Driving assembly and camera module

Abstract

A driving assembly and a camera module are disclosed. The driving assembly includes a chip stabilization fixing part with a receiving cavity, a chip stabilization movable part suspended in the receiving cavity, a chip driving element for driving the chip stabilization movable part to move relative to the chip stabilization fixing part in the receiving cavity, and a chip stabilization conductive part for conducting circuit boards of the driving element and the camera module. The chip stabilization conductive part is embedded in the chip movable carrier of the chip stabilization movable part by injection molding in an insert molding manner, and is integrally formed with the chip movable carrier, thereby reducing the number of parts of the driving assembly and simplifying the structure and assembly complexity of the driving assembly.

Description

Technical Field

[0001] This application relates to the field of camera modules, and more particularly to a driving component and a camera module. Background Technology

[0002] With the widespread adoption of mobile electronic devices, the technologies related to camera modules used in these devices to help users capture images have developed and progressed rapidly. Currently, consumers in the market have increasingly higher and more diverse functional requirements for camera modules configured in mobile electronic devices (e.g., smartphones), such as image stabilization.

[0003] When using mobile electronic devices for video recording, the physiological tremors that occur at a certain frequency under normal circumstances and the shaking caused by movement can lead to a decrease in video quality. Therefore, mobile electronic devices are usually equipped with image stabilization motors to drive the optical lens and / or image sensor to move and achieve image stabilization.

[0004] As the requirements for image quality in camera modules become increasingly demanding, the size and weight of optical lenses are also increasing, placing greater demands on the driving force of image stabilization motors. However, current mobile electronic devices also face significant size constraints on camera modules, meaning the space occupied by the image stabilization motor increases accordingly with the lens size. In other words, while optical lenses are trending towards larger and heavier designs, the driving force provided by the image stabilization motor cannot be increased accordingly.

[0005] Given limited driving force, the heavier the lens, the shorter the distance the image stabilization motor can travel to move the optical lens, thus affecting image stabilization capabilities. On the other hand, the heavier the optical lens, the slower the image stabilization motor can move it, and the longer it takes for the optical lens to reach the predetermined compensation position, which also affects the image stabilization effect.

[0006] To overcome the above-mentioned defects, the applicant proposes a driving component that achieves optical image stabilization by driving the movement of a photosensitive chip. Summary of the Invention

[0007] One advantage of this application is that it provides a driving component and a camera module, wherein the driving component can achieve optical image stabilization by driving the photosensitive chip to move, thereby meeting the requirements of optical image stabilization for driving stroke and driving speed, and the driving component combines multiple components together in an integral molding manner, which can reduce the structural complexity of the driving component and simplify the assembly process.

[0008] Another advantage of this application is that it provides a driving component and a camera module, wherein multiple components of the driving component are integrally formed by injection molding, which can improve the stability of the positional relationship between the components and thus improve the overall structural stability of the driving component.

[0009] Other advantages and features of this application will become apparent from the following description and can be realized by means and combinations particularly pointed out in the claims.

[0010] To achieve at least one of the above advantages, according to one aspect of this application, this application provides a driving component comprising:

[0011] Chip stabilization fixing part with a receiving cavity;

[0012] A chip anti-shake movable part is suspended and disposed within the receiving cavity;

[0013] A chip driving element for driving the movable chip stabilization portion to move relative to the fixed chip stabilization portion within the receiving cavity, wherein the chip driving element includes a chip coil assembly disposed on the movable chip stabilization portion, and a chip magnet assembly fixed to the fixed chip stabilization portion and corresponding to the chip coil assembly, wherein the chip coil assembly includes at least one chip coil; and

[0014] The chip anti-shake conductive portion includes at least one coil conductive element enclosed within the chip anti-shake movable portion. Each coil conductive element has an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end. At least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is adapted to be electrically connected to a circuit board.

[0015] In the driving assembly according to this application, the chip stabilization movable part includes a chip movable carrier having opposing upper and lower surfaces, wherein a first coil conductive end of the coil conductive element is exposed on the upper surface of the chip movable carrier, and a second coil conductive end of the coil conductive element is exposed on the lower surface of the chip movable carrier.

[0016] In the driving assembly according to this application, the chip coil assembly includes a coil circuit board disposed on the movable carrier of the chip, the at least one chip coil is fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the conductive end of the first coil.

[0017] In the drive assembly according to this application, the chip stabilization fixing part includes a top cover and a base that snap together to form the receiving cavity, and the chip magnet assembly is fixed to the top cover.

[0018] In the driving assembly according to this application, the driving assembly further includes a chip holding assembly, the chip holding assembly including at least one chip magnetic element covered within the chip stabilization movable portion, so that the chip stabilization movable portion is suspended within the receiving cavity of the chip stabilization fixing portion by the magnetic attraction between the at least one chip magnetic element and the chip magnet assembly.

[0019] In the driving component according to this application, the driving component further includes a chip holding component, the chip holding component including at least one chip magnetic element embedded in the chip movable carrier, so that the chip movable carrier is attracted to the upper cover by the magnetic attraction between the at least one chip magnetic element and the chip magnet component.

[0020] In the driving assembly according to this application, the chip holding assembly further includes a chip support assembly disposed between the chip movable carrier and the upper cover. The chip support assembly includes a ball groove recessed in the chip movable carrier and a ball disposed in the ball groove, wherein the ball is held between the upper cover and the chip movable carrier by magnetic attraction between the at least one chip magnetic element and the chip magnet assembly.

[0021] In the driving assembly according to this application, the chip support assembly further includes a ball support piece embedded in the movable chip carrier and located at the bottom of the ball groove, wherein the ball is supported on the ball support piece.

[0022] In the driving assembly according to this application, the movable chip carrier includes a chip carrier body and a chip carrier side extending downward from the periphery of the chip carrier body, wherein the movable chip carrier further includes an extension post protruding from the upper surface of the chip carrier body, and the ball groove is recessed into the upper surface of the extension post.

[0023] In the driving assembly according to this application, the driving assembly further includes a chip position sensing assembly, the chip position sensing assembly including at least one position sensing element, the chip anti-shake conductive portion further including at least one sensing element conductive element encased within the chip movable carrier, each of the sensing element conductive elements including a first sensing element conductive end exposed on the upper surface of the chip movable carrier, a second sensing element conductive end exposed on the lower surface of the chip movable carrier and opposite to the first sensing element conductive end, and a sensing element conductive extension extending between the first sensing element conductive end and the second sensing element conductive end, wherein the first sensing element conductive end is electrically connected to the position sensing element, and the second sensing element conductive end is adapted to be electrically connected to the circuit board.

[0024] In the driving assembly according to this application, the conductive end of the first sensing element is lower than the conductive end of the first coil in the height direction set by the movable carrier of the chip.

[0025] In the driving assembly according to this application, the sensing element conductive element, the coil conductive element and the ball support sheet are not magnetic, while the chip magnetic element is magnetic.

[0026] In the driving assembly according to this application, the chip magnetic attraction element includes a magnetic attraction element body enclosed within the chip movable carrier and a magnetic attraction element connecting portion extending from the magnetic attraction element body to the outside of the chip movable carrier. The sensing element conductive element further includes a sensing element conductive connecting portion extending from the sensing element conductive body formed by the first sensing element conductive end, the second sensing element conductive end, and the sensing element conductive extension to the outside of the chip movable carrier. The coil conductive element further includes a coil conductive connecting portion extending from the coil conductive body formed by the first coil conductive end, the second coil conductive end, and the coil conductive extension to the outside of the chip movable carrier. The ball support plate includes a support plate body located at the bottom of the ball groove and a support plate connecting portion extending from the support plate body to the outside of the chip movable carrier. The magnetic attraction element connecting portion differs from the sensing element conductive connecting portion, the coil conductive connecting portion, and the support plate connecting portion in the height direction set by the chip movable carrier.

[0027] In the driving assembly according to this application, the conductive connection portion of the sensing element and the conductive connection portion of the coil are aligned in the height direction set by the movable carrier of the chip.

[0028] In the driving assembly according to this application, the sensing element conductive element, the coil conductive element, the ball bearing support sheet and the chip magnetic element are integrally formed with the chip movable carrier by injection molding process.

[0029] In the driving assembly according to this application, the chip coil assembly includes a first chip coil group, a second chip coil group, and a third chip coil group. The first chip coil group includes at least one chip coil, the second chip coil group includes at least one chip coil, and the third chip coil group includes at least one chip coil. The second and third chip coil groups are arranged along an X-axis direction set by the driving assembly, and the first chip coil group is arranged along a Y-axis direction set by the driving assembly. The X-axis direction is perpendicular to the Y-axis direction.

[0030] According to another aspect of this application, a camera module is also provided, comprising:

[0031] Optical lens;

[0032] A photosensitive assembly includes a circuit board and a photosensitive chip electrically connected to the circuit board; and

[0033] In the driving component described above, the photosensitive component is mounted on the chip movable carrier of the driving component.

[0034] The further objectives and advantages of this application will become fully apparent from the following description and accompanying drawings.

[0035] These and other objects, features and advantages of this application are fully apparent from the following detailed description, the accompanying drawings and the claims. Attached Figure Description

[0036] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0037] Figure 1 The illustration shows a schematic diagram of a camera module according to an embodiment of this application.

[0038] Figure 2 The illustration shows a partial schematic diagram of a camera module according to an embodiment of this application.

[0039] Figure 3A The illustration shows a partial exploded view of a camera module according to an embodiment of this application.

[0040] Figure 3B The illustration shows another partial exploded view of a camera module according to an embodiment of this application.

[0041] Figure 4A The figure shows a partial structural schematic diagram of a camera module according to an embodiment of this application.

[0042] Figure 4B The figure shows a partial enlarged schematic diagram of a camera module according to an embodiment of this application.

[0043] Figure 4C The figure shows a partial cross-sectional view of a camera module according to an embodiment of this application.

[0044] Figure 5 The figure shows a partial disassembly diagram of a camera module according to an embodiment of this application.

[0045] Figure 6AThe illustration shows a partial schematic diagram of the driving component of a camera module according to an embodiment of this application.

[0046] Figure 6B The figure shows a partial disassembly diagram of the driving component of a camera module according to an embodiment of the present application.

[0047] Figure 6C The figure shows a partial structural schematic diagram of the driving component of a camera module according to an embodiment of the present application.

[0048] Figure 6D The illustration shows another partial structural diagram of the driving component of the camera module according to an embodiment of this application.

[0049] Figure 6E The illustration shows another partial structural schematic diagram of the driving component of a camera module according to an embodiment of the present application.

[0050] Figure 7 The illustration shows another partial structural diagram of a camera module according to an embodiment of this application. Detailed Implementation

[0051] Hereinafter, exemplary embodiments according to this application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein.

[0052] Application Overview

[0053] As mentioned earlier, with the widespread adoption of mobile electronic devices, the technologies related to camera modules used in these devices to help users capture images have developed and progressed rapidly. Currently, consumers in the market have increasingly higher and more diverse requirements for the functions of camera modules configured in mobile electronic devices (e.g., smartphones), such as image stabilization.

[0054] When using mobile electronic devices for video recording, the physiological tremors that occur at a certain frequency under normal circumstances and the shaking caused by movement can lead to a decrease in video quality. Therefore, mobile electronic devices are usually equipped with image stabilization motors to drive the optical lens and / or image sensor to move and achieve image stabilization.

[0055] As the requirements for image quality in camera modules become increasingly demanding, the size and weight of optical lenses are also increasing, placing greater demands on the driving force of image stabilization motors. However, current mobile electronic devices also face significant size constraints on camera modules, meaning the space occupied by the image stabilization motor increases accordingly with the lens size. In other words, while optical lenses are trending towards larger and heavier designs, the driving force provided by the image stabilization motor cannot be increased accordingly.

[0056] Given limited driving force, the heavier the lens, the shorter the distance the image stabilization motor can travel to move the optical lens, thus affecting image stabilization capabilities. On the other hand, the heavier the optical lens, the slower the image stabilization motor can move it, and the longer it takes for the optical lens to reach the predetermined compensation position, which also affects the image stabilization effect.

[0057] Existing solutions propose achieving optical image stabilization by driving the image sensor. Specifically, although image sensors are also trending towards larger sizes, their weight is significantly lighter than that of optical lenses. Therefore, the drive stroke and speed requirements of optical image stabilization can be met by driving the image sensor.

[0058] Furthermore, in existing optical image stabilization technologies that achieve optical image stabilization by driving a photosensitive chip, the assembly process is complex, and high precision is required for the dimensions and positioning of each component. For example, the drive motor used to drive the photosensitive component achieves electrical conduction through an electrical connection structure between it and the circuit board in the photosensitive component. Therefore, some designs involve slotting the drive motor components so that the electrical connection structure passes through the slot between the circuit board and the drive motor, electrically connecting the photosensitive component and the drive motor. Moreover, in the slotting design, corresponding requirements are imposed on the position and dimensions of each component around the slot.

[0059] Based on this, this application proposes that conductive structures and other components can be integrated into the driving assembly through a single molding process, thereby reducing the structural complexity of the driving assembly and simplifying the assembly process. Furthermore, this method allows for the determination of the positional relationships between the conductive structure and other components, improving the stability of these relationships and ultimately enhancing the overall structural stability of the driving assembly used to drive the photosensitive chip.

[0060] Exemplary camera module

[0061] like Figure 1 As shown, a camera module 1 according to an embodiment of this application is illustrated, which includes a photosensitive component 40, an optical lens 10 held on the photosensitive path of the photosensitive component 40, and a driving component for driving the optical lens 10 and / or the photosensitive component 40 to move to achieve optical performance adjustment, such as optical image stabilization, optical focusing, etc.

[0062] Accordingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11. The lens group 12 includes at least one optical lens, and the number of the at least one optical lens can be one or more, without limitation.

[0063] The driving component includes a chip driving motor 30, which is adapted to drive the photosensitive component 40 to translate and / or rotate, thereby realizing the chip-based image stabilization function of the camera module 1.

[0064] The chip drive motor 30 includes a chip stabilization fixing part 31, a chip stabilization movable part 33, a chip drive element 32, and a chip stabilization conductive part 35. The chip stabilization fixing part 31 has a receiving cavity to accommodate the chip stabilization movable part 33, the chip drive element 32, and the chip stabilization conductive part 35. The chip stabilization conductive part 35 provides current to the chip drive element 32. The chip drive element 32 drives the chip stabilization movable part 33 to move relative to the chip stabilization fixing part 31 within the receiving cavity of the chip stabilization fixing part 31. The photosensitive component 40 is fixed to the chip stabilization movable part 33, thereby the chip drive element 32 drives the photosensitive component 40 to move relative to the chip stabilization fixing part 31.

[0065] The driving assembly further includes a lens drive motor 20, which is adapted to drive the optical lens 10 to translate and / or rotate, thereby realizing the lens focusing, lens stabilization, and other functions of the camera module 1. The lens drive motor 20 includes a lens drive fixed part, a lens drive movable part, a lens drive element, and a lens drive conductive part. The lens drive fixed part has a receiving cavity to accommodate the lens drive movable part, the lens drive element, and the lens drive conductive part. The lens drive conductive part provides driving power to the lens drive element, and the lens drive element drives the lens drive movable part to move relative to the lens drive fixed part. The optical lens 10 is fixed to the lens drive movable part, so that the lens drive element drives the optical lens 10 to move relative to the lens drive fixed part. For example, driving the optical lens 10 to move along its optical axis to achieve lens focusing; or driving the optical lens 10 to translate in a direction perpendicular to its optical axis or driving the optical lens 10 to rotate about a direction perpendicular to its optical axis to achieve lens stabilization. The lens drive motor 20 is fixed to the chip stabilization fixing part 31 of the chip drive motor 30 through the lens drive fixing part, thereby placing the optical lens 10 on the light-sensing path of the photosensitive component 40.

[0066] In one embodiment of this application, the camera module 1 does not have a lens drive motor 20. The optical lens 10 is directly mounted on the chip stabilization fixing part 31 of the chip drive motor 30, or the optical lens 10 is indirectly mounted on the chip stabilization fixing part 31 of the chip drive motor 30 through a support member, so that the optical lens 10 is positioned on the light-sensing path of the photosensitive component 40.

[0067] The photosensitive component 40 includes a circuit board 41, a photosensitive chip 42 electrically connected to the circuit board 41, and electronic components 43. The photosensitive chip 42 is used to receive external light collected by the optical lens 10 to form an image and is electrically connected to an external mobile electronic device through the circuit board 41. In one embodiment of this application, the electronic component 43 may be one or more of passive electronic devices such as resistors and capacitors, and active electronic devices such as driver chips and memory chips. The electronic component 43 may be electrically connected to the front or back of the circuit board 41, depending on the design requirements of the camera module 1.

[0068] The photosensitive chip 42 is directly or indirectly fixed to the circuit board 41. The photosensitive chip 42 includes a photosensitive area and a non-photosensitive area. The photosensitive chip 42 is electrically connected to the circuit board 41 through chip pads located in the non-photosensitive area. For example, the photosensitive chip 42 can be electrically connected to the circuit board 41 by wire bonding (gold wire bonding), soldering, FC process (flip chip) or RDL (rerouting layer technology).

[0069] In one embodiment of this application, the circuit board 41 includes a circuit board body 411, a connecting strip 412, and a reinforcing plate 413. The connecting strip 412 connects to and electrically conducts the circuit board body 411, thereby transmitting the imaging information acquired by the photosensitive chip 42 to an external mobile electronic device through the circuit board body 411 and the connecting strip 412. The reinforcing plate 413 can be fixed to the back of the circuit board body 411, thereby increasing the structural strength of the circuit board body 411. The circuit board body 411 includes a circuit board through hole 4111 located in the middle. The reinforcing plate 413 is fixed to the bottom surface of the circuit board body 411 by, for example, adhesive bonding. The reinforcing plate 413 and the circuit board body 411 form a mounting cavity to accommodate the photosensitive chip 42, thereby avoiding the influence of the thickness of the circuit board body 411 on the thickness of the photosensitive component 40 and reducing the height of the camera module 1.

[0070] In one specific embodiment of this application, the connecting strip 412 includes a first connecting strip 4121 and a second connecting strip 4122. The first connecting strip 4121 and the second connecting strip 4122 extend outward from opposite sides of the circuit board body 411 and can be further bent upward. This arrangement allows the circuit board body 411 to remain stable during movement, further reducing the resistance when driving the circuit board 41 to move. Of course, in another specific example of this application, the first connecting strip 4121 and the second connecting strip 4122 can extend outward from adjacent sides of the circuit board body 411 and bend upward; this application does not impose any limitation on this.

[0071] The photosensitive assembly 40 further includes a filter element 44, which is held in the photosensitive path of the photosensitive chip 42 to filter the imaging light entering the photosensitive chip 42. In a specific example, the filter element 44 is mounted and fixed to the base 45 of the photosensitive assembly 40 and corresponds to at least the photosensitive area of ​​the photosensitive chip 42. The filter element 44 can be attached upright or upside down to the base 45, which has a light-transmitting hole, so that the light from the optical lens 10 can pass through the light-transmitting hole of the base 45 and enter the photosensitive chip 42.

[0072] The photosensitive component 40 can be fixed to the chip anti-shake movable part 33 of the chip drive motor 30 through the circuit board 41 (the circuit board body 411) or the base 45, so that the photosensitive component 40 moves with the movement of the chip anti-shake movable part 33.

[0073] Exemplary chip-driven motor

[0074] Figures 2 to 7 An embodiment of the chip drive motor 30 of this application is shown. The chip drive motor 30 includes a chip anti-shake fixing part 31, a chip anti-shake movable part 33, a chip drive element 32, and a chip anti-shake conductive part 35.

[0075] The chip driving element 32 is disposed between the chip stabilization movable part 33 and the chip stabilization fixed part 31, respectively connecting the chip stabilization movable part 33 and the chip stabilization fixed part 31. The chip stabilization conductive part 35 is electrically connected to the chip driving element 32 and the photosensitive component 40, and provides driving power to the chip driving element 32 to drive the chip stabilization movable part 33 to translate in the X-axis direction (i.e., the direction set by the X-axis) and the Y-axis direction (i.e., the direction set by the Y-axis) and / or rotate around the Z-axis direction (i.e., the direction set by the Z-axis), so as to realize translational stabilization and / or rotational stabilization of the photosensitive component 40. It is worth mentioning that, in this embodiment, the X-axis direction and the Y-axis direction are perpendicular to each other, and the Z-axis direction is perpendicular to the plane containing the X-axis direction and the Y-axis direction. The Z-axis direction is also the direction of the optical axis of the optical lens 10. In other words, the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system, and the XOY plane containing the X-axis direction and the Y-axis direction is also called the plane containing the horizontal direction.

[0076] like Figures 2 to 3BAs shown, in one embodiment of this application, the chip stabilization fixing part 31 includes an upper cover 311 and a base 312 that are interlocked to form a receiving cavity. That is, the chip stabilization fixing part 31 includes an upper cover 311 and a base 312 that are interlocked. The upper cover 311 and the base 312 are fixed to each other to form the receiving cavity (i.e., the receiving cavity of the chip stabilization fixing part 31) to house the chip stabilization movable part 33, the chip driving element 32, the chip stabilization conductive part 35, and the photosensitive component 40, etc., which not only protects the aforementioned camera module components but also reduces the entry of dust, dirt, or stray light into the interior of the chip driving motor 30. In a specific example of this application, the upper cover 311 and the base 312 can be made of metal materials such as non-magnetic stainless steel.

[0077] Specifically, in this embodiment, the upper cover 311 is disposed above the substrate 312. The upper cover 311 includes a cover body 3111 with a central opening, the opening corresponding to the photosensitive component 40, so that light can enter the photosensitive component 40 through the opening for imaging. Preferably, the opening is circular. Further, the upper cover 311 may also include a cover periphery 3112 extending integrally from the cover body 3111 towards the substrate 312, thereby being fixedly connected to the substrate 312 via the cover periphery 3112. For example, the cover periphery 3112 and the substrate 312 are fixed by laser welding or adhesive bonding. The peripheral side 3112 of the cover also includes at least one peripheral recess 31121, so that at least one connecting strip 412 outlet is formed between the upper cover 311 and the base 312, providing the connecting strip 412 of the circuit board 41 to extend outward from the receiving cavity of the chip anti-shake fixing part 31. In a specific example of this application, the peripheral side 3112 of the cover includes two peripheral recesses 31121 disposed opposite to each other, and two connecting strip 412 outlets are formed between the upper cover 311 and the base 312, providing the first connecting strip 4121 and the second connecting strip 4122 of the circuit board 41 to extend outward from the receiving cavity of the chip anti-shake fixing part 31.

[0078] Figure 4A For along Figure 2 A cross-sectional view of the dashed line AA. Figure 4B for Figure 4A An enlarged schematic diagram of the circular region A, as shown below. Figures 3A to 4BAs shown, the chip stabilization movable part 33 includes a chip movable carrier 331, which has opposing upper and lower surfaces. A chip driving element 32 is disposed between the chip movable carrier 331 and the upper cover 311, driving the chip movable carrier 331 to move relative to the chip stabilization fixing part 31. A photosensitive component 40 is disposed between the chip movable carrier 331 and the substrate 312, and is mounted on the chip movable carrier 331 via the circuit board 41, thus moving with the chip movable carrier 331. In the embodiments of this application, a certain air gap exists between the bottom surface of the photosensitive component 40 (i.e., the side of the photosensitive component 40 closest to the substrate 312) and the substrate 312. This prevents the movement of the photosensitive component 40 from being obstructed by the substrate 312, reducing the driving force requirement of the chip driving element 32. In other words, the photosensitive component 40 is suspended above the substrate 312.

[0079] In this embodiment, the chip stabilization movable part 33 is suspended within the receiving cavity of the chip stabilization fixing part 31, so that the chip stabilization movable part 33 can move relative to the chip stabilization fixing part 31.

[0080] like Figure 6AAs shown, the movable chip carrier 331 of the chip stabilization movable part 33 includes a fixed chip carrier body 3311 and a chip carrier side portion 3312 extending downward from the periphery of the chip carrier body 3311. The circuit board 41 is fixed to the bottom surface of the chip carrier body 3311 (i.e., the side facing the substrate 312). The chip carrier body 3311 has a carrier body through hole 33111, which is adapted to provide a light path for the photosensitive chip 42 of the photosensitive component 40 and can also provide mounting space for electronic components 43 on the photosensitive component 40, preventing the electronic components 43 from interfering with the chip carrier body 3311. The chip carrier side portion 3312 includes a first carrier side portion 33121, a second carrier side portion 33122, a third carrier side portion 33123, and a fourth carrier side portion 33124 extending outward integrally from the chip carrier body 3311. The first carrier side portion 33121 is disposed opposite to the second carrier side portion 33122 and adjacent to the third carrier side portion 33123 and the fourth carrier side portion 33124, the third carrier side portion 33123 and the fourth carrier side portion 33124 being disposed opposite to each other. The first carrier side portion 33121, the second carrier side portion 33122, the third carrier side portion 33123 and the fourth carrier side portion 33124 are adapted to serve as anti-collision components when the chip carrier body 3311 moves, preventing the chip carrier body 3311 from directly colliding with the chip anti-shake fixing portion 31.

[0081] In one embodiment of this application, the chip carrier side portion 3312 (first carrier side portion 33121, second carrier side portion 33122, third carrier side portion 33123 and fourth carrier side portion 33124) further extends towards the substrate 312. The chip carrier side portion 3312 is lower than the bottom surface of the chip carrier body 3311, so that when the circuit board 41 is fixed to the bottom surface of the chip carrier body 3311 by adhesive medium, the space formed between the chip carrier side portion 3312 and the chip carrier body 3311 can accommodate part of the overflowing adhesive medium, reducing the probability of the adhesive medium overflowing to the outside of the chip carrier side portion 3312. Furthermore, the extension of the chip carrier side portion 3312 towards the substrate 312 can also increase the side surface area of ​​the movable chip carrier 331, thereby increasing the impact area between the movable chip carrier 331 and the chip anti-shake fixing part 31. Furthermore, in order to allow the connecting strip 412 to extend outward, the first carrier side 33121 and the second carrier side 33122 each have a connecting strip clearance groove 33125, providing a channel for the first connecting strip 4121 and the second connecting strip 4122 to extend outward.

[0082] like Figure 5As shown, the chip driving element 32 includes a chip magnet assembly 321 and a chip coil assembly 322. The chip coil assembly 322 is disposed on the chip stabilization movable part 33, and the chip magnet assembly 321 is fixed to the chip stabilization fixing part 31 and corresponds to the chip coil assembly 322. The chip magnet assembly 321 is fixed to the upper cover 311 of the chip stabilization fixing part 31 by means of, for example, adhesive medium. The chip coil assembly 322 is fixed to the chip movable carrier 331 of the chip stabilization movable part 33. The chip magnet assembly 321 and the chip coil assembly 322 are disposed opposite to each other, thereby driving the chip stabilization movable part 33 to move relative to the chip stabilization fixing part 31 through the magnetic force between the chip coil assembly 322 and the chip magnet assembly 321.

[0083] Furthermore, the specific structure of the chip driving element 32 will be described, wherein each of the chip coil groups includes at least one chip coil. (See reference...) Figure 5 As shown, in one embodiment of this application, the chip coil assembly 322 includes a first chip coil group 3221, a second chip coil group 3222, and a third chip coil group 3223. The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are disposed in the plane containing the X-axis and Y-axis, i.e., the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are disposed horizontally. The first chip coil group 3221 is disposed along the Y-axis, the second chip coil group 3222 is disposed along the X-axis, and the third chip coil group 3223 is disposed along the X-axis. The second chip coil group 3222 and the third chip coil group 3223 are disposed opposite each other along the Y-axis. Further, the second chip coil group 3222 and the third chip coil group 3223 are symmetrical with respect to the Y-axis. The first chip coil group 3221, the second chip coil group 3222 and the third chip coil group 3223 are arranged around the photosensitive component 40.

[0084] The photosensitive chip 42 of the photosensitive component 40 has a rectangular structure including a long side and a wide side. The outer edge of the photosensitive component 40 can be defined as a first side, a second side, a third side and a fourth side. A rectangular coordinate system is established with the center of the photosensitive chip 42 as the origin. The first side and the second side are parallel to the X-axis direction, and the third side and the fourth side are parallel to the Y-axis direction.

[0085] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 each include at least one chip coil. That is, the first chip coil group 3221 includes at least one chip coil, the second chip coil group 3222 includes at least one chip coil, and the third chip coil group 3223 includes at least one chip coil. For example, in a specific embodiment of this application, the first chip coil group 3221 includes a first chip coil 32211 and a second chip coil 32212, which are arranged relatively parallel to each other along the Y-axis; the second chip coil group 3222 includes a third chip coil 32221 and a fourth chip coil 32222, which are arranged relatively parallel to each other along the X-axis; the third chip coil group 3223 includes a fifth chip coil 32231 and a sixth chip coil 32232, which are arranged relatively parallel to each other along the X-axis; the third chip coil 32221 and the fifth chip coil 32231 are arranged along the X-axis; the fourth chip coil 32222 and the sixth chip coil 32232 are arranged along the X-axis. Alternatively, the first chip coil 32211 and the second chip coil 32212 are respectively disposed on the third and fourth sides of the photosensitive component 40, and are arranged parallel to the third and fourth sides respectively; the third chip coil 32221 and the fifth chip coil 32231 are disposed on the second side of the photosensitive component 40, and are arranged parallel to the second side; the fourth chip coil 32222 and the sixth chip coil 32232 are disposed on the first side of the photosensitive component 40, and are arranged parallel to the first side.

[0086] The first chip coil 32211 and the second chip coil 32212 work together to drive the chip anti-shake movable part 33 to move along the X-axis direction. The third chip coil 32221, the fourth chip coil 32222, the fifth chip coil 32231 and the sixth chip coil 32232 work together to drive the chip anti-shake movable part 33 to move along the Y-axis direction and / or rotate around the Z-axis direction.

[0087] Preferably, the first chip coil 32211 and the second chip coil 32212 have the same size, the third chip coil 32221, the fourth chip coil 32222, the fifth chip coil 32231 and the sixth chip coil 32232 have the same size, and the size of the first chip coil 32211 and the second chip coil 32212 is larger than the size of the third chip coil 32221, the fourth chip coil 32222, the fifth chip coil 32231 and the sixth chip coil 32232.

[0088] In one embodiment of this application, the chip coil assembly 322 further includes a coil circuit board 3224, wherein at least one chip coil in the chip coil assembly 322 is fixed and electrically connected to the coil circuit board 3224. In a specific example of this application, the first chip coil group 3221 (first chip coil 32211, second chip coil 32212), the second chip coil group 3222 (third chip coil 32221, fourth chip coil 32222), and the third chip coil group 3223 (fifth chip coil 32231, sixth chip coil 32232) are all fixed and electrically connected to the coil circuit board 3224. The chip coil assembly 322 is electrically connected to the chip anti-shake conductive part 35 through the coil circuit board 3224, and is further electrically connected to the circuit board 41 of the photosensitive component 40. Specifically, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be wound coils that are fixedly electrically connected to the coil circuit board 3224; or, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be directly wound on the coil circuit board 3224; or, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be directly etched on the coil circuit board 3224 to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322, thereby reducing the height of the chip drive motor 30.

[0089] The coil circuit board 3224 has a circuit board light-transmitting hole 32241, which provides light from the optical lens 10 to enter the photosensitive component 40 through the light-transmitting hole. Further as... Figure 4C As shown, Figure 4C For along Figure 2The cross-sectional view along the dashed line BB shows that the coil circuit board 3224 further includes at least one positioning hole 32242. This positioning hole 32242 engages with at least one positioning post 33115 on the chip carrier body 3311, allowing the coil circuit board 3224 to be precisely positioned and mounted on the chip carrier body 3311. In a specific example of this application, the coil circuit board 3224 includes two positioning holes 32242, and the chip carrier body 3311 includes two positioning posts 33115 integrally protruding outward from the chip carrier body 3311. The two positioning holes 32242 are respectively fitted into the two positioning posts 33115, thereby precisely positioning the coil circuit board 3224 on the chip carrier body 3311.

[0090] Accordingly, in one embodiment of this application, the chip magnet assembly 321 includes a first chip magnet group 3211, a second chip magnet group 3212, and a third chip magnet group 3213. The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 are disposed on the plane containing the X-axis and Y-axis (i.e., disposed in the horizontal direction). Further, the first chip magnet group 3211 and the first chip coil group 3221 are disposed vertically opposite each other, the second chip magnet group 3212 and the second chip coil group 3222 are disposed vertically opposite each other, and the third chip magnet group 3213 and the third chip coil group 3223 are disposed vertically opposite each other, such that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211 is arranged along the Y-axis, the second chip magnet group 3212 and the third chip magnet group 3213 are arranged along the X-axis, the second chip magnet group 3212 and the third chip magnet group 3213 are arranged opposite each other along the Y-axis, and the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the Y-axis. In this application, the upper part is the side away from the photosensitive component 40, and the lower part is the side close to the photosensitive component 40.

[0091] The first chip magnet group 3211, the second chip magnet group 3212 and the third chip magnet group 3213 each include at least one chip magnet. For example, in a specific example of this application, the first chip magnet group 3211 includes a first chip magnet 32111 and a second chip magnet 32112, which are arranged relatively parallel to each other along the Y-axis direction; the second chip magnet group 3212 includes a third chip magnet 32121 and a fourth chip magnet 32122, which are arranged relatively parallel to each other along the X-axis direction; the third chip magnet group 3213 includes a fifth chip magnet 32131 and a sixth chip magnet 32132, which are arranged relatively parallel to each other along the X-axis direction; the third chip magnet 32121 and the fifth chip magnet 32131 are arranged along the X-axis direction; the fourth chip magnet 32122 and the sixth chip magnet 32132 are arranged along the X-axis direction. More specifically, in this embodiment of the application, the first chip magnet group 3211 is disposed on two opposite sides of the photosensitive component 40 along the Y-axis direction, and the second chip magnet group 3212 and the third chip magnet group 3213 are disposed at the four corners of the photosensitive component 40 along the X-axis direction.

[0092] The first chip magnet 32111 and the second chip magnet 32112 work together to drive the chip anti-shake movable part 33 to move along the X-axis direction, and the third chip magnet 32121, the fourth chip magnet 32122, the fifth chip magnet 32131 and the sixth chip magnet 32132 work together to drive the chip anti-shake movable part 33 to move along the Y-axis direction and / or rotate around the Z-axis direction.

[0093] Preferably, the first chip magnet 32111 and the second chip magnet 32112 are the same size, the third chip magnet 32121, the fourth chip magnet 32122, the fifth chip magnet 32131 and the sixth chip magnet 32132 are the same size, and the size of the first chip magnet 32111 and the second chip magnet 32112 is larger than the size of the third chip magnet 32121, the fourth chip magnet 32122, the fifth chip magnet 32131 and the sixth chip magnet 32132.

[0094] The first chip coil group 3221 and the first chip magnet group 3211 interact to drive the chip anti-shake movable part 33, thereby causing the photosensitive component 40 to translate in the X-axis direction; the second chip coil group 3222 and the second chip magnet group 3212 interact, and the third chip coil group 3223 and the third chip magnet group 3213 interact to jointly drive the chip anti-shake movable part 33, thereby causing the photosensitive component 40 to translate in the Y-axis direction and / or rotate around the Z-axis direction.

[0095] In one embodiment of this application, the chip magnet assembly 321 further includes a magnetically conductive member 3214 disposed between the first chip magnet group 3211, the second chip magnet group 3212, the third chip magnet group 3213 and the upper cover 311. The first chip magnet group 3211, the second chip magnet group 3212 and the third chip magnet group 3213 are indirectly fixed to the upper cover 311 through the magnetically conductive member 3214. The magnetically conductive member 3214 is adapted to enhance the magnetic field force of the chip magnet assembly 321 facing the coil magnet assembly, thereby enhancing the driving force of the chip driving element 32. In a specific example of this application, the magnetically conductive component 3214 includes six magnetically conductive units, which are respectively disposed between the first chip magnet 32111 and the upper cover 311, the second chip magnet 32112 and the upper cover 311, the third chip magnet 32121 and the upper cover 311, the fourth chip magnet 32122 and the upper cover 311, the fifth chip magnet 32131 and the upper cover 311, and the sixth chip magnet 32132 and the upper cover 311. Each magnetically conductive unit forms a "U" shape, enclosing the top surface of the chip magnet near the upper cover 311 and the two sides of the chip magnet with the largest area. In other embodiments of this application, the magnetically conductive unit may only enclose the top surface of the chip magnet near the upper cover 311, or it may include the top surface of the chip magnet near the upper cover 311 and the four sides of the chip magnet; this application is not limited to this.

[0096] In one embodiment of this application, the chip drive motor 30 further includes a chip position sensing component 36 and a chip holding component 34. The chip position sensing component 36 is used to acquire the position or motion information of the photosensitive component 40, and the chip holding component 34 is adapted to suspend the chip movable carrier 331 in the chip anti-shake fixing part 31. In this way, the photosensitive component 40 can be suspended in the chip anti-shake fixing part 31 by the chip holding component 34.

[0097] like Figure 6AAs shown, the chip position sensing component 36 is fixed to the chip movable carrier 331. When the chip movable carrier 331 moves, the chip position sensing component 36 is adapted to obtain the position information of the chip movable carrier 331 by acquiring the magnetic field change of the chip magnet component 321.

[0098] The position sensing element includes at least one position sensing element, and the number of position sensing elements is not limited by this application. In a specific example of this application, the chip position sensing component 36 includes a first position sensing element 361, a second position sensing element 362, and a third position sensing element 363, thereby sensing the position information of the chip movable carrier 331 in three directions: translation along the X-axis, translation along the Y-axis, and rotation around the Z-axis. In an embodiment of this application, the first position sensing element 361, the second position sensing element 362, and the third position sensing element 363 are Hall elements; in other embodiments of this application, the first position sensing element 361, the second position sensing element 362, and the third position sensing element 363 are driving chips with position sensing functions.

[0099] like Figure 6B As shown, the chip holding assembly 34 includes a chip support assembly 341 and a chip magnetic attraction assembly 342. The chip support assembly 341 is disposed between the chip movable carrier 331 and the upper cover 311. The chip magnetic attraction assembly 342 is fixed to the chip movable carrier 331 of the chip anti-shake movable part 33. Thus, the magnetic attraction between the chip magnetic attraction assembly 342 and the chip magnet assembly 321 causes the chip anti-shake movable part 33 to be attracted to the upper cover 311. The chip support assembly 341 is disposed between the upper cover 311 of the chip anti-shake fixing part 31 and the chip movable carrier 331 of the chip anti-shake movable part 33. Under the action of the magnetic attraction between the chip magnetic suction assembly 342 and the chip magnet assembly 321, the chip support assembly 341 is clamped by the upper cover 311 and the chip movable carrier 331, and a gap is maintained between the chip movable carrier 331 and the upper cover 311, thereby reducing the resistance of the chip anti-shake movable part 33 during movement.

[0100] In this embodiment, the chip support assembly 341 includes a ball groove 3412 recessed in the movable chip carrier 331 and balls 3411 disposed in the ball groove 3412. The number of balls 3411 and ball grooves 3412 is not limited by this application. In one embodiment of this application, the chip support assembly 341 includes at least three balls 3411 disposed between the chip movable carrier 331 and the upper cover 311. To limit the movement range of the balls 3411, the chip support assembly 341 also includes at least three ball grooves 3412 corresponding to the at least three balls 3411. Preferably, at least three ball grooves 3412 are formed on the chip movable carrier 331. The depth of the ball grooves 3412 is less than the diameter of the balls 3411. At least a portion of the balls 3411 can protrude from the ball grooves 3412 so that the balls 3411 can maintain frictional contact with the upper cover 311.

[0101] Furthermore, the movable chip carrier 331 further includes an extension post 3313 protruding from the upper surface of the chip carrier body 3311, and a ball groove 3412 recessed into the upper surface of the extension post 3313. In one embodiment of this application, the movable chip carrier 331 includes at least three extension posts 3313 formed on the chip carrier body 3311, the at least three extension posts 3313 protruding from the upper surface of the chip carrier body 3311, and at least three ball grooves 3412 formed on the at least three extension posts 3313. The chip support assembly 341 is disposed between the extension posts 3313 and the upper cover 311, so that a certain gap is maintained between the movable chip carrier 331 and the upper cover 311, and this gap does not change with the movement of the movable chip carrier 331.

[0102] In a specific example of this application, the movable chip carrier 331 includes four extending posts 3313 formed on the chip carrier body 3311, and the chip support assembly 341 includes four ball grooves 3412 formed by the recessed top surfaces of the extending posts 3313 and four balls 3411 disposed between the four ball grooves 3412 and the upper cover 311. The four extending posts 3313 are distributed on the longer sides of the chip carrier body 3311, thereby reducing the size of the chip carrier body 3311.

[0103] Further reference Figure 4A and Figure 4BThe chip support assembly 341 further includes a ball support piece 3413 embedded within the movable chip carrier 331 and located at the bottom of the ball groove 3412, wherein the ball 3411 is supported by the ball support piece 3413. In one embodiment of this application, the chip support assembly 341 further includes at least three ball support pieces 3413, which are fixed to the movable chip carrier 331 and serve as the bottom surface of the ball groove 3412. The ball support piece 3413 may be made of stainless steel or other metal materials, thereby providing a smoother support surface for the ball 3411 and reducing the friction of the ball 3411 rolling. In a specific example of this application, the chip support assembly 341 includes four ball support pieces 3413, each ball support piece 3413 being fixed in the extension post 3313 of the movable chip carrier 331 by insert molding and exposing its upper surface as the bottom surface of each ball groove 3412, further referring to... Figure 6E The ball bearing support 3413 includes a support body 34131 and a support connecting portion 34132, which extend integrally. The upper surface of the support body 34131 is exposed and serves as the bottom surface of the ball bearing groove 3412. The support connecting portion 34132 is used to maintain the position of the ball bearing support 3413 in the movable chip carrier 331 during the insert molding process. The support connecting portion 34132 can connect to the support connecting portions 34132 of other ball bearing supports 34133 or to other support components for supporting the support connecting portion 34132. After the ball bearing support 3413 is formed in the movable chip carrier 331 by the insert molding process, the support connecting portion 34132 is cut, and a portion of the support connecting portion 34132 can be exposed outside the movable chip carrier 331. That is, in some embodiments of this application, the ball support sheet 3413 includes a support sheet body 34131 located at the bottom of the ball groove 3412 and a support sheet connecting portion 34132 extending from the support sheet body 34131 to the outside of the chip movable carrier 331.

[0104] like Figure 6A , Figure 6B and Figure 6EAs shown, in some embodiments of this application, the chip magnetic assembly 342 includes at least one chip magnetic element 3421. The chip magnetic element 3421 is enclosed within the chip anti-shake movable portion 33, so that the chip anti-shake movable portion 33 is suspended within the receiving cavity of the chip anti-shake fixing portion 31 by the magnetic attraction between the at least one chip magnetic element 3421 and the chip magnet assembly 321. In a specific example of this application, at least one of the chip magnetic elements 3421 is embedded within the chip movable carrier 331 of the chip anti-shake movable part 33 via an insert molding process. The at least one chip magnetic element 3421 is disposed opposite to the chip magnet assembly 321 to generate a magnetic attraction force along the Z-axis between the at least one chip magnetic element 3421 and the chip magnet assembly 321. This magnetic attraction force causes the chip movable carrier 331 of the chip anti-shake movable part 33 to adhere to the upper cover 311. Furthermore, the magnetic attraction force between the at least one chip magnetic element 3421 and the chip magnet assembly 321 clamps the ball bearing 3411 between the upper cover 311 and the chip movable carrier 331, thereby clamping the chip support assembly 341 between the chip anti-shake fixing part 31 and the chip anti-shake movable part 33. The chip magnetic element 3421 is made of a material with magnetic properties, which is suitable for generating magnetic attraction with a magnet.

[0105] The chip magnetic element 3421 includes a magnetic element body 34211 and a magnetic element connecting portion 34212. The magnetic element body 34211 and the magnetic element connecting portion 34212 extend integrally. The magnetic element connecting portion 34212 is used to maintain the position of the chip magnetic element 3421 in the chip movable carrier 331 during the insert molding process. The magnetic element connecting portion 34212 can connect to the magnetic element connecting portion 34212 of other chip magnetic elements 3421 or to other support components for supporting the magnetic element connecting portion 34212. After the chip magnetic element 3421 is formed in the chip movable carrier 331 through the insert molding process, the magnetic element connecting portion 34212 is cut, and a portion of the magnetic element connecting portion 34212 can be exposed outside the chip movable carrier 331. That is, in some embodiments of this application, the chip magnetic element 3421 includes a magnetic element body 34211 enclosed in the chip movable carrier 331 and a magnetic element connecting portion 34212 extending from the magnetic element body 34211 to the outside of the chip movable carrier 331.

[0106] In one embodiment of this application, the upper surface of the chip magnetic element 3421 is exposed and not enclosed by the chip movable carrier 331, such as... Figure 6A As shown in the figure; in other embodiments of this application, the upper surface of the chip magnetic element 3421 may also be wrapped by the chip movable carrier 331, and this application is not limited thereto.

[0107] In a specific example of this application, the chip magnetic attraction assembly 342 includes eight chip magnetic attraction elements 3421. Every two chip magnetic attraction elements 3421 are disposed on both sides of the ball 3411, and the chip magnetic attraction elements 3421 on both sides of each ball 3411 have the same shape, thereby providing a uniform and stable magnetic attraction force, so that the movable chip carrier 331 is smoothly attracted to the upper cover 311.

[0108] In this application, the movable chip carrier 331 can be embedded with the ball support sheet 3413 and the magnetic chip element 3421. In order to reduce the number of components of the chip drive motor 30, the chip anti-shake conductive part 35 can also be embedded into the chip anti-shake movable part 33 by means of insert molding.

[0109] Therefore, this application embeds the chip anti-shake conductive part 35 into the chip anti-shake movable part 33 by, for example, insert molding, to provide a conductive chip anti-shake movable part 33, so that the chip coil assembly 322 can be electrically connected to the circuit board 41 through the chip anti-shake movable part 33. Furthermore, since the chip anti-shake conductive part 35 is embedded into the chip anti-shake movable part 33 by insert molding, the chip anti-shake movable part 33 is suitable for providing two flat mounting surfaces for mounting and fixing the chip coil assembly 322 and the circuit board 41, and can also reduce the number of components in the chip anti-shake motor, reduce the assembly complexity of the chip anti-shake motor, and protect the chip anti-shake conductive part 35.

[0110] Specifically, Figures 6A to 6B The embedded structure of the chip stabilization movable portion 33 and the chip stabilization conductive portion 35 is shown. The chip stabilization conductive portion 35 includes a coil conductive assembly 351 and a sensing element conductive assembly 352. The coil conductive assembly 351 includes at least one coil conductive element 3511 encapsulated within the chip stabilization movable portion 33. In one embodiment of this application, the coil conductive assembly 351 includes a plurality of (two or more) coil conductive elements 3511, such as... Figure 6CAs shown. A plurality of coil conductive elements 3511 are embedded in the movable chip carrier 331 via, for example, injection molding, in an insert molding manner. The plurality of coil conductive elements 3511 can electrically connect the chip coil assembly 322 and the circuit board 41. The sensing element conductive assembly 352 includes at least one sensing element conductive element 3521 encapsulated within the movable chip carrier 331. In one embodiment of this application, the sensing element conductive assembly 352 includes a plurality (two or more) of sensing element conductive elements 3521, which are embedded in the movable chip carrier 331 via, for example, injection molding, in an insert molding manner. The plurality of sensing element conductive elements 3521 can electrically connect the chip position sensing assembly 36 and the circuit board 41.

[0111] The number of coil conductive elements 3511 in the coil conductive assembly 351 is related to the number of circuits required by the chip coil assembly 322. In a specific example of this application, the coil conductive assembly 351 includes six coil conductive elements 3511. Each coil conductive element 3511 has an exposed first coil conductive end 35111, an exposed second coil conductive end 35113 opposite to the first coil conductive end 35111, and a coil conductive extension 35112 extending and electrically conducting between the first coil conductive end 35111 and the second coil conductive end 35113. The first coil conductive end 35111 is positioned higher than the second coil conductive end 35113, and the coil conductive extension 35112 extends downward from the first coil conductive end 35111 to the second coil conductive end 35113. When the coil conductive element 3511 is embedded in the chip movable carrier 331, the chip movable carrier 331 does not cover the upper surface of the first coil conductive end 35111, and the upper surface of the first coil conductive end 35111 is exposed for electrical connection with the chip coil assembly 322. The chip movable carrier 331 does not cover the lower surface of the second coil conductive end 35113, and the lower surface of the second coil conductive end 35113 is exposed for electrical connection with the circuit board 41, thereby electrically connecting the chip coil assembly 322 and the circuit board 41. In some embodiments of this application, at least some of the first coil conductive ends 35111 of all the coil conductive elements 3511 are exposed on the upper surface of the chip movable carrier 331, and the second coil conductive ends 35113 are exposed on the lower surface of the chip movable carrier 331. The coil circuit board 3224 of the chip coil assembly 322 is electrically connected to the first coil conductive end 35111, and the second coil conductive end 35113 is adapted to be electrically connected to the circuit board 41, thereby realizing electrical conduction between the chip coil assembly 322 and the circuit board 41.

[0112] In this embodiment, the first coil conductive end 35111 of the coil conductive element 3511 forms part of the upper conductive portion 33112 of the chip carrier body 3311 of the movable chip carrier 331, and the second coil conductive end 35113 of the coil conductive element 3511 forms part of the lower conductive portion 33113 of the chip carrier body 3311 of the movable chip carrier 331. In other words, the upper conductive portion 33112 includes the first coil conductive end 35111, and the lower conductive portion 33113 includes the second coil conductive end 35113.

[0113] Furthermore, in order to maintain the position of the coil conductive component 351 in the movable chip carrier 331 during the insert molding process, the coil conductive element 3511 further includes a coil conductive connection portion 35114. The coil conductive connection portion 35114 can connect to the coil conductive connection portions 35114 of other coil conductive elements 3511 or to other support components for supporting the coil conductive connection portion 35114. After the coil conductive component 351 is formed in the movable chip carrier 331 through the insert molding process, the coil conductive connection portion 35114 is cut, and a portion of the coil conductive connection portion 35114 is exposed outside the movable chip carrier 331. That is, in some embodiments of this application, the coil conductive element 3511 further includes a coil conductive connection portion 35114 extending from a coil conductive body formed by the first coil conductive end 35111, the second coil conductive end 35113, and the coil conductive extension portion 35112 to the outside of the movable chip carrier 331.

[0114] In one embodiment of this application, the first coil conductive end 35111, the second coil conductive end 35113, the coil conductive extension 35112, and the coil conductive connection 35114 are integrally formed from a conductive material. In another embodiment of this application, the coil conductive element 3511 does not have the coil conductive connection 35114, and therefore the first coil conductive end 35111, the second coil conductive end 35113, and the coil conductive extension 35112 are integrally formed from a conductive material.

[0115] Reference Figure 6A , Figure 6B and Figure 6DThe number of sensing element conductive elements 3521 in the sensing element conductive assembly 352 is related to the number of circuits required by the chip position sensing assembly 36. In a specific example of this application, the sensing element conductive element 3521 includes a first sensing element conductive end 35211, a second sensing element conductive end 35213 opposite to the first sensing element conductive end 35211, and a sensing element conductive extension 35212 extending and electrically conducting between the first sensing element conductive end 35211 and the second sensing element conductive end 35213. When the sensing element conductive element 3521 is embedded in the chip movable carrier 331, the chip movable carrier 331 does not cover the upper surface of the first sensing element conductive end 35211, and the upper surface of the first sensing element conductive end 35211 is used for electrical connection with the chip position sensing component 36. The chip movable carrier 331 does not cover the lower surface of the second sensing element conductive end 35213, and the lower surface of the second sensing element conductive end 35213 is exposed for electrical connection with the circuit board 41, thereby electrically connecting the sensing element conductive component 352 and the circuit board 41. In some embodiments of this application, at least some of the first sensing element conductive ends 35211 of all the sensing element conductive elements 3521 are exposed on the upper surface of the chip movable carrier 331, and the second sensing element conductive ends 35213 are exposed on the lower surface of the chip movable carrier 331. The first sensing element conductive end 35211 is electrically connected to the position sensing element, and the second sensing element conductive end 35213 is adapted to be electrically connected to the circuit board 41, thereby realizing electrical conduction between the sensing element conductive assembly 352 and the circuit board 41.

[0116] It is worth noting that in one of the sensing element conductive elements 3521, the number of the first sensing element conductive end 35211, the second sensing element conductive end 35213 and the sensing element conductive extension 35212 can be one or more, and is not a limitation.

[0117] The first conductive end 35211 of the sensing element conductive element 3521 forms part of the upper conductive portion 33112 of the chip carrier body 3311 of the movable chip carrier 331, and the second conductive end 35213 of the sensing element conductive element forms part of the lower conductive portion 33113 of the chip carrier body 3311 of the movable chip carrier 331. In other words, the upper conductive portion 33112 includes the first coil conductive end 35111 and the first sensing element conductive end 35211, and the lower conductive portion 33113 includes the second coil conductive end 35113 and the second sensing element conductive end 35213.

[0118] In some embodiments of this application, the position of the first sensing element conductive end 35211 is lower than the position of the first coil conductive end 35111. More specifically, the first sensing element conductive end 35211 is lower than the first coil conductive end 35111 in the height direction set by the chip movable carrier 331. In this way, the height of the position sensing element can be reduced, and it may not even protrude from the upper surface of the chip movable carrier 331. Specifically, a sensing element groove 33114 is formed on the chip carrier body 3311, and the chip position sensing assembly 36 is disposed in the sensing element groove 33114, thereby preventing the height of the chip position sensing assembly 36 from being too high. The first sensing element conductive end 35211 is electrically connected to the bottom surface of the chip position sensing assembly 36. Therefore, by setting the position of the first sensing element conductive end 35211 lower than the position of the first coil conductive end 35111, the position sensing element is disposed between the chip coil assembly 322 and the circuit board 41 in the height (Z-axis) direction. Preferably, the chip position sensing component 36 is housed in the sensing element recess 33114 and does not protrude from the sensing element recess 33114.

[0119] To maintain the position of the sensing element conductive assembly 352 within the movable chip carrier 331 during the insert molding process, the sensing element conductive assembly 352 further includes a sensing element conductive connection portion 35214. This connection portion 35214 can connect to the sensing element conductive connection portion 35214 of other sensing element conductive elements 3521 or to other support components for supporting the connection portion 35214. After the sensing element conductive assembly 352 is formed in the movable chip carrier 331 through the insert molding process, the sensing element conductive connection portion 35214 is cut, exposing a portion of it outside the movable chip carrier 331. That is, in some embodiments of this application, the sensing element conductive element 3521 further includes a sensing element conductive connection portion 35214 extending from a sensing element conductive body formed by the first sensing element conductive end, the second sensing element conductive end, and the sensing element conductive extension portion 35212 to the outside of the movable chip carrier 331.

[0120] In one embodiment of this application, the first conductive end 35211 of the sensing element, the conductive extension 35212 of the sensing element, the second conductive end 35213 of the sensing element, and the conductive connection portion 35214 of the sensing element are integrally formed from a conductive material. In another embodiment of this application, the conductive element 3521 of the sensing element does not have the conductive connection portion 35214, and thus the first conductive end 35211, the conductive extension 35212 of the sensing element, and the second conductive end 35213 of the sensing element are integrally formed from a conductive material.

[0121] In one embodiment of this application, the coil conductive component 351 and the sensing element conductive component 352 are made of the same conductive material and are embedded together in the movable chip carrier 331. Therefore, the coil conductive connection portions 35114 of the plurality of coil conductive elements 3511 of the coil conductive component 351 and the sensing element conductive connection portions 35214 of the plurality of sensing element conductive elements 3521 of the sensing element conductive component 352 can be located at the same height. That is, the sensing element conductive connection portions 35214 and the coil conductive connection portions 35114 are aligned in the height direction set by the movable chip carrier 331.

[0122] In one embodiment of this application, the ball bearing support 3413, the chip magnetic attraction assembly 342 (including the magnetic attraction element), and the chip anti-shake conductive part 35 (including the sensing element conductive element 3521 and the coil conductive element 3511) are all embedded in the chip movable carrier 331 by injection molding in an insert molding manner, and are integrally formed with the chip movable carrier 331, which reduces the number of parts of the chip drive motor 30, thereby simplifying the structure and assembly complexity of the chip drive motor 30.

[0123] It is worth mentioning that the chip magnetic absorbing assembly 342 needs to be made of a magnetically conductive material, while the ball bearing support 3413 and the chip anti-shake conductive part 35 (including the sensing element conductive assembly 352 and the coil conductive assembly 351) need to be made of a non-magnetically conductive material. Therefore, in the insert molding process, the chip magnetic absorbing assembly 342 is on the same strip, while the ball bearing support 3413 and the chip anti-shake conductive part 35 are on another strip. Therefore, after manufacturing, the height of the magnetic element connection portion 34212 of at least one chip magnetic element 3421 of the chip magnetic absorbing assembly 342 is inconsistent with the height of the support connection portion of the ball bearing support 3413 and the coil conductive connection portion 35114 and sensing element conductive connection portion 35214 of the chip anti-shake conductive part 35. Therefore, it can be seen that the sensing element conductive element 3521, the coil conductive element 3511, and the ball support plate 3413 of the chip anti-shake conductive part 35 are not magnetic, while the chip magnetic element 3421 of the magnetic attraction assembly is magnetic. The magnetic element connection part 34212 and the sensing element conductive connection part 35214, the coil conductive connection part 35114, and the support plate connection part 34132 are different in the height direction set by the chip movable carrier 331.

[0124] Furthermore, the installation and power-on method of the movable chip carrier 331 will be described. In one embodiment of this application, solder (e.g., solder tin) is provided on the upper conductive portion 33112 of the movable chip carrier 331 to electrically connect with the pads on the back side of the coil circuit board 3224 of the chip coil assembly 322. The coil circuit board 3224 and the movable chip carrier 331 are bonded and fixed by providing an adhesive medium between the movable chip carrier 331 and the coil circuit board 3224; the movable chip carrier 331 and the circuit board 41 are bonded and fixed by providing an adhesive medium between the movable chip carrier 331 and the circuit board 41. For example... Figure 7 As shown, at least a portion of the lower conductive portion 33113 of the movable chip carrier 331 is exposed, and then the lower conductive portion 33113 on the back side of the movable chip carrier 331 and the side of the circuit board body 411 of the circuit board 41 are electrically connected by solder.

[0125] In summary, the driving component and camera module 1 based on the embodiments of this application are explained, wherein the driving component combines multiple components together in an integral molding manner, which can reduce the structural complexity of the driving component and simplify the assembly process.

[0126] Those skilled in the art should understand that the embodiments of this application described above and shown in the accompanying drawings are merely examples and do not limit the scope of this application. The purpose of this application has been fully and effectively achieved. The functions and structural principles of this application have been demonstrated and explained in the embodiments, and any variations or modifications can be made to the implementation of this application without departing from the stated principles.

Claims

1. A driving component, characterized in that, include: Chip stabilization fixing part with a receiving cavity; A chip anti-shake movable part is suspended and disposed within the receiving cavity; A chip driving element for driving the movable chip stabilization portion to move relative to the fixed chip stabilization portion within the receiving cavity, wherein the chip driving element includes a chip coil assembly disposed above the movable chip stabilization portion, and a chip magnet assembly fixed to the fixed chip stabilization portion and corresponding to the chip coil assembly, wherein the chip coil assembly includes at least one chip coil; and The chip anti-shake conductive part is embedded in the chip anti-shake movable part by an insert molding method, including at least one coil conductive element covered in the chip anti-shake movable part. Each coil conductive element has an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end. At least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is adapted to be electrically connected to a circuit board. The chip stabilization movable part includes a chip movable carrier having opposing upper and lower surfaces, wherein the conductive end of the first coil is exposed on the upper surface of the chip movable carrier and electrically connected to at least one chip coil, and the conductive end of the second coil is exposed on the lower surface of the chip movable carrier and is adapted to be electrically connected to the circuit board of a photosensitive component located below the chip stabilization movable part. The driving assembly further includes a chip position sensing assembly, which includes at least one position sensing element. The chip anti-shake conductive part further includes at least one sensing element conductive element enclosed within the chip movable carrier. Each of the sensing element conductive elements includes a first sensing element conductive end exposed on the upper surface of the chip movable carrier. The first sensing element conductive end is electrically connected to the position sensing element. The first sensing element conductive end is lower than the first coil conductive end in the height direction set by the chip movable carrier.

2. The driving component according to claim 1, wherein, The chip coil assembly includes a coil circuit board disposed on the movable carrier of the chip, the at least one chip coil is fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the conductive end of the first coil.

3. The driving component according to claim 2, wherein, The chip anti-shake fixing part includes an upper cover and a base that snap together to form the receiving cavity, and the chip magnet assembly is fixed to the upper cover.

4. The driving component according to claim 1, wherein, The driving assembly further includes a chip holding assembly, which includes at least one chip magnetic element enclosed within the chip anti-shake movable part, so that the chip anti-shake movable part is suspended within the receiving cavity of the chip anti-shake fixed part by the magnetic attraction between the at least one chip magnetic element and the chip magnet assembly.

5. The driving component according to claim 3, wherein, The driving component further includes a chip holding component, which includes at least one chip magnetic element embedded in the chip movable carrier, so that the chip movable carrier is attracted to the upper cover by the magnetic attraction between the at least one chip magnetic element and the chip magnet component.

6. The driving component according to claim 5, wherein, The chip holding assembly further includes a chip support assembly disposed between the chip movable carrier and the upper cover. The chip support assembly includes a ball groove recessed in the chip movable carrier and a ball disposed in the ball groove. The ball is held between the upper cover and the chip movable carrier by magnetic attraction between the at least one chip magnetic element and the chip magnet assembly.

7. The driving component according to claim 6, wherein, The chip support assembly also includes a ball support piece embedded in the movable carrier of the chip and located at the bottom of the ball groove, wherein the ball is supported by the ball support piece.

8. The driving component according to claim 7, wherein, The movable chip carrier includes a chip carrier body and a chip carrier side extending downward from the periphery of the chip carrier body. The movable chip carrier also includes an extension post protruding from the upper surface of the chip carrier body, and a ball groove recessed into the upper surface of the extension post.

9. The driving component according to claim 7, wherein, Each of the sensing element conductive elements further includes a second sensing element conductive end exposed on the lower surface of the chip movable carrier and opposite to the first sensing element conductive end, and a sensing element conductive extension extending between the first sensing element conductive end and the second sensing element conductive end, wherein the second sensing element conductive end is adapted to be electrically connected to the circuit board.

10. The driving component according to claim 9, wherein, The sensing element conductive element, the coil conductive element, and the ball bearing support plate are not magnetic, while the chip magnetic element is magnetic.

11. The driving component according to claim 9, wherein, The chip magnetic attraction element includes a magnetic attraction element body enclosed within the chip movable carrier and a magnetic attraction element connecting portion extending from the magnetic attraction element body to the outside of the chip movable carrier. The sensing element conductive element further includes a sensing element conductive connecting portion extending from the sensing element conductive body formed by the first sensing element conductive end, the second sensing element conductive end, and the sensing element conductive extension to the outside of the chip movable carrier. The coil conductive element further includes a coil conductive connecting portion extending from the coil conductive body formed by the first coil conductive end, the second coil conductive end, and the coil conductive extension to the outside of the chip movable carrier. The ball bearing support includes a support body located at the bottom of the ball bearing groove and a support body connecting portion extending from the support body to the outside of the chip movable carrier. The magnetic attraction element connecting portion differs from the sensing element conductive connecting portion, the coil conductive connecting portion, and the support body connecting portion in the height direction set by the chip movable carrier.

12. The driving component according to claim 11, wherein, The conductive connection portion of the sensing element and the conductive connection portion of the coil are aligned in the height direction set by the movable carrier of the chip.

13. The driving component according to claim 11, wherein, The sensing element conductive element, the coil conductive element, the ball bearing support plate, and the chip magnetic element are integrally formed with the chip movable carrier through an injection molding process.

14. The driving component according to claim 3, wherein, The chip coil assembly includes a first chip coil group, a second chip coil group, and a third chip coil group. The first chip coil group includes at least one chip coil, the second chip coil group includes at least one chip coil, and the third chip coil group includes at least one chip coil. The second and third chip coil groups are arranged along the X-axis direction set by the driving component, and the first chip coil group is arranged along the Y-axis direction set by the driving component. The X-axis direction is perpendicular to the Y-axis direction.

15. A camera module, characterized in that, include: Optical lens; A photosensitive component, including a circuit board and a photosensitive chip electrically connected to the circuit board; as well as The driving component as described in any one of claims 1 to 14, wherein the photosensitive component is mounted on the chip movable carrier of the driving component.

Images