A method and apparatus for cleaning metal surface ablation residues based on laser cleaning technology, and a medium

Abstract

The embodiments of the present disclosure disclose a metal surface ablation residue cleaning method and device based on laser cleaning technology, equipment and medium, wherein the method comprises: based on the working environment of the metal substrate, a metal substrate model is generated by constructing a simulation model of the metal substrate; based on the metal substrate model, an ablation motion simulation model is generated by simulating the process of flame ablation of the metal substrate surface; based on the ablation motion simulation model, ablation mechanism analysis information is generated by analyzing the generation mechanism of the ablation residue; finally, based on the ablation mechanism analysis information, the laser probe cleans the ablation residue on the metal surface of the metal substrate through the laser cleaning path with set parameters. The embodiments of the present disclosure realize that the laser cleaning technology can clean the ablation residue without damaging the substrate material, solve the problem of slow manual and mechanical cleaning, and improve the recycling efficiency of the substrate material.

Description

Technical Field

[0001] This disclosure relates to laser removal technology, and in particular to a method, apparatus, equipment, and medium for cleaning ablation residues on metal surfaces based on laser removal technology. Background Technology

[0002] During equipment operation, the high-temperature, high-speed jet of propellant emitted by the engine causes severe ablation and high-speed gas erosion on the inner surface of the metal substrate supporting the engine (a coupled effect of erosion and scouring by condensed phase particles), with ablation being the primary form of damage. The ablation products offer no protection to the metal substrate, only affecting the engine's normal operation and hindering the successful completion of production tasks. Furthermore, over time, they can cause corrosion and other harmful effects on the inner wall. Therefore, removing the ablation material is essential.

[0003] Currently, the cleaning and maintenance of ablation materials is extremely complex. Achieving good cleaning results is time-consuming and labor-intensive, primarily relying on traditional methods such as sandblasting and angle grinders for manual mechanized cleaning. These methods, involving scraping, wiping, brushing, and sandblasting to remove surface contaminants, require a considerable amount of time, hindering the rapid and continuous use of the metal substrate and impacting equipment operating efficiency. Furthermore, these methods suffer from drawbacks such as demanding skilled operators, numerous subsequent processing steps, significant thinning of weld seam walls after repeated grinding, high labor intensity, and poor cleaning consistency, severely affecting the subsequent use of the metal substrate.

[0004] Therefore, one or more methods are needed to solve the above problems.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] The purpose of this disclosure is to provide a method, apparatus, equipment, and medium for cleaning ablation residues on metal surfaces based on laser removal technology, thereby overcoming, at least to some extent, one or more problems caused by the limitations and defects of related technologies.

[0007] According to one aspect of this disclosure, a method for cleaning ablation residues on a metal surface based on laser removal technology is provided, comprising:

[0008] Based on the working environment of the metal substrate, a metal substrate model is generated by constructing a simulation model of the metal substrate.

[0009] Based on the metal substrate model, an ablation motion simulation model is generated by simulating the process of flame ablation of the metal substrate surface.

[0010] Based on the aforementioned ablation motion simulation model, the generation mechanism of ablation residues is analyzed to generate ablation mechanism analysis information.

[0011] Based on the ablation mechanism analysis information, a laser cleaning path is generated by setting the laser system parameters. The laser probe then completes the cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

[0012] In one exemplary embodiment of this disclosure, the construction of a simulation model of a metal substrate includes:

[0013] Based on the working environment of the metal substrate, the guide form of the metal substrate is established, and the guide form parameter information is generated.

[0014] Based on the working environment of the metal substrate, shape parameter information is generated by setting the shape of the metal substrate;

[0015] Based on the working environment of the metal substrate, material parameter information is generated by setting the material parameters of the metal substrate;

[0016] Based on the working environment of the metal substrate, dimensional parameter information is generated by setting the material dimensions of the metal substrate;

[0017] Based on the guide form parameter information, shape parameter information, material parameter information, and size parameter information, a metal substrate model is generated by constructing a simulation model of the metal substrate.

[0018] In one exemplary embodiment of this disclosure, simulation modeling of the process of flame ablation of a metal substrate surface includes:

[0019] Based on the aforementioned metal substrate model, an initial flow field computational domain is generated by defining the flow field computational domain of the jet.

[0020] Based on the metal substrate model, an ablation flow field computational domain is generated by constraining the boundary conditions of the initial flow field computational domain.

[0021] In one exemplary embodiment of this disclosure, simulation modeling of the process of flame ablation of a metal substrate surface includes:

[0022] Based on the ablation flow field calculation domain, gas characteristic data are generated by extracting gas temperature and gas velocity.

[0023] Based on the jet environment of the inner wall surface of the metal substrate, a gas flow field model is generated by analyzing the gas characteristic data.

[0024] Based on the gas flow field model, particle feature data is generated by classifying the size of condensed particles.

[0025] Based on the heat exchange between the condensed particles and the combustion gas, an ablation motion simulation model is generated by analyzing the particle characteristic data.

[0026] In one exemplary embodiment of this disclosure, the analysis of the generation mechanism of ablation residues includes:

[0027] Based on the ablation motion simulation model, thermomechanical analysis information is generated by analyzing the thermomechanical effects of the combustion gas.

[0028] Based on the ablation motion simulation model, compositional analysis information is generated by analyzing the composition of the ablation material on the surface of the metal substrate.

[0029] By integrating the thermomechanical analysis information and the composition analysis information, ablation mechanism analysis information is generated.

[0030] In one exemplary embodiment of this disclosure, setting laser system parameters includes:

[0031] Based on the ablation mechanism analysis information, laser power parameter information is generated by setting the laser power.

[0032] Based on the ablation mechanism analysis information, pulse frequency parameter information is generated by setting the laser pulse frequency;

[0033] Based on the ablation mechanism analysis information, the number of laser removal cycles is set to generate removal cycle parameter information;

[0034] Based on the ablation mechanism analysis information, duty cycle parameter information is generated by setting the duty cycle;

[0035] Laser parameter information is generated by integrating the laser power parameter information, pulse frequency parameter information, clearing count parameter information, and duty cycle parameter information.

[0036] In one exemplary embodiment of this disclosure, setting laser system parameters includes:

[0037] Based on the laser parameter information, a scanning width parameter is generated by setting the scanning width of the laser probe;

[0038] Based on the laser parameter information, a scanning speed parameter is generated by setting the scanning speed of the laser probe;

[0039] Based on the laser parameter information, the swing direction parameter is generated by setting the swing direction of the laser probe;

[0040] Based on the scanning width parameter, scanning speed parameter, and swing direction parameter, a laser cleaning path is generated by planning the cleaning path of the laser probe. The laser probe then completes the cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

[0041] In one aspect of this disclosure, a device for cleaning ablation residues on metal surfaces based on laser removal technology is provided, comprising:

[0042] The metal substrate model generation module is used to generate a metal substrate model by constructing a simulation model of the metal substrate.

[0043] The ablation motion simulation model building module is used to simulate and model the process of flame ablation of the metal substrate surface to generate an ablation motion simulation model.

[0044] The ablation mechanism analysis module is used to analyze the generation mechanism of ablation residues and generate ablation mechanism analysis information.

[0045] The laser cleaning path generation module is used to generate a laser cleaning path by setting the laser system parameters. The laser probe then uses the laser cleaning path to clean the ablation residue on the metal surface of the metal substrate.

[0046] In one aspect of this disclosure, an electronic device is provided, comprising:

[0047] Processor; and

[0048] A memory storing computer-readable instructions that, when executed by the processor, implement the method according to any one of the preceding claims.

[0049] In one aspect of this disclosure, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the method according to any one of the preceding claims.

[0050] Based on the embodiments of this disclosure, firstly, a metal substrate model is generated by constructing a simulation model of the metal substrate according to the working environment of the metal substrate. Then, based on this metal substrate model, an ablation motion simulation model is generated by simulating the process of flame ablation of the metal substrate surface. Next, based on the ablation motion simulation model, the generation mechanism of ablation residues is analyzed to generate ablation mechanism analysis information. Finally, based on the ablation mechanism analysis information, a laser probe completes the cleaning of ablation residues on the metal surface of the metal substrate through a laser cleaning path with pre-set parameters. Therefore, the laser cleaning technology provided by the embodiments of this disclosure can clean ablation residues without damaging the substrate material, solving the problems of slow manual mechanized cleaning and improving the recycling efficiency of the substrate material.

[0051] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure.

[0052] The technical solutions of this disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0053] The accompanying drawings, which form part of this specification, illustrate embodiments of this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0054] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein:

[0055] Figure 1 This is a flowchart illustrating a method for cleaning ablation residues on a metal surface based on laser removal technology, according to one embodiment of the method disclosed herein.

[0056] Figure 2 This is a flow field calculation domain design diagram for a method for cleaning metal surface ablation residues based on laser removal technology, according to an embodiment of the method disclosed herein.

[0057] Figure 3 This is a graph showing the gas velocity distribution on the inner wall of a metal substrate in a method for cleaning metal surface ablation residues based on laser removal technology, according to an embodiment of the method disclosed herein.

[0058] Figure 4 This is a graph showing the gas temperature distribution on the inner wall of a metal substrate in a method for cleaning metal surface ablation residues based on laser removal technology, according to an embodiment of the method disclosed herein.

[0059] Figure 5 This is a schematic diagram of a laser experimental platform for a method of cleaning metal surface ablation residues based on laser removal technology, which is an embodiment of the method disclosed herein.

[0060] Figure 6This is a schematic diagram illustrating the principle of laser thermal ablation for removing alumina from a metal surface, based on laser removal technology, as an embodiment of the method disclosed herein.

[0061] Figure 7 This is a structural block diagram of a metal surface ablation residue cleaning device based on laser removal technology, according to one embodiment of the method disclosed herein.

[0062] Figure 8 This is a block diagram of an electronic device according to an embodiment of the method of this disclosure. Detailed Implementation

[0063] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0064] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details described, or other methods, components, materials, apparatuses, steps, etc., can be employed. In other instances, well-known structures, methods, apparatuses, implementations, materials, or operations are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0065] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, or in one or more software-hardened modules, or in different network and / or processor devices and / or microcontroller devices.

[0066] In this disclosure, a method for cleaning ablation residues on metal surfaces based on laser removal technology is first provided; see reference. Figure 1 As shown, the method for cleaning ablation residues on a metal surface based on laser removal technology may include the following steps:

[0067] Step S110: Based on the working environment of the metal substrate, a metal substrate model is generated by constructing a simulation model of the metal substrate.

[0068] Step S120: Based on the metal substrate model, a simulation model of the ablation motion is generated by simulating the process of flame ablation of the metal substrate surface.

[0069] Step S130: Based on the ablation motion simulation model, the generation mechanism of ablation residue is analyzed to generate ablation mechanism analysis information.

[0070] Step S140: Based on the ablation mechanism analysis information, a laser cleaning path is generated by setting the laser system parameters. The laser probe then completes the cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

[0071] The following will further describe a method for cleaning metal surface ablation residues based on laser removal technology in an embodiment of this disclosure.

[0072] In step S110, a metal substrate model can be generated by constructing a simulation model of the metal substrate based on the working environment of the metal substrate.

[0073] In some optional embodiments of this example, firstly, the metal substrate can be classified into three types according to its support and guidance form: adapter type, guide rail type, and hybrid type. Depending on the different support forms of the engine, different support and guidance forms can be selected as the guidance form parameter information of the metal substrate. Depending on the different usage requirements, the shape parameter information of the metal substrate is determined by selecting different shapes such as rectangle, cylinder, rhombus, and octagon. The material parameter information of the metal substrate is determined according to the heat resistance requirements of the metal substrate material in different working environments. The size parameter information of the metal substrate is determined according to the size of the engine and the size of the working site in different environments.

[0074] Subsequently, based on the guidance form parameters, shape parameters, material parameters, and dimensional parameters, the metal substrate model was simulated and constructed using Ansys Fluent software. Furthermore, this metal substrate model can be used to simulate the ablation process of the engine's exhaust plume on the inner wall of the metal substrate during launch.

[0075] In step S120, an ablation motion simulation model can be generated based on the metal substrate model by simulating the process of flame ablation of the metal substrate surface.

[0076] In some alternative embodiments of this example, after the solid rocket motor ignites, the propellant grain is ignited in the combustion chamber, generating a large amount of gaseous flame while producing a violent chemical reaction. This high-temperature, high-pressure gas is accelerated through a Laval nozzle and ejected from the engine tail at near-sonic speeds onto the metal substrate. Therefore, by simulating and modeling the process of the gaseous flame ejecting onto the metal substrate, the ablation impact properties of the metal substrate can be comprehensively analyzed, thus providing theoretical support for the subsequent development of laser cleaning schemes.

[0077] When constructing an ablation motion simulation model, the first step is to define its computational domain. For example, if a closed, symmetrical metal substrate model is chosen to support the engine, half the size of this symmetrical metal substrate model can be used as the computational domain for the flow field because it is a symmetrical structure.

[0078] In a specific example, such as Figure 2 As shown, the length of the initial flow field computation domain can be set to 50 meters, the width to 15 meters, and the height to 10 meters.

[0079] Subsequently, to describe the behavior of the physical processes at the computational domain boundaries, the boundary conditions of this initial flow field computational domain were also set, forming a complete ablation flow field computational domain. This includes:

[0080] Constrain the boundary conditions for imports to generate import boundary conditions; constrain the boundary conditions for the metal wall to generate metal wall boundary conditions; constrain the boundary conditions for exports to generate export boundary conditions.

[0081] Specifically, the inlet total pressure can be set to 8 MPa, the inlet temperature to 3500 K, the metal wall to be insulated and non-slip, and the pressure outlet boundary P = 1 standard atmosphere.

[0082] In some alternative embodiments of this example, based on the constructed ablation flow field computational domain, the flow field motion characteristics data of the gas in the closed symmetric metal substrate model are analyzed by constructing a gas flow field model.

[0083] In a specific example, after the engine begins its box-like motion, the high-pressure combustion gas is accelerated through the Laval nozzle to form a high-speed jet, which then collides with and is reflected by the inner wall of the metal substrate, becoming an oblique shock wave. Furthermore, as the jet propagates downstream, its direction of motion is almost parallel to the box wall. For example... Figures 3-4 As shown, the trends of gas velocity and temperature near the inner wall of the metal substrate are opposite; the temperature is lower where the velocity is higher, and higher where the velocity is lower. During material ablation, the gas temperature and gas velocity correspond to the thermal effect and impact damage of the gas on the metal substrate, respectively.

[0084] Therefore, by constructing a gas flow field model to simulate the jet trajectory, the jet environment on the inner wall surface of the metal substrate can be analyzed intuitively, thereby enabling the extraction of gas temperature and gas velocity data at different locations on the inner wall surface of the metal substrate.

[0085] Meanwhile, in order to comprehensively consider the maximum ablation effect of the jet on the material, the working condition with the highest speed and temperature can also be selected as the ablation basis (as shown in the figure, in this example, the highest temperature near the inner wall of the metal substrate is 2450K (2176.85℃), and the highest speed is 1700m / s).

[0086] Next, the trajectories of agglomerated particles in solid propellant need to be analyzed. We first assume a normal particle size distribution in the solid propellant, and then generate particle characteristic data containing multiple characteristic sizes of the normal distribution based on the distribution range.

[0087] Based on the heat exchange between particles and gas, the particle characteristic data is then introduced into the gas flow field model to improve the ablation motion simulation model, which is then attributed to the behavior of high-speed, high-temperature particles ablation and adhesion on the surface of a metal substrate under the impetus of gas.

[0088] In one specific example, a solid propellant with added aluminum powder is used as the engine's propellant.

[0089] Based on the normal distribution of agglomerated particle size, analysis of alumina particles of different sizes shows that the condensed phase velocity of small-sized particles increases faster than that of large-sized particles. Therefore, at the booster nozzle exit, the velocity of small-sized particles decreases more rapidly, easily generating turbulence in the airflow. While large-sized particles accelerate more slowly, they reach the metal substrate surface at a much faster rate.

[0090] Meanwhile, as the alumina particles move toward the surface of the metal substrate, heat exchange occurs between the particles and the gas, and the larger the surface area of ​​the alumina particles exchanging heat with the gas, the more heat is transferred from the particles to the gas.

[0091] Therefore, by approximating the ablation process of the engine flame on the metal substrate, a simulation model of the ablation motion of alumina particles and combustion gases on the metal substrate can be constructed. This provides theoretical support for analyzing the formation mechanism and composition of ablated materials on the metal substrate surface. Furthermore, it provides a strong theoretical basis for subsequent laser removal schemes.

[0092] In step S130, based on the ablation motion simulation model, the generation mechanism of ablation residue can be analyzed to generate ablation mechanism analysis information.

[0093] In some alternative embodiments of this example, the analysis of the ablation process using the above-described ablation motion simulation model reveals that the ablation problem occurring on the metal substrate surface can be attributed to the thermomechanical effect of the combustion gas on the metal substrate, and the ablation and adhesion behavior of high-temperature, high-speed particles on the inner surface of the metal substrate under the action of the combustion gas. Therefore, to obtain ablation mechanism analysis information regarding ablation residues, the ablation residues on the metal substrate surface can be analyzed from two aspects.

[0094] The first part analyzes the thermomechanical effects of the gas on the metal substrate, obtaining thermomechanical analysis information.

[0095] Thermal effects can cause localized melting, carbonization, or ablation of the substrate material surface. In more severe cases, thermal effects may also lead to thermal expansion, stress concentration, or microcracks in the substrate material, affecting its mechanical properties and structural integrity. Impact damage can cause cracks, peeling, or fragmentation on the substrate material surface. In more severe cases, it can cause extensive structural damage.

[0096] The second part analyzes the composition of the ablation residue formed after high-temperature and high-speed particles ablate and adhere to the metal substrate, and obtains compositional analysis information.

[0097] Taking solid propellants with added aluminum powder as an example, the solidified phase content in the combustion products can reach 30 wt%, while the alumina particles generated by the oxidation reaction account for 98 wt% of the solidified phase. The main component of the ablation residue at this time is alumina particles.

[0098] By integrating the aforementioned thermomechanical and compositional analysis information to derive the ablation mechanism analysis, the extent of damage to the metal substrate and the main components of the ablation residue on the substrate can be determined. This allows for the development of appropriate removal plans.

[0099] In step S140, based on the ablation mechanism analysis information, a laser cleaning path can be generated by setting the laser system parameters. The laser probe then completes the cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

[0100] In some alternative embodiments of this example, when the metal substrate meets the removal requirements, the parameters of the laser removal system are set according to the physical properties of different residue components. These settings include parameters such as laser power, pulse frequency, number of removal passes, and duty cycle.

[0101] Furthermore, these parameters can be adjusted according to the actual laser removal process to ensure complete removal of ablation residues.

[0102] Preferably, only one parameter can be changed while keeping the others constant. Furthermore, the changed parameter should exhibit a slow increase or decrease trend. This ensures greater stability at the beginning and end of the laser's removal of ablation residues from the metal substrate, minimizing damage to the substrate.

[0103] In some alternative embodiments of this example, the cleaning operation of the laser probe on the metal substrate is controlled by setting the cleaning path of the laser probe according to the laser parameter information set above.

[0104] First, set an appropriate scanning width parameter (if the scanning width is set too small, the laser will ablate the substrate at the center of the unit scanning width; if the scanning width is set too large, the area at the edges of the unit scanning width that is not sufficiently cleared will be too large).

[0105] Next, set appropriate scanning speed parameters (if the scanning speed is set too fast, the ablation residue on the path will not be completely removed; if the scanning speed is set too slow, the metal substrate on the path will be over-removed).

[0106] Then, set an appropriate probe swing direction to solve the focusing problem caused by radial cleaning when the pipe or the cleaning surface is curved.

[0107] Finally, the laser probe is controlled to perform the cleaning operation on the metal substrate along the pre-set parameters. These parameters can be adjusted according to the actual laser cleaning process to ensure complete removal of any ablation residue. For example, after one axial cleaning cycle, a second radial cleaning can be performed on the edges of both sides of the scanning width unit.

[0108] In a specific example, such as Figures 5-6 As shown, based on the above ablation mechanism analysis information, the metal substrate of the example sample material is steel plate, and the ablation residue is alumina (according to the experiment, a 1500W laser has the highest removal efficiency for alumina).

[0109] First, set the laser power to 1500W, the scanning speed v / (mm / s) to a constant 15000, the pulse frequency f / kHz to a constant 50, the duty cycle η / % to the initial value of 100% and remain unchanged, the scanning width to 500mm, the number of scans to 1, and the swing direction to axial clearing.

[0110] Then, select a distance of 1m from the target to be removed, and begin removing the aluminum oxide from the steel surface at a 60° angle.

[0111] During the removal process, it is advisable to pause briefly to observe the removal progress. When a portion of the substrate (different from the ablated material) becomes visible, attention should be paid to avoid over-removal that could damage the steel substrate. If the exposed area is large, removal should be stopped, and the temperature of that area should be allowed to drop below 40°C before switching to mechanical removal or using a low-power laser (0.7kW-0.9kW) to remove the remaining ablated material, thus avoiding any adverse effects of the laser on the substrate.

[0112] This method, which primarily uses laser removal technology combined with traditional mechanical removal techniques, minimizes the impact of the laser on the substrate while reducing the difficulty of removal, shortening the removal time, and improving the removal efficiency. This allows used metal substrates to be maintained and repaired more quickly, avoiding the impact of ablation and improving overall efficiency.

[0113] It should be noted that although the steps of the method in this disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or a step may be broken down into multiple steps.

[0114] Furthermore, in this example embodiment, a device for cleaning metal surface ablation residues based on laser removal technology is also provided. (Refer to...) Figure 7 As shown, the metal surface ablation residue cleaning device 700 based on laser removal technology may include: a metal substrate model generation module 710, an ablation motion simulation model construction module 720, an ablation mechanism analysis module 730, and a laser cleaning path generation module 740. Wherein:

[0115] The metal substrate model generation module 710 is used to generate a metal substrate model by constructing a simulation model of the metal substrate.

[0116] The ablation motion simulation model building module 720 is used to generate an ablation motion simulation model by simulating the process of flame ablation of the metal substrate surface.

[0117] The ablation mechanism analysis module 730 is used to generate ablation mechanism analysis information by analyzing the generation mechanism of ablation residues;

[0118] The laser cleaning path generation module 740 is used to generate a laser cleaning path by setting the laser system parameters, and the laser probe completes the cleaning of ablation residues on the metal surface of the metal substrate by passing through the laser cleaning path.

[0119] The metal surface ablation residue cleaning device based on laser removal technology in this disclosure corresponds to the embodiments of the metal surface ablation residue cleaning method based on laser removal technology described above. Related content can be referred to mutually, and will not be repeated here. The beneficial technical effects of the metal surface ablation residue cleaning device based on laser removal technology in this disclosure can be found in the corresponding beneficial technical effects of the exemplary method section described above, and will not be repeated here.

[0120] It should be noted that although several modules or units of the metal surface ablation residue cleaning device 700 based on laser removal technology have been mentioned in the detailed description above, this division is not mandatory. In fact, according to embodiments of this disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0121] Below, for reference Figure 8 This describes an electronic device according to embodiments of the present disclosure. The electronic device may be either or both of a first device and a second device, or a standalone device independent of them, which may communicate with the first device and the second device to receive acquired input signals from them.

[0122] Figure 8 A block diagram of an electronic device according to an embodiment of the present disclosure is shown.

[0123] like Figure 8 As shown, the electronic device includes one or more processors and memory.

[0124] A processor can be a central processing unit (CPU) or other form of processing unit with data processing and / or instruction execution capabilities, and can control other components in an electronic device to perform desired functions.

[0125] The memory can store one or more computer program products, and the memory can include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program products can be stored on the computer-readable storage medium, and the processor can run the computer program products to implement the methods of the various embodiments of this disclosure described above and / or other desired functions.

[0126] In one example, the electronic device may also include input devices and output devices, which are interconnected via a bus system and / or other forms of connection mechanism (not shown).

[0127] In addition, the input device may also include, for example, a keyboard, a mouse, etc.

[0128] This output device can output various information to the outside, including determined distance information, direction information, etc. The output device may include, for example, a display, a speaker, a printer, and a communication network and its connected remote output devices, etc.

[0129] Of course, for the sake of simplicity, Figure 8 Only some of the components of the electronic device relevant to this disclosure are shown, omitting components such as buses, input / output interfaces, etc. In addition, the electronic device may include any other suitable components depending on the specific application.

[0130] In addition to the methods and apparatus described above, embodiments of this disclosure may also be computer program products comprising computer program instructions that, when executed by a processor, cause the processor to perform the steps in the methods of various embodiments of this disclosure described in the foregoing portion of this specification.

[0131] The computer program product can be written in any combination of one or more programming languages ​​to perform the operations of the embodiments of this disclosure. The programming languages ​​include object-oriented programming languages ​​such as Java and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on a user's computing device, partially on a user's computing device, as a standalone software package, partially on a user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0132] Furthermore, embodiments of this disclosure may also be computer-readable storage media storing computer program instructions that, when executed by a processor, cause the processor to perform the steps in the methods of various embodiments of this disclosure described in the foregoing portion of this specification.

[0133] The computer-readable storage medium may be any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may, for example, include, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatuses, or devices, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: electrical connections having one or more wires, portable disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0134] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0135] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For system embodiments, since they largely correspond to method embodiments, the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0136] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0137] The methods and apparatus of this disclosure may be implemented in many ways. For example, they may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above-described order of steps for the methods is for illustrative purposes only, and the steps of the methods of this disclosure are not limited to the order specifically described above unless otherwise specifically stated. Furthermore, in some embodiments, this disclosure may also be implemented as a program recorded on a recording medium, the program including machine-readable instructions for implementing the methods according to this disclosure. Thus, this disclosure also covers recording media storing programs for performing the methods according to this disclosure.

[0138] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions to this disclosure.

[0139] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0140] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A method for cleaning ablation residues on metal surfaces based on laser removal technology, characterized in that, include: Based on the working environment of the metal substrate, a metal substrate model is generated by constructing a simulation model of the metal substrate. The simulation model of the metal substrate is constructed by: establishing the support and guidance form of the metal substrate based on the working environment of the metal substrate, and generating guidance form parameter information; establishing the shape of the metal substrate based on the working environment of the metal substrate, and generating shape parameter information; establishing the material parameters of the metal substrate based on the working environment of the metal substrate, and generating material parameter information; establishing the material dimensions of the metal substrate based on the working environment of the metal substrate, and generating dimension parameter information; and constructing a simulation model of the metal substrate based on the guidance form parameter information, shape parameter information, material parameter information, and dimension parameter information to generate a metal substrate model. Based on the aforementioned metal substrate model, an ablation motion simulation model is generated by simulating and modeling the process of flame ablation of the metal substrate surface. This simulation modeling includes: defining the flow field computational domain of the jet based on the metal substrate model to generate an initial flow field computational domain; constraining the boundary conditions of the initial flow field computational domain based on the metal substrate model to generate an ablation flow field computational domain. The simulation modeling also includes: extracting gas temperature and gas velocity based on the ablation flow field computational domain to generate gas characteristic data; analyzing the gas characteristic data based on the jet environment of the inner wall surface of the metal substrate to generate a gas flow field model; classifying the size of condensed particles based on the gas flow field model to generate particle characteristic data; and analyzing the particle characteristic data based on the heat exchange between the condensed particles and the gas to generate an ablation motion simulation model. Based on the ablation motion simulation model, the generation mechanism of ablation residues is analyzed to generate ablation mechanism analysis information. This analysis includes: based on the ablation motion simulation model, analyzing the thermomechanical effects of the combustion gases to generate thermomechanical analysis information; based on the ablation motion simulation model, analyzing the composition of the ablation residues on the metal substrate surface to generate composition analysis information; and integrating the thermomechanical analysis information and the composition analysis information to generate ablation mechanism analysis information. Based on the ablation mechanism analysis information, a laser cleaning path is generated by setting the laser system parameters. The laser probe then completes the cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

2. The method according to claim 1, characterized in that, By setting the parameters of the laser system, including at least one of the following: Based on the ablation mechanism analysis information, laser power parameter information is generated by setting the laser power. Based on the ablation mechanism analysis information, pulse frequency parameter information is generated by setting the laser pulse frequency; Based on the ablation mechanism analysis information, the number of laser removal cycles is set to generate removal cycle parameter information; Based on the ablation mechanism analysis information, duty cycle parameter information is generated by setting the duty cycle; Laser parameter information is generated by integrating the laser power parameter information, pulse frequency parameter information, clearing count parameter information, and duty cycle parameter information.

3. The method according to claim 2, characterized in that, By setting the parameters of the laser system, including: Based on the laser parameter information, a scanning width parameter is generated by setting the scanning width of the laser probe; Based on the laser parameter information, a scanning speed parameter is generated by setting the scanning speed of the laser probe; Based on the laser parameter information, the swing direction parameter is generated by setting the swing direction of the laser probe; Based on the scanning width parameter, scanning speed parameter, and swing direction parameter, a laser cleaning path is generated by planning the cleaning path of the laser probe. The laser probe then completes the cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

4. A device for cleaning metal surface ablation residues based on laser removal technology, according to the method of claim 1, characterized in that, include: The metal substrate model generation module is used to generate a metal substrate model by constructing a simulation model of the metal substrate. The ablation motion simulation model building module is used to simulate and model the process of flame ablation of the metal substrate surface to generate an ablation motion simulation model. The ablation mechanism analysis module is used to analyze the generation mechanism of ablation residues and generate ablation mechanism analysis information. The laser cleaning path generation module is used to generate a laser cleaning path by setting the laser system parameters. The laser probe then uses the laser cleaning path to clean the ablation residue on the metal surface of the metal substrate.

5. An electronic device, characterized in that, include: Memory, used to store computer program products; A processor for executing a computer program product stored in the memory, wherein when the computer program product is executed, it implements the method described in any one of claims 1-3.

6. A computer-readable storage medium having computer program instructions stored thereon, characterized in that, When the computer program instructions are executed by the processor, they implement the method described in any one of claims 1-3.

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