A purple full-spectrum LED light-emitting device and its preparation method

Abstract

This invention discloses a violet full-spectrum LED light-emitting device and its fabrication method. The method includes: providing an LED bracket, the LED bracket including an LED substrate and a lamp bowl structure disposed on the LED substrate; fixing a violet chip and a single-crystal blue light-emitting chip with three wavelengths within the lamp bowl structure on the LED substrate, and electrically connecting the violet chip and the blue chip respectively; mixing a cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength with an encapsulating adhesive to obtain a mixed encapsulating adhesive; filling the lamp bowl structure of the LED bracket with the mixed encapsulating adhesive to cover the violet chip and the blue chip, thereby obtaining a violet full-spectrum LED light-emitting device. This invention replaces the existing implementation scheme of modulated phosphor by providing a single-chip three-wavelength blue light-emitting device, thereby achieving a continuous spectrum and improving the lifespan of the LED light-emitting device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing technology, specifically to a violet full-spectrum LED light-emitting device and its preparation method. Background Technology

[0002] With technological advancements, LED devices are finding increasingly wider applications, leading to higher demands on their performance. The rise of human-centered lighting concepts has given rise to full-spectrum products. Full-spectrum LEDs significantly enhance spectral continuity and integrity by supplementing the missing short-wavelength violet, cyan, short-wavelength green, and long-wavelength red light portions of the spectrum. Short-wavelength violet light helps the human body synthesize vitamin D and promotes calcium absorption, while violet light with wavelengths of 400-420nm helps plants form anthocyanins and inhibits excessive leaf elongation.

[0003] In existing technologies, LEDs are typically formulated using a combination of a violet LED chip and phosphors. These phosphors usually contain blue phosphors (450-455nm), cyan phosphors (490-495nm), green phosphors (520-525nm), and red phosphors (650-660nm) to obtain a continuous full-spectrum LED light-emitting device. However, currently, blue phosphors are technically unstable and immature, and cannot withstand the high temperatures required for LED operation, resulting in a short lifespan for the LED light-emitting device.

[0004] Therefore, existing technologies still suffer from the problem of short lifespan of LED light-emitting devices due to the need for continuous full-spectrum emission through the mixing of violet chips and phosphors. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide a violet full-spectrum LED light-emitting device and its fabrication method, thereby solving the problems in existing technologies.

[0006] A first aspect of the present invention is to provide a method for fabricating a violet full-spectrum LED light-emitting device, the method comprising:

[0007] An LED bracket is provided, the LED bracket including an LED substrate and a lamp holder structure disposed on the LED substrate;

[0008] A violet light chip and a blue light chip with three wavelengths of light-emitting single crystal are respectively fixed on the LED substrate inside the lamp bowl structure, and the violet light chip and the blue light chip are electrically connected respectively.

[0009] A cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength are mixed with encapsulating adhesive to obtain a mixed encapsulating adhesive.

[0010] The mixed encapsulating adhesive is filled into the lamp bowl structure of the LED bracket to cover the violet chip and the blue chip, thereby obtaining a violet full-spectrum LED light-emitting device.

[0011] According to one aspect of the above technical solution, the step of mixing a cyan phosphor of a first preset wavelength, a green phosphor of a second preset wavelength, and a red phosphor of a third preset wavelength with an encapsulating adhesive to obtain a mixed encapsulating adhesive specifically includes:

[0012] A cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength are mixed to obtain a mixed phosphor.

[0013] The mixed phosphor is mixed with the pre-provided encapsulating adhesive to obtain a mixed encapsulating adhesive.

[0014] According to one aspect of the above technical solution, the step of second-mixing the mixed phosphor with the encapsulating adhesive to obtain the mixed encapsulating adhesive specifically includes:

[0015] The mixed phosphor is added to the encapsulating adhesive, and the encapsulating adhesive containing the mixed phosphor is placed in a centrifuge.

[0016] The encapsulating adhesive containing mixed phosphors is centrifuged for a preset time using the centrifuge equipment to obtain the mixed encapsulating adhesive.

[0017] According to one aspect of the above technical solution, the preset time is 25-30 minutes.

[0018] According to one aspect of the above technical solution, the first preset wavelength is 492nm, the second preset wavelength is 522nm, and the third wavelength is 660nm.

[0019] According to one aspect of the above technical solution, the emission wavelength of the violet chip is 405nm-415nm.

[0020] According to one aspect of the above technical solution, the ratio of the cyan phosphor, the green phosphor and the red phosphor is (2-3):(4-6):(0.8-1.2), so as to obtain a mixed phosphor based on this ratio.

[0021] According to one aspect of the above technical solution, the ratio of the mixed phosphor to the encapsulating adhesive is 1:(0.6-0.9).

[0022] A second aspect of the present invention is to provide a violet full-spectrum LED light-emitting device, the violet full-spectrum LED light-emitting device comprising:

[0023] LED bracket, wherein the LED bracket is provided with a lamp holder structure;

[0024] The ultraviolet light chip is located at the bottom of the lamp bowl structure of the LED bracket, and the emission wavelength of the ultraviolet light chip is 405nm-415nm.

[0025] A single-crystal blue light chip with three wavelengths, wherein the blue light chip emits light at wavelengths of 437nm, 447nm, and 465nm;

[0026] The mixed encapsulating adhesive is obtained by mixing encapsulating adhesive with cyan phosphor, green phosphor and red phosphor in a preset ratio and then curing it. The mixed encapsulating adhesive is filled into the lamp bowl structure to cover the violet chip and the blue chip.

[0027] According to one aspect of the above technical solution, both the violet light chip and the blue light chip are connected to the electrode structure on the LED bracket via wires.

[0028] Compared with existing technologies, the advantages of using the violet full-spectrum LED light-emitting device and its preparation method as shown in this invention are as follows:

[0029] The preparation method described in this invention involves providing an LED bracket, then fixing a violet chip and a blue single-crystal chip with three wavelengths and three peaks on the LED bracket, electrically connecting the violet chip and the blue chip respectively, and then mixing a cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength with liquid encapsulant to obtain a mixed encapsulant. Finally, the mixed encapsulant is filled into the lamp bowl structure of the LED bracket, and after curing, a violet full-spectrum LED light-emitting device is obtained. By using this preparation method, a single-crystal blue single-crystal chip with three wavelengths and three peaks is provided to replace the existing implementation scheme of modulated phosphor, which can achieve a continuous violet spectrum and improve the service life of the LED light-emitting device. Attached Figure Description

[0030] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0031] Figure 1 This is a schematic flowchart of a method for fabricating a violet full-spectrum LED light-emitting device according to an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the wavelength of a blue light chip with three wavelengths and three peaks of a single-crystal light-emitting structure according to an embodiment of the present invention;

[0033] Figure 3 This is a schematic diagram of the spectrum of a violet full-spectrum LED light-emitting device at different color temperatures in one embodiment of the present invention. Detailed Implementation

[0034] To make the objectives, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Several embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be more thorough and complete.

[0035] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] A first aspect of the present invention is to provide a method for fabricating a violet full-spectrum LED light-emitting device, the method comprising:

[0038] An LED bracket is provided, the LED bracket including an LED substrate and a lamp holder structure disposed on the LED substrate;

[0039] A violet light chip and a blue light chip with three wavelengths of light-emitting single crystal are respectively fixed on the LED substrate inside the lamp bowl structure, and the violet light chip and the blue light chip are electrically connected respectively.

[0040] A cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength are mixed with encapsulating adhesive to obtain a mixed encapsulating adhesive.

[0041] The mixed encapsulating adhesive is filled into the lamp bowl structure of the LED bracket to cover the violet chip and the blue chip, thereby obtaining a violet full-spectrum LED light-emitting device.

[0042] Further, the step of mixing a cyan phosphor of a first preset wavelength, a green phosphor of a second preset wavelength, and a red phosphor of a third preset wavelength with an encapsulating adhesive to obtain a mixed encapsulating adhesive specifically includes:

[0043] A cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength are mixed to obtain a mixed phosphor.

[0044] The mixed phosphor is mixed with the pre-provided encapsulating adhesive to obtain a mixed encapsulating adhesive.

[0045] Further, the step of mixing the mixed phosphor with the encapsulating adhesive a second time to obtain the mixed encapsulating adhesive specifically includes:

[0046] The mixed phosphor is added to the encapsulating adhesive, and the encapsulating adhesive containing the mixed phosphor is placed in a centrifuge.

[0047] The encapsulating adhesive containing mixed phosphors is centrifuged for a preset time using the centrifuge equipment to obtain the mixed encapsulating adhesive.

[0048] Furthermore, the preset time is 25-30 minutes.

[0049] Furthermore, the first preset wavelength is 492nm, the second preset wavelength is 522nm, and the third wavelength is 660nm.

[0050] Furthermore, the emission wavelength of the violet light chip is 405nm-415nm.

[0051] Furthermore, the ratio of the cyan phosphor, the green phosphor, and the red phosphor is such that a mixed phosphor is obtained based on this ratio.

[0052] Furthermore, the ratio of the mixed phosphor to the encapsulating adhesive is as follows.

[0053] A second aspect of the present invention is to provide a violet full-spectrum LED light-emitting device, the violet full-spectrum LED light-emitting device comprising:

[0054] LED bracket, wherein the LED bracket is provided with a lamp holder structure;

[0055] The ultraviolet light chip is located at the bottom of the lamp bowl structure of the LED bracket, and the emission wavelength of the ultraviolet light chip is 405nm-415nm.

[0056] A single-crystal blue light chip with three wavelengths, wherein the blue light chip emits light at wavelengths of 437nm, 447nm, and 465nm;

[0057] The mixed encapsulating adhesive is obtained by mixing encapsulating adhesive with cyan phosphor, green phosphor and red phosphor in a preset ratio and then curing it. The mixed encapsulating adhesive is filled into the lamp bowl structure to cover the violet chip and the blue chip.

[0058] Furthermore, both the violet light chip and the blue light chip are connected to the electrode structure on the LED bracket via wires.

[0059] Compared with existing technologies, the advantages of using the violet full-spectrum LED light-emitting device and its preparation method as shown in this invention are as follows:

[0060] The preparation method described in this invention involves providing an LED bracket, then fixing a violet chip and a blue single-crystal chip with three wavelengths and three peaks on the LED bracket, electrically connecting the violet chip and the blue chip respectively, and then mixing a cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength with liquid encapsulant to obtain a mixed encapsulant. Finally, the mixed encapsulant is filled into the lamp bowl structure of the LED bracket, and after curing, a violet full-spectrum LED light-emitting device is obtained. By using this preparation method, a single-crystal blue single-crystal chip with three wavelengths and three peaks is provided to replace the existing implementation scheme of modulated phosphor, which can achieve a continuous violet spectrum and improve the service life of the LED light-emitting device.

[0061] Example 1

[0062] Please see Figures 1-3 The first embodiment of the present invention provides a method for fabricating a violet full-spectrum LED light-emitting device. The fabrication method shown in this embodiment includes steps S10-S40:

[0063] Step S10: Provide an LED bracket.

[0064] In this embodiment, the LED bracket includes an LED substrate and a lamp holder structure disposed on the LED substrate. The LED substrate is used for die bonding, that is, for fixing the LED chip. Specifically, it is fixed to the LED substrate by die bonding adhesive, which is usually silver paste. The light-emitting surface of the LED chip faces into the lamp holder structure, and the lamp holder structure focuses and guides the light.

[0065] Specifically, the LED bracket is made of PPA material, which is usually formed by injection molding of PPA material.

[0066] Step S20: Fix a violet light chip and a blue light chip with three wavelengths of light-emitting single crystal on the LED substrate inside the lamp bowl structure, and electrically connect the violet light chip and the blue light chip respectively.

[0067] In this embodiment, in order to achieve full-spectrum emission, the blue light chip shown in this embodiment is a single-crystal LED chip with three wavelengths and three peaks, with emission wavelengths of 437nm, 447nm and 465nm respectively. This blue light chip contains three bands to achieve full-spectrum emission.

[0068] Among them, the violet light chip emits light at a wavelength of 405nm-415nm. By replacing the addition of blue phosphor with a broad half-peak blue light, it can significantly improve the reliability of LED light-emitting devices.

[0069] Specifically, the LED substrate of the LED bracket is fixed with die-attach adhesive, and then the violet chip and the blue chip are bonded to the electrode structure. For example, the positive and negative electrodes of the violet chip are bonded to the corresponding violet positive and negative electrodes by wire bonding, and the positive and negative electrodes of the blue chip are bonded to the corresponding blue positive and violet negative electrodes by wire bonding, or the blue chip and the violet chip are connected in series, and only the two poles of the series chip are bonded to the positive and negative electrodes by wire bonding.

[0070] It should be noted that both the violet and blue light chips are die-bonded onto the LED substrate. The violet and blue light chips are located at the bottom of the lamp cup structure, with their light-emitting surfaces facing inwards to focus and guide light through the lamp cup structure.

[0071] Step S30: Mix the cyan phosphor of the first preset wavelength, the green phosphor of the second preset wavelength, and the red phosphor of the third preset wavelength with the encapsulating adhesive to obtain a mixed encapsulating adhesive.

[0072] In this embodiment, in order to enable the violet light chip and the blue light chip with three wavelengths and three peaks of the single crystal to emit full-spectrum violet light, the violet light chip and the blue light chip are covered with a specially modulated encapsulating adhesive to further modulate the emission wavelength of the combined light emission.

[0073] Specifically, in this embodiment, cyan phosphor with a wavelength of 492nm, green phosphor with a wavelength of 522nm, and red phosphor with a wavelength of 660nm are mixed with a pre-provided encapsulating adhesive to obtain a mixed encapsulating adhesive.

[0074] Furthermore, when mixing cyan phosphor, green phosphor, and red phosphor with encapsulating adhesive, the cyan phosphor, green phosphor, and red phosphor in a preset ratio are first mixed to obtain a mixed phosphor. The ratio of cyan phosphor, green phosphor, and red phosphor is (2-3):(4-6):(0.8-1.2). Then, the mixed phosphor is added to the pre-mixed liquid encapsulating adhesive. The ratio of mixed phosphor to encapsulating adhesive is 1:(0.6-0.9). The mixed phosphor and encapsulating adhesive are then centrifuged to ensure that the mixed phosphor is evenly distributed within the encapsulating adhesive, thereby obtaining a mixed encapsulating adhesive for encapsulating violet and blue light chips.

[0075] When centrifuging the mixed phosphor and liquid encapsulant, the centrifugation time is 30 minutes.

[0076] As shown in Table 1, Table 1 is a schematic table of the mixing ratio of phosphor and encapsulating adhesive.

[0077] Table 1

[0078]

[0079] As shown in Table 1, for example, when the violet full-spectrum LED light-emitting device shown in this embodiment needs to achieve a color temperature of 2700K, the added weights of cyan phosphor, green phosphor, and red phosphor are 3.05g, 6.32g, and 1.3g, respectively; when it needs to achieve a color temperature of 4000K, the added weights of cyan phosphor, green phosphor, and red phosphor are 2.34g, 4.93g, and 1.3g, respectively; and when it needs to achieve a color temperature of 5000K, the added weights of cyan phosphor, green phosphor, and red phosphor are 2.11g, 4.32g, and 0.85g, respectively. In all the different formulations, the encapsulating adhesive is 12g, which is mixed with the mixed phosphor formed by mixing cyan phosphor, green phosphor, and red phosphor to obtain the mixed encapsulating adhesive.

[0080] It can be seen that the higher the required color temperature, the less cyan, green, and red phosphors are needed; conversely, the lower the required color temperature, the more cyan, green, and red phosphors are needed.

[0081] Step S40: Fill the lamp bowl structure of the LED bracket with the mixed encapsulant to cover the violet chip and the blue chip, thereby obtaining a violet full-spectrum LED light-emitting device.

[0082] In this embodiment, after centrifuging the mixed phosphor and liquid encapsulant to obtain the mixed encapsulant, the mixed encapsulant needs to be filled into the lamp holder structure of the LED bracket as soon as possible, so that the liquid mixed encapsulant covers the violet chip and the blue chip in the lamp holder structure. Then the liquid mixed encapsulant cures in the lamp holder structure, thereby completing the encapsulation and obtaining a violet full-spectrum LED light-emitting device.

[0083] In order to ensure parameter stability, the liquid mixed encapsulant needs to be cured within 60 minutes after it is obtained.

[0084] For example, after the mixed encapsulating adhesive is filled into the lamp holder structure, it can be cured at high temperature by baking, thereby shortening the curing time of the mixed encapsulating adhesive and ensuring the stability of the parameters.

[0085] In summary, this embodiment premixes three different colored phosphors in different proportions and mixes them with liquid encapsulating adhesive to obtain a mixed encapsulating adhesive. This adhesive is then used to encapsulate a pre-fixed violet chip and a blue chip with three wavelengths and three peaks of a single-crystal light-emitting diode. This allows the encapsulated violet full-spectrum LED light-emitting device to achieve a color temperature of 2700K-5700K.

[0086] Using the preparation method shown in this embodiment, a violet full-spectrum LED light-emitting device is prepared, which includes:

[0087] LED bracket, wherein the LED bracket is provided with a lamp holder structure;

[0088] The ultraviolet light chip is located at the bottom of the lamp bowl structure of the LED bracket, and the emission wavelength of the ultraviolet light chip is 405nm-415nm.

[0089] A single-crystal blue light chip with three wavelengths, wherein the blue light chip emits light at wavelengths of 437nm, 447nm, and 465nm;

[0090] The mixed encapsulating adhesive is obtained by mixing encapsulating adhesive with cyan phosphor, green phosphor and red phosphor in a preset ratio and then curing it. The mixed encapsulating adhesive is filled into the lamp bowl structure to cover the violet chip and the blue chip.

[0091] Both the violet light chip and the blue light chip are connected to the electrode structure on the LED bracket via wires.

[0092] In other words, the light-emitting device shown in this embodiment has an LED support including an LED substrate and a lamp holder structure. On the LED substrate of the lamp holder structure, there are violet light chips with an emission wavelength of 405nm-415nm and blue light chips with emission wavelengths of 437nm, 447nm and 465nm respectively. The violet light chips and blue light chips are both connected to the electrode structure by wire bonding to conduct electricity through the electrode structure. Then, the lamp holder structure is filled with a pre-mixed mixed encapsulant. Through the combined use of the violet light chip, the blue light chip and the mixed encapsulant, a violet full-spectrum LED light-emitting device with a color temperature of 2700K-5700K is obtained.

[0093] In this embodiment, two aging methods were used to conduct aging tests on the prepared violet full-spectrum LED light-emitting device, and the aging test results of the product of the prior art solution were compared. The results are shown in Table 1:

[0094] Table 1

[0095]

[0096] Compared with existing technologies, the advantages of using the violet full-spectrum LED light-emitting device and its fabrication method shown in this embodiment are as follows:

[0097] The preparation method shown in this embodiment involves providing an LED bracket, on which a violet chip and a single-crystal three-wavelength, three-peak blue light chip are fixed. The violet chip and the blue light chip are electrically connected. Then, a cyan phosphor of a first preset wavelength, a green phosphor of a second preset wavelength, and a red phosphor of a third preset wavelength are mixed with liquid encapsulant to obtain a mixed encapsulant. Finally, the mixed encapsulant is filled into the lamp bowl structure of the LED bracket, and after curing, a violet full-spectrum LED light-emitting device is obtained. By providing a single-crystal three-wavelength, three-peak blue light chip to replace the existing modulation phosphor implementation scheme, this method can achieve a continuous violet spectrum and improve the lifespan of the LED light-emitting device.

[0098] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0099] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A method for fabricating a violet full-spectrum LED light-emitting device, characterized in that, The method includes: An LED bracket is provided, the LED bracket including an LED substrate and a lamp holder structure disposed on the LED substrate; A violet light chip and a blue light chip with three wavelengths of light-emitting single crystal are respectively fixed on the LED substrate inside the lamp bowl structure, and the violet light chip and the blue light chip are electrically connected respectively. A cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength are mixed with encapsulating adhesive to obtain a mixed encapsulating adhesive. The mixed encapsulating adhesive is filled into the lamp bowl structure of the LED bracket to cover the violet chip and the blue chip, thereby obtaining a violet full-spectrum LED light-emitting device.

2. The method for preparing a violet full-spectrum LED light-emitting device according to claim 1, characterized in that, The step of mixing a cyan phosphor of a first preset wavelength, a green phosphor of a second preset wavelength, and a red phosphor of a third preset wavelength with an encapsulating adhesive to obtain a mixed encapsulating adhesive specifically includes: A cyan phosphor with a first preset wavelength, a green phosphor with a second preset wavelength, and a red phosphor with a third preset wavelength are mixed to obtain a mixed phosphor. The mixed phosphor is mixed with the pre-provided encapsulating adhesive to obtain a mixed encapsulating adhesive.

3. The method for preparing a violet full-spectrum LED light-emitting device according to claim 2, characterized in that, The step of second mixing the mixed phosphor with the encapsulating adhesive to obtain the mixed encapsulating adhesive specifically includes: The mixed phosphor is added to the encapsulating adhesive, and the encapsulating adhesive containing the mixed phosphor is placed in a centrifuge. The encapsulating adhesive containing mixed phosphors is centrifuged for a preset time using the centrifuge equipment to obtain the mixed encapsulating adhesive.

4. The method for preparing a violet full-spectrum LED light-emitting device according to claim 3, characterized in that, The preset time is 25-30 minutes.

5. The method for preparing a violet full-spectrum LED light-emitting device according to any one of claims 1-4, characterized in that, The first preset wavelength is 492nm, the second preset wavelength is 522nm, and the third preset wavelength is 660nm.

6. The method for preparing a violet full-spectrum LED light-emitting device according to claim 5, characterized in that, The light emission band of the violet chip is 405nm-415nm.

7. The method for preparing a violet full-spectrum LED light-emitting device according to claim 5, characterized in that, The ratio of the cyan phosphor, the green phosphor and the red phosphor is (2-3):(4-6):(0.8-1.2), so as to obtain a mixed phosphor based on this ratio.

8. The method for preparing a violet full-spectrum LED light-emitting device according to claim 7, characterized in that, The ratio of the mixed phosphor to the encapsulating adhesive is 1:(0.6-0.9).

9. A violet full-spectrum LED light-emitting device, characterized in that, The violet full-spectrum LED light-emitting device includes: LED bracket, wherein the LED bracket is provided with a lamp holder structure; The ultraviolet light chip is located at the bottom of the lamp bowl structure of the LED bracket, and the emission wavelength of the ultraviolet light chip is 405nm-415nm. A single-crystal blue light chip with three wavelengths, wherein the blue light chip emits light at wavelengths of 437nm, 447nm, and 465nm; The mixed encapsulating adhesive is obtained by mixing encapsulating adhesive with cyan phosphor, green phosphor and red phosphor in a preset ratio and then curing it. The mixed encapsulating adhesive is filled into the lamp bowl structure to cover the violet chip and the blue chip.

10. The violet full-spectrum LED light-emitting device according to claim 9, characterized in that, Both the violet light chip and the blue light chip are connected to the electrode structure on the LED bracket via wires.

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