A batch cleaning device for components after tin soldering and a method of using the same

Abstract

This invention discloses a batch cleaning device and its method for tin-plated components, comprising: a device frame forming a cleaning chamber; fixed supports respectively disposed on the inner walls of both sides of the device frame; a plurality of support plates located inside the device frame and layered between the fixed supports; a control panel disposed on the outer wall of the device frame, providing power to the batch cleaning device; the control panel including a control module; wherein each support plate is provided with: a plurality of clamping and limiting devices spaced apart on the support plate; and a component clamping device, clamped between any two adjacent clamping and limiting devices, for placing the tin-plated components to be cleaned. This invention creatively employs a batch cleaning method integrating heating and plasma cleaning functions, which can improve cleaning efficiency and quality while protecting components with fine leads.

Description

Technical Field

[0001] This invention relates to the field of electronic assembly technology, and in particular to a batch cleaning device for components after tinning and its usage method. Background Technology

[0002] With the advancement of domestic component production and microwave communication technology, gold-plated components in metal-cased packages are increasingly widely used in electronic assembly, especially in aerospace and other fields with high reliability requirements. Due to the risk of gold brittleness in gold-plated components, tinning is often used to remove gold from surface mount technology (SMT) components. In actual production, components need to be dipped in flux to facilitate tinning. After tinning, the flux often adheres to the component leads or body. During SMT assembly, this flux can cause the components to stick to the pick-and-place machine nozzles, preventing proper placement and leading to defects such as component rejection, misplacement, and even damage to the placement equipment. Manual cleaning of tinned components with alcohol is commonly used during production, but this method is time-consuming, labor-intensive, and often ineffective, and poses a risk of damaging the leads of components with fine pins. Therefore, a cleaning device and method capable of batch cleaning after tinning is needed. Summary of the Invention

[0003] The purpose of this invention is to provide a batch cleaning device and its usage method for tinned components. It creatively adopts a batch cleaning method that integrates heating and plasma cleaning functions, which can help heat and activate residual flux, reduce flux adhesion, and improve plasma cleaning intensity. It can effectively remove residual flux and other adhering organic matter from tinned components, and has strong engineering practicality.

[0004] To achieve the above objectives, the present invention provides a batch cleaning apparatus for components after tinning, comprising:

[0005] The equipment frame has an internal cleaning chamber.

[0006] Fixed brackets are respectively installed on the inner walls of both sides of the equipment frame;

[0007] Several support plates are located inside the equipment frame and are layered and installed between the fixed supports;

[0008] A control panel, located on the outer wall of the equipment frame, provides power to the batch cleaning device; the control panel includes a control module.

[0009] Each of the aforementioned support plates is provided with:

[0010] Several clamping and limiting devices are spaced apart on the support plate, and a clamping and limiting space is formed between two adjacent clamping and limiting devices.

[0011] A component clamping device is positioned between any two adjacent clamping and limiting devices to hold components that are to be cleaned after tinning.

[0012] Optionally, each of the aforementioned support plates contains the following internal components:

[0013] The heating element is connected to the control module circuit and its heating can be controlled by the control module to heat the carrier plate.

[0014] A temperature sensor, located above the heating wire and connected to the control module circuit, is used to detect and monitor the heating temperature of the carrier plate.

[0015] Optionally, the batch cleaning device also includes a temperature control indicator light, which is disposed on the outer wall of the equipment frame; the temperature control indicator light is connected to the control module circuit, and the control module can control the temperature control indicator light to light up or turn off according to the temperature signal transmitted by the temperature sensor.

[0016] Optionally, each of the said carrier plates further includes:

[0017] Several plug-in interfaces are provided between two adjacent clamping and limiting devices to enable connection with the component clamping device placed at that position;

[0018] The plug-in interface is connected to the control module circuit. When the plug-in interface is plugged into the component clamping device, the component clamping device is powered on.

[0019] Optionally, the plug-in interface includes:

[0020] First power socket and second power socket;

[0021] The first and second power sockets are arranged sequentially in the vertical direction, and the distance between the two power sockets can be adjusted by a sliding component.

[0022] Optionally, the component clamping device includes:

[0023] The base has a base slot on its side, and the base serves as a bottom electrode to store or release energy;

[0024] A component placement plate is located above the base and is fixedly clipped into the base slot to support the components to be cleaned.

[0025] The top cover, located above the component placement board, serves as a top electrode for storing or releasing energy.

[0026] An adjustable bolt is provided between the upper cover plate and the base for installing the upper cover plate onto the base; and the adjustable bolt can adjust the distance between the upper cover plate and the base according to the energy density required for the preset cleaning power.

[0027] Optionally, the component placement plate is provided with a plurality of grooves arranged in a regular grid pattern and matching the size of the components, and each groove is used to place a component to be cleaned.

[0028] The depth of each groove is less than the thickness of the component.

[0029] Optionally, the upper cover plate is provided with a plurality of through slots arranged in a regular grid pattern, which match the size of the components and the size of the grooves.

[0030] Optionally, the base has a first metal pin on its side and the upper cover has a second metal pin on its side on the same side as the base, and the first metal pin is located vertically below the second metal pin.

[0031] The first metal pin and the second metal pin are respectively matched and plugged into the first power socket and the second power socket on the plug-in interface.

[0032] The present invention also provides a method of using a batch cleaning device, comprising the following steps:

[0033] S1, Place multiple tin-plated components to be cleaned into the grooves of one or more component placement boards;

[0034] S2, install the component placement plate on the base and install the adjustable bolts, then install the top cover plate. By rotating it a certain number of times, adjust the distance between the top cover plate and the base until it matches the height corresponding to the set cleaning power.

[0035] S3, then adjust the distance between the first power socket and the second power socket so that it matches the distance between the first metal pin and the second metal pin on the base and the top cover;

[0036] S4, the assembled multiple component clamping devices are placed on the carrier plate and fixed by two adjacent clamping and limiting devices, and the side with the first metal pin and the second metal pin faces the plug-in interface, so that the pins are plugged into the power sockets in pairs.

[0037] S5, set the heating temperature and time of the batch cleaning device, set the plasma cleaning power and time, perform vacuuming and introduce the medium gas, and start cleaning;

[0038] S6. After cleaning is completed, the component clamping device is removed from the batch cleaning device, and then the component placement board is removed.

[0039] S7, remove the cleaned components from the component placement board.

[0040] In summary, compared with the prior art, the present invention has the following beneficial effects:

[0041] 1. Traditional manual cleaning of tinned components using alcohol is not only time-consuming and labor-intensive, but also incomplete. For components with fine leads, there is a risk of damaging the leads. The device and method provided by this invention can improve cleaning efficiency and quality, and requires less skill from the operators.

[0042] 2. Currently, water cleaning equipment is used to clean components, which carries the risk of water flow impact damaging the components. The device and method provided by this invention realize the cleaning of components without contact or collision, and are particularly suitable for cleaning components with fine pins.

[0043] 3. The process device provided by the present invention has a simple structure, a simple production process, and high cleaning efficiency, and has the advantage of low-cost production. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the batch cleaning device of the present invention;

[0045] Figure 2 This is a schematic diagram of the structure of the single-layer bearing plate of the present invention;

[0046] Figure 3 This is a schematic diagram of the component clamping device of the present invention;

[0047] Figure 4 This is a schematic diagram of the components to be cleaned placed in the component clamping device according to the present invention. Detailed Implementation

[0048] The following will be combined with the appendix Figures 1-4 The technical content, structural features, objectives and effects of the present invention will be described in detail through preferred embodiments.

[0049] It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions. They are only used to facilitate and clarify the purpose of illustrating the embodiments of the present invention, and are not intended to limit the implementation conditions of the present invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationship, or adjustments to the size should still fall within the scope of the technical content disclosed in the present invention, provided that they do not affect the effects and objectives that the present invention can produce.

[0050] In the description of this invention, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0051] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0052] This invention provides a batch cleaning device for components after tinning, such as... Figure 1 As shown, the batch cleaning device includes: an equipment frame 1, which serves as the structural support for the entire batch cleaning device and forms a cleaning chamber inside; fixed brackets 4, which are respectively disposed on both sides inside the equipment frame 1 and are tightly fitted and fixed to the inner wall of the equipment frame 1; a support plate 3, which is located inside the equipment frame 1 and is layered on the fixed brackets 4, that is, the two ends of each support plate 3 are respectively fixedly connected to the corresponding fixed bracket 4, and the support plate 3 has a heating function; and a control panel 2, which is disposed on the outer wall of the equipment frame 1 and includes a control module. The control panel 2 can serve as the control center and power supply center for the entire batch cleaning device.

[0053] Among them, such as Figure 2 As shown, each of the carrier plates 3 has the following inside: a heating wire 31, which is connected to the control module circuit and can be controlled by the control module to heat the carrier plate 3; and a temperature sensor 32, located above the heating wire 31 and connected to the control module circuit, for detecting the temperature of the carrier plate 3 and transmitting it to the control module so that the control module can monitor the heating of the carrier plate 3.

[0054] Specifically, when the support plate 3 is heated, the temperature sensor 32 can transmit its current temperature to the control module in real time. When the temperature of the support plate 3 reaches the set temperature threshold, the control module controls the heating wire 31 to stop heating.

[0055] A temperature control indicator light 11 is provided on the outer wall of the equipment frame 1, opposite to the control panel 2. The temperature control indicator light 11 is connected to the control module circuit. The control module controls the temperature control indicator light 11 to light up or turn off according to the temperature signal received from the temperature sensor 32, thereby displaying the heating status of the support plate 3 in real time.

[0056] Specifically, when the carrier plate 3 is heated, the control module controls the temperature control indicator 11 to light up, indicating that the carrier plate 3 is currently in a heating state; when the temperature of the carrier plate 3 reaches the set temperature threshold, the control module controls the heating wire 31 to stop heating, and at the same time, the control module also controls the temperature control indicator 11 to turn off, indicating that the carrier plate 3 is currently in an unheated state.

[0057] The control panel 2 is equipped with various buttons, including a temperature control button, a vacuum button, a ventilation button, and a cleaning button. These buttons are all connected to the control module circuit to set temperature parameters (including temperature threshold and heating time), perform vacuuming, input medium gas, and perform cleaning for the batch cleaning device.

[0058] Each of the carrier plates 3 has the following features on its upper surface: a plurality of clamping and limiting devices 5, spaced apart and fixed on the carrier plate 3, forming a clamping and limiting space between adjacent clamping and limiting devices 5; a component clamping device 7, positioned between any two adjacent clamping and limiting devices 5, for placing tinned components to be cleaned; and a plurality of plug-in interfaces 6, located between two adjacent clamping and limiting devices 5, to allow connection with the component clamping device 7 placed at that position. The plug-in interfaces 6 are connected to the control module circuit; therefore, when a plug-in interface 6 is connected to a component clamping device 7, the component clamping device 7 is energized.

[0059] Since the present invention provides a batch cleaning device, multiple component clamping devices 7 can be provided, up to filling all the clamping and limiting spaces formed by two adjacent clamping and limiting devices 5.

[0060] The plug-in interface 6 includes a first power socket and a second power socket. The first power socket and the second power socket are arranged sequentially in the vertical direction, and the distance between the two power sockets can be adjusted by a sliding component. Preferably, both the first power socket and the second power socket are dual-hole power sockets.

[0061] Specifically, the sliding assembly includes a first sliding groove, a second sliding groove, and a fastening screw. The first power socket is disposed in the first sliding groove, and the second power socket is disposed in the second sliding groove. By moving the positions of the first and second power sockets within the first and second sliding grooves, the relative distance between the first and second power sockets can be changed. When the distance between the two power sockets is adjusted to the desired value, it is further locked by the fastening screw to fix the distance.

[0062] In addition, a thermally conductive insulating layer 33 is laid on the upper surface of the bearing plate 3 and in the clamping space between all adjacent clamping and limiting devices 5 for heat transfer and insulation of the component clamping device 7.

[0063] In a specific embodiment of the present invention, the thermally conductive insulating layer is an alumina ceramic plate with high thermal conductivity.

[0064] Preferably, the clamping and limiting device 5 is made of non-conductive, high-temperature resistant polytetrafluoroethylene material.

[0065] Among them, such as Figure 3 As shown, the component clamping device 7 is configured in the shape of a keyboard grid. The component clamping device 7 includes: a base 75 with a base slot on its side, the base 75 serving as both a bottom electrode for storing / releasing energy and a bottom support structure for the component clamping device 7; a component placement plate 73 located above the base 75 and fixedly mounted on the base slot for supporting the components to be cleaned; an upper cover plate 76 located above the component placement plate 73, serving as a top electrode for storing / releasing energy and as an upper structural cover plate for the component clamping device 7; and an adjustable bolt 74 located between the upper cover plate 76 and the base 75 for mounting the upper cover plate 76 onto the base 75.

[0066] The component placement plate 73 has multiple regularly arranged, grid-like grooves 732 that match the dimensions of the components. Each groove 732 is used to place one component to be cleaned. The depth of the groove 732 is less than the thickness of the component. In this embodiment, the thickness of the component is 5mm, and the depth of the groove 732 is 4mm.

[0067] Preferably, the component placement plate 73 is made of antistatic epoxy board.

[0068] The upper cover plate 76 is provided with a plurality of through slots 722 arranged in a regular grid pattern, which match the size of the components and the size of the grooves 732. The through slots 722 allow the plasma beam between the upper cover plate 76 and the base 75 to be more concentrated when energized, i.e., the ion energy is more concentrated.

[0069] The base 75 has a first metal pin 711 on its side, and the upper cover 76 has a second metal pin 721 on its side, which is the same side as the base 75. The first metal pin 711 is located vertically below the second metal pin 721. The first metal pin 711 and the second metal pin 721 are respectively matched and plugged into the first and second power sockets on the plug-in interface 6. Preferably, both the first metal pin 711 and the second metal pin 721 are double pins that match the dual-hole power sockets.

[0070] The adjustable bolt 74 is a height-adjustable bolt. By rotating the adjustable bolt 74, the distance between the upper cover plate 76 and the base 75 can be adjusted accordingly, thereby adjusting the distance between the first metal pin 711 and the second metal pin 721.

[0071] In a specific embodiment, the distance between the upper cover plate 76 and the base 75 needs to be adjusted according to the preset cleaning power to regulate the energy density during cleaning. Therefore, the distance between the first metal pin 711 and the second metal pin 721 changes with the distance between the upper cover plate 76 and the base 75, and can be adjusted by adjusting the bolt 74. Then, the distance between the first power socket and the second power socket is adjusted by the aforementioned sliding component until it matches the distance between the first metal pin 711 and the second metal pin 721. Then, the first metal pin 711 and the second metal pin 721 are inserted into the first power socket and the second power socket.

[0072] Preferably, the adjustable bolts 74 are located at the four corners of the component clamping device 7.

[0073] Preferably, the adjustable bolt 74 is made of insulating material. In this embodiment, non-conductive polytetrafluoroethylene is used.

[0074] In a specific embodiment of the present invention, the distance between the upper cover plate 76 and the base 75 is 10mm, the thickness of the component is 5mm, the component pins are placed upwards and 5mm away from the upper cover plate.

[0075] In a preferred embodiment of the present invention, the base 75 and the top cover 76 are made of an aluminum alloy that is conductive and resistant to ionization corrosion.

[0076] The present invention also provides a method of using a batch cleaning device, comprising the following steps:

[0077] S1, Place the multiple tin-plated components 733 to be cleaned face down and leads up in the groove 732 of the component placement plate 73 (when there are many components 733, they can be placed in the grooves of multiple component placement plates 73 according to the number of components 733).

[0078] S2, the component placement plate 73 is snapped into the base slot of the base 75, and the adjustable bolt 74 is installed. Then the upper cover plate 76 is installed. By rotating a certain number of turns, the distance between the upper cover plate 76 and the base 75 is adjusted until it matches the height corresponding to the set cleaning power.

[0079] S3, then adjust the distance between the first power socket and the second power socket so that it matches the distance between the first metal pin 711 and the second metal pin 721 on the base 75 and the top cover plate 76;

[0080] S4, the assembled multiple component clamping devices 7 are placed on the carrier plate 3 respectively, fixed by two adjacent clamping and limiting devices 5, and the side with the first metal pin 711 and the second metal pin 721 faces the plug-in interface 6, so that the pins are plugged into the power sockets in pairs.

[0081] S5, set the operating procedure of the batch cleaning device, including setting the heating temperature threshold and heating time of the carrier plate 3 through the temperature control button on the control panel 2, performing vacuuming through the vacuum button, then starting the ventilation button to introduce medium gas, and setting the plasma cleaning power and gas pressure and other related parameters through the cleaning button, then starting the cleaning, and observing the heating status of the carrier plate 3 during cleaning through the control panel 2 and the temperature control indicator light 11.

[0082] In this embodiment, the heating temperature threshold is 120°C, the heating time is 150s, the gas used for cleaning is a mixture of hydrogen and argon, the gas flow rate is 350mL / min, the cleaning energy is 300W, and the cleaning time is 300s.

[0083] S6. After cleaning, remove the component clamping device 7 from the batch cleaning device, remove the adjustable bolt 74 between the upper cover plate 76 and the base 75, and remove the component placement plate 73.

[0084] S7, Remove the cleaned components from the component placement board 73.

[0085] In summary, the batch cleaning device and its method for tinning components provided by this invention creatively adopt a batch cleaning method that integrates heating and plasma cleaning functions. This method can help heat and activate residual flux, while reducing flux adhesion and increasing plasma cleaning intensity. It can effectively remove residual flux and other adhering organic matter from tinned components, and has strong engineering practicality.

[0086] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A batch cleaning device for components after tinning, characterized in that, Include: The equipment frame (1) has a cleaning chamber inside it; Fixed brackets (4) are respectively installed on the inner walls of both sides of the equipment frame (1); Several support plates (3) are located inside the equipment frame (1) and are layered between the fixed supports (4); each support plate (3) contains an electric heating wire (31). The control panel (2) is located on the outer wall of the equipment frame (1) and provides power to the batch cleaning device. The control panel (2) includes a control module. The control module is connected to the heating element (31) and can control its heating to heat the support plate (3). Each of the aforementioned support plates (3) is provided with: A number of clamping and limiting devices (5) are spaced apart on the bearing plate (3), and a clamping and limiting space is formed between two adjacent clamping and limiting devices (5); The component clamping device (7) is positioned between any two adjacent clamping limiting devices (5) for placing components to be cleaned after tinning; the component clamping device (7) includes a first metal pin (711) and a second metal pin (721) with adjustable spacing. Several plug-in interfaces (6) are disposed between two adjacent clamping and limiting devices (5); the plug-in interfaces (6) include a first power socket and a second power socket with adjustable spacing; The first metal pin (711) and the second metal pin (721) are respectively matched and connected to the first and second power sockets on the plug-in interface (6), thereby ionizing the introduced medium gas into plasma.

2. The batch cleaning device as described in claim 1, characterized in that, Each of the aforementioned support plates (3) also contains within its body: A temperature sensor (32) is located above the heating wire (31) and connected to the control module circuit to detect and monitor the heating temperature of the carrier plate (3).

3. The batch cleaning apparatus of claim 2, wherein The batch cleaning device also includes a temperature control indicator (11), which is set on the outer wall of the equipment frame (1); the temperature control indicator (11) is connected to the control module circuit, and the control module can control the temperature control indicator (11) to light up or turn off according to the temperature signal transmitted by the temperature sensor (32).

4. The batch cleaning device as described in claim 1, characterized in that, The plug-in interface (6) is connected to the control module circuit. When the plug-in interface (6) is plugged into the component clamping device (7), the component clamping device (7) is powered on.

5. The batch cleaning device as described in claim 4, characterized in that, The first and second power sockets are arranged sequentially in the vertical direction, and the distance between the two power sockets can be adjusted by a sliding component.

6. The batch cleaning apparatus of claim 5 wherein, The component clamping device (7) includes: The base (75) has a base slot on its side, and the base (75) serves as a bottom electrode to store or release energy; The component placement plate (73) is located above the base (75) and is fixedly mounted on the base slot to support the components to be cleaned. The top cover (76) is located above the component placement plate (73) and serves as a top electrode to store or release energy; An adjustable bolt (74) is provided between the upper cover plate (76) and the base (75) for mounting the upper cover plate (76) onto the base (75); and the adjustable bolt (74) can adjust the distance between the upper cover plate (76) and the base (75) according to the energy density required for the preset cleaning power.

7. The batch cleaning apparatus of claim 6 wherein, The component placement plate (73) is provided with a plurality of grooves (732) arranged in a grid pattern and matching the size of the components. Each groove (732) is used to place a component to be cleaned. The groove depth of each groove (732) is less than the thickness of the component.

8. The batch cleaning apparatus of claim 7 wherein, The upper cover plate (76) is provided with a plurality of through slots (722) arranged in a regular grid pattern, which match the size of the components and the size of the groove (732).

9. The batch cleaning apparatus of claim 6 wherein, The first metal pin (711) is disposed on the side of the base (75); the second metal pin (721) is disposed on the side of the upper cover (76) on the same side as the base (75), and the first metal pin (711) is located vertically below the second metal pin (721).

10. A method of using a batch cleaning apparatus, implemented based on the batch cleaning apparatus according to any one of claims 1 to 9, characterized by, Includes the following steps: S1, place multiple tin-plated components (733) to be cleaned into the groove (732) of one or more component placement boards (73); S2, install the component placement plate (73) on the base (75) and install the adjustable bolt (74), then install the top cover plate (76), and adjust the distance between the top cover plate (76) and the base (75) by rotating a certain number of turns until it matches the height corresponding to the set cleaning power; S3, then adjust the distance between the first power socket and the second power socket so that it is consistent with the distance between the first metal pin (711) and the second metal pin (721) on the base (75) and the top cover (76); S4, the assembled multiple component clamping devices (7) are placed on the carrier plate (3) respectively, fixed by two adjacent clamping limiting devices (5), and the side with the first metal pin (711) and the second metal pin (721) faces the plug-in interface (6) so that the pins and the power sockets are plugged in one by one; S5, set the heating temperature and time of the batch cleaning device, set the plasma cleaning power and time, perform vacuuming and introduce the medium gas, and start cleaning; S6. After cleaning is completed, the component clamping device (7) is taken out from the batch cleaning device, and then the component placement plate (73) is taken out. S7, remove the cleaned components from the component placement board (73).

Images