Optical module and electronic device

CN119207064BActive Publication Date: 2026-09-25WUHAN JUXIN MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202411293458.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-14
Publication Date
2026-09-25
Estimated Expiration
2044-09-14

AI Technical Summary

Technical Problem

但是,较小的开孔无法满足红外遥控功能的出光需求,使得无法在单点传感器、光感传感器等已包括发射组件的产品中集成红外遥控功能

Benefits of technology

[0036]本申请实施例中的光学模组,与发光单元对应的第一孔的长宽比大于1,并且大于或等于与接收单元对应的第二孔的长宽比。相较于长宽比为1的第一孔,本申请实施例使保持第一孔在第一方向上的孔径,增加其在第二方向上的孔径,使第一孔的长宽比大于1,增加了第一孔的出光角度和辐射通量,提高了射出的大角度光线的辐射强度,使得第一孔可以满足遥控(例如,红外遥控)的出光需求。并且,由于第一孔在第一方向上的孔径保持不变,不会引起第一方向上孔径增大导致的光串扰发生,能够满足光感功能的准确性需求。实现了在一个模组中集成遥控功能和光感功能;并且,将单独实现遥控功能和光感功能所需的三个开孔减少为两个开孔。提高了光学模组的美观性,有利于降低遥控模块和光感模块的集成成本,加速终端产品的小型化发展。

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Abstract

Embodiments of the present application provide an optical module and an electronic device. The optical module comprises a substrate, a first chip disposed on a first region of a surface of the substrate, the first chip comprising a light emitting unit for emitting light, a second chip disposed on a second region of the surface of the substrate, the second chip comprising a light receiving unit for receiving light, and a cover plate covering the first chip and the second chip, the cover plate comprising a first hole and a second hole, the first hole being located at a light emitting position of the light emitting unit, the second hole being located at a light receiving position of the light receiving unit, a ratio between a length of the first hole in a second direction and a width of the first hole in a first direction being a first length-width ratio, a ratio between a length of the second hole in the second direction and a width of the second hole in the first direction being a second length-width ratio, the first length-width ratio being greater than or equal to the second length-width ratio, the first length-width ratio being greater than 1, the second direction being parallel to the surface of the substrate and intersecting the first direction.
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Description

Technical Field

[0001] This application relates to the field of optoelectronic sensing technology, and more particularly to an optical module and an electronic device. Background Technology

[0002] With the rise of smart homes, infrared remote control technology has become an important bridge connecting various smart home appliances. Integrating infrared remote control functionality into electronic products is currently a hot research topic. This is typically achieved by adding a separate infrared remote control module to the electronic product, but this increases the size of the product, hindering its miniaturization.

[0003] In related technologies, products such as point sensors and light sensors may also include emitting components for emitting infrared light. However, in order to reduce optical crosstalk and improve sensing accuracy, these sensor products are usually designed with the openings in the sensor package made as small as possible. However, the small openings cannot meet the light emission requirements of infrared remote control functions, making it impossible to integrate infrared remote control functions into products such as point sensors and light sensors that already include emitting components. Summary of the Invention

[0004] In view of this, embodiments of this application aim to provide an optical module and electronic device that can integrate remote control functionality.

[0005] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0006] This application provides an optical module, including: a substrate;

[0007] A first chip, disposed in a first region on the surface of the substrate, includes a light-emitting unit; the light-emitting unit is used to emit light.

[0008] The second chip is disposed in a second region on the surface of the substrate and includes a receiving unit; the receiving unit is used to receive reflected light from the light source; wherein the first region and the second region are arranged side by side along a first direction parallel to the surface of the substrate.

[0009] A cover plate that covers the first chip and the second chip;

[0010] The cover plate is provided with a first hole and a second hole; the first hole is located at the light-emitting position of the light-emitting unit; the second hole is located at the light-receiving position of the receiving unit.

[0011] Wherein, the ratio between the length of the first hole in the second direction and its width in the first direction is a first aspect ratio, the ratio between the length of the second hole in the second direction and its width in the first direction is a second aspect ratio, the first aspect ratio is greater than or equal to the second aspect ratio, the first aspect ratio is greater than 1, the second direction is parallel to the surface of the substrate and intersects with the first direction.

[0012] In some embodiments, the second aspect ratio is greater than or equal to 1, and the length of the first hole in the second direction is greater than the length of the second hole in the second direction.

[0013] In some embodiments, the cross-sectional shape of the first hole on the first plane is elliptical, polygonal, or irregular; wherein the irregular shape is formed by curves and / or straight lines.

[0014] The cross-sectional shape of the second hole on the first plane is elliptical, circular, or polygonal;

[0015] The first plane is parallel to the surface of the substrate.

[0016] In some embodiments, the cross-sectional shape of the first hole on the second plane is rectangular or trapezoidal;

[0017] The cross-sectional shape of the second hole on the second plane is rectangular or trapezoidal;

[0018] The second plane is perpendicular to the surface of the substrate.

[0019] In some embodiments, the first hole includes a plurality of emission holes;

[0020] Along the second direction, the plurality of emission holes are spaced apart.

[0021] In some embodiments, the optical module further includes:

[0022] A movable plate, connected to the cover plate, is used to slide in a direction parallel to the surface of the cover plate to adjust the light-emitting surface area of ​​the first hole;

[0023] In the first position, the first hole is not blocked; in the second position, the first hole is partially or completely blocked by the movable plate.

[0024] In some embodiments, the light source includes a first light source and a second light source;

[0025] The first light beam includes a remote control signal corresponding to a preset code;

[0026] The second light ray includes a periodic signal modulated by continuous wave or pulse;

[0027] The receiving unit is used to receive the reflected second light.

[0028] In some embodiments, the second chip further includes a reference unit located near the side of the first chip;

[0029] The cover plate includes a protruding structure located between the reference unit and the receiving unit.

[0030] The protruding structure extends along the second direction to block the propagation of light between the light-emitting unit and the receiving unit.

[0031] In some embodiments, the optical module further includes a filter unit;

[0032] The filter unit is located between the receiving unit and the second hole, and covers the side of the second hole near the substrate.

[0033] The filter unit is used to filter out light other than the reflected light.

[0034] This application also provides an electronic device, including a light-transmitting panel and the aforementioned optical module;

[0035] The light-transmitting panel is located on the side of the optical module away from the substrate, and is used to protect the optical module.

[0036] In the optical module of this application embodiment, the aspect ratio of the first hole corresponding to the light-emitting unit is greater than 1, and is greater than or equal to the aspect ratio of the second hole corresponding to the receiving unit. Compared to a first hole with an aspect ratio of 1, this application embodiment maintains the aperture of the first hole in the first direction and increases its aperture in the second direction, making the aspect ratio of the first hole greater than 1. This increases the light emission angle and radiant flux of the first hole, improving the radiation intensity of the emitted large-angle light, so that the first hole can meet the light emission requirements of remote control (e.g., infrared remote control). Furthermore, since the aperture of the first hole in the first direction remains unchanged, it will not cause optical crosstalk caused by the increase in aperture in the first direction, thus meeting the accuracy requirements of the light sensing function. This achieves the integration of remote control and light sensing functions in one module; and reduces the three openings required to separately implement remote control and light sensing functions to two openings. This improves the aesthetics of the optical module, helps reduce the integration cost of the remote control module and the light sensing module, and accelerates the miniaturization of terminal products. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the optical module structure in the embodiments of this application. Figure 1 ;

[0038] Figure 2 This is a schematic diagram of the structure of the cover plate of the optical module in the embodiments of this application. Figure 1 ;

[0039] Figure 3 This is a schematic diagram of the structure of the cover plate of the optical module in the embodiments of this application. Figure 2 ;

[0040] Figure 4 This is a schematic diagram of the cover plate of the optical module in the first comparative embodiment of this application;

[0041] Figure 5 This is a schematic diagram of the cover plate of the optical module in Comparative Embodiment 2 of this application;

[0042] Figure 6 This is a simulation diagram of the light intensity distribution of the optical module in the embodiments of this application;

[0043] Figure 7 This is a schematic diagram of the optical module structure in the embodiments of this application. Figure 3 ;

[0044] Figure 8 This is a schematic diagram of the structure of the cover plate of the optical module in the embodiments of this application. Figure 2 ;

[0045] Figure 9 This is a schematic diagram of the structure of the cover plate of the optical module in the embodiments of this application. Figure 3 ;

[0046] Figure 10A This is a schematic diagram of the structure of the cover plate and movable plate of the optical module in the embodiments of this application. Figure 1 ;

[0047] Figure 10B This is a schematic diagram of the structure of the cover plate and movable plate of the optical module in the embodiments of this application. Figure 2 ;

[0048] Figure 11 This is a schematic diagram of the optical module structure in the embodiments of this application. Figure 4 ;

[0049] Figure 12 This is a schematic diagram of the optical module structure in the embodiments of this application. Figure 5 ;

[0050] Figure 13 This is a schematic diagram of the structure of the electronic device in the embodiments of this application. Detailed Implementation

[0051] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0053] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0054] Wireless remote control technology is a communication technology that uses light (e.g., infrared light) as an information transmission medium for wireless, contactless control. It allows users to operate the device without direct contact, greatly improving ease of use. Integrating remote control functionality into electronic devices has become a pressing issue that needs to be addressed.

[0055] The initial design principles of single-point sensors and light sensors fundamentally conflict with the functional requirements of remote controls: the former prioritizes the precision and accuracy of light signals, while the latter prioritizes the diffusion and remote control capabilities of light signals. The angle and intensity of light emitted by single-point and light-sensing products cannot meet the light emission requirements of remote control functions. Specifically, to better realize their sensing function and increase the accuracy of their measurement or detection, the transmitting and / or receiving apertures in single-point and light sensors are usually made relatively small, thereby reducing the impact of optical crosstalk. However, remote control functions require the light signal emitted by the transmitter to meet certain angles and light intensities (radiation intensity) to effectively control the controlled target device even at a greater distance. This necessitates that the aperture of the transmitting aperture on the transmitter cannot be too small.

[0056] Therefore, a modular design approach is typically adopted, integrating the remote control module as a separate unit into the target product. However, configuring the optical sensor module and the remote control module separately increases the size of the target product, which is not conducive to its miniaturization.

[0057] In view of this, embodiments of this application provide an optical module, such as... Figure 1As shown, the optical module 100 includes a substrate 101;

[0058] A first chip 102 is disposed in a first region on the surface of the substrate 101 and includes a light-emitting unit; the light-emitting unit is used to emit light.

[0059] The second chip 103 is disposed in a second region on the surface of the substrate 101 and includes a receiving unit; the receiving unit is used to receive reflected light from the light source; wherein the first region and the second region are arranged side by side along a first direction parallel to the surface of the substrate 101.

[0060] Cover plate 104 covers the first chip 102 and the second chip 103;

[0061] The cover plate 104 is provided with a first hole 105 and a second hole 106; the first hole 105 is located at the light-emitting position of the light-emitting unit; the second hole 106 is located at the light-receiving position of the receiving unit.

[0062] Wherein, the ratio between the length of the first hole 105 in the second direction and its width in the first direction is a first aspect ratio, the ratio between the length of the second hole 106 in the second direction and its width in the first direction is a second aspect ratio, the first aspect ratio is greater than or equal to the second aspect ratio, the first aspect ratio is greater than 1, the second direction is parallel to the surface of the substrate and intersects with the first direction.

[0063] In some embodiments, the first chip can generate non-visible light radiation by being driven by an electric current. For example, the first chip is a Vertical-Cavity Surface-Emitting Laser (VCSEL) chip or an Edge-Emitting Laser (EEL) chip. The light-emitting unit of the VCSEL chip includes a laser diode, which emits light perpendicular to the chip surface. Compared with EEL chips, VCSEL chips are more advantageous for large-scale arrays and integration. The second chip can receive the light signal and convert it into an electrical signal for further processing. For example, the second chip is an Application-Specific Integrated Circuit (ASIC) chip. Light can be emitted through the light-emitting unit. This light is led out through a first aperture to the object under test, reflected by the object under test, and received by the receiving unit through a second aperture. The optical module senses relevant information about the object under test through the received reflected light. For example, the optical module calculates the Time of Flight (TOF) based on the emitted infrared light and the received reflected infrared light to obtain the distance to the object under test, and then generates corresponding depth information.

[0064] On a plane parallel to the substrate 101, the arrangement direction of the first region and the second region is the first direction, that is, the direction of the line connecting the centers of the first hole 105 and the second hole 106 is the first direction. The direction of the line connecting two points with the maximum line distance on the edge of the first hole 105 is the second direction. The length of the first hole 105 in the second direction is the first length, the width of the first hole 105 in the first direction is the first width, and the ratio between the first length and the first width is the first aspect ratio. The length of the second hole 106 in the second direction is the second length, the width of the second hole 106 in the first direction is the second width, and the ratio between the second length and the second width is the second aspect ratio.

[0065] In one specific embodiment, the top view of the cover plate is as follows: Figure 2 As shown, the length of the first hole in the second direction (Y-axis direction) is L1, and the ratio of the length of the first hole in the Y-axis direction to its width in the first direction (X-axis direction) is the first aspect ratio L1 / W1. Similarly, the ratio of the length of the second hole in the Y-axis direction to its width in the X-axis direction is the second aspect ratio L2 / W2. Wherein, the first aspect ratio L1 / W1 is greater than 1, the second aspect ratio L2 / W2 is equal to 1, and the first aspect ratio L1 / W1 is greater than the second aspect ratio L2 / W2.

[0066] In another specific embodiment, the top view of the cover plate is as follows: Figure 3As shown, the ratio of the length of the first hole in the Y-axis direction to its width in the X-axis direction is the first aspect ratio L1 / W1. The ratio of the length of the second hole in the Y-axis direction to its width in the X-axis direction is the second aspect ratio L2 / W2. The first aspect ratio L1 / W1 is greater than 1, the second aspect ratio is greater than L2 / W2 and greater than 1, and the first aspect ratio L1 / W1 is equal to the second aspect ratio L2 / W2.

[0067] This application also provides a comparative embodiment one. For example... Figure 4 As shown, in Comparative Embodiment 1, the length of the first hole 105 in the Y-axis direction is the first length L1, and the length of the second hole 106 in the Y-axis direction is the second length L2. The first length L1 is greater than the second length L2, the first aspect ratio L1 / W1 is equal to 1, and the second aspect ratio L2 / W2 is equal to 1.

[0068] Compared to Comparative Example 1, Figure 2 and Figure 3 In the illustrated embodiment, the first aspect ratio L1 / W1 is greater than 1, and the aspect ratio of the first aperture is greater than or equal to that of the second aperture. This increases the aperture diameter of the first aperture in the second direction, increases the light-emitting area and radiant flux of the first aperture, and improves the radiation intensity of the emitted large-angle infrared light, enabling the first aperture to meet the light emission requirements for wireless remote control. Furthermore, since the aperture diameter of the first aperture remains unchanged in the first direction, it does not cause optical crosstalk that would result from an increase in aperture diameter in the first direction. The optical module in this embodiment can meet both the light emission requirements for wireless remote control to achieve wireless remote control functionality and the accuracy requirements for light sensing functionality.

[0069] This application also provides a second comparative embodiment, which differs from the first comparative embodiment only in that the aperture of the first aperture 105 is increased in both the X-axis and Y-axis directions. By simultaneously increasing the aperture in both the first and second directions, the light-emitting area and radiant flux of the first aperture 105 are increased, enabling it to meet the light emission requirements of wireless remote control. However, according to... Figure 4 As shown in the optical path analysis diagram of the optical module, compared with the first hole 105 shown by the solid line, the first hole 105 shown by the dashed line has a larger aperture in the first direction. This increases the emission angle of the light, which increases the probability that the light will enter the receiving end after being reflected by the external glass cover of the optical module. This causes the light to overlap with the reflected light from the target, exacerbating the optical crosstalk problem, and thus the accuracy required for the light sensing function cannot be met.

[0070] Since different air gaps (the distance between the optical module and the light-transmitting panel mounted on it) have varying effects on the optical performance of the optical module, this application compared the performance parameters of multiple embodiments under different air gap conditions. It was found that when all air gaps are A, or when all air gaps are B, the aperture of the first hole in the first direction remains unchanged in multiple embodiments, while its aperture in the second direction is increased sequentially. As the first aspect ratio increases, the aperture of the first hole in the second direction also gradually increases, resulting in a significant increase in the radiation intensity of infrared light at larger angles, which meets the radiation intensity requirements for infrared remote control. Furthermore, the increase in aperture in the second direction has a negligible impact on optical crosstalk in the receiving unit, and does not affect the optical module's ability to perform light sensing. This not only integrates remote control and light sensing functions into a single module, but also reduces the three openings required for each function to two. This improves the aesthetics of the optical module, helps reduce the integration cost of the remote control and light sensing modules, and accelerates the miniaturization of terminal products.

[0071] In some embodiments, the second aspect ratio is greater than or equal to 1, and the length of the first hole in the second direction is greater than the length of the second hole in the second direction.

[0072] The second aspect ratio is greater than 1, and the aperture of the first hole in the second direction is larger than its aperture in the first direction. Alternatively, the second aspect ratio is equal to 1, and the aperture of the first hole in the second direction is equal to its aperture in the first direction. It should be noted that the embodiments of this application do not limit the specific size of the second aspect ratio. However, if the second aspect ratio is less than 1, the light intake of the second hole in the first direction will be increased compared to its light intake in the second direction. Figure 5 The optical crosstalk path shown is detrimental to the accuracy required for light sensing.

[0073] The length of the first aperture in the second direction is greater than the length of the second aperture in the second direction, and the width of the first aperture in the first direction is greater than or equal to the width of the second aperture in the first direction. Since the length of the second aperture used to receive light in the second direction is less than the length of the first aperture used to emit light in that direction, increasing the emitted light radiant flux does not increase the amount of light entering the second aperture in that direction, and therefore does not affect the accuracy of the light sensing function.

[0074] In some embodiments, the cross-sectional shape of the first hole on the first plane is elliptical, polygonal, or irregular; wherein the irregular shape is formed by curves and / or straight lines.

[0075] The cross-sectional shape of the second hole on the first plane is circular or polygonal;

[0076] The first plane is parallel to the surface of the substrate.

[0077] On a first plane parallel to the surface of the substrate, the cross-sectional shape of the first hole is elliptical, polygonal, or irregular. Taking an elliptical shape as an example, continue referring to... Figure 2 The direction of the minor axis of the ellipse is the first direction, and the direction of its major axis is the second direction. The length of the minor axis of the ellipse is W1, and the length of the major axis is L1.

[0078] Continue to refer to Figure 4 In the first comparative embodiment shown, the first aperture 105 has a circular cross-sectional shape. An elliptical cross-sectional shape for the first aperture 105 increases its aperture diameter in the second direction, which can improve the light intensity at large angles. Since the aperture diameter of the first aperture 105 remains unchanged in the first direction, it does not increase the risk of optical crosstalk in the optical module. Figure 6 for Figure 2 and Figure 4 Simulation diagrams of radiation intensity distribution at different angles for the two corresponding embodiments. (See attached diagrams.) Figure 6 As shown, when the cross-sectional shape of the first hole 105 is elliptical, it still has a certain radiation intensity near ±θ degrees, which can meet the radiation intensity requirements of the infrared remote control function. When the cross-sectional shape of the first hole 105 is circular, its radiation intensity is almost 0 above ±δ degrees, which cannot meet the infrared light radiation intensity requirements of the infrared remote control function.

[0079] It should be noted that the embodiments of this application do not limit the specific cross-sectional shape of the first hole on the first plane, as long as it satisfies the first aspect ratio being greater than 1, that is, the diameter of the first hole in the first direction (the direction of the line connecting the centers of the two holes) is smaller than its diameter in the second direction (not the direction of the line connecting the centers of the two holes).

[0080] On a first plane parallel to the surface of the substrate, the cross-sectional shape of the second hole is elliptical, circular, or polygonal. Taking a circular hole as an example, see below. Figure 2 The diameter of the second hole in the first direction is equal to its diameter in the second direction. On one hand, the circular cross-sectional shape of the second hole allows it to receive reflected light from all directions, effectively improving the efficiency of light reception. On the other hand, the circular cross-sectional shape of the second hole also facilitates its processing and manufacturing. It should be noted that the embodiments of this application do not limit the specific cross-sectional shape of the second hole on the first plane.

[0081] In some embodiments, the cross-sectional shape of the first hole on the second plane is rectangular or trapezoidal;

[0082] The cross-sectional shape of the second hole on the second plane is rectangular or trapezoidal;

[0083] The second plane is perpendicular to the surface of the substrate.

[0084] In one specific embodiment, reference continues to be made to... Figure 1 On a second plane perpendicular to the surface of the substrate 101, the cross-sectional shape of the first hole 105 and the second hole 106 is rectangular.

[0085] In another specific embodiment, such as Figure 7 As shown, on a second plane perpendicular to the surface of the substrate 101, the cross-sectional shape of the first hole 105 and the second hole 106 is a trapezoid with a wider top and a narrower bottom. The second hole 106, with its wider top and narrower bottom, can more effectively guide the reflected infrared light to the receiving unit, further improving the receiving efficiency of the receiving unit.

[0086] In some embodiments, the first hole includes a plurality of emission holes;

[0087] Along the second direction, the plurality of emission holes are spaced apart.

[0088] Where the first aperture includes multiple emission apertures, the first length refers to the distance between the two farthest points of the multiple emission apertures in the second direction. The first width refers to the distance between the two farthest points of the multiple emission apertures or a single emission aperture in the first direction. The first aspect ratio is the ratio between the first length and the first width. For example, as shown... Figure 8 As shown, the first hole 105 includes a plurality of emission holes spaced apart along the Y-axis. The first length L1 of the first hole 105 is the distance between the upper and lower vertices, the first width W1 is the distance between the left and right vertices, and the first aspect ratio is L1 / W1.

[0089] Continue to refer to Figure 8 The cross-sectional shape of each emitting aperture on the first plane can be set to a circle with the same diameter. The cross-sectional shape of the second aperture 106 on the first plane is also set to a circle. On the one hand, a circular emitting aperture can reduce the risk of distortion of the emitted light spot. On the other hand, the circular cross-sectional shape allows for better matching between the emitting aperture and the second aperture, which can further ensure accurate transmission of infrared light. It should be noted that this application does not limit the cross-sectional shape of each emitting aperture on the first plane.

[0090] Furthermore, the embodiments of this application do not limit the specific aperture of each emission hole. In another specific embodiment, such as Figure 9As shown, the first hole 105 includes three spaced-apart emission holes. The middle emission hole has the largest diameter, while the emission holes near the edge of the cover plate have relatively smaller diameters. In this case, the width of the first hole 105 in the first direction refers to the maximum diameter of the emission hole. It should be noted that the embodiments of this application do not limit the specific number of emission holes 105 in the first direction; that is, multiple emission holes can be provided in the first direction.

[0091] In some embodiments, such as Figure 10A or Figure 10B As shown, the optical module further includes:

[0092] Movable plate 1001 is connected to cover plate 104. Movable plate 1001 is used to slide in a direction parallel to the surface of cover plate 104 to adjust the light-emitting surface area of ​​the first hole 105.

[0093] In the first position, the first hole 105 is not blocked; in the second position, the first hole 105 is partially or completely blocked by the movable plate 1001.

[0094] In some embodiments, continue to refer to Figure 10A The first hole 105 is a single-hole structure. A movable plate 1001, slidably connected to the cover plate 104, is provided on the movable plate 1001. A circular hole 1002 is provided on the movable plate 1001, the diameter of which is equal to the width W1 of the first hole 105 in the first direction. During the remote control function of the optical module, the movable plate 1001 and the first hole 105 do not overlap. During the light-sensing function of the optical module, the movable plate 1001 and the first hole 105 overlap, partially blocking the first hole 105 and reducing its light-emitting area. Specifically, in a direction perpendicular to the substrate surface, the center of the circular hole 1002 on the movable plate overlaps with the center of the first hole 105. The portion of the first hole 105 near the edge of the cover plate is covered by the movable plate 1001, and the infrared light emitted by the light-emitting unit is guided out through the first hole 105 and the circular hole on the movable plate 1001 before being emitted.

[0095] In other embodiments, reference continues. Figure 10B The first hole 105 includes three emission holes. During the remote control function of the optical module, the movable plate 1001 does not overlap with any of the emission holes. During the light-sensing function of the optical module, the movable plate 1001 overlaps with the first hole 105 and covers the emission holes on both sides. The infrared light emitted by the light-emitting unit is led out through the central emission hole and the circular hole 1002 on the movable plate.

[0096] It should be noted that during the remote control function of the optical module, the movable plate may overlap with part of the first hole, but the light-emitting area of ​​the optical module during the infrared remote control function should be greater than its light-emitting area during the light-sensing function. Additionally, one or more circular holes on the movable plate are provided as examples. The embodiments of this application do not limit the specific shape of the holes on the movable plate.

[0097] In some embodiments, the light source includes a first light source and a second light source;

[0098] The first light beam includes a remote control signal corresponding to a preset code;

[0099] The second light ray includes a periodic signal modulated by continuous wave or pulse;

[0100] The receiving unit is used to receive the reflected second light.

[0101] The optical module achieves remote control functionality through a first light beam emitted by the light-emitting unit. This first light beam includes a remote control signal corresponding to a preset code. The specific modulation method for the first light beam can be pulse width modulation (PWM) or pulse position modulation (PPM). When the light-emitting unit emits the first light beam, i.e., when it emits the remote control signal corresponding to the preset code, the first light beam (remote control signal) is propagated to the location of the controlled device. The controlled target device is equipped with a corresponding remote control receiver. When the remote control receiver receives the first light beam, it converts it into a corresponding electrical signal and identifies the specific operation command through its internal decoding circuit, thereby controlling the controlled device to perform the corresponding operation. The controlled device can be a home appliance operated via remote control, such as a television, projector, stereo, air conditioner, fan, refrigerator, lamp, switch, etc.

[0102] An optical module emits a second light beam through a light-emitting unit and receives the reflected second light beam through a receiving unit to achieve a light-sensing function. For example, a Time-of-Flight (TOF) function can be implemented using an optical module. In some embodiments, the light-emitting unit emits a second light beam, which comprises a periodic signal modulated to a certain frequency. By measuring the phase difference between the second light beam and the light beam reflected back to the receiving unit from the object under test, the time of flight and the depth of the object can be indirectly calculated. In other embodiments, a light pulse is emitted towards the object under test, and the time of flight and the depth of the object can be directly calculated by measuring the time interval between the reflected and emitted light pulses.

[0103] In some embodiments, the receiving unit of the second chip includes a single-photon avalanche diode (SPAD) or an avalanche photodiode (APD). The SPAD has single-photon detection capability. When a photon is absorbed by the SPAD, a photogenerated carrier is generated. Under reverse bias, the carrier accelerates and gains sufficient energy, subsequently ionizing through collisions with atoms in the crystal lattice, generating more electron-hole pairs. These new electron-hole pairs further induce collisional ionization, forming an avalanche multiplication effect, causing the photocurrent to rapidly increase to a detectable level. The APD also utilizes the avalanche multiplication effect of carriers to amplify the signal, thereby improving detection sensitivity.

[0104] In some embodiments, such as Figure 11 The second chip 103 shown also includes a reference unit 1101 located near the first chip 102.

[0105] The cover plate 104 includes a protrusion structure 1103 located between the reference unit 1101 and the receiving unit 1102.

[0106] The protruding structure extends along the second direction to block the propagation of light between the light-emitting unit and the receiving unit.

[0107] The reference unit 1101 can directly receive the infrared light emitted by the light-emitting unit. The optical module can calibrate the calculated time of flight based on the time it takes for the reference unit 1101 to receive the infrared light, thereby increasing the accuracy of the calculation. In some embodiments, similar to the receiving unit, the reference unit may also include a SPAD or an APD.

[0108] The lower surface of the protruding structure 1103 abuts against the upper surface of the second chip 103, which can block the propagation of infrared light between the light-emitting unit on the first chip and the receiving unit 1102 on the second chip. Of course, it can also block the propagation of infrared light between the reference unit 1101 and the receiving unit 1102 on the second chip.

[0109] It should be noted that in some embodiments, the reference unit may not be provided on the second chip. In this case, the protruding structure on the cover plate can be provided between the first chip and the second chip to block the propagation of light between the light-emitting unit and the receiving unit.

[0110] In some embodiments, such as Figure 12 As shown, the optical module also includes a filter unit 1201;

[0111] The filter unit 1201 is located between the receiving unit 1102 and the second hole 106, and covers the side of the second hole 106 near the substrate.

[0112] The filter unit 1201 is used to filter out light other than the reflected light.

[0113] The light filter unit 1201 only allows target light of the corresponding wavelength (light emitted by the emitting unit) to pass through, while suppressing the passage of other light. For example... Figure 12 As shown, the first filter unit 1201 located below the second aperture 106 can filter out visible light such as ambient light, reduce interference from light other than the target light, and improve measurement accuracy. In some other embodiments, the first filter unit 1201 may also be disposed on the upper surface of the second chip. In some embodiments, reference continues to... Figure 12 Furthermore, a second filter unit 1202 can be disposed below the first hole 105, covering the lower surface of the first hole 105, to filter out light other than the target light, further reducing interference from ambient light. In some other embodiments, the second filter unit 1202 can also be disposed on the upper surface of the first chip. Based on the same inventive concept, embodiments of this application also provide an electronic device, such as... Figure 13 As shown, the electronic device 200 includes a light-transmitting panel 201 and an optical module 100 in any of the above embodiments;

[0114] The light-transmitting panel 201 is located on the side of the optical module 100 away from the substrate, and is used to protect the optical module 100.

[0115] In a direction perpendicular to the substrate surface, the distance D1 between the light-transmitting panel 201 and the optical module 100 is an air gap. An appropriate air gap helps ensure optical performance and avoid unnecessary optical interference. Since the electronic device includes the aforementioned optical module, it also possesses similar beneficial effects to the optical module. Therefore, the beneficial effects of the electronic device will not be repeated here.

[0116] In some embodiments, continue to refer to Figure 13 The electronic device 200 includes foam 202 disposed between the light-transmitting panel 201 and the optical module 100. Foam 202 has good shock absorption and pressure reduction properties, and can protect the optical module together with the transparent panel. On the other hand, the foam ensures that a suitable air gap is maintained between the optical module and the light-transmitting panel.

[0117] The various embodiments / implementations provided in this application can be combined with each other without creating contradictions.

[0118] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An optical module, characterized in that, The optical module integrates light sensing and wireless remote control functions, and the optical module includes: a substrate. A first chip, disposed in a first region on the surface of the substrate, includes a light-emitting unit; the light-emitting unit is used to emit light. The second chip is disposed in a second region on the surface of the substrate and includes a receiving unit; the receiving unit is used to receive reflected light from the light source; wherein the first region and the second region are arranged side by side along a first direction parallel to the surface of the substrate. A cover plate that covers the first chip and the second chip; The cover plate is provided with a first hole and a second hole; the first hole is located at the light-emitting position of the light-emitting unit; the second hole is located at the light-receiving position of the receiving unit. Wherein, the ratio between the length of the first hole in the second direction and its width in the first direction is a first aspect ratio, the ratio between the length of the second hole in the second direction and its width in the first direction is a second aspect ratio, the first aspect ratio is greater than or equal to the second aspect ratio, the first aspect ratio is greater than 1, the second direction is parallel to the surface of the substrate and intersects with the first direction.

2. The optical module according to claim 1, characterized in that, The second aspect ratio is greater than or equal to 1, and the length of the first hole in the second direction is greater than the length of the second hole in the second direction.

3. The optical module according to claim 1, characterized in that, The cross-sectional shape of the first hole on the first plane is elliptical, polygonal, or irregular; wherein the irregular shape is formed by curves and / or straight lines. The cross-sectional shape of the second hole on the first plane is elliptical, circular, or polygonal; The first plane is parallel to the surface of the substrate.

4. The optical module according to claim 1, characterized in that, The cross-sectional shape of the first hole on the second plane is rectangular or trapezoidal; The cross-sectional shape of the second hole on the second plane is rectangular or trapezoidal; The second plane is perpendicular to the surface of the substrate.

5. The optical module according to claim 1, characterized in that, The first hole includes multiple emission holes; Along the second direction, the plurality of emission holes are spaced apart.

6. The optical module according to claim 1, characterized in that, Also includes: A movable plate, connected to the cover plate, is used to slide in a direction parallel to the surface of the cover plate to adjust the light-emitting surface area of ​​the first hole; In the first position, the first hole is not blocked; in the second position, the first hole is partially or completely blocked by the movable plate.

7. The optical module according to any one of claims 1 to 6, characterized in that, The light rays include a first light ray and a second light ray; The first light beam includes a remote control signal corresponding to a preset code; The second light ray includes a periodic signal modulated by continuous wave or pulse; The receiving unit is used to receive the reflected second light.

8. The optical module according to any one of claims 1 to 6, characterized in that, The second chip also includes a reference unit located near the side of the first chip; The cover plate includes a protruding structure located between the reference unit and the receiving unit. The protruding structure extends along the second direction to block the propagation of light between the light-emitting unit and the receiving unit.

9. The optical module according to any one of claims 1 to 6, characterized in that, It also includes a filter unit; The filter unit is located between the receiving unit and the second hole, and covers the side of the second hole near the substrate. The filter unit is used to filter out light other than the reflected light.

10. An electronic device, characterized in that, It includes a light-transmitting panel and an optical module as described in any one of claims 1 to 9; the light-transmitting panel is located on the side of the optical module away from the substrate and is used to protect the optical module.

Citation Information

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