A surface residual liquid cleaning device for printed circuit board processing

Abstract

This invention discloses a surface residual liquid cleaning device for printed circuit board (PCB) processing, comprising: an ultrasonic cleaning mechanism including a cleaning base with a stirring rod rotatably connected to the bottom of the inner cavity of the cleaning base; and a rotating mechanism located on top of and rotatably connected to the ultrasonic cleaning mechanism, the rotating mechanism including a hollow tube located on top of the cleaning base, with circular turntables fitted on both the left and right sides of the hollow tube, and an air inlet connector connected to the left end of the hollow tube. The technical problem this invention aims to solve is that existing surface residual liquid cleaning devices for PCB processing are inconvenient for efficiently and uniformly cleaning residual liquids from the PCB manufacturing process, easily causing corrosion and damage to the PCB, and reducing the electrical performance of the PCB.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board processing technology, and in particular to a device for cleaning residual liquid on the surface of printed circuit boards. Background Technology

[0002] During the manufacturing process of printed circuit boards, various chemical solutions are used in multiple manufacturing steps. If these solutions are not completely cleaned after processing, they will leave behind residues, such as etching solution residues, copper plating solution residues, and developer residues. If these residues are not thoroughly removed, they will not only affect the electrical performance of the circuit board, but may also cause problems such as corrosion, short circuits, and decreased insulation performance.

[0003] Surface residual liquid cleaning devices for printed circuit board (PCB) processing are specifically designed to remove various contaminants left over from the PCB manufacturing process. If these contaminants are not properly cleaned, they can affect the electrical performance and reliability of the PCB. Cleaning devices typically employ physical or chemical methods to achieve efficient and precise cleaning results. For example, ultrasonic cleaning utilizes the impact force generated when tiny bubbles produced by high-frequency sound waves burst in the liquid to remove dirt from the PCB surface, making it suitable for cleaning small crevices and hidden areas.

[0004] A printed circuit board (PCB) processing apparatus according to Chinese patent application number 201520859241.1 includes a PCB processing apparatus body, which comprises a housing and a cover. A filter screen for holding PCBs is provided at the lower center of the cover. An ultrasonic vibration plate is symmetrically positioned at the center of the inner surface of the housing. A power interface is provided on the outer sidewall at the lower center of the housing. The ultrasonic vibration plate and the power interface are connected in series. A magnet is provided at the center of the bottom of the PCB processing apparatus body. This processing apparatus uses an ultrasonic vibration plate to effectively remove residues, greatly improving the cleanliness and cleaning efficiency of the PCBs. Furthermore, the electroplating solution magnetized by the magnet can significantly improve the dispersion effect.

[0005] Chinese Patent Application No. 201620292317.1 discloses an apparatus for cleaning chemical residues in vias of printed circuit boards after surface treatment. The apparatus includes a frame with cleaning tanks arranged sequentially in a first, second, and third cleaning tank. The first and third cleaning tanks are water washing tanks. An ultrasonic generator is installed in the second cleaning tank. Drive wheels are installed in the first, second, and third cleaning tanks for conveying the board to be cleaned. This apparatus effectively improves the cleaning effect of chemical residues in vias after surface treatment by using ultrasonic waves generated by the ultrasonic generator. Specifically, it reduces the risk of corrosion of the copper layer in vias after OSP treatment on boards with insufficient solder mask filling (with depressions), thereby reducing the production of defective products and lowering production costs.

[0006] Existing surface residual liquid cleaning devices for printed circuit board processing are not convenient for efficiently and uniformly cleaning the liquids left over from the manufacturing process, which can easily cause corrosion and damage to the circuit boards and reduce their electrical performance. Summary of the Invention

[0007] The technical problem to be solved by the present invention is that existing surface residual liquid cleaning devices for printed circuit board processing are not convenient for efficiently and uniformly cleaning the liquids remaining in the printed circuit board manufacturing process, which can easily cause corrosion and damage to the circuit board and reduce the electrical performance of the printed circuit board.

[0008] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a surface residual liquid cleaning device for printed circuit board processing, comprising an ultrasonic cleaning mechanism, wherein the ultrasonic cleaning mechanism includes a cleaning seat, and an agitator is rotatably connected to the bottom of the inner cavity of the cleaning seat;

[0009] A rotating mechanism is located on top of and rotatably connected to the ultrasonic cleaning mechanism. The rotating mechanism includes a hollow tube located on top of the cleaning seat. Circular turntables are fitted on both the left and right sides of the surface of the hollow tube. An air inlet connector is connected to the left end of the hollow tube.

[0010] A clamping mechanism, wherein there are several clamping mechanisms distributed around the inner cavity of the rotating mechanism, the clamping mechanism includes a clamping frame, a rotating head is installed at both ends of the clamping frame, a fixed clamp is fixedly connected to the middle of one side of the clamping frame, and movable clamps are provided on the left and right sides of the fixed clamp that are movably connected to the clamping frame.

[0011] A ring mechanism is installed on one side of an ultrasonic cleaning mechanism. The ring mechanism includes a ring frame, and a plurality of evenly distributed cam drive heads are installed on one side of the ring frame.

[0012] A reciprocating drive mechanism is installed on one side of the ultrasonic cleaning mechanism. The rotating end of the reciprocating drive mechanism is connected to the rotating mechanism. A controller is installed on the reciprocating drive mechanism.

[0013] A spray cleaning mechanism is installed on top of the rotating mechanism and is used to clean the printed circuit board inside the clamping mechanism.

[0014] A drying mechanism is installed on the other side of the ultrasonic cleaning mechanism. The air outlet of the drying mechanism is rotatably connected to and communicates with the air inlet of the rotating mechanism. The drying mechanism includes an air heater, and the air outlet at the top of the air heater is connected to an air outlet component.

[0015] As a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing described in this invention, the cleaning seat has several transducers installed on both the front and rear sides of its bottom. An ultrasonic generator electrically connected to the transducers is installed on the front side of the cleaning seat. A support base is connected to the surface of the cleaning seat to support it. A drain pipe is connected to the center of the bottom of the cleaning seat. A drain valve is installed at the bottom of the drain pipe. Several stirring blades are installed on the surface of the stirring rod. A limiting groove for accommodating a circular turntable is provided on the top of the cleaning seat.

[0016] As a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing described in this invention, the hollow tube is equipped with a one-way valve at the air inlet end, the hollow tube has a plurality of hot air holes on its surface, the hollow tube has a plurality of hot air nozzles communicating with the hot air holes on its inner wall, the air outlet end of the air outlet is located inside the air inlet connector and is rotatably connected to its inner wall, the circular turntable has a mounting hole, and the rotating head is installed inside the mounting hole and is movably connected.

[0017] As a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing described in this invention, wherein: a plurality of support heads are fixedly connected to one side of the fixed clamp, and a clamping head is movably connected to the other side of the fixed clamp; a threaded rod is installed at the center of the clamping head, and the threaded rod is threadedly connected to the fixed clamp; a limiting slide rod is fixedly connected to the bottom of the inner wall of the clamping frame; the movable clamp is movably sleeved on the surface of the limiting slide rod; a sliding member is fixedly connected to the rear side of the movable clamp, and the sliding member is movably connected to the clamping frame; a double-ended lead screw is rotatably connected to the top of the inner wall of the clamping frame and the fixed clamp; the movable clamp is threadedly sleeved on the surface of the double-ended lead screw; a large gear is sleeved at the middle end of the surface of the double-ended lead screw; and a self-locking drive structure for driving the large gear is installed on the rear side of the clamping frame.

[0018] As a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing described in this invention, the self-locking drive structure includes a gear housing installed on the rear side of the clamping frame, a small gear that meshes with a large gear is rotatably connected inside the gear housing, a waterproof self-locking motor is installed on the surface of the gear housing, and the output shaft of the waterproof self-locking motor is connected to the small gear.

[0019] As a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing described in this invention, the rotating head is equipped with a cam, a pressing rod is fixedly connected to the cam, a hollow arc frame is movably connected to the surface of the pressing rod, the hollow arc frame is installed on the surface of a circular turntable, and arc-shaped rubber expansion joints connected to the pressing rod are installed on both the front and rear sides of the inner cavity of the hollow arc frame, and springs are provided inside the arc-shaped rubber expansion joints.

[0020] As a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing described in this invention, the cam drive head is located on the motion trajectory of the cam and drives the cam to rotate when in contact with the cam. The cam drive head is equipped with a reinforcing rib connected to the cam drive head, and the bottom of the annular frame is provided with a fixing member that is fixedly connected to the surface of the cleaning seat.

[0021] In a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing according to the present invention, the reciprocating drive mechanism includes a worktable, a support frame fixedly connected to the bottom of the worktable, the support frame being fixedly connected to the surface of the cleaning seat, a reducer fixedly connected to the top of the worktable, a drive motor fixedly connected to one side of the reducer, the output shaft of the drive motor being fixedly connected to the input shaft of the reducer, an eccentric component fixedly connected to the output shaft of the reducer, a movable head rotatably connected to one end of the eccentric component, a movable frame movably connected to the surface of the movable head, and a mounting bracket movably connected to the surface of the movable frame. A sliding seat is mounted on the top of the workbench. One end of the movable frame extends to the left side of the sliding seat and is fixedly connected to a rack. The rack is movably connected to the surface of the sliding seat. A drive gear meshes with the top of the rack. A drive rod is installed inside the drive gear. One end of the drive rod is connected to a hollow tube. The other end of the drive rod is rotatably connected to a rotating seat. The rotating seat is mounted on the sliding seat. A drive wheel is sleeved on the surface of the drive rod. A drive belt is drivenly connected to the surface of the drive wheel. A driven wheel is drivenly connected to the bottom of the inner wall of the drive belt. The driven wheel is sleeved on the stirring rod to drive it.

[0022] As a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing according to the present invention, the spray cleaning mechanism includes a spray frame, and fixed frames fixedly connected to the surface of the cleaning seat are provided on both the left and right sides of the spray frame. Spray pipes are rotatably connected to both the front and rear sides of the spray frame. A stepper motor is fixedly installed on one side of the spray frame. The output shaft of the stepper motor is fixedly connected to the spray pipe. A plurality of nozzles are connected to the bottom of the spray pipe. A first hose and a second hose are respectively connected to the top of the spray frame. The second hose is connected to the first hose. A delivery pipe is connected to the liquid inlet end of the first hose. A liquid pump is connected to the liquid inlet end of the delivery pipe. The liquid pump is used to extract the printed circuit board cleaning liquid. A limiting plate installed on the surface of the cleaning seat is sleeved on the surface of the delivery pipe.

[0023] As a preferred embodiment of the surface residual liquid cleaning device for printed circuit board processing described in this invention, wherein: a temperature sensor is installed on the surface of the air outlet, a limiting frame is sleeved on the surface of the air heater, the limiting frame is installed on the surface of the cleaning seat, a bent pipe is connected to the bottom of the limiting frame, a fan is connected to the air inlet end of the bent pipe, and a plurality of electric heating tubes are installed around the inner wall of the air heater.

[0024] The beneficial effects of this invention are:

[0025] 1. This invention utilizes the combined use of an ultrasonic cleaning mechanism and a spray cleaning mechanism to facilitate spray cleaning and ultrasonic cleaning of printed circuit boards (PCBs). The spray cleaning mechanism is positioned at the top for spray cleaning, while the ultrasonic cleaning mechanism is located at the bottom to collect the sprayed cleaning fluid and perform a secondary ultrasonic cleaning of the PCB. The spray cleaning mechanism, with its adjustable nozzle, can change the initial angle of rinsing the PCB surface, effectively removing residual contaminants. Meanwhile, the ultrasonic cleaning mechanism at the bottom uses the bursting effect of microbubbles generated in the cleaning fluid to penetrate into tiny crevices and pores, removing even smaller and harder-to-reach contaminants. The combination of these two mechanisms achieves highly efficient and uniform cleaning of the PCB surface and its deeper layers.

[0026] 2. This invention, by setting a reciprocating drive mechanism, facilitates the reciprocating rotation of the rotating mechanism inside the ultrasonic cleaning mechanism. During the reciprocating rotation of the rotating mechanism, it drives several clamping mechanisms inside to rotate on opposite sides of the ultrasonic cleaning mechanism and the spray cleaning mechanism. This allows the ultrasonic cleaning mechanism and the spray cleaning mechanism to clean multiple printed circuit boards distributed around each other. Moreover, it enables multiple printed circuit boards to move and flip dynamically in the cleaning solution, increasing the contact area and time between the cleaning solution and the surface of the circuit boards, thereby improving cleaning efficiency. At the same time, this movement mode also helps the cleaning solution to better penetrate into all corners of the circuit boards, improving the cleaning effect. The combination of automation and mechanization reduces manual intervention, improves the continuity and automation level of the cleaning process, and makes batch cleaning of printed circuit boards more efficient, reducing production costs.

[0027] 3. This invention, by setting up a ring mechanism, facilitates the clamping mechanism to swing back and forth inside the rotating mechanism. The ring mechanism is fixed to the ultrasonic cleaning mechanism and does not rotate with the rotating mechanism. During the rotation of the clamping mechanism driven by the rotating mechanism, the clamping mechanism and the ring mechanism come into contact, and the ring mechanism drives the clamping mechanism to swing, making the cleaning more thorough. The swinging motion helps the cleaning fluid to form a more active flow on the surface of the printed circuit board, promoting the contact and separation of the cleaning fluid and contaminants, improving the efficiency of the cleaning fluid, and reducing the consumption of cleaning agent. The forward and backward swinging motion changes the angle and direction of the cleaning fluid impacting the printed circuit board, which helps to eliminate cleaning dead corners that may be formed by fixed-direction cleaning, ensuring the thorough cleaning of the entire surface of the printed circuit board. Moreover, the dynamic stress generated by the swinging motion helps to loosen and remove contaminants attached to the surface and embedded parts of the printed circuit board, especially for those residues that are difficult to remove by static soaking or linear motion alone. During the ultrasonic cleaning stage, the swinging motion helps the bubbles generated by the ultrasonic waves to be more evenly distributed in the cleaning fluid, improving the ultrasonic cleaning effect.

[0028] 4. This invention, through the combined use of a drying mechanism and a rotating mechanism, facilitates the heating and drying of printed circuit boards (PCBs) cleaned inside the clamping mechanism. During the drying process, hot air directly acts on the surface of the PCB, rapidly increasing the temperature and accelerating the evaporation of residual moisture after cleaning. This significantly shortens the drying time and improves production efficiency. Furthermore, the PCB continues to move in multiple dimensions during drying, allowing the hot air to contact the PCB from multiple directions, ensuring uniform drying and avoiding problems caused by localized overheating or dampness. The continuous dynamic movement also helps prevent water droplets from accumulating in fixed positions on the PCB, thereby reducing watermarks and spots and maintaining the cleanliness and smoothness of the PCB surface. Compared to static drying or high-temperature ovens, this method reduces the risk of thermal damage to the PCB by controlling appropriate temperature and hot air. Attached Figure Description

[0029] Figure 1 This is the main view axonometric drawing of the present invention;

[0030] Figure 2 This is a rear-view axonometric drawing of the present invention;

[0031] Figure 3 This is a front axonometric view of the ultrasonic cleaning mechanism of the present invention;

[0032] Figure 4 This is a bottom-view axonometric view of the ultrasonic cleaning mechanism of the present invention;

[0033] Figure 5 This is a front axonometric view of the rotating mechanism of the present invention;

[0034] Figure 6 This is a front axonometric view of the clamping mechanism of the present invention;

[0035] Figure 7 This is a rear axonometric view of the clamping mechanism of the present invention;

[0036] Figure 8 This is a partial sectional view of the clamping mechanism of the present invention from the right side.

[0037] Figure 9 This is a front axonometric view of the self-locking drive structure of the present invention;

[0038] Figure 10 This is a front axonometric view of the ring mechanism of the present invention;

[0039] Figure 11 This is a front axonometric view of the reciprocating drive mechanism of the present invention;

[0040] Figure 12 This is a left axonometric view of the reciprocating drive mechanism of the present invention;

[0041] Figure 13 This is a front axonometric view of the spray cleaning mechanism of the present invention;

[0042] Figure 14 This is a bottom-view axonometric view of the spray cleaning mechanism of the present invention;

[0043] Figure 15 This is a front axonometric view of the drying mechanism of the present invention;

[0044] Figure 16 This is a partial sectional view of the drying mechanism of the present invention from the front view.

[0045] Figure 17 This is a partial sectional view of the main view of the rotating mechanism and the drying mechanism of the present invention;

[0046] Figure 18 This is a right view of the first working state of a local structure of the present invention when it is rotated forward;

[0047] Figure 19 This is an isometric view of the first working state of a local structure of the present invention during forward rotation;

[0048] Figure 20 This is a right view of the second working state of a partial structure of the present invention when it is rotated forward;

[0049] Figure 21 This is an isometric view of the second working state of a local structure of the present invention during forward rotation;

[0050] Figure 22 This is a right view of the first working state when the partial structure of the present invention is reversed;

[0051] Figure 23 This is an isometric view of the first working state of the present invention when the local structure is reversed;

[0052] Figure 24 This is a right view of the second working state of the present invention when the partial structure is reversed;

[0053] Figure 25 This is an isometric view of the second working state when the local structure of the present invention is reversed.

[0054] In the diagram: 100, Ultrasonic cleaning mechanism; 101, Cleaning base; 102, Agitator blades; 103, Agitator rod; 104, Transducer; 105, Ultrasonic generator; 106, Support base; 107, Limiting groove; 108, Drain pipe; 109, Drain valve; 200, Rotating mechanism; 201, Hollow tube; 202, Hot air vent; 203, Mounting hole; 204, Circular turntable; 205, Air inlet connector; 206, One-way valve; 207, Hot air nozzle; 300, Clamping mechanism; 301. Clamping frame; 302, Self-locking drive structure; 3021, Gear housing; 3022, Pinion; 3023, Waterproof self-locking motor; 303, Sliding component; 304, Double-ended lead screw; 305, Large gear; 306, Fixed clamp; 307, Rotating head; 308, Hollow arc-shaped frame; 309, Cam; 310, Extrusion rod; 311, Arc-shaped rubber telescopic device; 312, Movable clamp; 313, Support head; 314, Clamping head; 315, Threaded rod; 316, Limiting slide rod; 317, Spring; 400. Ring mechanism; 401. Ring frame; 402. Cam drive head; 403. Reinforcing rib; 404. Fixing component; 500. Reciprocating drive mechanism; 501. Worktable; 502. Moving head; 503. Sliding seat; 504. Rack; 505. Moving frame; 506. Drive rod; 507. Drive transmission wheel; 508. Drive gear; 509. Rotating seat; 510. Eccentric component; 511. Reducer; 512. Drive motor; 513. Support frame; 514. Driven transmission wheel; 51 5. Drive belt; 600. Spray cleaning mechanism; 601. Spray frame; 602. Second hose; 603. First hose; 604. Conveying pipe; 605. Fixing frame; 606. Limiting plate; 607. Liquid pump; 608. Stepper motor; 609. Spray head; 610. Spray pipe; 700. Drying mechanism; 701. Air heater; 702. Fan; 703. Bend; 704. Limiting frame; 705. Air outlet; 706. Temperature sensor; 707. Heating element; 800. Controller. Detailed Implementation

[0055] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0056] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0057] Example 1, as Figure 1-25 As shown, this embodiment provides a surface residual liquid cleaning device for printed circuit board processing, including an ultrasonic cleaning mechanism 100. The ultrasonic cleaning mechanism 100 includes a cleaning seat 101, and an agitator 103 is rotatably connected to the bottom of the inner cavity of the cleaning seat 101.

[0058] Furthermore, several transducers 104 are installed on both the front and rear sides of the bottom of the cleaning seat 101. An ultrasonic generator 105 electrically connected to the transducers 104 is installed on the front side of the cleaning seat 101. A support base 106 is connected to the surface of the cleaning seat 101 to support it. A drain pipe 108 is connected to the center of the bottom of the cleaning seat 101. A drain valve 109 is installed at the bottom of the drain pipe 108. Several stirring blades 102 are installed on the surface of the stirring rod 103. A limiting groove 107 for accommodating the circular turntable 204 is opened on the top of the cleaning seat 101.

[0059] During the operation of the ultrasonic cleaning mechanism 100, the ultrasonic generator 105 converts the AC power supplied by the mains into high-frequency electrical energy. Several transducers 104 are located on the front and rear sides of the bottom of the cleaning seat 101, respectively, converting the electrical energy into mechanical vibrations. These vibrations are transmitted into the cleaning fluid through the bottom of the cleaning seat 101, ensuring that the ultrasonic energy evenly covers the cleaning area and improves cleaning efficiency. The ultrasonic energy in the cleaning fluid not only directly acts on contaminants, causing them to detach from the substrate, but also the micro-explosions generated by cavitation can penetrate into tiny gaps and blind holes, achieving the purpose of deep cleaning of the printed circuit board. During ultrasonic cleaning, the drive rod 506 of the reciprocating drive mechanism 500 drives the active drive wheel 507 to rotate. The active drive wheel 507 drives the stirring rod 103 to rotate at the bottom of the inner cavity of the cleaning seat 101 through the transmission belt 515 and the driven drive wheel 514. The cleaning seat 101 drives several stirring blades 102 to stir the cleaning fluid at the bottom of the inner cavity of the cleaning seat 101. Movement allows the cleaning fluid to flow, preventing the formation of dead zones or stagnant layers within the cleaning chamber 101. This ensures that ultrasonic energy and cleaning agent are evenly distributed to every corner, improving the comprehensiveness and consistency of the cleaning. Ultrasonic cleaning primarily relies on the cavitation effect in the liquid to remove dirt. Agitating the cleaning fluid promotes the generation and collapse of bubbles, enhancing the cavitation effect and allowing microbubbles to penetrate micro-crevices and complex areas more effectively, improving cleaning efficiency. Furthermore, the flowing cleaning fluid can more quickly carry away detached dirt particles, preventing them from redepositing on the printed circuit board surface and maintaining the cleanliness of the cleaning fluid, thereby accelerating the cleaning process. When the cleaning fluid level inside the cleaning chamber 101 becomes too high, the drain valve 109 is opened, allowing the cleaning fluid to be discharged through the drain pipe 108 and the drain valve 109. This allows the cleaning chamber 101 to continue collecting the cleaning fluid, while the discharge of some cleaning fluid can remove contaminants, improving the purity of the cleaning fluid inside the cleaning chamber 101.

[0060] Furthermore, it also includes a rotating mechanism 200, which is located on top of the ultrasonic cleaning mechanism 100 and rotatably connected to it. The rotating mechanism 200 includes a hollow tube 201 located on top of the cleaning seat 101. Circular turntables 204 are fitted on both the left and right sides of the surface of the hollow tube 201, and an air inlet connector 205 is connected to the left end of the hollow tube 201.

[0061] Furthermore, a one-way valve 206 is installed at the air inlet end of the hollow tube 201, and several hot air holes 202 are opened on the surface of the hollow tube 201. Several hot air nozzles 207 communicating with the hot air holes 202 are installed on the inner wall of the hollow tube 201. The air outlet end of the air outlet component 705 is located inside the air inlet connector 205 and is rotatably connected to its inner wall. An installation hole 203 is opened on the circular turntable 204, and the rotating head 307 is installed inside the installation hole 203 and is movably connected.

[0062] During the operation of the rotating mechanism 200, the reciprocating drive mechanism 500 drives the hollow tube 201 to rotate back and forth. During the rotation of the hollow tube 201, the circular turntable 204 rotates inside the limiting groove 107. The limiting groove 107 limits the circular turntable 204 to prevent it from detaching from the cleaning seat 101. The rotating head 307 is installed inside the mounting hole 203 and rotates with the circular turntable 204 to realize the rotation of multiple clamping mechanisms 300.

[0063] Furthermore, it also includes a clamping mechanism 300. There are several clamping mechanisms 300, which are distributed around the inner cavity of the rotating mechanism 200. The clamping mechanism 300 includes a clamping frame 301. Rotating heads 307 are installed at both ends of the clamping frame 301. A fixed clamp 306 is fixedly connected to the middle of one side of the clamping frame 301. Movable clamps 312 that are movably connected to the clamping frame 301 are provided on the left and right sides of the fixed clamp 306.

[0064] Furthermore, a number of support heads 313 are fixedly connected to one side of the fixed clamp 306, and a clamping head 314 is movably connected to the other side of the fixed clamp 306. A threaded rod 315 is installed at the center of the clamping head 314, and the threaded rod 315 is threadedly connected to the fixed clamp 306. A limiting slide rod 316 is fixedly connected to the bottom of the inner wall of the clamping frame 301. A movable clamp 312 is movably sleeved on the surface of the limiting slide rod 316. A sliding member 303 is fixedly connected to the rear side of the movable clamp 312, and the sliding member 303 is movably connected to the clamping frame 301. A double-ended lead screw 304 is rotatably connected to the top of the inner wall of the clamping frame 301 and the fixed clamp 306. The movable clamp 312 is threadedly sleeved on the surface of the double-ended lead screw 304. A large gear 305 is sleeved at the middle end of the surface of the double-ended lead screw 304. A self-locking drive structure 302 for driving the large gear 305 is installed on the rear side of the clamping frame 301.

[0065] Furthermore, the self-locking drive structure 302 includes a gear housing 3021 installed on the rear side of the clamping frame 301. A small gear 3022 that meshes with a large gear 305 is rotatably connected inside the gear housing 3021. A waterproof self-locking motor 3023 is installed on the surface of the gear housing 3021. The output shaft of the waterproof self-locking motor 3023 is connected to the small gear 3022.

[0066] Furthermore, a cam 309 is installed on one end of the rotating head 307, and a pressing rod 310 is fixedly connected to the cam 309. A hollow arc frame 308 is movably connected to the surface of the pressing rod 310. The hollow arc frame 308 is installed on the surface of the circular turntable 204. Arc-shaped rubber expansion joints 311 connected to the pressing rod 310 are installed on both the front and rear sides of the inner cavity of the hollow arc frame 308. A spring 317 is provided inside the arc-shaped rubber expansion joint 311.

[0067] During operation, the clamping mechanism 300 places the printed circuit board to be cleaned on one side of the fixed clamp 306 and the movable clamp 312. The fixed clamp 306 and the movable clamp 312 have clamping grooves adapted to the printed circuit board. The support head 313 fits against one side of the printed circuit board to support it. The clamping head 314 is rotated via the threaded rod 315 to move to the other side of the printed circuit board, clamping and fixing both sides of the printed circuit board. The output shaft of the waterproof self-locking motor 3023 drives the pinion gear. When gear 3022 rotates, the small gear 3022 drives the large gear 305 and the double-ended lead screw 304 to rotate. The double-ended lead screw 304 drives the two movable clamps 312 to move relative to each other, so that the movable clamps 312 clamp and fix the left or right side of the printed circuit board, and stably clamp the printed circuit board on the fixed clamp 306. During the movement of the movable clamp 312, the sliding member 303 slides inside the clamping frame 301 and slides on the surface of the limiting slide bar 316. The sliding member 303 and the limiting slide bar 316 prevent the movable clamp 312 from rotating during the movement.

[0068] Furthermore, it also includes a ring mechanism 400, which is installed on one side of the ultrasonic cleaning mechanism 100. The ring mechanism 400 includes a ring frame 401, and a number of evenly distributed cam drive heads 402 are installed on one side of the ring frame 401.

[0069] Furthermore, the cam drive head 402 is located on the motion trajectory of the cam 309, and drives the cam 309 to rotate when in contact with it. The cam drive head 402 is equipped with a reinforcing rib 403 connected to the cam drive head 402, and the bottom of the ring frame 401 is provided with a fixing member 404 that is fixedly connected to the surface of the cleaning seat 101.

[0070] During operation, the annular mechanism 400 facilitates the driving of the clamping mechanism 300 during rotation. When the clamping mechanism 300 rotates forward, the cam 309 contacts the front side of the cam drive head 402. During this contact, the cam 309 swings upward, thereby causing the clamping mechanism 300 to swing forward as a whole, changing the cleaning angle. When the clamping mechanism 300 rotates in reverse, the cam 309 contacts the rear side of the cam drive head 402. During this contact, the cam 309 swings backward, thereby causing the clamping mechanism 300 to swing backward as a whole. During the swinging of the cam 309, the extrusion rod 310 moves within the hollow arc frame 308. The internal sliding mechanism limits the swing angle of the cam 309, while two springs 317 support the extrusion rod 310, allowing it to return to the midpoint after swinging, facilitating subsequent reciprocating swing. When the extrusion rod 310 slides inside the hollow arc frame 308, it extrudes one side of the arc-shaped rubber expansion joint 311, while the other side expands, enabling the extrusion rod 310 and the cam 309 to swing. The arc-shaped rubber expansion joint 311 has a spring 317 inside, which increases the support strength of the arc-shaped rubber expansion joint 311 and facilitates the return of the extrusion rod 310 to its original position.

[0071] By setting the annular mechanism 400, the clamping mechanism 300 can be easily driven to swing back and forth inside the rotating mechanism 200. The annular mechanism 400 is fixed on the ultrasonic cleaning mechanism 100 and does not rotate with the rotating mechanism 200. During the rotation of the clamping mechanism 300 driven by the rotating mechanism 200, the clamping mechanism 300 and the annular mechanism 400 come into contact. The annular mechanism 400 drives the clamping mechanism 300 to swing, making the cleaning more thorough. The swinging motion helps the cleaning fluid to form a more active flow on the surface of the printed circuit board, promoting the contact and separation of the cleaning fluid and contaminants, improving the efficiency of the cleaning fluid, and reducing the consumption of cleaning agent. The forward and backward swinging motion changes the angle and direction of the cleaning fluid impacting the printed circuit board, which helps to eliminate cleaning dead corners that may be formed by fixed-direction cleaning, ensuring the thorough cleaning of the entire surface of the printed circuit board. Moreover, the dynamic stress generated by the swinging motion helps to loosen and remove contaminants attached to the surface and embedded parts of the printed circuit board, especially for those residues that are difficult to remove by static soaking or linear motion alone. During the ultrasonic cleaning stage, the swinging motion helps the bubbles generated by the ultrasonic waves to be more evenly distributed in the cleaning fluid, improving the ultrasonic cleaning effect.

[0072] Furthermore, it also includes a reciprocating drive mechanism 500, which is installed on one side of the ultrasonic cleaning mechanism 100. The rotating end of the reciprocating drive mechanism 500 is connected to the rotating mechanism 200, and a controller 800 is installed on the reciprocating drive mechanism 500.

[0073] Furthermore, the reciprocating drive mechanism 500 includes a worktable 501, a support frame 513 fixedly connected to the bottom of the worktable 501, the support frame 513 fixedly connected to the surface of the cleaning seat 101, a reducer 511 fixedly connected to the top of the worktable 501, a drive motor 512 fixedly connected to one side of the reducer 511, the output shaft of the drive motor 512 fixedly connected to the input shaft of the reducer 511, an eccentric member 510 fixedly connected to the output shaft of the reducer 511, a movable head 502 rotatably connected to one end of the eccentric member 510, a movable frame 505 movably connected to the surface of the movable head 502, and a sliding seat 503 mounted on the top of the worktable 501 movably connected to the surface of the movable frame 505. One end extends to the left side of the sliding seat 503 and is fixedly connected to a rack 504. The rack 504 is movably connected to the surface of the sliding seat 503. A drive gear 508 meshes with the top of the rack 504. A drive rod 506 is installed inside the drive gear 508. One end of the drive rod 506 is connected to the hollow tube 201. The other end of the drive rod 506 is rotatably connected to a rotating seat 509. The rotating seat 509 is installed on the sliding seat 503. An active transmission wheel 507 is sleeved on the surface of the drive rod 506. A transmission belt 515 is connected to the surface of the active transmission wheel 507. A driven transmission wheel 514 is connected to the bottom of the inner wall of the transmission belt 515. The driven transmission wheel 514 is sleeved on the stirring rod 103 to drive it.

[0074] During the operation of the reciprocating drive mechanism 500, the output shaft of the drive motor 512 drives the reducer 511 to rotate, and the output shaft of the reducer 511 drives the eccentric part 510 to rotate. During the rotation of the eccentric part 510, the movable head 502 moves up and down reciprocally inside the movable frame 505. During the up and down reciprocating motion of the movable head 502, the movable frame 505 moves back and forth reciprocally inside the sliding seat 503, thereby driving the rack 504 to move back and forth reciprocally. The rack 504 drives the drive gear 508 meshing with it to rotate back and forth reciprocally. The drive gear 508 drives the hollow tube 201 to rotate through the drive rod 506. During the rotation of the drive rod 506, the agitator 103 is driven to rotate through the drive wheel 507, the drive belt 515 and the driven wheel 514. The rotating seat 509 limits the right end of the rotating drive rod 506 so that it can rotate stably.

[0075] By setting up a reciprocating drive mechanism 500, the rotating mechanism 200 can be easily driven to reciprocate within the ultrasonic cleaning mechanism 100. During the reciprocating rotation of the rotating mechanism 200, several clamping mechanisms 300 inside it rotate on opposite sides of the ultrasonic cleaning mechanism 100 and the spray cleaning mechanism 600, enabling the ultrasonic cleaning mechanism 100 and the spray cleaning mechanism 600 to clean multiple printed circuit boards distributed around each other. Moreover, multiple printed circuit boards can dynamically move and flip in the cleaning solution, increasing the contact area and time between the cleaning solution and the surface of the circuit boards, thus improving cleaning efficiency. At the same time, this movement mode also helps the cleaning solution to better penetrate into all corners of the circuit boards, improving the cleaning effect. The combination of automation and mechanization reduces manual intervention, improves the continuity and automation level of the cleaning process, and makes batch cleaning of printed circuit boards more efficient, reducing production costs.

[0076] Furthermore, it also includes a spray cleaning mechanism 600, which is mounted on top of the rotating mechanism 200 and is used to clean the printed circuit board inside the clamping mechanism 300.

[0077] Furthermore, the spray cleaning mechanism 600 includes a spray frame 601. The spray frame 601 has fixed brackets 605 on both its left and right sides, which are fixedly connected to the surface of the cleaning seat 101. Spray pipes 610 are rotatably connected to both the front and rear sides of the spray frame 601. A stepper motor 608 is fixedly installed on one side of the spray frame 601. The output shaft of the stepper motor 608 is fixedly connected to the spray pipe 610. Several nozzles 609 are connected to the bottom of the spray pipe 610. A first flexible hose 603 and a second flexible hose 602 are connected to the top of the spray frame 601. The second flexible hose 602 is connected to the first flexible hose 603. A delivery pipe 604 is connected to the liquid inlet end of the first flexible hose 603. A liquid pump 607 is connected to the liquid inlet end of the delivery pipe 604. The liquid pump 607 is used to extract the printed circuit board cleaning solution. A limiting plate 606, which is installed on the surface of the cleaning seat 101, is sleeved on the surface of the delivery pipe 604.

[0078] During the operation of the spray cleaning mechanism 600, the liquid pump 607 draws external cleaning fluid and uses a cleaning fluid specifically designed for the residual liquid components on the surface of the printed circuit board, enabling efficient cleaning of the residual liquid on the printed circuit board. The cleaning fluid is delivered to the first hose 603 through the delivery pipe 604 and simultaneously enters the two spray pipes 610 through the second hose 602. The spray pipes 610 spray the cleaning fluid through the nozzles 609, and the sprayed cleaning fluid contacts and cleans the surface of the printed circuit board. The spray pipes 610 can be rotated by the fixing bracket 605, thereby adjusting the initial cleaning angle of the nozzles 609. After adjusting the initial angle, the printed circuit board is rotated and oscillated for cleaning, thereby improving the cleaning efficiency.

[0079] The combined use of the ultrasonic cleaning mechanism 100 and the spray cleaning mechanism 600 facilitates both spray cleaning and ultrasonic cleaning of printed circuit boards. The spray cleaning mechanism 600 is positioned at the top for spray cleaning, while the ultrasonic cleaning mechanism 100 is positioned at the bottom to collect the sprayed cleaning fluid and perform a secondary ultrasonic cleaning of the printed circuit board. The spray cleaning mechanism 600, through its adjustable nozzle 609, can change the initial angle of rinsing the surface of the printed circuit board, effectively removing residual contaminants. Meanwhile, the ultrasonic cleaning mechanism 100 at the bottom uses the bursting effect of microbubbles generated in the cleaning fluid to penetrate into tiny crevices and pores, removing even smaller and harder-to-reach contaminants. The combination of the two achieves efficient and uniform cleaning of the surface and deeper layers of the printed circuit board.

[0080] Furthermore, it also includes a drying mechanism 700, which is installed on the other side of the ultrasonic cleaning mechanism 100. The air outlet of the drying mechanism 700 is rotatably connected to the air inlet of the rotating mechanism 200. The drying mechanism 700 includes an air heater 701, and the air outlet at the top of the air heater 701 is connected to an air outlet component 705.

[0081] Furthermore, a temperature sensor 706 is installed on the surface of the air outlet 705, a limiting bracket 704 is fitted on the surface of the air heater 701, the limiting bracket 704 is installed on the surface of the cleaning seat 101, a bend 703 is connected to the bottom of the limiting bracket 704, a fan 702 is connected to the air inlet end of the bend 703, and several electric heating tubes 707 are installed around the inner wall of the air heater 701.

[0082] During the operation of the drying mechanism 700, the fan 702 draws in outside air and delivers it to the air heater 701 through the bend pipe 703. The electric heating element 707 inside the air heater 701 heats the air. The heated air is then delivered to the air inlet connector 205 through the air outlet 705. A sealing structure is provided at the connection between the air inlet connector 205 and the air outlet 705. The hot air opens the one-way valve 206 and is ejected through the hot air nozzle 207 and the hot air hole 202 to dry the printed circuit board. The temperature sensor 706 detects the temperature of the hot air and transmits the detection signal to the controller 800. The controller 800 controls the operating parameters of the air heater 701 based on the detected temperature, thereby controlling the temperature of the hot air.

[0083] By using the drying mechanism 700 and the rotating mechanism 200 in combination, the printed circuit board (PCB) cleaned inside the clamping mechanism 300 can be easily heated and dried. During the drying process, hot air acts directly on the surface of the PCB, rapidly increasing the temperature and accelerating the evaporation of residual moisture after cleaning. This greatly shortens the drying time and improves production efficiency. Furthermore, the PCB continues to move in multiple dimensions during drying, allowing the hot air to contact the PCB from multiple directions, ensuring uniform drying and avoiding problems caused by localized overheating or dampness. The continuous dynamic movement also helps prevent water droplets from accumulating in fixed positions on the PCB, thereby reducing watermarks and spots and keeping the PCB surface clean and smooth. Compared to static drying or high-temperature ovens, this method reduces the risk of thermal damage to the PCB by controlling the appropriate temperature and hot air.

[0084] Example 2, as Figure 1-25 As shown, this embodiment provides a method for using a surface residual liquid cleaning device for printed circuit board processing, including the following steps:

[0085] Select a suitable cleaning solution based on the characteristics of the printed circuit board, and start the liquid pump 607 to begin circulation to ensure the supply of cleaning solution.

[0086] Open the fixed clamp 306 and the movable clamp 312, and correctly place the printed circuit board that needs to be cleaned between the clamps.

[0087] Use the threaded rod 315 to adjust the position of the clamping head 314 to ensure that the printed circuit board is securely clamped.

[0088] The self-locking drive structure 302 operates the double-ended lead screw 304 to fasten the movable clamp 312 to the printed circuit board, ensuring no slippage during the cleaning process.

[0089] The spray cleaning mechanism 600 is activated, the liquid pump 607 draws cleaning fluid, and sprays it onto the printed circuit board through the nozzle 609 to further remove residual stains.

[0090] The ultrasonic cleaning unit 100 collects the sprayed cleaning fluid, starts the ultrasonic generator 105, converts the mains power into high-frequency electrical energy to supply the transducer 104, generates ultrasonic vibration, and produces cavitation effect in the cleaning fluid.

[0091] The reciprocating drive mechanism 500 drives the stirring rod 103 to rotate, and the stirring blades 102 cause the cleaning fluid to flow, improving cleaning efficiency and uniformity.

[0092] The rotating mechanism 200 drives the clamping mechanism 300 to rotate, achieving multi-angle cleaning. At the same time, the cleaning angle can be changed by the swing controlled by the ring mechanism 400 to ensure all-round cleaning.

[0093] After cleaning, the drying mechanism 700 is started, the fan 702 introduces air, which is heated by the air heater 701 and then dried by the hot air nozzle 207 and hot air hole 202 on the printed circuit board.

[0094] Temperature sensor 706 monitors the hot air temperature, and controller 800 adjusts the power of heating element 707 based on the feedback to ensure a suitable temperature and avoid heat damage.

[0095] After drying is complete, stop all operations and allow the printed circuit board to cool to room temperature.

[0096] Open the clamping mechanism 300 one by one, remove the printed circuit board, and perform a quality inspection to ensure that all residual liquid and stains have been thoroughly removed.

Claims

1. A device for cleaning residual liquid from the surface of printed circuit boards, characterized in that: include, An ultrasonic cleaning mechanism (100) includes a cleaning seat (101) with a stirring rod (103) rotatably connected to the bottom of the inner cavity of the cleaning seat (101). A rotating mechanism (200) is located on top of the ultrasonic cleaning mechanism (100) and rotatably connected thereto. The rotating mechanism (200) includes a hollow tube (201) located on top of the cleaning seat (101). Circular turntables (204) are fitted on both the left and right sides of the surface of the hollow tube (201). An air inlet connector (205) is connected to the left end of the hollow tube (201). A clamping mechanism (300) is provided, and the number of clamping mechanisms (300) is several and they are distributed around the inner cavity of the rotating mechanism (200). The clamping mechanism (300) includes a clamping frame (301). A rotating head (307) is installed at both the left and right ends of the clamping frame (301). A fixed clamp (306) is fixedly connected to the middle end of one side of the clamping frame (301). Movable clamps (312) that are movably connected to the clamping frame (301) are provided on the left and right sides of the fixed clamp (306). A ring mechanism (400) is installed on one side of an ultrasonic cleaning mechanism (100). The ring mechanism (400) includes a ring frame (401), and a plurality of evenly distributed cam drive heads (402) are installed on one side of the ring frame (401). A reciprocating drive mechanism (500) is installed on one side of the ultrasonic cleaning mechanism (100). The rotating end of the reciprocating drive mechanism (500) is connected to the rotating mechanism (200). A controller (800) is installed on the reciprocating drive mechanism (500). A spray cleaning mechanism (600) is installed on top of the rotating mechanism (200) and is used to clean the printed circuit board inside the clamping mechanism (300). The drying mechanism (700) is installed on the other side of the ultrasonic cleaning mechanism (100). The air outlet of the drying mechanism (700) is rotatably connected to the air inlet of the rotating mechanism (200). The drying mechanism (700) includes an air heater (701). The air outlet at the top of the air heater (701) is connected to an air outlet component (705).

2. The surface residual liquid cleaning device for printed circuit board processing as described in claim 1, characterized in that: Several transducers (104) are installed on both the front and rear sides of the bottom of the cleaning seat (101). An ultrasonic generator (105) electrically connected to the transducer (104) is installed on the front side of the cleaning seat (101). A support base (106) is connected to the surface of the cleaning seat (101) to support it. A drain pipe (108) is connected to the center of the bottom of the cleaning seat (101). A drain valve (109) is installed at the bottom of the drain pipe (108). Several stirring blades (102) are installed on the surface of the stirring rod (103). A limiting groove (107) for accommodating the circular turntable (204) is opened on the top of the cleaning seat (101).

3. The surface residual liquid cleaning device for printed circuit board processing as described in claim 1, characterized in that: The hollow tube (201) is equipped with a one-way valve (206) at the air inlet end. Several hot air holes (202) are opened on the surface of the hollow tube (201). Several hot air nozzles (207) communicating with the hot air holes (202) are installed on the inner wall of the hollow tube (201). The air outlet end of the air outlet (705) is located inside the air inlet connector (205) and is rotatably connected to its inner wall. The circular turntable (204) is provided with a mounting hole (203). The rotating head (307) is installed inside the mounting hole (203) and is movably connected.

4. The surface residual liquid cleaning device for printed circuit board processing as described in claim 1, characterized in that: The fixed clamp (306) has several support heads (313) fixedly connected to one side, and a clamping head (314) movably connected to the other side. A threaded rod (315) is installed at the center of the clamping head (314), and the threaded rod (315) is threadedly connected to the fixed clamp (306). A limiting slide rod (316) is fixedly connected to the bottom of the inner wall of the clamping frame (301). The movable clamp (312) is movably sleeved on the surface of the limiting slide rod (316). A sliding member (303) is fixedly connected to the rear side of the clamping frame (301). The sliding member (303) is movably connected to the clamping frame (301). A double-ended lead screw (304) is rotatably connected to the top of the inner wall of the clamping frame (301) and the fixed clamp (306). The movable clamp (312) is threaded onto the surface of the double-ended lead screw (304). A large gear (305) is sleeved at the middle end of the surface of the double-ended lead screw (304). A self-locking drive structure (302) for driving the large gear (305) is installed on the rear side of the clamping frame (301).

5. The surface residual liquid cleaning device for printed circuit board processing as described in claim 4, characterized in that: The self-locking drive structure (302) includes a gear housing (3021) installed on the rear side of the clamping frame (301). A small gear (3022) that meshes with a large gear (305) is rotatably connected inside the gear housing (3021). A waterproof self-locking motor (3023) is installed on the surface of the gear housing (3021). The output shaft of the waterproof self-locking motor (3023) is connected to the small gear (3022).

6. The surface residual liquid cleaning device for printed circuit board processing as described in claim 1, characterized in that: A cam (309) is installed on the rotating head (307), and a pressing rod (310) is fixedly connected to the cam (309). A hollow arc frame (308) is movably connected to the surface of the pressing rod (310). The hollow arc frame (308) is installed on the surface of the circular turntable (204). Arc-shaped rubber expansion joints (311) connected to the pressing rod (310) are installed on both the front and rear sides of the inner cavity of the hollow arc frame (308). A spring (317) is provided inside the arc-shaped rubber expansion joint (311).

7. The surface residual liquid cleaning device for printed circuit board processing as described in claim 1, characterized in that: The cam drive head (402) is located on the motion trajectory of the cam (309) and drives the cam (309) to rotate when it comes into contact with the cam (309). The cam drive head (402) is equipped with a reinforcing rib (403) connected to the cam drive head (402). The bottom of the ring frame (401) is provided with a fixing member (404) that is fixedly connected to the surface of the cleaning seat (101).

8. The surface residual liquid cleaning device for printed circuit board processing as described in claim 1, characterized in that: The reciprocating drive mechanism (500) includes a worktable (501), a support frame (513) fixedly connected to the bottom of the worktable (501), the support frame (513) fixedly connected to the surface of the cleaning seat (101), a reducer (511) fixedly connected to the top of the worktable (501), a drive motor (512) fixedly connected to one side of the reducer (511), the output shaft of the drive motor (512) fixedly connected to the input shaft of the reducer (511), an eccentric component (510) fixedly connected to the output shaft of the reducer (511), a movable head (502) rotatably connected to one end of the eccentric component (510), a movable frame (505) movably connected to the surface of the movable head (502), and a sliding seat (503) movably connected to the surface of the movable frame (505) mounted on the top of the worktable (501). The end extends to the left side of the sliding seat (503) and is fixedly connected to a rack (504). The rack (504) is movably connected to the surface of the sliding seat (503). The top of the rack (504) is meshed with a drive gear (508). A drive rod (506) is installed inside the drive gear (508). One end of the drive rod (506) is connected to the hollow tube (201). The other end of the drive rod (506) is rotatably connected to a rotating seat (509). The rotating seat (509) is installed on the sliding seat (503). An active transmission wheel (507) is sleeved on the surface of the drive rod (506). A transmission belt (515) is connected to the surface of the active transmission wheel (507). A driven transmission wheel (514) is connected to the bottom of the inner wall of the transmission belt (515). The driven transmission wheel (514) is sleeved on the stirring rod (103) to drive it.

9. The surface residual liquid cleaning device for printed circuit board processing as described in claim 1, characterized in that: The spray cleaning mechanism (600) includes a spray frame (601), with fixed brackets (605) on both the left and right sides of the spray frame (601) fixedly connected to the surface of the cleaning seat (101). Spray pipes (610) are rotatably connected to both the front and rear sides of the spray frame (601). A stepper motor (608) is fixedly installed on one side of the spray frame (601), and the output shaft of the stepper motor (608) is fixedly connected to the spray pipe (610). Several nozzles (609) are connected to the bottom of the spray pipe (610). The top of the spray frame (601) is connected to a first hose (603) and a second hose (602), the second hose (602) is connected to the first hose (603), the inlet end of the first hose (603) is connected to a delivery pipe (604), the inlet end of the delivery pipe (604) is connected to a liquid pump (607), the liquid pump (607) is used to extract the printed circuit board cleaning liquid, and the surface of the delivery pipe (604) is fitted with a limiting plate (606) installed on the surface of the cleaning seat (101).

10. The surface residual liquid cleaning device for printed circuit board processing as described in claim 1, characterized in that: A temperature sensor (706) is installed on the surface of the air outlet (705). A limiting frame (704) is fitted on the surface of the air heater (701). The limiting frame (704) is installed on the surface of the cleaning seat (101). A bend (703) is connected to the bottom of the limiting frame (704). A fan (702) is connected to the air inlet end of the bend (703). Several electric heating tubes (707) are installed around the inner wall of the air heater (701).

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