A method for manufacturing a jack of a circuit board

Abstract

The application discloses a jack manufacturing method of a circuit board, which comprises the following steps: scanning the circuit board to obtain the distribution of the through holes on the circuit board and to form drilling pattern data; taking an aluminum sheet, drilling the aluminum sheet according to the drilling pattern data to form flow guide holes on the aluminum sheet which are consistent with the distribution of the through holes, and the drilling tool diameter is related to the jack process; pasting the aluminum sheet on a screen printing screen and covering the circuit board to align the flow guide holes with the through holes; using a solder mask jack process or a resin jack process to inject jack ink into the through holes through the flow guide holes to form the jack; and baking the circuit board to solidify the jack. The jack manufacturing method of the circuit board provided by the application improves the jack precision by standardizing the design of the flow guide holes on the aluminum sheet.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and specifically to a method for manufacturing vias in circuit boards. Background Technology

[0002] Printed circuit boards (PCBs) are important electronic components. They serve as the basic support for electronic components and the carrier for the electrical interconnection of electronic components. Because they are made using electronic printing technology, they are called "printed" circuit boards.

[0003] During the circuit board manufacturing process, ink is used to plug the through holes of the circuit board to improve the impedance characteristics of the circuit board and enhance its appearance quality. After the ink is plugged, the ink is cured by exposure, development and baking to form the plugged through hole fabrication.

[0004] In the existing technology, during the via plugging process, guide holes are drilled on the aluminum sheet to allow the plugging ink to flow from the guide holes on the aluminum sheet into the through holes of the circuit board. The position and size of the guide holes on the aluminum sheet affect the plugging accuracy, so the guide holes need to be designed in a standardized manner to improve the plugging accuracy. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method for manufacturing via plugging on a circuit board, which improves the accuracy of via plugging by standardizing the design of the guide holes on the aluminum sheet.

[0006] The technical solution of the present invention is as follows:

[0007] A method for manufacturing vias in a circuit board includes the following steps:

[0008] Step S1: Scan the circuit board to obtain the distribution of vias on the circuit board and generate drilling pattern data;

[0009] Step S2: Take an aluminum sheet and drill holes in it according to the drilling pattern data to form guide holes on the aluminum sheet that are consistent with the distribution of through holes.

[0010] Step S3: Aluminum sheet is attached to the screen printing stencil and covered on the circuit board, so that the guide hole and the through hole are aligned.

[0011] Step S4: Using solder resist plugging process or resin plugging process, plugging ink is injected into the through hole through the guide hole to form plugging hole;

[0012] Step S5: Bake on a baking plate to allow the plugged holes to harden.

[0013] Among them, when the circuit board of the same part number has through holes with different diameters, and the through hole diameter D satisfies 0.25mm≤D<0.40mm, the aluminum sheet drilling tool diameter D1=0.35mm; when the through hole diameter D satisfies 0.4mm≤D≤0.6mm, the aluminum sheet drilling tool diameter D1=0.3mm.

[0014] When using the solder mask plugging process, if circuit boards of the same part number have through holes of the same diameter, and the through hole diameter D satisfies 0.25mm≤D≤0.5mm, the aluminum sheet drilling tool diameter D1=0.4mm; when the through hole diameter D satisfies 0.5mm<D≤0.6mm, the aluminum sheet drilling tool diameter D1=0.5mm.

[0015] When using resin plugging technology, if circuit boards of the same part number have through holes of the same diameter and the diameter of the through hole is D, the diameter of the aluminum sheet drilling channel is D1 = D + 0.15 mm.

[0016] Furthermore, when the solder mask plugging process is adopted and it is double-sided plugging, the minimum board thickness is 0.5mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.6mm, the maximum thickness-to-diameter ratio is 8:1, and the maximum diameter range is 0.2mm.

[0017] When using solder resist plugging technology, and it is a partial plugging process, the minimum board thickness is 0.8mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.3mm, and the maximum thickness-to-diameter ratio is 8:1.

[0018] Furthermore, when using resin plugging technology, the minimum board thickness is 0.5mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.75mm, the maximum thickness-to-diameter ratio is 8:1, and the maximum diameter range is 0.3mm.

[0019] Furthermore, when using a weld-proof plugging process, specifically a semi-plugging process, the diameter of the aluminum sheet cutting tool is the same as the diameter of the through hole.

[0020] Furthermore, the spacing between the walls of the guide holes on the aluminum sheet is L. When L≤0.02mm, the diameter of the drill bit for the aluminum sheet is D1-0.1mm; when 0.02mm<L<0.08mm, the diameter of the drill bit for the aluminum sheet is D1-0.05mm; when L≥0.08mm, the diameter of the drill bit for the aluminum sheet is D1.

[0021] Furthermore, the aluminum sheet is more than 7cm larger on one side than the forming area of ​​the circuit board.

[0022] Furthermore, each part number corresponds to two aluminum sheets.

[0023] Furthermore, when the circuit board is a board with BGA, the hole is plugged from the back of the BGA; when the circuit board is a board with a single-sided window, the hole is plugged from the side with the oil cover.

[0024] Compared with the prior art, the circuit board via-filling method provided by the present invention has the following advantages:

[0025] The circuit board via-plugging method provided by this invention improves the via-plugging accuracy by standardizing the design of the guide holes on the aluminum sheet, so that the position and size of the guide holes match the through holes. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be further described below.

[0027] It should be noted that the descriptions of these embodiments are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0028] A method for manufacturing vias in a circuit board includes the following steps:

[0029] Step S1: Scan the circuit board to obtain the distribution of vias on the circuit board and generate drilling pattern data;

[0030] Step S2: Take an aluminum sheet and drill holes in it according to the drilling pattern data to form guide holes on the aluminum sheet that are consistent with the distribution of through holes.

[0031] Specifically, the drilling data includes not only through holes, but also drill pin holes, part numbers, and orientation holes; and the drill bit diameter is related to the plugging process, as detailed below:

[0032] When using the solder mask plugging process, if circuit boards of the same part number have through holes with different diameters, and the through hole diameter D satisfies 0.25mm≤D<0.40mm, the aluminum sheet drilling tool diameter D1=0.35mm; when the through hole diameter D satisfies 0.4mm≤D≤0.6mm, the aluminum sheet drilling tool diameter D1=0.3mm.

[0033] When using the solder mask plugging process, if circuit boards of the same part number have through holes of the same diameter, and the through hole diameter D satisfies 0.25mm≤D≤0.5mm, the aluminum sheet drilling tool diameter D1=0.4mm; when the through hole diameter D satisfies 0.5mm<D≤0.6mm, the aluminum sheet drilling tool diameter D1=0.5mm.

[0034] When using resin plugging technology, if circuit boards of the same part number have through holes of the same diameter and the diameter of the through hole is D, the diameter of the aluminum sheet drilling channel is D1 = D + 0.15 mm.

[0035] Furthermore, when the solder mask plugging process is adopted and it is double-sided plugging, the minimum board thickness is 0.5mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.6mm, the maximum thickness-to-diameter ratio is 8:1, and the maximum diameter range is 0.2mm.

[0036] When using solder resist plugging technology, and specifically partial plugging, the minimum board thickness is 0.8mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.3mm, and the maximum thickness-to-diameter ratio is 8:1. The partial plugging hole diameter is designed to be ≤0.3mm, without changing the number of drilling layers. If the drill bit length is insufficient, a split-drill method must be used, employing an extended drill bit with the aluminum blade diameter equal to the through hole diameter. It should be noted that partial plugging is not used when the solder resist ink is white.

[0037] Furthermore, when using resin plugging technology, the minimum board thickness is 0.5mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.75mm, the maximum thickness-to-diameter ratio is 8:1, and the maximum diameter range is 0.3mm.

[0038] The spacing between the guide holes on the aluminum sheet is set to L. When L≤0.02mm, the diameter of the drill bit for the aluminum sheet is D1-0.1mm; when 0.02mm<L<0.08mm, the diameter of the drill bit for the aluminum sheet is D1-0.05mm; when L≥0.08mm, the diameter of the drill bit for the aluminum sheet is D1.

[0039] In this invention, the aluminum sheet is more than 7cm larger on one side than the forming area of ​​the circuit board, and each part number corresponds to two aluminum sheets.

[0040] Step S3: Aluminum sheet is attached to the screen printing stencil and covered on the circuit board, so that the guide hole and the through hole are aligned.

[0041] Step S4: Using solder resist plugging process or resin plugging process, plugging ink is injected into the through hole through the guide hole to form plugging hole;

[0042] Step S5: Bake on a baking plate to allow the plugged holes to harden.

[0043] In this invention, the solder resist plugging process, resin plugging process, and baking plate process refer to existing technologies.

[0044] The circuit board via filling method provided by this invention allows for the following steps: when the circuit board is a regular board, the vias are filled from the back of the IC; if there is no IC, the vias are filled from the soldering side. When the circuit board is a board with a BGA, the vias are filled from the back of the BGA. When the circuit board is a board with a single-sided window, the vias are filled from the grease-covered side.

[0045] The circuit board via filling method of the present invention adopts resin via filling process, and the via filling fullness of single-sided and double-sided via filling is ≥95%. The via filling process adopts solder resist filling process, and the via filling fullness can meet the conventional requirements of ≥65% and light-proof.

[0046] The embodiments of the present invention have been described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A method for manufacturing via plugs on a circuit board, characterized in that, Includes the following steps: Step S1: Scan the circuit board to obtain the distribution of vias on the circuit board and generate drilling pattern data; Step S2: Take an aluminum sheet and drill holes in it according to the drilling pattern data to form guide holes on the aluminum sheet that are consistent with the distribution of through holes. Step S3: Aluminum sheet is attached to the screen printing stencil and covered on the circuit board, so that the guide hole and the through hole are aligned. Step S4: Using solder resist plugging process or resin plugging process, plugging ink is injected into the through hole through the guide hole to form plugging hole; Step S5: Bake on a baking plate to allow the plugged holes to harden. Among them, when the circuit board of the same part number has through holes with different diameters, and the through hole diameter D satisfies 0.25mm≤D<0.40mm, the aluminum sheet drilling tool diameter D1=0.35mm; when the through hole diameter D satisfies 0.4mm≤D≤0.6mm, the aluminum sheet drilling tool diameter D1=0.3mm. When using the solder mask plugging process, if circuit boards of the same part number have through holes of the same diameter, and the through hole diameter D satisfies 0.25mm≤D≤0.5mm, the aluminum sheet drilling tool diameter D1=0.4mm; when the through hole diameter D satisfies 0.5mm<D≤0.6mm, the aluminum sheet drilling tool diameter D1=0.5mm. When using resin plugging technology, if circuit boards of the same part number have through holes of the same diameter and the diameter of the through hole is D, the diameter of the aluminum sheet drilling channel D1 = D + 0.15 mm. The spacing between the guide holes on the aluminum sheet is L. When L≤0.02mm, the diameter of the drill bit for the aluminum sheet is D1-0.1mm; when 0.02mm<L<0.08mm, the diameter of the drill bit for the aluminum sheet is D1-0.05mm; when L≥0.08mm, the diameter of the drill bit for the aluminum sheet is D1.

2. The method for manufacturing vias on a circuit board according to claim 1, characterized in that, When using solder resist plugging technology, and it is double-sided plugging, the minimum board thickness is 0.5mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.6mm, the maximum thickness-to-diameter ratio is 8:1, and the maximum diameter range is 0.2mm. When using solder mask plugging technology, and it is a partial plugging process, the minimum board thickness is 0.8mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.3mm, and the maximum thickness-to-diameter ratio is 8:

1.

3. The method for manufacturing vias on a circuit board according to claim 1, characterized in that, When using resin plugging technology, the minimum board thickness is 0.5mm, the maximum board thickness is 2mm, the maximum diameter of the through hole is 0.75mm, the maximum thickness-to-diameter ratio is 8:1, and the maximum diameter range is 0.3mm.

4. The method for manufacturing vias on a circuit board according to claim 2, characterized in that, When using a weld-proof plugging process, and specifically a partial plugging process, the diameter of the aluminum sheet cutting tool is the same as the diameter of the through hole.

5. The method for manufacturing vias on a circuit board according to claim 1, characterized in that, The aluminum sheet is more than 7cm larger on one side than the forming area of ​​the circuit board.

6. The method for manufacturing vias on a circuit board according to claim 5, characterized in that, Each part number corresponds to two aluminum sheets.

7. The method for manufacturing vias on a circuit board according to claim 1, characterized in that, When the circuit board has a BGA, plug the hole from the back of the BGA; when the circuit board has a single-sided window, plug the hole from the top of the cover.