一种氧化镓晶圆片的倒角装置及方法
A chamfering device and method for gallium oxide wafers using flexible grinding wheels and optimized grinding processes has solved the problem of cleavage and delamination during the chamfering process, improving product quality, reducing production costs, and expanding high-end applications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU GAREN SEMICON CO LTD
- Filing Date
- 2024-09-13
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional chamfering processes cannot effectively handle the anisotropy of gallium oxide wafers, resulting in uneven grinding, easy cleavage delamination and chipping, and product scrap.
Utilizing flexible grinding wheel materials and optimized grinding processes, combined with vacuum adsorption, arc-shaped groove design, and pressure-controlled feed, grinding is performed by spraying grinding fluid to avoid cleavage and delamination caused by excessive mechanical force. Spherical ultrafine powder materials are used as abrasives.
It effectively reduces the risk of cleavage and delamination during the chamfering process of gallium oxide wafers, improves geometric accuracy and product quality, reduces production costs, and expands high-end application areas.
Smart Images
Figure CN119141375B_ABST