Driver components, camera modules and multi-camera camera modules

Abstract

A driving component, a camera module, and a multi-camera camera module are disclosed. In the latter, the photosensitive component of the camera module is eccentrically positioned relative to the center of the driving component used to drive the photosensitive component. This makes one side of the photosensitive chip of the photosensitive component closer to the edge of the mobile electronic device, thereby meeting the shape and functional requirements of the mobile electronic device. For example, it makes the screen opening of the mobile electronic device corresponding to the camera module closer to the edge of the mobile electronic device, thus making the screen of the mobile electronic device more complete.

Description

Technical Field

[0001] This application relates to the field of camera modules, and more particularly to a driving component, a camera module, and a multi-camera camera module. Background Technology

[0002] With the widespread adoption of mobile electronic devices, the technologies related to camera modules used in these devices to help users capture images have developed and progressed rapidly. Currently, consumers in the market have increasingly higher and more diverse functional requirements for camera modules configured in mobile electronic devices (e.g., smartphones), such as image stabilization.

[0003] When using mobile electronic devices for video recording, the physiological tremors that occur at a certain frequency under normal circumstances and the shaking caused by movement can lead to a decrease in video quality. Therefore, mobile electronic devices are usually equipped with image stabilization motors to drive the optical lens and / or image sensor to move and achieve image stabilization.

[0004] As the requirements for image quality in camera modules become increasingly demanding, the size and weight of optical lenses are also increasing, placing greater demands on the driving force of image stabilization motors. However, current mobile electronic devices also face significant size constraints on camera modules, meaning the space occupied by the image stabilization motor increases accordingly with the lens size. In other words, while optical lenses are trending towards larger and heavier designs, the driving force provided by the image stabilization motor cannot be increased accordingly.

[0005] Given limited driving force, the heavier the lens, the shorter the distance the image stabilization motor can travel to move the optical lens, thus affecting image stabilization capabilities. On the other hand, the heavier the optical lens, the slower the image stabilization motor can move it, and the longer it takes for the optical lens to reach the predetermined compensation position, which also affects the image stabilization effect.

[0006] To overcome the above-mentioned defects, the applicant proposes a driving component that achieves optical image stabilization by driving the movement of a photosensitive chip. Summary of the Invention

[0007] One advantage of this application is that it provides a driving component, a camera module, and a multi-camera camera module. The driving component can achieve optical image stabilization by driving the photosensitive chip to move, thereby meeting the requirements of optical image stabilization for driving stroke and driving speed. The camera module meets the application requirements of mobile electronic devices by reasonably designing the positional relationship between the driving component and the photosensitive component.

[0008] One advantage of this application is that it provides a driving component, a camera module, and a multi-camera camera module. The driving component can achieve optical image stabilization by driving the photosensitive chip to move, thereby meeting the requirements of optical image stabilization for driving stroke and driving speed. Furthermore, the camera module enables different magnetic elements to play different roles through the reasonable arrangement of magnetic elements in its driving component.

[0009] Another advantage of this application is that it provides a driving component, a camera module, and a multi-camera camera module, wherein the photosensitive component of the camera module is set off-center relative to the center of the driving component, so that one side of the photosensitive chip of the photosensitive component is closer to the edge of the mobile electronic device, in order to meet the shape and functional requirements of the mobile electronic device. For example, it makes the screen opening of the mobile electronic device corresponding to the camera module closer to the edge of the mobile electronic device, thereby making the screen of the mobile electronic device more complete.

[0010] Other advantages and features of this application will become apparent from the following description and can be realized by means and combinations particularly pointed out in the claims.

[0011] To achieve at least one of the above advantages, according to one aspect of this application, this application provides a driving component comprising:

[0012] Chip stabilization fixing part with a receiving cavity;

[0013] A chip image stabilization movable part is movably housed within the housing cavity, the chip image stabilization movable part including a chip movable carrier adapted to mount a photosensitive component thereon, the photosensitive component having a first central axis; and

[0014] A chip driving element for moving a movable chip carrier relative to a fixed chip portion within the receiving cavity to drive the chip anti-shake movable portion of the chip.

[0015] The drive assembly has a second central axis, and the first central axis is offset from the second central axis.

[0016] In the driving assembly according to this application, the photosensitive assembly includes a photosensitive chip, the central axis of which is a first central axis of the photosensitive assembly.

[0017] In the driving component according to this application, the photosensitive component includes a photosensitive chip, which is disposed off-center relative to the center of the driving component.

[0018] In the driving assembly according to this application, the photosensitive component is adapted to be mounted on the chip movable carrier, wherein the chip anti-shake fixing part includes a top cover and a base that snap together to form the receiving cavity, and there is a gap between the chip movable carrier and the base.

[0019] In the driving assembly according to this application, the driving assembly further includes a chip holding assembly, the chip holding assembly including at least one chip magnetic element enclosed within the movable chip carrier, wherein the chip driving element includes a chip coil assembly disposed on the movable chip carrier, and a chip magnet assembly fixed to the upper cover and corresponding to the chip coil assembly, so that the movable chip carrier is suspended in the receiving cavity of the chip anti-shake fixing part by the magnetic attraction between the chip magnet assembly and the at least one chip magnetic element.

[0020] In the driving assembly according to this application, the chip coil assembly includes at least one chip coil, and the driving assembly further includes a chip anti-shake conductive portion, the chip anti-shake conductive portion including at least one coil conductive element encased within the chip anti-shake movable carrier, each of the coil conductive elements having an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end, wherein at least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is adapted to be electrically connected to the circuit board of the photosensitive component.

[0021] In the driving assembly according to this application, the chip coil assembly further includes a coil circuit board disposed on the movable carrier of the chip, the at least one chip coil being fixed and electrically connected to the coil circuit board, and the coil circuit board being electrically connected to the conductive end of the first coil.

[0022] In the driving assembly according to this application, the chip holding assembly further includes a chip support assembly disposed between the chip movable carrier and the upper cover. The chip support assembly includes a ball groove recessed in the chip movable carrier and a ball disposed in the ball groove, wherein the ball is held between the upper cover and the chip movable carrier by magnetic attraction between the at least one chip magnetic element and the chip magnet assembly.

[0023] In the driving assembly according to this application, the chip support assembly further includes a ball support piece embedded in the movable chip carrier and located at the bottom of the ball groove, wherein the ball is supported on the ball support piece.

[0024] In the drive assembly according to this application, the coil conductive element and the ball support sheet are not magnetic, while the chip magnetic element is magnetic.

[0025] In the drive assembly according to this application, the coil conductive element, the ball bearing support sheet, and the chip magnetic element are integrally formed with the chip movable carrier by injection molding.

[0026] In the driving assembly according to this application, the chip driving element includes a chip coil assembly disposed on the chip movable carrier, and a chip magnet assembly fixed to the upper cover and corresponding to the chip coil assembly, wherein the chip coil assembly includes at least one chip coil group, and at least one side of the chip movable carrier is not provided with the chip coil group.

[0027] In the driving assembly according to this application, the movable chip carrier includes a first side, a second side, a third side, and a fourth side that surround each other, the first side being opposite to the third side, the second side being opposite to the fourth side, wherein the chip coil assembly includes a first chip coil group disposed on the first side, and a second chip coil group and a third chip coil group disposed on the opposite second side and the fourth side.

[0028] In the driving assembly according to this application, the distance between the first central axis of the photosensitive chip and the third side of the movable chip carrier is less than the distance between the first central axis of the photosensitive chip and the first side of the movable chip carrier.

[0029] In the driving component according to this application, the first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, wherein the Y-axis direction is perpendicular to the X-axis direction, wherein the first chip coil group includes a first chip coil and a second chip coil disposed on the first side, the second chip coil group includes a third chip coil disposed on the second side, and the third chip coil group includes a fourth chip coil disposed on the fourth side.

[0030] In the driving assembly according to this application, the first chip coil and the second chip coil are arranged relatively parallel along the X-axis direction, and the third chip coil and the fourth chip coil are arranged relatively parallel along the Y-axis direction.

[0031] According to one aspect of this application, a driving component is provided, comprising:

[0032] Chip stabilization fixing part with a receiving cavity;

[0033] A chip stabilization movable part is movably housed within the housing cavity, and the chip stabilization movable part is adapted to mount a photosensitive component thereon;

[0034] A chip driving element for driving the chip anti-shake movable part to move relative to the chip fixed part within the receiving cavity;

[0035] A chip support assembly includes at least three support components clamped between the chip stabilization movable portion and the chip stabilization fixed portion, the at least three support components being arranged in a partially collinear manner; and

[0036] The chip magnetic attraction assembly includes a first chip magnetic attraction element and a second chip magnetic attraction element disposed on the chip anti-shake movable part, wherein the first chip magnetic attraction element is adjacent to the first support component among the at least three support components, and the distance between the second chip magnetic attraction element and any one of the at least three support components is greater than the distance between the first chip magnetic attraction element and the first support component.

[0037] In the driving assembly according to this application, the chip stabilization movable part includes a chip movable carrier, and the photosensitive component is adapted to be mounted on the chip movable carrier.

[0038] In the driving component according to this application, the movable chip carrier includes a first side, a second side, a third side, and a fourth side that surround each other, the first side being opposite to the third side, and the second side being opposite to the fourth side. The chip support component includes a first support component, a second support component, and a third support component. The first support component is disposed on the first side of the movable chip carrier, the second support component and the third support component are disposed in two corner regions of the third side of the movable chip carrier opposite to the first side, and the first support component is disposed in the middle region of the first side.

[0039] In the driving assembly according to this application, the chip magnetic accommodating assembly includes a pair of first chip magnetic accommodating elements, the pair of first chip magnetic accommodating elements being disposed on opposite sides of the first support assembly, wherein the chip magnetic accommodating assembly includes a pair of second chip magnetic accommodating elements, one second chip magnetic accommodating element being disposed in the middle region of the second side, and the other second chip magnetic accommodating element being disposed in the middle region of the fourth side.

[0040] In the driving assembly according to this application, the size of the first chip magnetic element is larger than the size of the second chip magnetic element.

[0041] In the driving assembly according to this application, the chip magnetic attraction assembly further includes a pair of third chip magnetic attraction elements, one of the third chip magnetic attraction elements being adjacent to the second support assembly, and the other of the third magnetic attraction elements being adjacent to the third support assembly.

[0042] In the driving assembly according to this application, a pair of first chip magnetic elements, a pair of second chip magnetic elements and a pair of third chip magnetic elements are covered by the chip movable carrier.

[0043] In the drive assembly according to this application, each of the first support assembly, the second support assembly, and the third support assembly includes a ball groove recessed in the movable carrier of the chip and a ball disposed in the ball groove, the ball protruding from the ball groove.

[0044] In the drive assembly according to this application, the movable chip carrier further includes three extended pillars protruding from the upper surface of the chip carrier body, and ball grooves recessed into the upper surface of each of the extended pillars.

[0045] In the drive assembly according to this application, each of the support assemblies further includes a ball support piece embedded in the movable carrier of the chip and located at the bottom of the ball groove, wherein the ball is supported on the ball support piece.

[0046] In the driving assembly according to this application, the chip driving element includes a chip coil assembly disposed on the chip movable carrier, and a chip magnet assembly fixed to the chip anti-shake fixing part and corresponding to the chip coil assembly, wherein the chip magnet assembly includes a pair of first chip magnets respectively corresponding to a pair of first chip magnetic attraction elements and a pair of second chip magnets respectively corresponding to a pair of second chip magnetic attraction elements.

[0047] In the driving assembly according to this application, the chip coil assembly includes at least one chip coil group, and at least one side of the chip movable carrier is not provided with the chip coil group, wherein the chip coil assembly includes a first chip coil group provided on the first side, and a second chip coil group and a third chip coil group provided on the opposite second side and the fourth side.

[0048] In the driving assembly according to this application, the driving assembly further includes a chip anti-shake conductive portion, the chip anti-shake conductive portion including at least one coil conductive element encased within the chip anti-shake movable carrier, each of the coil conductive elements having an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end, wherein at least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is adapted to be electrically connected to the circuit board of the photosensitive component.

[0049] In the driving assembly according to this application, the chip coil assembly further includes a coil circuit board disposed on the movable carrier of the chip, the first chip coil group, the second chip coil group and the third chip coil group are fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the conductive end of the first coil.

[0050] In the drive assembly according to this application, the coil conductive element and the ball support sheet are not magnetic, while the chip magnetic element is magnetic.

[0051] In the drive assembly according to this application, the coil conductive element, the ball bearing support sheet and the chip magnetic element are integrally formed with the chip movable carrier by injection molding process.

[0052] According to another aspect of this application, a camera module is also provided, which includes: the driving component as described above.

[0053] According to another aspect of this application, this application also provides a multi-camera module, which includes:

[0054] The first camera module; and

[0055] Second camera module;

[0056] Wherein, at least one of the first camera module and the second camera module includes the driving component as described above.

[0057] In the multi-camera module according to this application, no chip driving element is provided on the first side of the driving component of the first camera module, and no chip driving element is provided on the second side of the driving component of the second camera module, wherein the first side of the driving component of the first camera module and the second side of the driving component of the second camera module are adjacent to each other.

[0058] The further objectives and advantages of this application will become fully apparent from the following description and accompanying drawings.

[0059] These and other objects, features and advantages of this application are fully apparent from the following detailed description, the accompanying drawings and the claims. Attached Figure Description

[0060] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0061] Figure 1A The illustration shows an application diagram of a single-camera module according to an embodiment of this application.

[0062] Figure 1B The illustration shows an application diagram of a multi-camera module according to an embodiment of this application.

[0063] Figure 2 The figure shows a schematic diagram of the structure of a camera module according to an embodiment of this application.

[0064] Figure 3 The figure shows a partial structural schematic diagram of a camera module according to an embodiment of this application.

[0065] Figure 4 The illustration shows a partial exploded view of a camera module according to an embodiment of this application.

[0066] Figure 5 The illustration shows another partial structural diagram of a camera module according to an embodiment of this application.

[0067] Figure 6 The figure shows a partial structural schematic diagram of the driving component of a camera module according to an embodiment of the present application.

[0068] Figure 7 The illustration shows another partial structural schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0069] Figure 8 The illustration shows another partial exploded view of a camera module according to an embodiment of this application.

[0070] Figure 9 The illustration shows another partial structural schematic diagram of the driving component of a camera module according to an embodiment of this application.

[0071] Figure 10 The illustration shows another partial schematic diagram of the driving components of a camera module according to an embodiment of the present application.

[0072] Figure 11The figure shows a partial disassembly diagram of the driving component of a camera module according to an embodiment of the present application.

[0073] Figure 12 The illustration shows another partial structural schematic diagram of a camera module according to an embodiment of this application.

[0074] Figure 13A The illustration shows another partial structural schematic diagram of the driving component of a camera module according to an embodiment of this application.

[0075] Figure 13B The illustration shows another partial structural schematic diagram of the driving component of a camera module according to an embodiment of this application.

[0076] Figure 14A The figure shows a structural stress analysis diagram of the driving component of a camera module according to an embodiment of this application.

[0077] Figure 14B The figure shows another structural force analysis diagram of the driving component of the camera module according to an embodiment of this application.

[0078] Figure 14C The figure shows another structural stress analysis diagram of the driving component of the camera module according to an embodiment of the present application.

[0079] Figure 15 The figure shows a partial structural schematic diagram of the driving component of a multi-camera module according to an embodiment of the present application.

[0080] Figure 16 The figure shows a schematic diagram of the structure of a multi-camera module according to an embodiment of this application.

[0081] Figure 17 The illustration shows a partial exploded view of a camera module according to an embodiment of this application.

[0082] Figure 18 The illustration shows another partial structural diagram of a camera module according to an embodiment of this application.

[0083] Figure 19 The illustration shows another partial exploded view of a camera module according to an embodiment of this application.

[0084] Figure 20 The illustration shows another partial structural schematic diagram of the driving component of a camera module according to an embodiment of this application.

[0085] Figure 21 The figure shows a partial disassembly diagram of the driving component of a camera module according to an embodiment of the present application.

[0086] Figure 22 The illustration shows another partial structural diagram of a camera module according to an embodiment of this application.

[0087] Figure 23 The illustration shows another partial structural schematic diagram of the driving component of a camera module according to an embodiment of this application.

[0088] Figure 24 The figure shows a structural stress analysis diagram of the driving component of a camera module according to an embodiment of this application.

[0089] Figure 25 The figure shows another structural force analysis diagram of the driving component of the camera module according to an embodiment of this application.

[0090] Figure 26 The figure shows another structural stress analysis diagram of the driving component of the camera module according to an embodiment of the present application.

[0091] Figure 27 The figure shows a partial structural schematic diagram of the driving component of a multi-camera module according to an embodiment of the present application. Detailed Implementation

[0092] Hereinafter, exemplary embodiments according to this application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein.

[0093] Exemplary electronic devices

[0094] like Figure 1A and Figure 1B As shown, this application provides a mobile electronic device equipped with at least one camera module 1 and a camera module 1 applicable to the mobile electronic device. The camera module 1 has optical focusing and / or optical image stabilization functions, enabling it to capture clearer images. The number and specific installation position of the camera modules 1 are not limited by this application. For example, in one embodiment of this application, the mobile electronic device is equipped with one camera module 1; in another embodiment, the mobile electronic device is equipped with multiple (two or more) camera modules 1. The camera module 1 can be disposed on the front of the mobile electronic device as a front-facing camera module 1, or it can be disposed on the back of the mobile electronic device as a rear-facing camera module 1.

[0095] In one embodiment of this application, when the mobile electronic device has only one camera module 1 on the front and / or back, the optical lens 10 and the photosensitive chip 42 of the camera module 1 are eccentrically arranged in the camera module 1 so that the camera module 1 is in an eccentric state. This arrangement makes the optical lens 10 and the photosensitive chip 42 of the camera module 1 closer to one side of the mobile electronic device, and thus the screen opening of the mobile electronic device is closer to one side of the mobile electronic device, such as the top side, left side or right side.

[0096] In another embodiment of this application, when two camera modules 1 are arranged on the front and / or back of the mobile electronic device, the two optical lenses 10 and two photosensitive chips 42 of the two camera modules 1 are eccentrically arranged in the dual-camera module so that the two optical lenses 10 of the dual-camera module are as close as possible to enhance optical function. The two camera modules 1 may have the same structure or different structures, and this application does not limit this.

[0097] In summary, this application provides a camera module 1 with an off-center optical lens 10 and image sensor 42, combined with a drive motor to move the optical lens 10 and / or image sensor 42. This satisfies the structural design requirements of mobile electronic devices while enhancing optical performance, enabling the camera module 1 to achieve optical focusing and / or optical image stabilization. The camera module 1 proposed in this application will now be described in detail with reference to the accompanying drawings.

[0098] Exemplary camera module

[0099] like Figure 2 As shown, a camera module 1 according to an embodiment of this application is illustrated. The camera module 1 includes a photosensitive component 40, an optical lens 10 held on the photosensitive path of the photosensitive component 40, and a driving component for driving the optical lens 10 and / or the photosensitive component 40 to move in order to achieve optical performance adjustment, such as optical image stabilization, optical focusing, etc.

[0100] Accordingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11. The lens group 12 includes at least one optical lens, and the number of the at least one optical lens can be one or more, without limitation.

[0101] The driving assembly includes a chip drive motor 30, which is adapted to drive the photosensitive component 40 to translate and / or rotate, thereby realizing the chip-based image stabilization function of the camera module 1. The chip drive motor 30 includes a chip stabilization fixing part 31, a chip stabilization movable part 33, a chip drive element 32, and a chip drive conductive part (i.e., a chip stabilization conductive part 35). The chip stabilization fixing part 31 has a receiving cavity to accommodate the chip stabilization movable part 33, the chip drive element 32, and the chip stabilization conductive part 35. The chip stabilization conductive part 35 provides current to the chip drive element 32, which drives the chip stabilization movable part 33 to move relative to the chip stabilization fixing part 31. The photosensitive component 40 is fixed to the chip stabilization movable part 33, thereby the chip drive element 32 drives the photosensitive component 40 to move relative to the chip stabilization fixing part 31.

[0102] The driving assembly further includes a lens drive motor 20, which is adapted to drive the optical lens 10 to translate and / or rotate, thereby realizing the lens focusing, lens stabilization, and other functions of the camera module 1. The lens drive motor 20 includes a lens drive fixed part, a lens drive movable part, a lens drive element, and a lens drive conductive part. The lens drive fixed part has a receiving cavity to accommodate the lens drive movable part, the lens drive element, and the lens drive conductive part. The lens drive conductive part provides driving power to the lens drive element, and the lens drive element is used to drive the lens drive movable part to move relative to the lens drive fixed part. The optical lens 10 is fixed to the lens drive movable part, so that the lens drive element drives the optical lens 10 to move relative to the lens drive fixed part. For example, driving the optical lens 10 to move along its optical axis to achieve lens focusing; or driving the optical lens 10 to translate in a direction perpendicular to its optical axis or driving the optical lens 10 to rotate about a direction perpendicular to its optical axis to achieve lens stabilization. The lens drive motor 20 fixes the lens drive fixing part to the chip image stabilization fixing part 31 of the chip drive motor 30, thereby placing the optical lens 10 on the light-sensing path of the photosensitive component 40.

[0103] In one embodiment of this application, the camera module 1 does not have a lens drive motor 20. The optical lens 10 is directly mounted on the chip stabilization fixing part 31 of the chip drive motor 30, or the optical lens 10 is indirectly mounted on the chip stabilization fixing part 31 of the chip drive motor 30 through a support member, so that the optical lens 10 is positioned on the light-sensing path of the photosensitive component 40.

[0104] like Figure 2As shown, the photosensitive component 40 includes a circuit board 41, a photosensitive chip 42 electrically connected to the circuit board 41, and electronic components 43. The photosensitive chip 42 is used to receive external light collected by the optical lens 10 to form an image and is electrically connected to an external mobile electronic device through the circuit board 41. In one embodiment of this application, the electronic component 43 can be one or more of passive electronic devices such as resistors and capacitors, and active electronic devices such as driver chips and memory chips. The electronic component 43 can be electrically connected to the front or back of the circuit board 41, depending on the design requirements of the camera module 1.

[0105] The photosensitive chip 42 is directly or indirectly fixed to the circuit board 41. The photosensitive chip 42 includes a photosensitive area and a non-photosensitive area. The photosensitive chip 42 is electrically connected to the circuit board 41 through chip pads located in the non-photosensitive area. For example, the photosensitive chip 42 can be electrically connected to the circuit board 41 by wire bonding (gold wire bonding), soldering, FC process (flip chip) or RDL (rerouting layer technology).

[0106] In one embodiment of this application, the circuit board 41 includes a circuit board body 411 and a connecting strip 412. The connecting strip 412 connects to and electrically connects the circuit board body 411, thereby transmitting the imaging information acquired by the photosensitive chip 42 to an external mobile electronic device through the circuit board body 411 and the connecting strip 412.

[0107] In one specific embodiment of this application, the connecting strip 412 includes a first connecting strip 4121 and a second connecting strip 4122. The first connecting strip 4121 and the second connecting strip 4122 extend outward from opposite sides of the circuit board body 411, and further bend upward and sideways, so that the first connecting strip 4121 and the second connecting strip 4122 are electrically connected. This arrangement allows the circuit board body 411 to remain stable during movement, further reducing the resistance when driving the circuit board 41 to move. Of course, in another specific example of this application, the first connecting strip 4121 and the second connecting strip 4122 can extend outward from adjacent sides of the circuit board body 411 and bend upward; this application does not limit this.

[0108] The photosensitive assembly 40 further includes a filter element 44, which is held in the photosensitive path of the photosensitive chip 42 to filter the imaging light entering the photosensitive chip 42. In a specific example, the filter element 44 is mounted and fixed to the base 45 of the photosensitive assembly 40 and corresponds to at least a portion of the photosensitive area of ​​the photosensitive chip 42. The filter element 44 can be attached upright or upside down to the base 45, which has a light-transmitting hole, so that the light from the optical lens 10 can pass through the light-transmitting hole of the base 45 and enter the photosensitive chip 42.

[0109] The photosensitive component 40 can be fixed to the chip anti-shake movable part 33 of the chip drive motor 30 through the circuit board 41 (the circuit board body 411) or the base 45, so that the photosensitive component 40 moves with the movement of the chip anti-shake movable part 33.

[0110] Exemplary chip-driven motor

[0111] Figure 3 Figure 13 illustrates one embodiment of the chip drive motor 30 of this application. The chip drive motor 30 includes a chip anti-shake fixing part 31, a chip anti-shake movable part 33, a chip drive element 32, and a chip anti-shake conductive part 35.

[0112] The chip driving element 32 is disposed between the chip stabilization movable part 33 and the chip stabilization fixed part 31, respectively connecting the chip stabilization movable part 33 and the chip stabilization fixed part 31. The chip stabilization conductive part 35 is electrically connected to the chip driving element 32 and the photosensitive component 40, and provides driving power to the chip driving element 32 to drive the chip stabilization movable part 33 to translate in the X-axis direction (i.e., the direction set by the X-axis) and the Y-axis direction (i.e., the direction set by the Y-axis) and / or rotate around the Z-axis direction (i.e., the direction set by the Z-axis), so as to realize translational stabilization and / or rotational stabilization of the photosensitive component 40. It is worth mentioning that, in this embodiment, the X-axis direction and the Y-axis direction are perpendicular to each other, and the Z-axis direction is perpendicular to the plane containing the X-axis direction and the Y-axis direction. The Z-axis direction is also the direction of the optical axis of the optical lens 10. In other words, the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system, and the XOY plane containing the X-axis direction and the Y-axis direction is also called the plane containing the horizontal direction.

[0113] like Figures 3 to 4As shown, in one embodiment of this application, the chip stabilization fixing part 31 includes an upper cover 311 and a base 312 that are interlocked to form the receiving cavity. The upper cover 311 and the base 312 are fixed to each other and form a receiving cavity (i.e., the receiving cavity of the chip stabilization fixing part 31) to accommodate the chip stabilization movable part 33, the chip driving element 32, the chip stabilization conductive part 35, and the photosensitive component 40, etc., which not only protects the above-mentioned camera module components, but also reduces the entry of dust, dirt, or stray light into the interior of the chip driving motor 30. In a specific example of this application, the upper cover 311 and the base 312 can be made of metal materials such as non-magnetic stainless steel.

[0114] Specifically, in this embodiment, the upper cover 311 is disposed above the substrate 312. The upper cover 311 includes a cover body 3111 with a central opening, the opening corresponding to the photosensitive component 40, so that light can enter the photosensitive component 40 through the opening for imaging. Preferably, the opening is circular. Further, the upper cover 311 may also include a cover periphery 3112 extending integrally from the cover body 3111 toward the substrate 312, thereby being fixedly connected to the substrate 312 by the cover periphery 3112, for example, by laser welding or adhesive bonding. The cover periphery 3112 also includes at least one peripheral recess 31121, so that at least one connecting strip 412 outlet is formed between the upper cover 311 and the substrate 312, allowing the connecting strip 412 of the circuit board 41 to extend outward from the receiving cavity of the chip anti-shake fixing part 31. In a specific example of this application, the peripheral side 3112 of the cover includes two opposing peripheral recesses 31121, and two connecting strip outlets 412 are formed between the upper cover 311 and the base 312 to allow the first connecting strip 4121 and the second connecting strip 4122 of the circuit board 41 to extend outward from the receiving cavity of the chip anti-shake fixing part 31.

[0115] In this embodiment, the movable chip stabilization part 33 is movably housed within the receiving cavity of the fixed chip stabilization part 31. Specifically, the movable chip stabilization part 33 is suspended or suspended within the receiving cavity of the fixed chip stabilization part 31, so that the movable chip stabilization part 33 can move relative to the fixed chip stabilization part 31.

[0116] like Figures 4 to 6As shown, the chip stabilization movable part 33 includes a chip movable carrier 331 having opposing upper and lower surfaces. A chip driving element 32 is disposed between the chip movable carrier 331 and the upper cover 311, and the chip driving element 32 drives the chip movable carrier 331 to move relative to the chip stabilization fixing part 31. The chip movable carrier 331 is adapted to mount a photosensitive component 40 thereon, that is, the photosensitive component 40 is adapted to be mounted on the chip movable carrier 331. In one embodiment of this application, the photosensitive component 40 is disposed between the chip movable carrier 331 and the substrate 312, and the photosensitive component 40 is mounted on the chip movable carrier 331 via the circuit board 41, thereby moving with the chip movable carrier 331. In the embodiments of this application, there is a gap between the movable chip carrier 331 and the substrate 312, and there is also a certain air gap between the bottom surface of the photosensitive component 40 (i.e., the side of the photosensitive component 40 close to the substrate 312) and the substrate 312. In this way, the movement of the photosensitive component 40 is not easily hindered by the substrate 312, reducing the driving force requirement of the chip driving element 32. In other words, the photosensitive component 40 is suspended above the substrate 312.

[0117] Specifically, in this embodiment, the photosensitive component 40 has a first central axis, and the driving component has a second central axis, with the first central axis offset from the second central axis. Specifically, the central axis of the photosensitive chip 42 of the photosensitive component 40 is the first central axis of the photosensitive component 40, and the central axis of the chip driving motor 30 is the second central axis of the driving component. The photosensitive chip 42 is eccentrically positioned relative to the center of the driving component; that is, the photosensitive chip 42 of the photosensitive component 40 is eccentrically positioned within the chip driving motor 30, meaning the central axis of the photosensitive chip 42 is eccentrically positioned, and the central axis of the photosensitive chip 42 is not the same as the central axis of the chip driving motor 30. (The central axis of the photosensitive chip 42 is the axis that passes through the intersection of the diagonals of the photosensitive chip 42 when viewed from above and is parallel to the Z-axis; the central axis of the chip driving motor 30 is the axis that passes through the intersection of the diagonals of the chip driving motor 30 when viewed from above and is parallel to the Z-axis).

[0118] like Figure 6As shown, the movable chip carrier 331 of the chip stabilization movable part 33 includes a fixed chip carrier body 3311 and a chip carrier side portion 3312. The circuit board 41 is fixed to the bottom surface of the chip carrier body 3311 (i.e., the side facing the substrate 312). The chip carrier body 3311 has a carrier body through hole 33111. The carrier body through hole 33111 is not only suitable for providing a light path for the photosensitive chip 42 of the photosensitive component 40, but also provides mounting space for the electronic components 43 on the photosensitive component 40, preventing the electronic components 43 from interfering with the chip carrier body 3311. The chip carrier side portion 3312 includes a first carrier side portion 33121, a second carrier side portion 33122, a third carrier side portion 33123, and a fourth carrier side portion 33124 extending outward integrally from the chip carrier body 3311. The first carrier side portion 33121 is disposed opposite to the third carrier side portion 33123 and adjacent to the second carrier side portion 33122 and the fourth carrier side portion 33124, the second carrier side portion 33122 and the fourth carrier side portion 33124 being disposed opposite to each other. The first carrier side portion 33121, the second carrier side portion 33122, the third carrier side portion 33123 and the fourth carrier side portion 33124 are adapted to serve as anti-collision components when the chip carrier body 3311 moves, preventing the chip carrier body 3311 from directly colliding with the chip anti-shake fixing portion 31.

[0119] In one embodiment of this application, the chip carrier side portion 3312 (first carrier side portion 33121, second carrier side portion 33122, third carrier side portion 33123 and fourth carrier side portion 33124) further extends to the side of the chip carrier body 3311. That is, the chip carrier side portion 3312 extends further outward from the outer periphery of the chip carrier body 3311 and protrudes from the sidewall of the chip carrier body 3311. This allows the chip anti-shake movable part 33 to collide with the chip anti-shake fixing part 31 through the chip carrier side portion 3312 during movement, thereby avoiding direct collision between the chip carrier body 3311 where the photosensitive component 40 is located and the chip anti-shake fixing part 31, which could damage the photosensitive component 40.

[0120] like Figure 7As shown, the photosensitive chip 42 is eccentrically disposed within the movable chip carrier 331, and the distances from the center O of the photosensitive chip 42 to the two opposite sides of the movable carrier are unequal. Alternatively, the photosensitive chip 42 is closer to at least one side of the movable chip carrier 331, that is, the photosensitive chip 42 is closer to at least one side of the chip drive motor 30. In a specific example of this application, the photosensitive chip 42 of the photosensitive component 40 has a rectangular structure including a long side and a wide side. The edges of the photosensitive component 40 can be defined with a first side, a second side, a third side, and a fourth side. A Cartesian coordinate system is established with the intersection of the diagonals of the photosensitive chip 42 as the origin, where the first and third sides are parallel to the X-axis, and the second and fourth sides are parallel to the Y-axis. Correspondingly, the movable chip carrier 331 also has a first side, a second side, a third side, and a fourth side corresponding to the photosensitive component 40.

[0121] Wherein, the distance from the center O of the photosensitive chip 42 to the first side of the movable chip carrier 331 is H1, and the distance from the center O of the photosensitive chip 42 to the third side of the movable chip carrier 331 is H2, where H1 > H2. That is, the distance between the first central axis of the photosensitive chip 42 and the third side of the movable chip carrier 331 is less than the distance between the first central axis of the photosensitive chip 42 and the first side of the movable chip carrier 331. The photosensitive chip 42 is closer to the third side of the movable chip carrier 331 and farther away from the first side of the movable chip carrier 331. That is, the distance between the first central axis of the photosensitive chips 42A and 42B and the third side of the movable chip carriers 331A and 331B is less than the distance between the first central axis of the photosensitive chips 42A and 42B and the first side of the movable chip carriers 331A and 331B. The photosensitive chips 42A and 42B are closer to the third side of the movable chip carriers 331A and 331B and farther away from the first side of the movable chip carriers 331A and 331B. For example, the range of H1 is 6mm-8mm, and the range of H2 is 3mm-4mm. Preferably, H1 is 7.14mm and H2 is 3.74mm.

[0122] Of course, in other embodiments of this application, H1 < H2, that is, the photosensitive chip 42 is closer to the third side of the movable chip carrier 331 and farther away from the first side of the movable chip carrier 331. This application does not limit this.

[0123] The distance from the center O of the photosensitive chip 42 to the second side of the movable chip carrier 331 is H3, and the distance from the center O of the photosensitive chip 42 to the fourth side of the movable chip carrier 331 is H4. H3 can be equal to H4, less than H4, or greater than H4. That is to say, the photosensitive chip 42 only needs to be closer to at least one side of the movable chip carrier 331, and this application does not impose any restrictions on this.

[0124] When the eccentric photosensitive chip 42 described in this application is applied to a single-camera module 1, especially to a front-facing camera module 1, the side of the photosensitive chip 42 with the shorter distance from the chip drive motor 30 is positioned closer to one side of the mobile electronic device. This facilitates meeting the shape and functional requirements of the mobile electronic device. For example, it makes the screen opening of the mobile electronic device corresponding to the camera module 1 closer to the edge of the mobile electronic device, thereby making the screen of the mobile electronic device more complete.

[0125] like Figure 5 and Figure 8 As shown, the chip driving element 32 includes a chip magnet assembly 321 and a chip coil assembly 322. The chip coil assembly 322 is disposed on the chip movable carrier 331 of the chip stabilization movable part 33. The chip magnet assembly 321 is fixed to the upper cover 311 of the chip stabilization fixing part 31 and corresponds to the chip coil assembly 322. The chip magnet assembly 321 is fixed to the upper cover 311 of the chip stabilization fixing part 31 by means of, for example, adhesive medium. The chip coil assembly 322 is fixed to the chip movable carrier 331 of the chip stabilization movable part 33. The chip magnet assembly 321 and the chip coil assembly 322 are disposed opposite to each other, thereby driving the chip stabilization movable part 33 to move relative to the chip stabilization fixing part 31 through the magnetic force between the chip coil assembly 322 and the chip magnet assembly 321. In other words, in this application, the chip magnet assembly 321 is the stator and the chip coil assembly 322 is the mover. This arrangement ensures that the movement of the chip movable carrier 331 is not affected by magnetic interference, thereby avoiding affecting the chip's anti-shake effect.

[0126] Furthermore, the specific structure of the chip driving element 32 will be described, wherein each of the chip coil assembly 322 includes at least one chip coil. (See reference...) Figure 4As shown, in one embodiment of this application, at least one side of the movable chip carrier 331 is not provided with the chip coil assembly 322. Specifically, the movable chip carrier 331 includes a first side, a second side, a third side, and a fourth side that surround each other, with the first side opposite to the third side, and the second side opposite to the fourth side. The first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, the Y-axis direction being perpendicular to the X-axis direction. The chip coil assembly 322 includes a first chip coil group 3221 disposed on the first side, and a second chip coil group 3222 and a third chip coil group 3223 disposed on the opposite second and fourth sides.

[0127] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are disposed in the plane containing the X-axis and Y-axis, that is, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are disposed horizontally. The first chip coil group 3221 is disposed along the X-axis, the second chip coil group 3222 is disposed along the Y-axis, and the third chip coil group 3223 is disposed along the Y-axis, with the second chip coil group 3222 and the third chip coil group 3223 being disposed opposite each other along the Y-axis. Further, the second chip coil group 3222 and the third chip coil group 3223 are symmetrical with respect to the Y-axis. The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are disposed around three sides of the photosensitive component 40.

[0128] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 each include at least one chip coil. That is, the first chip coil group 3221 includes at least one chip coil, the second chip coil group 3222 includes at least one chip coil, and the third chip coil group 3223 includes at least one chip coil. For example, in a specific example of this application, the first chip coil group 3221 includes a first chip coil 732211 and a second chip coil 732212 disposed on the first side. The first chip coil 732211 and the second chip coil 732212 are arranged along the X-axis direction. Specifically, the first chip coil 732211 and the second chip coil 732212 are arranged relatively parallel to each other along the X-axis direction. The second chip coil group 3222 includes a third chip coil 732221 disposed on the second side. The third chip coil group 3223 includes a fourth chip coil 732231 disposed on the fourth side. The third chip coil 732221 and the fourth chip coil 732231 are arranged relatively parallel to each other along the Y-axis direction. Alternatively, the first chip coil 732211 and the second chip coil 732212 are disposed on the first or third side of the photosensitive component 40, and the third chip coil 732221 and the fourth chip coil 732231 are disposed on the second and fourth sides of the photosensitive component 40, respectively.

[0129] The first chip coil 732211 and the second chip coil 732212 work together to drive the chip anti-shake movable part 33 to move along the Y-axis and / or rotate around the Z-axis. The third chip coil 732221 and the fourth chip coil 732231 work together to drive the chip anti-shake movable part 33 to move along the X-axis.

[0130] Preferably, the first chip coil 732211 and the second chip coil 732212 are the same size, and the third chip coil 732221 and the fourth chip coil 732231 are the same size, but their sizes are smaller than those of the first chip coil 732211 and the second chip coil 732212. This is because the third chip coil 732221 and the fourth chip coil 732231 only need to drive the chip anti-shake movable part 33 to translate along the X-axis, while the first chip coil 732211 and the second chip coil 732212 need to drive the chip anti-shake movable part 33 to both translate along the Y-axis and rotate around the Z-axis.

[0131] In one embodiment of this application, the chip coil assembly 322 further includes a coil circuit board 3224 disposed on the chip movable carrier 331, and at least one chip coil in the chip coil assembly 322 is fixed and electrically connected to the coil circuit board 3224. In a specific example of this application, the first chip coil group 3221 (first chip coil 732211, second chip coil 732212), the second chip coil group 3222 (third chip coil 732221), and the third chip coil group 3223 (fourth chip coil 732231) are all fixed and electrically connected to the coil circuit board 3224, and the chip coil assembly 322 is electrically connected to the chip anti-shake conductive part 35 through the coil circuit board 3224, thereby further electrically connected to the circuit board 41 of the photosensitive component 40. Specifically, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be wound coils fixedly electrically connected to the coil circuit board 3224; or, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be directly wound on the coil circuit board 3224; or, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be directly etched on the coil circuit board 3224 to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322, thereby reducing the height of the chip drive motor 30. Further, the coil circuit board 3224 has a circuit board light-transmitting hole 32241, which provides light from the optical lens 10 to enter the photosensitive component 40 through a light-transmitting hole.

[0132] Accordingly, in one embodiment of this application, the chip magnet assembly 321 includes a first chip magnet group 3211, a second chip magnet group 3212, and a third chip magnet group 3213. The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 are disposed on the plane containing the X-axis and Y-axis (i.e., disposed in the horizontal direction). Further, the first chip magnet group 3211 and the first chip coil group 3221 are disposed vertically opposite each other, the second chip magnet group 3212 and the second chip coil group 3222 are disposed vertically opposite each other, and the third chip magnet group 3213 and the third chip coil group 3223 are disposed vertically opposite each other, such that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211 is arranged along the X-axis, and the second chip magnet group 3212 and the third chip magnet group 3213 are arranged along the Y-axis. The second chip magnet group 3212 and the third chip magnet group 3213 are arranged opposite each other along the Y-axis, and the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the X-axis. In this application, the upper part is the side away from the photosensitive component 40, and the lower part is the side closer to the photosensitive component 40.

[0133] The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 each include at least one chip magnet. For example, in a specific example of this application, the first chip magnet group 3211 includes a first chip magnet 732111 and a second chip magnet 732112, which are arranged along the X-axis direction. Specifically, the first chip magnet 732111 and the second chip magnet 732112 are arranged relatively parallel to each other along the X-axis direction. The second chip magnet group 3212 includes a third chip magnet 732121; the third chip magnet group 3213 includes a fourth chip magnet 732131, which are arranged relatively parallel to each other along the Y-axis direction. More specifically, in this embodiment of the application, the first chip magnet group 3211 is disposed at two opposite corners (i.e., corner areas) of the photosensitive component 40 along the X-axis direction, and the second chip magnet group 3212 and the third chip magnet group 3213 are disposed at two opposite sides of the photosensitive component 40 along the Y-axis direction.

[0134] The first chip magnet 732111 and the second chip magnet 732112 work together to drive the chip anti-shake movable part 33 to move along the Y-axis and / or rotate around the Z-axis, and the third chip magnet 732121 and the fourth chip magnet 732131 work together to drive the chip anti-shake movable part 33 to move along the X-axis.

[0135] Preferably, the first chip magnet 732111 and the second chip magnet 732112 are the same size, and the third chip magnet 732121 and the fourth chip magnet 732131 are the same size, but their sizes are smaller than those of the first chip magnet 732111 and the second chip magnet 732112. This is because the third chip magnet 732121 and the fourth chip magnet 732131 only need to drive the chip anti-shake movable part 33 to translate along the X-axis, while the first chip magnet 732111 and the second chip magnet 732112 need to drive the chip anti-shake movable part 33 to translate along the Y-axis and also drive it to rotate around the Z-axis.

[0136] The first chip coil group 3221 and the first chip magnet group 3211 interact to drive the chip anti-shake movable part 33, thereby driving the photosensitive component 40 to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222 and the second chip magnet group 3212 interact, and the third chip coil group 3223 and the third chip magnet group 3213 interact to jointly drive the chip anti-shake movable part 33, thereby driving the photosensitive component 40 to translate in the X-axis direction.

[0137] refer to Figure 17 As shown, in one embodiment of this application, at least one side of the movable chip carrier 331 is not provided with the chip coil assembly 322. Specifically, the movable chip carrier 331 includes a first side, a second side, a third side, and a fourth side that surround each other, with the first side opposite to the third side, and the second side opposite to the fourth side. The first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, the Y-axis direction being perpendicular to the X-axis direction. The chip coil assembly 322 includes a first chip coil group 3221 disposed on the first side, and a second chip coil group 3222 and a third chip coil group 3223 disposed on the opposite second and fourth sides.

[0138] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are disposed in the plane containing the X-axis and Y-axis, that is, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are disposed horizontally. The first chip coil group 3221 is disposed along the X-axis, the second chip coil group 3222 is disposed along the Y-axis, and the third chip coil group 3223 is disposed along the Y-axis, with the second chip coil group 3222 and the third chip coil group 3223 being disposed opposite each other along the Y-axis. Further, the second chip coil group 3222 and the third chip coil group 3223 are symmetrical with respect to the Y-axis. The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are disposed around three sides of the photosensitive component 40.

[0139] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 each include at least one chip coil. That is, the first chip coil group 3221 includes at least one chip coil, the second chip coil group 3222 includes at least one chip coil, and the third chip coil group 3223 includes at least one chip coil. For example, in a specific example of this application, the first chip coil group 3221 includes two opposing first chip coils 832211 disposed on the first side, forming a pair of first chip coils 832211. The pair of first chip coils 832211 are arranged along the X-axis direction, specifically, the pair of first chip coils 832211 are arranged parallel to each other along the X-axis direction. The second chip coil group 3222 includes a second chip coil 832212 disposed on the second side. The third chip coil group 3223 includes another second chip coil 832212 disposed on the fourth side, opposite to the second chip coil 832212 disposed on the second side, forming a pair of second chip coils 832212. The pair of second chip coils 832212 are arranged relatively parallel to each other along the Y-axis direction. Alternatively, the pair of first chip coils 832211 are disposed on the first or third side of the photosensitive component 40, and two of the pair of second chip coils 832212 are respectively disposed on the second and fourth sides of the photosensitive component 40.

[0140] A pair of first chip coils 832211 work together to drive the chip anti-shake movable part 33 to move along the Y-axis and / or rotate around the Z-axis, and a pair of second chip coils 832212 work together to drive the chip anti-shake movable part 33 to move along the X-axis.

[0141] Preferably, the pair of first chip coils 832211 are of the same size, and the pair of second chip coils 832212 are of the same size, with the size of the second chip coil 832212 being smaller than that of the first chip coil 832211. This is because the second chip coil 832212 only needs to drive the chip anti-shake movable part 33 to translate along the X-axis, while the first chip coil 832211 needs to drive the chip anti-shake movable part 33 to both translate along the Y-axis and rotate around the Z-axis.

[0142] In one embodiment of this application, the chip coil assembly 322 further includes a coil circuit board 3224 disposed on the chip movable carrier 331, and at least one chip coil in the chip coil assembly 322 is fixed and electrically connected to the coil circuit board 3224. In a specific example of this application, the first chip coil group 3221 (a pair of first chip coils 832211), the second chip coil group 3222 (a second chip coil 832212), and the third chip coil group 3223 (a second chip coil 832212) are all fixed and electrically connected to the coil circuit board 3224, and the chip coil assembly 322 is electrically connected to the chip anti-shake conductive part 35 through the coil circuit board 3224, thereby further electrically connected to the circuit board 41 of the photosensitive component 40. Specifically, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be wound coils fixedly electrically connected to the coil circuit board 3224; or, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be directly wound on the coil circuit board 3224; or, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 can be directly etched on the coil circuit board 3224 to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322, thereby reducing the height of the chip drive motor 30. Further, the coil circuit board 3224 has a circuit board light-transmitting hole 32241, which provides light from the optical lens 10 to enter the photosensitive component 40 through a light-transmitting hole.

[0143] Accordingly, in one embodiment of this application, the chip magnet assembly 321 includes a first chip magnet group 3211, a second chip magnet group 3212, and a third chip magnet group 3213. The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 are disposed on the plane containing the X-axis and Y-axis (i.e., disposed in the horizontal direction). Further, the first chip magnet group 3211 and the first chip coil group 3221 are disposed vertically opposite each other, the second chip magnet group 3212 and the second chip coil group 3222 are disposed vertically opposite each other, and the third chip magnet group 3213 and the third chip coil group 3223 are disposed vertically opposite each other, such that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211 is arranged along the X-axis, and the second chip magnet group 3212 and the third chip magnet group 3213 are arranged along the Y-axis. The second chip magnet group 3212 and the third chip magnet group 3213 are arranged opposite each other along the Y-axis, and the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the Y-axis. In this application, the upper part is the side away from the photosensitive component 40, and the lower part is the side closer to the photosensitive component 40.

[0144] The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 each include at least one chip magnet. For example, in a specific example of this application, the first chip magnet group 3211 includes two opposing first chip magnets 832111, forming a pair of first chip magnets 832111. The pair of first chip magnets 832111 are arranged along the X-axis direction; specifically, the two first chip magnets 832111 are arranged parallel to each other along the X-axis direction. The second chip magnet group 3212 includes one second chip magnet 832112; the third chip magnet group 3213 includes one second chip magnet 832112, forming a pair of second chip magnets 832112. The pair of second chip magnets 832112 are arranged relatively parallel to each other along the Y-axis direction. More specifically, in this embodiment of the application, the first chip magnet group 3211 is disposed at two opposite corners (i.e., corner areas) of the photosensitive component 40 along the X-axis direction, and the second chip magnet group 3212 and the third chip magnet group 3213 are disposed at two opposite sides of the photosensitive component 40 along the Y-axis direction.

[0145] A pair of first chip magnets 832111 work together to drive the chip anti-shake movable part 33 to move along the Y-axis and / or rotate around the Z-axis, and a pair of second chip magnets 3212 work together to drive the chip anti-shake movable part 33 to move along the X-axis.

[0146] Preferably, the pair of first chip magnets 832111 are of the same size, and the pair of second chip magnet groups 3212 are of the same size, with the size of the second chip magnet group 3212 being smaller than that of the first chip magnets 832111. This is because the second chip magnet group 3212 only needs to drive the chip anti-shake movable part 33 to translate along the X-axis, while the first chip magnet 832111 needs to drive the chip anti-shake movable part 33 to both translate along the Y-axis and rotate around the Z-axis.

[0147] The first chip coil group 3221 and the first chip magnet group 3211 interact to drive the chip anti-shake movable part 33, thereby driving the photosensitive component 40 to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222 and the second chip magnet group 3212 interact, and the third chip coil group 3223 and the third chip magnet group 3213 interact to jointly drive the chip anti-shake movable part 33, thereby driving the photosensitive component 40 to translate in the X-axis direction.

[0148] like Figure 9 As shown, in one embodiment of this application, at least one side of the chip drive motor 30 is not provided with a chip drive element 32, in order to provide more space for the off-center arrangement of the photosensitive chip 42. That is, the photosensitive chip 42 can be arranged close to the side of the chip drive motor 30 where the chip drive element 32 is not provided, so that the central axis of the photosensitive chip 42 is not consistent with the central axis of the chip drive motor 30. Furthermore, when the off-center photosensitive chip 42 described in this application is applied to the camera module 1, the arrangement of at least one side of the chip drive motor 30 without a chip drive element 32 can avoid magnetic interference problems affecting the selection of the lens drive motor 20 matching scheme.

[0149] Specifically, in one embodiment of this application, the chip magnet assembly 321 and the chip coil assembly 322 are concentrated on three sides of the photosensitive chip 42, and the other side of the photosensitive chip 42 does not have a chip driving element 32. This arrangement causes the central axis of the photosensitive chip 42 to be set off the chip movable carrier 331 in an off-center state, and the center O of the photosensitive chip 42 is closer to the side of the chip movable carrier 331 where the chip driving element 32 is not set. For example, in a specific example of this application, the first chip magnet group 3211 and the first chip coil group 3221 are disposed on the first side of the photosensitive chip 42, and the second chip magnet group 3212, the second chip coil group 3222, the third chip magnet group 3213, and the third chip coil group 3223 are disposed on the second and fourth sides of the photosensitive chip 42. This arrangement makes the center O of the photosensitive chip 42 close to the first side of the chip movable carrier 331, that is, the central axis of the photosensitive chip 42 is not consistent with the central axis of the chip drive motor 30.

[0150] In one embodiment of this application, the chip magnet assembly 321 further includes a magnetically conductive member (not shown in the figure) disposed between the first chip magnet group 3211, the second chip magnet group 3212, the third chip magnet group 3213, and the upper cover 311. The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 are indirectly fixed to the upper cover 311 through the magnetically conductive member. The magnetically conductive member is adapted to enhance the magnetic field force of the chip magnet assembly 321 toward the coil magnet assembly, thereby enhancing the driving force of the chip driving element 32.

[0151] In one embodiment of this application, the chip drive motor 30 further includes a chip position sensing component 36 and a chip holding component 34. The chip position sensing component 36 is used to acquire the position or motion information of the photosensitive component 40. The chip holding component 34 is adapted to allow the chip movable carrier 331 to be suspended in the receiving cavity of the chip anti-shake fixing part 31, so that the photosensitive component 40 can be suspended in the chip anti-shake fixing part 31 by the chip holding component 34.

[0152] like Figure 7 and Figure 8 As shown, the chip position sensing component 36 is fixed to the chip movable carrier 331, so that when the chip movable carrier 331 moves, the chip position sensing component 36 is adapted to obtain the position information of the chip movable carrier 331 by obtaining the magnetic field change of the chip magnet component 321.

[0153] The chip position sensing component 36 includes at least one position sensing element, and the number of position sensing elements is not limited by this application. In a specific example of this application, the chip position sensing component 36 includes a first position sensing element 361, a second position sensing element 362, and a third position sensing element 363, thereby sensing the position information of the chip movable carrier 331 in three directions: translation along the X-axis, translation along the Y-axis, and rotation around the Z-axis. In an embodiment of this application, the first position sensing element 361, the second position sensing element 362, and the third position sensing element 363 are Hall elements; in other embodiments of this application, the first position sensing element 361, the second position sensing element 362, and the third position sensing element 363 are driving chips with position sensing functions.

[0154] In a specific example of this application, a sensing element recess 33114 is formed on the chip carrier body 3311 (e.g., Figure 6 As shown, the chip position sensing component 36 is disposed in the sensing element recess 33114, thereby preventing the chip position sensing component 36 from being too high. The chip position sensing component 36 is electrically connected to the circuit board 41 of the photosensitive component 40. In the height (Z-axis) direction set by the chip movable carrier 331, the chip position sensing element is disposed between the chip coil assembly 322 and the circuit board 41. Preferably, the chip position sensing component 36 is accommodated in the sensing element recess 33114 and does not protrude from the sensing element recess 33114.

[0155] The chip holding assembly 34 includes a chip support assembly 341 and a chip magnetic attraction assembly 342 disposed between the chip movable carrier 331 and the upper cover 311. The chip magnetic attraction assembly 342 is fixed to the chip movable carrier 331 of the chip anti-shake movable part 33. Thus, the magnetic attraction between the chip magnetic attraction assembly 342 and the chip magnet assembly 321 causes the chip anti-shake movable part 33 to be attracted to the upper cover 311. The chip support assembly 341 is disposed between the upper cover 311 of the chip anti-shake fixing part 31 and the chip movable carrier 331 of the chip anti-shake movable part 33. Under the action of the magnetic attraction between the chip magnetic attraction assembly 342 and the chip magnet assembly 321, the chip support assembly 341 is clamped by the upper cover 311 and the chip movable carrier 331, and a gap is maintained between the chip movable carrier 331 and the upper cover 311, thereby reducing the resistance of the chip anti-shake movable part 33 during movement.

[0156] In this embodiment, the chip support assembly 341 includes at least three support components clamped between the chip stabilization movable part 33 and the chip stabilization fixed part 31. Each set of support components includes a ball groove 3412 recessed in the chip movable carrier 331 and balls 3411 disposed in the ball groove 3412. Figures 10 to 12 As shown. The number of balls 3411 and grooves is not limited by this application. In one embodiment of this application, the chip support assembly 341 includes three support assemblies, each of which includes at least one ball 3411 and at least one ball groove 3412. That is, the chip support assembly 341 includes at least three balls 3411 disposed between the chip movable carrier 331 and the upper cover 311. To limit the movement range of the balls 3411, the chip support assembly 341 also includes at least three ball grooves 3412 corresponding to the at least three balls 3411. Preferably, at least three ball grooves 3412 are formed on the chip movable carrier 331. The depth of the ball groove 3412 is less than the diameter of the ball 3411. At least a portion of the ball 3411 can protrude from the ball groove 3412 so that the ball 3411 can maintain frictional contact with the upper cover 311.

[0157] Furthermore, the movable chip carrier 331 further includes an extension post 3313 protruding from the upper surface of the chip carrier body 3311, and a ball groove 3412 recessed into the upper surface of the extension post 3313. In one embodiment of this application, the movable chip carrier 331 includes at least three extension posts 3313 formed on the chip carrier body 3311, the at least three extension posts 3313 protruding from the upper surface of the chip carrier body 3311, and at least three ball grooves 3412 formed on the at least three extension posts 3313. The chip support assembly 341 is disposed between the extension posts 3313 and the upper cover 311, so that a certain gap is maintained between the movable chip carrier 331 and the upper cover 311, and this gap does not change with the movement of the movable chip carrier 331.

[0158] In a specific example of this application, the movable chip carrier 331 includes three extension posts 3313 formed on the chip carrier body 3311, and the chip support assembly 341 includes three ball grooves 3412 formed by the recessed top surface of the extension posts 3313 and three balls 3411 disposed between the three ball grooves 3412 and the upper cover 311.

[0159] Specifically, in the embodiments of this application, the at least three support components are arranged in a not completely collinear manner. Accordingly, in the specific example above, the three extension pillars 3313 are distributed at two adjacent corners of the chip carrier body 3311 and on the side opposite to the side where the line connecting the adjacent corners is located, that is, the three ball bearings 3411 are arranged in a triangular pattern to provide stable support for the movable chip carrier 331.

[0160] Further reference Figure 12 The chip support assembly 341 further includes a ball support piece 3413 embedded within the movable chip carrier 331 and located at the bottom of the ball groove 3412, wherein the ball 3411 is supported by the ball support piece 3413. In one embodiment of this application, the chip support assembly 341 further includes at least three ball support pieces 3413, which are fixed to the movable chip carrier 331 and serve as the bottom surface of the ball groove 3412. The ball support piece 3413 may be made of stainless steel or other metal materials, thereby providing a smoother support surface for the ball 3411 and reducing the friction of the ball 3411 rolling. In a specific example of this application, the chip support assembly 341 includes three ball support pieces 3413, each ball support piece 3413 being fixed in the extension post 3313 of the movable chip carrier 331 by insert molding and exposing its upper surface as the bottom surface of each ball groove 3412, further referring to... Figure 13A The ball bearing support 3413 includes a support body 34131 and a support connecting portion 34132. The support body 34131 and the support connecting portion 34132 extend integrally. The upper surface of the support body 34131 is exposed and serves as the bottom surface of the ball groove 3412. The support connecting portion 34132 is used to maintain the position of the ball bearing support 3413 in the movable chip carrier 331 during the insert molding process. The support connecting portion 34132 can connect to the support connecting portions 34132 of other ball bearing supports 34133 or to other support components used to support the support connecting portion 34132. After the ball bearing support 3413 is formed in the movable chip carrier 331 by the insert molding process, the support connecting portion 34132 is cut, and a portion of the support connecting portion 34132 can be exposed outside the movable chip carrier 331. That is, in some embodiments of this application, the ball support sheet 3413 includes a support sheet body 34131 located at the bottom of the ball groove 3412 and a support sheet connecting portion 34132 extending from the support sheet body 34131 to the outside of the chip movable carrier 331.

[0161] like Figure 11 and Figure 13AAs shown, in some embodiments of this application, the chip magnetic assembly 342 includes at least one chip magnetic element 3421, which is enclosed within the chip movable carrier 331 of the chip anti-shake movable part 33, so that the chip movable carrier 331 is suspended and disposed within the receiving cavity of the chip anti-shake fixing part 31 by the magnetic attraction between the chip magnet assembly 321 and the at least one chip magnetic element 3421. In a specific example of this application, at least one of the chip magnetic elements 3421 is embedded in the chip movable carrier 331 of the chip anti-shake movable part 33 through an insert molding process. At least one of the chip magnetic elements 3421 is disposed opposite to the chip magnet assembly 321 to generate a magnetic attraction between the at least one chip magnetic element 3421 and the chip magnet assembly 321. On the one hand, the chip support assembly 341 is clamped between the chip anti-shake fixing part 31 and the chip anti-shake movable part 33 by the action of the magnetic attraction. Specifically, the ball 3411 is clamped between the upper cover 311 and the chip movable carrier 331 by the magnetic attraction between the at least one chip magnetic element 3421 and the chip magnet assembly 321. On the other hand, after the chip movable carrier 331 moves, the magnetic attraction keeps the chip movable carrier 331 in a position, wherein the position can be the initial position of the chip movable carrier 331 before it is driven. The chip magnetic element 3421 is made of a material with magnetic properties, which is suitable for generating magnetic attraction with a magnet.

[0162] The chip magnetic element 3421 includes a magnetic element body 34211 and a magnetic element connecting portion 34212. The magnetic element body 34211 and the magnetic element connecting portion 34212 extend integrally. The magnetic element connecting portion 34212 is used to maintain the position of the chip magnetic element 3421 in the chip movable carrier 331 during the insert molding process. The magnetic element connecting portion 34212 can connect to the magnetic element connecting portion 34212 of other chip magnetic elements 3421 or to other support components for supporting the magnetic element connecting portion 34212. After the chip magnetic element 3421 is formed in the chip movable carrier 331 through the insert molding process, the magnetic element connecting portion 34212 is cut, and a portion of the magnetic element connecting portion 34212 can be exposed outside the chip movable carrier 331. That is, in some embodiments of this application, the chip magnetic element 3421 includes a magnetic element body 34211 enclosed in the chip movable carrier 331 and a magnetic element connecting portion 34212 extending from the magnetic element body 34211 to the outside of the chip movable carrier 331.

[0163] In one embodiment of this application, the upper surface of the chip magnetic element 3421 is exposed and not covered by the chip movable carrier 331; in other embodiments of this application, the upper surface of the chip magnetic element 3421 may also be covered by the chip movable carrier 331, and this application is not limited thereto.

[0164] Specifically, in one embodiment of this application, such as Figure 11 and Figure 13A As shown, the chip magnetic assemblies 342 include a first chip magnetic assembly 3422 and a second chip magnetic assembly 3423. Through the proper arrangement of the first and second chip magnetic assemblies 3422 and 3423, their main functions differ. Viewed along the Z-axis, the three balls 3411 are arranged in a triangular pattern. The first chip magnetic assembly 3422 is positioned at the corner of the triangular plane (i.e., the corner area), close to the balls 3411. The main function of the first chip magnetic assembly 3422 is to generate a magnetic attraction force along the Z-axis with the chip magnet assembly 321, thereby clamping the chip support assembly 341 between the chip anti-shake fixing part 31 and the chip anti-shake movable part 33. The second chip magnetic component 3423 is disposed on the side of the triangular plane, meaning the distance from the second chip magnetic component 3423 to the ball bearing 3411 is greater than the distance from the first chip magnetic component 3422 to the ball bearing 3411. The main function of the second chip magnetic component 3423 is to generate a magnetic attraction force with the chip magnet group at a certain angle to the Z-axis direction after the movable chip carrier 331 moves. The main function of this magnetic attraction force is to return the movable chip carrier 331 to a certain position. Of course, the fact that the first chip magnetic component 3422 and the second chip magnetic component 3423 have different main functions in this application does not mean that the first chip magnetic component 3422 and the second chip magnetic component 3423 will not have other functions. In other words, the first chip magnetic suction component 3422 also has the function of returning the movable chip carrier 331 to a certain position through magnetic attraction after the movable chip carrier 331 moves. The second chip magnetic suction component 3423 also has the function of clamping the chip support component 341 between the chip anti-shake fixing part 31 and the chip anti-shake movable part 33 through magnetic attraction. The first chip magnetic suction component 3422 and the second chip magnetic suction component 3423 cooperate with each other and work together on the movable chip carrier 331. However, since the positions of the first chip magnetic suction component 3422 and the second chip magnetic suction component 3423 are different, their main functions are different.

[0165] Specifically, in this embodiment of the application, the number of the first chip magnetic attraction components 3422 is 4, including the first chip magnetic attraction element 734221, the second chip magnetic attraction element 734222, the third chip magnetic attraction element 734223 and the fourth chip magnetic attraction element 734224. The first chip magnetic element 734221 and the first chip magnet 732111 are arranged opposite each other along the height direction set by the movable chip carrier 331. The second chip magnetic element 734222 and the second chip magnet 732112 are arranged opposite each other along the height direction set by the movable chip carrier 331. The third chip magnetic element 734223 and the third chip magnet 732121 are arranged opposite each other along the height direction set by the movable chip carrier 331. The fourth chip magnetic element 734224 and the fourth chip magnet 732131 are arranged opposite each other along the height direction set by the movable chip carrier 331. In this application, the chip magnet assembly 321 and the first chip magnetic assembly 3422 do not need to be completely opposite each other when arranged opposite each other along the height direction set by the movable chip carrier 331. That is to say, the projection of the chip magnet assembly 321 and the projection of the first chip magnetic assembly 3422 need to overlap at least partially.

[0166] The first chip magnetic element 734221 and the second chip magnetic element 734222 are disposed on the first side of the movable chip carrier 331, and the third chip magnetic element 734223 and the fourth chip magnetic element 734224 are respectively disposed on the second and fourth sides of the movable chip carrier 331. Alternatively, the first chip magnetic element 734221, the second chip magnetic element 734222, the third chip magnetic element 734223, and the fourth chip magnetic element 734224 are positioned according to the position of the ball bearing 3411.

[0167] Furthermore, the first chip magnetic element 734221 and the second chip magnetic element 734222 are positioned close to the ball bearing 3411 along the X-axis direction, and are respectively positioned on both sides of the two balls bearing 3411; the third chip magnetic element 734223 and the fourth chip magnetic element 734224 are positioned close to the ball bearing 3411 along the Y-axis direction, and are respectively positioned on one side of one ball bearing 3411. Because the first chip magnetic component 3422 is closer to the ball bearing 3411, the magnetic attraction force between it and the chip magnet component 321 that clamps the chip support component 341 is more pronounced.

[0168] More specifically, in this embodiment, the number of second chip magnetic assemblies 3423 is two, including a fifth chip magnetic element 734231 and a sixth chip magnetic element 734232. The fifth chip magnetic element 734231 and the third chip magnet 732121 are arranged opposite each other along the height direction set by the chip movable carrier 331, and the sixth chip magnetic element 734232 and the fourth chip magnet 732131 are arranged opposite each other along the height direction set by the chip movable carrier 331. Further, in a specific example of this application, the fifth chip magnetic element 734231 is disposed between the first chip magnet 732111 and the third chip magnet 32131, and the sixth chip magnetic element 734232 is disposed between the second chip magnet 732112 and the fourth chip magnet 32121. Alternatively, the fifth chip magnetic element 734231 is disposed on the second side of the movable chip carrier 331, and the sixth chip magnetic element 734232 is disposed on the fourth side of the movable chip carrier 331. This arrangement ensures that after the movable chip carrier 331 moves, a magnetic attraction force with a certain angle to the Z-axis is generated between the second chip magnetic element group and the chip magnet assembly 321. This magnetic attraction force causes the movable chip carrier 331 to return to its original position. Of course, it is understood that during this process, a magnetic attraction force is also generated between the first chip magnetic element 3422 and the chip magnet assembly 321, causing the movable chip carrier 331 to return to its original position.

[0169] It is worth mentioning that the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can be a force opposite to the moving direction of the chip movable carrier 331. In this case, the magnetic attraction force is a reset force, causing the chip movable carrier 331 to return to a certain position. Alternatively, the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can be a force in the same direction as the moving direction of the chip movable carrier 331. In this case, the magnetic attraction force is an external attraction force. This is because when the chip movable carrier 331 moves, the circuit board 41 of the photosensitive component 40 will also generate a certain reset force. The external attraction force and the reset force of the circuit board 41 slightly cancel each other out to compensate for the pushing force of the chip movable carrier 331 at the edge.

[0170] Specifically, in one embodiment of this application, such as Figure 21 and Figure 23As shown, the chip magnetic assemblies 342 include a first chip magnetic assembly 3422 and a second chip magnetic assembly 3423. Through the proper arrangement of the first and second chip magnetic assemblies 3422 and 3423, their main functions differ. Viewed along the Z-axis, the three balls 3411 are arranged in a triangular pattern. The first chip magnetic assembly 3422 is positioned at the corner of the triangular plane (i.e., the corner area), close to the balls 3411. The main function of the first chip magnetic assembly 3422 is to generate a magnetic attraction force along the Z-axis with the chip magnet assembly 321, thereby clamping the chip support assembly 341 between the chip anti-shake fixing part 31 and the chip anti-shake movable part 33. The second chip magnetic component 3423 is disposed on the side of the triangular plane, meaning the distance from the second chip magnetic component 3423 to the ball bearing 3411 is greater than the distance from the first chip magnetic component 3422 to the ball bearing 3411. The main function of the second chip magnetic component 3423 is to generate a magnetic attraction force with the chip magnet group at a certain angle to the Z-axis direction after the movable chip carrier 331 moves. The main function of this magnetic attraction force is to return the movable chip carrier 331 to a certain position. Of course, the fact that the first chip magnetic component 3422 and the second chip magnetic component 3423 have different main functions in this application does not mean that the first chip magnetic component 3422 and the second chip magnetic component 3423 will not have other functions. In other words, the first chip magnetic suction component 3422 also has the function of returning the movable chip carrier 331 to a certain position through magnetic attraction after the movable chip carrier 331 moves. The second chip magnetic suction component 3423 also has the function of clamping the chip support component 341 between the chip anti-shake fixing part 31 and the chip anti-shake movable part 33 through magnetic attraction. The first chip magnetic suction component 3422 and the second chip magnetic suction component 3423 cooperate with each other and work together on the movable chip carrier 331. However, since the positions of the first chip magnetic suction component 3422 and the second chip magnetic suction component 3423 are different, their main functions are different.

[0171] Specifically, the first chip magnetic component 3422 includes at least one first chip magnetic element 834221, and the second chip magnetic component 3423 includes at least one second chip magnetic element 834231. The first chip magnetic element 834221 is adjacent to the first support component among the at least three support components, and the distance between the second chip magnetic element 834231 and any of the at least three support components is greater than the distance between the first chip magnetic element 834221 and the first support component.

[0172] In this embodiment, the number of first chip magnetic assemblies 3422 is 4, and the number of second chip magnetic assemblies 3423 is 2. The first chip magnetic assembly 3422 includes two opposing first chip magnetic elements 834221 and two opposing third chip magnetic elements 834222, forming a pair of first chip magnetic elements 834221 and a pair of third chip magnetic elements 834222. The second chip magnetic assembly 3423 includes two second chip magnetic elements 834231, forming a pair of second chip magnetic elements 834231.

[0173] A pair of first chip magnetic elements 834221 and a pair of first chip magnets 832111 are arranged opposite each other along the height direction set by the movable chip carrier 331. Similarly, a pair of second chip magnetic elements 834231 and a pair of second chip magnets 832112 are arranged opposite each other along the height direction set by the movable chip carrier 331. That is, a pair of first chip magnetic elements 834221 corresponds to a pair of first chip magnets 832111 along the height direction set by the movable chip carrier 331, and a pair of second chip magnetic elements 834231 corresponds to a pair of second chip magnets 832112 along the height direction set by the movable chip carrier 331. In this application, the chip magnet assembly 321 and the first chip magnetic assembly 3422 do not need to be perfectly aligned along the height direction set by the movable chip carrier 331; that is, the projection of the chip magnet assembly 321 and the projection of the first chip magnetic assembly 3422 only need to overlap at least partially.

[0174] A pair of first chip magnetic elements 834221 are disposed on the first side of the movable chip carrier 331, located on opposite sides of the first support assembly. A pair of third chip magnetic elements 834222 are disposed on the second and fourth sides of the movable chip carrier 331, with one third chip magnetic element 834222 adjacent to the second support assembly and the other third chip magnetic element 834222 adjacent to the third support assembly. Alternatively, the first chip magnetic elements 834221 and the third chip magnetic elements 834222 are positioned according to the position of the ball bearing 3411 of the support assembly.

[0175] Furthermore, a pair of first chip magnetic elements 834221 are positioned close to the ball bearings 3411 along the X-axis direction, with each pair of first chip magnetic elements 834221 positioned on either side of the two ball bearings 3411; a pair of third chip magnetic elements 834222 are positioned close to the ball bearings 3411 along the Y-axis direction, with each third chip magnetic element 834222 positioned on one side of one of the ball bearings 3411. Because the first chip magnetic components 3422 are closer to the ball bearings 3411, the magnetic attraction between them and the chip magnet components 321, which clamps the chip support component 341, is more pronounced.

[0176] It is worth mentioning that the dimensions of the first chip magnetic element 834221 and the third chip magnetic element 834222 are larger than the dimensions of the second chip magnetic element 834231. This is because the main function of the first chip magnetic element 834221 and the third chip magnetic element 834222 is to clamp the ball 3411, which also serves to reset the movable chip carrier 331. The second chip magnetic element 834231 and its corresponding chip magnet element only need to generate a resetting force to reset the movable chip carrier 331.

[0177] In this embodiment, a pair of second chip magnetic elements 834231 and second chip magnets 832112 are arranged opposite each other along the height direction set by the movable chip carrier 331. Further, in a specific example of this application, a pair of second chip magnetic elements 834231 are disposed between a pair of first chip magnets 832111 and a pair of third chip magnets 32131. Specifically, one of the pair of second chip magnetic elements 834231 is disposed in the middle region of the second side of the movable chip carrier 331, and the other is disposed in the middle region of the fourth side of the movable chip carrier 331. This arrangement ensures that after the movable chip carrier 331 moves, a magnetic attraction force with a certain angle to the Z-axis is generated between the second chip magnetic assembly 3423 and the chip magnet assembly 321, causing the movable chip carrier 331 to return to a certain position. Of course, it is understandable that during this process, a magnetic attraction force will also be generated between the first chip magnetic attraction component 3422 and the chip magnet component 321, causing the chip movable carrier 331 to return to a certain position.

[0178] It is worth mentioning that the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can be a force opposite to the moving direction of the chip movable carrier 331. In this case, the magnetic attraction force is a reset force, causing the chip movable carrier 331 to return to a certain position. Alternatively, the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can be a force in the same direction as the moving direction of the chip movable carrier 331. In this case, the magnetic attraction force is an external attraction force. This is because when the chip movable carrier 331 moves, the circuit board 41 of the photosensitive component 40 will also generate a certain reset force. The external attraction force and the reset force of the circuit board 41 slightly cancel each other out to compensate for the pushing force of the chip movable carrier 331 at the edge.

[0179] In a specific example of this application, the chip magnetic attraction assembly 342 includes six chip magnetic attraction elements 3421, with each pair of chip magnetic attraction elements 3421 having the same shape, thereby providing a uniform and stable magnetic attraction force, so that the chip movable carrier 331 is smoothly attracted to the upper cover 311.

[0180] In this application, the movable chip carrier 331 can be integrally formed with the ball support sheet 3413 and the chip magnetic element 3421 by injection molding in an insert molding manner, so as to reduce the number of components of the chip drive motor 30. The chip anti-shake conductive part 35 can also be embedded into the chip anti-shake movable part 33 by insert molding.

[0181] Therefore, this application embeds the chip anti-shake conductive part 35 into the chip anti-shake movable part 33 by, for example, insert molding, to provide a conductive chip anti-shake movable part 33, so that the chip coil assembly 322 can be electrically connected to the circuit board 41 through the chip anti-shake movable part 33. Furthermore, since the chip anti-shake conductive part 35 is embedded into the chip anti-shake movable part 33 by insert molding, the chip anti-shake movable part 33 is adapted to provide two flat mounting surfaces for mounting and fixing the chip coil assembly 322 and the circuit board 41. This also reduces the number of components in the chip anti-shake motor, reduces the assembly complexity of the chip anti-shake motor, and protects the chip anti-shake conductive part 35.

[0182] Specifically, Figure 11 and Figure 13B The embedded structure of the chip stabilization movable portion 33 and the chip stabilization conductive portion 35 is shown. The chip stabilization conductive portion 35 includes at least one coil conductive component 351. In one embodiment of this application, the chip stabilization conductive portion 35 includes a plurality of (two or more) coil conductive elements 3511. The plurality of coil conductive elements 3511 are embedded in the chip movable carrier 331 by, for example, insert molding. That is, the coil conductive elements 3511 are covered within the chip stabilization movable carrier so that the plurality of coil conductive elements 3511 can be electrically connected to the chip coil assembly 322 and the circuit board 41.

[0183] The number of coil conductive elements 3511 in the coil conductive assembly 351 is related to the number of circuits required in the chip coil assembly 322, as shown in the reference. Figure 13BIn one specific example of this application, the coil conductive assembly 351 includes six coil conductive elements 3511. Each coil conductive element 3511 has an exposed first coil conductive end 35111, an exposed second coil conductive end 35113 opposite to the first coil conductive end 35111, and a coil conductive extension 35112 extending and electrically connected between the first coil conductive end 35111 and the second coil conductive end 35113. The first coil conductive end 35111 is positioned higher than the second coil conductive end 35113, and the coil conductive extension 35112 extends downward from the first coil conductive end 35111 to the second coil conductive end 35113. When the coil conductive element 3511 is embedded in the chip movable carrier 331, the chip movable carrier 331 does not cover the upper surface of the first coil conductive end 35111, and the upper surface of the first coil conductive end 35111 is exposed for electrical connection with the chip coil assembly 322. The chip movable carrier 331 does not cover the lower surface of the second coil conductive end 35113, and the lower surface of the second coil conductive end 35113 is exposed for electrical connection with the circuit board 41, thereby electrically connecting the chip coil assembly 322 and the circuit board 41. In some embodiments of this application, at least some of the first coil conductive ends 35111 of all the coil conductive elements 3511 are exposed on the upper surface of the chip movable carrier 331, and the second coil conductive ends 35113 are exposed on the lower surface of the chip movable carrier 331. At least one chip coil in the chip coil assembly 322 is electrically connected to the first coil conductive end 35111 via the coil circuit board 3224. The second coil conductive end 35113 is adapted to be electrically connected to the circuit board 41 of the photosensitive component 40, thereby achieving electrical conduction between the chip coil assembly 322 and the circuit board 41.

[0184] In this embodiment, the first coil conductive end 35111 of the coil conductive element 3511 forms part of the upper conductive portion 33112 of the chip carrier body 3311 of the movable chip carrier 331, and the second coil conductive end 35113 of the coil conductive element 3511 forms part of the lower conductive portion 33113 of the chip carrier body 3311 of the movable chip carrier 331. In other words, the upper conductive portion 33112 includes the first coil conductive end 35111, and the lower conductive portion 33113 includes the second coil conductive end 35113.

[0185] Furthermore, in order to maintain the position of the coil conductive component 351 in the movable chip carrier 331 during the insert molding process, the coil conductive element 3511 further includes a coil conductive connection portion 35114. The coil conductive connection portion 35114 can connect to the coil conductive connection portions 35114 of other coil conductive elements 3511 or to other support components for supporting the coil conductive connection portion 35114. After the coil conductive component 351 is formed in the movable chip carrier 331 through the insert molding process, the coil conductive connection portion 35114 is cut, and a portion of the coil conductive connection portion 35114 is exposed outside the movable chip carrier 331. That is, in some embodiments of this application, the coil conductive element 3511 further includes a coil conductive connection portion 35114 extending from a coil conductive body formed by the first coil conductive end 35111, the second coil conductive end 35113, and the coil conductive extension portion 35112 to the outside of the movable chip carrier 331.

[0186] In one embodiment of this application, the first coil conductive end 35111, the second coil conductive end 35113, the coil conductive extension 35112, and the coil conductive connection 35114 are integrally formed from a conductive material. In another embodiment of this application, the coil conductive element 3511 does not have the coil conductive connection 35114, and therefore the first coil conductive end 35111, the second coil conductive end 35113, and the coil conductive extension 35112 are integrally formed from a conductive material.

[0187] In one embodiment of this application, the chip anti-shake conductive portion 35 may further include a sensing element conductive assembly (not shown in the figure), the sensing element conductive assembly including at least one sensing element conductive element enclosed within the chip movable carrier 331. Each of the sensing element conductive elements includes a first sensing element conductive end exposed on the upper surface of the chip movable carrier 331, a second sensing element conductive end exposed on the lower surface of the chip movable carrier 331 and opposite to the first sensing element conductive end, and a sensing element conductive extension extending between the first sensing element conductive end and the second sensing element conductive end, wherein the first sensing element conductive end is electrically connected to the position sensing element, the second sensing element conductive end is adapted to be electrically connected to the circuit board 41, and the first sensing element conductive end is lower than the first coil conductive end 35111 in the height direction set by the chip movable carrier 331.

[0188] In one embodiment of this application, the ball bearing support 3413, the chip magnetic attraction assembly 342 (including the chip magnetic attraction element 3421), and the chip anti-shake conductive part 35 (including the coil conductive element 3511 and the sensing element conductive element) are all embedded in the chip movable carrier 331 by injection molding in an insert molding manner, and are integrally formed with the chip movable carrier 331, which reduces the number of parts of the chip drive motor 30, thereby simplifying the structure and assembly complexity of the chip drive motor 30.

[0189] It is worth mentioning that the chip magnetic absorbing assembly 342 (including the chip magnetic absorbing element 3421) needs to be made of a magnetically conductive material, while the ball bearing support 3413 and the chip anti-shake conductive part 35 (including the coil conductive element 3511 and the sensing element conductive element) need to be made of a non-magnetically conductive material. Therefore, in the insert molding process, the chip magnetic absorbing assembly 342 is on the same strip, while the ball bearing support 3413 and the chip anti-shake conductive part 35 are on another strip. Therefore, after manufacturing, the height of the magnetic absorbing element connection portion 34212 of at least one chip magnetic absorbing element 3421 of the chip magnetic absorbing assembly 342 is inconsistent with the height of the support connection portion of the ball bearing support 3413 and the coil conductive connection portion 35114 of the chip anti-shake conductive part 35. That is, the coil conductive element 3511 and the ball support plate 3413 of the chip anti-shake conductive part 35 are not magnetic, while the chip magnetic element 3421 of the magnetic attraction assembly is magnetic. The magnetic element connection part 34212, the coil conductive connection part 35114, and the support plate connection part 34132 are different in the height direction set by the chip movable carrier 331.

[0190] Furthermore, the installation and power-on method of the movable chip carrier 331 will be described. In one embodiment of this application, solder (e.g., solder) is applied to the upper conductive portion 33112 of the movable chip carrier 331 to electrically connect with the pads on the back side of the coil circuit board 3224 of the chip coil assembly 322. The coil circuit board 3224 and the movable chip carrier 331 are bonded and fixed by an adhesive medium between the movable chip carrier 331 and the coil circuit board 3224. The movable chip carrier 331 and the circuit board 41 are bonded and fixed by an adhesive medium between the movable chip carrier 331 and the circuit board 41. Then, the lower conductive portion 33113 on the back side of the movable chip carrier 331 and the side of the circuit board body 411 of the circuit board 41 are electrically connected by solder.

[0191] This application further provides a driving method for a chip-driven motor 30:

[0192] Figures 14A to 14CThe current direction and force direction of each chip anti-shake coil are shown when the chip anti-shake movable part 33 translates along the X-axis, translates along the Y-axis, and rotates around the Z-axis.

[0193] like Figure 14A As shown, the third chip coil 732221 and the fourth chip coil 732231 are connected in series. When the movable chip carrier 331 is driven to translate along the -X-axis, the third chip coil 732221 receives a clockwise current, and the fourth chip coil 732231 receives a counterclockwise current. The third and fourth chip coils 732221 are driven by electromagnetic force, causing the movable chip carrier 331 with the photosensitive component 40 to move along the -X-axis for compensation. Arrow I indicates the current direction, and F indicates the force on the coil. When the movable chip carrier 331 translates along the -X-axis, the current through the third and fourth chip coils 732221 is the same, and the forces on the third and fourth chip coils 732231 are the same in magnitude and direction. Conversely, when the third chip coil 732221 is supplied with a counterclockwise current and the fourth chip coil 732231 is supplied with a clockwise current, the movable carrier 331 of the chip with the photosensitive component 40 translates along the +X axis direction for compensation.

[0194] like Figure 14B As shown, the first chip coil 732211 and the second chip coil 732212 are individually energized. When the movable chip carrier 331 is driven to translate along the +Y axis, the first chip coil 732211 receives a clockwise current, and the second chip coil 732212 receives a clockwise current. The first and second chip coils 732211 and 732212 are driven by electromagnetic force, causing the movable chip carrier 331 with the photosensitive component 40 to move along the +Y axis for compensation. Arrow I indicates the current direction, and F indicates the force on the coil. When the movable chip carrier 331 translates along the +Y axis, the current through the first and second chip coils 732211 is the same, and the forces on the first and second chip coils 732211 are the same in magnitude and direction. Conversely, when the first chip coil 732211 is supplied with a counterclockwise current and the second chip coil 732212 is supplied with a counterclockwise current, the movable carrier 331 of the chip with the photosensitive component 40 translates along the -Y axis direction to compensate.

[0195] like Figure 14CAs shown, the first chip coil 732211 and the second chip coil 732212 are individually energized. When the movable chip carrier 331 is driven to rotate clockwise around the Z-axis, the first chip coil 732211 receives a counterclockwise current, and the second chip coil 732212 receives a clockwise current. The first chip coil 732211 is driven by an electromagnetic force in the -Y direction, and the second chip coil 732212 is driven by an electromagnetic force in the +Y direction. This causes the movable chip carrier 331 to experience a torsional force, resulting in the chip carrier 331 with the photosensitive component 40 rotating clockwise around the Z-axis for compensation. Arrow I indicates the current direction, and F indicates the force on the coil. When the movable chip carrier 331 translates along the +Y axis, the current through the first chip coil 732211 and the second chip coil 732212 is the same, and the forces on the first chip coil 732211 and the second chip coil 732212 are the same in magnitude but opposite in direction. Conversely, when the first chip coil 732211 receives a clockwise current and the second chip coil 732212 receives a counterclockwise current, the movable chip carrier 331 with the photosensitive component 40 rotates counterclockwise around the Z axis to compensate for the rotation.

[0196] Figures 24 to 26 The current direction and force direction of each chip anti-shake coil are shown when the chip anti-shake movable part 33 translates along the X-axis, translates along the Y-axis, and rotates around the Z-axis.

[0197] like Figure 24 As shown, the third chip coil 832221 and the fourth chip coil 832231 are connected in series. When the movable chip carrier 331 is driven to translate along the -X-axis, the third chip coil 832221 receives a clockwise current, and the fourth chip coil 832231 receives a counterclockwise current. The third and fourth chip coils 832221 are driven by electromagnetic force, causing the movable chip carrier 331 with the photosensitive component 40 to move along the -X-axis for compensation. Arrow I indicates the current direction, and F indicates the force on the coil. When the movable chip carrier 331 translates along the -X-axis, the current through the third and fourth chip coils 832221 is the same, and the forces on the third and fourth chip coils 832231 are the same in magnitude and direction. Conversely, when the third chip coil 832221 is supplied with a counterclockwise current and the fourth chip coil 832231 is supplied with a clockwise current, the movable carrier 331 of the chip with the photosensitive component 40 translates along the +X axis direction for compensation.

[0198] like Figure 25 As shown, the first chip coil 832211 and the second chip coil 832212 are individually energized. When the movable chip carrier 331 is driven to translate along the +Y axis, the first chip coil 832211 receives a clockwise current, and the second chip coil 832212 receives a clockwise current. The first and second chip coils 832211 and 832212 are driven by electromagnetic force, causing the movable chip carrier 331 with the photosensitive component 40 to move along the +Y axis for compensation. Arrow I indicates the current direction, and F indicates the force on the coil. When the movable chip carrier 331 translates along the +Y axis, the current through the first and second chip coils 832211 is the same, and the forces on the first and second chip coils 832211 are the same in magnitude and direction. Conversely, when the first chip coil 832211 is supplied with a counterclockwise current and the second chip coil 832212 is supplied with a counterclockwise current, the movable carrier 331 of the chip with the photosensitive component 40 translates along the -Y axis direction to compensate.

[0199] like Figure 26 As shown, the first chip coil 832211 and the second chip coil 832212 are individually energized. When the movable chip carrier 331 is driven to rotate clockwise around the Z-axis, the first chip coil 832211 receives a counterclockwise current, and the second chip coil 832212 receives a clockwise current. The first chip coil 832211 is driven by an electromagnetic force in the -Y direction, and the second chip coil 832212 is driven by an electromagnetic force in the +Y direction. This causes the movable chip carrier 331 to experience a torsional force, resulting in the movable chip carrier 331 with the photosensitive component 40 rotating clockwise around the Z-axis for compensation. Arrow I indicates the current direction, and F indicates the force on the coil. When the movable chip carrier 331 translates along the +Y axis, the current through the first chip coil 832211 and the second chip coil 832212 is the same, and the forces on the first chip coil 832211 and the second chip coil 832212 are the same in magnitude but opposite in direction. Conversely, when the first chip coil 832211 receives a clockwise current and the second chip coil 832212 receives a counterclockwise current, the movable chip carrier 331 with the photosensitive component 40 rotates counterclockwise around the Z axis to compensate for the rotation.

[0200] Furthermore, in this embodiment, when the chip anti-shake movable part 33 moves along the X-axis, the first position sensing element 361 senses a significant change in the magnetic field and provides feedback on the change in the magnetic field; when the chip anti-shake movable part 33 moves along the Y-axis and rotates around the Z-axis, the first position sensing element 361 senses no significant change in the magnetic field, while the second position sensing element 362 and the third position sensing element 363 sense significant changes in the magnetic field.

[0201] In summary, the driving component and camera module 1 based on the embodiments of this application are explained, wherein the camera module 1 enables different magnetic elements to play different roles through the reasonable arrangement of magnetic elements in its driving component; and the photosensitive component 40 of the camera module 1 is set off-center from the center of the driving component, so that one side of the photosensitive chip 42 of the photosensitive component 40 is closer to the edge of the mobile electronic device, so as to meet the shape and functional requirements of the mobile electronic device.

[0202] Exemplary multi-camera module

[0203] like Figure 15 , Figure 16 and Figure 27 As shown, this application further provides a dual-camera module using the aforementioned photosensitive chip, the dual-camera module comprising two single-camera modules arranged side by side (first camera module 1A, second camera module 1B). The specific structure and function of at least one of the first camera module 1A and the second camera module 1B are described in reference. Figures 2 to 14C and Figures 17 to 25 The specific structure and function of the camera module shown are consistent with those of the referenced module. In one embodiment of this application, the specific structure and function of the first camera module 1A and the second camera module 1B are both consistent with those of the referenced module. Figures 2 to 14C , Figures 17 to 25 The specific structure and function of the camera module shown are consistent.

[0204] Specifically, the first camera module 1A includes a first optical lens 10A, a first photosensitive component 40A, and a first driving component. The second camera module 1B includes a second optical lens 10B, a second photosensitive component 40B, and a second driving component. The first optical lens 10A and the second optical lens 10B are respectively positioned on the light-sensing paths of the first photosensitive component 40A and the second photosensitive component 40B. The first driving component of the first camera module 1A drives the first photosensitive component 40A and / or the first optical lens 10A to move to achieve optical performance adjustment. The second driving component of the second camera module 1A drives the first photosensitive component 40B and / or the second optical lens 10B to move to achieve optical performance adjustment, such as optical image stabilization or optical focusing. It is understood that, in one embodiment of this application, the first camera module 1A and the second camera module 1B of the dual-camera camera module are interconnected via a bracket (not shown).

[0205] Accordingly, the first optical lens 10A includes a first lens barrel 11A and a first lens group 12A installed within the first lens barrel 11A, the first lens group 12A including at least one optical lens. The second optical lens 10B includes a second lens barrel 11B and a second lens group 12B installed within the second lens barrel 11B, the second lens group 12B including at least one optical lens. The number of optical lenses can be one or more, and is not limited.

[0206] The first driving component includes a chip driving motor 30A, and the second driving component includes a chip driving motor 30B. The first chip driving motor 30A and the second chip driving motor 30B are respectively adapted to drive the first photosensitive component 40A and the second photosensitive component 40B to translate and / or rotate, thereby realizing the chip-based image stabilization function of the first camera module 1A and the second camera module 1B. The first chip driving motor 30A includes a first chip stabilization fixing part 31A, a first chip stabilization movable part 33A, a first chip driving element 32A, and a first chip driving conductive part (i.e., the first chip stabilization conductive part 35A). The second chip driving motor 30B includes a second chip stabilization fixing part 31B, a second chip stabilization movable part 33B, a second chip driving element 32B, and a second chip driving conductive part (i.e., the second chip stabilization conductive part 35B). The first chip stabilization fixing part 31A has a receiving cavity to accommodate the first chip stabilization movable part 33A, the first chip driving element 32A, and the first chip stabilization conductive part 35A. The second chip stabilization fixing part 31B has a receiving cavity to accommodate the second chip stabilization movable part 33B, the second chip driving element 32B, and the second chip stabilization conductive part 35B. The first chip stabilization conductive part 35A and the second chip stabilization conductive part 35B provide current to the first chip driving element 32A and the second chip driving element 32B, respectively. The first chip driving element 32A drives the first chip stabilization movable part 33A to move relative to the first chip stabilization fixing part 31A, and the second chip driving element 32B drives the second chip stabilization movable part 33B to move relative to the second chip stabilization fixing part 31B. The first photosensitive component 40A and the second photosensitive component 40B are respectively fixed to the first chip stabilization movable part 33A and the second chip stabilization movable part 33B, thereby driving the first photosensitive component 40A and the second photosensitive component 40B to move relative to the first chip stabilization fixing part 31A and the second chip stabilization fixing part 31B.

[0207] The first driving component of the first camera module 1A further includes a first lens drive motor 20A, and the second driving component of the second camera module 1B further includes a second lens drive motor 20B. The first lens drive motor 20A is adapted to drive the first optical lens 10A to translate and / or rotate, and the second lens drive motor 20B is adapted to drive the second optical lens 10B to translate and / or rotate, thereby realizing lens focusing, lens image stabilization, and other functions of the first camera module 1A and the second camera module 1B. The first lens drive motor 20A includes a first lens drive fixed part, a first lens drive movable part, a first lens drive element, and a first lens drive conductive part. The first lens drive fixed part has a receiving cavity to accommodate the first lens drive movable part, the first lens drive element, and the first lens drive conductive part. The first lens drive conductive part provides driving power to the first lens drive element, and the first lens drive element is used to drive the first lens drive movable part to move relative to the first lens drive fixed part. The second lens drive motor 20B includes a second lens drive fixed part, a second lens drive movable part, a second lens drive element, and a second lens drive conductive part. The second lens drive fixed part has a receiving cavity to accommodate the second lens drive movable part, the second lens drive element, and the second lens drive conductive part. The second lens drive conductive part provides drive power to the second lens drive element. The second lens drive element is used to drive the second lens drive movable part to move relative to the second lens drive fixed part.

[0208] The first optical lens 10A and the second optical lens 10B are respectively fixed to the first lens driving movable part and the second lens driving movable part. Thus, the first lens driving element drives the first optical lens 10A to move relative to the first lens driving fixed part, and the second lens driving element drives the second optical lens 10B to move relative to the second lens driving fixed part. For example, driving the first optical lens 10A and the second optical lens 10B to move along their optical axes achieves lens focusing; or driving the first optical lens 10A and the second optical lens 10B to translate along a direction perpendicular to their optical axes or driving the first optical lens 10A and the second optical lens 10B to rotate around a direction perpendicular to their optical axes achieves lens image stabilization. The first lens driving motor 20A fixes the first lens driving fixed part to the chip image stabilization fixed part 31A of the first chip driving motor 30A, thereby placing the first optical lens 10A on the light-sensing path of the first photosensitive component 40A. The second lens drive motor 20B fixes the second lens drive fixing part to the chip image stabilization fixing part 31B of the second chip drive motor 30B, thereby placing the second optical lens 10B on the light-sensing path of the second photosensitive component 40B.

[0209] In one embodiment of this application, the multi-camera module does not include a first lens drive motor 20A and / or a second lens drive motor 20B. The first optical lens 10A and / or the second optical lens 10B are directly mounted on the first chip stabilization fixing part 31A of the first chip drive motor 30A and / or the second chip stabilization fixing part 31B of the second chip drive motor 30B. Alternatively, the first optical lens 10A and / or the second optical lens 10B are indirectly mounted on the first chip stabilization fixing part 31A of the first chip drive motor 30A and / or the second chip stabilization fixing part 31B of the second chip drive motor 30B through a support member. This results in the first optical lens 10A being positioned on the light-sensing path of the first photosensitive component 40A, and the second optical lens 10B being positioned on the light-sensing path of the second photosensitive component 40B.

[0210] The first photosensitive component 40A includes a first circuit board 41A, a first photosensitive chip 42A electrically connected to the first circuit board 41A, and a first electronic component 43A. The second photosensitive component 40B includes a second circuit board 41B, a second photosensitive chip 42B electrically connected to the second circuit board 41B, and a second electronic component 43B. The first photosensitive chip 42A is used to receive ambient light collected by the first optical lens 10A for imaging and is electrically connected to an external mobile electronic device through the first circuit board 41A. The second photosensitive chip 42B is used to receive ambient light collected by the second optical lens 10B for imaging and is electrically connected to an external mobile electronic device through the second circuit board 41B. In one embodiment of this application, the first electronic component 43A and the second electronic component 43B can be one or more of passive electronic devices such as resistors and capacitors and active electronic devices such as driver chips and memory chips. The first electronic component 43A and the second electronic component 43B can be electrically connected to the front side of the first circuit board 41A and the second circuit board 41B, or they can be electrically connected to the back side of the first circuit board 41A and the second circuit board 41B, depending on the design requirements of the first camera module 1A and the second camera module 1B.

[0211] The first photosensitive chip 42A is directly or indirectly fixed to the first circuit board 41A. The first photosensitive chip 42A includes a photosensitive area and a non-photosensitive area. The first photosensitive chip 42A is electrically connected to the first circuit board 41A through chip pads located in the non-photosensitive area. For example, the first photosensitive chip 42A can be electrically connected to the first circuit board 41A by wire bonding (gold wire bonding), soldering, FC process (flip chip), or RDL (redistribution layer technology). The second photosensitive chip 42B is directly or indirectly fixed to the second circuit board 41B. The second photosensitive chip 42B includes a photosensitive area and a non-photosensitive area. The second photosensitive chip 42B is electrically connected to the second circuit board 41B through chip pads located in the non-photosensitive area. For example, the second photosensitive chip 42B can be electrically connected to the second circuit board 41B by wire bonding (gold wire bonding), soldering, FC process (flip chip), or RDL (redistribution layer technology).

[0212] In one embodiment of this application, the first circuit board 41A includes a circuit board body 411A and a connecting strip 412A, and the second circuit board 41B includes a circuit board body 411B and a connecting strip 412B. The connecting strip 412A of the first circuit board 41A is connected to and electrically connected to the circuit board body 411A, thereby transmitting the imaging information acquired by the first photosensitive chip 42A to an external mobile electronic device through the circuit board body 411A and the connecting strip 412A. The connecting strip 412B of the second circuit board 41B is connected to and electrically connected to the circuit board body 411B, thereby transmitting the imaging information acquired by the second photosensitive chip 42B to an external mobile electronic device through the circuit board body 411B and the connecting strip 412B.

[0213] In one specific embodiment of this application, the connecting strip 412A of the first circuit board 41A includes a first connecting strip 4121A and a second connecting strip 4122A. The first connecting strip 4121A and the second connecting strip 4122A extend outward from opposite sides of the circuit board body 411A, and further bend upward and sideways to make the first connecting strip 4121A and the second connecting strip 4122A electrically connected. This arrangement can make the circuit board body 411A remain stable during movement and further reduce the resistance when driving the first circuit board 41A to move. In one specific embodiment of this application, the connecting strip 412B of the second circuit board 41B includes a first connecting strip 4121B and a second connecting strip 4122B. The first connecting strip 4121B and the second connecting strip 4122B extend outward from opposite sides of the circuit board body 411B, and further bend upward and sideways, so that the first connecting strip 4121B and the second connecting strip 4122B are electrically connected. This arrangement allows the circuit board body 411B to remain stable during movement, further reducing the resistance when driving the second circuit board 41B to move. Of course, in another specific example of this application, the first connecting strip 4121A and the second connecting strip 4122A of the first circuit board 41A can extend outward from adjacent sides of the circuit board body 411A and bend upward, and the first connecting strip 4121B and the second connecting strip 4122B of the second circuit board 41B can extend outward from adjacent sides of the circuit board body 411B and bend upward. This application does not limit this.

[0214] The first photosensitive component 40A further includes a first filter element 44A, which is held in the photosensitive path of the first photosensitive chip 42A for filtering the imaging light entering the first photosensitive chip 42A. The second photosensitive component 40B further includes a second filter element 44B, which is held in the photosensitive path of the second photosensitive chip 42B for filtering the imaging light entering the second photosensitive chip 42B. In a specific example, the first filter element 44A is mounted and fixed to a first base 45A of the first photosensitive component 40A and corresponds to at least a portion of the photosensitive area of ​​the first photosensitive chip 42A. The first filter element 44A can be attached upright or upside down to the first base 45A. The first base 45A has a light-transmitting hole, so that the light from the first optical lens 10A can pass through the light-transmitting hole of the first base 45A and enter the first photosensitive chip 42A. The second filter element 44B is mounted and fixed to the second base 45B of the second photosensitive assembly 40B and corresponds to at least a portion of the photosensitive area of ​​the second photosensitive chip 42B. The second filter element 44B can be attached to the second base 45B either upright or upside down. The second base 45B has a light-transmitting hole, so that the light from the second optical lens 10B can pass through the light-transmitting hole of the second base 45B and enter the second photosensitive chip 42B.

[0215] The first photosensitive component 40A can be fixed to the first chip anti-shake movable part 33A of the first chip drive motor 30A via the first circuit board 41A (the first circuit board body 411A) or the first base 45A, so that the first photosensitive component 40A moves with the movement of the first chip anti-shake movable part 33A. The second photosensitive component 40B can be fixed to the second chip anti-shake movable part 33B of the second chip drive motor 30B via the second circuit board body 411B of the second circuit board 41B or the second base 45B, so that the second photosensitive component 40B moves with the movement of the second chip anti-shake movable part 33B.

[0216] In one embodiment of this application, the first photosensitive chip 42A and the second photosensitive chip 42B are respectively eccentrically arranged in the two single-camera modules (first camera module 1A and second camera module 1B) of the dual-camera camera module. That is, the central axis of the first photosensitive chip 42A is not aligned with the central axis of the first chip drive motor 30A, and the central axis of the second photosensitive chip 42B is not aligned with the central axis of the second chip drive motor 30B. Specifically, the side of the first photosensitive chip 42A with the shorter distance to the first chip movable carrier 331A is close to the side of the second photosensitive chip 42B with the shortest distance to the second chip movable carrier 331B. That is, the side of the photosensitive chip 42A close to the chip movable carrier 331A and the side of the photosensitive chip 42B close to the chip movable carrier 331B are arranged adjacent to each other. This allows the first optical lens 10A and the second optical lens 10B to be arranged closer together, thereby enhancing the optical performance of the dual-camera camera module.

[0217] The first chip driving element 32A is disposed between the first chip stabilization movable part 33A and the first chip stabilization fixed part 31A. The first chip stabilization conductive part 35A is electrically connected to the first chip driving element 32A and the first photosensitive component 40A, and provides driving power to the first chip driving element 32A to drive the first chip stabilization movable part 33A to translate in the X-axis direction (i.e., the direction set by the X-axis) and the Y-axis direction (i.e., the direction set by the Y-axis) and / or rotate around the Z-axis direction (i.e., the direction set by the Z-axis) to realize translational stabilization and / or rotational stabilization of the first photosensitive component 40A. The second chip driving element 32B is disposed between the second chip stabilization movable part 33B and the second chip stabilization fixed part 31B. The second chip stabilization conductive part 35B is electrically connected to the second chip driving element 32B and the second photosensitive component 40B, and provides driving power to the second chip driving element 32B to drive the second chip stabilization movable part 33B to translate in the X-axis direction (i.e., the direction set by the X-axis) and the Y-axis direction (i.e., the direction set by the Y-axis) and / or rotate around the Z-axis direction (i.e., the direction set by the Z-axis), so as to realize translational stabilization and / or rotational stabilization of the second photosensitive component 40B.

[0218] It is worth mentioning that in this embodiment, the X-axis and Y-axis are perpendicular to each other, and the Z-axis is perpendicular to the plane containing the X-axis and Y-axis. The Z-axis is also the direction of the optical axis of the first optical lens 10A and the second optical lens 10B. In other words, the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system, and the XOY plane containing the X-axis and Y-axis is also called the plane containing the horizontal direction.

[0219] In one embodiment of this application, the first chip stabilization fixing part 31A includes an upper cover 311A ​​and a base 312A that are fastened together to form the receiving cavity, and the second chip stabilization fixing part 31B includes an upper cover 311B and a base 312B that are fastened together to form the receiving cavity. The upper cover 311A ​​and the base 312A are fixed to each other to form a receiving cavity (i.e., the receiving cavity of the first chip stabilization fixing part 31A) to house the first chip stabilization movable part 33A, the first chip driving element 32A, the first chip stabilization conductive part 35A, and the first photosensitive component 40A, etc., of the camera module components. The upper cover 311B and the base 312B are fixed to each other to form a receiving cavity (i.e., the receiving cavity of the second chip stabilization fixing part 31B) to house the second chip stabilization movable part 33B, the second chip driving element 32B, the second chip stabilization conductive part 35B, and the second photosensitive component 40B, etc., of the camera module components. This not only protects the aforementioned camera module components but also reduces the entry of dust, dirt, or stray light into the interior of the first chip driving motor 30A and the second chip driving motor 30B. In a specific example of this application, the upper cover 311A, 311B and the base 312A, 312B can be made of metal materials such as non-magnetic stainless steel.

[0220] Specifically, in this embodiment, the upper cover 311A ​​of the first chip image stabilization fixing part 31A is disposed above the substrate 312A, and the upper cover 311B of the second chip image stabilization fixing part 31B is disposed above the substrate 312B. The upper cover 311A ​​of the first chip image stabilization fixing part 31A includes a cover body 3111A with a central opening, which corresponds to the first photosensitive component 40A, allowing light to enter the first photosensitive component 40A through the opening for imaging. The upper cover 311B of the second chip image stabilization fixing part 31B includes a cover body 3111B with a central opening, which corresponds to the second photosensitive component 40B, allowing light to enter the second photosensitive component 40B through the opening for imaging. Preferably, the opening is circular. Furthermore, the upper cover 311A ​​of the first chip image stabilization fixing part 31A may also include a cover periphery 3112A extending integrally from the cover body 3111A toward the base 312A, thereby being fixedly connected to the base 312A through the cover periphery 3112A. The upper cover 311B of the second chip image stabilization fixing part 31B may also include a cover periphery 3112B extending integrally from the cover body 3111B toward the base 312B, thereby being fixedly connected to the base 312B through the cover periphery 3112B. For example, the cover periphery 3112A, 3112B and the base 312A, 312B are fixed by laser welding or adhesive bonding. The cover periphery 3112A of the first chip stabilization fixing part 31A further includes at least one peripheral recess 31121A, thereby forming at least one connecting strip 412A outlet between the upper cover 311A ​​and the base 312A, allowing the connecting strip 412A of the first circuit board 41A to extend outward from the receiving cavity of the first chip stabilization fixing part 31A. The cover periphery 3112B of the second chip stabilization fixing part 31B further includes at least one peripheral recess 31121B, thereby forming at least one connecting strip 412B outlet between the upper cover 311B and the base 312B, allowing the connecting strip 412B of the second circuit board 41B to extend outward from the receiving cavity of the second chip stabilization fixing part 31B. In a specific example of this application, the cover periphery 3112A of the first chip anti-shake fixing part 31A includes two opposing periphery recesses 31121A, and two connecting strip outlets 412A are formed between the upper cover 311A ​​and the base 312A to allow the first connecting strip 4121A and the second connecting strip 4122A of the first circuit board 41A to extend outward from the receiving cavity of the first chip anti-shake fixing part 31A.The cover periphery 3112B of the second chip anti-shake fixing part 31B includes two opposing periphery recesses 31121B. Two connecting strip outlets 412B are formed between the upper cover 311B and the base 312B to allow the first connecting strip 4121B and the second connecting strip 4122B of the second circuit board 41B to extend outward from the receiving cavity of the second chip anti-shake fixing part 31B.

[0221] In this embodiment, the first chip stabilization movable part 33A is movably housed within the receiving cavity of the first chip stabilization fixing part 31A, and the second chip stabilization movable part 33B is movably housed within the receiving cavity of the second chip stabilization fixing part 31B. Specifically, the first chip stabilization movable part 33A is suspended within the receiving cavity of the first chip stabilization fixing part 31A, allowing it to move relative to the first chip stabilization fixing part 31A, and the second chip stabilization movable part 33B is suspended within the receiving cavity of the second chip stabilization fixing part 31B, allowing it to move relative to the second chip stabilization fixing part 31B.

[0222] The first chip stabilization movable part 33A includes a chip movable carrier 331A having opposing upper and lower surfaces. A first chip driving element 32A is disposed between the chip movable carrier 331A and the upper cover 311A, and the first chip driving element 32A drives the chip movable carrier 331A to move relative to the first chip stabilization fixing part 31A. The chip movable carrier 331A of the first chip stabilization movable part 33A is adapted to mount a first photosensitive component 40A thereon; that is, the first photosensitive component 40A is adapted to be mounted on the chip movable carrier 331A of the first chip stabilization movable part 33A. In one embodiment of this application, a first photosensitive component 40A is provided between the chip movable carrier 331A of the first chip image stabilization movable part 33A and the substrate 312A. The first photosensitive component 40A is mounted on the chip movable carrier 331A of the first chip image stabilization movable part 33A via the first circuit board 41A, and thus the first photosensitive component 40A moves with the chip movable carrier 331A of the first chip image stabilization movable part 33A. In the embodiments of this application, there is a gap between the chip movable carrier 331A of the first chip stabilization movable part 33A and the substrate 312A, and there is also a certain air gap between the bottom surface of the first photosensitive component 40A (i.e., the side of the first photosensitive component 40A close to the substrate 312A) and the substrate 312A. In this way, the movement of the first photosensitive component 40A is not easily hindered by the substrate 312A, reducing the driving force requirement of the first chip driving element 32A. In other words, the first photosensitive component 40A is suspended above the substrate 312A of the first chip stabilization movable part 33A.

[0223] The second chip stabilization movable part 33B includes a chip movable carrier 331B having opposing upper and lower surfaces. A second chip driving element 32B is disposed between the chip movable carrier 331B and the upper cover 311B, and the second chip driving element 32B drives the chip movable carrier 331B to move relative to the second chip stabilization fixing part 31B. The chip movable carrier 331B of the second chip stabilization movable part 33B is adapted to mount a second photosensitive component 40B thereon; that is, the second photosensitive component 40B is adapted to be mounted on the chip movable carrier 331B of the second chip stabilization movable part 33B. In one embodiment of this application, a second photosensitive component 40B is provided between the chip movable carrier 331B of the second chip image stabilization movable part 33B and the substrate 312B. The second photosensitive component 40B is mounted on the chip movable carrier 331B of the second chip image stabilization movable part 33B via the second circuit board 41B, and thus the second photosensitive component 40B moves with the chip movable carrier 331B of the second chip image stabilization movable part 33B. In the embodiments of this application, there is a gap between the chip movable carrier 331B of the second chip image stabilization movable part 33B and the substrate 312B, and there is also a certain air gap between the bottom surface of the second photosensitive component 40B (i.e., the side of the second photosensitive component 40B close to the substrate 312B) and the substrate 312B. In this way, the movement of the second photosensitive component 40B is not easily hindered by the substrate 312B, reducing the driving force requirement of the second chip driving element 32B. In other words, the second photosensitive component 40B is suspended above the substrate 312B of the second chip image stabilization movable part 33B.

[0224] It is worth mentioning that in the dual-camera module, at least one side (e.g., the first side) of the driving component (i.e., the first driving component) of the first camera module 1A does not have a first chip driving element 32A, and at least one side (e.g., the second side) of the driving component (i.e., the second driving component) of the second camera module 1B does not have a second chip driving element 32B. The side of the driving component of the first camera module 1A that does not have a chip driving element 32A (e.g., the first side) and the side of the driving component of the second camera module 1B that does not have a chip driving element 32B (e.g., the second side) are adjacent.

[0225] Specifically, no first chip driving element 32A is provided on the first side of the first chip driving motor 30A (i.e., the first side of the driving component of the first camera module 1A), and no second chip driving element 32B is provided on the second side of the second chip driving motor 30B (i.e., the second side of the driving component of the second camera module 1B). The first side of the first chip driving motor 30A and the second side of the second chip driving motor 30B are adjacent to each other. Because the first chip driving element 32A and the second chip driving element 32A do not need to be provided on the adjacent first side of the first chip driving motor 30A and the second side of the second chip driving motor 30B, it is not necessary to provide the first chip driving element 32A and the second chip driving element 32B. 32B, the first photosensitive chip 42A and the second photosensitive chip 40B have more placement space on the first side of the first chip driving motor 30A and the second side of the second chip driving motor 30B. This allows the first photosensitive chip 42A to be closer to the first side of the first chip driving motor 30A where the first chip driving element 32A is not located, and the second photosensitive chip 40B to be closer to the second side of the second chip driving motor 30B where the second chip driving element 32B is not located, thereby achieving the effect of the first photosensitive chip 42A and the second photosensitive chip 40B being eccentrically positioned.

[0226] The first side of the first chip drive motor 30A without the first chip drive element 32A and the second side of the second chip drive motor 30Bd are arranged adjacent to each other. That is, the first side of the first chip drive motor 30A without the first chip drive element 32A and the second side of the second chip drive motor 30Bd are arranged close to each other. This arrangement ensures that there are no chip drive elements (i.e., the first chip drive element 32A and the second chip drive assembly 32B) adjacent to the first camera module 1A and the second camera module 1B of the dual-camera module, so as to avoid the influence of magnetic interference.

[0227] Specifically, the first photosensitive component 40A has a first central axis, and the first driving component has a second central axis, which are offset from each other. Specifically, the central axis of the first photosensitive chip 42A of the first photosensitive component 40A is the first central axis of the first photosensitive component 40A, and the central axis of the first chip driving motor 30A is the second central axis of the first driving component. The first photosensitive chip 42A is eccentrically positioned relative to the center of the first driving component; that is, the photosensitive chip 42A of the first photosensitive component 40A is eccentrically positioned within the first chip driving motor 30A, and the central axis of the first photosensitive chip 42A of the first photosensitive component 40A is eccentrically positioned, meaning that the central axis of the first photosensitive chip 42A is not aligned with the central axis of the first chip driving motor 30A. (The central axis of the first photosensitive chip 42A is the axis that passes through the intersection of the diagonals of the first photosensitive chip 42A when viewed from above and is parallel to the Z-axis; the central axis of the first chip drive motor 30A is the axis that passes through the intersection of the diagonals of the first chip drive motor 30A when viewed from above and is parallel to the Z-axis).

[0228] The second photosensitive component 40B has a first central axis, and the second driving component has a second central axis, which are offset from each other. Specifically, the central axis of the second photosensitive chip 42B of the second photosensitive component 40B is the first central axis of the second photosensitive component 40B, and the central axis of the second chip driving motor 30B is the second central axis of the second driving component. The second photosensitive chip 42B is eccentrically positioned relative to the center of the second driving component, that is, the photosensitive chip 42B of the second photosensitive component 40B is eccentrically positioned within the second chip driving motor 30B, and the central axis of the second photosensitive chip 42B of the second photosensitive component 40B is eccentrically positioned, meaning that the central axis of the second photosensitive chip 42B is not the same as the central axis of the second chip driving motor 30B. (The central axis of the second photosensitive chip 42B is the axis that passes through the intersection of the diagonals of the second photosensitive chip 42B when viewed from above and is parallel to the Z-axis; the central axis of the second chip driving motor 30B is the axis that passes through the intersection of the diagonals of the second chip driving motor 30B when viewed from above and is parallel to the Z-axis).

[0229] The chip movable carrier 331A of the first chip stabilization movable part 33A includes a fixed chip carrier body 3311A and a chip carrier side portion 3312B. The first circuit board 41A is fixed to the bottom surface (i.e., the side facing the substrate 312A) of the chip carrier body 3311A of the first chip stabilization movable part 33A. The chip carrier body 3311A of the first chip stabilization movable part 33A has a carrier body through hole 33111A and 33111B. The carrier body through hole 33111A is not only suitable for providing a light path for the first photosensitive chip 42A of the first photosensitive component 40A, but also provides mounting space for the first electronic component 43A on the first photosensitive component 40A, preventing the first electronic component 43A from interfering with the first chip carrier body 3311A. The chip carrier side 3312A of the first chip image stabilization movable part 33A includes a first carrier side 33121A, a second carrier side 33122A, a third carrier side 33123A, and a fourth carrier side 33124A extending outward integrally from the chip carrier body 3311A. The first carrier side 33121A of the first chip image stabilization movable part 33A is disposed opposite to the third carrier side 33123A and adjacent to the second carrier side 33122A, 33122B and the fourth carrier side 33124A, 33124B. The second carrier side 33122A is disposed opposite to the fourth carrier side 33124A. The first carrier side 33121A, the second carrier side 33122A, the third carrier side 33123A and the fourth carrier side 33124A are adapted to serve as anti-collision components when the chip carrier body 3311A moves, so as to prevent the chip carrier body 3311A of the first chip anti-shake movable part 33A from directly colliding with the first chip anti-shake fixed part 31A.

[0230] The chip movable carrier 331B of the second chip stabilization movable part 33B includes a fixed chip carrier body 3311B and a chip carrier side portion 3312B. The second circuit board 41B is fixed to the bottom surface (i.e., the side facing the substrate 312B) of the chip carrier body 3311B of the second chip stabilization movable part 33B. The chip carrier body 3311B of the second chip stabilization movable part 33B has a carrier body through hole 33111B, 33111B. The carrier body through hole 33111B is not only suitable for providing a light path for the second photosensitive chip 42B of the second photosensitive component 40B, but also provides mounting space for the second electronic component 43B on the second photosensitive component 40B, preventing the second electronic component 43B from interfering with the second chip carrier body 3311B. The chip carrier side 3312B of the second chip image stabilization movable part 33B includes a first carrier side 33121B, a second carrier side 33122B, a third carrier side 33123B, and a fourth carrier side 33124B extending outwardly from the chip carrier body 3311B. The second carrier side 33121B of the first chip image stabilization movable part 33B is disposed opposite to the third carrier side 33123B and adjacent to the second carrier side 33122B and the fourth carrier side 33124B, and the second carrier side 33122B is disposed opposite to the fourth carrier side 33124B. The first carrier side 33121B, the second carrier side 33122B, the third carrier side 33123B and the fourth carrier side 33124B are adapted to serve as anti-collision components when the chip carrier body 3311B moves, so as to prevent the chip carrier body 3311B of the second chip anti-shake movable part 33B from directly colliding with the second chip anti-shake fixed part 31B.

[0231] In one embodiment of this application, the chip carrier side portion 3312A (first carrier side portion 33121A, second carrier side portion 33122A, third carrier side portion 33123A and fourth carrier side portion 33124A) of the first chip stabilization movable portion 33A further extends to the side of the chip carrier body 3311A. That is, the chip carrier side portion 3312A extends further outward from the outer periphery of the chip carrier body 3311A and protrudes from the sidewall of the chip carrier body 3311A. This allows the first chip stabilization movable portion 33A to collide with the first chip stabilization fixing portion 31A through the chip carrier side portion 3312A during movement, thereby avoiding direct collision between the chip carrier body 3311A where the first photosensitive component 40A is disposed and the first chip stabilization fixing portion 31A, which could damage the first photosensitive component 40A.

[0232] In one embodiment of this application, the chip carrier side portion 3312B (first carrier side portion 33121B, second carrier side portion 33122B, third carrier side portion 33123B and fourth carrier side portion 33124B) of the second chip stabilization movable portion 33B further extends to the side of the chip carrier body 3311B. That is, the chip carrier side portion 3312B extends further outward from the outer periphery of the chip carrier body 3311B and protrudes from the sidewall of the chip carrier body 3311B. This allows the second chip stabilization movable portion 33B to collide with the second chip stabilization fixing portion 31B through the chip carrier side portion 3312B during movement, thereby avoiding direct collision between the chip carrier body 3311B where the second photosensitive component 40B is disposed and the second chip stabilization fixing portion 31B, which could damage the second photosensitive component 40B.

[0233] The first photosensitive chip 42A is eccentrically disposed within the movable chip carrier 331A, with the center O of the first photosensitive chip 42A being... A The distances to the two opposite sides of the movable carrier 331 of the first chip stabilization movable part 33A are not equal. In other words, the first photosensitive chip 42A is closer to at least one side of the movable carrier 331A of the first chip stabilization movable part 33A, that is, the first photosensitive chip 42A is closer to at least one side of the first chip drive motor 30A. In a specific example of this application, the first photosensitive chip 42A of the first photosensitive component 40A has a rectangular structure including a long side and a wide side. The edges of the first photosensitive component 40A can be defined with a first side, a second side, a third side, and a fourth side. A rectangular coordinate system is established with the intersection of the diagonals of the first photosensitive chip 42A as the central origin. The first and third sides are parallel to the X-axis, and the second and fourth sides are parallel to the Y-axis. Correspondingly, the movable carrier 331A of the first chip stabilization movable part 33A also has a first side, a second side, a third side, and a fourth side corresponding to the first photosensitive component 40A.

[0234] The second photosensitive chip 42B is eccentrically disposed within the movable chip carrier 331B, with the center O of the second photosensitive chip 42B being... BThe distances to the two opposite sides of the movable carrier 331 of the second chip image stabilization movable part 33B are not equal. In other words, the second photosensitive chip 42B is closer to at least one side of the movable carrier 331B of the second chip image stabilization movable part 33B, that is, the second photosensitive chip 42B is closer to at least one side of the second chip drive motor 30B. In a specific example of this application, the second photosensitive chip 42B of the second photosensitive component 40B has a rectangular structure including a long side and a wide side. The edges of the second photosensitive component 40B can be defined with a first side, a second side, a third side, and a fourth side. A rectangular coordinate system is established with the intersection of the diagonals of the second photosensitive chip 42B as the origin. The first and third sides are parallel to the X-axis, and the second and fourth sides are parallel to the Y-axis. Correspondingly, the movable carrier 331B of the second chip image stabilization movable part 33B also has a first side, a second side, a third side, and a fourth side corresponding to the second photosensitive component 40B.

[0235] The side of the first camera module 1A adjacent to the third side of the chip movable carrier 331A of the first chip image stabilization movable part 33A is the first side of the first camera module 1A, the side of the chip movable carrier 331A adjacent to the first side of the first chip image stabilization movable part 33A is the second side of the first camera module 1A, the side of the chip movable carrier 331A adjacent to the fourth side of the first chip image stabilization movable part 33A is the third side of the first camera module 1A, and the side of the chip movable carrier 331A adjacent to the second side of the first chip image stabilization movable part 33A is the fourth side of the first camera module 1A. The side of the second camera module 1B adjacent to the first side of the chip movable carrier 331B of the second chip image stabilization movable part 33B is the first side of the second camera module 1B, the side adjacent to the third side of the chip movable carrier 331B of the second chip image stabilization movable part 33B is the second side of the first camera module 1B, the side adjacent to the second side of the chip movable carrier 331B of the second chip image stabilization movable part 33B is the third side of the first camera module 1B, and the side adjacent to the fourth side of the chip movable carrier 331B of the second chip image stabilization movable part 33B is the fourth side of the second camera module 1B.

[0236] The center O of the first photosensitive chip 42A A The distance to the first side of the movable carrier 331A of the chip is H1 A The center O of the first photosensitive chip 42A A The distance to the third side of the movable carrier 331A of the chip is H2 A H1 A >H2 A, that is, the distance between the first central axis of the first photosensitive chip 42A and the third side of the chip movable carrier 331A is less than the distance between the first central axis of the first photosensitive chip 42A and the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A. The first photosensitive chip 42A is closer to the third side of the chip movable carrier 331A of the first chip anti-shake movable part 33A and farther from the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A. The center O of the second photosensitive chip 42B B The distance to the first side of the chip movable carrier 331B is H1 B , the center O of the second photosensitive chip 42B B The distance to the third side of the chip movable carrier 331B is H2 B , H1 B > H2 B , that is, the distance between the first central axis of the second photosensitive chip 42B and the third side of the chip movable carrier 331B is less than the distance between the first central axis of the second photosensitive chip 42B and the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B. The second photosensitive chip 42B is closer to the third side of the chip movable carrier 331B of the second chip anti-shake movable part 33B and farther from the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B. For example, the H1 A , H1 B ranges from 6 mm to 8 mm, and H2 A , H2 B ranges from 3 mm to 4 mm. Preferably, H1 A , H1 B is 7.14 mm, and H2 A , H2 B is 3.74 mm. The third side of the chip movable carrier 331A of the first chip anti-shake movable part 33A is adjacent to the third side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, and the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A is away from the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, as Figure 15 and Figure 16 shown. <00006​​​​​​​​​That is, the first photosensitive chip 42A is closer to the third side of the chip movable carrier 331A of the first chip image stabilization movable part 33A and farther away from the first side of the chip movable carrier 331A, and the second photosensitive chip 42B is closer to the third side of the chip movable carrier 331B of the second chip image stabilization movable part 33B and farther away from the first side of the chip movable carrier 331B. This application does not impose any restrictions on this.

[0238] The center O of the first photosensitive chip 42A A The distance from the second side of the chip movable carrier 331A to the first chip anti-shake movable part 33A is H3. A The center O of the first photosensitive chip 42A A The distance from the fourth side of the chip movable carrier 331A to the first chip anti-shake movable part 33A is H4. A The H3 A It can be equal to H4 A The H3 A It can be smaller than H4 A The H3 A It can also be larger than H4 A In other words, the first photosensitive chip 42A only needs to be closer to at least one side of the chip movable carrier 331A of the first chip image stabilization movable part 33A, and this application does not impose any restrictions on this.

[0239] The center O of the second photosensitive chip 42B B The distance from the second chip movable carrier 331B to the second chip anti-shake movable part 33B is H3. B The center O of the second photosensitive chip 42B B The distance from the fourth side of the chip movable carrier 331B to the second chip anti-shake movable part 33B is H4. B The H3 B It can be equal to H4 B The H3 B It can be smaller than H4 B The H3 B It can also be larger than H4 B In other words, the second photosensitive chip 42B only needs to be closer to at least one side of the chip movable carrier 331B of the second chip image stabilization movable part 33B, and this application does not impose any restrictions on this.

[0240] The first chip driving element 32A includes a chip magnet assembly 321A and a chip coil assembly 322A. The chip coil assembly 322A of the first chip anti-shake movable part 33A is disposed on the chip movable carrier 331A. The chip magnet assembly 321A of the first chip driving element 32A is fixed to the upper cover 311A ​​of the first chip anti-shake fixed part 31A and corresponds to the chip coil assembly 322A. The chip magnet assembly 321A of the first chip stabilization fixing part 31A is fixed to the upper cover 311A ​​of the first chip stabilization fixing part 31A by means of, for example, adhesive medium. The chip coil assembly 322A of the first chip driving element 32A is fixed to the chip movable carrier 331A of the first chip stabilization movable part 33A. The chip magnet assembly 321A of the first chip driving element 32A and the chip coil assembly 322A are arranged opposite to each other, so that the first chip stabilization movable part 33A is driven to move relative to the first chip stabilization fixing part 31A by the magnetic force between the chip coil assembly 322A and the chip magnet assembly 321A. That is to say, in this application, the chip magnet assembly 321A of the first chip driving element 32A is the stator, and the chip coil assembly 322A of the first chip driving element 32A is the mover. This arrangement can prevent the movement of the chip movable carrier 331A of the first chip stabilization movable part 33A from being affected by magnetic interference, thereby avoiding affecting the chip stabilization effect.

[0241] The second chip driving element 32B includes a chip magnet assembly 321B and a chip coil assembly 322B. The chip coil assembly 322B of the second chip anti-shake movable part 33B is disposed on the chip movable carrier 331B. The chip magnet assembly 321B of the second chip driving element 32B is fixed to the upper cover 311B of the second chip anti-shake fixed part 31B and corresponds to the chip coil assembly 322B. The chip magnet assembly 321B of the second chip stabilization fixing part 31B is fixed to the upper cover 311B of the second chip stabilization fixing part 31B by means of, for example, adhesive. The chip coil assembly 322B of the second chip driving element 32B is fixed to the chip movable carrier 331B of the second chip stabilization movable part 33B. The chip magnet assembly 321B of the second chip driving element 32B and the chip coil assembly 322B are arranged opposite to each other, so that the magnetic field force between the chip coil assembly 322B and the chip magnet assembly 321B drives the second chip stabilization movable part 33B to move relative to the second chip stabilization fixing part 31B. That is to say, in this application, the chip magnet assembly 321B of the second chip driving element 32B is the stator, and the chip coil assembly 322B of the second chip driving element 32B is the mover. This arrangement can prevent the movement of the chip movable carrier 331B of the second chip stabilization movable part 33B from being affected by magnetic interference, thereby avoiding affecting the chip stabilization effect.

[0242] Further, the specific structure of the first chip driving element 32A will be described. Each chip coil assembly 322A of the first chip driving element 32A includes at least one chip coil. In one embodiment of this application, at least one side of the chip movable carrier 331A of the first chip stabilization movable part 33A is not provided with the chip coil assembly 322A. Specifically, the chip movable carrier 331A of the first chip stabilization movable part 33A includes a first side, a second side, a third side, and a fourth side that surround each other. The first side is opposite to the third side, and the second side is opposite to the fourth side. The first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, the Y-axis direction being perpendicular to the X-axis direction. The chip coil assembly 322A of the first chip driving element 32A includes a first chip coil group 3221A disposed on the first side, and a second chip coil group 3222A and a third chip coil group 3223A disposed on the opposite second and fourth sides.

[0243] Further, the specific structure of the second chip driving element 32B will be described. Each chip coil assembly 322B of the second chip driving element 32B includes at least one chip coil. In one embodiment of this application, at least one side of the chip movable carrier 331B of the second chip stabilization movable part 33B is not provided with the chip coil assembly 322B. Specifically, the chip movable carrier 331B of the second chip stabilization movable part 33B includes a first side, a second side, a third side, and a fourth side that surround each other. The first side is opposite to the third side, and the second side is opposite to the fourth side. The first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, wherein the Y-axis direction is perpendicular to the X-axis direction. The chip coil assembly 322B of the second chip driving element 32B includes a first chip coil group 3221B disposed on the first side, and a second chip coil group 3222B and a third chip coil group 33223B disposed on the opposite second and fourth sides.

[0244] The first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driving element 32A are disposed in the plane containing the X-axis and Y-axis, that is, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A are disposed horizontally. The first chip coil group 3221A of the first chip driving element 32A is disposed along the X-axis, the second chip coil group 3222A is disposed along the Y-axis, and the third chip coil group 3223A is disposed opposite to the second chip coil group 3222A and the third chip coil group 3223A along the Y-axis. Further, the second chip coil group 3222A and the third chip coil group 3223A of the first chip driving element 32A are symmetrical with respect to the Y-axis. The first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A of the first chip driving element 32A are arranged around three sides of the first photosensitive component 40A.

[0245] The first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B of the second chip driving element 32B are disposed in the plane containing the X-axis and Y-axis, that is, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B are disposed horizontally. The first chip coil group 3221B of the second chip driving element 32B is disposed along the X-axis, the second chip coil group 3222B is disposed along the Y-axis, and the third chip coil group 33223B is disposed opposite to the second chip coil group 33223B along the Y-axis. Furthermore, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B are symmetrical with respect to the Y-axis. The first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B of the second chip driving element 32B are arranged around three sides of the second photosensitive component 40B.

[0246] The first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driving element 32A each include at least one chip coil. That is, the first chip coil group 3221A of the first chip driving element 32A includes at least one chip coil, the second chip coil group 3222A includes at least one chip coil, and the third chip coil group 3223A includes at least one chip coil. For example, in a specific example of this application, the first chip coil group 3221A of the first chip driving element 32A includes a first chip coil 732211A and a second chip coil 732212A disposed on the first side, and the first chip coil 732211A and the second chip coil 732212A are arranged along the X-axis direction. Specifically, the first chip coil 732211A and the second chip coil 732212A of the first chip driving element 32A are arranged relatively parallel to each other along the X-axis direction; the second chip coil group 3222A includes a third chip coil 732221A disposed on the second side; the third chip coil group 3223A includes a fourth chip coil 732231A disposed on the fourth side; the third chip coil 732221A and the fourth chip coil 732231A are arranged relatively parallel to each other along the Y-axis direction. Alternatively, the first chip coil 732211A and the second chip coil 732212A of the first chip driving element 32A are disposed on the first side or the third side of the first photosensitive component 40A, and the third chip coil 732221A and the fourth chip coil 732231A are respectively disposed on the second side and the fourth side of the first photosensitive component 40A.

[0247] The first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B of the second chip driving element 32B each include at least one chip coil. That is, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B of the second chip driving element 32B each include at least one chip coil. For example, in a specific example of this application, the first chip coil group 3221B of the second chip driving element 32B includes a first chip coil 732211B and a second chip coil 732212B disposed on the first side, and the first chip coil 732211B and the second chip coil 732212B are arranged along the X-axis direction. Specifically, the first chip coil 732211B and the second chip coil 732212B of the second chip driving element 32B are arranged relatively parallel to each other along the X-axis direction; the second chip coil group 3222B includes a third chip coil 732221B disposed on the second side; the third chip coil group 33223B includes a fourth chip coil 732231B disposed on the fourth side; the third chip coil 732221B and the fourth chip coil 732231B are arranged relatively parallel to each other along the Y-axis direction. Alternatively, the first chip coil 732211B and the second chip coil 732212B of the second chip driving element 32B are disposed on the first or third side of the second photosensitive component 40B, and the third chip coil 732221B and the fourth chip coil 732231B are respectively disposed on the second and fourth sides of the second photosensitive component 40B.

[0248] The first chip coil 732211A and the second chip coil 732212A of the first chip driving element 32A work together to drive the first chip anti-shake movable part 33A to move along the Y-axis and / or rotate around the Z-axis. The third chip coil 732221A and the fourth chip coil 732231A work together to drive the first chip anti-shake movable part 33A to move along the X-axis.

[0249] The first chip coil 732211B and the second chip coil 732212B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move along the Y-axis and / or rotate around the Z-axis. The third chip coil 732221B and the fourth chip coil 732231B work together to drive the second chip anti-shake movable part 33B to move along the X-axis.

[0250] Preferably, the first chip coil 732211A and the second chip coil 732212A of the first chip driving element 32A are of the same size, and the third chip coil 732221A and the fourth chip coil 732231A are of the same size. However, the sizes of the third chip coil 732221A and the fourth chip coil 732231A are smaller than the sizes of the first chip coil 732211A and the second chip coil 732212A. This is because the third chip coil 732221A and the fourth chip coil 732231A of the first chip driving element 32A only need to drive the first chip anti-shake movable part 33 to translate along the X-axis, while the first chip coil 732211A and the second chip coil 732212A of the first chip driving element 32A need to drive the first chip anti-shake movable part 33 to translate along the Y-axis and to rotate around the Z-axis.

[0251] Preferably, the first chip coil 732211B and the second chip coil 732212B of the second chip driving element 32B are of the same size, and the third chip coil 732221B and the fourth chip coil 732231B are of the same size. The size of the third chip coil 732221B and the fourth chip coil 732231B is smaller than the size of the first chip coil 732211B and the second chip coil 732212B. This is because the third chip coil 732221B and the fourth chip coil 732231B of the second chip driving element 32B only need to drive the first chip anti-shake movable part 33 to translate along the X-axis, while the first chip coil 732211B and the second chip coil 732212B of the second chip driving element 32B need to drive the first chip anti-shake movable part 33 to translate along the Y-axis and to rotate the first chip anti-shake movable part 33 around the Z-axis.

[0252] In one embodiment of this application, the chip coil assembly 322A of the first chip driving element 32A further includes a coil circuit board 3224A disposed on the chip movable carrier 331A, wherein at least one chip coil in the chip coil assembly 322A is fixed and electrically connected to the coil circuit board 3224A. In a specific example of this application, the first chip coil group 3221A (first chip coil 732211A, second chip coil 732212A), the second chip coil group 3222A (third chip coil 732221A), and the third chip coil group 3223A (fourth chip coil 732231A) of the first chip driving element 32A are all fixed and electrically connected to the coil circuit board 3224A. The chip coil assembly 322A is electrically connected to the first chip anti-shake conductive part 35A through the coil circuit board 3224A, and is further electrically connected to the first circuit board 41A of the first photosensitive component 40A. Specifically, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driving element 32A can be wound coils that are fixedly electrically connected to the coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A can be directly wound on the coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A are directly etched on the coil circuit board 3224A to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322A of the first chip driving element 32A, thereby reducing the height of the chip driving motor 30A. Furthermore, the coil circuit board 3224A of the first chip driving element 32A has a circuit board light-transmitting hole 32241A, which provides light from the first optical lens 10A to enter the first photosensitive component 40A through a light-transmitting hole.

[0253] In one embodiment of this application, the chip coil assembly 322B of the second chip driving element 32B further includes a coil circuit board 3224B disposed on the chip movable carrier 331B, wherein at least one chip coil in the chip coil assembly 322B is fixed and electrically connected to the coil circuit board 3224B. In a specific example of this application, the first chip coil group 3221B (first chip coil 732211B, second chip coil 732212B), the second chip coil group 3222B (the third chip coil 732221B), and the third chip coil group 33223B (the fourth chip coil 732231B) of the second chip driving element 32B are all fixed and electrically connected to the coil circuit board 3224B. The chip coil assembly 322B is electrically connected to the second chip anti-shake conductive part 35B through the coil circuit board 3224B, and is further electrically connected to the second circuit board 41B of the second photosensitive component 40B. Specifically, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B of the second chip driving element 32B can be wound coils that are fixedly electrically connected to the coil circuit board 3224B; or, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B can be directly wound on the coil circuit board 3224B; or, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B can be directly etched on the coil circuit board 3224B to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322B of the second chip driving element 32B, thereby reducing the height of the chip driving motor 30B. Furthermore, the coil circuit board 3224B of the second chip driving element 32B has a circuit board light-transmitting hole 32241B, which provides light from the second optical lens 10B to enter a light-transmitting hole of the second photosensitive component 40B.

[0254] Accordingly, in one embodiment of this application, the chip magnet assembly 321A of the first chip driving element 32A includes a first chip magnet group 3211A, a second chip magnet group 3212A, and a third chip magnet group 3213A. The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A are disposed on the plane containing the X-axis and Y-axis (i.e., disposed in the horizontal direction). Further, the first chip magnet group 3211A of the first chip driving element 32A is disposed vertically opposite to the first chip coil group 3221A, the second chip magnet group 3212A is disposed vertically opposite to the second chip coil group 3222A, and the third chip magnet group 3213A is disposed vertically opposite to the third chip coil group 3223A, such that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211A of the first chip driving element 32A is arranged along the X-axis direction, and the second chip magnet group 3212A and the third chip magnet group 3213A are arranged along the Y-axis direction. The second chip magnet group 3212A and the third chip magnet group 3213A are arranged opposite to each other along the Y-axis direction, and the second chip magnet group 3212A and the third chip magnet group 3213A are symmetrical with respect to the Y-axis. In this application, the upper part is the side away from the first photosensitive component 40A, and the lower part is the side close to the first photosensitive component 40A.

[0255] The chip magnet assembly 321B of the second chip driving element 32B includes a first chip magnet group 3211B, a second chip magnet group 3212B, and a third chip magnet group 3213B. The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B are disposed on the plane containing the X-axis and Y-axis (i.e., disposed in the horizontal direction). Further, the first chip magnet group 3211B and the first chip coil group 3221B of the second chip driving element 32B are disposed vertically opposite each other, the second chip magnet group 3212B and the second chip coil group 3222B are disposed vertically opposite each other, and the third chip magnet group 3213B and the third chip coil group 32223B are disposed vertically opposite each other, so that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211B of the second chip driving element 32B is arranged along the X-axis direction, and the second chip magnet group 3212B and the third chip magnet group 3213B are arranged along the Y-axis direction. The second chip magnet group 3212B and the third chip magnet group 3213B are arranged opposite to each other along the Y-axis direction, and the second chip magnet group 3212B and the third chip magnet group 3213B are symmetrical with respect to the Y-axis. In this application, the upper part is the side away from the second photosensitive component 40B, and the lower part is the side closer to the second photosensitive component 40B.

[0256] The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A of the first chip driving element 32A each include at least one chip magnet. For example, in a specific example of this application, the first chip magnet group 3211A of the first chip driving element 32A includes a first chip magnet 732111A and a second chip magnet 732112A, which are arranged along the X-axis direction. Specifically, the first chip magnet 732111A and the second chip magnet 732112A are arranged relatively parallel to each other along the X-axis direction. The second chip magnet group 3212A of the first chip driving element 32A includes a third chip magnet 732121A; the third chip magnet group 3213A includes a fourth chip magnet 732131A, and the third chip magnet 732121A and the fourth chip magnet 732131A are arranged relatively parallel to each other along the Y-axis direction. More specifically, in the embodiments of this application, the first chip magnet group 3211A of the first chip driving element 32A is disposed at two opposite corners (i.e., corner areas) of the first photosensitive component 40A along the X-axis direction, and the second chip magnet group 3212A and the third chip magnet group 3213A are disposed at two opposite sides of the first photosensitive component 40A along the Y-axis direction.

[0257] The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B of the second chip driving element 32B each include at least one chip magnet. For example, in a specific example of this application, the first chip magnet group 3211B of the second chip driving element 32B includes a first chip magnet 732111B and a second chip magnet 732112B, which are arranged along the X-axis direction. Specifically, the first chip magnet 732111B and the second chip magnet 732112B are arranged relatively parallel to each other along the X-axis direction. The second chip magnet group 3212B of the second chip driving element 32B includes a third chip magnet 732121B; the third chip magnet group 3213B includes a fourth chip magnet 732131B, and the third chip magnet 732121B and the fourth chip magnet 732131B are arranged relatively parallel to each other along the Y-axis direction. More specifically, in the embodiments of this application, the first chip magnet group 3211B of the second chip driving element 32B is disposed at two opposite corners (i.e., corner areas) of the second photosensitive component 40B along the X-axis direction, and the second chip magnet group 3212B and the third chip magnet group 3213B are disposed at two opposite sides of the second photosensitive component 40B along the Y-axis direction.

[0258] The first chip magnet 732111A and the second chip magnet 732112A of the first chip driving element 32A work together to drive the first chip anti-shake movable part 33A to move along the Y-axis and / or rotate around the Z-axis. The third chip magnet 732121A and the fourth chip magnet 732131A work together to drive the first chip anti-shake movable part 33A to move along the X-axis.

[0259] The first chip magnet 732111B and the second chip magnet 732112B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move along the Y-axis and / or rotate around the Z-axis. The third chip magnet 732121B and the fourth chip magnet 732131B work together to drive the second chip anti-shake movable part 33B to move along the X-axis.

[0260] Preferably, the first chip magnet 732111A and the second chip magnet 732112A of the first chip driving element 32A are of the same size, and the third chip magnet 732121A and the fourth chip magnet 732131A are of the same size. The size of the third chip magnet 732121A and the fourth chip magnet 732131A is smaller than that of the first chip magnet 732111A and the second chip magnet 732112A. This is because the third chip magnet 732121A and the fourth chip magnet 732131A only need to drive the first chip anti-shake movable part 33A to translate along the X-axis, while the first chip magnet 732111A and the second chip magnet 732112A need to drive the first chip anti-shake movable part 33A to translate along the Y-axis and also drive the first chip anti-shake movable part 33A to rotate around the Z-axis.

[0261] Preferably, the first chip magnet 732111B and the second chip magnet 732112B of the second chip driving element 32B are of the same size, and the third chip magnet 732121B and the fourth chip magnet 732131B are of the same size, but their sizes are smaller than those of the first chip magnet 732111B and the second chip magnet 732112B. This is because the third chip magnet 732121B and the fourth chip magnet 732131B only need to drive the second chip anti-shake movable part 33B to translate along the X-axis, while the first chip magnet 732111B and the second chip magnet 732112B need to drive the second chip anti-shake movable part 33B to translate along the Y-axis and also drive it to rotate around the Z-axis.

[0262] The first chip coil group 3221A and the first chip magnet group 3211A of the first chip driving element 32A interact to drive the first chip anti-shake movable part 33A, thereby driving the first photosensitive component 40A to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222A and the second chip magnet group 3212A interact, and the third chip coil group 3223A and the third chip magnet group 3213A interact to jointly drive the first chip anti-shake movable part 33A, thereby driving the first photosensitive component 40A to translate in the X-axis direction.

[0263] The first chip coil group 3221B and the first chip magnet group 3211B of the second chip driving element 32B interact to drive the second chip anti-shake movable part 33B, thereby driving the second photosensitive component 40B to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222B and the second chip magnet group 3212B interact, and the third chip coil group 33223B and the third chip magnet group 3213B interact, jointly driving the second chip anti-shake movable part 33B, thereby driving the second photosensitive component 40B to translate in the X-axis direction.

[0264] The first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driving element 32A each include at least one chip coil. That is, the first chip coil group 3221A of the first chip driving element 32A includes at least one chip coil, the second chip coil group 3222A includes at least one chip coil, and the third chip coil group 3223A includes at least one chip coil. For example, in a specific example of this application, the first chip coil group 3221A of the first chip driving element 32A includes two opposing first chip coils 832211A disposed on the first side, forming a pair of first chip coils 832211A, and the pair of first chip coils 832211A are arranged along the X-axis direction. Specifically, the pair of first chip coils 832211A of the first chip driving element 32A are arranged parallel to each other along the X-axis direction; the second chip coil group 3222A includes a second chip coil 832212A disposed on the second side; the third chip coil group 3223A includes another second chip coil 832212A disposed on the fourth side opposite to the second chip coil 832212A disposed on the second side, forming a pair of second chip coils 832212A; the pair of second chip coils 832212A are arranged relatively parallel to each other along the Y-axis direction. Alternatively, the pair of first chip coils 832211A of the first chip driving element 32A are disposed on the first side or the third side of the first photosensitive component 40A, and two of the pair of second chip coils 832212A are respectively disposed on the second side and the fourth side of the first photosensitive component 40A.

[0265] The first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 3223B of the second chip driving element 32B each include at least one chip coil. That is, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 3223B of the second chip driving element 32B each include at least one chip coil. For example, in a specific example of this application, the first chip coil group 3221B of the second chip driving element 32B includes two opposing first chip coils 832211B disposed on the first side, forming a pair of first chip coils 832211B, which are arranged along the X-axis direction. Specifically, the pair of first chip coils 832211B of the second chip driving element 32B are arranged parallel to each other along the X-axis; the second chip coil group 3222B includes a second chip coil 832212B disposed on the second side; the third chip coil group 3223B includes another second chip coil 832212B disposed on the fourth side opposite to the second chip coil 832212B disposed on the second side, forming a pair of second chip coils 832212B; the pair of second chip coils 832212B are arranged relatively parallel to each other along the Y-axis. Alternatively, the pair of first chip coils 832211B of the second chip driving element 32B are disposed on the first or third side of the second photosensitive component 40B, and two of the two second chip coils 832212B are respectively disposed on the second and fourth sides of the second photosensitive component 40B.

[0266] The first chip driving element 32A’s pair of first chip coils 832211A work together to drive the first chip anti-shake movable part 33A to move along the Y-axis and / or rotate around the Z-axis, and the first chip anti-shake movable part 33A works together to drive the first chip anti-shake movable part 33A to move along the X-axis.

[0267] The pair of first chip coils 832211B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move along the Y-axis and / or rotate around the Z-axis, and the pair of second chip coils 832212B work together to drive the second chip anti-shake movable part 33B to move along the X-axis.

[0268] Preferably, the pair of first chip coils 832211A of the first chip driving element 32A are of the same size, and the pair of second chip coils 832212A are of the same size, with the size of the second chip coil 832212A being smaller than that of the first chip coil 832211A. This is because the second chip coil 832212A of the first chip driving element 32A only needs to drive the first chip anti-shake movable part 33A to translate along the X-axis, while the first chip coil 832211A needs to both drive the first chip anti-shake movable part 33A to translate along the Y-axis and drive the first chip anti-shake movable part 33A to rotate around the Z-axis.

[0269] The pair of first chip coils 832211B of the second chip driving element 32B are the same size, and the pair of second chip coils 832212B are the same size, but the size of the second chip coil 832212B is smaller than the size of the first chip coil 832211B. This is because the second chip coil 832212B of the second chip driving element 32B only needs to drive the second chip anti-shake movable part 33B to translate along the X-axis, while the first chip coil 832211B needs to drive the second chip anti-shake movable part 33B to both translate along the Y-axis and rotate around the Z-axis.

[0270] In one embodiment of this application, the chip coil assembly 322A of the first chip driving element 32A further includes a coil circuit board 3224A disposed on the chip movable carrier 331A of the first chip stabilization movable part 33A. At least one chip coil in the chip coil assembly 322A is fixed and electrically connected to the coil circuit board 3224A. In a specific example of this application, the first chip coil group 3221A (a pair of first chip coils 832211A), the second chip coil group 3222A (one second chip coil 832212A), and the third chip coil group 3223A (one second chip coil 832212A) of the first chip driving element 32A are all fixed and electrically connected to the coil circuit board 3224A. The chip coil assembly 322A is electrically connected to the first chip stabilization conductive part 35A through the coil circuit board 3224A, and is further electrically connected to the first circuit board 41A of the first photosensitive component 40A. Specifically, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 33223A of the first chip driving element 32A can be wound coils that are fixedly electrically connected to the coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 33223A can be directly wound on the coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 33223A can be directly etched on the coil circuit board 3224A to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322A of the first chip driving element 32A, thereby reducing the height of the first chip driving motor 30A. Furthermore, the coil circuit board 3224A of the first chip driving element 32A has a circuit board light-transmitting hole 32241A, which provides light from the first optical lens 10A to enter the first photosensitive component 40A through a light-transmitting hole.

[0271] The chip coil assembly 322B of the second chip driving element 32B further includes a coil circuit board 3224B disposed on the chip movable carrier 331B of the second chip anti-shake movable part 33B. At least one chip coil in the chip coil assembly 322B is fixed and electrically connected to the coil circuit board 3224B. In a specific example of this application, the first chip coil group 3221B (a pair of first chip coils 832211B), the second chip coil group 3222B (one second chip coil 832212B), and the third chip coil group 3223B (one second chip coil 832212B) of the second chip driving element 32B are all fixed and electrically connected to the coil circuit board 3224B. The chip coil assembly 322B is electrically connected to the second chip anti-shake conductive part 35B through the coil circuit board 3224B, and is further electrically connected to the second circuit board 41B of the second photosensitive component 40B. Specifically, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B of the second chip driving element 32B can be wound coils that are fixedly electrically connected to the coil circuit board 3224B; or, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B can be directly wound on the coil circuit board 3224B; or, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B can be directly etched on the coil circuit board 3224B to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322B of the second chip driving element 32B, thereby reducing the height of the second chip driving motor 30B. Furthermore, the coil circuit board 3224B of the second chip driving element 32B has a circuit board light-transmitting hole 32241B, which provides light from the second optical lens 10B to enter a light-transmitting hole of the second photosensitive component 40B.

[0272] Accordingly, in one embodiment of this application, the chip magnet assembly 321A of the first chip driving element 32A includes a first chip magnet group 3211A, a second chip magnet group 3212A, and a third chip magnet group 3213A. The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A are disposed on the plane containing the X-axis and Y-axis (i.e., disposed in the horizontal direction). Further, the first chip magnet group 3211A of the first chip driving element 32A is disposed vertically opposite to the first chip coil group 3221A, the second chip magnet group 3212A is disposed vertically opposite to the second chip coil group 3222A, and the third chip magnet group 3213A is disposed vertically opposite to the third chip coil group 32223A, such that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211A of the first chip driving element 32A is arranged along the X-axis direction, and the second chip magnet group 3212A and the third chip magnet group 3213A are arranged along the Y-axis direction. The second chip magnet group 3212A and the third chip magnet group 3213A are arranged opposite to each other along the Y-axis direction, and the second chip magnet group 3212A and the third chip magnet group 3213A are symmetrical with respect to the Y-axis. In this application, the upper part is the side away from the first photosensitive component 40A, and the lower part is the side close to the first photosensitive component 40A.

[0273] The chip magnet assembly 321B of the second chip driving element 32B includes a first chip magnet group 3211B, a second chip magnet group 3212B, and a third chip magnet group 3213B. The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B are disposed on the plane containing the X-axis and Y-axis (i.e., disposed in the horizontal direction). Further, the first chip magnet group 3211B and the first chip coil group 3221B of the second chip driving element 32B are disposed vertically opposite each other, the second chip magnet group 3212B and the second chip coil group 3222B are disposed vertically opposite each other, and the third chip magnet group 3213B and the third chip coil group 32223B are disposed vertically opposite each other, so that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211B of the second chip driving element 32B is arranged along the X-axis direction, and the second chip magnet group 3212B and the third chip magnet group 3213B are arranged along the Y-axis direction. The second chip magnet group 3212B and the third chip magnet group 3213B are arranged opposite to each other along the Y-axis direction, and the second chip magnet group 3212B and the third chip magnet group 3213B are symmetrical with respect to the Y-axis. In this application, the upper part is the side away from the second photosensitive component 40B, and the lower part is the side closer to the second photosensitive component 40B.

[0274] The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A of the first chip driving element 32A each include at least one chip magnet. For example, in a specific embodiment of this application, the first chip magnet group 3211A of the first chip driving element 32A includes two opposing first chip magnets 832111A, forming a pair of first chip magnets 832111A. The pair of first chip magnets 832111A are arranged along the X-axis direction; specifically, the two first chip magnets 832111A are arranged parallel to each other along the X-axis direction. The second chip magnet group 3212A of the first chip driving element 32A includes one second chip magnet 832112A; the third chip magnet group 3213A includes one second chip magnet 832112A, forming a pair of second chip magnets 832112A. The pair of second chip magnets 832112A are arranged relatively parallel to each other along the Y-axis direction. More specifically, in the embodiments of this application, the first chip magnet group 3211A of the first chip driving element 32A is disposed at two opposite corners (i.e., corner areas) of the first photosensitive component 40A along the X-axis direction, and the second chip magnet group 3212A and the third chip magnet group 3213A are disposed at two opposite sides of the first photosensitive component 40A along the Y-axis direction.

[0275] The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B of the second chip driving element 32B each include at least one chip magnet. For example, in a specific example of this application, the first chip magnet group 3211B of the second chip driving element 32B includes two opposing first chip magnets 832111B, forming a pair of first chip magnets 832111B. The pair of first chip magnets 832111B are arranged along the X-axis direction; specifically, the two first chip magnets 832111B are arranged parallel to each other along the X-axis direction. The second chip magnet group 3212B of the second chip driving element 32B includes one second chip magnet 832112B; the third chip magnet group 3213B includes one second chip magnet 832112B, forming a pair of second chip magnets 832112B. The pair of second chip magnets 832112B are arranged relatively parallel to each other along the Y-axis direction. More specifically, in the embodiments of this application, the first chip magnet group 3211B of the second chip driving element 32B is disposed at two opposite corners (i.e., corner areas) of the second photosensitive component 40B along the X-axis direction, and the second chip magnet group 3212B and the third chip magnet group 3213B are disposed at two opposite sides of the second photosensitive component 40B along the Y-axis direction.

[0276] The first chip driving element 32A’s pair of first chip magnets 832111A work together to drive the first chip anti-shake movable part 33A to move along the Y-axis and / or rotate around the Z-axis, and the pair of second chip magnets 3212A work together to drive the first chip anti-shake movable part 33A to move along the X-axis.

[0277] The pair of first chip magnets 832111B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move along the Y-axis and / or rotate around the Z-axis, and the pair of second chip magnet groups 3212B work together to drive the second chip anti-shake movable part 33B to move along the X-axis.

[0278] Preferably, the pair of first chip magnets 832111A of the first chip driving element 32A are of the same size, and the pair of second chip magnet groups 3212A are of the same size, with the size of the second chip magnet group 3212A being smaller than that of the first chip magnet 832111A. This is because the second chip magnet group 3212A of the first chip driving element 32A only needs to drive the first chip anti-shake movable part 33A to translate along the X-axis, while the first chip magnet 832111A needs to both drive the first chip anti-shake movable part 33A to translate along the Y-axis and drive the first chip anti-shake movable part 33A to rotate around the Z-axis.

[0279] The pair of first chip magnets 832111B in the second chip driving element 32B are the same size, and the pair of second chip magnet groups 3212B are the same size, but the size of the second chip magnet group 3212B is smaller than that of the first chip magnet 832111B. This is because the second chip magnet group 3212B of the second chip driving element 32B only needs to drive the second chip anti-shake movable part 33B to translate along the X-axis, while the first chip magnet 832111B needs to drive the second chip anti-shake movable part 33B to translate along the Y-axis and also drive the second chip anti-shake movable part 33B to rotate around the Z-axis.

[0280] Preferably, the first chip magnet 832111B and the second chip magnet 832112B of the second chip driving element 32B are of the same size, and the third chip magnet 832121B and the fourth chip magnet 832131B are of the same size, but their sizes are smaller than those of the first chip magnet 832111B and the second chip magnet 832112B. This is because the third chip magnet 832121B and the fourth chip magnet 832131B only need to drive the second chip anti-shake movable part 33B to translate along the X-axis, while the first chip magnet 832111B and the second chip magnet 832112B need to drive the second chip anti-shake movable part 33B to translate along the Y-axis and also drive it to rotate around the Z-axis.

[0281] The first chip coil group 3221A and the first chip magnet group 3211A of the first chip driving element 32A interact to drive the first chip anti-shake movable part 33A, thereby driving the first photosensitive component 40A to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222A and the second chip magnet group 3212A interact, and the third chip coil group 33223A and the third chip magnet group 3213A interact, jointly driving the first chip anti-shake movable part 33A, thereby driving the first photosensitive component 40A to translate in the X-axis direction.

[0282] The first chip coil group 3221B and the first chip magnet group 3211B of the second chip driving element 32B interact to drive the second chip anti-shake movable part 33B, thereby driving the second photosensitive component 40B to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222B and the second chip magnet group 3212B interact, and the third chip coil group 33223B and the third chip magnet group 3213B interact, jointly driving the second chip anti-shake movable part 33B, thereby driving the second photosensitive component 40B to translate in the X-axis direction.

[0283] In one embodiment of this application, at least one side of the first chip driving motor 30A is not provided with the first chip driving element 32A, so as to provide more space for the eccentric arrangement of the first photosensitive chip 42A. That is, the first photosensitive chip 42A can be disposed close to the side of the first chip driving motor 30A where the first chip driving element 32A is not provided, so that the central axis of the first photosensitive chip 42A is not consistent with the central axis of the first chip driving motor 30A.

[0284] In one embodiment of this application, at least one side of the second chip driving motor 30B is not provided with the second chip driving element 32B, so as to provide more space for the off-center arrangement of the second photosensitive chip 42B. That is, the second photosensitive chip 42B can be disposed close to the side of the second chip driving motor 30B where the second chip driving element 32B is not provided, so that the central axis of the second photosensitive chip 42B is not aligned with the central axis of the second chip driving motor 30B.

[0285] Furthermore, when the eccentrically positioned first photosensitive chip 42A is applied to the first camera module 1A and the eccentrically positioned second photosensitive chip 42B is applied to the second camera module 1B, at least one side of the first chip drive motor 30A does not have the first chip drive element 32A, and at least one side of the second chip drive motor 30B does not have the second chip drive element 32B. Furthermore, the side of the first chip drive motor 30A without the first chip drive element 32A and the side of the second chip drive motor 30B without the second chip drive element 32B are... Adjacent arrangement, that is, the side of the first chip drive motor 30A without the first chip drive element 32A and the side of the second chip drive motor 30B without the second chip drive element 32B are arranged close to each other. This arrangement means that the first chip drive element 32A and / or the second chip drive element 32B are not arranged at the adjacent positions of the first camera module 1A and the second camera module 1B of the dual-camera module, so as to avoid magnetic interference problems affecting the selection of the cooperation scheme of the first lens drive motor 20A and the second lens drive motor 20B.

[0286] Specifically, in one embodiment of this application, the chip magnet assembly 321A and the chip coil assembly 322A of the first chip driving element 32A are concentrated on three sides of the first photosensitive chip 42A. The first chip driving element 32A is not provided on one side of the first photosensitive chip 42A other than the three sides. This arrangement causes the central axis of the first photosensitive chip 42A to be set off off-center on the chip movable carrier 331A of the first chip anti-shake movable part 33A. The center O of the first photosensitive chip 42A is closer to the side of the chip movable carrier 331A where the first chip driving element 32A is not provided. For example, in a specific example of this application, the first chip magnet group 3211A and the first chip coil group 3221A of the first chip driving element 32A are disposed on the third and fourth sides of the first photosensitive chip 42A, and the second chip magnet group 3212A, the second chip coil group 3222A, the third chip magnet group 3213A, and the third chip coil group 3223A are disposed on the second side of the first photosensitive chip 42A. This arrangement makes the center O of the first photosensitive chip 42A close to the first side of the chip movable carrier 331A, that is, the central axis of the first photosensitive chip 42A is not consistent with the central axis of the first chip driving motor 30A.

[0287] The chip magnet assembly 321B and the chip coil assembly 322B of the second chip driving element 32B are concentrated on three sides of the second photosensitive chip 42B. The second chip driving element 32B is not provided on one side of the second photosensitive chip 42B other than the three sides. This arrangement makes the central axis of the second photosensitive chip 42B set off off-center on the chip movable carrier 331B of the second chip anti-shake movable part 33B. The center O of the second photosensitive chip 42B is closer to the side of the chip movable carrier 331B where the second chip driving element 32B is not provided. For example, in a specific example of this application, the first chip magnet group 3211B and the first chip coil group 3221B of the second chip driving element 32B are disposed on the third and fourth sides of the second photosensitive chip 42B, and the second chip magnet group 3212B, the second chip coil group 3222B, the third chip magnet group 3213B, and the third chip coil group 33223B are disposed on the second side of the second photosensitive chip 42B. This arrangement makes the center O of the second photosensitive chip 42B close to the first side of the chip movable carrier 331B, that is, the central axis of the second photosensitive chip 42B is not consistent with the central axis of the second chip driving motor 30B.

[0288] In one embodiment of this application, the chip magnet assembly 321A of the first chip driving element 32A further includes a magnetically conductive member (not shown in the figure) disposed between the first chip magnet group 3211A, the second chip magnet group 3212A, the third chip magnet group 3213A, and the upper cover 311A ​​of the first chip anti-shake fixing part 31A. The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A of the first chip driving element 32A are indirectly fixed to the upper cover 311A ​​of the first chip anti-shake fixing part 31A through the magnetically conductive member. The magnetically conductive member is adapted to enhance the magnetic field force of the chip magnet assembly 321A toward the chip coil assembly 322A, thereby enhancing the driving force of the first chip driving element 32A.

[0289] The chip magnet assembly 321B of the second chip driving element 32B further includes a magnetically conductive member (not shown in the figure) disposed between the first chip magnet group 3211B, the second chip magnet group 3212B, the third chip magnet group 3213B, and the upper cover 311B of the second chip anti-shake fixing part 31B. The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B of the second chip driving element 32B are indirectly fixed to the upper cover 311B of the second chip anti-shake fixing part 31B through the magnetically conductive member. The magnetically conductive member is adapted to enhance the magnetic field force of the chip magnet assembly 321B toward the chip coil assembly 322B, thereby enhancing the driving force of the second chip driving element 32B.

[0290] In one embodiment of this application, the first chip drive motor 30A further includes a first chip position sensing component 36A and a first chip holding component 34A. The first chip position sensing component 36A is used to acquire the position or motion information of the first photosensitive component 40A. The first chip holding component 34A is adapted to suspend the chip movable carrier 331A in the receiving cavity of the first chip anti-shake fixing part 31A, so that the first photosensitive component 40A can be suspended in the first chip anti-shake fixing part 31A by the first chip holding component 34A.

[0291] The second chip drive motor 30B further includes a second chip position sensing component 36B and a second chip holding component 34B. The second chip position sensing component 36B is used to acquire the position or motion information of the second photosensitive component 40B. The second chip holding component 34B is adapted to suspend the chip movable carrier 331B in the receiving cavity of the second chip anti-shake fixing part 31B. In this way, the second photosensitive component 40B can be suspended in the second chip anti-shake fixing part 31B by the second chip holding component 34B.

[0292] The first chip position sensing component 36A is fixed to the chip movable carrier 331A, so that when the chip movable carrier 331A moves, the first chip position sensing component 36A is adapted to obtain the position information of the chip movable carrier 331A by obtaining the magnetic field change of the chip magnet component 321A of the first chip anti-shake movable part 33A.

[0293] The second chip position sensing component 36B is fixed to the chip movable carrier 331B, so that when the chip movable carrier 331B moves, the second chip position sensing component 36B is adapted to obtain the position information of the chip movable carrier 331B by acquiring the magnetic field change of the chip magnet component 321B of the second chip anti-shake movable part 33B.

[0294] The first chip position sensing component 36A includes at least one position sensing element, and the number of position sensing elements is not limited by this application. In a specific example of this application, the first chip position sensing component 36A includes a first position sensing element 361A, a second position sensing element 362A, and a third position sensing element 363A, thereby sensing position information of the chip movable carrier 331A of the first chip anti-shake movable part 33A in three movements: translation along the X-axis direction, translation along the Y-axis direction, and rotation around the Z-axis direction. In the embodiments of this application, the first position sensing element 361A, the second position sensing element 362A, and the third position sensing element 363A of the first chip position sensing component 36A are Hall elements; in other embodiments of this application, the first position sensing element 361A, the second position sensing element 362A, and the third position sensing element 363A are driving chips with position sensing functions.

[0295] The second chip position sensing component 36B includes at least one position sensing element, and the number of position sensing elements is not limited by this application. In a specific example of this application, the second chip position sensing component 36B includes a first position sensing element 361B, a second position sensing element 362B, and a third position sensing element 363B, thereby sensing position information of the chip movable carrier 331B of the second chip anti-shake movable part 33B in three movements: translation along the X-axis direction, translation along the Y-axis direction, and rotation around the Z-axis direction. In the embodiments of this application, the first position sensing element 361B, the second position sensing element 362B, and the third position sensing element 363B of the second chip position sensing component 36B are Hall elements; in other embodiments of this application, the first position sensing element 361B, the second position sensing element 362B, and the third position sensing element 363B are driving chips with position sensing functions.

[0296] In a specific example of this application, a sensing element groove 33114A is formed on the chip carrier body 3311A of the first chip stabilization movable part 33A. The first chip position sensing component 36A is disposed in the sensing element groove 33114A, thereby preventing the height of the first chip position sensing component 36A from being too high. The first chip position sensing component 36A is electrically connected to the first circuit board 41A of the first photosensitive component 40A. In the height (Z-axis) direction set by the chip movable carrier 331A of the first chip stabilization movable part 33A, the first chip position sensing component 36A is disposed between the chip coil assembly 322A of the first chip driving element 32A and the first circuit board 41A. Preferably, the first chip position sensing component 36A is accommodated in the sensing element groove 33114A of the first chip stabilization movable part 33A and does not protrude from the sensing element groove 33114A.

[0297] A sensing element groove 33114B is formed on the chip carrier body 3311B of the second chip stabilization movable part 33B. The second chip position sensing component 36B is disposed in the sensing element groove 33114B, thereby preventing the height of the second chip position sensing component 36B from being too high. The second chip position sensing component 36B is electrically connected to the second circuit board 41B of the second photosensitive component 40B. In the height (Z-axis) direction set by the chip movable carrier 331B of the second chip stabilization movable part 33B, the second chip position sensing component 36B is disposed between the chip coil assembly 322B of the second chip driving element 32B and the second circuit board 41B. Preferably, the second chip position sensing component 36B is accommodated in the sensing element groove 33114B of the second chip stabilization movable part 33B and does not protrude from the sensing element groove 33114B.

[0298] The first chip holding assembly 34A includes a chip support assembly 341A and a chip magnetic attraction assembly 342A disposed between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the upper cover 311A. The chip magnetic attraction assembly 342A is fixed to the chip movable carrier 331A of the first chip anti-shake movable part 33A. Thus, the magnetic attraction between the chip magnetic attraction assembly 342A and the chip magnet assembly 321A causes the first chip anti-shake movable part 33A to be attracted to the upper cover 311A. The chip support component 341A of the first chip holding component 34A is disposed between the upper cover 311A ​​of the first chip anti-shake fixing part 31A and the chip movable carrier 331A of the first chip anti-shake movable part 33A. Under the action of the magnetic attraction between the chip magnetic attraction component 342A and the chip magnet component 321A, the chip support component 341A is clamped by the upper cover 311A ​​and the chip movable carrier 331A, and a gap is maintained between the chip movable carrier 331A and the upper cover 311A, thereby reducing the resistance of the first chip anti-shake movable part 33A during movement.

[0299] The second chip holding assembly 34B includes a chip support assembly 341B and a chip magnetic attraction assembly 342B disposed between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the upper cover 311B. The chip magnetic attraction assembly 342B is fixed to the chip movable carrier 331B of the second chip anti-shake movable part 33B. Thus, the magnetic attraction between the chip magnetic attraction assembly 342B and the chip magnet assembly 321B causes the second chip anti-shake movable part 33B to be attracted to the upper cover 311B. The chip support component 341B of the second chip holding component 34B is disposed between the upper cover 311B of the second chip anti-shake fixing part 31B and the chip movable carrier 331B of the second chip anti-shake movable part 33B. Under the action of the magnetic attraction between the chip magnetic attraction component 342B and the chip magnet component 321B, the chip support component 341B is clamped by the upper cover 311B and the chip movable carrier 331B, and a gap is maintained between the chip movable carrier 331B and the upper cover 311B, thereby reducing the resistance of the second chip anti-shake movable part 33B during movement.

[0300] In this embodiment, the chip support component 341A of the first chip holding component 34A is clamped and disposed between the first chip stabilization movable portion 33A and the first chip stabilization fixing portion 31A. That is, the chip support component 341A of the first chip holding component 34A includes a first support component, a second support component, and a third support component clamped and disposed between the first chip stabilization movable portion 33A and the first chip stabilization fixing portion 31A. Each of the first, second, and third support components includes a ball groove 3412A recessed in the chip movable carrier 331A of the first chip stabilization movable portion 33A and a ball 3411A disposed within the ball groove 3412A.

[0301] The chip support component 341B of the second chip holding assembly 34B is clamped and disposed between the second chip stabilization movable portion 33B and the second chip stabilization fixing portion 31B. Specifically, the chip support component 341B of the second chip holding assembly 34B includes a first support component, a second support component, and a third support component clamped and disposed between the second chip stabilization movable portion 33B and the second chip stabilization fixing portion 31B. Each of the first, second, and third support components includes a ball groove 3412B recessed in the chip movable carrier 331B of the second chip stabilization movable portion 33B and a ball 3411B disposed within the ball groove 3412B.

[0302] Specifically, in this embodiment, the at least three support components are arranged in a partially collinear manner. In a specific example of this application, the first support component, the second support component, and the third support component are arranged in a triangular pattern. The first support component is disposed on the first side of the movable chip carrier, and the second and third support components are disposed at the two corner regions of the third side of the movable chip carrier opposite to the first side. Preferably, the first support component is disposed in the middle region of the first side to provide stable support for the movable chip carrier 331A of the first chip anti-shake movable part 33A and the movable chip carrier 331B of the first chip anti-shake movable part 33B.

[0303] The number of balls 3411A and ball grooves 3412A in the first chip holding assembly 34A is not limited by this application. In one embodiment of this application, the chip support assembly 341A of the first chip holding assembly 34A includes three support assemblies, each of which includes at least one ball 3411A and at least one ball groove 3412A. That is, the chip support assembly 341A includes at least three balls 3411A disposed between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the upper cover 311A. A. To limit the movement range of the ball bearing 3411A, the chip support assembly 341A further includes at least three ball bearing grooves 3412A corresponding to at least three of the ball bearings 3411A. Preferably, at least three of the ball bearing grooves 3412A are formed on the chip movable carrier 331A. The depth of the ball bearing grooves 3412A is less than the diameter of the ball bearing 3411A. At least a portion of the ball bearing 3411A can protrude from the ball bearing grooves 3412A so that the ball bearing 3411A can maintain frictional contact with the upper cover 311A.

[0304] The chip support component 341B of the second chip holding assembly 34B is clamped and disposed between the second chip stabilization movable portion 33B and the second chip stabilization fixing portion 31B. Specifically, the chip support component 341B of the second chip holding assembly 34B includes a first support component, a second support component, and a third support component clamped and disposed between the second chip stabilization movable portion 33B and the second chip stabilization fixing portion 31B. Each of the first, second, and third support components includes a ball groove 3412B recessed in the chip movable carrier 331B of the second chip stabilization movable portion 33B and a ball 3411B disposed within the ball groove 3412B. The number of balls 3411B and ball grooves 3412B in the second chip holding assembly 34B is not limited by this application. In one embodiment of this application, the chip support assembly 341B of the second chip holding assembly 34B includes three support assemblies, each of which includes at least one ball 3411B and at least one ball groove 3412B. That is, the chip support assembly 341B includes at least three balls 3411B disposed between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the upper cover 311B. B. To limit the movement range of the ball bearing 3411B, the chip support assembly 341B further includes at least three ball bearing grooves 3412B corresponding to at least three of the ball bearings 3411B. Preferably, at least three of the ball bearing grooves 3412B are formed on the chip movable carrier 331B. The depth of the ball bearing grooves 3412B is less than the diameter of the ball bearing 3411B. At least a portion of the ball bearing 3411B can protrude from the ball bearing grooves 3412B so that the ball bearing 3411B can maintain frictional contact with the upper cover 311B.

[0305] Furthermore, the chip movable carrier 331A of the first chip stabilization movable part 33A also includes an extension post 3313A protruding from the upper surface of the chip carrier body 3311A, and a ball groove 3412A recessed from the upper surface of the extension post 3313A. In one embodiment of this application, the chip movable carrier 331A includes at least three extension posts 3313A formed on the chip carrier body 3311A, the at least three extension posts 3313A protruding from the upper surface of the chip carrier body 3311A, and at least three ball grooves 3412A formed on the at least three extension posts 3313A. The chip support component 341A of the first chip holding component 34A is disposed between the extension post 3313A of the first chip anti-shake movable part 33A and the upper cover 311A, so that a certain gap is maintained between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the upper cover 311A, and the gap does not change as the chip movable carrier 331A moves.

[0306] The chip movable carrier 331B of the second chip stabilization movable part 33B further includes an extension post 3313B protruding from the upper surface of the chip carrier body 3311B, and a ball groove 3412B recessed from the upper surface of the extension post 3313B. In one embodiment of this application, the chip movable carrier 331B includes at least three extension posts 3313B formed on the chip carrier body 3311B, the at least three extension posts 3313B protruding from the upper surface of the chip carrier body 3311B, and at least three ball grooves 3412B formed on the at least three extension posts 3313B. The chip support component 341B of the second chip holding component 34B is disposed between the extension post 3313B of the second chip anti-shake movable part 33B and the upper cover 311B, so that a certain gap is maintained between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the upper cover 311B, and the gap does not change with the movement of the chip movable carrier 331B.

[0307] In a specific example of this application, the chip movable carrier 331A of the first chip stabilization movable part 33A includes three extension posts 3313A formed on the chip carrier body 3311A, and the chip support assembly 341A of the first chip holding assembly 34A includes three ball grooves 3412A formed by the top surface of the extension posts 3313A being recessed, and three balls 3411A disposed between the three ball grooves 3412A and the upper cover 311A.

[0308] The chip movable carrier 331B of the second chip stabilization movable part 33B includes three extension posts 3313B formed on the chip carrier body 3311B, and the chip support assembly 341B of the second chip holding assembly 34B includes three ball grooves 3412B formed by the recessed top surface of the extension posts 3313B and three balls 3411B disposed between the three ball grooves 3412B and the upper cover 311B.

[0309] Specifically, in this embodiment, the at least three support components of the first chip holding component 34A are arranged in a partially collinear manner. Correspondingly, in the above specific example, the three extension posts 3313A of the first chip anti-shake movable part 33A are distributed at two adjacent corners of the chip carrier body 3311A and on the side opposite to the line connecting the adjacent corners, i.e., the three balls 3411A are arranged in a triangular configuration to provide stable support for the chip movable carrier 331A. The at least three support components of the second chip holding component 34B are arranged in a partially collinear manner. Correspondingly, in the above specific example, the three extension posts 3313B of the second chip anti-shake movable part 33B are distributed at two adjacent corners of the chip carrier body 3311B and on the side opposite to the line connecting the adjacent corners, i.e., the three balls 3411B are arranged in a triangular configuration to provide stable support for the chip movable carrier 331B.

[0310] The chip support component 341A of the first chip holding component 34A further includes a ball bearing support piece 3413A embedded in the chip movable carrier 331A of the first chip anti-shake movable part 33A and located at the bottom of the ball bearing groove 3412A, wherein the ball bearing 3411A is supported by the ball bearing support piece 3413A. In one embodiment of this application, the chip support component 341A of the first chip holding component 34A further includes at least three ball bearing support pieces 3413A, wherein the ball bearing support pieces 3413A are fixed to the chip movable carrier 331A of the first chip anti-shake movable part 33A and serve as the bottom surface of the ball bearing groove 3412A, and the ball bearing support pieces 3413A may be made of metal such as stainless steel, thereby providing a smoother support surface for the ball bearing 3411A and reducing the friction of the ball bearing 3411A rolling. In a specific example of this application, the chip support component 341A of the first chip holding component 34A includes three ball bearing support pieces 3413A. Each ball bearing support piece 3413A is fixed to the extension post 3313A of the chip movable carrier 331A of the first chip anti-shake movable part 33A by an insert molding method, and its upper surface is exposed as the bottom surface of each ball bearing groove 3412A. The ball bearing support piece 3413A includes a support piece body 34131A and a support piece connecting part 34132A. The support piece body 34131A Extending integrally with the support plate connecting portion 34132A, the upper surface of the support plate body 34131A is exposed and serves as the bottom surface of the ball groove 3412A. The support plate connecting portion 34132A is used to hold the ball support plate 3413A in the chip movable carrier 331A during the insert molding process. The support plate connecting portion 34132A can connect to the support plate connecting portions 34132A of other ball support plates 3413A or to other support components for supporting the support plate connecting portion 34132A. After the ball support plate 3413A of the first chip holding assembly 34A is formed in the chip movable carrier 331A of the first chip anti-shake movable part 33A through the insert molding process, the support plate connecting portion 34132A is cut, and a portion of the support plate connecting portion 34132A can be exposed outside the chip movable carrier 331A. That is, in some embodiments of this application, the ball support plate 3413A of the first chip holding assembly 34A includes a support plate body 34131A located at the bottom of the ball groove 3412A and a support plate connecting portion 34132A extending from the support plate body 34131A to the outside of the chip movable carrier 331A of the first chip anti-shake movable portion 33A.

[0311] The chip support component 341B of the second chip holding component 34B further includes a ball support piece 3413B embedded in the chip movable carrier 331B of the second chip anti-shake movable part 33B and located at the bottom of the ball groove 3412B, wherein the ball 3411B is supported by the ball support piece 3413B. In one embodiment of this application, the chip support component 341B of the second chip holding component 34B further includes at least three ball support pieces 3413B, wherein the ball support pieces 3413B are fixed to the chip movable carrier 331B of the second chip anti-shake movable part 33B and serve as the bottom surface of the ball groove 3412B. The ball support pieces 3413B may be made of metal such as stainless steel, thereby providing a smoother support surface for the ball 3411B and reducing the friction of the ball 3411B rolling. In a specific example of this application, the chip support component 341B of the second chip holding component 34B includes three ball bearing support pieces 3413B. Each ball bearing support piece 3413B is fixed to the extension post 3313B of the chip movable carrier 331B of the second chip anti-shake movable part 33B by an insert molding method, and its upper surface is exposed as the bottom surface of each ball bearing groove 3412B. The ball bearing support piece 3413B includes a support piece body 34131B and a support piece connecting part 34132B. Extending integrally with the support plate connecting portion 34132B, the upper surface of the support plate body 34131B is exposed and serves as the bottom surface of the ball groove 3412B. The support plate connecting portion 34132B is used to hold the ball support plate 3413B in the chip movable carrier 331B during the insert molding process. The support plate connecting portion 34132B can connect to the support plate connecting portions 34132B of other ball support plates 3413B or to other support components used to support the support plate connecting portion 34132B. After the ball support plate 3413B of the second chip holding assembly 34B is formed in the chip movable carrier 331B of the second chip anti-shake movable portion 33B through the insert molding process, the support plate connecting portion 34132B is cut off, and a portion of the support plate connecting portion 34132B can be exposed outside the chip movable carrier 331B. That is, in some embodiments of this application, the ball support plate 3413B of the second chip holding assembly 34B includes a support plate body 34131B located at the bottom of the ball groove 3412B and a support plate connecting portion 34132B extending from the support plate body 34131B to the outside of the chip movable carrier 331B of the second chip anti-shake movable portion 33B.

[0312] In some embodiments of this application, the chip magnetic component 342A of the first chip holding component 34A includes at least one chip magnetic element 3421A. The chip magnetic element 3421A is enclosed within the chip movable carrier 331A of the first chip anti-shake movable part 33A, so that the chip movable carrier 331A is suspended in the receiving cavity of the first chip anti-shake fixing part 31A by the magnetic attraction between the chip magnet component 321A of the first chip driving element 32A and the at least one chip magnetic element 3421A. In a specific example of this application, at least one of the chip magnetic elements 3421A of the first chip holding assembly 34A is embedded in the chip movable carrier 331A of the first chip stabilization movable part 33A through an insert molding process. At least one of the chip magnetic elements 3421A is disposed opposite to the chip magnet assembly 321A to generate a magnetic attraction between the at least one chip magnetic element 3421A and the chip magnet assembly 321A. On the one hand, the chip support assembly 341A of the first chip holding assembly 34A is clamped between the first chip stabilization fixing part 31A and the first chip stabilization movable part 33A by the action of the magnetic attraction. Specifically, the ball bearing 3411A is held between the upper cover 311A ​​and the movable chip carrier 331A by the magnetic attraction between at least one chip magnetic element 3421A of the first chip holding assembly 34A and the chip magnet assembly 321A of the first chip anti-shake movable part 33A. On the other hand, after the movable chip carrier 331A moves, the magnetic attraction keeps it in a position, which can be its initial position before being driven. The chip magnetic element 3421A of the first chip holding assembly 34A is made of a material with magnetic properties, suitable for generating magnetic attraction with a magnet.

[0313] The chip magnetic component 342B of the second chip holding component 34B includes at least one chip magnetic element 3421B. The chip magnetic element 3421B is enclosed in the chip movable carrier 331B of the second chip anti-shake movable part 33B, so that the chip movable carrier 331B is suspended in the receiving cavity of the second chip anti-shake fixing part 31B by the magnetic attraction between the chip magnet component 321B of the second chip driving element 32B and the at least one chip magnetic element 3421B. In a specific example of this application, at least one of the chip magnetic elements 3421B of the second chip holding assembly 34B is embedded in the chip movable carrier 331B of the second chip anti-shake movable part 33B through an insert molding process. At least one of the chip magnetic elements 3421B is disposed opposite to the chip magnet assembly 321B to generate a magnetic attraction between the at least one chip magnetic element 3421B and the chip magnet assembly 321B. On the one hand, the chip support assembly 341B of the second chip holding assembly 34B is clamped between the second chip anti-shake fixing part 31B and the second chip anti-shake movable part 33B by the action of the magnetic attraction. Specifically, the ball bearing 3411B is held between the upper cover 311B and the movable chip carrier 331B by the magnetic attraction between at least one chip magnetic element 3421B of the second chip holding assembly 34B and the chip magnet assembly 321B of the second chip anti-shake movable part 33B. On the other hand, after the movable chip carrier 331B moves, the magnetic attraction keeps it in a position, which can be its initial position before being driven. The chip magnetic element 3421B of the second chip holding assembly 34B is made of a material with magnetic properties, suitable for generating magnetic attraction with a magnet.

[0314] The chip magnetic element 3421A of the first chip holding assembly 34A includes a magnetic element body 34211A and a magnetic element connecting portion 34212A. The magnetic element body 34211A and the magnetic element connecting portion 34212A extend integrally. The magnetic element connecting portion 34212A is used to hold the position of the chip magnetic element 3421A in the chip movable carrier 331A of the first chip anti-shake movable portion 33A during the insert molding process. The magnetic element connecting portion 34212A can be connected to the magnetic element connecting portion 34212A of other chip magnetic elements 3421A or to other support components for supporting the magnetic element connecting portion 34212A. After the chip magnetic element 3421A of the first chip holding assembly 34A is formed in the chip movable carrier 331A of the first chip anti-shake movable part 33A through an insert molding process, the magnetic element connecting portion 34212A is cut off, and a portion of the magnetic element connecting portion 34212A can be exposed outside the chip movable carrier 331A. That is, in some embodiments of this application, the chip magnetic element 3421A of the first chip holding assembly 34A includes a magnetic element body 34211A covered within the chip movable carrier 331A of the first chip anti-shake movable part 33A and a magnetic element connecting portion 34212A extending from the magnetic element body 34211A to the outside of the chip movable carrier 331A.

[0315] The chip magnetic element 3421B of the second chip holding assembly 34B includes a magnetic element body 34211B and a magnetic element connecting portion 34212B. The magnetic element body 34211B and the magnetic element connecting portion 34212B extend integrally. The magnetic element connecting portion 34212B is used to hold the position of the chip magnetic element 3421B in the chip movable carrier 331B of the second chip anti-shake movable portion 33B during the insert molding process. The magnetic element connecting portion 34212B can be connected to the magnetic element connecting portion 34212B of other chip magnetic elements 3421B or to other support components for supporting the magnetic element connecting portion 34212B. After the chip magnetic element 3421B of the second chip holding assembly 34B is formed in the chip movable carrier 331B of the second chip anti-shake movable part 33B through an insert molding process, the magnetic element connecting portion 34212B is cut off, and a portion of the magnetic element connecting portion 34212B can be exposed outside the chip movable carrier 331B. That is, in some embodiments of this application, the chip magnetic element 3421B of the second chip holding assembly 34B includes a magnetic element body 34211B covered within the chip movable carrier 331B of the second chip anti-shake movable part 33B and a magnetic element connecting portion 34212B extending from the magnetic element body 34211B to the outside of the chip movable carrier 331B.

[0316] In one embodiment of this application, the upper surface of the chip magnetic element 3421A of the first chip holding component 34A is exposed and not wrapped by the chip movable carrier 331A of the first chip anti-shake movable part 33A; in other embodiments of this application, the upper surface of the chip magnetic element 3421A may also be wrapped by the chip movable carrier 331A, and this application is not limited thereto.

[0317] The upper surface of the chip magnetic element 3421B of the second chip holding component 34B is exposed and not wrapped by the chip movable carrier 331B of the second chip anti-shake movable part 33B; in other embodiments of this application, the upper surface of the chip magnetic element 3421B may also be wrapped by the chip movable carrier 331B, and this application is not limited thereto.

[0318] In particular, in one embodiment of this application, the chip magnetic attraction component 342A of the first chip holding component 34A includes a first chip magnetic attraction component 3422A and a second chip magnetic attraction component 3423A. Through the reasonable arrangement of the first chip magnetic attraction component 3422A and the second chip magnetic attraction component 3423A, the main functions of the first chip magnetic attraction component 3422A and the second chip magnetic attraction component 3423A are different. Viewed along the Z-axis, the three balls 3411A of the first chip holding component 34A are arranged in a triangular pattern. The first chip magnetic component 3422A is located at the corner of the triangular plane (i.e., the corner area), close to the balls 3411A. The main function of the first chip magnetic component 3422A is to generate a magnetic attraction force along the Z-axis with the chip magnet component 321A of the first chip driving element 32A, so that the chip support component 341A is clamped between the first chip anti-shake fixing part 31A and the... The first chip anti-shake movable part 33A is located between the first chip; the second chip magnetic attraction component 3423A is disposed at the edge of the triangular plane, that is, the distance from the second chip magnetic attraction component 3423A to the ball 3411A is greater than the distance from the first chip magnetic attraction component 3422A to the ball 3411A. The main function of the second chip magnetic attraction component 3423A is to generate a magnetic attraction force with the chip magnet group at a certain angle with the Z-axis direction after the chip movable carrier 331A moves. The main function of this magnetic attraction force is to make the chip movable carrier 331A return to a certain position. Of course, the fact that the first chip magnetic attraction component 3422A and the second chip magnetic attraction component 3423A of the first chip holding component 34A have different main functions does not mean that the first chip magnetic attraction component 3422A and the second chip magnetic attraction component 3423A will not have other functions. In other words, the first chip magnetic attraction component 3422A of the first chip holding component 34A also has the function of returning the movable chip carrier 331A to a position through magnetic attraction after the chip carrier 331A of the first chip anti-shake movable part 33A moves. The second chip magnetic attraction component 3423A also has the function of clamping the chip support component 341A between the first chip anti-shake fixing part 31A and the first chip anti-shake movable part 33A through magnetic attraction. The first chip magnetic attraction component 3422A and the second chip magnetic attraction component 3423A cooperate with each other and work together on the movable chip carrier 331A. However, because the positions of the first chip magnetic attraction component 3422A and the second chip magnetic attraction component 3423A are different, their main functions are different.

[0319] The chip magnetic attraction component 342B of the second chip holding component 34B includes a first chip magnetic attraction component 3422B and a second chip magnetic attraction component 3423B. Through the reasonable arrangement of the first chip magnetic attraction component 3422B and the second chip magnetic attraction component 3423B, their main functions differ. Viewed along the Z-axis, the three balls 3411B of the second chip holding component 34B are arranged in a triangular shape. The first chip magnetic attraction component 3422B is located at the corner of the triangular plane (i.e., the corner area), close to the balls 3411B. The main function of the first chip magnetic attraction component 3422B is to generate a magnetic attraction force along the Z-axis with the chip magnet component 321B of the second chip driving element 32B, so that the chip support component 341B is clamped between the second chip anti-shake fixing part 31B and the... The second chip anti-shake movable part 33B is located between the second chip magnetic attraction component 3423B and the ball bearing 3411B. The second chip magnetic attraction component 3423B is positioned at the edge of the triangular plane, meaning the distance from the second chip magnetic attraction component 3423B to the ball bearing 3411B is greater than the distance from the first chip magnetic attraction component 3422B to the ball bearing 3411B. The main function of the second chip magnetic attraction component 3423B is to generate a magnetic attraction force with the chip magnet group at a certain angle to the Z-axis direction after the movable chip carrier 331B moves. The main function of this magnetic attraction force is to return the movable chip carrier 331B to a certain position. Of course, the fact that the first chip magnetic attraction component 3422B and the second chip magnetic attraction component 3423B of the second chip holding component 34B have different main functions does not mean that the first chip magnetic attraction component 3422B and the second chip magnetic attraction component 3423B will not have other functions. In other words, the first chip magnetic component 3422B of the second chip holding component 34B also has the function of returning the movable chip carrier 331B to a position through magnetic attraction after the chip carrier 331B of the second chip anti-shake movable part 33B moves. The second chip magnetic component 3423B also has the function of clamping the chip support component 341B between the second chip anti-shake fixing part 31B and the second chip anti-shake movable part 33B through magnetic attraction. The first chip magnetic component 3422B and the second chip magnetic component 3423B cooperate with each other and work together on the movable chip carrier 331B. However, because the positions of the first chip magnetic component 3422B and the second chip magnetic component 3423B are different, their main functions are different.

[0320] Specifically, in this embodiment, the number of first chip magnetic assemblies 3422A in the first chip holding assembly 34A is four, including a first chip magnetic element 734221A, a second chip magnetic element 734222A, a third chip magnetic element 734223A, and a fourth chip magnetic element 734224A. The first chip magnetic element 734221A of the first chip holding assembly 34A and the first chip magnet 732111A of the first chip driving element 32A are arranged opposite each other along the height direction set by the chip movable carrier 331A of the first chip anti-shake movable part 33A. The second chip magnetic element 734222A and the second chip magnet 732112A are arranged opposite each other along the height direction set by the chip movable carrier 331A. The third chip magnetic element 734223A and the third chip magnet 732121A are arranged opposite each other along the height direction set by the chip movable carrier 331A. The fourth chip magnetic element 734224A and the fourth chip magnet 732131A are arranged relative to each other along the height direction set by the movable carrier 331A. In this application, the chip magnet assembly 321A and the first chip magnetic assembly 3422A do not need to be completely opposite each other when arranged relative to each other along the height direction set by the movable carrier 331A. That is to say, the projection of the chip magnet assembly 321A and the projection of the first chip magnetic assembly 3422A need to overlap at least partially.

[0321] The second chip holding assembly 34B has four first chip magnetic assemblies 3422B, including a first chip magnetic element 734221B, a second chip magnetic element 734222B, a third chip magnetic element 734223B, and a fourth chip magnetic element 734224B. The first chip magnetic element 734221B of the second chip holding assembly 34B and the first chip magnet 732111B of the second chip driving element 32B are positioned opposite each other along the height direction set by the chip movable carrier 331B of the second chip anti-shake movable part 33B. The second chip magnetic element 734222B and the second chip magnet 732112B are positioned opposite each other along the height direction set by the chip movable carrier 331B. The third chip magnetic element 734223B and the third chip magnet 732121B are positioned opposite each other along the height direction set by the chip movable carrier 331B. The fourth chip magnetic element 734224B and the fourth chip magnet 732131B are arranged relative to each other along the height direction set by the movable carrier 331B. In this application, the chip magnet assembly 321A and the first chip magnetic assembly 3422A do not need to be completely opposite each other when arranged relative to each other along the height direction set by the movable carrier 331B. That is to say, the projection of the chip magnet assembly 321B and the projection of the first chip magnetic assembly 3422B need to overlap at least partially.

[0322] The first chip magnetic element 734221A and the second chip magnetic element 734222A of the first chip holding assembly 34A are disposed on the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A, and the third chip magnetic element 734223A and the fourth chip magnetic element 734224A are respectively disposed on the second and fourth sides of the chip movable carrier 331A. Alternatively, the first chip magnetic element 734221A, the second chip magnetic element 734222A, the third chip magnetic element 734223A, and the fourth chip magnetic element 734224A of the first chip holding assembly 34A are arranged according to the position of the ball bearing 3411A.

[0323] The first chip magnetic element 734221B and the second chip magnetic element 734222B of the second chip holding assembly 34B are disposed on the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, and the third chip magnetic element 734223B and the fourth chip magnetic element 734224B are respectively disposed on the second and fourth sides of the chip movable carrier 331B. Alternatively, the first chip magnetic element 734221B, the second chip magnetic element 734222B, the third chip magnetic element 734223B, and the fourth chip magnetic element 734224B of the second chip holding assembly 34B are positioned according to the position of the ball bearing 3411B.

[0324] Furthermore, the first chip magnetic element 734221A and the second chip magnetic element 734222A of the first chip holding assembly 34A are disposed close to the ball bearing 3411A along the X-axis direction, and are respectively disposed on both sides of the two balls bearing 3411A; the third chip magnetic element 734223A and the fourth chip magnetic element 734224A are disposed close to the ball bearing 3411A along the Y-axis direction, and are respectively disposed on one side of one ball bearing 3411A. Because the first chip magnetic element 3422A of the first chip holding assembly 34A is closer to the ball bearing 3411A, the magnetic attraction force between it and the chip magnet assembly 321A of the first chip driving element 32A, which clamps the chip support assembly 341A, is more significant.

[0325] The first chip magnetic element 734221B and the second chip magnetic element 734222B of the second chip holding assembly 34B are positioned close to the ball bearing 3411B along the X-axis direction, with the first and second chip magnetic elements 734222B respectively positioned on both sides of the two balls 3411B. The third chip magnetic element 734223B and the fourth chip magnetic element 734224B are positioned close to the ball bearing 3411B along the Y-axis direction, with the third and fourth chip magnetic elements 734223B respectively positioned on one side of one ball bearing 3411B. Because the first chip magnetic element 3422B of the second chip holding assembly 34B is closer to the ball bearing 3411B, the magnetic attraction between it and the chip magnet assembly 321B of the second chip driving element 32B, which clamps the chip support assembly 341B, is more pronounced.

[0326] More specifically, in this embodiment, the number of second chip magnetic assemblies 3423A of the first chip holding assembly 34A is two, including a fifth chip magnetic element 734231A and a sixth chip magnetic element 734232A. The fifth chip magnetic element 734231A and the third chip magnet 732121A of the first chip driving element 32A are arranged opposite to each other along the height direction set by the chip movable carrier 331A of the first chip anti-shake movable part 33A. The sixth chip magnetic element 734232A and the fourth chip magnet 732131A are arranged opposite to each other along the height direction set by the chip movable carrier 331A. Furthermore, in a specific example of this application, the fifth chip magnetic element 734231A of the first chip holding assembly 34A is disposed between the first chip magnet 732111A and the third chip magnet 32131 of the first chip driving element 32A, and the sixth magnetic element is disposed between the second chip magnet 732112A and the fourth chip magnet 32121. Alternatively, the fifth chip magnetic element 734231A of the first chip holding assembly 34A is disposed on the second side of the chip movable carrier 331A of the first chip driving element 32A, and the sixth chip magnetic element 734232A is disposed on the fourth side of the chip movable carrier 331A. This configuration ensures that after the movable chip carrier 331A of the first chip stabilization movable part 33A moves, a magnetic attraction force with a certain angle to the Z-axis is generated between the second chip magnetic attraction component 3423A and the chip magnet component 321A of the first chip driving element 32A. This magnetic attraction force causes the movable chip carrier 331A to return to its original position. Of course, it is understandable that during this process, a magnetic attraction force is also generated between the first chip magnetic attraction component 3422A of the first chip holding component 34A and the chip magnet component 321A of the first chip driving element 32A, causing the movable chip carrier 331A of the first chip stabilization movable part 33A to return to its original position.

[0327] The second chip holding assembly 34B has two second chip magnetic assemblies 3423B, including a fifth chip magnetic element 734231B and a sixth chip magnetic element 734232B. The fifth chip magnetic element 734231B and the third chip magnet 732121B of the second chip driving element 32B are arranged opposite each other along the height direction set by the chip movable carrier 331B of the second chip anti-shake movable part 33B. The sixth chip magnetic element 734232B and the fourth chip magnet 732131B are arranged opposite each other along the height direction set by the chip movable carrier 331B. Further, in a specific example of this application, the fifth chip magnetic element 734231B of the second chip holding assembly 34B is disposed between the first chip magnet 732111B and the third chip magnet 32131 of the second chip driving element 32B, and the sixth magnetic element is disposed between the second chip magnet 732112B and the fourth chip magnet 32121. Alternatively, the fifth chip magnetic element 734231B of the second chip holding assembly 34B is disposed on the second side of the chip movable carrier 331B of the second chip driving element 32B, and the sixth chip magnetic element 734232B is disposed on the fourth side of the chip movable carrier 331B. This arrangement ensures that after the chip movable carrier 331B of the second chip anti-shake movable part 33B moves, a magnetic attraction force with a certain angle to the Z-axis is generated between the second chip magnetic element 3423B and the chip magnet assembly 321B of the second chip driving element 32B. This magnetic attraction force causes the chip movable carrier 331B to return to a certain position. Of course, it is understandable that during this process, a magnetic attraction force is also generated between the first chip magnetic element 3422B of the second chip holding assembly 34B and the chip magnet assembly 321B of the second chip driving element 32B, causing the chip movable carrier 331B of the second chip anti-shake movable part 33B to return to a certain position.

[0328] The first chip holding assembly 34A includes a first chip magnetic component 3422A, which includes at least one first chip magnetic element 834221A, and the second chip magnetic component 3423A includes at least one second chip magnetic element 834231A. The first chip magnetic element 834221A is adjacent to the first support component among the at least three support components, and the distance between the second chip magnetic element 834231A and any of the at least three support components is greater than the distance between the first chip magnetic element 834221A and the first support component.

[0329] The first chip magnetic component 3422B of the second chip holding component 34B includes at least one first chip magnetic element 834221B, and the second chip magnetic component 3423B includes at least one second chip magnetic element 834231B. The first chip magnetic element 834221B is adjacent to the first support component among the at least three support components, and the distance between the second chip magnetic element 834231B and any of the at least three support components is greater than the distance between the first chip magnetic element 834221B and the first support component.

[0330] In this embodiment, the first chip holding assembly 34A has four first chip magnetic attraction components 3422A and two second chip magnetic attraction components 3423A. The first chip magnetic attraction components 3422A of the first chip holding assembly 34A include two opposing first chip magnetic attraction elements 834221A and two opposing third chip magnetic attraction elements 834222A, forming a pair of first chip magnetic attraction elements 834221A and a pair of third chip magnetic attraction elements 834222A. The second chip magnetic attraction components 3423A include two second chip magnetic attraction elements 834231A, forming a pair of second chip magnetic attraction elements 834231A.

[0331] The second chip holding assembly 34B has four first chip magnetic assemblies 3422B and two second chip magnetic assemblies 3423B. The first chip magnetic assemblies 3422B of the second chip holding assembly 34B include two opposing first chip magnetic elements 834221B and two opposing third chip magnetic elements 834222B, forming a pair of first chip magnetic elements 834221B and a pair of third chip magnetic elements 834222B. The second chip magnetic assemblies 3423B include two second chip magnetic elements 834231B, forming a pair of second chip magnetic elements 834231B.

[0332] A pair of first chip magnetic elements 834221A and a pair of first chip magnets 832111A of the first chip holding assembly 34A are arranged opposite each other along the height direction set by the chip movable carrier 331A of the chip anti-shake movable part 33A. A pair of second chip magnetic elements 834231A and a pair of second chip magnets 832112A are also arranged opposite each other along the height direction set by the chip movable carrier 331A. That is, the pair of first chip magnetic elements 834221A of the first chip holding assembly 34A corresponds to a pair of first chip magnets 832111A in the height direction set by the chip movable carrier 331A of the chip anti-shake movable part 33A, and the pair of second chip magnetic elements 834231A corresponds to a pair of second chip magnets 832112A in the height direction set by the chip movable carrier 331A. In this application, the chip magnet component 321A and the first chip magnetic attraction component 3422A are not required to be perfectly aligned when they are positioned relative to each other along the height direction set by the movable chip carrier 331A. That is to say, the projection of the chip magnet component 321A and the projection of the first chip magnetic attraction component 3422A need to overlap at least partially.

[0333] The pair of first chip magnetic elements 834221B and the pair of first chip magnets 832111B of the second chip holding assembly 34B are arranged opposite each other along the height direction set by the chip movable carrier 331B of the chip anti-shake movable part 33B. Similarly, the pair of second chip magnetic elements 834231B and the pair of second chip magnets 832112B are arranged opposite each other along the height direction set by the chip movable carrier 331B. In other words, the pair of first chip magnetic elements 834221B of the second chip holding assembly 34B corresponds to the pair of first chip magnets 832111B along the height direction set by the chip movable carrier 331B of the chip anti-shake movable part 33B, and the pair of second chip magnetic elements 834231B corresponds to the pair of second chip magnets 832112B along the height direction set by the chip movable carrier 331B. In this application, the chip magnet component 321B and the first chip magnetic component 3422B are not required to be perfectly aligned when they are positioned relative to each other along the height direction set by the movable chip carrier 331B. That is to say, the projection of the chip magnet component 321B and the projection of the first chip magnetic component 3422B need to overlap at least partially.

[0334] A pair of first chip magnetic elements 834221A of the first chip holding assembly 34A are disposed on the first side of the chip movable carrier 331A, located on opposite sides of the first support assembly. A pair of third chip magnetic elements 834222A are disposed on the second and fourth sides of the chip movable carrier 331A, with one third chip magnetic element 834222A adjacent to the second support assembly and the other third chip magnetic element 834222A adjacent to the third support assembly. Alternatively, the first chip magnetic elements 834221A and the third chip magnetic elements 834222A of the first chip holding assembly 34A are positioned according to the position of the ball bearing 3411A of the support assembly.

[0335] A pair of first chip magnetic elements 834221B of the second chip holding assembly 34B are disposed on the first side of the chip movable carrier 331B, located on opposite sides of the first support assembly. A pair of third chip magnetic elements 834222B are disposed on the second and fourth sides of the chip movable carrier 331B, with one third chip magnetic element 834222B adjacent to the second support assembly and the other third chip magnetic element 834222B adjacent to the third support assembly. Alternatively, the first chip magnetic elements 834221B and the third chip magnetic elements 834222B of the second chip holding assembly 34B are positioned according to the position of the ball bearing 3411B of the support assembly.

[0336] Furthermore, a pair of first chip magnetic elements 834221A of the first chip holding assembly 34A are positioned close to the ball bearing 3411A along the X-axis direction, with the pair of first chip magnetic elements 834221A respectively positioned on both sides of the two balls bearing 3411A; a pair of third chip magnetic elements 834222A are positioned close to the ball bearing 3411A along the Y-axis direction, with the third chip magnetic elements 834222A respectively positioned on one side of one ball bearing 3411A. Because the first chip magnetic elements 3422A of the first chip holding assembly 34A are closer to the balls bearing 3411A, the magnetic attraction between them and the chip magnet assembly 321A of the first chip driving element 32A, which clamps the chip support assemblies 341A and 341B, is more pronounced.

[0337] A pair of first chip magnetic elements 834221B of the second chip holding assembly 34B are positioned close to the ball bearing 3411B along the X-axis direction, with the pair of first chip magnetic elements 834221B respectively positioned on both sides of the two balls bearing 3411B; a pair of third chip magnetic elements 834222B are positioned close to the ball bearing 3411B along the Y-axis direction, with the third chip magnetic elements 834222B respectively positioned on one side of one ball bearing 3411B. Because the first chip magnetic elements 3422B of the second chip holding assembly 34B are closer to the ball bearing 3411B, the magnetic attraction between them and the chip magnet assembly 321B of the second chip driving element 32B, which clamps the chip support assemblies 341B, is more pronounced.

[0338] It is worth mentioning that the dimensions of the first chip magnetic element 834221A and the third chip magnetic element 834222A of the first chip holding assembly 34A are larger than the dimensions of the second chip magnetic element 834231A. This is because the main function of the first chip magnetic element 834221A and the third chip magnetic element 834222A of the first chip holding assembly 34A is to clamp the ball 3411, which also serves to reset the chip movable carrier 331A of the first chip anti-shake movable part 33A. The second chip magnetic element 834231A and its corresponding chip magnet element only need to generate a resetting force to reset the chip movable carrier 331A.

[0339] The dimensions of the first chip magnetic element 834221B and the third chip magnetic element 834222B of the second chip holding assembly 34B are larger than the dimensions of the second chip magnetic element 834231B. This is because the main function of the first chip magnetic element 834221B and the third chip magnetic element 834222B of the second chip holding assembly 34B is to clamp the ball bearing 3411, which also serves to reset the chip movable carrier 331B of the second chip anti-shake movable part 33B. The second chip magnetic element 834231B and its corresponding chip magnet element only need to generate a resetting force to reset the chip movable carrier 331B.

[0340] In this embodiment, a pair of second chip magnetic elements 834231A of the first chip holding assembly 34A and a second chip magnet 832112 of the first chip driving element 32A are disposed opposite each other along the height direction set by the chip movable carrier 331A of the first chip anti-shake movable part 33A. Further, in a specific example of this application, a pair of second chip magnetic elements 834231A of the first chip holding assembly 34A are disposed between a pair of first chip magnets 832111A and a pair of third chip magnets 32131 of the first chip driving element 32A. Alternatively, one of the pair of second chip magnetic elements 834231A of the first chip holding assembly 34A is disposed in the middle region of the second side of the chip movable carrier 331A of the first chip anti-shake movable part 33A, and the other is disposed in the middle region of the fourth side of the chip movable carrier 331A. This configuration ensures that after the movable chip carrier 331A of the first chip stabilization movable part 33A moves, a magnetic attraction force with a certain angle to the Z-axis is generated between the second chip magnetic attraction component 3423A of the first chip holding component 34A and the chip magnet component 321A of the first chip driving element 32A. This magnetic attraction force causes the movable chip carrier 331A to return to its original position. Of course, it is understandable that during this process, a magnetic attraction force will also be generated between the first chip magnetic attraction component 3422A of the first chip holding component 34A and the chip magnet component 321A of the first chip driving element 32A, causing the movable chip carrier 331A of the first chip stabilization movable part 33A to return to its original position.

[0341] The pair of second chip magnetic elements 834231B of the second chip holding assembly 34B and the second chip magnet 832112 of the second chip driving element 32B are disposed opposite each other along the height direction set by the chip movable carrier 331B of the second chip anti-shake movable part 33B. Further, in a specific example of this application, the pair of second chip magnetic elements 834231B of the second chip holding assembly 34B is disposed between the pair of first chip magnets 832111B and the pair of third chip magnets 32131 of the second chip driving element 32B. Alternatively, one of the pair of second chip magnetic elements 834231B of the second chip holding assembly 34B is disposed in the middle region of the second side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, and the other is disposed in the middle region of the fourth side of the chip movable carrier 331B. This configuration ensures that after the movable chip carrier 331B of the second chip stabilization movable part 33B moves, a magnetic attraction force with a certain angle to the Z-axis is generated between the second chip magnetic attraction component 3423B of the second chip holding component 34B and the chip magnet component 321B of the second chip driving element 32B. This magnetic attraction force causes the movable chip carrier 331B to return to its original position. Of course, it is understandable that during this process, a magnetic attraction force is also generated between the first chip magnetic attraction component 3422B of the second chip holding component 34B and the chip magnet component 321B of the second chip driving element 32B, causing the movable chip carrier 331B of the second chip stabilization movable part 33B to return to its original position.

[0342] It is worth mentioning that the magnetic attraction force generated between the second chip magnetic attraction component 3423A of the first chip holding component 34A and the chip magnet component 321A of the first chip driving element 32A can be a force opposite to the moving direction of the chip movable carrier 331A of the first chip anti-shake movable part 33A. In this case, the magnetic attraction force is a reset force, which makes the chip movable carrier 331A return to a position. The magnetic attraction force generated between the second chip magnetic attraction component 3423A and the chip magnet component 321A can also be a force in the same direction as the moving direction of the chip movable carrier 331A. In this case, the magnetic attraction force is an external attraction force. This is because when the chip movable carrier 331A moves, the first circuit board 41A of the first photosensitive component 40A will also generate a certain reset force. The external attraction force slightly cancels out the reset force of the first circuit board 41A to compensate for the thrust of the chip movable carrier 331A at the edge.

[0343] The magnetic attraction force generated between the second chip magnetic attraction component 3423B of the second chip holding component 34B and the chip magnet component 321B of the second chip driving element 32B can be a force opposite to the moving direction of the chip movable carrier 331B of the second chip anti-shake movable part 33B. In this case, the magnetic attraction force is a reset force, causing the chip movable carrier 331B to return to a position. Alternatively, the magnetic attraction force generated between the second chip magnetic attraction component 3423B and the chip magnet component 321B can be a force in the same direction as the moving direction of the chip movable carrier 331B. In this case, the magnetic attraction force is an external attraction force. This is because when the chip movable carrier 331B moves, the second circuit board 41B of the second photosensitive component 40B will also generate a certain reset force. The external attraction force slightly cancels out the reset force of the second circuit board 41B to compensate for the thrust of the chip movable carrier 331B at the edge.

[0344] In a specific example of this application, the chip magnetic attraction component 342A of the first chip holding component 34A includes six chip magnetic attraction elements 3421A, and every two of the chip magnetic attraction elements 3421A have the same shape, thereby providing a uniform and stable magnetic attraction force, so that the chip movable carrier 331A of the first chip anti-shake movable part 33A is smoothly attracted to the upper cover 311A ​​of the first chip anti-shake fixing part 31A.

[0345] The chip magnetic attraction component 342B of the second chip holding component 34B includes six chip magnetic attraction elements 3421B. Every two chip magnetic attraction elements 3421B have the same shape, thereby providing a uniform and stable magnetic attraction force, so that the chip movable carrier 331B of the second chip anti-shake movable part 33B is smoothly attracted to the upper cover 311B of the second chip anti-shake fixing part 31B.

[0346] In this application, the chip movable carrier 331A of the first chip anti-shake movable part 33A can be integrally formed with the ball support sheet 3413A of the first chip holding component 34A and the chip magnetic element 3421A by injection molding in an insert molding manner, so as to reduce the number of components of the first chip drive motor 30A. The first chip anti-shake conductive part 35A can also be embedded into the first chip anti-shake movable part 33A by insert molding.

[0347] The chip movable carrier 331B of the second chip anti-shake movable part 33B can be integrally formed with the ball support 3413B of the second chip holding component 34B and the chip magnetic element 3421B by injection molding in an insert molding manner, so as to reduce the number of components of the second chip drive motor 30B. The second chip anti-shake conductive part 35B can also be embedded into the second chip anti-shake movable part 33B by insert molding.

[0348] Therefore, this application embeds the first chip anti-shake conductive part 35A into the first chip anti-shake movable part 33A by, for example, insert molding, to provide a first chip anti-shake movable part 33A with conductive function, so that the chip coil assembly 322A of the first chip driving element 32A can be electrically connected to the first circuit board 41A through the first chip anti-shake movable part 33A. Furthermore, since the first chip anti-shake conductive part 35A is embedded into the first chip anti-shake movable part 33A by insert molding, the first chip anti-shake movable part 33A is suitable for providing two flat mounting surfaces for mounting and fixing the chip coil assembly 322A of the first chip driving element 32A and the first circuit board 41A. This also reduces the number of components in the chip anti-shake motor, reduces the assembly complexity of the chip anti-shake motor, and protects the first chip anti-shake conductive part 35A.

[0349] This application embeds the second chip anti-shake conductive part 35B into the second chip anti-shake movable part 33B by, for example, insert molding, providing a conductive second chip anti-shake movable part 33B. This allows the chip coil assembly 322B of the second chip driving element 32B to be electrically connected to the second circuit board 41B through the second chip anti-shake movable part 33B. Furthermore, since the second chip anti-shake conductive part 35B is embedded into the second chip anti-shake movable part 33B by insert molding, the second chip anti-shake movable part 33B is suitable for providing two flat mounting surfaces for mounting and fixing the chip coil assembly 322B of the second chip driving element 32B and the second circuit board 41B. This also reduces the number of components in the chip anti-shake motor, reduces the assembly complexity of the chip anti-shake motor, and protects the second chip anti-shake conductive part 35B.

[0350] Specifically, the first chip stabilization movable portion 33A and the first chip stabilization conductive portion 35A form an embedded structure. The first chip stabilization conductive portion 35A includes at least one coil conductive component 351A. In one embodiment of this application, the first chip stabilization conductive portion 35A includes a plurality of (two or more) coil conductive elements 3511A. The plurality of coil conductive elements 3511A are embedded in the chip movable carrier 331A by, for example, insert molding. That is, the coil conductive elements 3511A are encapsulated within the chip stabilization movable carrier, so that the plurality of coil conductive elements 3511A can be electrically connected to the chip coil assembly 322A and the first circuit board 41A.

[0351] The second chip stabilization movable portion 33B and the second chip stabilization conductive portion 35B form an embedded structure. The second chip stabilization conductive portion 35B includes at least one coil conductive component 351B. In one embodiment of this application, the second chip stabilization conductive portion 35B includes a plurality of (two or more) coil conductive elements 3511B. The plurality of coil conductive elements 3511B are embedded in the chip movable carrier 331B by, for example, insert molding. That is, the coil conductive elements 3511B are covered within the chip stabilization movable carrier, so that the plurality of coil conductive elements 3511B can be electrically connected to the chip coil assembly 322B and the second circuit board 41B.

[0352] The number of coil conductive elements 3511A in the coil conductive assembly 351A of the first chip anti-shake conductive part 35A is related to the number of circuits required in the chip coil assembly 322A of the first chip driving element 32A. In a specific example of this application, the coil conductive assembly 351A of the first chip anti-shake conductive part 35A includes 6 coil conductive elements 3511A. Each of the coil conductive elements 3511A of the first chip anti-shake conductive portion 35A has an exposed first coil conductive end 35111A, an exposed second coil conductive end 35113A opposite to the first coil conductive end 35111A, and a coil conductive extension 35112A extending and electrically conducting between the first coil conductive end 35111A and the second coil conductive end 35113A. The first coil conductive end 35111A is positioned higher than the second coil conductive end 35113A, and the coil conductive extension 35112A extends downward from the first coil conductive end 35111A to the second coil conductive end 35113A. When the coil conductive element 3511A of the first chip anti-shake conductive part 35A is embedded in the chip movable carrier 331A of the first chip anti-shake movable part 33A, the chip movable carrier 331A does not cover the upper surface of the first coil conductive end 35111A, and the upper surface of the first coil conductive end 35111A is exposed for electrical connection with the chip coil assembly 322A of the first chip driving element 32A. The chip movable carrier 331A of the first chip anti-shake movable part 33A does not cover the lower surface of the second coil conductive end 35113A, and the lower surface of the second coil conductive end 35113A is exposed for electrical connection with the first circuit board 41A, thereby electrically connecting the chip coil assembly 322A and the first circuit board 41A. In some embodiments of this application, at least a portion of the first coil conductive ends 35111A of all coil conductive elements 3511A of the first chip anti-shake conductive portion 35A are exposed on the upper surface of the chip movable carrier 331A of the first chip anti-shake movable portion 33A, and the second coil conductive ends 35113A are exposed on the lower surface of the chip movable carrier 331A. At least one chip coil in the chip coil assembly 322A of the first chip driving element 32A is electrically connected to the first coil conductive end 35111A of the first chip anti-shake conductive portion 35A via the coil circuit board 3224A. The second coil conductive end 35113A is adapted to be electrically connected to the first circuit board 41A of the first photosensitive component 40A, thereby achieving electrical conduction between the chip coil assembly 322A and the first circuit board 41A.

[0353] The number of coil conductive elements 3511B in the coil conductive assembly 351B of the second chip anti-shake conductive part 35B is related to the number of circuits required in the chip coil assembly 322B of the second chip driving element 32B. In a specific example of this application, the coil conductive assembly 351B of the second chip anti-shake conductive part 35B includes 6 coil conductive elements 3511B. Each of the coil conductive elements 3511B of the second chip anti-shake conductive portion 35B has an exposed first coil conductive end 35111B, an exposed second coil conductive end 35113B opposite to the first coil conductive end 35111B, and a coil conductive extension 35112B extending and electrically conducting between the first coil conductive end 35111B and the second coil conductive end 35113B. The first coil conductive end 35111B is positioned higher than the second coil conductive end 35113B, and the coil conductive extension 35112B extends downward from the first coil conductive end 35111B to the second coil conductive end 35113B. When the coil conductive element 3511B of the second chip anti-shake conductive part 35B is embedded in the chip movable carrier 331B of the second chip anti-shake movable part 33B, the chip movable carrier 331B does not cover the upper surface of the first coil conductive end 35111B, and the upper surface of the first coil conductive end 35111B is exposed for electrical connection with the chip coil assembly 322B of the second chip driving element 32B. The chip movable carrier 331B of the second chip anti-shake movable part 33B does not cover the lower surface of the second coil conductive end 35113B, and the lower surface of the second coil conductive end 35113B is exposed for electrical connection with the second circuit board 41B, thereby electrically connecting the chip coil assembly 322B and the second circuit board 41B. In some embodiments of this application, at least a portion of the first coil conductive ends 35111B of all coil conductive elements 3511B of the second chip anti-shake conductive portion 35B are exposed on the upper surface of the chip movable carrier 331B of the second chip anti-shake movable portion 33B, and the second coil conductive end 35113B is exposed on the lower surface of the chip movable carrier 331B. At least one chip coil in the chip coil assembly 322B of the second chip driving element 32B is electrically connected to the first coil conductive end 35111B of the second chip anti-shake conductive portion 35B via the coil circuit board 3224B. The second coil conductive end 35113B is adapted to be electrically connected to the second circuit board 41B of the second photosensitive component 40B, thereby achieving electrical conduction between the chip coil assembly 322B and t...

Claims

1. A driving component, characterized in that, include: Chip stabilization fixing part with a receiving cavity; A chip stabilization movable part is movably housed within the housing cavity. The chip stabilization movable part includes a chip movable carrier adapted to mount a photosensitive component thereon. The photosensitive component has a first central axis. as well as A chip driving element for moving a movable chip carrier relative to a fixed chip stabilizing part within the receiving cavity to drive the chip stabilizing movable part of the chip; The drive component has a second central axis, and the first central axis is offset from the second central axis.

2. The driving component according to claim 1, wherein, The photosensitive component includes a photosensitive chip, and the central axis of the photosensitive chip is the first central axis of the photosensitive component.

3. The driving component according to claim 1, wherein, The photosensitive component includes a photosensitive chip, which is disposed off-center relative to the center of the driving component.

4. The driving component according to claim 2, wherein, The photosensitive component is adapted to be mounted on the movable chip carrier, wherein the chip anti-shake fixing part includes a top cover and a base that snap together to form the receiving cavity, and there is a gap between the movable chip carrier and the base.

5. The driving component according to claim 4, wherein, The driving component further includes a chip holding component, which includes at least one chip magnetic element enclosed within the movable chip carrier. The chip driving element includes a chip coil assembly disposed on the movable chip carrier and a chip magnet assembly fixed to the upper cover and corresponding to the chip coil assembly, so that the movable chip carrier is suspended within the receiving cavity of the chip anti-shake fixing part by the magnetic attraction between the chip magnet assembly and the at least one chip magnetic element.

6. The driving component according to claim 5, wherein, The chip coil assembly includes at least one chip coil, and the driving assembly further includes a chip anti-shake conductive portion. The chip anti-shake conductive portion includes at least one coil conductive element encased within the chip anti-shake movable carrier. Each coil conductive element has an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end. At least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is adapted to be electrically connected to the circuit board of the photosensitive component.

7. The driving component according to claim 6, wherein, The chip coil assembly further includes a coil circuit board disposed on the movable carrier of the chip, wherein at least one chip coil is fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the conductive end of the first coil.

8. The driving component according to claim 6, wherein, The chip holding assembly further includes a chip support assembly disposed between the chip movable carrier and the upper cover. The chip support assembly includes a ball groove recessed in the chip movable carrier and a ball disposed in the ball groove. The ball is held between the upper cover and the chip movable carrier by magnetic attraction between the at least one chip magnetic element and the chip magnet assembly.

9. The driving component according to claim 8, wherein, The chip support assembly also includes a ball support piece embedded in the movable carrier of the chip and located at the bottom of the ball groove, wherein the ball is supported by the ball support piece.

10. The driving component according to claim 9, wherein, The coil conductive element and the ball bearing support plate are not magnetic, while the chip magnetic element is magnetic.

11. The driving component according to claim 10, wherein, The coil conductive element, the ball bearing support plate, and the chip magnetic element are integrally formed with the chip movable carrier through injection molding.

12. The driving component according to claim 1, wherein, The chip anti-shake fixing part includes a top cover and a base that snap together to form the receiving cavity. The chip driving element includes a chip coil assembly disposed on the chip movable carrier and a chip magnet assembly fixed to the top cover and corresponding to the chip coil assembly. The chip coil assembly includes at least one chip coil group, and at least one side of the chip movable carrier is not provided with the chip coil group.

13. The driving component according to claim 12, wherein, The movable chip carrier includes a first side, a second side, a third side, and a fourth side that surround each other. The first side is opposite to the third side, and the second side is opposite to the fourth side. The chip coil assembly includes a first chip coil group disposed on the first side, and a second chip coil group and a third chip coil group disposed on the opposite second and fourth sides.

14. The drive component according to claim 13, wherein, The distance between the first central axis of the photosensitive component and the third side of the movable chip carrier is less than the distance between the first central axis of the photosensitive component and the first side of the movable chip carrier.

15. The drive component according to claim 14, wherein, The first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, wherein the Y-axis direction is perpendicular to the X-axis direction. The first chip coil group includes a first chip coil and a second chip coil disposed on the first side, the second chip coil group includes a third chip coil disposed on the second side, and the third chip coil group includes a fourth chip coil disposed on the fourth side.

16. The drive component according to claim 15, wherein, The first chip coil and the second chip coil are arranged relatively parallel to each other along the X-axis, and the third chip coil and the fourth chip coil are arranged relatively parallel to each other along the Y-axis.

17. A camera module, characterized in that, include: The drive component as described in any one of claims 1 to 16.

18. A multi-camera module, characterized in that, include: First camera module; as well as Second camera module; Wherein, at least one of the first camera module and the second camera module includes the driving component as described in any one of claims 1-16.

19. The multi-camera module according to claim 18, wherein, The first side of the driving component of the first camera module does not have a chip driving element, and the second side of the driving component of the second camera module does not have a chip driving element, wherein the first side of the driving component of the first camera module and the second side of the driving component of the second camera module are adjacent to each other.

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