IGBT bonding wire 3D point cloud adaptive filtering and arc height surface extraction method

CN119205701APending Publication Date: 2024-12-27SHANGHAI SHARETEK TECH CO LTD

Patent Information

Application Number
CN202411351566.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-26
Publication Date
2024-12-27

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Abstract

The invention discloses an IGBT bonding wire 3D point cloud adaptive filtering and arc height surface extraction method. The method comprises the steps of obtaining a to-be-detected image; performing local discrete noise denoising processing on the to-be-detected image to obtain a processed to-be-detected image; calculating a gray histogram of the processed to-be-detected image, and obtaining a smooth curve of the gray histogram of the IGBT bonding wire; carrying out second-order derivation on the IGBT bonding wire gray level histogram smooth curve to obtain a dense noise area and a gray level distribution range of a camber height surface; based on the dense noise area and the gray level distribution range of the arc height surface, the dense noise area is removed, and a bonding wire arc height area is obtained. According to the invention, adaptive filtering can be carried out on the obtained 3D point cloud information of the IGBT bonding wire, and a lot of work of manually setting parameters is effectively replaced. The key information of the target bonding wire can be successfully extracted after filtering, the detection work of the bonding wire is accurately and efficiently completed, and the overall working efficiency and reliability of the system are effectively improved.
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Citation Information

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