A server mainboard heat dissipation structure and a server

Abstract

The embodiment of the application provides a server mainboard heat dissipation structure and a server, which comprise a shell, a wind box assembly arranged at the bottom of the shell, a top plate, a plurality of server mainboards arranged in the shell, and a plurality of heat dissipation fins arranged on the top plate. The shell and the top plate are connected through a clamping assembly. When the clamping assembly is in a separated state, the shell and the top plate are slidably connected, the shell is open, and the shell is used for mounting the plurality of server mainboards through the opening. When the clamping assembly is in a fastened state, the wind box assembly outputs cold air to the bottom of the shell, the cold air passes through the server mainboards to reach the heat dissipation fins, the server mainboards transfer heat to the heat dissipation fins through the shell and the top plate, and the heat dissipation fins are used for dissipating heat in the cold air and heat from the server mainboards. The embodiment of the application can realize quick disassembly and assembly of the server mainboards, thereby realizing convenient installation of the server, dissipating heat of the server mainboards in the shell through the heat dissipation fins, and realizing the purpose of heat dissipation of the server.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a server motherboard heat dissipation system and a server. Background Technology

[0002] A server is a type of computer that runs faster, handles higher loads, and is more expensive than a regular computer. Servers provide computing or application services to other client machines on a network. Servers possess high-speed CPU (Central Processing Unit) processing power, long-term reliable operation, powerful I / O (input / output) external data throughput capabilities, and better scalability. Depending on the services provided, servers generally have the ability to respond to service requests, provide services, and ensure service availability. For prefabricated servers, heat dissipation mainly relies on airflow through ducts. Due to the enclosed nature of the main body, the airflow within the ducts is ineffective, leading to difficulties in heat dissipation. Summary of the Invention

[0003] In view of the above problems, embodiments of the present invention are proposed to provide a server motherboard heat dissipation method and a server that overcome or at least partially solve the above problems.

[0004] To address the aforementioned problems, this invention discloses a server motherboard heat dissipation structure, comprising: The outer casing has a bellows assembly at its bottom; the top plate has heat sinks on it; the outer casing and the top plate are connected by a snap-fit ​​assembly. When the locking assembly is in the disengaged state, the outer casing and the top plate are slidably connected, and the outer casing forms an opening through which multiple server motherboards are installed. When the locking assembly is in the secured state, the air box assembly outputs cold air to the bottom of the outer casing, which passes through the server motherboard and reaches the heat sink. The server motherboard transfers heat to the heat sink through the outer casing and the top plate. The heat sink is used to dissipate heat from the cold air and from the server motherboard.

[0005] Optionally, the bellows assembly includes: The bellows body is fixed to the bottom of the outer shell; the bellows body has an open receiving cavity. A fan is installed inside the opening receiving cavity to generate and output cold air through the opening side of the opening receiving cavity; A filter screen is disposed on the opening side of the opening receiving cavity for filtering the cold air.

[0006] Optionally, the engagement component includes: A locking groove is provided on the top of the outer shell; a locking block is provided on the bottom of the top plate; the locking groove and the locking block are slidably connected; A connecting rod, one end of which passes through the engaging groove and engaging block; an operating block, disposed at the other end of the connecting rod; when the operating block is engaged with the connecting rod, the engaging assembly is in the fastened state; when the operating block is disengaged from the connecting rod, the engaging assembly is in the disengaged state.

[0007] Optionally, the engagement assembly further includes: The outer side wall of the connecting rod is provided with external threads; The inner wall of the locking block is provided with internal threads; The internal thread and the external thread mate with each other.

[0008] Optionally, the server motherboard has a connector, and the server motherboard heat dissipation structure further includes: A fixing component is connected to the socket and is used to fix the socket.

[0009] Optionally, the fixing component includes: The plug is connected to the socket. A connecting rod, the middle region of which is mounted on both sides of the plug; A buckle, one end of which is installed on one end of the connecting rod; the other end of the buckle is provided with a bevel, which extends to the side of the socket, and the buckle is used to fix the connection with the socket through the bevel under the action of the connecting rod; A pressure plate, installed at the other end of the connecting rod, is used to release the inclined surface from the fixed connection with the socket.

[0010] Optionally, the connecting rod is an elastic connecting rod.

[0011] Optionally, the heat sinks are arranged at equal intervals at the top of the top plate.

[0012] Optionally, it also includes: Positioning blocks are disposed on both sides of the outer casing for positioning the outer casing; The plate is installed on one side of the positioning block; A spring is installed on the other side of the positioning block, and a snap-fit ​​is installed on one side of the spring. The snap-fit ​​is used to fasten the positioning block and the outer shell under the action of the spring.

[0013] In a second aspect, an embodiment of the present invention discloses a server, including a server motherboard and a server motherboard heat dissipation structure as described above, wherein the server motherboard is mounted in the server motherboard heat dissipation structure, and the server motherboard heat dissipation structure is used to dissipate heat from the server motherboard.

[0014] The embodiments of the present invention have the following advantages: This invention provides an outer casing with a bellows assembly at its bottom and a top plate with heat sinks. The outer casing and top plate are connected by a snap-fit ​​assembly. When the snap-fit ​​assembly is disengaged, the outer casing and top plate are slidably connected, forming an opening through which multiple server motherboards are mounted. When the snap-fit ​​assembly is secured, the bellows assembly outputs cold air to the bottom of the outer casing, which passes through the server motherboards and reaches the heat sinks. The server motherboards transfer heat to the heat sinks via the outer casing and top plate, and the heat sinks dissipate heat from the cold air and the server motherboards. This invention allows for quick assembly and disassembly of the server motherboards after installation by opening the outer casing, enabling convenient assembly and disassembly of modular servers. When closed, cold air is blown from the bottom towards the server motherboards for cooling. The cooled air and the heat dissipated from the server motherboards are directed to the heat sinks at the top of the top plate for further heat absorption and rapid dissipation, thus cooling the interior of the casing and achieving server heat dissipation. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of an embodiment of a server motherboard heat dissipation structure according to the present invention; Figure 2 This is a top cross-sectional view of an embodiment of a server motherboard heat dissipation structure according to the present invention. Figure 3 This is a front cross-sectional view of a server motherboard heat dissipation structure according to the present invention; Figure 4 yes Figure 3 Enlarged cross-sectional view of point A in the middle section; Figure 5 This is a partial cross-sectional view of the bellows assembly of the present invention. Figure 6 This is a schematic diagram of the connection structure of the positioning block, plate and spring of the present invention; Figure 7 This is a schematic diagram of the fixing component of the present invention.

[0016] Explanation of reference numerals in the attached figures: 100-Outer shell, 110-Feet, 200-Blowbox assembly, 210-Blowbox body, 220-Fan, 230-Filter, 300-Top plate, 400-Heat sink, 500-Clamping assembly, 510-Clamping slot, 520-Connecting rod, 530-Clamping block, 540-Operating block, 600-Server motherboard, 610-Socket, 700-Fixing assembly, 710-Plug, 720-Connecting rod, 730-Snap-on, 740-Pressure plate, 810-Positioning block, 820-Plate body, 830-Spring. Detailed Implementation

[0017] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] Reference Figure 1 The diagram shows a three-dimensional structural schematic of a heat dissipation structure for a server motherboard 600 according to the present invention. Figure 2 The diagram shows a top cross-sectional view of an embodiment of a server motherboard 600 heat dissipation structure according to the present invention; see reference. Figure 3 The diagram shows a front cross-sectional view of a heat dissipation structure for a server motherboard 600 according to the present invention. Specifically, the heat dissipation structure for the server motherboard 600 may include: The outer casing 100 has a bellows assembly 200 at its bottom; the top plate 300 has heat sinks 400 on its top plate; the outer casing 100 and the top plate 300 are connected by a snap-fit ​​assembly 500. When the locking assembly 500 is in the disengaged state, the outer casing 100 and the top plate 300 are slidably connected, and the outer casing 100 forms an opening through which multiple server motherboards 600 are installed. When the locking assembly 500 is in the secured state, the air box assembly 200 outputs cold air to the bottom of the outer casing 100, which passes through the server motherboards 600 and reaches the heat sink 400. The server motherboards 600 transfer heat to the heat sink 400 through the outer casing 100 and the top plate 300. The heat sink 400 is used to dissipate heat from the cold air and heat from the server motherboards 600.

[0019] In this embodiment of the invention, the heat dissipation structure of the server motherboard 600 may include a housing 100, a fan assembly 200, a top plate 300, a heat sink 400, and a locking assembly 500. The housing 100 is mounted on a support base for other components and has an internal cavity for mounting the server motherboard 600. A connector 610 is mounted on the side of the server motherboard 600. The top plate 300 is detachably connected to the housing 100 via the locking assembly 500. The heat sink 400 is mounted on the top plate 300, and the fan assembly 200 is mounted on the bottom of the housing 100. The heat sink 400 and the fan assembly 200 work together to dissipate heat generated by the server motherboard 600 within the server. When the locking assembly 500 is in a secured state, the air box assembly 200 outputs cold air to the bottom of the outer casing 100, passes through the server motherboard 600, and reaches the heat sink 400. The server motherboard 600 transfers heat to the heat sink 400 through the outer casing 100 and the top plate 300. At this time, the heat sink 400 can receive the heat directly transferred from the server motherboard 600 and the heat transferred through the cold air, and then dissipate the heat in the cold air and the heat from the server motherboard 600. Since the heat from the server motherboard 600 is directly dissipated, and the cold air can be cooled again, the cooled air can then dissipate heat from the inside of the outer casing 100 to the server motherboard 600, thereby achieving a good heat dissipation effect.

[0020] Furthermore, when the locking assembly 500 is in the separated state, the outer casing 100 and the top plate 300 are slidably connected, forming an opening in the outer casing 100. Multiple server motherboards 600 are installed in the outer casing 100 through the opening, thereby enabling convenient repair and maintenance of the interior of the outer casing 100. The server motherboards 600 can process different data.

[0021] In this embodiment of the invention, a housing 100 is provided, with a bellows assembly 200 at its bottom; a top plate 300 is provided, with a heat sink 400 on the top plate 300; the housing 100 and the top plate 300 are connected by a snap-fit ​​assembly 500; when the snap-fit ​​assembly 500 is in a disengaged state, the housing 100 and the top plate 300 are slidably connected, and the housing 100 forms an opening through which multiple server motherboards 600 are installed; when the snap-fit ​​assembly 500 is in a secured state, the bellows assembly 200 outputs cold air to the bottom of the housing 100, which passes through the server motherboards 600 and reaches the heat sink 400. The server motherboards 600 transfer heat through the housing 100 and the top plate 300 to the heat sink 400, which dissipates heat from the cold air and from the server motherboards 600. In this embodiment of the invention, after the server motherboard 600 is installed, the outer casing 100 can be opened to quickly disassemble and assemble the server motherboard 600, thereby realizing the convenient disassembly and assembly of the modular server. When closed, cool air is provided from the bottom to blow onto the server motherboard 600 to cool it. The cooled air and the cold air emitted by the server motherboard 600 are directed to the heat sink 400 on the top of the top plate 300, where the heat sink 400 further absorbs heat for rapid heat dissipation, thus dissipating heat from the inside of the outer casing 100 and achieving the purpose of server heat dissipation.

[0022] Specifically, the bellows assembly 200 includes: The bellows body 210 is fixed to the bottom of the outer shell 100; the bellows body 210 has an opening receiving cavity inside. A fan 220 is disposed inside the opening receiving cavity and is used to generate and output cold air through the opening side of the opening receiving cavity; A filter 230 is disposed on the opening side of the opening receiving cavity for filtering the cold air.

[0023] You can refer to Figure 5The airbox assembly 200 includes an airbox body 210, a fan 220, and a filter 230. The airbox body 210 is fixed to the bottom of the outer casing 100. The airbox body 210 has an open receiving cavity, within which the fan 220 is installed. The fan 220 is a fan device used to enhance airflow and accelerate heat dissipation. It generates airflow through rotation, carrying away the heat generated inside the server, thereby maintaining the server hardware temperature within an acceptable range and preventing performance degradation, system crashes, or even hardware damage due to overheating. Server fans 220 can be classified into various types. For example, according to power supply type, they can be divided into DC fans and AC fans; according to the number of blades, they can be divided into single-blade fans and multi-blade fans; according to speed and airflow, they can be divided into low-speed, low-airflow fans and high-speed, high-airflow fans, etc. Different types of server fans 220 have different characteristics and application scenarios. DC fans typically have lower noise and higher efficiency, suitable for server environments with strict noise requirements and long-term operation. AC fans have a relatively simple structure and lower cost, but their noise and efficiency may be slightly inferior to DC fans. High-speed, high-airflow fan: capable of quickly removing a large amount of heat, suitable for high-density, high-power server applications.

[0024] A filter 230 is installed inside the air box body 210. Specifically, it can be installed on the opening side of the opening receiving cavity. The filter 230 filters dust and impurities in the air, preventing them from entering the server motherboard 600 and heat sink 400, thus maintaining the cleanliness and heat dissipation efficiency of the server motherboard 600 and heat sink 400. The filter 230 effectively blocks dust, particulate matter, and other impurities in the air from entering the heat sink, preventing these impurities from adhering to the heat sink 400 and affecting heat dissipation. By preventing dust accumulation, the filter 230 can reduce the decrease in heat dissipation performance caused by excessive dust, thereby extending the lifespan of the heat sink. Keeping the heat sink clean ensures smooth airflow, improves heat dissipation efficiency, and helps the server maintain a stable temperature during long-term high-load operation. The material and structure of the filter 230 can be determined according to the actual product. For example, the filter 230 is often made of materials such as metal mesh, nylon mesh, or fiber cloth. The filter 230 can be an integrated filter 230 or a separate detachable filter 230. The filter 230 is usually designed to be detachable or washable, which facilitates regular cleaning and maintenance.

[0025] Furthermore, the top and bottom of the bellows are provided with through holes, which are symmetrically distributed with respect to the central axis of the bellows.

[0026] When fan 220 starts, it rotates and generates airflow. This airflow enters the air chamber through the ventilation holes, carrying away hot air from inside the server. After being accelerated by fan 220, the air is expelled from the chamber. Simultaneously, fresh air from outside enters the chamber through the vents, creating a circulation. Through this continuous circulation process, heat is effectively dissipated from inside the server, achieving the purpose of heat dissipation and cooling. Reference Figure 2 and Figure 3 As shown, the heat sink 400 has a large surface area, which can absorb heat for rapid heat dissipation. At the same time, the fan 220 at the bottom of the outer casing 100 can start working. The fan 220 can draw air into the outer casing 100 to draw out the hot air inside the outer casing 100 and dissipate heat inside the outer casing 100. The filter 230 can filter dust to prevent dust from entering the interior of the outer casing 100.

[0027] In an optional embodiment of the present invention, the engaging assembly 500 includes: A locking groove 510 is disposed on the top of the outer shell 100; a locking block 530 is disposed on the bottom of the top plate 300; the locking groove 510 and the locking block 530 are slidably connected. A connecting rod 520, one end of which passes through the engaging groove 510 and the engaging block 530, and an operating block 540, which is disposed at the other end of the connecting rod 520; when the operating block 540 is engaged with the connecting rod 520, the engaging assembly 500 is in the fastened state; when the operating block 540 is disengaged from the connecting rod 520, the engaging assembly 500 is in the disengaged state.

[0028] like Figure 4The outer casing 100 and the top plate 300 form a sliding structure via a locking assembly 500. The locking block 530 at the top of the top plate 300 can slide into the locking groove 510 at the top of the outer casing 100. One end of the connecting rod 520 passes through the locking groove 510 and the locking block 530, and an operating block 540 is located at the other end of the connecting rod 520. The connecting rod 520, the locking block 530, and the outer casing 100 form a locking structure. Furthermore, the connecting rod 520 can be a threaded rod, thus achieving a secure connection through threads. The operating block 540 can be a screw block for tightening operations, allowing for quick operation. By operating the operating block 540, the connecting rod 520 can be fixed to the locking block 530 and the outer casing 100, thereby fixing the top plate 300 to the top of the outer casing 100, allowing the heat sink 400 above the top plate 300 to dissipate heat. The operating block 540 can also be provided with fine anti-slip texture, which can increase the friction between the operating block 540 and the user when operating the operating block 540, so that it can be rotated easily and quickly. In addition, the top plate 300 can be removed by rotating the operating block 540 to repair and maintain the inside of the outer shell 100.

[0029] Furthermore, the engagement assembly 500 also includes: The outer side wall of the connecting rod 520 is provided with external threads; The inner wall of the locking block 530 is provided with internal threads; The internal thread and the external thread mate with each other.

[0030] In this embodiment of the invention, external threads are uniformly provided on the outer side wall of the connecting rod 520, and internal threads that cooperate with the external threads are uniformly provided on the inner side wall of the locking block 530. The connecting rod 520 and the locking block 530 are securely connected by the threads.

[0031] In an optional embodiment of the present invention, the server motherboard 600 heat dissipation structure further includes: a support foot 110. The support leg 110 is mounted on the bottom end of the housing 100.

[0032] By using the support feet 110 to abut against other servers, a certain gap can be maintained between the main structures of the servers, which facilitates cabling.

[0033] In an optional embodiment of the present invention, the server motherboard 600 heat dissipation structure further includes: Positioning blocks 810 are disposed on both sides of the outer casing 100 for positioning the outer casing 100; Plate 820 is installed on one side of the positioning block 810; A spring 830 is installed on the other side of the positioning block 810. A snap fastener is installed on one side of the spring 830. The snap fastener is used to fasten the positioning block 810 and the outer shell 100 under the action of the spring 830.

[0034] The outer casing 100 is provided with positioning blocks 810, plates 820, and springs 830 on both sides to position the outer casing 100, allowing it to be fixedly connected to other components. A plate 820 is mounted on one side of the positioning block 810, with mounting screws movably connected to both the top and bottom of the plate 820. A spring 830 is mounted on one side of the positioning block 810, and a snap-fit ​​is mounted on one side of the spring 830.

[0035] You can refer to Figure 2 and Figure 6 As shown, the outer shell 100 and the positioning block 810 form a sliding structure that can interact and connect with each other. The outer shell 100 can slide into the positioning block 810 for installation. The positioning block 810 can be installed on the wall or inside the cabinet through the plate 820 and mounting screws. The outer shell 100 can be assembled by sliding into the positioning block 810. At the same time, the snap-fit ​​is conical, and the spring 830 on one side is elastic. After the base slides into the positioning block 810, the snap-fit ​​will automatically snap into the base, making the base installation more stable. The conical snap-fit ​​will not affect the installation and disassembly of the device, allowing the device to be quickly assembled and disassembled.

[0036] In an optional embodiment of the present invention, the server motherboard 600 has a connector 610, and the heat dissipation structure of the server motherboard 600 further includes: The fixing component 700 is connected to the socket 610 and is used to fix the socket 610.

[0037] The socket 610 is connected to the fixing component 700, which fixes the outer periphery of the socket 610 to secure the socket 610.

[0038] Specifically, the fixing component 700 includes: The plug 710 is connected to the socket 610; Link 720, the middle region of which is mounted on both sides of plug 710; A buckle 730 is provided, one end of which is installed on one end of the connecting rod 720; the other end of the buckle 730 is provided with a bevel, which extends to the side of the socket 610. The buckle 730 is used to fix the connection between the connecting rod 720 and the socket 610 through the bevel. A pressure plate 740 is installed at the other end of the connecting rod 720 and is used to release the inclined surface from the fixed connection with the socket 610.

[0039] In this embodiment of the invention, a socket 610 is installed at one end of the server motherboard 600. The fixing assembly 700 includes a plug 710, a latch 730, a connecting rod 720, and a pressure plate 740. The plug 710 is installed at one end of the socket 610. Connecting rods 720 are installed on both sides of the plug 710, a pressure plate 740 is installed on one side of each connecting rod 720, and a latch 730 is installed at one end of each connecting rod 720. A slot is provided at one end of the socket 610, and the plug 710 and the socket 610 form a locking structure.

[0040] Connecting rods 720 are installed on both sides of the plug 710. A pressure plate 740 is installed on one side of the connecting rod 720, and a buckle 730 is installed on one end of the connecting rod 720.

[0041] See attached document Figure 7 As shown, the plug 710 can be inserted into the socket 610. After the plug 710 is inserted into the socket 610, the connecting rods 720 on both sides of the plug 710 can be made of an elastic plastic material, that is, the connecting rods 720 are elastic connecting rods. The elastic plastic material includes, but is not limited to, thermoplastic polyurethane, styrene-based thermoplastic elastomers, polyvinyl chloride, chlorinated polyethylene, ethylene-vinyl acetate copolymer, silicone rubber, and polyolefin-based thermoplastic elastomers.

[0042] One end of the latch 730 on the connecting rod 720 has a bevel. Therefore, when the plug 710 is inserted into the socket 610, the latch 730 will directly lock into the grooves on both sides of the socket 610, and the latch 730 will fix the plug 710 to the socket 610. When it is necessary to remove the plug 710, the pressure plate 740 can be pressed to rotate the connecting rod 720. The rotation of the connecting rod 720 will cause the latch 730 to no longer lock into the socket 610.

[0043] Furthermore, a heat-shrink film is placed between the socket 610 and the plug 710, covering both. When the server generates heat, the heat dissipates and causes the heat-shrink film to shrink, allowing it to tightly wrap around the socket 610 and the plug 710, preventing them from detaching. The heat-shrink film can be any thermoplastic film, such as polyethylene (PE) or polyvinyl chloride (PVC).

[0044] In an optional embodiment of the present invention, the heat sinks 400 are arranged at equal intervals at the top of the top plate 300.

[0045] The heat sink 400 is made of thermally conductive metal, transferring heat from a radiator or other heat dissipation device to itself and dissipating heat to the environment through its high surface area. Simultaneously, heat transfer can be accelerated by forcibly flowing gas through the heat sink 400 at appropriate speeds. The heat sink 400 can be made of silver, copper, aluminum, steel, etc., and this embodiment of the invention does not specifically limit the material.

[0046] Specifically, the heat sink 400 can be a finned heat sink 400, which is arranged at equal intervals at the top of the top plate 300. The heat sink 400 utilizes fins to increase the heat dissipation area, significantly increasing the heat dissipation area of ​​the radiator, allowing heat to be transferred to the fin surface more quickly and dissipated rapidly into the surrounding environment. The fin arrangement not only improves heat dissipation efficiency but also reduces the size and weight of the heat dissipation component, making it more compact and lightweight.

[0047] Reference Figure 2 and Figure 3 As shown, the heat sink 400 has a large surface area, which can absorb heat for rapid heat dissipation. At the same time, the fan 220 at the bottom of the outer casing 100 can start working. The fan 220 can draw air into the outer casing 100 to draw out the hot air inside the outer casing 100 and dissipate heat inside the outer casing 100. The filter 230 can filter dust to prevent dust from entering the interior of the outer casing 100.

[0048] In this embodiment of the invention, a plug 710 is movably connected to one end of a socket 610. The plug 710 can be inserted into the socket 610. After the plug 710 is inserted into the socket 610, the connecting rods 520 on both sides of the plug 710 can be made of elastic plastic material. One end of the buckle 730 of the connecting rod 520 is provided with a bevel. Therefore, when the plug 710 is inserted into the socket 610, the buckle 730 will directly lock into the grooves on both sides of the socket 610, fixing the plug 710 to the socket 610. When it is necessary to remove the plug 710, the pressure plate 740 can be pressed to rotate the connecting rod 520. The rotation of the connecting rod 520 will cause the buckle 730 to no longer lock into the socket 610, so the plug 710 can be removed. This achieves the purpose of making it easy for the server to fix the plug 710. By installing a heat sink 400 at the top of the top plate 300, the heat sink 400 has a large surface area and can absorb heat to dissipate heat quickly. At the same time, the fan 220 at the bottom of the outer casing 100 can start working. The fan 220 can draw air into the outer casing 100 to draw out the hot air inside the outer casing 100 and dissipate heat from the inside of the outer casing 100. The filter 230 can filter dust to prevent dust from entering the inside of the outer casing 100, thereby achieving the purpose of facilitating heat dissipation for the server.

[0049] This invention also discloses a server, including a server motherboard 600 and a server motherboard 600 heat dissipation structure as described above. The server motherboard 600 is installed in the server motherboard 600 heat dissipation structure, which is used to dissipate heat from the server motherboard 600.

[0050] In this embodiment of the invention, the server includes a server motherboard 600 and a server motherboard 600 heat dissipation structure. When the server motherboard 600 is running, the server motherboard 600 heat dissipation structure is activated simultaneously to dissipate heat from the server motherboard 600, ensuring that the server motherboard 600 can operate stably and realize the corresponding business processing.

[0051] Specifically, the server motherboard 600 heat dissipation structure includes: The outer casing 100 has a bellows assembly 200 at its bottom; the top plate 300 has heat sinks 400 on its top plate; the outer casing 100 and the top plate 300 are connected by a snap-fit ​​assembly 500. When the locking assembly 500 is in the disengaged state, the outer casing 100 and the top plate 300 are slidably connected, and the outer casing 100 forms an opening through which multiple server motherboards 600 are installed. When the locking assembly 500 is in the secured state, the air box assembly 200 outputs cold air to the bottom of the outer casing 100, which passes through the server motherboards 600 and reaches the heat sink 400. The server motherboards 600 transfer heat to the heat sink 400 through the outer casing 100 and the top plate 300. The heat sink 400 is used to dissipate heat from the cold air and heat from the server motherboards 600.

[0052] Optionally, the bellows assembly 200 includes: The bellows body 210 is fixed to the bottom of the outer shell 100; the bellows body 210 has an opening receiving cavity inside. A fan 220 is disposed inside the opening receiving cavity and is used to generate and output cold air through the opening side of the opening receiving cavity; A filter 230 is disposed on the opening side of the opening receiving cavity for filtering the cold air.

[0053] Optionally, the engagement assembly 500 includes: A locking groove 510 is disposed on the top of the outer shell 100; a locking block 530 is disposed on the bottom of the top plate 300; the locking groove 510 and the locking block 530 are slidably connected. A connecting rod 520, one end of which passes through the engaging groove 510 and the engaging block 530, and an operating block 540, which is disposed at the other end of the connecting rod 520; when the operating block 540 is engaged with the connecting rod 520, the engaging assembly 500 is in the fastened state; when the operating block 540 is disengaged from the connecting rod 520, the engaging assembly 500 is in the disengaged state.

[0054] Optionally, the engagement assembly 500 further includes: The outer side wall of the connecting rod 520 is provided with external threads; The inner wall of the locking block 530 is provided with internal threads; The internal thread and the external thread mate with each other.

[0055] Optionally, the server motherboard 600 has a connector 610, and the heat dissipation structure of the server motherboard 600 further includes: The fixing component 700 is connected to the socket 610 and is used to fix the socket 610.

[0056] Optionally, the fixing component 700 includes: The plug 710 is connected to the socket 610; Link 720, the middle region of which is mounted on both sides of plug 710; A buckle 730 is provided, one end of which is installed on one end of the connecting rod 720; the other end of the buckle 730 is provided with a bevel, which extends to the side of the socket 610. The buckle 730 is used to fix the connection between the connecting rod 720 and the socket 610 through the bevel. A pressure plate 740 is installed at the other end of the connecting rod 720 and is used to release the inclined surface from the fixed connection with the socket 610.

[0057] Optionally, the connecting rod 720 is an elastic connecting rod.

[0058] Optionally, the heat sinks 400 are arranged at equal intervals at the top of the top plate 300.

[0059] Optionally, it also includes: Positioning blocks 810 are disposed on both sides of the outer casing 100 for positioning the outer casing 100; Plate 820 is installed on one side of the positioning block 810; A spring 830 is installed on the other side of the positioning block 810. A snap fastener is installed on one side of the spring 830. The snap fastener is used to fasten the positioning block 810 and the outer shell 100 under the action of the spring 830.

[0060] In this embodiment of the invention, a housing 100 is provided, with a bellows assembly 200 at its bottom; a top plate 300 is provided, with a heat sink 400 on the top plate 300; the housing 100 and the top plate 300 are connected by a snap-fit ​​assembly 500; when the snap-fit ​​assembly 500 is in a disengaged state, the housing 100 and the top plate 300 are slidably connected, and the housing 100 forms an opening through which multiple server motherboards 600 are installed; when the snap-fit ​​assembly 500 is in a secured state, the bellows assembly 200 outputs cold air to the bottom of the housing 100, which passes through the server motherboards 600 and reaches the heat sink 400. The server motherboards 600 transfer heat through the housing 100 and the top plate 300 to the heat sink 400, which dissipates heat from the cold air and from the server motherboards 600. In this embodiment of the invention, after the server motherboard 600 is installed, the outer casing 100 can be opened to quickly disassemble and assemble the server motherboard 600, thereby realizing the convenient disassembly and assembly of the modular server. When closed, cool air is provided from the bottom to blow onto the server motherboard 600 to cool it. The cooled air and the cold air emitted by the server motherboard 600 are directed to the heat sink 400 on the top of the top plate 300, where the heat sink 400 further absorbs heat for rapid heat dissipation, thus dissipating heat from the inside of the outer casing 100 and achieving the purpose of server heat dissipation.

[0061] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A server motherboard heat dissipation structure, characterized in that, include: The outer casing has a bellows assembly at its bottom; the top plate has heat sinks on it; the outer casing and the top plate are connected by a snap-fit ​​assembly. When the locking assembly is in the disengaged state, the outer casing and the top plate are slidably connected, forming an opening through which multiple server motherboards are installed. When the locking assembly is in the secured state, the air box assembly outputs cold air to the bottom of the outer casing, which passes through the server motherboards and reaches the heat sink. The server motherboards transfer heat to the heat sink via the outer casing and the top plate. The heat sink dissipates heat from the cold air and from the server motherboards. The outer casing has a cavity for housing the server motherboards. After the heat sink dissipates heat from the cold air, the cooled air further dissipates heat from the server motherboards inside the outer casing. Positioning blocks are disposed on both sides of the outer casing for positioning the outer casing; The plate is installed on one side of the positioning block; A spring is installed on the other side of the positioning block, and a snap-fit ​​is installed on one side of the spring. The snap-fit ​​is used to fasten the positioning block and the outer shell under the action of the spring. The engagement assembly includes: A locking groove is provided on the top of the outer shell; a locking block is provided on the bottom of the top plate; the locking groove and the locking block are slidably connected; A connecting rod, one end of which passes through the engaging groove and engaging block; an operating block, disposed at the other end of the connecting rod; when the operating block is engaged with the connecting rod, the engaging assembly is in the fastened state; when the operating block is disengaged from the connecting rod, the engaging assembly is in the disengaged state.

2. The server motherboard heat dissipation structure according to claim 1, characterized in that, The bellows assembly includes: The bellows body is fixed to the bottom of the outer shell; the bellows body has an open receiving cavity. A fan is installed inside the opening receiving cavity to generate and output cold air through the opening side of the opening receiving cavity; A filter screen is disposed on the opening side of the opening receiving cavity for filtering the cold air.

3. The server motherboard heat dissipation structure according to claim 1, characterized in that, The engagement assembly also includes: The outer side wall of the connecting rod is provided with external threads; The inner wall of the locking block is provided with internal threads; The internal thread and the external thread mate with each other.

4. The server motherboard heat dissipation structure according to claim 1, characterized in that, The server motherboard has a connector, and the server motherboard heat dissipation structure further includes: A fixing component is connected to the socket and is used to fix the socket.

5. The server motherboard heat dissipation structure according to claim 4, characterized in that, The fixing component includes: The plug is connected to the socket. A connecting rod, the middle region of which is mounted on both sides of the plug; A buckle, one end of which is installed on one end of the connecting rod; the other end of the buckle is provided with a bevel, which extends to the side of the socket, and the buckle is used to fix the connection with the socket through the bevel under the action of the connecting rod; A pressure plate, installed at the other end of the connecting rod, is used to release the inclined surface from the fixed connection with the socket.

6. The server motherboard heat dissipation structure according to claim 5, characterized in that, The connecting rod is an elastic connecting rod.

7. The server motherboard heat dissipation structure according to claim 1, characterized in that, The heat sinks are arranged at equal intervals at the top of the top plate.

8. A server, characterized in that, The system includes a server motherboard and a server motherboard heat dissipation structure as described in any one of claims 1-7, wherein the server motherboard is mounted in the server motherboard heat dissipation structure, and the server motherboard heat dissipation structure is used to dissipate heat from the server motherboard.

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