Electroforming processing method for gold jewelry

Abstract

The invention belongs to the technical field of electroforming processing, and particularly relates to a gold jewelry electroforming processing method which comprises the following steps: blending a gold electroforming solution formula required in an electroforming process; a required gold jewelry female mold is obtained through processing; gold jewelry electroforming is carried out; the gold jewelry female die is used as a cathode, a large current of 0.1-0.5 A is firstly used for electroforming, a first electroforming layer with a large thickness is obtained, and the electroforming layer is the inner layer of the gold jewelry; carrying out electroforming by using a small current of 0.02-0.05 A, wherein an electroformed layer is an outer layer of the gold jewelry; the gold jewelry is heated at a high temperature, the high-temperature enamel is fused in the surface texture structure of the gold jewelry, and the high-temperature enamel gold jewelry is obtained after cooling; through the electroforming technology, the gold jewelry with high precision and fine surface lines can be manufactured. The surface grain patterns of the gold jewelry are easy to customize and change; the waste of gold materials can be reduced through the electroforming technology, the raw materials can be utilized to the maximum extent by accurately controlling the casting process, and the production and manufacturing cost of the gold jewelry is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of electroforming processing, and in particular relates to a gold jewelry electroforming processing method. Background Art

[0002] Electroforming technology is a precision electrochemical processing and manufacturing technology based on the principle of electrodeposition. This technology has extremely high replication accuracy and can accurately replicate the fine lines on the surface of the master mold. In gold jewelry processing, electroforming technology can produce precision gold jewelry, including complex designs and delicate textures, to ensure the high quality and exquisiteness of the product. Electroforming technology can also reduce the waste of gold materials. During the electroforming process, by precisely controlling the casting process, the raw materials can be utilized to the greatest extent and production costs can be reduced. Electroforming technology also has excellent flexibility. Through the design and processing of the master mold, the styles of gold jewelry can range from simple to complex to meet the needs. Therefore, electroforming technology can provide the advantages of high quality, high efficiency and personalized customization in gold jewelry processing, providing important support for the development and innovation of the jewelry industry;

[0003] In processes such as gold electroforming, it is important to manage and control internal stresses to ensure that the material has good toughness and ductility. Through appropriate process parameters and subsequent heat treatment, the internal structure of the material can be adjusted to reduce compressive stress and improve overall performance. The relationship between current density, hardness and crystal size is complex and variable, and multiple factors need to be considered comprehensively;

[0004] The high-temperature enamel process is to heat the processed gold jewelry to 800℃ to soften the gold, and then melt the inorganic glass material and condense it into the surface texture of the gold jewelry to obtain the high-temperature enamel gold jewelry. The temperature during the electroforming process is usually maintained between 40℃-60℃. Excessive temperature will cause changes in the internal microstructure of the electroformed parts, thereby affecting the hardness of the gold jewelry after the high-temperature melting of the inorganic glass material is completed and the temperature of the gold jewelry drops to room temperature, which greatly reduces the hardness of the gold jewelry. Low hardness will cause damage to the gold jewelry and affect the quality of the gold jewelry.

[0005] During the electroforming process, the current density will affect the internal crystal size of the electroformed part, thereby affecting the hardness of the electroformed part. A high current density will lead to a faster electroforming rate, and the grains of the deposited layer will be larger, which will increase the internal stress of the electroformed part, resulting in unstable grain production, thereby reducing the hardness. A low current density will lead to a low electroforming rate and the grains of the deposited layer may be too fine, which will affect the hardness;

[0006] In order to solve the above problems, this application proposes a gold jewelry electroforming processing method. Summary of the invention

[0007] The purpose of the present invention is to provide a method for electroforming gold jewelry, which has the characteristics of realizing electroforming of gold jewelry and ensuring the quality of gold jewelry after high-temperature enamel process, and solves the problems raised in the above background technology.

[0008] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0009] The present invention is a gold jewelry electroforming processing method, the process steps are:

[0010] S1. Prepare the formula of the gold electroforming liquid required for the electroforming process. Furthermore, the ratio of the gold electroforming liquid will affect the quality of electroformed gold jewelry, and the electroforming liquid needs to be prepared reasonably. During the electroforming process, the temperature of the electroforming liquid needs to be kept constant, and the electroforming liquid needs to be continuously heated. The gold electroforming liquid contains grain refining additives, and the pH value of the electroforming liquid is controlled at the same time;

[0011] S2. The desired gold jewelry master mold is obtained by processing. Further, the electroforming of gold jewelry requires the use of a gold jewelry master mold, and the surface texture of the gold jewelry master mold is the same as the texture of the electroformed gold jewelry;

[0012] S3. Perform electroforming of gold jewelry. Furthermore, the electroforming process has extremely high replication accuracy, so the processing quality of the gold jewelry master mold will directly affect the clarity of the surface texture of the electroformed gold jewelry. After the electroforming is completed, the master mold needs to be removed from the finished gold jewelry, so the wax mold can be used as the gold jewelry master mold. After the gold jewelry is electroformed, a small hole is left. By heating the gold jewelry as a whole, the wax mold is melted and flows out of the small hole, completing the separation of the wax mold;

[0013] S4. The gold jewelry master mold is used as the cathode, and a large current of 0.1A-0.5A is first used for electroforming to obtain a thicker first electroforming layer, which is the inner layer of the gold jewelry;

[0014] S5. Use a small current of 0.02A-0.05A for electroforming. This electroforming layer is the outer layer of gold jewelry. Furthermore, the electroforming process requires the substrate to be conductive. The wax mold can be coated with conductive oil as the substrate, and then used as the cathode for electroforming. The surface of the master mold needs to be kept clean;

[0015] S6. By heating the gold jewelry at high temperature, the high-temperature enamel is melted and condensed in the surface texture structure of the gold jewelry, and the high-temperature enamel gold jewelry is obtained after cooling. Furthermore, the electroforming process of the gold jewelry with high-temperature enamel technology requires that the gold jewelry be heated at high temperature after the electroforming process is completed. The gold jewelry needs to retain the original texture obtained by the electroforming process and soften the gold to melt the inorganic glass material on the gold to obtain enamel. However, the heating temperature required for this process is much higher than the temperature of the electroforming liquid during electroforming, so it will destroy the internal structure of the gold material, resulting in a decrease in the hardness of the gold jewelry, affecting the quality of the gold jewelry, so the step current electroforming method is adopted. After research, it is known that the material with high hardness after electrodeposition, after high-temperature heating and softening and then cooling, the hardness of the material obtained is greatly reduced, while the material with low hardness after electrodeposition, after high-temperature heating and softening and then cooling, the hardness of the material obtained is reduced less. Using a large current of 0.1A-0.5A for electroforming will obtain gold with a larger initial hardness, and using a small current of 0.02A-0.05A for electroforming will obtain gold with a smaller initial hardness. After high-temperature heating and cooling, the hardness of gold obtained by high-current electroforming is lower than that of gold obtained by low-current electroforming, so the following method is used for electroforming of gold jewelry. First, use a high current of 0.1A-0.5A to electroform gold jewelry. This electroformed layer is the inner layer of the finished gold jewelry. Since the inner layer is not in contact with the outside world, the low hardness has little effect on the inner layer. The high current can make the electrodeposition rate faster, thereby obtaining a higher electroforming efficiency. Then, on the basis of this inner layer, only the current size is changed, and it is adjusted to a low current of 0.02A-0.05A for electroforming. This electroformed layer is the outer layer of the finished gold jewelry. After the process of high-temperature heating and cooling, the hardness of the outer layer of the gold jewelry can reach the ideal hardness value.

[0016] Furthermore, the high temperature treatment range of the two-layer electroplating is 800° C.-900° C., and the time is 10 min-60 min.

[0017] The present invention has the following beneficial effects:

[0018] 1. Through electroforming technology, high-precision gold jewelry with fine surface textures can be produced. The surface texture patterns of gold jewelry are easy to customize;

[0019] 2. Due to the high price of gold materials, the material waste rate during processing is an important indicator to measure processing technology. Electroforming technology can reduce the waste of gold materials. By precisely controlling the casting process, it can maximize the use of raw materials and reduce the production cost of gold jewelry;

[0020] 3. The step current electroforming method of the present invention can greatly improve the problem of surface hardness of gold jewelry after heating. First, use a large current of 0.1A-0.5A to electroform the inner layer of the jewelry. The large current can improve the efficiency of electroforming and save time. High current electroforming will produce gold jewelry with a larger initial hardness. After high temperature heating and cooling, the hardness will be much lower than the hardness required for the jewelry, but the hardness of the inner layer of the jewelry has little effect on the quality of the jewelry product. The thickness of the inner layer accounts for about 4 / 5 of the overall thickness. Then, use a small current of 0.02A-0.05A to electroform the outer layer of the jewelry. The small current will produce gold jewelry with a smaller initial hardness. After high temperature heating and cooling, the hardness will meet the hardness requirements of the jewelry. The hardness of the outer layer of the jewelry has a great impact on the quality of the jewelry product. The high hardness of the outer layer can reduce the daily loss and damage of gold jewelry.

[0021] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 This is a schematic diagram of the structure of the layers after gold electroforming of the present invention;

[0024] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0025] In the figure: 1, mother mold; 2, inner layer; 3, outer layer. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0028] See also Figure 1 As shown, the present invention is a gold jewelry electroforming processing method, the method is as follows:

[0029] S1. Prepare the gold electroforming liquid. The specific ratio of the gold electroforming liquid needs to be continuously improved to obtain a better ratio. The electroforming equipment is equipped with a heating pump. During the electroforming process, the temperature of the electroforming liquid is 50°C and the pH value of the electroforming liquid is maintained within the range of 7-7.5. If the pH value changes beyond the range during the electroforming process, a specific solution is used to adjust the pH value of the electroforming liquid;

[0030] S2. Process the master mold required for electroforming of gold jewelry, design the required texture on the surface of gold jewelry, use the wax mold as the master mold 1 of gold jewelry, process the wax mold, and make the surface texture the same as that of gold jewelry, that is, the grooves and protrusions of the gold jewelry texture are exactly the same as the grooves and protrusions of the wax mold surface texture. Apply conductive oil on the surface of the wax mold. The wax mold serves as the cathode during the electroforming process, and the anode is equipped with gold balls to replenish the gold ions in the electroforming liquid. A small hole is left after the electroforming of the gold jewelry is completed. By heating the gold jewelry as a whole, the wax mold is melted and flows out of the small hole, completing the separation of the wax mold;

[0031] S3. After the electroforming preparation stage is completed, step current electroforming is performed. High current electroforming will obtain a gold jewelry layer with a higher initial hardness, and low current electroforming will obtain a gold jewelry layer with a lower initial hardness. First, adjust the power supply current to 0.2A. This stage is the high current electroforming stage, which is used to electroform the inner layer 2 of the gold jewelry. The electroforming thickness at this stage is 800μm, and the initial hardness of the inner layer 2 is about 150HV. The efficiency of high current electroforming will be much higher than that of low current electroforming. Then adjust the power supply current to 0.02A. This stage is the low current electroforming stage, which is used to electroform the outer layer 3 of the gold jewelry. The electroforming thickness at this stage is 200μm, and the initial hardness of the outer layer 3 is about 100HV. After the gold jewelry is processed, it is heated to 800℃ to soften the gold, and then the inorganic glass material is melted and condensed into the surface texture of the gold jewelry to obtain high temperature enamel gold jewelry. Then stop heating the gold jewelry and cool it to room temperature to obtain high-temperature enamel gold jewelry with a hardness of about 30HV for the inner layer 2 and about 70HV-80HV for the outer layer 3. The inner layer 2 has little contact with the outside world, so the low hardness of the inner layer 2 has little effect on the quality of the gold jewelry. The outer layer 3 is in contact with the outside world for a long time, so it needs to have a higher hardness to prevent damage to the gold jewelry due to friction and collision. This step current electroforming processing method will obtain the outer layer 3 of the gold jewelry with a hardness that meets the requirements. The use of a large current to process the inner layer 2 can improve the overall processing efficiency of the gold jewelry, and the use of a small current to process the outer layer 3 can increase the hardness of the outer layer 3 after high-temperature heating and cooling to meet the use requirements.

[0032] A specific application of this embodiment is:

[0033] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0034] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A gold jewelry electroforming processing method, characterized in that: The process steps are: S1. Prepare the gold electroforming liquid formula required for the electroforming process; S2. Obtain the required gold jewelry master mold through processing; S3. Conduct electroforming of gold jewellery; S4. The gold jewelry master mold is used as the cathode, and a large current of 0.1A-0.5A is first used for electroforming to obtain a thicker first electroforming layer, which is the inner layer of the gold jewelry; S5. Use a small current of 0.02A-0.05A for electroforming. This electroformed layer is the outer layer of the gold jewelry. S6. By heating the gold jewelry at high temperature, the high-temperature enamel is melted and solidified in the surface texture structure of the gold jewelry, and the high-temperature enamel gold jewelry is obtained after cooling.

2. A gold jewelry electroforming processing method according to claim 1, characterized in that: The gold electroforming liquid in S1 contains a grain refining additive. The electroforming liquid needs to be continuously heated and kept at a constant temperature during electroforming, and the pH value of the electroforming liquid needs to be controlled at the same time.

3. The gold jewelry electroforming processing method according to claim 1, characterized in that: The gold jewelry master mold in S2 is demoulded from the gold jewelry finished product after the electroforming is completed.

4. The gold jewelry electroforming processing method according to claim 1, characterized in that: In S3 and S4, the gold jewelry is first electroformed using a current of 0.1A-0.5A, and this electroformed layer is the inner layer of the finished gold jewelry. Then, based on this inner layer, the current is adjusted to 0.02A-0.05A for electroforming, and this electroformed layer is the outer layer of the finished gold jewelry.

5. The gold jewelry electroforming processing method according to claim 4, characterized in that: The electroplating thickness of the outer layer of the gold jewelry is greater than the electroplating thickness of the inner layer of the gold jewelry.

6. The gold jewelry electroforming processing method according to claim 1, characterized in that: The thickness of the inner layer and the outer layer of the gold jewelry are formed into plating layers of different thicknesses by adjusting the current density.

7. A gold jewelry electroforming processing method according to claim 6, characterized in that: The outer layer is located on the outermost part of the finished product, and the inner layer is located between the gold jewelry master mold and the outer layer.

8. The gold jewelry electroforming method according to claim 1, characterized in that: The high temperature treatment range of the two-layer electroplating is 800° C.-900° C., and the time is 10 min-60 min.

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