A method of laser removal of contaminants from a surface of a cleaning element
Patent Information
- Application Number
- CN202411272742.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2044-09-11
AI Technical Summary
这些常用的液体介质流动性较好,涂覆在物体表面时需要设计专门的液膜铺设结构,控制液体层的厚度和均匀性,这增加了工艺的复杂性,而且很难在结构异形件表面进行液膜铺设,减少了清洗件的应用范围
[0025]在本发明实施例中,该激光去除清洗件表面污染物的方法设计合理,其在待清洗件表面均匀涂覆液态凝胶,以在待清洗件表面形成预设厚度的凝胶层,即其利用具有纳米粒子的凝胶层附着在待清洗件表面,一方面,在激光清洗时可利用纳米粒子的分布调整到达至待清洗件表面的激光能量,避免基体高温而烧蚀待清洗件以更好地保护待清洗件;另一方面,凝胶层可吸附清洗掉的污染层以避免污染环境和在清洗件表面的再沉淀,并可在一定程度上隔绝空气,避免金属基体表面被氧化。另外,具有琼脂的凝胶层化学性质稳定,清洗前后均不会污染基体,同时凝胶层的制备工艺可控性高、操作灵活性好。
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Figure CN119158842B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of laser cleaning technology for component surfaces, and specifically relates to a method for removing contaminants from the surface of a component using laser. Background Technology
[0002] With the continuous development of cleaning technology, laser cleaning technology has been widely used in fields such as cultural relic protection, aerospace, automobile manufacturing, and electronics industry due to its significant advantages of high precision and controllability, non-destructiveness, pollution-free operation, ease of automation, and wide range of materials that can be removed. Wet laser cleaning has advantages in reducing thermal damage to the substrate and improving cleaning efficiency, thus it has great research and application value.
[0003] Wet laser cleaning involves applying a liquid medium to the surface of an object during the cleaning process. The explosive force generated by the evaporation of the liquid removes contaminants or impurity layers. Therefore, wet laser cleaning is effective. At the same time, the presence of the liquid provides a temperature buffer environment, which can effectively prevent high-temperature ablation of the substrate, especially for heat-sensitive materials.
[0004] Currently, commonly used liquid media for wet laser cleaning include water, organic solvents, and mixtures of both. These commonly used liquid media have good fluidity, requiring specialized liquid film deposition structures to control the thickness and uniformity of the liquid layer when applied to object surfaces. This increases the complexity of the process and makes it difficult to deposit liquid films on irregularly shaped parts, limiting the range of applications for cleaning. Furthermore, some liquid media are toxic, posing a pollution risk to users and the environment, thus necessitating liquid media recycling and treatment during use. In addition, improper use of liquid media can lead to workpiece corrosion or other chemical damage, posing a potential corrosion risk.
[0005] Therefore, the application scope of wet laser cleaning is currently limited to some extent. Summary of the Invention
[0006] The present invention aims to at least solve one of the technical problems existing in the prior art, and to provide a new technical solution for a method of removing contaminants from the surface of a cleaning part using laser.
[0007] According to one aspect of the present invention, a method for removing contaminants from the surface of a workpiece using laser is provided, comprising the following steps:
[0008] A mixture of agar powder and nano powder was prepared by using a powder mixer to mix them evenly.
[0009] The mixed powder is dissolved in deionized water and then ultrasonically dispersed to obtain a mixed powder dispersion.
[0010] At a first preset temperature, the mixed powder dispersion is stirred for the first time to completely dissolve the agar powder, thereby preparing a mixed solution; wherein, ultrasonic dispersion treatment is continuously performed during the first stirring process;
[0011] The mixed solution is stirred a second time, while the temperature of the mixed solution is reduced from a first preset temperature to a second preset temperature to prepare a liquid gel; wherein, ultrasonic dispersion treatment is continuously performed during the second stirring process;
[0012] The liquid gel is uniformly coated on the surface of the part to be cleaned to form a gel layer of a predetermined thickness on the surface of the part to be cleaned.
[0013] The contaminated layer on the workpiece is cleaned using a laser, and the gel layer is removed after cleaning.
[0014] Optionally, the agar powder includes agarose and agar pectin.
[0015] Optionally, the mass ratio of the agarose to the agar-pectin is (2-5):(5-10).
[0016] Optionally, the nanopowder is a particle with a particle size in the nanometer range, and the material properties of the nanopowder are metal nanoparticles or ceramic nanoparticles;
[0017] The metal nanoparticles are at least one of Fe, Co, and Ni; the ceramic nanoparticles are at least one of VO2 and SiO2.
[0018] Optionally, in the liquid gel, the mass fraction of the agar powder is 5%-10%, and the mass fraction of the metal nanoparticles or ceramic nanoparticles is 1%-5%.
[0019] Optionally, the first preset temperature is 80℃-100℃.
[0020] Optionally, the second preset temperature is 20℃-30℃.
[0021] Optionally, the preset thickness is 1mm-5mm.
[0022] Optionally, the stirring speed for the first stirring is 200 r / min to 800 r / min.
[0023] Optionally, the stirring speed for the second stirring is 50 r / min to 200 r / min.
[0024] One technical advantage of this invention is that:
[0025] In this embodiment of the invention, the method for removing contaminants from the surface of a workpiece using laser is rationally designed. It involves uniformly coating the surface of the workpiece with a liquid gel to form a gel layer of a predetermined thickness. Specifically, the gel layer, containing nanoparticles, adheres to the surface of the workpiece. On one hand, during laser cleaning, the distribution of the nanoparticles can adjust the laser energy reaching the surface of the workpiece, preventing high temperatures from burning the workpiece and thus better protecting it. On the other hand, the gel layer can adsorb the removed contaminants to avoid environmental pollution and re-deposition on the workpiece surface, and can also isolate the metal substrate from air to a certain extent, preventing oxidation. Furthermore, the agar-containing gel layer is chemically stable and will not contaminate the substrate before or after cleaning. Simultaneously, the preparation process of the gel layer is highly controllable and offers good operational flexibility.
[0026] Therefore, compared with traditional dry and wet laser cleaning, this method of removing contaminants from the surface of the part has significant advantages: it is environmentally friendly, protects the part, is easy to operate, and has flexible processes. Attached Figure Description
[0027] Figure 1 This is a schematic flowchart of a method for removing contaminants from the surface of a cleaning component using laser, according to an embodiment of the present invention. Detailed Implementation
[0028] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0029] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0030] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0031] According to one aspect of the invention, see Figure 1A method for removing contaminants from the surface of a part to be cleaned using laser technology is provided, comprising the following steps:
[0032] Step S100: Agar powder and nano powder are mixed evenly using a powder mixer to obtain a mixed powder.
[0033] Step S200: Dissolve the mixed powder in deionized water and perform ultrasonic dispersion treatment to obtain a mixed powder dispersion.
[0034] Step S300: At a first preset temperature, the mixed powder dispersion is stirred for the first time to completely dissolve the agar powder, thereby preparing a mixed solution; wherein, ultrasonic dispersion treatment is continuously performed during the first stirring process.
[0035] Step S400: The mixed solution is stirred for the second time, and the temperature of the mixed solution is reduced from the first preset temperature to the second preset temperature to prepare a liquid gel; wherein, ultrasonic dispersion treatment is continuously performed during the second stirring process.
[0036] Step S500: The liquid gel is uniformly coated on the surface of the part to be cleaned to form a gel layer of a preset thickness on the surface of the part to be cleaned.
[0037] Step S600: Use a laser to clean the contaminated layer on the workpiece to be cleaned, and remove the gel layer after cleaning is completed.
[0038] In this embodiment of the invention, the method for removing contaminants from the surface of a workpiece using laser is rationally designed. It involves uniformly coating the surface of the workpiece with a liquid gel to form a gel layer of a predetermined thickness. Specifically, the gel layer, containing nanoparticles, adheres to the surface of the workpiece. On one hand, during laser cleaning, the distribution of the nanoparticles can adjust the laser energy reaching the surface of the workpiece, preventing high temperatures from burning the workpiece and thus better protecting it. On the other hand, the gel layer can adsorb the removed contaminants to avoid environmental pollution and re-deposition on the workpiece surface, and can also isolate the metal substrate from air to a certain extent, preventing oxidation. Furthermore, the agar-containing gel layer is chemically stable and will not contaminate the substrate before or after cleaning. Simultaneously, the preparation process of the gel layer is highly controllable and offers good operational flexibility.
[0039] Therefore, compared with traditional dry and wet laser cleaning, this method of removing contaminants from the surface of the part has significant advantages: it is environmentally friendly, protects the part, is easy to operate, and has flexible processes.
[0040] Optionally, the agar powder includes agarose and agar pectin. The composition of the agar powder is relatively reasonable, resulting in a more stable chemical structure and better ensuring the stability of the gel layer. Furthermore, the polysaccharide molecules in the agar powder have excellent hydration capabilities, forming hydrogen bonds and van der Waals forces in solution, thus enabling it to effectively absorb water and form a gel. This effectively isolates the agar from air and prevents the clean metal matrix from being oxidized.
[0041] Optionally, the mass ratio of agarose to agaropectin is (2-5):(5-10). This helps to form a stable gel layer and better isolates it from air, effectively preventing the clean metal matrix from being oxidized.
[0042] Optionally, the nanopowder is a particle with a particle size in the nanometer range, and the material properties of the nanopowder are metal nanoparticles or ceramic nanoparticles;
[0043] The metal nanoparticles are at least one of Fe, Co, and Ni; the ceramic nanoparticles are at least one of VO2 and SiO2.
[0044] In the above embodiments, during laser cleaning, the distribution of metal nanoparticles or ceramic nanoparticles can be fully utilized to adjust the laser energy reaching the surface of the part to be cleaned, avoiding the high temperature of the substrate from burning the part to be cleaned, thereby better protecting the part to be cleaned.
[0045] Optionally, in the liquid gel, the mass fraction of the agar powder is 5%-10%, and the mass fraction of the metal nanoparticles or ceramic nanoparticles is 1%-5%.
[0046] In the above embodiments, a stable liquid gel can be formed to facilitate the rapid formation of a gel layer of a preset thickness on the surface of the part to be cleaned, protecting the substrate from ablation during the laser cleaning process. Furthermore, the laser energy can be precisely adjusted using metal nanoparticles or ceramic nanoparticles to further prevent the substrate from ablation during the laser cleaning process.
[0047] Optionally, the first preset temperature is 80℃-100℃. This helps to ensure that the agar powder is completely dissolved.
[0048] Optionally, the second preset temperature is 20℃-30℃. The second preset temperature is reasonably designed so that a stable liquid gel can be prepared during the process of the mixed solution temperature decreasing from the first preset temperature to the second preset temperature.
[0049] Optionally, the preset thickness is 1mm-5mm. This not only mitigates the ablation of the workpiece by laser energy through the nanoparticles in the nanoparticles, increasing the control window of process parameters, but also effectively cools the workpiece, ensuring the laser cleaning effect.
[0050] Optionally, the stirring speed for the first stirring is 200 r / min to 800 r / min. This helps to better ensure the homogeneity of the mixed solution.
[0051] Optionally, the stirring speed for the second stirring is 50 r / min to 200 r / min. This helps to better ensure the uniformity of nanoparticle distribution in the liquid gel.
[0052] In this embodiment of the application, the method for removing contaminants from the surface of a cleaning component using laser has the following advantages:
[0053] Firstly, since the size of the nanoparticles in the nanoparticle powder is similar to the laser wavelength, Mie scattering can improve the distribution of laser energy, increase the uniformity of laser energy density distribution, and avoid substrate ablation caused by excessively high local energy. Furthermore, the nanoparticles can absorb laser energy, further increasing the laser energy level range, mitigating laser energy ablation of the workpiece, and expanding the control window for process parameters.
[0054] Secondly, the gel layer has high humidity, wettability, and adsorption properties, which can cool the parts to be cleaned and adsorb the cleaned contaminants and evaporated gases inside the gel layer, preventing environmental pollution and affecting the health of operators, and protecting the clean surface of the parts being cleaned. In addition, the gel layer has good density and stable chemical properties, which can protect the parts being cleaned to a certain extent without contaminating them.
[0055] Thirdly, the preparation method of the gel layer is simple and flexible, and it is convenient to coat the surface of the part to be cleaned without the need for special coating equipment. Furthermore, the thickness of the gel layer, the type and amount of internal nanoparticle additives are easy to control, and the gel layer is easy to remove without leaving any residue, thus ensuring a good cleaning effect on the surface of the part to be cleaned.
[0056] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.
Claims
1. A method for removing contaminants from the surface of a workpiece using laser, characterized in that, Includes the following steps: Agar powder and nanoparticles are mixed evenly using a powder mixer to obtain a mixed powder; the nanoparticles are particles with a particle size of nanometers, and the material properties of the nanoparticles are metal nanoparticles or ceramic nanoparticles; wherein, the metal nanoparticles are at least one of Fe, Co, and Ni; and the ceramic nanoparticles are at least one of VO2 and SiO2. The mixed powder is dissolved in deionized water and then ultrasonically dispersed to obtain a mixed powder dispersion. At a first preset temperature, the mixed powder dispersion is stirred for the first time to completely dissolve the agar powder, thereby preparing a mixed solution; wherein, ultrasonic dispersion treatment is continuously performed during the first stirring process; The mixed solution is stirred a second time, while the temperature of the mixed solution is reduced from a first preset temperature to a second preset temperature to prepare a liquid gel; wherein, ultrasonic dispersion is continuously performed during the second stirring process; The liquid gel is uniformly coated on the surface of the part to be cleaned to form a gel layer of a predetermined thickness on the surface of the part to be cleaned; in the liquid gel, the mass fraction of the agar powder is 5%-10%, and the mass fraction of the metal nanoparticles or ceramic nanoparticles is 1%-5%; The contaminated layer on the workpiece is cleaned using a laser, and the gel layer is removed after cleaning.
2. The method for removing contaminants from the surface of a workpiece using laser technology according to claim 1, characterized in that, The agar powder includes agarose and agar pectin.
3. The method for removing contaminants from the surface of a workpiece using laser according to claim 2, characterized in that, The mass ratio of agarose to agar-pectin is 2~5:5~10.
4. The method for removing contaminants from the surface of a workpiece using laser according to claim 1, characterized in that, The first preset temperature is 80℃-100℃.
5. The method for removing contaminants from the surface of a workpiece using laser according to claim 1, characterized in that, The second preset temperature is 20℃-30℃.
6. The method for removing contaminants from the surface of a workpiece using laser according to claim 1, characterized in that, The preset thickness is 1mm-5mm.
7. The method for removing contaminants from the surface of a workpiece using laser according to claim 1, characterized in that, The stirring speed for the first stirring is 200 r / min-800 r / min.
8. The method for removing contaminants from the surface of a workpiece using laser according to claim 1, characterized in that, The stirring speed for the second stirring is 50 r / min-200 r / min.
Citation Information
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