Sensor chip packaging structure, method, PCB substrate and microfluidic detection device

Abstract

This invention provides a sensor chip packaging structure, method, and PCB substrate. The sensor chip packaging structure includes: a packaging substrate; a sensor chip including a first surface and a second surface opposite to each other; the first surface covers a sensing portion, and the second surface is attached to the packaging substrate, with the sensor chip electrically connected to the packaging substrate; the sensor chip packaging structure further includes: a molding compound, which covers the sensor chip and has an opening on the surface opposite to the sensing portion to encapsulate the sensor chip and expose at least a portion of the sensing portion. It utilizes the fluid properties of the molding compound before molding, selectively exposing part or all of the sensing portion after curing, allowing the sensing portion to contact the object being detected, simplifying the complexity of the packaging structure, facilitating the acquisition of detected data, and obtaining better signal response, thereby maximizing the usable area of ​​the chip while achieving a lightweight packaging structure.

Description

Technical Field

[0001] This invention relates to semiconductor chip packaging technology, and in particular to a sensor chip packaging structure, method, PCB substrate, and microfluidic detection device. Background Technology

[0002] Packaging is the process of assembling integrated circuits into a final chip product. Simply put, it involves placing the bare integrated circuit dies produced by the wafer fab on a substrate that serves as a support, and then fixing and packaging them into a whole.

[0003] Current chip packaging typically uses molding compound, which is injected into a mold to completely encapsulate the chip, thus protecting it. Alternatively, a cap can be used to cover the chip, achieving the same protection.

[0004] However, there are still many technical problems to be solved in the sensor chip industry. For example, sensor chips have a sensing part that needs to read the external environment. As a result, sensor chips are easily limited by the packaging structure and its formation process. The existing packaging method of partial dispensing of adhesive can expose the chip surface, but the production efficiency of this method is not high. Furthermore, the existing technology usually uses the corresponding pins to be brought out on the side of the sensor chip, which is more complex and requires higher precision, making packaging difficult. Summary of the Invention

[0005] This invention provides a sensor chip packaging structure, method, PCB substrate, and microfluidic detection device to solve the technical problems mentioned in the background art.

[0006] The first aspect of the present invention provides a sensor chip packaging structure, comprising: a packaging substrate; a sensor chip including a first surface and a second surface opposite to each other; a sensing portion covered on the first surface, and the second surface attached to the packaging substrate, wherein the sensor chip is electrically connected to the packaging substrate; the sensor chip packaging structure further comprises: a molding compound, the molding compound covering the sensor chip and having an opening on the surface opposite to the sensing portion, so as to encapsulate the sensor chip and expose at least a portion of the sensing portion.

[0007] In a further embodiment of this application, the upper surface of the molding compound is higher than the upper surface of the sensing element; or the upper surface of the molding compound is flush with the upper surface of the sensing element.

[0008] In a further embodiment of this application, the sensor chip packaging structure includes a first connection layer disposed on a second surface for connecting the packaging substrate and the sensor chip; wherein, the first connection layer is any one of solder balls, epoxy resin adhesive, or silver paste.

[0009] In a further embodiment of this application, the sensor chip packaging structure further includes a second connection layer. The second connection layer is disposed on the side of the packaging substrate away from the sensor chip and is used to fix the packaging substrate and the external PCB substrate. The second connection layer is either a solder ball or a pad, and the solder balls or pads are arranged at intervals on the side of the packaging substrate away from the sensor chip.

[0010] In an optional embodiment of this application, a high metal-coated region is provided on the portion of the packaging substrate that contacts the sensor chip. The metal content of the high metal-coated region is higher than that of other regions of the packaging substrate, which is used to dissipate heat from the sensor chip.

[0011] In an optional embodiment of this application, the sensor chip packaging structure also includes electronic components mounted on the packaging substrate.

[0012] In a further embodiment of this application, the sensing chip includes an ASIC chip or a substrate, wherein the ASIC chip or substrate is disposed between the packaging substrate and the sensing part.

[0013] In a further embodiment of this application, the sensor chip packaging structure also includes a bonding wire, one end of which is connected to the sensor chip and the other end is connected to the packaging substrate, for realizing the electrical connection between the packaging substrate and the sensor chip.

[0014] In an optional embodiment of this application, the sensor chip includes multiple through-silicon vias to transmit electrical signals from the sensing portion on the first surface of the sensor chip to the packaging substrate on the second surface, thereby achieving an electrical connection between the packaging substrate and the sensor chip.

[0015] A second aspect of the present invention also provides a method for packaging a sensor chip, comprising: providing a packaging substrate; providing a sensor chip including a first surface and a second surface opposite to each other, wherein the first surface covers a sensing portion; attaching the second surface of the sensor chip to the packaging substrate and establishing an electrical connection between the sensor chip and the packaging substrate; forming a molding compound on the packaging substrate, the molding compound surrounding the sensor chip and providing an opening on the surface of the sensing portion to expose at least a portion of the sensing portion.

[0016] In a further embodiment of this application, the process of encapsulating the sensor chip while simultaneously providing an opening on the surface of the sensing portion includes: extruding the encapsulating medium into the mold cavity and completely embedding the sensor chip therein, and then making a corresponding cut in the sensing portion to provide the opening.

[0017] In an optional embodiment of this application, a filler is provided for the sensing part in the mold cavity, so that the sensing part has an opening after molding.

[0018] In an optional embodiment of this application, a high metal coating area is provided at the contact point between the packaging substrate and the sensing chip.

[0019] In an optional embodiment of this application, establishing an electrical connection between the sensor chip and the packaging substrate includes: setting a bonding wire between the sensor chip and the packaging substrate to achieve an electrical connection between the packaging substrate and the sensor chip.

[0020] In an optional embodiment of this application, multiple through-silicon vias are provided inside the sensor chip to transmit electrical signals from the sensing part on the first surface of the sensor chip to the packaging substrate on the second surface, thereby achieving an electrical connection between the packaging substrate and the sensor chip.

[0021] In another aspect of this application, a PCB substrate is also provided, the PCB substrate comprising:

[0022] The PCB substrate also includes the sensor chip package structure as described above, which is soldered onto the PCB substrate and electrically connected to the PCB substrate.

[0023] Finally, this application provides a microfluidic detection device, comprising: a fluid component; and a sensor chip packaging structure as described above, wherein the fluid component and the sensor chip packaging structure are assembled to form a reaction chamber.

[0024] In summary, this invention provides a sensor chip packaging structure that utilizes the fluid properties of the molding compound before molding. After curing, it selectively exposes part or all of the sensing element, allowing it to contact the object being detected. This simplifies the packaging structure, facilitates data acquisition, and improves signal response, maximizing the usable chip area while achieving a lightweight packaging structure. Furthermore, by directly exposing the sensing element with the molding compound, no dispensing or other complex processes are required. This results in smaller overall dimensional tolerances for the packaging structure, and the fluid encapsulation allows for high-precision assembly with supporting components, solving the sealing problem. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This embodiment of the invention exemplifies a sensor chip packaging structure;

[0027] Figure 2 This is a top view of the sensor chip packaging structure corresponding to the embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the sensor chip packaging structure provided in Embodiment 2 of the present invention;

[0029] Figure 4 This is a schematic diagram of the sensor chip packaging structure provided in Embodiment 3 of the present invention;

[0030] Figure 5 This is a schematic diagram of the sensor chip packaging structure provided in Embodiment 4 of the present invention;

[0031] Figure 6 This is a schematic diagram of the sensor chip packaging structure provided in Embodiment Six of the present invention;

[0032] Figure 7 This is a flowchart of the packaging method for the sensor chip provided in the embodiments of the present invention; and

[0033] Figure 8 This is a schematic diagram of the PCB board structure provided in an embodiment of the present invention.

[0034] Figure Labels

[0035] 100(a~d), Sensor chip packaging structure; 101, Packaging substrate;

[0036] 102. Sensor chip; 103. Molded enclosure;

[0037] 104. First Connector Layer; 105. Second Connector Layer;

[0038] 106. Electronic components; 107. Bonding wires;

[0039] 101a, First connecting part; 101b, Second connecting part;

[0040] 102a. Sensing unit; 102b. Chip body;

[0041] 200. PCB board; 201. PCB substrate. Detailed Implementation

[0042] To make the above and other features and advantages of the present invention clearer, the invention will be further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explanation to those skilled in the art and are exemplary only, not restrictive.

[0043] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0047] This invention addresses the problems existing in the prior art by proposing a general inventive concept to solve the technical problems that the current packaging structure cannot be well applied to sensor chips, such as the exposure of specific sensing parts or the high difficulty and low efficiency of manufacturing processes.

[0048] [Overall Invention Concept]

[0049] Please refer to the following first. Figure 1 , Figure 1 This embodiment of the invention exemplifies a sensor chip packaging structure 100. Figure 2 This is a top view of the sensor chip packaging structure 100 corresponding to the embodiment of the present invention; the sensor chip packaging structure 100 includes a packaging substrate 101 and a sensor chip 102.

[0050] In this embodiment of the invention, the packaging substrate 101 is used to package the bare IC chip (referring to the sensor chip 102 in this embodiment of the invention). While carrying the sensor chip 102, it can also have circuit structures and electronic components arranged inside to achieve specific functions. As an intermediate product between the sensor chip and the PCB substrate, it plays a role in protecting, fixing and supporting the sensor chip 102, and providing heat dissipation channels.

[0051] The sensor chip 102 includes a sensing part 102a and a chip body 102b. The sensor chip 102 is not limited to light sensing, temperature sensing, pressure sensing, infrared sensing, etc., and its shape can be a rectangular block or other shapes. It includes a first surface and a second surface facing each other. In terms of connection, the sensing part 102a is on the first surface of the sensor chip 102, and its second surface is attached to one side of the packaging substrate 101, thereby forming a stacked design of the sensing part 102a, the chip body 102b, and the packaging substrate 101.

[0052] Furthermore, the sensor chip 102 and the packaging substrate 101 are electrically connected, and the sensing signal is transmitted to the packaging substrate 101.

[0053] In this embodiment of the invention, the packaging substrate 101 and the sensor chip 102 are not limited in terms of connection method, material, shape, etc., and can be adapted to the type of sensor chip 102 and the functions to be implemented.

[0054] In a general inventive concept of an embodiment of the present invention, the sensor chip packaging structure 100 further includes:

[0055] The molding compound 103 is designed to cover the chip body and has an opening 103a on the surface opposite the sensing part 102a, so as to completely cover the periphery of the chip body 102b while exposing at least a portion of the sensing part 102a.

[0056] It is understood that the molding compound 103, when not fully formed, is a fluid medium. A fluid medium, such as epoxy film molding compound, is extruded into the mold cavity using a transfer molding method. The mold cavity is embedded in the packaging substrate 101, and the sensor chip 102 is embedded within it and then cured to form a package structure with a specific shape. Its function is to protect the sensor chip 102 from the influence of the external environment; resist external moisture, solvents, and impacts; ensure electrical insulation between the chip and the external environment; and ensure that the overall package has good sealing performance, resistance to thermal shock and mechanical vibration, and thermal diffusion.

[0057] In this embodiment of the invention, the material of the packaging substrate 101 may be silicon dioxide, epoxy, or other similar materials. It differs from the PCB substrate in terms of process precision and has higher assembly precision requirements than the PCB substrate.

[0058] On the other hand, the molding compound 103 may be epoxy resin or a mixture of epoxy resins.

[0059] By selectively exposing part or all of the sensing part 102a directly through the molding compound 103, the sensing part 102a can come into contact with the object being detected. This simplifies the complexity of the packaging structure and facilitates the acquisition of the detected data, thereby maximizing the usable area of ​​the chip while achieving a lightweight packaging structure.

[0060] On the other hand, since the sensing part 102a is directly exposed by the molding compound 103, there is no need to use dispensing or other complex processes. Its overall packaging structure has small dimensional tolerances, which can be assembled with the matching fluid components with high precision, thus solving the sealing problem.

[0061] The following is a detailed description of the sensor chip packaging structure 100:

[0062] In this embodiment of the invention, the chip body 102b is an ASIC chip or a substrate. When the chip body 102b is only an ASIC chip, the ASIC chip is integrated into the chip body 102b, which can further process the sensing signal measured by the sensing unit 102a and undertake some signal processing functions of external devices. At this time, the corresponding electronic components on the PCB board can be reduced, which greatly reduces the size of the entire device. At the same time, integrating the ASIC chip can also reduce the power consumption of the entire device and achieve energy saving.

[0063] In an alternative embodiment of the present invention, the chip body 102b may also be simply a substrate, which serves to support the sensor chip 102 and dissipate heat, thereby increasing the strength of the sensor chip. The specific configuration can be adapted according to the type, specifications, and application scenario of the sensor chip.

[0064] In a further embodiment of the present invention, the sensor chip packaging structure 100 further includes a first connection layer 104, which is disposed on the second surface, that is, disposed between the chip body 102b and the packaging substrate 101 and connects the packaging substrate 101 and the chip body 102b; wherein, the first connection layer 104 is any one of solder ball, epoxy resin adhesive, or silver paste.

[0065] It is understandable that the specific configuration can be adapted according to the characteristics of the materials. Solder balls, as welding materials, can achieve stable fixed connections and conductivity. When solder balls are used in the first connection layer 104, since the connection is a point connection, its contact area is small. The gaps between the solder balls can be filled by the molding compound 103 to provide support and sealing. Furthermore, the solder balls need to penetrate the entire chip body 102b to ensure smooth signal transmission. When epoxy resin or silver paste is used in the first connection layer 104, the epoxy resin is composed of epoxy resin or silicone resin filled with randomly distributed metal or conductive carbon particles. When fully cured, it can provide a high-quality conductive path. Alternatively, silver paste has both electrical and thermal conductivity. Since both epoxy resin and silver paste are adhesive-based connections, bonding wires are required to achieve electrical connections between the packaging substrate and the sensor chip. See the specific embodiments below for details.

[0066] On the other hand, the sensor chip packaging structure 100 also includes a second connection layer 105, which is disposed on the side of the packaging substrate 101 away from the chip body 102b, and is used to fix the packaging substrate 101 and the external PCB substrate.

[0067] Furthermore, the second connection layer 105 can optionally be either solder balls or pads. The solder balls or pads are arranged at intervals on the side of the packaging substrate 101 away from the sensing chip. While structurally connecting, they can also be used to realize the electrical signal transmission between the packaging substrate 101 and the PCB substrate.

[0068] It is understood that the first connection layer 104 and the second connection layer 105 mentioned above are located on both sides of the packaging substrate 101, thereby realizing the connection between the packaging substrate 101 and the sensor chip 102 and the PCB substrate respectively.

[0069] In an optional embodiment of the present invention, the sensor chip packaging structure 100 further includes electronic components 106. These electronic components 106 are resistors, capacitors, or other electronic components mounted on the packaging substrate 101, serving to process electrical signals, such as amplifying / reducing signals. The electronic components 106 are mounted on the side of the packaging substrate 101 facing away from the PCB substrate and are protected by being embedded inside the molding compound 103.

[0070] It is understandable that the sensor chip packaging structure 100 can selectively package the electronic components 106 or not package the electronic components 106, that is, place them on an external PCB substrate or on the circuit board of an external device, as long as the same effect is achieved.

[0071] In order to achieve electrical connection between the packaging substrate 101 and the chip body 102b, in an optional embodiment of the present invention, the sensor chip packaging structure further includes a bonding wire 107. The bonding wire 107 is embedded in the molding compound 103. One end of the bonding wire 107 is connected to the chip body 102b and the other end is connected to the packaging substrate 101, so as to achieve electrical connection between the packaging substrate 101 and the chip body 102b.

[0072] In another optional embodiment of the present invention, the chip body is provided with a plurality of through-silicon vias (TSVs). Figure 1 (Not shown), through-silicon vias (TSVs) are used to transmit electrical signals from the chip body to the packaging substrate to achieve an electrical connection between the packaging substrate and the chip body.

[0073] In summary, this invention provides a sensor chip packaging structure 100 that utilizes the fluid properties of the molding compound 103 before molding. The molding compound 103 selectively exposes part or all of the sensing element 102a, allowing it to contact the object being detected. This simplifies the complexity of the packaging structure, facilitates the acquisition of detected data, maximizes the usable chip area, and achieves a lightweight packaging structure. Furthermore, because the molding compound 103 directly exposes the sensing element 102a, there is no need for dispensing or other complex processes. The overall packaging structure has small dimensional tolerances, and the fluid encapsulation and associated components can achieve high-precision assembly, solving the sealing problem.

[0074] The following specific examples illustrate this:

[0075]

Example 1

[0076] Please continue reading. Figure 1 and Figure 2 In Embodiment 1 of the present invention, the sensor chip packaging structure 100 has the following features:

[0077] The sensor chip packaging structure 100 is generally a rectangular block structure, but it can also be configured to be irregular in shape according to requirements.

[0078] Along the direction away from the PCB substrate, the sensor chip packaging structure 100 includes a packaging substrate 101 and a sensor chip 102. The packaging substrate 101 and the sensor chip 102 form a stacked packaging structure and are connected in the vertical direction. It can be understood that the stack can adopt a pyramid-shaped stacked packaging, that is, the area of ​​the lower packaging substrate 101 is larger than that of the upper layer and forms a pyramid shape, or a cross-shaped stacking method can be adopted.

[0079] In this embodiment of the invention, the sensor chip 102 is composed of an exposed upper sensing part 102a and a chip body 102b. The molding compound 103 is designed with an opening 103a after molding, which is flush with the upper surface of the sensing part 102a, so that the entire sensor chip packaging structure 100 is flat, which facilitates installation and transportation.

[0080] In this embodiment, the chip body 102b is an ASIC chip, which reduces the size of the entire device and saves overall energy consumption.

[0081] Furthermore, the first connection layer 104 is selected to be bonded to the packaging substrate 101 using silver paste to provide good heat dissipation performance.

[0082] Since the first connecting layer 104 is silver paste, the chip body and the shell are interconnected by bonding. That is, one end of the bonding wire is connected to the sensor chip 102 and the other end is connected to the packaging substrate 101. The electrical signal is output from the sensor chip 102 to the packaging substrate 101 through the bonding wire 107 (which can be gold wire or copper wire).

[0083] The second connection layer 105 uses solder balls, which are distributed below the packaging substrate 101 to be soldered and fixed to the external PCB, while the packaging substrate 101 and the PCB substrate are electrically connected.

[0084] Multiple electronic components 106 can be selectively mounted on the packaging substrate 101. The electronic components 106 can be resistors, capacitors, etc., and are used to process electrical signals.

[0085] That is, the non-sensing areas of the electronic components 106, bonding wires 107, and sensor chip 102 are wrapped and protected by the encapsulation body 103, while the upper surface of the sensing part 102a is exposed, so that the sensing part 102a can make full contact with the external object being detected.

[0086] It is understood that the sensor chip packaging structure 100 provided in this embodiment of the invention simplifies the structure compared with the prior art. It only utilizes the fluid characteristics of the molding compound 103 before it is formed, and selectively exposes part or all of the sensing part after it is cured. On the one hand, it can realize that the sensing part 102a can directly contact the object being detected in the outside world. On the other hand, it uses the molding compound 103 to directly integrate the shell of the prior art without the need for dispensing or other complex processes. Moreover, the fluid encapsulation and supporting components can achieve high-precision assembly and solve the sealing problem.

[0087]

Example 2

[0088] Please see Figure 3 , Figure 3 This is a schematic diagram of the sensor chip packaging structure 100a provided in Embodiment 2 of the present invention. As shown in the figure, the sensor chip packaging structure 100a is similar to other structural parts of Embodiment 1, except that the second connection layer 105 in Embodiment 2 is a solder pad, and the chip is soldered onto the external PCB substrate by screen printing process to achieve a tight connection between the PCB substrate and the packaging substrate 101.

[0089] It is understandable that the solder pad is the basic building block of surface mount assembly. Compared with the solder ball, it has a larger connection area, a more stable connection, and can reduce the vertical thickness, thus achieving overall compactness.

[0090]

Example 3

[0091] Please see Figure 4 , Figure 4 This is a schematic diagram of the sensor chip packaging structure 100b provided in Embodiment 3 of the present invention. As shown in the figure, the sensor chip packaging structure 100b is similar to any of Embodiments 1 to 2, except that the packaging substrate 101 is designed to have a first connecting portion 101a and a second connecting portion 101b. The first connecting portion 101a is connected to the chip body 102b, and the second connecting portion 101b is located on both sides of the first connecting portion 101a and is used to connect to an external PCB substrate.

[0092] In this third embodiment, the first connecting part 101a is additionally covered with metal, which can be made of materials such as copper or aluminum, so that the metal content in this area is higher than the metal content in the second connecting part 101b.

[0093] It can be understood that the first connection part 101a corresponds to the contact area between the packaging substrate 101 and the chip body 102b. In an optional solution, the packaging substrate 101 adopts a high copper cladding structure in the contact area, which makes the copper content in this area higher, thereby enabling more effective heat transfer from the chip to the bottom for dissipation. This method has better temperature control and can increase the overall performance and reliability.

[0094]

Example 4

[0095] Please see Figure 5 , Figure 5 This is a schematic diagram of the sensor chip packaging structure 100c provided in Embodiment 4 of the present invention. It is similar in structural features to any of Embodiments 1-3, except that the ASIC chip in Embodiment 4 uses a through-silicon via (TSV) process instead of the wire bonding process used in Embodiments 1-3. The first connection layer 104 uses solder balls to achieve signal transmission from the sensing unit 102a to the packaging substrate 101.

[0096] Specifically, a plurality of through-silicon vias are provided in the chip body 102b. The through-silicon vias are used to transmit electrical signals directly from the upper surface of the chip body 102b to the packaging substrate 101, so as to realize the electrical connection between the packaging substrate 101 and the chip body 102b.

[0097] The second connection layer 105 can be either a pad or a solder ball.

[0098] It is understandable that the second connection layer 105 can be changed from solder balls to pads, and the package substrate 101 can be soldered onto the external PCB substrate through screen printing process to increase the stability and flatness of the connection.

[0099] Holes are drilled inside the chip body 102b to transmit electrical signals from the upper surface to the lower surface of the chip body 102b. Then, the chip body 102b and the packaging substrate 101 are soldered together using pads to transmit electrical signals to the packaging substrate 101.

[0100] Example 4 can be understood as replacing the bonding wires with solder balls and integrating the solder balls onto the chip body 102b through through-silicon vias. In this case, the signal is transmitted directly from the sensing part 102a on the upper part of the chip body 102b through the chip body 102b to the packaging substrate 101. This can increase the compactness of the sensor chip packaging structure 100, reduce the interconnection length of the signal through vertical interconnection, reduce signal delay, reduce capacitance and inductance, realize low power consumption and high speed communication between signal transmissions, increase bandwidth, and realize miniaturization after sensor chip integration.

[0101]

Example 5

[0102] Please see Figure 6 , Figure 6 This is a schematic diagram of the sensor chip packaging structure 100d provided in Embodiment Six of the present invention.

[0103] Similar to the structural features of any of Embodiments 1 to 4, the difference lies in that the encapsulation 103 covers part of the surface of the sensing part 102a, selectively exposing the surface that needs to be exposed, thereby realizing the basic function of the sensor contacting the object being measured.

[0104] At this time, the upper surface of the plastic seal 103 can be higher than the upper surface of the sensing unit 102a, so that the sensing unit 102a can be protected to avoid scratches during transportation.

[0105] For certain types of sensor chips, such as photosensors, a transparent layer can be placed over the upper surface of the encapsulation 103, which is higher than the upper surface of the sensing part 102a, to better protect the sensing part 102a and increase the reliability of the product.

[0106]

Method Implementation Examples

[0107] Please see Figure 7 , Figure 7 This is a flowchart of a sensor chip packaging method provided in an embodiment of the present invention. The present invention also provides a sensor chip packaging method, which includes the following steps:

[0108] Step S101: Provide a packaging substrate;

[0109] Step S102: Provide a sensor chip, which includes a chip body and a sensing unit;

[0110] Step S103: Place the sensor chip body on the packaging substrate and establish an electrical connection between the sensor chip and the packaging substrate.

[0111] Step S104: A molding compound with an opening is formed on the packaging substrate. The molding compound covers the chip body and the sensing part, and the opening exposes at least a portion of the sensing part outside the molding compound.

[0112] It is understood that the above describes a single-chip packaging method, which involves placing the sensor chip body on a packaging substrate to achieve stacked packaging, and directly forming a plastic encapsulation with an opening on the packaging substrate to selectively expose part or all of the sensing part. This simplifies the complexity of the packaging structure, facilitates the acquisition of the detected data, maximizes the usable area of ​​the chip, and achieves lightweight packaging structure.

[0113] Furthermore, the process of forming a molded body with an opening on the packaging substrate mentioned in step S104 includes:

[0114] Step S1042: Reserve a filler for the sensing part in the mold cavity so that the molded body has an opening at the corresponding position of the sensing part after molding.

[0115] It is understandable that by designing the mold cavity structure and reserving filler for the sensing part in the mold cavity, an opening is formed in the area of ​​the sensing part after the fluid-like encapsulated body is formed.

[0116] As can be seen from the above, the packaging substrate has a first connection portion and a second connection portion; before placing the chip body of the sensor chip on the packaging substrate, the packaging method further includes: step S1021, providing a metal cladding layer on the first connection portion of the packaging substrate, so that the metal content of the first connection portion is higher than the metal content of the second connection portion.

[0117] Furthermore, step S103, establishing the electrical connection between the sensor chip and the packaging substrate, includes:

[0118] Step S1031: A bonding wire is provided between the sensor chip and the packaging substrate to achieve electrical connection between the packaging substrate and the sensor chip; or

[0119] Step S1032: Multiple through-silicon vias are provided on the chip body of the sensor chip to transmit electrical signals from the chip body to the packaging substrate, thereby realizing the electrical connection between the packaging substrate and the sensor chip.

[0120] The above steps can be derived from the technical inspiration of the overall inventive concept and embodiments 1 to 5, and will not be repeated in this application.

[0121] PCB board

[0122] Please see Figure 8 , Figure 8 This is a schematic diagram of the structure of the PCB board 200 provided in an embodiment of the present invention; the present invention also provides a PCB board 200, comprising:

[0123] PCB substrate 201; as described above, the sensor chip package structure 100 is soldered onto the PCB substrate 201 and electrically connected.

[0124] Microfluidic Detection Device

[0125] This invention also provides a microfluidic detection device (not shown in the figure), comprising:

[0126] Fluid assembly; as described in the above embodiments, the fluid assembly forms a reaction chamber at the sensing section 102a after being assembled with the sensing chip packaging structure 100.

[0127] Because the sensing part 102a of the sensing chip package structure 100 on this microfluidic detection device is directly connected to the reaction chamber, it can sense signals faster and more accurately, even if the signal is weak. At the same time, the simplified structure of the sensing chip package structure 100 can reduce the overall size of the microfluidic detection device, giving it the advantages of high sensitivity, strong portability and fast detection.

[0128] Furthermore, those skilled in the art should understand that if all or part of the sub-modules involved in the sensor chip packaging structure 100, PCB board 200 and its microfluidic detection device provided in the embodiments of the present invention are combined or replaced by means of fusion, simple changes, mutual transformation, etc., such as moving the position of each component; or setting the product they constitute as a whole; or having a detachable design; as long as the combined components can form a device / apparatus / system with a specific function, using such a device / apparatus / system to replace the corresponding components of the present invention also falls within the protection scope of the present invention.

[0129] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0130] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A sensor chip packaging structure, characterized in that, Used in microfluidic detection devices, including sensor chips, packaging substrates, and molding compounds; The sensing chip includes a chip body and a sensing unit. The chip body is disposed on the packaging substrate and electrically connected to the packaging substrate. The sensing unit, the chip body and the packaging substrate are stacked. The sensing unit is disposed on the side of the chip body away from the packaging substrate. The upper surface of the sensing unit is higher than the upper surface of the chip body. The length of the sensing unit facing the side is less than the length of the chip body facing the side; The molding compound covers the side of the sensing element, a portion of the upper surface of the chip body is covered by the sensing element, and the portion of the upper surface of the chip body not covered by the sensing element is covered by the molding compound. The molding compound also covers the side of the chip body. The molding compound has an opening for exposing at least a portion of the sensing element in the molding compound when the molding compound covers the chip body and the sensing element. The upper surface of the molding compound is flush with the upper surface of the sensing part; The packaging substrate has a first connecting portion and a second connecting portion. The first connecting portion is connected to the chip body, and the second connecting portion is located on both sides of the first connecting portion and is used to connect to an external PCB substrate. The metal content of the first connecting portion is higher than that of the second connecting portion.

2. The sensor chip packaging structure according to claim 1, characterized in that, The sensor chip packaging structure further includes a first connection layer, which is disposed between the chip body and the packaging substrate and connects the packaging substrate and the chip body. The first connecting layer is any one of solder balls, epoxy resin adhesive, or silver paste.

3. The sensor chip packaging structure according to claim 1, characterized in that, The sensor chip packaging structure further includes a second connection layer, which is disposed on the side of the packaging substrate away from the chip body, and is used to fix the packaging substrate and the external PCB substrate. The second connection layer is either a solder ball or a pad, and the solder balls or pads are arranged at intervals on the side of the packaging substrate away from the sensor chip.

4. The sensor chip packaging structure according to claim 1, characterized in that, The sensor chip packaging structure also includes electronic components, which are mounted on the packaging substrate.

5. The sensor chip packaging structure according to claim 1, characterized in that, The chip body is either an ASIC chip or a substrate.

6. The sensor chip packaging structure according to any one of claims 1 to 5, characterized in that, The sensor chip packaging structure also includes bonding wires, one end of which is connected to the chip body and the other end is connected to the packaging substrate, for realizing the electrical connection between the packaging substrate and the chip body.

7. The sensor chip packaging structure according to any one of claims 1 to 5, characterized in that, The chip body is provided with multiple through silicon vias, which are used to transmit electrical signals from the chip body to the packaging substrate to achieve electrical connection between the packaging substrate and the chip body.

8. A method for packaging a sensor chip, characterized in that, The sensing chip is used in a microfluidic detection device, comprising: Provide packaging substrate; A sensing chip is provided, the sensing chip comprising a chip body and a sensing part, wherein the upper surface of the sensing part is higher than the upper surface of the chip body; The chip body of the sensing chip is placed on the packaging substrate, and an electrical connection is established between the sensing chip and the packaging substrate. The sensing part, the chip body and the packaging substrate are stacked. The length of the sensing part in the lateral direction is less than the length of the chip body in the lateral direction. A molding compound with an opening is formed on the packaging substrate. The molding compound covers the chip body and the sensing unit. The molding compound covers the side of the sensing unit. A portion of the upper surface of the chip body is covered by the sensing unit. A portion of the upper surface of the chip body not covered by the sensing unit is covered by the molding compound. The molding compound also covers the side of the chip body. The opening exposes at least a portion of the sensing unit in the molding compound. The upper surface of the molding compound is flush with the upper surface of the sensing part; The packaging substrate has a first connecting portion and a second connecting portion; Before placing the sensor chip body on the packaging substrate, the packaging method further includes: providing a metal cladding layer on the first connection portion of the packaging substrate, such that the metal content of the first connection portion is higher than the metal content of the second connection portion.

9. The packaging method according to claim 8, characterized in that, Forming a molded body with an opening on the packaging substrate includes: The mold cavity is pre-filled with a filler for the sensing part, so that the molded body has an opening at the corresponding position of the sensing part after molding.

10. The packaging method according to claim 8, characterized in that, Establishing the electrical connection between the sensing chip and the packaging substrate includes: A bonding wire is provided between the sensor chip and the packaging substrate to achieve an electrical connection between the packaging substrate and the sensor chip; or Multiple through-silicon vias are provided on the chip body of the sensing chip to transmit electrical signals from the chip body to the packaging substrate, thereby realizing the electrical connection between the packaging substrate and the sensing chip.

11. A PCB board, characterized in that, include: PCB substrate; The sensor chip packaging structure according to any one of claims 1 to 7, wherein the sensor chip packaging structure is soldered onto the PCB substrate and electrically connected.

12. A microfluidic detection device, characterized in that, include: Fluid components; According to any one of claims 1 to 7, the fluid component is assembled with the sensor chip packaging structure to form a reaction chamber.

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