Temperature control device of semiconductor structure, control method and vehicle-mounted communication module

Abstract

The embodiment of the invention provides a temperature control device of a semiconductor structure, a control method and a vehicle-mounted communication module. The temperature control device comprises a module substrate, a temperature control telescopic module, a heat dissipation module and a module shielding shell. The temperature control telescopic module, the heat dissipation module and the semiconductor structure are arranged in the module shielding shell; the heat dissipation module is arranged above the surface of the semiconductor structure, and the heat dissipation module is connected with the module shielding shell; the temperature control telescopic module is arranged near the semiconductor structure; and the temperature control telescopic module is connected with the heat dissipation module. By using the above structure, temperature control of the semiconductor structure is realized without additionally increasing the working current of the preheating circuit, so that the semiconductor structure is enabled to carry out temperature maintenance and low-temperature starting at low temperature, heat dissipation of the semiconductor structure at high temperature is enhanced, the environmental adaptability of the semiconductor structure under a severe temperature condition is improved, and the service life of the semiconductor structure is prolonged. And meanwhile, the electromagnetic shielding cover is fused with an original module shielding cover to jointly form a metal shielding outer envelope, so that an electromagnetic shielding effect is realized.

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