Display panel, method for manufacturing display panel, and display device

CN119095421BActive Publication Date: 2026-09-22HEFEI VISIONOX TECH CO LTD +1
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Patent Information

Application Number
CN202411180998.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-08-26
Publication Date
2026-09-22
Estimated Expiration
2044-08-26

AI Technical Summary

Benefits of technology

[0043]本申请实施例提供一种显示面板、显示面板的制备方法及显示装置,显示面板包括基板、隔离结构和多个发光单元,隔离结构设置于基板的一侧,且围合形成隔离开口,隔离结构能够将发光材料隔断形成发光单元,使得发光单元位于隔离开口中,而无需使用掩模版,能够降低成本。隔离结构包括沿远离基板方向层叠设置的第一隔离部和第二隔离部,第一隔离部包括被第二隔离部覆盖的第一子部和设置于第一子部朝向隔离开口一侧的第二子部,第二子部相对于第二隔离部凸出设置,第二子部包括朝向隔离开口的粗糙面,使得发光单元的第一电极能够与第二子部搭接,并且能够覆盖至少部分粗糙面,由于粗糙面的表面粗糙度大于第一子部的表面粗糙度,因而能够增大第一电极与第二子部的搭接面积,减小二者的搭接电阻,提升显示面板的发光性能。

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Abstract

The application discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, an isolation structure and a plurality of light-emitting units. The isolation structure is arranged on one side of the substrate and encloses an isolation opening. The isolation structure comprises a first isolation part and a second isolation part which are arranged in a stacking manner away from the substrate. The first isolation part comprises a first sub-part covered by the second isolation part and a second sub-part arranged on the side of the first sub-part facing the isolation opening. The second sub-part is arranged protruding relative to the second isolation part. The second sub-part comprises a rough surface facing the isolation opening. The surface roughness of the rough surface is greater than the surface roughness of the first sub-part. At least part of the light-emitting unit is arranged in the isolation opening. The light-emitting unit comprises a light-emitting functional layer and a first electrode which are arranged in a stacking manner away from the substrate. The first electrode is overlapped with the second sub-part and covers at least part of the rough surface.
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Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] The purpose of this application is to provide a display panel, a method for manufacturing the display panel, and a display device that can improve the performance of the display panel.

[0005] The first aspect of this application provides a display panel, including a substrate, an isolation structure, and a plurality of light-emitting units. The isolation structure is disposed on one side of the substrate and forms an isolation opening. The isolation structure includes a first isolation portion and a second isolation portion stacked in a direction away from the substrate. The first isolation portion includes a first sub-part covered by the second isolation portion and a second sub-part disposed on the side of the first sub-part facing the isolation opening. The second sub-part protrudes relative to the second isolation portion and includes a rough surface facing the isolation opening. The surface roughness of the rough surface is greater than the surface roughness of the first sub-part. At least a portion of the light-emitting units is disposed in the corresponding isolation opening. The light-emitting unit includes a light-emitting functional layer and a first electrode stacked in a direction away from the substrate. The first electrode overlaps with the second sub-part and covers at least a portion of the rough surface.

[0006] In some embodiments, the second sub-part includes a first surface facing the substrate, a second surface facing away from the substrate, and a side surface connecting the first surface and the second surface, and the rough surface includes the second surface and / or the side surface;

[0007] Preferably, a plurality of protrusions and a plurality of grooves are formed on the second surface and / or the side surface.

[0008] In some embodiments, the first sub-part includes a third surface facing the substrate and a fourth surface facing away from the substrate, the second surface is formed with a plurality of protrusions, the tops of the protrusions protruding from the fourth surface, or the distance between the tops of the protrusions and the first surface is less than or equal to the distance between the third surface and the fourth surface.

[0009] In some embodiments, a plurality of grooves are formed on the second surface. The ratio Z1 of the distance from the bottom of the groove near the substrate to the fourth surface to the thickness of the first sub-part satisfies: 0.1≤Z1≤0.5.

[0010] In some embodiments, the top of the protrusion protrudes from the fourth surface, and along the direction perpendicular to the substrate, the ratio Z2 of the distance from the top of the protrusion away from the substrate to the fourth surface to the thickness of the first sub-part satisfies: 0.1≤Z2≤0.5.

[0011] Preferably, the orthographic projection of the surface of the second isolation portion near the substrate onto the substrate lies within the orthographic projection of the fourth surface onto the substrate.

[0012] In some embodiments, along the direction parallel to the substrate, the width L of the second sub-part satisfies: 0.1 micrometers ≤ L ≤ 0.3 micrometers.

[0013] In some embodiments, the ratio Z3 of the thickness of the first sub-part to the thickness of the second isolation part satisfies:

[0014] Preferably, the thickness H1 of the first sub-part satisfies: 100 angstroms ≤ H1 ≤ 1000 angstroms; and / or, the thickness H2 of the second isolation part satisfies: 7000 angstroms ≤ H2 ≤ 9000 angstroms.

[0015] In some embodiments, the isolation structure further includes a third isolation portion disposed on the side of the second isolation portion away from the substrate. The second isolation portion includes a sixth surface facing the substrate and a seventh surface away from the substrate. The orthographic projection of the seventh surface on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

[0016] Preferably, the orthographic projection of the seventh surface onto the substrate lies within the orthographic projection of the sixth surface onto the substrate;

[0017] Preferably, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

[0018] In some embodiments, the display panel further includes a pixel definition layer, which includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The pixel opening is connected to an isolation opening, and at least some of the light-emitting units are located in the pixel opening. An isolation structure is disposed on the side of the pixel defining portion away from the substrate.

[0019] In some embodiments, the display panel further includes a pixel definition layer, which includes a pixel defining portion and a pixel opening and a clearance opening formed by the pixel defining portion. An isolation structure is disposed in the clearance opening, and a first electrode extends from the pixel opening to the clearance opening and overlaps with the first isolation portion of the isolation structure.

[0020] A second aspect of this application provides a method for manufacturing a display panel, the method comprising:

[0021] A first isolation material layer and a second isolation material layer are sequentially formed on one side of the substrate;

[0022] The second insulating material layer is patterned to form the second insulating section;

[0023] The first isolation material layer is patterned and roughened to form a first isolation part, thereby obtaining an isolation structure. The isolation structure encloses and forms multiple isolation openings. The first isolation part includes a first sub-part covered by a second isolation part and a second sub-part disposed on the side of the first sub-part facing the isolation opening. The second sub-part protrudes relative to the second isolation part and includes a rough surface facing the isolation opening. The surface roughness of the rough surface is greater than that of the first sub-part.

[0024] Light-emitting units are formed in each isolation opening. Each light-emitting unit includes a light-emitting functional layer and a first electrode stacked in a direction away from the substrate. The first electrode overlaps with the second sub-part and covers at least part of the rough surface.

[0025] In some embodiments, the steps of patterning and roughening the first isolation material layer include: roughening the first isolation material layer using an etching process or a plasma etching process.

[0026] In some embodiments, in the step of sequentially forming a first isolation material layer and a second isolation material layer on one side of the substrate, a third isolation material layer is also formed;

[0027] Before the step of patterning the second insulating material layer to form the second insulating portion, the method further includes:

[0028] The first, second, and third isolation material layers are etched to form a pre-opening and a third isolation portion;

[0029] The steps of patterning the second insulating material layer to form the second insulating portion include:

[0030] Laterally etch the surface of the second isolation material layer exposed through the pre-prepared opening to form a second isolation portion, and expose a portion of the surface of the first isolation material layer facing away from the substrate, and the orthographic projection of the surface of the second isolation portion facing away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

[0031] In some embodiments, the step of sequentially forming a first insulating material layer and a second insulating material layer on one side of the substrate includes:

[0032] A first insulating material layer is formed on one side of the substrate;

[0033] A portion of the first isolation material layer is patterned to create recesses;

[0034] A second isolation material layer is formed on the side of the first isolation material layer away from the substrate, and a portion of the second isolation material layer is located in the recess.

[0035] In the step of patterning the second isolation material layer to form the second isolation portion, the second isolation portion is located in the recess;

[0036] In the step of patterning and roughening the first isolation material layer to form the first isolation portion, the first sub-part is located on the side of the recess facing the substrate, and the orthographic projection of the surface of the second isolation portion on the substrate is located within the orthographic projection of the surface of the first sub-part on the substrate away from the substrate.

[0037] Preferably, before the step of patterning the second insulating material layer, the method further includes:

[0038] A third isolation material layer is formed on the side of the second isolation material layer away from the substrate;

[0039] The first, second, and third isolation material layers are etched to form a pre-opening and a third isolation portion;

[0040] The steps of patterning the second insulating material layer to form the second insulating portion include:

[0041] Laterally etch the surface of the second isolation material layer exposed through the pre-prepared opening to form a second isolation portion located in the recess, and expose a portion of the surface of the first isolation material layer facing away from the substrate, and the orthographic projection of the surface of the second isolation portion facing away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

[0042] A third aspect of this application provides a display device, including a display panel of any of the above-mentioned methods or a display panel prepared by any of the above-mentioned methods.

[0043] This application provides a display panel, a method for manufacturing the display panel, and a display device. The display panel includes a substrate, an isolation structure, and multiple light-emitting units. The isolation structure is disposed on one side of the substrate and forms an isolation opening. The isolation structure can isolate the light-emitting material to form the light-emitting units, so that the light-emitting units are located in the isolation opening, without the need for a mask, thus reducing costs. The isolation structure includes a first isolation portion and a second isolation portion stacked along a direction away from the substrate. The first isolation portion includes a first sub-part covered by the second isolation portion and a second sub-part disposed on the side of the first sub-part facing the isolation opening. The second sub-part protrudes relative to the second isolation portion and includes a rough surface facing the isolation opening, so that the first electrode of the light-emitting unit can overlap with the second sub-part and can cover at least part of the rough surface. Since the surface roughness of the rough surface is greater than the surface roughness of the first sub-part, the overlap area between the first electrode and the second sub-part can be increased, the overlap resistance between the two can be reduced, and the light-emitting performance of the display panel can be improved. Attached Figure Description

[0044] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 A cross-sectional schematic diagram of a display panel provided in some embodiments of this application;

[0046] Figure 2 Partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application;

[0047] Figure 3 for Figure 1 Enlarged view of section AA;

[0048] Figure 4 for Figure 1 Another enlarged view of section AA;

[0049] Figure 5 A cross-sectional schematic diagram of a display panel provided for other embodiments of this application;

[0050] Figure 6 A flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application;

[0051] Figure 7 Another flowchart illustrating a method for fabricating a display panel provided in some embodiments of this application.

[0052] The attached icons are numbered as follows:

[0053] Display panel 100; substrate 10; isolation structure 20; isolation opening 21; first isolation portion 22; second isolation portion 23; sixth surface 221; seventh surface 222; first sub-part 24; third surface 241; fourth surface 242; second sub-part 25; rough surface 251; first surface 252; second surface 253; side surface 254; protrusion 255; groove 256; third isolation portion 26; light-emitting unit 30; first electrode 31; light-emitting functional layer 32; second electrode 33; pixel definition layer 40; pixel limiting portion 41; pixel opening 42. Detailed Implementation

[0054] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application, that is, this application is not limited to the described embodiments.

[0055] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the allowable tolerance range. "Parallel" is not parallel in the strict sense, but within the allowable tolerance range.

[0056] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0057] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0058] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel, or other types of display panels, such as micro light-emitting diode (Micro-LED) or quantum light-emitting diode (QLED) display panels.

[0059] Please see Figure 1 The first aspect of this application provides a display panel 100, including a substrate 10, an isolation structure 20, and a plurality of light-emitting units 30. The isolation structure 20 is disposed on one side of the substrate 10 and forms an isolation opening 21. The isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 stacked in a direction away from the substrate 10. The first isolation portion 22 includes a first sub-portion 24 covered by the second isolation portion 23 and a second sub-portion 25 disposed on the side of the first sub-portion 24 facing the isolation opening 21. The second sub-portion 25 protrudes relative to the second isolation portion 23 and includes a rough surface 251 facing the isolation opening 21. The surface roughness of the rough surface 251 is greater than the surface roughness of the first sub-portion 24. At least a portion of the light-emitting units 30 is disposed in the isolation opening 21. The light-emitting unit 30 includes a light-emitting functional layer 32 and a first electrode 31 stacked in a direction away from the substrate 10. The first electrode 31 overlaps with the second sub-portion 25 and covers at least a portion of the rough surface 251.

[0060] The substrate 10 includes a substrate and a driving circuit layer disposed on the substrate. The substrate can be a rigid substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The driving circuit layer contains a driving circuit for controlling the light emission of the light-emitting unit 30. The driving circuit layer is generally composed of inorganic film layers such as a metal layer, a semiconductor layer (active layer), and an insulating layer. By patterning these inorganic film layers, a driving circuit for controlling the light emission of the light-emitting unit 30 can be formed. There are various ways to implement the specific circuit structure, which will not be elaborated here.

[0061] The isolation structure 20 encloses multiple isolation openings 21. When light-emitting material is deposited on the side of the isolation structure 20 away from the substrate 10, the light-emitting material can be separated by the isolation structure 20 to form multiple light-emitting units 30 that are disconnected from each other. This eliminates the need to use a precision mask to fabricate the light-emitting units 30, reducing the development and use of precision masks and lowering manufacturing costs. The multiple light-emitting units 30 are arranged one-to-one in the multiple isolation openings 21, thereby reducing carrier crosstalk in each light-emitting unit 30 and improving the display effect of the display panel 100. The isolation structure 20 may include a conductive material. The isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 disposed on the side of the first isolation portion 22 facing away from the substrate 10. The light-emitting unit 30 may include a first electrode 31, a light-emitting functional layer 32, and a second electrode 33 stacked together. The first electrode 31 may be located on the side of the light-emitting functional layer 32 facing away from the substrate 10, and the second electrode 33 may be located on the side of the light-emitting functional layer 32 facing the substrate 10. The first electrode 31 overlaps with the isolation structure 20, allowing the first electrodes 31 of multiple light-emitting units 30 to be electrically connected through the isolation structure 20 to form a full-surface electrode, thereby ensuring normal light emission of the light-emitting unit 30. One of the first electrode 31 and the second electrode 33 can serve as the anode of the light-emitting unit 30, and the other as the cathode. In this embodiment, the first electrode 31 is used as the cathode of the light-emitting unit 30, and the second electrode 33 is used as the anode of the light-emitting unit 30 for illuminating purposes. It should be noted that the light-emitting functional layer 32 can be formed by stacking multiple film layer structures. For example, the light-emitting functional layer 32 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer, an electron injection layer (EIL), and an electron transport layer (ETL) stacked together.

[0062] Understandably, in order to reduce the overlap resistance and resistivity between the first electrode 31 and the isolation structure 20, the first electrode 31 typically extends from the first isolation portion 22 to the sidewall of the second isolation portion 23 facing the isolation opening 21, so as to overlap with the second isolation portion 23. In some related technologies, due to the limited climbing ability of the first electrode 31, it is difficult for the first electrode 31 to climb to the second isolation portion 23, and it usually overlaps with the first isolation portion 22. Since the area of ​​the first isolation portion 22 exposed relative to the second isolation portion 23 is limited, the overlap area between the first isolation portion 22 and the first electrode 31 is limited, which leads to a larger overlap resistance between the first electrode 31 and the first isolation portion 22, affecting the light-emitting performance of the display panel 100.

[0063] Therefore, in this embodiment, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 stacked along a direction away from the substrate 10. The first isolation portion 22 includes a first sub-portion 24 covered by the second isolation portion 23 and a second sub-portion 25 disposed on the side of the first sub-portion 24 facing the isolation opening 21. The second sub-portion 25 protrudes relative to the second isolation portion 23 and includes a rough surface 251 facing the isolation opening 21, so that the first electrode 31 of the light-emitting unit 30 can overlap with the second sub-portion 25 and can cover at least part of the rough surface 251 of the second sub-portion 25. Since the surface roughness of the rough surface 251 is greater than the surface roughness of the first sub-portion 24, the overlap area between the first electrode 31 and the second sub-portion 25 can be increased, the overlap resistance between the two can be reduced, and the light-emitting performance of the display panel 100 can be improved.

[0064] It should be noted that in these embodiments, the first sub-part 24 is covered by the second isolation part 23, and its orthographic projection on the substrate 10 overlaps with the orthographic projection of the surface of the second isolation part 23 facing the substrate 10 on the substrate 10. The second sub-part 25 protrudes relative to the second isolation part 23 and is not covered by the second isolation part 23. Since the second sub-part 25 is located on the side of the first sub-part 24 facing the isolation opening 21, the second sub-part 25 specifically protrudes relative to the second isolation part 23 in a direction closer to the isolation opening 21. In addition, the second sub-part 25 includes a rough surface 251 facing the isolation opening 21, which is a surface of the second sub-part 25 that does not contact the substrate 10 or the first sub-part 24.

[0065] Please see Figure 2 In some embodiments, the second sub-part 25 includes a first surface 252 facing the substrate 10, a second surface 253 facing away from the substrate 10, and a side surface 254 connecting the first surface 252 and the second surface 253. The rough surface 251 includes the second surface 253 and / or the side surface 254.

[0066] Specifically, the first surface 252 can be the bottom surface of the second sub-part 25, which faces the substrate 10, and the second surface 253 can be the top surface of the second sub-part 25, which faces away from the substrate 10. The side surface 254 is connected between the first surface 252 and the second surface 253. The side surface 254 can be located on the side of the second sub-part 25 away from the first sub-part 24. Both the second surface 253 and the side surface 254 face the isolation opening 21.

[0067] It is understood that when the first electrode 31 overlaps with the second sub-part 25, it can cover at least a portion of the side surface 254 of the second sub-part 25, or the first electrode 31 can simultaneously cover both the side surface 254 and at least a portion of the second surface 253 of the second sub-part 25. Therefore, in these embodiments, the rough surface 251 is provided to include the second surface 253 and / or the side surface 254, so that when the first electrode 31 overlaps with the second sub-part 25, it can cover at least a portion of the rough surface 251, thereby increasing the overlap area between the first electrode 31 and the second sub-part 25.

[0068] It should be noted that when the rough surface 251 includes the second surface 253 and / or the side surface 254, it may include all of the second surface 253 and / or the side surface 254, or it may only include a portion of the second surface 253 and / or a portion of the side surface 254. This embodiment does not limit this.

[0069] Please see Figure 3 Preferably, a plurality of protrusions 255 and a plurality of grooves 256 are formed on the second surface 253 and / or the side surface 254, which can increase the surface area of ​​the second surface 253 and / or the side surface 254 of the second sub-part 25. When the first electrode 31 overlaps with the second surface 253 and / or the side surface 254 of the second sub-part 25, it can cover at least a portion of the plurality of protrusions 255 and the plurality of grooves 256, thereby further increasing the overlap area between the first electrode 31 and the second sub-part 25.

[0070] It should be noted that when the first electrode 31 covers the protrusion 255 and / or the groove 256, the size of the protrusion 255 and the groove 256 is positively correlated with the overlap area of ​​the first electrode 31 and the second sub-part 25, and negatively correlated with the overlap resistance between the first electrode 31 and the second sub-part 25. Specifically, the larger the size of the protrusion 255 and the groove 256, the larger the overlap area between the first electrode 31 and the second sub-part 25, and the smaller the overlap resistance between them; the smaller the size of the protrusion 255 and the groove 256, the smaller the overlap area between the first electrode 31 and the second sub-part 25, and the larger the overlap resistance between them.

[0071] When multiple protrusions 255 and multiple grooves 256 are formed on the second surface 253 and / or the side surface 254, the multiple protrusions 255 and multiple grooves 256 are arranged alternately in sequence. That is, there is a groove 256 between two adjacent protrusions 255 and a protrusion 255 between two adjacent grooves 256. The shape and size of the multiple protrusions 255 can be the same or different. Similarly, the shape and size of the multiple grooves 256 can be the same or different. In addition, the shape of the protrusions 255 and the grooves 256 can be regular shapes such as cones, trapezoids, and semicircles, or other irregular shapes. This embodiment does not limit these shapes.

[0072] Please see Figure 3 and Figure 4 In some embodiments, the first sub-part 24 includes a third surface 241 facing the substrate 10 and a fourth surface 242 facing away from the substrate 10. The second surface 253 is formed with a plurality of protrusions 255, the top of the protrusions 255 protruding from the fourth surface 242. Alternatively, the distance between the top of the protrusion 255 and the first surface 252 is less than or equal to the distance between the third surface 241 and the fourth surface 242.

[0073] It is understood that the second surface 253 can also form multiple grooves 256, and multiple protrusions 255 and multiple grooves 256 are arranged alternately in sequence. Each groove 256 is located between two adjacent protrusions 255, and the shape of each groove 256 can be adapted to the shape of the adjacent protrusion 255. It should be noted that the top of the protrusion 255 refers to the end of the protrusion 255 away from the substrate 10 along the thickness direction of the substrate 10. The distance between the top of the protrusion 255 and the first surface 252 of the second sub-part 25 can be the maximum thickness of the second sub-part 25, and the distance between the third surface 241 and the fourth surface 242 of the first sub-part 24 can be the maximum thickness of the first sub-part 24.

[0074] In these embodiments, the top of the protrusion 255 protrudes beyond the fourth surface 242 of the first sub-part 24. In this case, the distance between the top of the protrusion 255 and the first surface 252 is greater than the distance between the third surface 241 and the fourth surface 242, thereby increasing the surface area of ​​the protrusion 255. When the first electrode 31 covers the protrusion 255, the overlap area between the first electrode 31 and the second sub-part 25 can be further increased. Alternatively, the distance between the top surface of the protrusion 255 and the first surface 252 is less than or equal to the distance between the third surface 241 and the fourth surface 242. That is, the top of the protrusion 255 is recessed towards the substrate 10 relative to the fourth surface 242, or the top of the protrusion 255 is flush with the fourth surface 242. Compared to setting the top of the protrusion 255 to protrude beyond the fourth surface 242, the fabrication difficulty of the protrusion 255 can be reduced, making it easier to form the protrusion 255 on the second sub-part 25.

[0075] Please continue reading. Figure 3 and Figure 4In some embodiments, the second surface 253 forms a plurality of grooves 256 along a direction perpendicular to the substrate 10. The ratio Z1 of the distance from the bottom of the groove 256 near the substrate 10 to the fourth surface 242 to the thickness of the first sub-part 24 satisfies: 0.1≤Z1≤0.5. For example, this ratio can be 0.1, 0.2, 0.3, 0.4, 0.5, etc. By reasonably setting the size of the grooves 256 formed on the second sub-part 25, on the one hand, the second sub-part 25 can have a larger surface area, increasing the overlap area between the first electrode 31 and the second sub-part 25. On the other hand, it can also avoid the grooves 256 formed on the second sub-part 25 being too large and affecting its performance.

[0076] It should be noted that when the second surface 253 has protrusions 255 and grooves 256, protrusions 255 and grooves 256 can also be formed on the side surface 254. The protrusions 255 and grooves 256 formed on the side surface 254 can be the same as or different from the protrusions 255 and grooves 256 formed on the second surface 253. Of course, when the second surface 253 has protrusions 255 and grooves 256, the side surface 254 may not have protrusions 255. This application embodiment does not limit this. Furthermore, when the ratio of the distance from the bottom of the groove 256 on the second surface 253 to the fourth surface 242 to the thickness of the first sub-part 24 is greater than or equal to 0.1 and less than or equal to 0.5, the top of the protrusion 255 on the second surface 253 can protrude relative to the fourth surface 242 of the first sub-part 24, or the top of the protrusion 255 on the second surface 253 can be recessed relative to the fourth surface 242 toward the side closer to the substrate 10 or flush with the fourth surface 242. That is, the distance between the top of the protrusion 255 on the second surface 253 and the first surface 252 is less than or equal to the distance between the third surface 241 and the fourth surface 242.

[0077] Please continue reading. Figure 3 In some embodiments, the top of the protrusion 255 protrudes from the fourth surface 242. Along the direction perpendicular to the substrate 10, the ratio Z2 of the distance from the top of the protrusion 255 away from the substrate 10 to the fourth surface 242 to the thickness of the first sub-part 24 satisfies: 0.1≤Z2≤0.5. For example, this ratio can be 0.1, 0.2, 0.3, 0.4, 0.5, etc. By reasonably setting the size of the protrusion 255, on the one hand, the second sub-part 25 can have a larger surface area, increasing the overlap area between the first electrode 31 and the second sub-part 25. On the other hand, it can also avoid the protrusion 255 formed on the second sub-part 25 being too large and affecting the performance of the second sub-part 25 itself and other structures.

[0078] It should be clarified that when the ratio of the distance from the top of the protrusion 255 away from the substrate 10 to the fourth surface 242 to the thickness of the first sub-part 24 is greater than or equal to 0.1 and less than or equal to 0.5, the ratio of the distance from the bottom of the groove 256 between two adjacent protrusions 255 to the fourth surface 242 to the thickness of the first sub-part 24 can be greater than or equal to 0.1 and less than or equal to 0.5, so as to further increase the surface area of ​​the second sub-part 25, while avoiding affecting the performance of the second sub-part 25 itself and other structures.

[0079] Please continue reading. Figure 3 Preferably, the orthographic projection of the surface of the second isolation portion 23 near the substrate 10 on the substrate 10 is located within the orthographic projection of the fourth surface 242 on the substrate 10, such that the orthographic projection of the surface of the second isolation portion 23 near the substrate 10 on the substrate 10 is located outside the orthographic projection of the second surface 253 of the second sub-part 25 on the substrate 10, such that the fourth surface 242 of the first sub-part 24 is covered by the second isolation portion 23 while the second surface 253 of the second sub-part 25 is not covered by the second isolation portion 23, that is, the second sub-part 25 protrudes relative to the second isolation portion 23 toward the isolation opening 21.

[0080] In some embodiments, along a direction parallel to the substrate 10, the width L of the second sub-part 25 satisfies: 0.1 micrometer ≤ L ≤ 0.3 micrometer. For example, the width of the second sub-part 25 can be 0.1 micrometer, 0.15 micrometer, 0.2 micrometer, 0.25 micrometer, 0.3 micrometer, etc., so that the first electrode 31 can overlap with the second sub-part 25.

[0081] In some embodiments, the ratio Z3 of the thickness of the first sub-part 24 to the thickness of the second isolation part 23 satisfies: For example, the ratio could be The thickness relationship between the first sub-part 24 and the second isolation part 23 is reasonably set to improve the performance of the isolation structure 20.

[0082] Furthermore, by reasonably setting the thickness relationship between the first sub-part 24 and the second isolation part 23, the thickness relationship between the second sub-part 25 and the second isolation part 23 can be indirectly characterized, thereby reasonably adjusting the dimensional relationship between the various parts of the isolation structure 20.

[0083] Preferably, the thickness H1 of the first sub-part 24 satisfies: 100 angstroms ≤ H1 ≤ 1000 angstroms; and / or the thickness H2 of the second isolation part 23 satisfies: 7000 angstroms ≤ H2 ≤ 9000 angstroms, so as to reasonably set the thickness of the first sub-part 24 and / or the second isolation part 23.

[0084] It should be noted that the thickness of the first sub-part 24 is greater than or equal to 100 angstroms and less than or equal to 1000 angstroms. For example, the thickness of the first sub-part 24 can be 100 angstroms, 200 angstroms, 300 angstroms, 500 angstroms, 700 angstroms, 1000 angstroms, etc. The thickness of the second isolation part 23 is greater than or equal to 7000 angstroms, 7400 angstroms, 7800 angstroms, 8000 angstroms, 8500 angstroms, 9000 angstroms, etc.

[0085] Please continue reading. Figure 1 In some embodiments, the isolation structure 20 further includes a third isolation portion 26 disposed on the side of the second isolation portion 23 away from the substrate 10. The second isolation portion 23 includes a sixth surface 221 facing the substrate 10 and a seventh surface 222 away from the substrate 10. The orthographic projection of the seventh surface 222 on the substrate 10 is located within the orthographic projection of the third isolation portion 26 on the substrate 10.

[0086] In these embodiments, a third isolation portion 26 is provided on the side of the second isolation portion 23 facing away from the substrate 10. The orthographic projection of the seventh surface 222 of the second isolation portion 23 facing away from the substrate 10 onto the substrate 10 is located within the orthographic projection of the third isolation portion 26 onto the substrate 10. Therefore, during the fabrication of the light-emitting unit 30, the light-emitting material can be isolated by the third isolation portion 26 to form the light-emitting unit 30 without the need for a precision mask, which can reduce the development and use of precision masks and reduce the fabrication cost.

[0087] Preferably, the orthographic projection of the seventh surface 222 on the substrate 10 is located within the orthographic projection of the sixth surface 221 on the substrate 10, thereby facilitating the material of the first electrode 31 to fall onto the second sub-part 25 of the first isolation portion 22 during the deposition process, thus achieving the overlap between the first electrode 31 and the second sub-part 25.

[0088] Preferably, the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the third isolation portion 26 on the substrate 10, which can prevent the light-emitting functional layer 32 from overlapping with the first isolation portion 22 and reduce the risk of leakage of the light-emitting unit 30.

[0089] Please continue reading. Figure 1 In some embodiments, the display panel 100 further includes a pixel definition layer 40, which includes a pixel limiting portion 41 and a pixel opening 42 formed by the pixel limiting portion 41. The pixel opening 42 is connected to the isolation opening 21, and at least some of the light-emitting units 30 are located in the pixel opening 42. The isolation structure 20 is disposed on the side of the pixel limiting portion 41 away from the substrate 10.

[0090] The pixel limiting portion 41 encloses to form a pixel opening 42, and the light-emitting unit 30 is located in the pixel opening 42 to realize the light-emitting display of the display panel 100. The pixel opening 42 is connected to the isolation opening 21 to reduce the obstruction of the pixel opening 42 by the isolation structure 20 and ensure the light-emitting effect of the light-emitting unit 30. The isolation structure 20 is located on the side of the pixel limiting portion 41 away from the substrate 10. Therefore, the first electrode 31 of the light-emitting unit 30 can extend from the pixel opening 42 to the side of the pixel limiting portion 41 away from the substrate 10 to connect with the second sub-part 25 of the first isolation portion 22.

[0091] In these embodiments, the isolation structure 20 is disposed on the side of the pixel limiting portion 41 away from the substrate 10, and the pixel opening 42 is connected to the isolation opening 21. Therefore, the arrangement of the pixel limiting portion 41 is equivalent to making the isolation opening 21 have a large height difference. When fabricating the light-emitting unit 30, since the height difference at the isolation opening 21 is large, the light-emitting material is more easily broken at the isolation structure 20, thereby reducing the fabrication difficulty of the light-emitting unit 30.

[0092] It should be noted that the second electrode 33 of the light-emitting unit 30 can be disposed between the pixel limiting part 41 and the substrate 10, and is insulated from the isolation structure 20 through the pixel limiting part 41.

[0093] Please see Figure 5 In some embodiments, the display panel 100 further includes a pixel definition layer 40, which includes a pixel defining portion 41 and a pixel opening 42 and a clearance opening 43 formed by the pixel defining portion 41. An isolation structure 20 is disposed in the clearance opening, and a first electrode 31 extends from the pixel opening 42 to the clearance opening and overlaps with the first isolation portion 22 of the isolation structure 20.

[0094] Both the clearance opening and the pixel opening 42 are enclosed by the pixel limiting portion 41. The orthographic projection of the clearance opening on the substrate 10 is offset from the orthographic projection of the pixel opening 42 on the substrate 10. A clearance opening can be provided between two adjacent pixel openings 42. The pixel opening 42 and the clearance opening can be separated by the pixel limiting portion 41. An isolation structure 20 is disposed in the clearance opening. The first electrode 31 can extend from the pixel opening 42 through the side surface 254 of the pixel limiting portion 41 facing away from the substrate 10 into the clearance opening and connect with the first isolation portion 22 of the isolation structure 20.

[0095] In these embodiments, the isolation structure 20 is disposed in the clearance opening. During the fabrication process, the isolation structure 20 can be fabricated before the second electrode 33 of the light-emitting unit 30 is fabricated. That is, after the isolation structure 20 is fabricated on the substrate 10, the second electrode 33 is fabricated on the substrate 10. This can reduce the impact of the fabrication of the isolation structure 20 on the second electrode 33 and ensure that the second electrode 33 is not damaged during the fabrication of the isolation structure 20.

[0096] Please see Figure 6 The second aspect of this application provides a method for manufacturing a display panel 100, the method comprising:

[0097] S10. A first isolation material layer and a second isolation material layer are sequentially formed on one side of the substrate 10. The first and second isolation material layers are formed sequentially; that is, after the first isolation material layer is formed on the substrate 10, the second isolation material layer is formed on the side of the first isolation material layer facing away from the substrate 10. There are no other process steps between the process of forming the first isolation material layer and the process of forming the second isolation material layer. It should be noted that the first and second isolation material layers can be prepared using a deposition process, and both the first and second isolation material layers can comprise conductive materials.

[0098] S20. The second isolation material layer is patterned to form the second isolation section 23.

[0099] S30. The first isolation material layer is patterned and roughened to form a first isolation portion 22, resulting in an isolation structure 202. The isolation structure 20 encloses a plurality of isolation openings 21. The first isolation portion 22 includes a first sub-portion 24 covered by a second isolation portion 23 and a second sub-portion 25 disposed on the side of the first sub-portion 24 facing the isolation opening 21. The second sub-portion 25 protrudes relative to the second isolation portion 23 and includes a roughened surface 251 facing the isolation opening 21. The surface roughness of the roughened surface 251 is greater than the surface roughness of the first sub-portion 24. It should be noted that the first isolation material layer and / or the second isolation material layer can be patterned using processes such as dry etching or wet etching. In the step of patterning and roughening the first isolation material layer, the first isolation material layer can be patterned first to form the first sub-portion 24 and a second preparatory sub-portion with a specific shape. Then, the surface of the second preparatory sub-portion facing the isolation opening 21 is roughened to form the second sub-portion 25 including the roughened surface 251. Roughening the first isolation material layer can specifically involve forming a plurality of protrusions 255 and a plurality of grooves 256 on the surface of the second preparatory sub-part facing the isolation opening 21, so that the surface of the second preparatory sub-part facing the isolation opening 21 is rougher than the third surface 241 and the fourth surface 242 of the first sub-part 24.

[0100] S40. Light-emitting units 30 are formed in each isolation opening 21. The light-emitting unit 30 includes a light-emitting functional layer 32 and a first electrode 31 stacked in a direction away from the substrate 10. The first electrode 31 overlaps with the second sub-part 25 and covers at least part of the rough surface 251.

[0101] In these embodiments, a first isolation material layer and a second isolation material layer are first formed sequentially on one side of the substrate 10. Then, the second isolation material layer is patterned to form a second isolation portion 23. The first isolation material layer is then patterned to form a first isolation portion 22, resulting in an isolation structure 20. The isolation structure 20 encloses and forms a plurality of isolation openings 21. The first isolation portion 22 includes a first sub-portion 24 covered by the second isolation portion 23 and a second sub-portion 25 disposed on the side of the first sub-portion 24 facing the isolation opening 21. The second sub-portion 25 protrudes relative to the second isolation portion 23. The second sub-portion 25 includes a rough surface 251 facing the isolation opening 21. The surface roughness of the rough surface 251 is greater than the surface roughness of the first sub-portion 24. Subsequently, light-emitting units 30 are formed in each isolation opening 21. The light-emitting unit 30 includes a light-emitting functional layer 32 and a first electrode 31 stacked in a direction away from the substrate 10, such that the first electrode 31 overlaps with the second sub-part 25 and covers the rough surface 251 of the second sub-part 25, thereby increasing the overlap area between the first electrode 31 and the second sub-part 25, reducing the overlap resistance between the two, and improving the light-emitting performance of the display panel 100.

[0102] Preferably, the steps of patterning and roughening the first isolation material layer include: roughening the first isolation material layer using an etching process or a plasma etching process.

[0103] Understandably, the first isolation material layer can be patterned to form a second pre-part with a specific shape. The isolation opening 21 can then be formed by the second pre-part and the second isolation portion. Subsequently, the second pre-part is roughened to form a rough surface 251, which has multiple protrusions 255 or grooves 256. The etching process can include dry etching and wet etching. Using this process to roughen the second pre-part can reduce costs. Alternatively, plasma etching can be used to roughen the second pre-part, which can improve the precision of the protrusions 255 or grooves 256 formed on the rough surface 251.

[0104] In some embodiments, during the step of sequentially forming a first isolation material layer and a second isolation material layer on one side of the substrate 10, a third isolation material layer is also formed. The third isolation material layer covers the side of the second isolation material layer opposite to the substrate 10, and the third isolation material layer may include a conductive material.

[0105] Before the step of patterning the second insulating material layer to form the second insulating part 23, the method further includes:

[0106] The first, second, and third isolation material layers are etched to form a pre-opening and a third isolation portion 26. Specifically, before patterning the second isolation material layer, the first, second, and third isolation material layers can be etched along the thickness direction of the substrate 10 to form a pre-opening and a third isolation portion 26. The position of the pre-opening corresponds to the position of the isolation opening 21 formed subsequently. The pre-opening can expose the sidewalls of the first isolation material layer, the second isolation material layer, and the third isolation portion 26 along the direction parallel to the substrate 10. At this time, the orthographic projections of the first isolation material layer, the second isolation material layer, and the third isolation portion 26 on the substrate 10 overlap with each other.

[0107] The steps of patterning the second insulating material layer to form the second insulating part 23 include:

[0108] Laterally etching is performed on the surface of the second isolation material layer exposed through the pre-existing opening to form a second isolation portion 23. This exposes a portion of the surface of the first isolation material layer facing away from the substrate 10, and the orthographic projection of the surface of the second isolation portion 23 facing away from the substrate 10 onto the substrate 10 lies within the orthographic projection of the third isolation portion 26 onto the substrate 10. Specifically, a specific etching solution can be used to laterally etch the surface of the second isolation material layer exposed through the pre-existing opening to form a second isolation portion 23 with a specific morphology. Since a portion of the second isolation material layer is etched away by the etching solution, a portion of the surface of the first isolation material layer facing away from the substrate 10 can be exposed through the pre-existing opening. Finally, the first isolation material layer is patterned and roughened to form a first isolation portion 22 with a specific morphology.

[0109] In these embodiments, a first isolation material layer, a second isolation material layer, and a third isolation material layer are first sequentially formed on one side of the substrate 10. The first isolation material layer, the second isolation material layer, and the third isolation material layer are etched to form a pre-opening and a third isolation portion 26. Then, the surface of the second isolation material layer exposed through the pre-opening is laterally etched to form a second isolation portion 23, exposing a portion of the surface of the first isolation material layer facing away from the substrate 10. The orthographic projection of the surface of the second isolation portion 23 facing away from the substrate 10 on the substrate 102 is located within the orthographic projection of the third isolation portion 26 on the substrate 10. Subsequently, the first isolation material layer is patterned and roughened to form a first isolation portion 22, thereby reducing the difficulty of the process.

[0110] It should be noted that, in this embodiment, the distance between the top of the protrusion 255 formed on the rough surface 251 of the second sub-part 25 and the first surface 252 of the second sub-part 25 is less than or equal to the distance between the third surface 241 and the fourth surface 242 of the first sub-part 24.

[0111] Please see Figure 7 In some embodiments, the step of sequentially forming a first insulating material layer and a second insulating material layer on one side of the substrate 10 includes:

[0112] S11. A first insulating material layer is formed on one side of the substrate 10;

[0113] S12. A portion of the first isolation material layer is patterned to form a recess. Specifically, after the first isolation material layer is formed, a portion of the first isolation material layer can be etched away from the side of the first isolation material layer away from the substrate 10 to form a recess. The position of the recess corresponds to the position of the first sub-part 24 of the first isolation portion 22 and also corresponds to the position of the second isolation portion 23.

[0114] S13. A second isolation material layer is formed on the side of the first isolation material layer away from the substrate 10, and a portion of the second isolation material layer is located in the recess.

[0115] In the step of patterning the second isolation material layer to form the second isolation portion 23, the second isolation portion 23 is located in the recess.

[0116] In the step of patterning and roughening the first isolation material layer to form the first isolation portion 22, the first sub-part 24 is located on the side of the recess facing the substrate 10, and the orthographic projection of the surface of the second isolation portion 23 on the substrate 10 near the substrate 10 is located within the orthographic projection of the surface of the first sub-part 24 on the substrate 10 away from the substrate 10.

[0117] In these embodiments, a thicker first insulating material layer is first formed on one side of the substrate 10, and the first insulating material layer is patterned to form a recess. The position of the recess corresponds to the position of the subsequently formed first sub-part 24. Then, a second insulating material layer is formed on the side of the first insulating material layer away from the substrate 10, such that a portion of the second insulating material layer is located in the recess. Next, the second insulating material layer is patterned to form a second insulating portion 23 located in the recess. Then, the first insulating material layer is patterned and roughened to form a first insulating portion 22. The first insulating portion 22 includes a first sub-part 24 and a second sub-part 25. The first sub-part 24 is located on the side of the recess facing the substrate 10. The orthographic projection of the surface of the second isolation portion 23 near the substrate 10 onto the substrate 10 lies within the orthographic projection of the surface of the first sub-portion 24 away from the substrate 10 onto the substrate 10. This causes the second sub-portion 25 to protrude toward the isolation opening 21 relative to the second isolation portion 23, so as to overlap with the first electrode 31 of the subsequently fabricated light-emitting unit 30. Since the second sub-portion 25 includes a rough surface 251 facing the isolation opening 21, and the surface roughness of the rough surface 251 is greater than that of the first sub-portion 24, and the first electrode 31 covers at least part of the rough surface 251, the overlap area between the first electrode 31 and the second sub-portion 25 can be increased, the overlap resistance between the two can be reduced, and the light-emitting performance of the display panel 100 can be improved.

[0118] Preferably, before the step of patterning the second insulating material layer, the method further includes:

[0119] A third isolation material layer is formed on the side of the second isolation material layer facing away from the substrate 10. The third isolation material layer covers the side of the second isolation material layer facing away from the substrate 10, and the third isolation material layer may include a conductive material.

[0120] The first, second, and third isolation material layers are etched to form a pre-opening and a third isolation portion 26. The location and process of the pre-opening are the same as those of the pre-opening described above, and therefore will not be repeated here.

[0121] The steps of patterning the second insulating material layer to form the second insulating part 23 include:

[0122] Laterally etch the surface of the second isolation material layer exposed through the pre-prepared opening to form a second isolation portion 23 located in the recess, exposing a portion of the surface of the first isolation material layer facing away from the substrate 10. The orthographic projection of the surface of the second isolation portion 23 facing away from the substrate 10 onto the substrate 10 lies within the orthographic projection of the third isolation portion 26 onto the substrate 10. It should be noted that the etching method of the second isolation material layer and the morphology of the formed second isolation portion 23 in this embodiment can be the same as the aforementioned process, and therefore will not be repeated here.

[0123] In these embodiments, a thicker first isolation material layer is first formed on one side of the substrate 10, and the first isolation material layer is patterned to form a recess, the position of which corresponds to the position of the first sub-part 24. Then, a second isolation material layer and a third isolation material layer are sequentially formed on the side of the first isolation material layer away from the substrate 10, and the first, second, and third isolation material layers are etched to form a pre-opening and a third isolation portion 26. Afterward, the surface of the second isolation material layer exposed through the pre-opening is laterally etched to form a second isolation portion 23, and the first isolation material layer is made to face away from the substrate 10. A portion of the surface on one side is exposed in the pre-opening. Subsequently, the first isolation material layer is patterned and roughened to form a first isolation portion 22 including a first sub-portion 24 and a second sub-portion 25. The second sub-portion 25 includes a rough surface 251 facing the isolation opening 21. The surface roughness of the rough surface 251 is greater than that of the first sub-portion 24, so that the first electrode 31 of the subsequently fabricated light-emitting unit 30 overlaps with the second sub-portion 25 and covers at least part of the rough surface 251. This increases the overlap area between the first electrode 31 and the second sub-portion 25, reduces the overlap resistance between them, and improves the light-emitting performance of the display panel 100.

[0124] A third aspect of this application provides a display device, including a display panel 100 according to any of the above-described methods or a display panel 100 prepared by any of the above-described methods. Since this display device employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0125] The display device can be any device with display function, such as mobile devices such as mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), as well as non-mobile devices such as personal computers (PCs), televisions (TVs), ATMs, or self-service machines.

[0126] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0127] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings. The isolation structure includes a first isolation portion and a second isolation portion stacked in a direction away from the substrate. The first isolation portion includes a first sub-part covered by the second isolation portion and a second sub-part disposed on the side of the first sub-part facing the isolation opening. The second sub-part protrudes relative to the second isolation portion and includes a rough surface facing the isolation opening. The surface roughness of the rough surface is greater than the surface roughness of the first sub-part. Multiple light-emitting units, at least a portion of which are disposed in corresponding isolation openings, each light-emitting unit including a light-emitting functional layer and a first electrode stacked along a direction away from the substrate, the first electrode overlapping with a second sub-part and covering at least a portion of the rough surface; The first electrodes of the plurality of light-emitting units are electrically connected through the isolation structure to form a full-surface electrode; The second sub-part includes a first surface facing the substrate, a second surface facing away from the substrate, and a side surface connecting the first surface and the second surface, wherein the rough surface includes the second surface; The second surface forms a plurality of grooves along a direction perpendicular to the substrate. The ratio Z1 of the distance from the bottom of the groove near the substrate to the surface of the first sub-part away from the substrate to the thickness of the first sub-part satisfies: 0.1≤Z1≤0.

5.

2. The display panel according to claim 1, characterized in that, The rough surface includes the side surface.

3. The display panel according to claim 1, characterized in that, The second surface and / or the side surface are formed with a plurality of protrusions and a plurality of grooves.

4. The display panel according to claim 1, characterized in that, The first sub-part includes a third surface facing the substrate and a fourth surface facing away from the substrate. The second surface is formed with a plurality of protrusions, the tops of which protrude from the fourth surface. Alternatively, the distance between the tops of the protrusions and the first surface is less than or equal to the distance between the third surface and the fourth surface.

5. The display panel according to claim 4, characterized in that, The top of the protrusion protrudes from the fourth surface. In a direction perpendicular to the substrate, the ratio Z2 of the distance from the top of the protrusion away from the substrate to the fourth surface to the thickness of the first sub-part satisfies: 0.1≤Z2≤0.

5.

6. The display panel according to claim 4, characterized in that, The orthographic projection of the surface of the second isolation portion on the side near the substrate is located within the orthographic projection of the fourth surface on the substrate.

7. The display panel according to claim 1, characterized in that, Along the direction parallel to the substrate, the width L of the second sub-part satisfies: 0.1 micrometers ≤ L ≤ 0.3 micrometers.

8. The display panel according to any one of claims 1-7, characterized in that, The ratio Z3 of the thickness of the first sub-part to the thickness of the second isolation part satisfies: .

9. The display panel according to claim 8, characterized in that, The thickness H1 of the first sub-part satisfies: 100 angstroms ≤ H1 ≤ 1000 angstroms; and / or, the thickness H2 of the second isolation part satisfies: 7000 angstroms ≤ H2 ≤ 9000 angstroms.

10. The display panel according to any one of claims 1-7, characterized in that, The isolation structure further includes a third isolation portion disposed on the side of the second isolation portion away from the substrate. The second isolation portion includes a sixth surface facing the substrate and a seventh surface away from the substrate. The orthographic projection of the seventh surface on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

11. The display panel according to claim 10, characterized in that, The orthographic projection of the seventh surface on the substrate lies within the orthographic projection of the sixth surface on the substrate.

12. The display panel according to claim 10, characterized in that, The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

13. The display panel according to any one of claims 1-7, characterized in that, The display panel further includes a pixel definition layer, which includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The pixel opening is connected to the isolation opening, and at least a portion of the light-emitting units are located in the pixel opening. The isolation structure is disposed on the side of the pixel defining portion away from the substrate.

14. The display panel according to any one of claims 1-7, characterized in that, The display panel further includes a pixel definition layer, which includes a pixel defining portion and a pixel opening and a clearance opening formed by the pixel defining portion. The isolation structure is disposed in the clearance opening, and the first electrode extends from the pixel opening to the clearance opening and overlaps with the first isolation portion of the isolation structure.

15. A method for manufacturing a display panel, characterized in that, The preparation method includes: A first isolation material layer and a second isolation material layer are sequentially formed on one side of the substrate; The second insulating material layer is patterned to form the second insulating part; The first isolation material layer is patterned and roughened to form a first isolation portion, thus obtaining an isolation structure. The isolation structure encloses and forms multiple isolation openings. The first isolation portion includes a first sub-part covered by a second isolation portion and a second sub-part disposed on the side of the first sub-part facing the isolation opening. The second sub-part protrudes relative to the second isolation portion and includes a roughened surface facing the isolation opening. The surface roughness of the roughened surface is greater than that of the first sub-part. The second sub-part includes a first surface facing the substrate, a second surface facing away from the substrate, and a side surface connecting the first surface and the second surface. The roughened surface includes the second surface. The second surface forms multiple grooves along a direction perpendicular to the substrate. The ratio Z1 of the distance from the bottom of the groove near the substrate to the surface of the first sub-part facing away from the substrate to the thickness of the first sub-part satisfies: 0.1 ≤ Z1 ≤ 0.

5. Light-emitting units are formed in each of the isolation openings. Each light-emitting unit includes a light-emitting functional layer and a first electrode stacked in a direction away from the substrate. The first electrode overlaps with the second sub-part and covers at least part of the rough surface. The first electrodes of the plurality of light-emitting units are electrically connected through the isolation structure to form a full-surface electrode.

16. The preparation method according to claim 15, characterized in that, The steps of patterning and roughening the first isolation material layer include: roughening the first isolation material layer using an etching process or a plasma etching process.

17. The preparation method according to claim 15, characterized in that, In the step of sequentially forming a first isolation material layer and a second isolation material layer on one side of the substrate, a third isolation material layer is also formed. Before the step of patterning the second insulating material layer to form the second insulating portion, the method further includes: The first isolation material layer, the second isolation material layer and the third isolation material layer are etched to form a pre-opening and a third isolation portion; The step of patterning the second insulating material layer to form the second insulating portion includes: Laterally etch the surface of the second isolation material layer exposed through the pre-opening to form the second isolation portion, and expose a portion of the surface of the first isolation material layer facing away from the substrate, and the orthographic projection of the surface of the second isolation portion facing away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

18. The preparation method according to claim 15, characterized in that, The step of sequentially forming a first insulating material layer and a second insulating material layer on one side of the substrate includes: A first insulating material layer is formed on one side of the substrate; A portion of the first insulating material layer is patterned to form a recess; A second isolation material layer is formed on the side of the first isolation material layer away from the substrate, and a portion of the second isolation material layer is located in the recess. In the step of patterning the second insulating material layer to form the second insulating portion, the second insulating portion is located in the recess; In the step of patterning and roughening the first isolation material layer to form the first isolation portion, the first sub-part is located on the side of the recess facing the substrate, and the orthographic projection of the surface of the second isolation portion on the substrate near the substrate is located within the orthographic projection of the surface of the first sub-part on the substrate away from the substrate.

19. The preparation method according to claim 18, characterized in that, Before the step of patterning the second insulating material layer, the method further includes: A third isolation material layer is formed on the side of the second isolation material layer away from the substrate; The first isolation material layer, the second isolation material layer and the third isolation material layer are etched to form a pre-opening and a third isolation portion; The step of patterning the second insulating material layer to form the second insulating portion includes: Laterally etch the surface of the second isolation material layer exposed through the pre-opening to form the second isolation portion located in the recess, and expose a portion of the surface of the first isolation material layer facing away from the substrate, and the orthographic projection of the surface of the second isolation portion facing away from the substrate on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

20. A display device, characterized in that, The display panel includes the display panel according to any one of claims 1-14 or the display panel prepared by the preparation method according to any one of claims 15-19.

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