High-sensitivity flexible pressure sensing array based on DIW technology printing
CN119124411APending Publication Date: 2024-12-13UNIV OF SHANGHAI FOR SCI & TECH
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Patent Information
- Application Number
- CN202411188040.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2024-12-13
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Figure CN119124411A_ABST
Abstract
The invention discloses a high-sensitivity flexible pressure sensing array printed based on a DIW technology, and the array selects PET as a packaging layer, and a patterned electrode is printed on the packaging layer through the DIW technology. The sensitive layer is a PVDF piezoelectric film; and the patterned electrode is printed by adopting a DIW technology to receive the changed electric signals. The invention allows printing of almost any material, as long as the precursor ink is designed, it is possible to exhibit appropriate rheological properties. The design freedom degree, the multifunctionality and the stability are introduced into a unique way of a printing structure at the same time. The sensor array is of a simple sandwich structure, and has the excellent characteristics of high sensitivity, wide linearity, low response time, high stability and the like without complicated structural design and manufacturing process. The sensing array can detect bending of human limbs, and can also display voltage responses of the sensor array corresponding to different pressure distributions.
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