Wafer vertical defect detection device

CN119164352APending Publication Date: 2024-12-20SHENGJISHENG PRECISION EQUIP (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202411306040.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-19
Publication Date
2024-12-20

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Abstract

The invention relates to a wafer vertical defect detection device. The wafer vertical defect detection device comprises an equipment framework, a wafer detection assembly and a wafer bearing and overturning assembly. The wafer detection assembly comprises a straightness retesting device and a detection guide driving part, and the detection guide driving part is used for driving the straightness retesting device to perform vertical reciprocating motion detection on a wafer; the wafer bearing and overturning assembly comprises a wafer bearing adsorption frame and overturning guide driving parts, and the overturning guide driving parts are in linkage with each other and drive the wafer bearing adsorption frame to complete switching between a wafer horizontal feeding state and a vertical detection state and between a front face detection state and a back face detection state and drive the wafer to conduct horizontal reciprocating motion detection. Automatic detection of defects on the front and back surfaces of the wafer is realized, so that the detection efficiency is improved; meanwhile, wafer vertical state detection is adopted, so that interference factors caused by middle concave due to gravity in a wafer horizontal detection state are eliminated, and the accuracy of a detection result is ensured.
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Citation Information

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