A method for manufacturing a small pad small pitch blind via printed circuit board
CN119136444BActive Publication Date: 2026-08-28JIANG XI XU SHENG DIAN ZI GU FEN YOU XIAN GONG SI
Patent Information
- Application Number
- CN202411247279.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2044-09-06
AI Technical Summary
Technical Problem
[0004]本发明的目的在于提供一种带盲埋孔设计的mini LED及COB系列板生产技术，以解决小PAD小间距HDI线路板PAD尺寸、间距不合格及良率低等问题
Benefits of technology
[0021]一、本发明提供的小PAD小间距盲埋孔线路板的制作方法，在线路板中设计埋孔，不仅可以提高电源传输的效率和稳定性，特别是类似高密度灯珠的显示屏板，还可以降低电路板的热阻；采用激光钻机钻出线路板的所有盲孔，盲孔密度为170-200万孔/㎡,孔径为75-100μm，电镀盲孔填平后可实现微孔、密布互联，灯珠PAD更密集，显示效果更清晰；填孔电镀工艺采用分段设置电流电镀工艺，提高电镀均匀性，使填孔效率≥95％，填孔凹陷≤8um，面铜极差≤10μm，可实现盲孔电镀的通联效果并获得稳定的品质；填孔电镀后增加减铜流程，控制板面铜厚极差≤10μm，从而实现蚀刻的PAD尺寸公差和小间距公差满足用户需求。因此本发明的线路板制作方法，通过对一系列的参数进行控制，使生产的线路板灯珠PAD尺寸小且间距密集，并对电镀镀铜厚度及铜厚均匀性进行控制，使小PAD小间距盲埋孔线路板精度符合要求，提高了产品品质。
✦ Generated by Eureka AI based on patent content.
Abstract
The application discloses a kind of small PAD small pitch blind buried hole circuit board manufacturing method, comprising the following steps: resin plug filling is carried out to buried hole layer after electroplating, then inner layer circuit is made;After pressing, copper reduction treatment is carried out, and the copper thickness difference of board surface is controlled to be ≤10 μm;All blind holes of circuit board are drilled by laser drilling machine, and the blind hole density is 170-200 million holes / ㎡, and the aperture is 75-100 μm;Vertical continuous electroplating process is used, wherein segmented current electroplating process is used for blind hole filling electroplating, filling efficiency is ≥95% after completing blind hole filling, filling recess is ≤8um, and the copper thickness difference of surface is ≤10 μm;Copper reduction treatment is carried out before outer layer circuit is made, and the copper thickness difference of board surface is controlled to be ≤10 μm.The small PAD small pitch blind buried hole circuit board manufacturing method provided by the application can improve the manufacturing precision of small PAD small pitch blind buried hole circuit board, and improve product yield.
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Citation Information
Patent Citations
Manufacturing method of HDI blind buried through hole circuit board
CN117939804A
Manufacturing method of second-order HDI circuit board
CN118382212A