感光树脂组合物、感光干膜及其应用
By improving the sensitizer and photoinitiator system of the photosensitive resin composition, the problem of agglomerate formation was solved, and the photosensitivity and developability were improved. This makes it suitable for the manufacture of high-precision IC substrates and high-end PCBs, thereby improving production yield and efficiency.
CN119148465BActive Publication Date: 2026-07-17HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
- Filing Date
- 2024-08-05
- Publication Date
- 2026-07-17
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Figure CN119148465B_ABST
Abstract
本申请提供了一种感光树脂组合物、感光干膜及其应用，该感光树脂组合物包括碱可溶性树脂、光聚合单体、光引发剂及改性蒽类增感剂。本申请通过将改性蒽类增感剂引入树脂体系中，一方面，所得感光树脂组合物的光敏性能够大幅提升；另一方面，所得感光树脂组合物在分辨率、附着力性能、柔韧性等级，引发剂迁移、显影沉淀等各方面性能相较于相关技术均有所提升，从而适用于制作载板和类载板等高阶PCB，且能兼顾满足长铜柱、mSAP镀厚铜等特殊使用场景性能要求，可显著提升生产良率，显著提高PCB制造、引线框制造、半导体封装、平板显示器领域中的ITO等部件制造时的生产效率，降低生产成本。
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