Semiconductor polishing chemical liquid processing cycle device

CN119075397BActive Publication Date: 2026-10-20SUZHOU WINMAX TECH CORP
View PDF 4 Cites 0 Cited by

Patent Information

Application Number
CN202411230327.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-04
Publication Date
2026-10-20
Estimated Expiration
2044-09-04

AI Technical Summary

Technical Problem

[0002]半导体研磨化学液主要针对的是晶圆在加工过程中进行研磨、切割等工序所带来的热量和清洗领域,晶圆加工后,会产生大量的研磨化学废液,这些液体含有大量的重金属、氟化物和其他有机物杂质等有害物质,为了避免其直接排放破坏环境和便于循环利用,现有技术中,已经开发了针对半导体研磨化学液的处理循环装置,其中,去除水中的有毒有害物质主要采用中和法:即添加中和剂调节废液中的pH值,使废水中的重金属离子和氟化物等有毒有害物质形成沉淀物,然后通过固液分离将沉淀物从废水中去除,中和法操作简单,对于处理重金属和氟化物含量较高的废水效果较好,但装置在处理时,对于产生的沉淀没有很好的处理办法,在实现中和产生的沉淀物生成后,一般通过溢流口排出处理好的废水,使其进行进入下一处理工序,但溢流排液的效率太低,且需要等处理好的废水排完之后才能加入新的废水,这一来二去大大降低了装置的处理效率,且随着底部沉淀物愈来愈多,每次处理的废水量都会下降,而现有技术中对于沉淀物的处理也不能做到每次同步清理,沿着制约了装置的使用效率

Benefits of technology

[0014]1、本装置经过重新设计,实现了沉淀物杂质的自动同步清理功能,有效提高了装置的废水处理量,通过在处理箱的内腔底部开设圆形的储料腔,并通过隔离板一与隔离板二分别前后插入处理箱的内壁,形成抵接密封,隔离处理箱内腔的上侧与储料腔,并通过伸缩杆二和伸缩杆三控制隔离板一与隔离板二分离,实现沉淀进入储料腔中,并能够进行隔离,当储料腔中经过多轮的处理积攒了足够多的沉淀物,此时,可通过隔离板一与隔离板二抵接密封,通过电机带动刮料块、密封垫旋转,一方面对储料腔的内壁进行刮除,同时,将排料口打开,将沉淀物沿排料口排出,使装置能决定在排出处理好的废水同时,是否将储料腔中的沉淀物排出,大大提高了装置的工作效率。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119075397B_ABST
    Figure CN119075397B_ABST
Patent Text Reader

Abstract

The application belongs to the technical field of semiconductor and discloses a semiconductor grinding chemical liquid treatment circulating device, which comprises a treatment box, a pH monitor, a water inlet pipe, a neutralizing agent adding pipe and a balance pipe, a siphon pipe is fixedly installed on the right side of the inner wall of the treatment box, a communicating pipe one is fixedly connected to one side of the outer surface of the siphon pipe, a middle pipe is fixedly connected to one end of the communicating pipe one, a communicating pipe two is fixedly connected to one end of the middle pipe, and a sealing plate is sealingly hinged to one end of the communicating pipe two. The device is redesigned to realize the automatic and synchronous cleaning function of the precipitate impurities, effectively improve the wastewater treatment capacity of the device, and rotate the scraping block and the sealing gasket by the motor. On the one hand, the inner wall of the storage cavity is scraped, and on the other hand, the discharge port is opened, the precipitate is discharged along the discharge port, the device can determine whether the precipitate in the storage cavity is discharged at the same time when the treated wastewater is discharged, and the working efficiency of the device is greatly improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, specifically a semiconductor grinding chemical solution treatment and circulation device. Background Technology

[0002] Semiconductor polishing chemicals are primarily used in the heat and cleaning processes generated during wafer processing, such as polishing and dicing. After wafer processing, a large amount of polishing chemical wastewater is generated. This wastewater contains significant amounts of heavy metals, fluorides, and other organic impurities. To prevent direct discharge and environmental damage, and to facilitate recycling, existing technologies have developed treatment and recycling devices for semiconductor polishing chemicals. The removal of toxic and harmful substances from the water mainly employs a neutralization method: adding a neutralizing agent to adjust the pH value of the wastewater causes heavy metal ions and fluorides to precipitate. The precipitate is then separated from the wastewater through solid-liquid separation. Water removal and neutralization methods are simple to operate and effective for treating wastewater with high levels of heavy metals and fluorides. However, the equipment lacks a good method for dealing with the precipitates generated during treatment. After the precipitates are formed during neutralization, the treated wastewater is usually discharged through an overflow outlet to proceed to the next treatment stage. However, the overflow discharge efficiency is too low, and new wastewater can only be added after the treated wastewater has been discharged. This process significantly reduces the treatment efficiency of the equipment. Furthermore, as the amount of precipitates at the bottom increases, the amount of wastewater treated each time decreases. Existing technologies cannot simultaneously clean the precipitates each time, further limiting the efficiency of the equipment. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor polishing chemical solution treatment and circulation device to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor polishing chemical solution treatment and circulation device, comprising a treatment tank, a pH monitor, a water inlet pipe, a neutralizing agent addition pipe, and a balancing pipe. A siphon pipe is fixedly installed on the right side of the inner wall of the treatment tank. A connecting pipe I is fixedly connected to one side of the outer surface of the siphon pipe. A middle pipe is fixedly connected to one end of the connecting pipe I. A connecting pipe II is fixedly connected to one end of the middle pipe. A sealing plate is sealed and hinged to one end of the connecting pipe II. A connecting pipe III is fixedly installed on the top of the outer surface of the middle pipe. A telescopic rod I is installed on the top of the connecting pipe III. A piston is fixedly installed on the telescopic end of the telescopic rod I.

[0005] The bottom of the processing box has a storage chamber and a discharge port. A motor is also installed at the bottom of the processing box. A scraper block is fixedly installed on the output shaft of the motor. A sealing gasket is fixedly connected to the outer surface of the scraper block. A rectangular groove extending from the front to the back of the processing box is opened. Telescopic rod two and telescopic rod three are respectively installed on the front and back of the processing box. A front fixing plate is fixedly connected to the telescopic end of telescopic rod two. An isolation plate one is fixedly installed at the bottom of the front fixing plate. The isolation plate one is sealed and snapped into the rectangular groove. A rear fixing plate is fixedly connected to the telescopic end of telescopic rod three. An isolation plate two is fixedly installed at the bottom of the rear fixing plate. The isolation plate two is sealed and snapped into another set of sealing grooves. The isolation plate two and isolation plate one are sealed and abut against the inner cavity of the processing box.

[0006] As a preferred embodiment of the present invention, the water inlet pipe, the neutralizing agent addition pipe and the balancing pipe are all fixedly connected to the top of the treatment tank, the pH monitor is installed on the left side of the inner wall of the treatment tank, the balancing pipe is set in four groups and is distributed circumferentially at the four corners of the top of the treatment tank, and a discharge frame located outside the discharge port is fixedly installed at the bottom of the treatment tank.

[0007] As a preferred embodiment of the present invention, the contact surfaces of the isolation plate 1 and the isolation plate 2 are respectively provided with a slot 1 and a slot 2, a sealing strip 1 is glued inside the slot 1, and a sealing strip 2 is glued inside the slot 2, and the sealing strip 2 abuts against the sealing strip 1.

[0008] As a preferred embodiment of the present invention, the siphon tube is U-shaped and has a 180° inverted design. One end of the siphon tube is located in the inner cavity of the processing box. A fixing post is fixedly installed on the right side of the processing box, and the fixing post is fixedly connected to the outer surface of the siphon tube.

[0009] As a preferred embodiment of the present invention, a sealing ring is fixedly sleeved at one end of the sealing plate located in the inner cavity of the second connecting pipe, and the sealing ring is interference-fitted with the inner wall of the second connecting pipe.

[0010] In a preferred embodiment of the present invention, both the scraper block and the discharge port are fan-shaped, and the inner wall dimension of the discharge port is equidistant from the outer wall dimension of the scraper block.

[0011] In a preferred embodiment of the present invention, the storage cavity is circular in shape, and the diameter of the side of the sealing gasket that abuts against the inner wall of the storage cavity is equal.

[0012] In a preferred embodiment of the present invention, both the first and second isolation plates are located above the storage chamber, and a gap is left between the end of the siphon tube located in the inner cavity of the processing box and the upper surface of the first and second isolation plates, the gap allowing liquid to pass through.

[0013] The beneficial effects of this invention are as follows:

[0014] 1. This device has been redesigned to achieve automatic synchronous cleaning of precipitates and impurities, effectively increasing the wastewater treatment capacity. A circular storage chamber is created at the bottom of the treatment tank's inner cavity. Two isolation plates, one at the front and one at the back, are inserted into the inner wall of the treatment tank to form a seal, isolating the upper part of the treatment tank's inner cavity from the storage chamber. Telescopic rods two and three control the separation of isolation plates, allowing precipitates to enter and be isolated. When sufficient precipitates accumulate in the storage chamber after multiple treatments, the seal between isolation plates one and two is achieved. A motor drives the scraper block and sealing gasket to rotate, scraping the inner wall of the storage chamber while simultaneously opening the discharge port to expel the precipitates. This allows the device to decide whether to discharge precipitates from the storage chamber along with the treated wastewater, significantly improving the device's efficiency.

[0015] 2. Then, by setting up connecting pipe one, middle pipe, connecting pipe two, sealing plate, sealing ring, connecting pipe three, telescopic rod one, and piston, faster wastewater discharge is achieved. Through the siphon pipe with a "U"-shaped design, the inner cavity of the treatment box and the middle pipe are connected. When the isolation plates one and two isolate the upper side of the inner cavity of the treatment box, the telescopic rod one drives the piston upward, generating negative pressure in the inner cavity of the middle pipe, firmly sucking the sealing plate, ensuring that the suction force is entirely applied to the inner cavity of the siphon pipe, and sucking the wastewater in the inner cavity of the treatment box into the side of the inner cavity of the siphon pipe close to the connecting pipe one. As the piston moves up to above the balance hole on the surface of the connecting pipe three, the connecting pipe three is no longer sealed, and the suction force disappears. At this time, the wastewater in the inner cavity of the siphon pipe is quickly discharged through the connecting pipe one, middle pipe, and connecting pipe two by siphon. Compared with the traditional overflow hole design, this design greatly increases the flow rate.

[0016] 3. Isolation plate one and isolation plate two are connected and sealed together or separated by the front fixed plate and telescopic rod three. The purpose is to isolate the upper part of the treatment tank cavity from the storage cavity. The storage cavity is used to treat the precipitates generated during the neutralization reaction of wastewater. As the precipitates increase, the liquid space in the storage cavity will be squeezed by the solid precipitates. At this time, after the storage cavity is isolated, there is actually very little liquid inside. Therefore, when the discharge port is opened, not too much wastewater will be lost. This will make the volume of the precipitates infinitely close to the volume of the storage cavity cavity and maximize the utilization of the storage cavity. Attached Figure Description

[0017] Figure 1 This is a front view diagram of the structure of the present invention;

[0018] Figure 2 This is a top view of the structure of the present invention;

[0019] Figure 3 This is a front sectional view of the structure of the present invention;

[0020] Figure 4 For the present invention Figure 3 Enlarged schematic diagram of the structure at point A;

[0021] Figure 5 This is a side sectional view of the structure of the present invention;

[0022] Figure 6 For the present invention Figure 5 Enlarged schematic diagram of the structure at point B;

[0023] Figure 7 This is a top sectional view of the processing box of the present invention;

[0024] Figure 8 This is a schematic diagram showing the separation of the discharge frame, motor, scraper block and sealing gasket of the present invention.

[0025] In the diagram: 1. Processing tank; 2. pH monitor; 3. Inlet pipe; 4. Neutralizing agent addition pipe; 5. Balancing pipe; 6. Fixing column; 7. Siphon pipe; 8. Connecting pipe one; 9. Middle pipe; 10. Connecting pipe two; 11. Sealing plate; 12. Sealing ring; 13. Connecting pipe three; 14. Telescopic rod one; 15. Piston; 16. Discharge frame; 17. Motor; 18. Telescopic rod two; 19. Front fixing plate; 20. Isolation plate one; 201. Slot one; 202. Sealing strip one; 21. Telescopic rod three; 22. Rear fixing plate; 23. Isolation plate two; 231. Slot two; 232. Sealing strip two; 24. Scraper block; 25. Sealing gasket; 26. Discharge port; 27. Storage chamber. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] like Figures 1 to 8As shown, this embodiment of the invention provides a semiconductor polishing chemical solution treatment and circulation device, including a treatment tank 1, a pH monitor 2, a water inlet pipe 3, a neutralizing agent addition pipe 4, and a balance pipe 5. A siphon pipe 7 is fixedly installed on the right side of the inner wall of the treatment tank 1. A connecting pipe 8 is fixedly connected to one side of the outer surface of the siphon pipe 7. A middle pipe 9 is fixedly connected to one end of the connecting pipe 8. A connecting pipe 10 is fixedly connected to one end of the middle pipe 9. A sealing plate 11 is sealed and hinged to one end of the connecting pipe 10. A connecting pipe 3 13 is fixedly installed on the top of the outer surface of the middle pipe 9. A telescopic rod 14 is installed on the top of the connecting pipe 3 13. A piston 15 is fixedly installed on the telescopic end of the telescopic rod 14.

[0028] The bottom of the inner cavity of the processing box 1 is provided with a storage cavity 27 and a discharge port 26. A motor 17 is also installed at the bottom of the processing box 1. A scraper block 24 is fixedly installed on the output shaft of the motor 17. A sealing gasket 25 is fixedly connected to the outer surface of the scraper block 24. A rectangular groove extending from the front to the back is provided on the front of the processing box 1. Telescopic rod 28 and telescopic rod 3 21 are respectively installed on the front and back of the processing box 1. A front fixing plate 19 is fixedly connected to the telescopic end of telescopic rod 28. An isolation plate 10 is fixedly installed at the bottom of the front fixing plate 19. The isolation plate 10 is sealed and snapped into the rectangular groove. A rear fixing plate 22 is fixedly connected to the telescopic end of telescopic rod 3 21. An isolation plate 23 is fixedly installed at the bottom of the rear fixing plate 22. The isolation plate 23 is sealed and snapped into another set of sealing grooves. The isolation plate 23 and the isolation plate 10 seal against the inner cavity of the processing box 1.

[0029] This redesigned device achieves automatic synchronous cleaning of precipitates and impurities, effectively increasing the wastewater treatment capacity. A circular storage chamber 27 is created at the bottom of the inner cavity of the treatment tank 1. Isolation plates 20 and 23 are inserted into the inner wall of the treatment tank 1, forming a seal that isolates the upper part of the inner cavity of the treatment tank 1 from the storage chamber 27. The separation of isolation plates 20 and 23 is controlled by telescopic rods 18 and 21, allowing precipitates to enter and be isolated within the storage chamber 27. When sufficient precipitates accumulate in the storage chamber 27 after multiple treatments, the seal between isolation plates 20 and 23 is achieved. Motor 17 drives the scraper block 24 and sealing gasket 25 to rotate, scraping the inner wall of the storage chamber 27 while simultaneously opening the discharge port 26 to discharge the precipitates. This allows the device to decide whether to discharge the precipitates from the storage chamber 27 while simultaneously discharging the treated wastewater, significantly improving the device's efficiency.

[0030] Then, by setting up a connecting pipe 8, a middle pipe 9, a connecting pipe 10, a sealing plate 11, a sealing ring 12, a connecting pipe 13, a telescopic rod 14, and a piston 15, faster wastewater discharge is achieved. A siphon pipe 7 with a "U"-shaped design connects the inner cavity of the treatment tank 1 and the middle pipe 9. When the isolation plates 20 and 23 isolate the upper side of the inner cavity of the treatment tank 1, the telescopic rod 14 drives the piston 15 upward, generating negative pressure in the inner cavity of the middle pipe 9, thus sealing the... Plate 11 firmly holds the siphon tube 7, ensuring that the suction force is fully applied to the inner cavity of the siphon tube 7. The wastewater in the inner cavity of the treatment tank 1 is drawn into the inner cavity of the siphon tube 7 near the side of the connecting pipe 1 8. As the piston 15 moves up to above the balance hole on the surface of the connecting pipe 3 13, the connecting pipe 3 13 is no longer sealed, and the suction force disappears. At this time, the wastewater in the inner cavity of the siphon tube 7 is quickly discharged through the connecting pipe 1 8, the middle pipe 9, and the connecting pipe 2 10 via siphon. Compared with the traditional overflow hole design, this design greatly increases the flow rate.

[0031] The isolation plates 1 and 23 are sealed together or separated by the front fixing plate 19 and the telescopic rod 3 21. The purpose is to isolate the upper side of the inner cavity of the treatment box 1 from the storage cavity 27. The storage cavity 27 is used for the sediment generated during the neutralization reaction of wastewater. As the sediment increases, the liquid space in the inner cavity of the storage cavity 27 will be squeezed by the solid sediment. At this time, after the storage cavity 27 is isolated, there is actually very little liquid inside it. Therefore, when the discharge port 26 is opened, not much wastewater will be lost. This will make the volume of the sediment infinitely close to the volume value of the inner cavity of the storage cavity 27 and maximize the utilization of the storage cavity 27.

[0032] Among them, the water inlet pipe 3, the neutralizing agent addition pipe 4 and the balance pipe 5 are all fixedly connected to the top of the treatment box 1, the pH monitor 2 is installed on the left side of the inner wall of the treatment box 1, the balance pipe 5 is set into four groups and is distributed equidistantly in the four corners of the top of the treatment box 1, and the bottom of the treatment box 1 is fixedly installed with a discharge frame 16 located outside the discharge port 26.

[0033] The inlet pipe 3 is used to connect wastewater, the neutralizing agent addition pipe 4 is used to add neutralizing agent, and the balancing pipe 5 is used to balance the atmospheric pressure chamber inside and outside the treatment tank 1 to ensure that the inner cavity of the siphon pipe 7 can smoothly utilize siphon drainage.

[0034] Among them, the contact surfaces of the isolation plate 1 20 and the isolation plate 23 are respectively provided with the slot 1 201 and the slot 2 231. The inside of the slot 1 201 is glued with the sealing strip 1 202, and the inside of the slot 2 231 is glued with the sealing strip 2 232. The sealing strip 2 232 abuts against the sealing strip 1 202.

[0035] The isolation plate 1 20 and the isolation plate 23 are connected or separated by the front fixed plate 19 and the telescopic rod 3 21. The purpose is to isolate the upper part of the inner cavity of the treatment tank 1 from the storage cavity 27. The storage cavity 27 is used for the sediment generated during the neutralization reaction of wastewater. As the sediment increases, the liquid space in the inner cavity of the storage cavity 27 will be squeezed by the solid sediment. At this time, after the storage cavity 27 is isolated, there is actually very little liquid inside, so that not much wastewater will be lost when the discharge port 26 is opened.

[0036] The siphon tube 7 is U-shaped and has a 180° inverted design. One end of the siphon tube 7 is located in the inner cavity of the processing box 1. A fixing post 6 is fixedly installed on the right side of the processing box 1, and the fixing post 6 is fixedly connected to the outer surface of the siphon tube 7.

[0037] like Figure 3 As shown, the siphon pipe 7, which is designed in a "U" shape, is inverted on the right side of the treatment tank 1. This design is mainly to realize the siphon effect of the siphon pipe 7 on the wastewater in the inner cavity of the treatment tank 1. When the wastewater is sucked into the highest point of the siphon pipe 7 by the negative pressure generated by the piston 15 moving upward and flows down along its other end, no suction force is needed, and all the wastewater in the inner cavity of the treatment tank 1 can be sucked away.

[0038] Among them, a sealing ring 12 is fixedly sleeved at one end of the sealing plate 11 located in the inner cavity of the second connecting pipe 10, and the sealing ring 12 is in an interference fit with the inner wall of the second connecting pipe 10.

[0039] The sealing plate 11 acts as a one-way valve. When the piston 15 moves upward, it generates suction inside the connecting pipe 10. At this time, the sealing plate 11 is tied to one end of the connecting pipe 10 under the action of gravity and is sealed by the sealing ring 12, thus firmly holding the sealing plate 11 to one end of the connecting pipe 10. This ensures that the negative pressure generated by the piston 15 can be fully applied to the siphon pipe 7 and the wastewater inside the treatment tank 1. When the wastewater passes through the connecting pipe 10, the impact force generated can push the sealing plate 11 open from the inside to the outside, preventing it from obstructing the discharge of wastewater.

[0040] The scraper block 24 and the discharge port 26 are both fan-shaped, and the inner wall size of the discharge port 26 is equidistant from the outer wall size of the scraper block 24.

[0041] The scraper block 24 is used to block the discharge port 26, so that wastewater does not leak when the storage chamber 27 is connected to the inner cavity of the treatment box 1.

[0042] The storage cavity 27 is circular in shape, and the diameter of the sealing gasket 25 that abuts against the inner wall of the storage cavity 27 is equal.

[0043] The storage chamber 27 can be scraped from all directions by rotating the scraper block 24 and the sealing gasket 25 to align the inner wall, thus preventing the residue from being left behind.

[0044] Among them, the first isolation plate 20 and the second isolation plate 23 are both located above the storage chamber 27. The siphon pipe 7 is located at one end of the inner cavity of the processing box 1 and has a gap between it and the upper surface of the first isolation plate 20 and the second isolation plate 23, which allows liquid to pass through.

[0045] like Figure 3 As shown, the distance between the bottom end of the siphon tube 7 and the upper surface of the isolation plate 23 is very small, but liquid can pass through, thus facilitating the discharge of as much wastewater as possible from the inner cavity of the treatment tank 1.

[0046] Working principle:

[0047] When this device is in operation, firstly, grinding chemical wastewater is added to the inner cavity of the treatment tank 1 through the water inlet pipe 3, and then the extension rods 18 and 21 are activated to extend, which respectively drive the isolation plate 20 and 23 to move apart. The inner cavity of the treatment tank 1 and the storage chamber 27 are connected, and the liquid level is controlled to be higher than the pH monitor 2 and lower than the bend of the siphon pipe 7.

[0048] Then, neutralizing agent is continuously added to the inner cavity of treatment tank 1 through neutralizing agent addition pipe 4. The pH monitor 2 detects the acidity and alkalinity of the water. When the acidity and alkalinity is about 7, the addition of neutralizing agent is stopped and observed for a period of time. At this time, the heavy metals in the wastewater react with the neutralizing agent and form precipitates, which sink to the bottom of storage chamber 27. When the reaction is complete and the precipitates have completely sunk into storage chamber 27, the pre-start fixed plate 19 and telescopic rod 21 retract, and drive the isolation plate 20 and isolation plate 23 to move towards the inner cavity of treatment tank 1 until the two come into contact. The sealing strip 202 and sealing strip 232 are used to make auxiliary seals at the joint, completely isolating the inner cavity of treatment tank 1 and storage chamber 27.

[0049] Then, the telescopic rod 14 is activated, which drives the piston 15 to move upward. This creates a negative pressure in the inner cavity of the middle pipe 9, the connecting pipe 8, and the siphon pipe 7, drawing the treated wastewater from the inner cavity of the treatment tank 1 into the inner cavity of the siphon pipe 7 located on the outside of the treatment tank 1. Then, when the piston 15 moves upward through the balance hole on the surface of the connecting pipe 13, the wastewater inside the siphon pipe 7 flows along the connecting pipe 8, the middle pipe 9, and the connecting pipe 10, breaking through the sealing plate 11 and being discharged. Meanwhile, the wastewater inside the treatment tank 1 is all accelerated out under the "siphon effect" generated by the siphon pipe 7. Subsequently, a new round of grinding chemical wastewater can be added through the water inlet pipe 3.

[0050] Finally, when enough sediment has accumulated in the inner cavity of the storage chamber 27 after multiple rounds of processing, the motor 17 can be started to drive the scraper block 24 to rotate. The scraper block 24 and the outer wall of the sealing gasket 25 scrape the inner wall of the storage chamber 27 to remove the attached sediment. When the scraper block 24 rotates, it will open the discharge port 26, making it open. The sediment will be discharged along this port. After the scraper block 24 rotates several times, it can remove the sediment in the storage chamber 27 and reset it, and then reseal the discharge port 26.

[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor polishing chemical solution treatment and circulation device, comprising a treatment tank (1), a pH monitor (2), a water inlet pipe (3), a neutralizing agent addition pipe (4), and a balancing pipe (5), characterized in that: A siphon tube (7) is fixedly installed on the right side of the inner wall of the processing box (1). A connecting pipe (8) is fixedly connected to one side of the outer surface of the siphon tube (7). A middle pipe (9) is fixedly connected to one end of the connecting pipe (8). A connecting pipe (10) is fixedly connected to one end of the middle pipe (9). A sealing plate (11) is sealed and hinged to one end of the connecting pipe (10). A connecting pipe (13) is fixedly installed on the top of the outer surface of the middle pipe (9). A telescopic rod (14) is installed on the top of the connecting pipe (13). A piston (15) is fixedly installed on the telescopic end of the telescopic rod (14). A balance hole is provided on the surface of the connecting pipe (13). When the piston (15) moves upward past the balance hole, the connecting pipe (13) is no longer sealed. The bottom of the processing box (1) has a storage chamber (27) and a discharge port (26). A motor (17) is also installed at the bottom of the processing box (1). A scraper block (24) is fixedly installed on the output shaft of the motor (17). The scraper block (24) and the discharge port (26) are both fan-shaped. The inner wall size of the discharge port (26) is equidistant from the outer wall size of the scraper block (24). A sealing gasket (25) is fixedly connected to the outer surface of the scraper block (24). A rectangular groove extending from the front to the back is provided on the front of the processing box (1). Telescopic rod two (18) and telescopic rod three (21) are respectively installed on the front and back of the processing box (1). A front fixing plate is fixedly connected to the telescopic end of the telescopic rod two (18). (19) A first isolation plate (20) is fixedly installed at the bottom of the front fixed plate (19). The first isolation plate (20) is sealed and snapped into a rectangular groove. The telescopic end of the telescopic rod (21) is fixedly connected to the rear fixed plate (22). A second isolation plate (23) is fixedly installed at the bottom of the rear fixed plate (22). The second isolation plate (23) is sealed and snapped into another set of sealing grooves. The second isolation plate (23) and the first isolation plate (20) are sealed and abut against the inner cavity of the processing box (1). The first isolation plate (20) and the second isolation plate (23) are both located above the storage cavity (27). A gap is left between the end of the siphon tube (7) located in the inner cavity of the processing box (1) and the upper surface of the first isolation plate (20) and the second isolation plate (23). The gap allows liquid to pass through.

2. The semiconductor polishing chemical solution treatment and circulation device according to claim 1, characterized in that: The water inlet pipe (3), neutralizer addition pipe (4) and balance pipe (5) are all fixedly connected to the top of the treatment tank (1). The pH monitor (2) is installed on the left side of the inner wall of the treatment tank (1). The balance pipe (5) is set into four groups and is distributed equidistantly around the four corners of the top of the treatment tank (1). The bottom of the treatment tank (1) is fixedly installed with a discharge frame (16) located outside the discharge port (26).

3. The semiconductor polishing chemical solution treatment and circulation device according to claim 2, characterized in that: The contact surfaces of the isolation plate 1 (20) and the isolation plate 2 (23) are respectively provided with a slot 1 (201) and a slot 2 (231). A sealing strip 1 (202) is glued inside the slot 1 (201), and a sealing strip 2 (232) is glued inside the slot 2 (231). The sealing strip 2 (232) abuts against the sealing strip 1 (202).

4. The semiconductor polishing chemical solution treatment and circulation device according to claim 3, characterized in that: The siphon tube (7) is U-shaped and has a 180° inverted design. One end of the siphon tube (7) is located in the inner cavity of the processing box (1). A fixing post (6) is fixedly installed on the right side of the processing box (1). The fixing post (6) is fixedly connected to the outer surface of the siphon tube (7).

5. The semiconductor polishing chemical solution treatment and circulation device according to claim 4, characterized in that: The sealing plate (11) is fixedly fitted with a sealing ring (12) at one end of the inner cavity of the connecting pipe (10), and the sealing ring (12) is in an interference fit with the inner wall of the connecting pipe (10).

6. The semiconductor polishing chemical solution treatment and circulation device according to claim 5, characterized in that: The storage cavity (27) is circular in shape, and the diameter of the side of the sealing gasket (25) that abuts against the inner wall of the storage cavity (27) is equal.

Citation Information

Patent Citations

  • Multifunctional sewage sedimentation tank and use method thereof

    CN113018918A

  • Three-way siphon pump

    CN2099855U

  • Energy-saving free side-turning type flap valve

    CN213017901U

  • Sludge discharge apparatus and operation method thereof

    JP2007296466A