Metal film thickness measurement method, device, equipment, polishing method and storage medium

CN119153351BActive Publication Date: 2025-02-18HWATSING TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411628961.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-15
Publication Date
2025-02-18
Estimated Expiration
2044-11-15

AI Technical Summary

Technical Problem

During the chemical mechanical polishing process, the working temperature of the film thickness sensor is greatly affected by the ambient temperature, resulting in abnormal signal measurement of metal film thickness, affecting the accuracy of the polishing process.

Method used

The thickness of the metal film is detected by an eddy current sensor, and combined with the measurement of temperature and base value temperature, the thickness compensation value is calculated, and the true thickness of the metal film is determined to eliminate the temperature influence.

Benefits of technology

The accuracy of metal film thickness detection is improved, the impact of temperature changes on measurement results is reduced, and the stability and accuracy of the polishing process is ensured.

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Abstract

The present application discloses a metal film thickness measurement method, device, equipment, polishing method and storage medium. The metal film thickness measurement method includes: detecting the thickness of the metal film on the wafer by an eddy current sensor to obtain a measurement signal output by the eddy current sensor; obtaining a measurement temperature; obtaining a measurement thickness value according to the measurement signal and the base value signal; obtaining a thickness compensation value according to the measurement temperature and the base value temperature; determining the thickness of the metal film according to the measurement thickness value and the thickness compensation value. The present application determines the thickness compensation value for compensating the measurement signal obtained by the eddy current sensor by detecting the measurement temperature and the base value temperature when the thickness of the metal film on the wafer is detected, which can largely eliminate the influence of the working environment temperature on the eddy current sensor, thereby improving the accuracy of metal film thickness detection.
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Citation Information

Patent Citations

  • Method for measuring thickness of metal film in real time

    CN116175396A

  • Metal film thickness online measurement compensation method, film thickness sensor and equipment

    CN116423378A