, the present invention provides a polywafer drying device. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is as follows: The present invention provides a multi-wafer drying equipment, including a drying chamber, wafer baskets evenly distributed inside the drying chamber, a material trough opened inside the wafer baskets, and a wafer body disposed inside the material trough. A drying gas inlet pipe is installed at the front of the drying chamber, a drying gas outlet pipe is installed at the back of the drying chamber, and jetting components for blowing nitrogen gas onto the outside of the wafer body are provided at both ends inside the wafer baskets. The jet assembly includes grooves evenly spaced at both ends inside the wafer basket. A nozzle is installed inside the groove, with the nozzle opening facing the outside of the wafer body. Connecting blocks are fixed on both sides inside the groove. The nozzle is hinged to the connecting blocks via a rotating shaft. An air guide groove is provided on the outer periphery of the groove, which is located inside the wafer basket. A connecting pipe is connected to the top of the nozzle and is connected to the inside of the air guide groove. An air injection groove is provided on one side of the air guide groove.

[0008] Preferably, the top of the drying oven is provided with a top cover, and the outer periphery of the wafer body is provided with a fixing clamp.

[0009] Preferably, a support is fixed to the back of the drying oven, and guide rails are fixed to both sides of the support. The guide rails are located on both sides of the drying oven, and an electric slider is provided on the top of the guide rails. The electric slider is fixed to both sides of the top cover.

[0010] Preferably, the jet assembly further includes a pusher groove formed at both ends inside the wafer basket, the pusher groove being connected to the interior of the groove, a pusher disk being rotatably arranged inside the pusher groove, an internal cavity being formed at one end of the pusher groove, the internal cavity being connected to the interior of the pusher groove, a drive motor being installed at the bottom of the internal cavity, a gear being fixed on the shaft of the drive motor, a gear ring being meshed on the top of the gear, and the gear ring being fixed to the back of the pusher disk.

[0011] Preferably, the material trough has internal grooves at both ends, which are connected to the inside of the material trough. The internal grooves are provided with pulleys on both sides, and a push belt is provided on the outside of the pulleys. A brush is fixed to the side wall of the push belt.

[0012] Preferably, an air hood is provided on the top of the pulley, and an impeller is rotatably provided inside the air hood. The bottom of the impeller is connected to the top of the pulley. An air injection pipe is fixed to one end of the air hood, and an exhaust pipe is fixed to one side of the air hood. A blowpipe is fixed to one end of the exhaust pipe, and the blowpipe is located above the brush.

[0013] Preferably, filter tanks are provided on both sides of the wafer basket. The filter tanks are located at the bottom of the drying oven. Activated carbon filters are installed inside the filter tanks. A suction bottom pipe is provided below the filter tanks. The suction bottom pipe is installed at the bottom of the drying oven and is connected to the inside of the filter tanks.

[0014] Preferably, a frame is fixed to the top of the top cover. The number of frames is the same as the number of wafer baskets, and they are located directly above the wafer baskets and correspond one-to-one. A cover is hinged to the top of the frame. A flip-top motor is installed at the hinge between the frame and the cover. The rotating shaft of the flip-top motor is connected to the hinge shaft of the cover.

[0015] Preferably, slots are provided on both sides of the top of the frame, and inserts are provided inside the slots. The inserts are fixed to both sides of the bottom of the cover. An injection tube is fixed at the middle position of both sides of the frame and is connected to the inside of the slot. Air ports are provided on both sides inside the frame and are connected to the inside of the slot. A spring cover is provided on the side of the slot near the injection tube.

[0016] Preferably, the insert block, when inserted into the slot, can press the spring cover tightly against the inner wall of the slot, and the insert block inserted into the slot can block the injection tube.

[0017] The beneficial effects of this invention are as follows: 1. The multi-wafer drying equipment of the present invention injects nitrogen into an injection tank via a nitrogen pipeline. The injection tank guides the nitrogen into a guide tank, which then guides the nitrogen into multiple nozzles via connecting pipes. The nozzles then spray the nitrogen onto the wafer body clamped by a fixing fixture. The nitrogen is first blown towards the outside of the wafer body before filling the interior of the drying chamber. The nitrogen that is preferentially blown towards the wafer body can blow off some impurity particles attached to the outside of the wafer body, preventing external impurity particles from being blown off during the wafer body placement into the drying chamber. First, nitrogen is applied to the outside of the wafer body. Second, nitrogen gas is used inside the drying oven to form a barrier that prevents external dust and small particles from entering. At the same time, nitrogen gas prevents the wafer body from reacting with oxygen, thus solving the problem of oxygen causing oxidation on the wafer surface, forming an oxide layer, which affects the electrical performance of the wafer and the precision of subsequent processes. If moisture in the air is adsorbed on the wafer surface, it will introduce moisture impurities. Chemical reactions between the wafer surface and other components in the air can also lead to impurities on the wafer surface.

[0018] 2. The multi-wafer drying equipment of the present invention injects nitrogen into the injection tube. After the nitrogen enters the slot, it is discharged from the air port. Multiple air ports spray nitrogen out within the frame, forming an air curtain barrier. The air curtain barrier prevents oxygen- and moisture-rich air from entering the drying chamber, providing a highly pure and dry environment for the wafer and effectively preventing the wafer from being contaminated and oxidized during placement. Attached Figure Description

[0019] The invention will now be further described with reference to the accompanying drawings.

[0020] Figure 1 This is an overall structural diagram of the present invention; Figure 2 This is a partial structural diagram of the present invention; Figure 3 This is a split view of the wafer basket structure in this invention; Figure 4 This is a partial cross-sectional view of the wafer basket structure in this invention; Figure 5 This is a cross-sectional view of the wafer basket structure in this invention. Figure 1 ; Figure 6 This is a cross-sectional view of the wafer basket structure in this invention. Figure 2 ; Figure 7 This is a partial structural diagram of the jet assembly in this invention; Figure 8 This is a partial structural diagram of the impurity particle cleaning component in this invention; Figure 9 This is a partial structural cross-sectional view of the drying oven in this invention; Figure 10 This is a diagram of the top cover opening structure in this invention; Figure 11 This is a partial sectional view of the top cover structure in this invention; In the diagram: 1. Drying oven; 11. Filter tank; 12. Activated carbon filter; 13. Material trough; 14. Internal tank; 15. Pulley; 16. Push belt; 17. Sweeping brush; 18. Air hood; 19. Paddle wheel; 110. Air injection pipe; 111. Exhaust pipe; 112. Blow-off pipe; 113. Suction bottom pipe; 2. Top cover; 21. Frame; 22. Sealing cover; 23. Slot; 24. Insert block; 25. Injection pipe; 26. Spring cover; 27. Flip-top 1. Cover motor; 28. Air inlet; 3. Guide rail; 31. Bracket; 32. Electric slider; 4. Drying air inlet pipe; 5. Drying air outlet pipe; 6. Wafer basket; 61. Groove; 62. Nozzle; 63. Air injection groove; 64. Air guide groove; 65. Connecting pipe; 66. Pushing groove; 67. Pushing plate; 68. Gear ring; 69. Gear; 610. Drive motor; 611. Internal cavity; 612. Connecting block; 7. Wafer body; 8. Fixing fixture. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0022] like Figures 1 to 11 As shown, an embodiment of the present invention provides a multi-wafer drying apparatus, comprising a drying chamber 1, wafer baskets 6 evenly spaced inside the drying chamber 1, a material trough 13 formed inside the wafer baskets 6, and a wafer body 7 formed inside the material trough 13. A drying gas inlet pipe 4 is installed at the front of the drying chamber 1, and a drying gas outlet pipe 5 is installed at the back of the drying chamber 1. At both ends inside the wafer baskets 6 are jetting assemblies for blowing nitrogen gas onto the outside of the wafer body 7. The jetting assemblies include grooves 61 evenly spaced at both ends inside the wafer baskets 6. The drying oven 1 is equipped with a nozzle 62, the nozzle of which faces the outside of the wafer body 7. Connecting blocks 612 are fixed on both sides inside the groove 61. The nozzle 62 is hinged to the connecting blocks 612 via a rotating shaft. An air guide groove 64 is provided on the outer periphery of the groove 61. The air guide groove 64 is located inside the wafer basket 6. A connecting pipe 65 is connected to the top of the nozzle 62. The connecting pipe 65 is connected to the inside of the air guide groove 64. An air injection groove 63 is provided on one side of the air guide groove 64. The top of the drying oven 1 is equipped with a top cover 2, and a fixing clamp 8 is provided on the outer periphery of the wafer body 7.

[0023] In the wafer processing, after cleaning the wafer, it needs to be dried. If there are metal impurity particles in the drying chamber that adhere to the wafer surface, it will cause uneven etching in the subsequent etching process, affecting the chip's performance and yield. In order to prevent impurity particles in the drying chamber from affecting the wafer, it is necessary to clean the drying chamber. First, oxygen can cause oxidation on the wafer surface, forming an oxide layer that affects the wafer's electrical properties and the precision of subsequent processes. Second, if moisture in the air is adsorbed on the wafer surface, it can introduce moisture impurities. Finally, chemical reactions between the wafer surface and other components in the air can also lead to impurities on the wafer surface. Therefore, a nitrogen pipeline is connected to the gas injection tank 63. When injecting nitrogen into the interior of the drying oven 1, the nitrogen pipeline is used to inject nitrogen into the gas injection tank 63. The gas injection tank 63 guides the nitrogen into the gas guide tank 64. The gas guide tank 64 guides the nitrogen into multiple nozzles 62 through the connecting pipe 65. Then, the nozzles 62 spray the nitrogen onto the wafer body 7 clamped by the fixing clamp 8. The nitrogen is first blown to the outside of the wafer body 7 and then filled into the interior of the drying oven 1. The nitrogen gas blown towards the wafer body 7 can blow off some impurity particles attached to the outside of the wafer body 7, preventing external impurity particles from adhering to the outside of the wafer body 7 during the process of placing the wafer body 7 into the drying oven 1. Secondly, the nitrogen gas filled inside the drying oven 1 forms a barrier inside the drying oven 1 to prevent external dust and small particles, and at the same time, the nitrogen gas prevents the placed wafer body 7 from contacting and reacting with oxygen. By continuously injecting nitrogen into the drying chamber, the continuous flow of nitrogen forms an airflow barrier, preventing external dust and fine particles from entering the drying chamber and maintaining a clean internal environment. Furthermore, the stable nitrogen atmosphere helps ensure that the wafer is placed in a consistent environment when it is placed in the drying chamber, reducing the potential impact of environmental changes on the wafer. At the same time, nitrogen is an inert gas that does not react with substances on the wafer surface under normal conditions. When nitrogen fills the environment where the wafer is located, it effectively blocks oxygen from contacting the wafer, thereby preventing oxidation reactions. This solves the aforementioned problems. A drying gas injection line is connected to the drying gas inlet pipe 4, and a drying gas outlet pipe is connected to the drying gas outlet pipe 5. Nitrogen is continuously injected into the drying chamber 1 using the jet assembly, filling the drying chamber 1 with nitrogen. The nitrogen forms a barrier inside the drying chamber 1 to prevent external dust and small particles from entering. At the same time, the nitrogen prevents the placed wafer body 7 from reacting with oxygen. Then, the wafer body 7 is placed from the top of the top cover 2 onto the wafer basket 6 inside the drying chamber 1 and clamped. The wafer body 7 is then clamped in place in the drying chamber 1 with the fixing clamp 8 to dry it. Drying gas is injected into the drying chamber 1 through the drying gas inlet pipe 4 to dry the wafer body 7. After drying, the wafer body 7 can be removed.

[0024] like Figures 1 to 11 As shown, a support 31 is fixed to the back of the drying oven 1, and guide rails 3 are fixed to both sides of the support 31. The guide rails 3 are located on both sides of the drying oven 1, and an electric slider 32 is provided on the top of the guide rails 3. The electric slider 32 is fixed to both sides of the top cover 2.

[0025] The top cover 2 is moved on the top of the drying chamber 1 by the guide rail 3 and the electric slider 32, so that the top of the drying chamber 1 can be opened or closed, so as to facilitate subsequent maintenance and repair of the interior of the drying chamber 1.

[0026] like Figures 1 to 11 As shown, the jet assembly also includes a pusher groove 66 at both ends inside the wafer basket 6. The pusher groove 66 is connected to the interior of the groove 61. A pusher disk 67 is rotatably installed inside the pusher groove 66. An internal cavity 611 is opened at one end of the pusher groove 66. The internal cavity 611 is connected to the interior of the pusher groove 66. A drive motor 610 is installed at the bottom of the internal cavity 611. A gear 69 is fixed on the shaft of the drive motor 610. A gear ring 68 meshes with the top of the gear 69. The gear ring 68 is fixed to the back of the pusher disk 67.

[0027] The nozzle 62 is hinged to the connecting block 612 via a rotating shaft. A torsion spring is provided on the outside of the rotating shaft of the nozzle 62. The torsion spring is placed inside the connecting block 612 and is used to push the rotating shaft so that the nozzle of the nozzle 62 faces the outside of the wafer body 7. The torsion spring is not shown in the figure. The torsion spring is prior art and will not be described in detail here. By default, the nozzles 62 inside the groove 61 are all facing the outside of the wafer body 7. When nitrogen is ejected, the nitrogen is blown towards the outside of the wafer body 7. Start the drive motor 610, which drives the gear 69 to rotate. The gear 69 drives the meshing gear ring 68 to rotate, causing the pusher disk 67, which is fixedly connected to the gear ring 68, to rotate in the pusher groove 66. The protrusion of the pusher disk 67 gradually moves into the groove 61, gradually pushing the rear of the nozzle 62, causing the nozzle 62 to flip and the nozzle of the nozzle 62 to gradually move towards the center of the wafer body 7, and causing nitrogen gas to be sprayed towards the center of the wafer body 7. At this time, the nozzle 62 is pushed and rotated by the pusher disk 67, and the torsion spring outside the nozzle 62 shaft is twisted and tightened. When the recess of the pusher disk 67 approaches the rear of the nozzle 62, the nozzle 62 gradually returns to the default position under the action of the torsion spring. By gradually spraying the nozzle 62 from the outside of the wafer body 7 towards the center of the wafer body 7, and then from the center of the wafer body 7 outwards, some impurity particles attached to the outside of the wafer body 7 are blown off. This prevents external impurity particles from adhering to the outside of the wafer body 7 during the process of placing the wafer body 7 into the drying oven 1. Furthermore, nitrogen gas preferentially acts on the outside of the wafer body 7, enabling the nitrogen gas to quickly act on the wafer body 7, thereby preventing impurity particles from affecting the wafer body 7.

[0028] like Figures 1 to 11 As shown, the material trough 13 has built-in grooves 14 at both ends, which are connected to the inside of the material trough 13. The built-in grooves 14 are provided with pulleys 15 on both sides of the built-in grooves 14, and a push belt 16 is provided on the outside of the pulleys 15. A brush 17 is fixed on the side wall of the push belt 16.

[0029] Impurity particles blown down by nitrogen gas fall to the bottom of the material trough 13. The pulley 15 drives the push belt 16 to move. The push belt 16 drives the brush 17 fixed on the side wall. After the brush 17 moves into the material trough 13, it cleans the impurity particles that have fallen to the bottom of the material trough 13 to prevent the accumulation of impurity particles.

[0030] like Figures 1 to 11 As shown, an air hood 18 is provided on the top of the pulley 15, and an impeller 19 is rotatably provided inside the air hood 18. The bottom of the impeller 19 is connected to the top of the pulley 15. An air injection pipe 110 is fixed to one end of the air hood 18, and an exhaust pipe 111 is fixed to one side of the air hood 18. A blow pipe 112 is fixed to one end of the exhaust pipe 111, and the blow pipe 112 is located above the brush 17.

[0031] A nitrogen pipeline is connected to the gas injection pipe 110, and a booster pump is used to quickly blow nitrogen into the gas hood 18. The nitrogen blows the impeller 19 to drive the pulley 15 to rotate and move the push belt 16. At the same time, the nitrogen that enters the gas hood 18 is finally discharged from the exhaust pipe 111 and blown by the spray pipe 112 to the outside of the brush 17 to blow off the impurities and particles attached to the outside of the brush 17.

[0032] like Figures 1 to 11 As shown, filter tanks 11 are provided on both sides of the wafer basket 6. The filter tanks 11 are located at the bottom of the drying oven 1. Activated carbon filter screens 12 are installed inside the filter tanks 11. A suction bottom pipe 113 is provided below the filter tanks 11. The suction bottom pipe 113 is installed at the bottom of the drying oven 1 and is connected to the inside of the filter tanks 11.

[0033] A nitrogen suction pipe is installed at the suction bottom pipe 113. By suctioning an appropriate amount of nitrogen from the drying chamber 1, the air pressure inside the drying chamber 1 is reduced. Impurity particles swept down by the push belt 16 and impurity particles blown off by the push belt 16 fall into the filter tanks 11 on both sides of the wafer basket 6. When the impurity particles fall, the suction force generated by the suction bottom pipe 113 sucking nitrogen can suck the impurity particles into the filter tank 11, and the activated carbon filter 12 adsorbs the impurity particles.

[0034] like Figures 1 to 11 As shown, a frame 21 is fixed to the top of the top cover 2. The number of frames 21 is the same as the number of wafer baskets 6, and they are located directly above the wafer baskets 6 and correspond one-to-one. A cover 22 is hinged to the top of the frame 21. A flip-top motor 27 is installed at the hinge of the frame 21 and the cover 22. The rotating shaft of the flip-top motor 27 is connected to the hinge shaft of the cover 22.

[0035] The flip-top motor 27 drives the rotating shaft of the cover 22 to rotate, so that the cover 22 can be opened at the top of the frame 21. The flip-top motor 27 drives the rotating shaft of the cover 22 to rotate in the opposite direction, so that the cover 22 can be closed by covering the top of the frame 21.

[0036] like Figures 1 to 11 As shown, slots 23 are provided on both sides of the top of the frame 21. Inserts 24 are provided inside the slots 23. The inserts 24 are fixed to both sides of the bottom of the cover 22. Injection tubes 25 are fixed in the middle of both sides of the frame 21. The injection tubes 25 are connected to the inside of the slots 23. Air ports 28 are provided on both sides inside the frame 21. The air ports 28 are connected to the inside of the slots 23. A spring cover 26 is provided on the side of the slot 23 near the injection tube 25. The inserts 24 can be inserted into the slot 23 to press the spring cover 26 tightly against the inner wall of the slot 23. The inserts 24 inserted into the slot 23 can block the injection tube 25.

[0037] In the default state, the cover 22 covers the frame 21, and the insert 24 is inserted into the slot 23 to press down the spring cover 26 so that it flips up and sticks to the inner wall of the slot 23; When the cover 22 is opened, the inserts 24 on both sides of its bottom move out of the slot 23, and the spring cover 26, which loses its pressure, flips to the top of the slot 23 to seal it. A nitrogen pipeline is installed at the injection tube 25. When the cover 22 is opened and the wafer body 7 needs to be placed in the drying chamber 1 for drying, nitrogen is injected into the injection tube 25 first. After the nitrogen enters the slot 23, it is discharged from the gas port 28. Multiple gas ports 28 spray nitrogen out within the enclosure 21. The nitrogen forms an air curtain barrier within the enclosure 21. The air curtain barrier prevents the outside air rich in oxygen and water vapor from entering the drying chamber 1, providing a highly pure and dry environment for the wafer and effectively preventing the wafer from being contaminated and oxidized during placement.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-wafer drying apparatus, comprising a drying chamber (1), wafer baskets (6) evenly spaced inside the drying chamber (1), a material trough (13) formed inside the wafer baskets (6), and a wafer body (7) disposed inside the material trough (13), characterized in that: A drying gas inlet pipe (4) is installed at the front of the drying chamber (1), a drying gas outlet pipe (5) is installed at the back of the drying chamber (1), and jetting components for blowing nitrogen gas onto the outside of the wafer body (7) are provided at both ends inside the wafer basket (6). The jet assembly includes grooves (61) evenly spaced at both ends inside the wafer basket (6). A nozzle (62) is provided inside the groove (61), with the nozzle (62) facing the outside of the wafer body (7). Connecting blocks (612) are fixed on both sides inside the groove (61). The nozzle (62) is hinged to the connecting block (612) via a rotating shaft. A gas guide groove (64) is provided on the outer periphery of the groove (61). The gas guide groove (64) is opened inside the wafer basket (6). A connecting pipe (65) is connected to the top of the nozzle (62). The connecting pipe (65) is connected to the inside of the gas guide groove (64). An injection groove (63) is opened on one side of the gas guide groove (64). The jet assembly also includes a pusher groove (66) at both ends inside the wafer basket (6). The pusher groove (66) is connected to the interior of the groove (61). A pusher disk (67) is rotatably installed inside the pusher groove (66). An internal cavity (611) is opened at one end of the pusher groove (66). The internal cavity (611) is connected to the interior of the pusher groove (66). A drive motor (610) is installed at the bottom of the internal cavity (611). A gear (69) is fixed on the shaft of the drive motor (610). A gear ring (68) meshes with the top of the gear (69). The gear ring (68) is fixed to the back of the pusher disk (67). The material trough (13) has an internal groove (14) at both ends. The internal groove (14) is connected to the inside of the material trough (13). The internal groove (14) is provided with pulleys (15) on both sides. The pulleys (15) are provided with a push belt (16) on the outside. The push belt (16) is fixed with a brush (17) on the side wall. An air hood (18) is provided on the top of the pulley (15). An impeller (19) is rotatably provided inside the air hood (18). The bottom of the impeller (19) is connected to the top of the pulley (15). An air injection pipe (110) is fixed at one end of the air hood (18). An exhaust pipe (111) is fixed on one side of the air hood (18). A blow pipe (112) is fixed at one end of the exhaust pipe (111). The blow pipe (112) is located above the brush (17). The wafer basket (6) has filter tanks (11) on both sides. The filter tanks (11) are located at the bottom of the drying oven (1). Activated carbon filter screens (12) are installed inside the filter tanks (11). A suction bottom pipe (113) is installed below the filter tanks (11). The suction bottom pipe (113) is installed at the bottom of the drying oven (1) and is connected to the inside of the filter tanks (11).

2. The polywafer drying equipment according to claim 1, characterized in that: The top of the drying oven (1) is provided with a top cover (2), and the outer periphery of the wafer body (7) is provided with a fixing clamp (8).

3. The polywafer drying equipment according to claim 2, characterized in that: A bracket (31) is fixed to the back of the drying oven (1), and guide rails (3) are fixed to both sides of the bracket (31). The guide rails (3) are located on both sides of the drying oven (1), and an electric slider (32) is provided on the top of the guide rails (3). The electric sliders (32) are fixed to both sides of the top cover (2).

4. The polywafer drying equipment according to claim 1, characterized in that: The top of the top cover (2) is fixed with a frame (21). The number of frames (21) is the same as the number of wafer baskets (6), and they are located directly above the wafer baskets (6) and correspond one to one. The top of the frame (21) is hinged with a cover (22). A flip-top motor (27) is installed at the hinge of the frame (21) and the cover (22). The rotating shaft of the flip-top motor (27) is connected to the hinge shaft of the cover (22).

5. The polywafer drying equipment according to claim 4, characterized in that: The top of the frame (21) has slots (23) on both sides. The slots (23) have inserts (24) inside. The inserts (24) are fixed to the bottom of the cap (22) on both sides. The middle position of the two sides of the frame (21) has injection tubes (25) fixed. The injection tubes (25) are connected to the inside of the slots (23). The two sides of the inside of the frame (21) have air ports (28) connected to the inside of the slots (23). The inside of the slots (23) has spring caps (26) on the side near the injection tubes (25).

6. The polywafer drying equipment according to claim 5, characterized in that: The insert (24) can be inserted into the slot (23) to press the spring cover (26) against the inner wall of the slot (23), and the insert (24) inserted into the slot (23) can block the injection tube (25).

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