Laser focus height following method and device, processing equipment and readable storage medium

CN119187843APending Publication Date: 2024-12-27广东大族显视装备科技有限公司
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Patent Information

Application Number
CN202411365866.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-29
Publication Date
2024-12-27

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Abstract

The invention relates to a laser focus height following method and device, processing equipment and a readable storage medium. The method comprises the steps that the laser incident angle and the laser refraction angle of a transparent material, the transverse distance value of laser refracted on the upper surface of the transparent material through the lower surface of the transparent material and the upper surface height measurement value are obtained; determining a thickness measurement value of the transparent material according to the laser incident angle, the laser refraction angle and the transverse distance value; and determining a focus height following coordinate instruction according to the laser incident angle, the laser refraction angle, the transparent material thickness measurement value and the upper surface height measurement value. According to the method, the precision problem caused by the fact that the thickness change of the to-be-machined material cannot be completely eliminated only based on laser focus height following of the upper surface of the to-be-machined material is effectively solved, the laser focus height following efficiency is improved, and meanwhile the higher requirement for laser focus height following precision is effectively met.
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