Epoxy plastic packaging material, preparation method and application thereof

Abstract

The application provides an epoxy plastic sealing material and a preparation method and application thereof, and raw materials of the epoxy plastic sealing material comprise the following components in parts by weight: modified spherical filler 130-210 parts; epoxy resin 8-15 parts; curing agent 8-18 parts; accelerator 0.05-0.2 parts; and the modified spherical filler is spherical alloy powder coated with silicon dioxide. The spherical alloy powder coated with silicon dioxide is used as the filler, and the epoxy resin is used as the base glue, so that the prepared epoxy plastic sealing material has excellent electric insulation performance and electromagnetic shielding performance, and simultaneously has a high glass transition temperature and a low thermal expansion coefficient, and has a wide application prospect in structure-function integrated packaging of SiP.

Description

Technical Field

[0001] This invention belongs to the field of electronic industry technology, and relates to an epoxy molding compound, its preparation method and application, specifically an epoxy molding compound with electrical insulation and electromagnetic shielding properties, its preparation method and application. Background Technology

[0002] The rapid advancements in big data, artificial intelligence, cloud computing, and 5G communication technologies have placed higher performance demands on high-end chip manufacturing. To overcome the inherent physical manufacturing limitations of photolithography and pursue higher integration and system integration capabilities, the industry has turned to advanced packaging technologies as a key solution.

[0003] System-in-a-Package (SiP) is an advanced electronic device packaging technology that integrates multiple functional chips, including processors and memory chips, into a single package, depending on the application scenario and the number of layers in the packaging substrate, thereby achieving a basically complete function. However, the multiple chips, circuit components, and power modules integrated within an SiP package generate electromagnetic radiation during operation. Without effective electromagnetic shielding measures, this radiation may interfere with each other, leading to signal distortion, increased bit error rate, and other problems, thus affecting the stability and reliability of the entire system. Therefore, electromagnetic interference protection for SiP packages is an indispensable part of the electronic product design and manufacturing process.

[0004] Electromagnetic interference protection in SiP packaging can solve electromagnetic interference problems between the package interior and the surrounding environment. It is a key measure to ensure system reliability, meet electromagnetic compatibility requirements, cope with the trend of high integration and high-speed, high-frequency signal transmission, and achieve miniaturization design.

[0005] For electromagnetic protection of packaged chips, the traditional method is to install a metal shield around the electronic component to enclose the electronic device or circuit, thereby reducing or preventing electromagnetic interference to the internal circuitry and leakage of internal electromagnetic radiation to the outside. However, the shield occupies valuable printed circuit board area in both the horizontal and vertical directions, posing a significant obstacle to the miniaturization of the device.

[0006] Existing conformal shielding technologies involve spraying, electroplating, or sputtering a layer of conductive material onto an epoxy molding compound (EMC), eliminating the need for an external shielding cover and saving on additional equipment space. However, the manufacturing process for conformal shielding is relatively complex, with each method having its specific process flow and parameter requirements, necessitating precise control to ensure the quality and performance of the shielding layer. Furthermore, the complexity of the manufacturing process also leads to increased production costs.

[0007] To address the high integration and electromagnetic complexity of SiP packaging, as well as the thermal, mechanical, and electrical challenges during operation, there is an urgent need to develop a novel structure-function integrated epoxy molding compound. This compound should possess electromagnetic shielding properties, providing both the electrical protection and mechanical support of epoxy molding compounds while resisting electromagnetic interference to ensure the normal operation of the chip. Summary of the Invention

[0008] To address the shortcomings of existing technologies, the present invention aims to provide an epoxy molding compound, its preparation method, and its applications. Specifically, it provides an epoxy molding compound with electrical insulation and electromagnetic shielding properties, along with its preparation method and applications. The solution adopted in this invention adds an insulation modification step to the epoxy molding compound preparation process. This requires only simple physicochemical methods, has a short preparation process, uses low-cost materials, and can be mass-produced. Using the epoxy molding compound provided by this invention for SiP packaging greatly simplifies the packaging process, achieving high integration and thinness of chip packaging without the need for additional electromagnetic shielding materials and processes. The structural-functional integrated epoxy molding compound provided by this invention will become a future hot topic and development trend in the field of EMC materials.

[0009] To achieve this objective, the present invention adopts the following technical solution:

[0010] In a first aspect, the present invention provides an epoxy molding compound, wherein the raw materials for preparing the epoxy molding compound, by weight, comprise the following components:

[0011]

[0012]

[0013] The modified spherical filler is a spherical alloy powder with a surface coated with silicon dioxide.

[0014] This invention uses spherical alloy powder coated with silica as a filler and epoxy resin as a base adhesive to prepare an epoxy molding compound that has both excellent electrical insulation and electromagnetic shielding properties, as well as a high glass transition temperature (Tg) and a low coefficient of thermal expansion (CTE). It has broad application prospects in the structure-function integrated packaging of SiP.

[0015] In this invention, the amount of modified spherical filler used in the preparation of the epoxy molding compound, based on parts by weight, can be 130 parts, 132 parts, 134 parts, 136 parts, 138 parts, 140 parts, 142 parts, 144 parts, 146 parts, 148 parts, 150 parts, 152 parts, 154 parts, 156 parts, 158 parts, 160 parts, 162 parts, 164 parts, 166 parts, 168 parts, 170 parts, 172 parts, 174 parts, 176 parts, 178 parts, 180 parts, 182 parts, 184 parts, 186 parts, 188 parts, 190 parts, 192 parts, 194 parts, 196 parts, 198 parts, 200 parts, 202 parts, 204 parts, 206 parts, 208 parts, 210 parts, etc.

[0016] In this invention, the raw materials for preparing the epoxy molding compound can be 8 parts, 9 parts, 10 parts, 12 parts, 14 parts, 15 parts, etc., by weight.

[0017] In this invention, the raw materials for preparing the epoxy molding compound, by weight, include 8 parts, 9 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, etc. of the curing agent.

[0018] In this invention, the amount of accelerator used in the preparation of the epoxy molding compound, by weight, can be 0.05 parts, 0.08 parts, 0.1 parts, 0.13 parts, 0.15 parts, 0.18 parts, 0.2 parts, etc.

[0019] Preferably, the modified spherical packing is prepared by the following method:

[0020] Spherical alloy powder is mixed with a first organic solvent, then a silane coupling agent and a second organic solvent are added and mixed. Ammonia water is then added and stirred. Tetraethyl silicate is then added and stirred continuously. The mixture is allowed to stand and separate, then the lower layer product obtained from the separation is washed and dried to obtain the modified spherical filler.

[0021] The modified spherical filler provided by this invention has both high magnetic permeability and high insulation.

[0022] Preferably, the spherical alloy powder includes spherical iron-nickel alloy powder, spherical iron-cobalt-nickel alloy powder, spherical iron-vanadium alloy powder, spherical ferrite powder, spherical aluminum-magnesium alloy powder, and spherical iron-based amorphous powder.

[0023] Preferably, the particle size of the spherical alloy powder is 25-75 μm, such as 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, etc.

[0024] Preferably, the first organic solvent includes anhydrous ethanol.

[0025] Preferably, the silane coupling agent comprises γ-aminopropyltriethoxysilane (KH550) and / or γ-glycidoxypropyltrimethoxysilane (KH560).

[0026] Preferably, the second organic solvent includes ethanol.

[0027] Preferably, based on 100% of the spherical alloy powder, the amount of the silane coupling agent is 3-8 wt.%, such as 3 wt.%, 4 wt.%, 5 wt.%, 6 wt.%, 7 wt.%, 8 wt.%, etc.

[0028] Preferably, the amount of ammonia used is such that the pH value of the system is adjusted to 4 to 5, for example, 4, 4.2, 4.4, 4.5, 4.6, 4.8, 5, etc.

[0029] Preferably, based on 10g of spherical alloy powder, the amount of tetraethyl silicate is 1-3mL, such as 1mL, 1.5mL, 2mL, 2.5mL, 3mL, etc.

[0030] Preferably, the stirring time is 20-40 minutes, such as 20 minutes, 25 minutes, 30 minutes, 35 minutes, 40 minutes, etc.

[0031] Preferably, the temperature for continued stirring is 40-60℃, such as 40℃, 45℃, 50℃, 55℃, 60℃, etc., and the stirring time is 3-5h, such as 3h, 4h, 5h, etc.

[0032] Preferably, the washing is performed using ethanol.

[0033] Preferably, the drying temperature is 70-90℃, such as 70℃, 75℃, 80℃, 85℃, 90℃, etc., and the drying time is 1-3h, such as 1h, 2h, 3h, etc.

[0034] Preferably, the epoxy resin includes any one or a combination of at least two of the following: bisphenol A type epoxy resin, bisphenol F type epoxy resin, polyphenol type glycidyl ether epoxy resin, aliphatic glycidyl ether epoxy resin, and glycidyl ester type epoxy resin.

[0035] Preferably, the epoxy resin comprises 4,5-epoxyhexane-1,2-dicarboxylic acid diglycidyl ester and / or E51 epoxy resin.

[0036] Preferably, the curing agent includes any one or a combination of at least two of the following: amine curing agents, acid anhydride curing agents, synthetic resin curing agents, alkaline curing agents, and acidic curing agents.

[0037] Preferably, the curing agent comprises methylhexahydrophthalic anhydride.

[0038] Preferably, the accelerator includes any one or a combination of at least two of imidazole accelerators, tertiary amine accelerators, and phenolic accelerators.

[0039] Preferably, the promoter comprises 2-ethyl-4-methylimidazole and / or 2-methylimidazole.

[0040] In a second aspect, the present invention provides a method for preparing an epoxy molding compound as described in the first aspect, the method comprising the following steps:

[0041] The modified spherical filler of the specified amount is mixed with epoxy resin, then a curing agent and an accelerator are added, and the mixture is mixed again and cured to obtain the epoxy molding compound.

[0042] Preferably, the mixing speed is 800-2000 r / min, such as 800 r / min, 1000 r / min, 1200 r / min, 1400 r / min, 1600 r / min, 1800 r / min, 2000 r / min, etc., and the mixing time is 3-8 min, such as 3 min, 4 min, 5 min, 6 min, 8 min, etc.

[0043] Preferably, the remixing speed is 800-1000 r / min, such as 800 r / min, 900 r / min, 1000 r / min, etc., and the duration is 1-3 min, such as 1 min, 2 min, 3 min, etc.

[0044] Preferably, the curing temperature is 120-140℃, such as 120℃, 125℃, 130℃, 135℃, 140℃, etc., and the curing time is 1-3h, such as 1h, 2h, 3h, etc.

[0045] Thirdly, the present invention provides an application of the epoxy molding compound as described in the first aspect in SiP packaging.

[0046] Compared with the prior art, the present invention has the following beneficial effects:

[0047] This invention uses spherical alloy powder coated with silica as a filler and epoxy resin as a base adhesive to prepare an epoxy molding compound that has both excellent electrical insulation and electromagnetic shielding properties, as well as a high glass transition temperature and a low coefficient of thermal expansion. It has broad application prospects in the structure-function integrated packaging of SiP. Attached Figure Description

[0048] Figure 1 To prepare the spherical Fe in Example 1 30 Ni70 Surface morphology of powder (a), Fe 30 Ni 70 @Surface morphology (b) and cross-sectional views ((c)~(d)) of SiO2 powder.

[0049] Figure 2 Fe provided in Example 1 30 Ni 70 Transmission electron microscopy image and electron energy spectrum of SiO2 powder.

[0050] Figure 3 The original spherical Fe used in the preparation of Example 1 30 Ni 70 Comparison of infrared spectra of powder, modified spherical filler obtained in Preparation Example 1, and modified spherical filler obtained in Preparation Example 6.

[0051] Figure 4 The image shows a cross-sectional SEM image of the epoxy molding compound provided in Example 1. Detailed Implementation

[0052] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention.

[0053] Preparation Example 1

[0054] This preparation example provides a modified spherical packing material, the preparation method of which includes the following steps:

[0055] First, take 10g of spherical Fe 30 Ni 70 The powder (particle size 35 μm) was dispersed in 50 mL of anhydrous ethanol and ultrasonically vibrated to ensure uniform dispersion in a three-necked flask. 0.5 g of silane coupling agent (γ-aminopropyltriethoxysilane) was added, followed by 50 mL of ethanol. The mixture was stirred while ultrasonically vibrating to ensure homogeneity. Then, 2 mL of ammonia water was slowly added dropwise, and the mixture was stirred for 30 min. Next, 2 mL of tetraethyl silicate was slowly added, and the mixture was stirred in a water bath at 50 °C for four hours. The solution was allowed to stand, and the upper white layer was separated. The lower layer, containing Fe coated with SiO2, was then separated. 30 Ni 70 The powder was sonicated in an ethanol solution for 10 min, then washed with ethanol, repeated three times to remove free silica from the surface. The washed sample was then dried in an oven at 80°C for 2 hours to obtain Fe2+ with a SiO2-coated surface. 30 Ni 70 @SiO2 powder.

[0056] The spherical Fe in this preparation example 30 Ni 70Surface morphology of powder (a), Fe 30 Ni 70 @Surface morphology (b) and cross-sectional views ((c)~(d)) of SiO2 powder are shown in Figure 1. Figure 1 As shown, the original material has a smooth surface, while the material surface after insulation modification is covered with a dense insulating layer.

[0057] The Fe prepared in this example 30 Ni 70 Transmission electron microscope images and electron energy spectra of SiO2 powder are as follows: Figure 2 As shown, (b) is an enlarged view of the boxed area in (a).

[0058] Preparation Example 2

[0059] The only difference between this preparation example and Preparation Example 1 is that the spherical Fe... 30 Ni 70 The powder was replaced with an equal weight of spherical Fe. 36 Ni 64 Powder (particle size 35 μm) was used to obtain Fe with SiO2 coating on the surface. 36 Ni 64 @SiO2 powder.

[0060] Preparation Example 3

[0061] The only difference between this preparation example and Preparation Example 1 is that the spherical Fe... 30 Ni 70 The powder was replaced with an equal weight of spherical Fe. 50 Ni 50 Powder (particle size 35 μm) was used to obtain Fe with SiO2 coating on the surface. 50 Ni 50 @SiO2 powder.

[0062] Preparation Example 4

[0063] The only difference between this preparation example and Preparation Example 1 is that the spherical Fe... 30 Ni 70 The powder has a particle size of 15 μm.

[0064] Preparation Example 5

[0065] The only difference between this preparation example and Preparation Example 1 is that the spherical Fe... 30 Ni 70 The powder has a particle size of 85 μm.

[0066] Preparation Example 6

[0067] The only difference between this preparation example and Preparation Example 1 is that no silane coupling agent is added during the preparation process.

[0068] The original spherical Fe used in Preparation Example 1 30 Ni 70 A comparison of the infrared spectra of the powder, the modified spherical filler obtained in Preparation Example 1, and the modified spherical filler obtained in Preparation Example 6 is shown in the figure below. Figure 3 As shown, it can be seen that compared with the modified spherical filler without silane coupling agent (Preparation Example 6), the modified spherical filler with silane coupling agent (Preparation Example 1) has obvious Si-O-Si vibration peaks, indicating that there is a stronger bonding force between the core and shell.

[0069] Comparative Preparation Example 1

[0070] The only difference between this preparation example and Preparation Example 1 is that the spherical Fe... 30 Ni 70 The powder was replaced with an equal amount of flake Fe. 30 Ni 70 (Length 60-100 μm, thickness 1-2 μm) to obtain modified sheet-like fillers.

[0071] Examples 1-7

[0072] In Examples 1-7, an epoxy molding compound is provided respectively. The specific raw materials and amounts (parts by weight) are shown in Table 1.

[0073] Table 1

[0074]

[0075]

[0076] The preparation methods of Examples 1-3 and Examples 5-7 include the following steps:

[0077] Weigh each raw material according to the formula in Table 1. Use a mixer to mechanically mix the modified spherical filler with epoxy resin at a speed of 1000 r / min for 5 min. Then add the curing agent and accelerator and mechanically mix at a speed of 9000 r / min for 2 min. Then cure at 140℃ for 2 h to obtain the epoxy molding compound. Specifically, blocks with cross-sectional areas of 3 mm*3 mm, 7 mm*7 mm and 22.86 mm*10.16 mm were prepared to test the volume resistivity, coefficient of thermal expansion and electromagnetic shielding performance, respectively.

[0078] The only difference between the preparation method of Example 4 and that of Example 1 is that the curing temperature is 120°C.

[0079] The cross-sectional SEM image of the epoxy molding compound provided in Embodiment 1 of this invention is shown below. Figure 4 As shown in the figure, the modified spherical filler is well dispersed in epoxy resin.

[0080] Comparative Example 1

[0081] The only difference between this comparative example and Example 1 is that the modified spherical filler (Fe) provided in Example 1 is used instead. 30 Ni 70 (@SiO2 powder) replaced with an equal weight proportion of spherical Fe 30 Ni 70 Powder (i.e., unmodified Fe) 30 Ni 70 The original powder had a particle size of 35 μm.

[0082] Comparative Example 2

[0083] The only difference between this comparative example and Example 2 is that the modified spherical filler (Fe) provided in Example 2 is used instead. 36 Ni 64 (@SiO2 powder) replaced with an equal weight proportion of spherical Fe 36 Ni 64 Powder (i.e., unmodified Fe) 36 Ni 64 The original powder had a particle size of 35 μm.

[0084] Comparative Example 3

[0085] The only difference between this comparative example and Example 3 is that the modified spherical filler (Fe) provided in Example 3 is used instead. 50 Ni 50 (@SiO2 powder) replaced with an equal weight proportion of spherical Fe 50 Ni 50 Powder (i.e., unmodified Fe) 50 Ni 50 The original powder had a particle size of 35 μm.

[0086] Comparative Example 4

[0087] The only difference between this comparative example and Example 1 is that the amount of modified spherical filler used is 220 parts by weight.

[0088] Comparative Example 5

[0089] The only difference between this comparative example and Example 1 is that the amount of modified spherical filler used is 120 parts by weight.

[0090] Comparative Example 6

[0091] The only difference between this comparative example and Example 1 is that the modified spherical packing is replaced with the modified sheet packing provided in Comparative Preparation Example 1, because the sheet packing has poor surface flowability, and its amount is 70 parts by weight.

[0092] The epoxy molding compounds provided in the examples and comparative examples were subjected to performance tests, and the test methods are as follows:

[0093] (1) Volume resistivity: Tested using a high-resistivity meter;

[0094] (2) Viscosity: Tested using a rotational rheometer;

[0095] (3) Coefficient of thermal expansion; tested using a thermomechanical analyzer; the coefficient of thermal expansion 1 was tested at 25–200℃, and the coefficient of thermal expansion 2 was tested at 200–300℃;

[0096] (4) Electromagnetic shielding performance: Tested at 8.2-12GHz using a vector network analyzer;

[0097] (5) Glass transition temperature: Tested using a dynamic thermomechanical analyzer.

[0098] The performance test results are shown in Table 2.

[0099] Table 2

[0100]

[0101]

[0102] In Table 2, “\” indicates that no corresponding test was performed (since the volume resistivity of the epoxy molding compound provided by the relevant comparative example does not meet the requirements, it is meaningless to perform other tests, so no test was performed).

[0103] As can be seen from Table 2, the epoxy molding compounds provided in Examples 1-4 of the present invention all have excellent electrical insulation properties (volume resistivity: 5.81E+11~2.99E+12Ω·cm) and electromagnetic shielding properties (20.2~26.1dB), while also having high glass transition temperature, low coefficient of thermal expansion and viscosity.

[0104] Compared with Examples 1-3, the electrical insulation properties of the epoxy molding compounds provided in Comparative Examples 1-3 were significantly reduced.

[0105] Compared with Example 1, the viscosity of the epoxy molding compound provided in Comparative Example 4 is significantly increased, making it difficult to cast. The viscosity of the epoxy molding compound provided in Comparative Example 5 is reduced, but its electromagnetic shielding performance is very poor (only 11dB). The electrical insulation and electromagnetic shielding performance of the epoxy molding compound provided in Comparative Example 6 are significantly reduced, and its coefficient of thermal expansion is increased.

[0106] The applicant declares that this invention illustrates the epoxy molding compound, its preparation method, and its application through the above embodiments. However, this invention is not limited to the above embodiments, meaning that this invention does not necessarily rely on the above embodiments for implementation. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of the raw materials used in this invention, additions of auxiliary components, and selection of specific methods all fall within the protection and disclosure scope of this invention.

Claims

1. An epoxy molding compound, characterized in that, The raw materials for preparing the epoxy molding compound include the following components by weight: 150-200 parts of modified spherical filler; 8-10 parts epoxy resin; 10-12 parts of curing agent; Accelerator 0.09-0.13 parts; The modified spherical filler is a spherical alloy powder with a surface coated with silicon dioxide; The modified spherical packing was prepared by the following method: Spherical alloy powder is mixed with a first organic solvent, then a silane coupling agent and a second organic solvent are added and mixed. Ammonia water is then added and stirred. Tetraethyl silicate is then added and stirred continuously. The mixture is allowed to stand and separate, then the lower layer product obtained from the separation is washed and dried to obtain the modified spherical filler.

2. The epoxy molding compound according to claim 1, characterized in that, The spherical alloy powder includes spherical iron-nickel alloy powder, spherical iron-cobalt-nickel alloy powder, spherical iron-vanadium alloy powder, spherical aluminum-magnesium alloy powder, or spherical iron-based amorphous powder.

3. The epoxy molding compound according to claim 1, characterized in that, The particle size of the spherical alloy powder is 25-75 μm.

4. The epoxy molding compound according to claim 1, characterized in that, The first organic solvent includes anhydrous ethanol.

5. The epoxy molding compound according to claim 1, characterized in that, The silane coupling agent includes γ-aminopropyltriethoxysilane and / or γ-glycidoxypropyltrimethoxysilane.

6. The epoxy molding compound according to claim 1, characterized in that, The second organic solvent includes ethanol.

7. The epoxy molding compound according to claim 1, characterized in that, Based on the amount of spherical alloy powder being 100%, the amount of the silane coupling agent is 3-8 wt.%.

8. The epoxy molding compound according to claim 1, characterized in that, Based on a usage of 10 g of spherical alloy powder, the amount of tetraethyl silicate used is 1-3 mL.

9. The epoxy molding compound according to claim 1, characterized in that, The stirring time is 20-40 minutes.

10. The epoxy molding compound according to claim 1, characterized in that, The temperature for continued stirring is 40-60℃, and the stirring time is 3-5 hours.

11. The epoxy molding compound according to claim 1, characterized in that, The washing process involves using ethanol.

12. The epoxy molding compound according to claim 1, characterized in that, The drying temperature is 70-90℃, and the drying time is 1-3 hours.

13. The epoxy molding compound according to claim 1, characterized in that, The epoxy resin includes any one or a combination of at least two of the following: bisphenol A type epoxy resin, bisphenol F type epoxy resin, polyphenol type glycidyl ether epoxy resin, aliphatic glycidyl ether epoxy resin, and glycidyl ester type epoxy resin.

14. The epoxy molding compound according to claim 13, characterized in that, The epoxy resin includes 4,5-epoxyhexane-1,2-dicarboxylic acid diglycidyl ester and / or E51 epoxy resin.

15. The epoxy molding compound according to claim 1, characterized in that, The curing agent includes any one or a combination of at least two of the following: amine curing agents, acid anhydride curing agents, synthetic resin curing agents, alkaline curing agents, and acidic curing agents.

16. The epoxy molding compound according to claim 15, characterized in that, The curing agent includes methylhexahydrophthalic anhydride.

17. The epoxy molding compound according to claim 1, characterized in that, The accelerator includes any one or a combination of at least two of imidazole accelerators, tertiary amine accelerators, and phenolic accelerators.

18. The epoxy molding compound according to claim 17, characterized in that, The promoter includes 2-ethyl-4-methylimidazole and / or 2-methylimidazole.

19. A method for preparing an epoxy molding compound as described in any one of claims 1-18, characterized in that, The preparation method includes the following steps: The modified spherical filler of the specified amount is mixed with epoxy resin, then a curing agent and an accelerator are added, and the mixture is mixed again and cured to obtain the epoxy molding compound.

20. The preparation method according to claim 19, characterized in that, The mixing speed is 800-2000 r / min, and the duration is 3-8 min.

21. The preparation method according to claim 19, characterized in that, The remixing speed is 800-1000 r / min, and the duration is 1-3 min.

22. The preparation method according to claim 19, characterized in that, The curing temperature is 120-140℃, and the curing time is 1-3 hours.

23. The application of an epoxy molding compound as described in any one of claims 1-18 in SiP packaging.

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