Semiconductor memory device
By setting the first nitride layer and the second nitride layer in the semiconductor memory device, the diffusion of hydrogen ions is prevented, and the problem of diffusion of hydrogen ions between peripheral circuit elements and the memory cell array is solved, and the performance and reliability of the memory device are improved. .
Patent Information
- Application Number
- CN202411217634.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2019-09-12
- Filing Date
- 2020-08-03
- Publication Date
- 2024-12-13
AI Technical Summary
In the existing semiconductor memory devices, the nitride layer structure between the peripheral circuit elements and the memory cell array is difficult to effectively suppress the diffusion of hydrogen ions, resulting in unstable transistor threshold voltage and affecting the performance of the memory device.
The first nitride layer is arranged between the control circuit and the memory cell array, and the second nitride layer is arranged between the control circuit and the first nitride layer, and the hydrogen content and density of the nitride layer are controlled by different formation methods, so as to Prevent the diffusion of hydrogen ions.
It effectively suppresses the arrival of hydrogen ions into transistors in the memory cell array, stabilizes the threshold voltage of the transistor, and improves the performance and reliability of the memory device.
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Abstract
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