Method for directly electroplating PCB (Printed Circuit Board) based on carbon nanotube pore-conditioning agent

Abstract

The invention discloses a method for directly electroplating a PCB (Printed Circuit Board) on the basis of a carbon nano tube pore-conditioning agent, which belongs to the technical field of PCB production and processing, is carried out after drilling the PCB, and comprises the following steps: placing the PCB in the carbon nano tube pore-conditioning agent to carry out pore-conditioning treatment, so that the pore wall of the PCB has positive charges; in the carbon nanotube pore conditioning agent, a compound with positive electricity is connected to a carbon nanotube. According to the method, the two ends or the side walls of the carbon nanotubes are innovatively modified, and cationic micromolecules or polymers are grafted to serve as a pore-conditioning agent to adsorb GO, so that the adsorption capacity of the GO is greatly improved, the adsorption performance and the conductivity in the holes of the PCB can be effectively improved, electroplating of copper in the holes is promoted, and a new thought and method can also be provided for a direct metallization process of the holes of the PCB.

Images