Etching equipment for semiconductor chip production
By designing an etching device with transfer, rotation, and conveying mechanisms, the problems of insufficient etching and health risks in semiconductor chips were solved, achieving efficient mechanized operation and a safe etching process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DINGCHENG (XIAMEN) SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2024-01-31
- Publication Date
- 2026-07-31
AI Technical Summary
In existing etching equipment used in semiconductor chip production, semiconductor chips are prone to falling to the bottom of the etching chamber, resulting in insufficient etching. Furthermore, when removing the chips, they are easily exposed to toxic gases, which can affect the health of workers.
An etching device comprising a transfer mechanism, a rotating etching mechanism, and a conveying mechanism was designed. This device loads, etches, and removes semiconductor chips in a mechanized manner, avoiding manual operation. It utilizes a filter cartridge and inclined blocks to form a box for all-round etching and cleaning, reducing etching solution waste and health risks.
It enables comprehensive etching and cleaning of semiconductor chips, avoiding waste of etching solution and health hazards to workers, saving time and reducing tool damage.
Smart Images
Figure CN119208188B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor chip manufacturing technology, specifically to an etching apparatus for semiconductor chip manufacturing. Background Technology
[0002] Semiconductor chips are semiconductor devices that perform certain functions by etching and wiring on semiconductor wafers. The invention of semiconductor chips was a groundbreaking achievement of the 20th century, pioneering the information age. As one of the most frequently used and important processes in semiconductor chip manufacturing, semiconductor chip etching is particularly important. The cited patent number is CN217903080U, which discloses an etching apparatus for semiconductor chip manufacturing. When existing etching equipment is used in semiconductor chip manufacturing, the semiconductor chips are manually placed into the etching tank for etching. This can easily cause the semiconductor chips to fall to the bottom of the etching tank, preventing them from being fully etched. Furthermore, when retrieving the etched semiconductor chips, workers' fingers can easily come into contact with the etching liquid, which can affect their health. Summary of the Invention
[0003] In view of the shortcomings of the prior art, the present invention provides an etching apparatus for semiconductor chip production to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, the present invention provides the following technical solution: an etching apparatus for semiconductor chip production, comprising an etching chamber, a slide rail fixedly connected to the top of the etching chamber, a chamber cover slidably connected to the top of the slide rail, a partition fixedly connected inside the etching chamber, a through pipe fixedly connected to the top of the partition, a transfer mechanism at the bottom of the through pipe, a conveying mechanism on the side of the transfer mechanism, and a rotating etching mechanism at the top of the conveying mechanism; the rotating etching mechanism includes a motor, a rotating shaft fixedly connected to the output end of the motor, a connecting rod fixedly connected to the outer side of the rotating shaft, a filter cartridge fixedly connected to the end of the connecting rod away from the rotating shaft, a feed pipe at the top of the filter cartridge, an annular slide rail slidably connected to the outer side of the filter cartridge, a bracket fixedly connected to the bottom of the annular slide rail, and the filter cartridge... A second connecting rod is fixedly connected internally, and a spring is fixedly connected to the top of the second connecting rod. A rotating door is fixedly connected to the end of the spring away from the second connecting rod. A third rotating shaft is rotatably connected inside the rotating door. A stop is fixedly connected to the outside of the filter cartridge. There are two connecting rods. The semiconductor is poured into the filter cartridge through the feed pipe. Because the rotating door and spring are set on the outside of the filter cartridge, the semiconductor can compress the spring when it is poured, thereby opening the rotating door. When all the semiconductor has entered the filter cartridge, the second motor is started. The second motor drives the filter cartridge to rotate. Because the stop is set on the outer wall of the filter cartridge, the rotating door cannot be opened to the outside. In this way, the semiconductor will not flow out of the filter cartridge when it rotates. As the semiconductor rotates in the filter cartridge, the etching solution can etch the semiconductor in all directions, and there will be no situation where one side or one part comes into contact with the inner wall of the etching tank and cannot be etched.
[0005] Preferably, the transfer mechanism includes a motor, the output end of which is fixedly connected to a rotating shaft. A lifting rod is fixedly connected to the end of the rotating shaft away from the motor. A lever is fixedly connected to the side of the lifting rod closest to the motor. A mounting block is provided at the end of the lifting rod away from the rotating shaft. A frustum is provided on the side of the mounting block closest to the motor. A mounting plate is fixedly connected to the side of the frustum closest to the motor. A slide rail is fixedly connected to the side of the mounting plate. A stop bar is fixedly connected to the side of the frustum away from the motor. The mounting plate rotates on the side closest to the motor. The mounting block is connected by a locking mechanism. A ramp is fixedly connected to the top of the mounting block, and a filter plate is fixedly connected to the side of the ramp. Two filter plates are provided. The ramp and filter plates can form a housing, thereby loading the semiconductor. Simultaneously, a through-tube extends from the bottom of the ramp, allowing the semiconductor to slide down onto the partition. Since water is injected above the partition, the semiconductor is cleaned as it falls into the water through the ramp. During its ascent, the filter plate allows the etching solution inside the housing to flow out, preventing it from flowing into the partition along with the semiconductor, thus reducing waste and preventing... Etching solution adhering to the semiconductor can damage human health. A fixing block is fixedly connected to the mounting block near the motor, and a fixing block is fixedly connected to the mounting block away from the motor. A fixing block is fixedly connected to the bottom of the mounting block. When the etched semiconductor chip is transported into the box containing the inclined plate, filter plate, and mounting plate, the motor is started. The motor drives the lifting rod and lever to rotate. When the lifting rod rotates to the vicinity of the mounting block, it drags the mounting block upwards, thereby transporting the semiconductor upwards within the box composed of the filter plate and inclined block. When the bottom of the inclined block... When the flow path exceeds the limit, the clamp on the mounting plate will lock the second fixing block in position, thus stopping the inclined block and filter plate in that position. The motor continues to rotate. When the lever rotates to contact the clamp, it will move the clamp away from the second fixing block, causing the inclined block and filter plate to fall to the bottom. In this way, the semiconductor can be removed from the etching solution mechanically, avoiding the release of toxic gases when workers open the etching box themselves, thus preventing damage to the workers' health. Furthermore, it eliminates the need to use tools to remove the semiconductors one by one, saving time and preventing damage to tools.
[0006] Preferably, the conveying mechanism includes a connecting rod three, with a feeding pipe fixedly connected to the bottom end of the connecting rod three. A baffle is provided at the top of the feeding pipe, and a connecting rod four is fixedly connected to the side of the baffle. A rotating rod is fixedly connected to the end of the connecting rod four away from the baffle, and a connecting rod five is fixedly connected to the end of the rotating rod away from the connecting rod four. A gripping rod is fixedly connected to the end of the connecting rod five away from the rotating rod. There are two connecting rods three. After the semiconductor etching is completed, the gripping rod is rotated, and the gripping rod drives the baffle to rotate. Since there is a notch at the bottom of the filter cartridge, after the baffle is removed, the semiconductor falls into the feeding pipe through the notch. The feeding pipe is inclined, so the semiconductor will slide down with the feeding pipe into the subsequent mechanism.
[0007] This invention provides an etching apparatus for semiconductor chip production. It has the following advantages: 1. This etching apparatus for semiconductor chip production, through the setting of a transfer mechanism, when the etched semiconductor chip is transported into the box containing the inclined plate, filter plate, and mounting plate, motor one is started. Motor one drives the lifting rod and the lever to rotate. When the lifting rod rotates to the vicinity of the mounting block, it drags the mounting block upward, thereby transporting the semiconductor in the box composed of the filter plate and the inclined block upward. When the bottom of the inclined block exceeds the through pipe, the clamp on the mounting plate will lock the fixing block two in that position, thus stopping the inclined block and the filter plate in that position. Motor one continues to rotate. When the lever rotates to contact the clamp, it moves the clamp to release the clamp from the fixing block two, thereby causing the inclined block and the filter plate to fall to the bottom. In this way, the semiconductor can be removed from the etching solution mechanically, avoiding the release of toxic gases when workers open the etching box themselves, and preventing damage to the health of workers. Furthermore, it eliminates the need to use tools to clamp out the semiconductor one by one, saving time and avoiding damage to tools.
[0008] 2. This etching apparatus for semiconductor chip production, through the setting of filter plates and inclined blocks, can form a box to load semiconductors. At the same time, after the bottom of the inclined block extends the through tube, it can drive the semiconductor down to the partition. Since water is injected above the partition, the semiconductor can be cleaned by falling into the water through the inclined block. During the process of the filter plate rising, it can drain the etching solution in the box, preventing the etching solution from flowing into the partition with the semiconductor, reducing the waste of etching solution, and also preventing the etching solution from adhering to the semiconductor and causing damage to human health.
[0009] 3. This etching apparatus for semiconductor chip production, by rotating the etching mechanism, pours semiconductors into the filter cartridge through the feed pipe. Because the filter cartridge has a rotating door and spring on the outside, the semiconductors compress the springs as they fall, opening the rotating door. Once all the semiconductors are inside the filter cartridge, motor two is started, driving the filter cartridge to rotate. Because there are baffles on the outer wall of the filter cartridge, the rotating door cannot open outwards, preventing the semiconductors from flowing out of the filter cartridge during rotation. As the filter cartridge rotates, the etching solution can etch the semiconductors from all sides, preventing any one side or area from contacting the inner wall of the etching chamber and failing to etch.
[0010] 4. This etching device for semiconductor chip production, through the setting of the conveying mechanism, after the semiconductor etching is completed, rotate the handle, the handle drives the baffle to rotate. Since there is a notch at the bottom of the filter cartridge, after the baffle is moved away, the semiconductor falls into the feeding tube through the notch. The feeding tube is inclined, so the semiconductor will slide down with the feeding tube into the subsequent mechanism. Attached Figure Description
[0011] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall internal structure of the present invention; Figure 3 This is a schematic diagram of the transfer mechanism structure of the present invention; Figure 4 This is a schematic diagram of the rear structure of the transfer mechanism of the present invention; Figure 5 This is a schematic diagram of the rotating etching mechanism of the present invention; Figure 6 This is a schematic diagram of the internal structure of the rotating etching mechanism of the present invention; Figure 7 For the present invention Figure 6 Enlarged view of A in the middle; Figure 8 This is a schematic diagram of the conveying mechanism of the present invention.
[0012] In the diagram: 1. Etching tank; 2. Slide rail one; 3. Tank cover; 4. Partition plate; 5. Through pipe; 6. Transfer mechanism; 601. Slide rail two; 602. Mounting plate; 603. Frustum; 604. Motor one; 605. Rotating shaft one; 606. Lifting rod; 607. Toggle rod; 608. Clamp; 609. Fixing block one; 610. Fixing block two; 611. Mounting block; 612. Fixing block three; 613. Stop bar; 614. Filter plate; 615. Inclined plate; 7. Rotating etching machine 701. Motor II; 702. Rotating Shaft II; 703. Filter Cartridge; 704. Circular Slide Rail; 705. Support; 706. Feed Pipe; 707. Rotating Door; 708. Rotating Shaft III; 709. Stop Block; 710. Spring; 711. Connecting Rod II; 712. Connecting Rod I; 8. Conveying Mechanism; 801. Connecting Rod III; 802. Feeding Pipe; 803. Baffle; 804. Connecting Rod IV; 805. Rotating Rod; 806. Connecting Rod V; 807. Handle Rod. Detailed Implementation
[0013] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0014] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.
[0015] Please see Figure 1-8This invention provides a technical solution: an etching apparatus for semiconductor chip production, comprising an etching chamber 1, a slide rail 2 fixedly connected to the top of the etching chamber 1, a chamber cover 3 slidably connected to the top of the slide rail 2, a partition 4 fixedly connected inside the etching chamber 1, a through pipe 5 fixedly connected to the top of the partition 4, a transfer mechanism 6 at the bottom of the through pipe 5, a conveying mechanism 8 on the side of the transfer mechanism 6, and a rotating etching mechanism 7 at the top of the conveying mechanism 8; the rotating etching mechanism 7 includes a second motor 701. The output end is fixedly connected to a second rotating shaft 702. A first connecting rod 712 is fixedly connected to the outer side of the second rotating shaft 702. A filter cylinder 703 is fixedly connected to the end of the first connecting rod 712 away from the second rotating shaft 702. A feed pipe 706 is provided at the top of the filter cylinder 703. An annular slide rail 704 is slidably connected to the outer side of the filter cylinder 703. A bracket 705 is fixedly connected to the bottom of the annular slide rail 704. A second connecting rod 711 is fixedly connected inside the filter cylinder 703. A spring 710 is fixedly connected to the top of the second connecting rod 711. A rotating door 707 is fixedly connected to one end of the connecting rod 711 away from the other end. A rotating shaft 708 is rotatably connected inside the rotating door 707. A stop 709 is fixedly connected to the outside of the filter cartridge 703. Two connecting rods 711 are provided. Semiconductors are poured into the filter cartridge 703 through the feed pipe 706. Because the rotating door 707 and spring 710 are located on the outside of the filter cartridge 703, the spring 710 can be compressed when the semiconductors are poured, thus opening the rotating door 707. When all the semiconductors have entered the filter cartridge 703, the second motor is started. 701, Motor 2 701 drives Shaft 2 702 to rotate. Shaft 2 702 drives Filter 703 to rotate via Connecting Rod 1 712. Since there is a stop 709 on the outer wall of Filter 703, Rotating Door 707 cannot be opened to the outside. This way, the semiconductor will not flow out of Filter 703 when it rotates. As Filter 703 rotates, the etching solution can etch the semiconductor in all directions, and there will be no situation where one side or one place comes into contact with the inner wall of Etching Box 1 and cannot be etched.
[0016] The transfer mechanism 6 includes a motor 604, with a rotating shaft 605 fixedly connected to the output end of the motor 604. A lifting rod 606 is fixedly connected to the end of the rotating shaft 605 away from the motor 604. A lever 607 is fixedly connected to the side of the lifting rod 606 near the motor 604. A mounting block 611 is provided at the end of the lifting rod 606 away from the rotating shaft 605. A frustum 603 is provided on the side of the mounting block 611 near the motor 604. A mounting plate 602 is fixedly connected to the side of the frustum 603 near the motor 604. A slide rail 601 is fixedly connected to the side of the mounting plate 602. A stop bar 613 is fixedly connected to the side of the frustum 603 away from the motor 604. The side of the mounting plate 602 near the motor 604 is rotatably connected to... The mounting block 611 has a card 608 and a mounting plate 615 fixedly connected to its top. A filter plate 614 is fixedly connected to the side of the mounting plate 615. Two filter plates 614 are provided. The mounting block and filter plates 614 can form a housing, thereby loading the semiconductor. Simultaneously, the bottom of the mounting block extends through a tube 5, which can drive the semiconductor down onto the partition 4. Since water is injected above the partition 4, the semiconductor can be cleaned by falling into the water through the mounting block. During its ascent, the filter plate 614 can drain the etching solution from the housing, preventing it from flowing into the partition 4 along with the semiconductor, reducing waste, and also preventing the etching solution from adhering to the semiconductor and causing harm to human health. The mounting block 611 is located near the motor 604. A fixing block 609 is fixedly connected to the side of the mounting block 611. A fixing block 612 is fixedly connected to the side of the mounting block 611 away from the motor 604. A fixing block 610 is fixedly connected to the bottom of the mounting block 611. When the etched semiconductor chip is transported into the box containing the inclined plate 615, filter plate 614, and mounting plate 602, the motor 604 is started. The motor 604 drives the rotating shaft 605 to rotate, which in turn drives the lifting rod 606 and the lever 607 to rotate. When the lifting rod 606 rotates to the vicinity of the mounting block 611, it drags the mounting block 611 upward through the fixing block 609, thereby transporting the semiconductor in the box consisting of the filter plate 614 and the inclined block upward. When the bottom of the inclined block exceeds the through pipe 5, the mounting plate 602... The locking device 608 will lock the second fixing block 610 in this position, thereby stopping the inclined block and filter plate 614 in this position. The motor 604 continues to rotate. When the lever 607 rotates to contact the locking device 608, it will push the locking device 608 to move away from the second fixing block 610, thereby causing the inclined block and filter plate 614 to fall to the bottom. The third fixing block 612 will lock onto the stop bar 613, thereby stopping the mounting block 611 in this position. In this way, the semiconductor can be removed from the etching solution mechanically, avoiding the release of toxic gases when the workers open the etching box 1 themselves, which will not harm the health of the workers. Furthermore, it does not require the use of tools to clamp out the semiconductors one by one, saving time and avoiding damage to the tools.
[0017] The conveying mechanism 8 includes a connecting rod 3 801. The bottom end of the connecting rod 3 801 is fixedly connected to a feeding pipe 802. The top of the feeding pipe 802 is provided with a baffle 803. The side of the baffle 803 is fixedly connected to a connecting rod 4 804. The end of the connecting rod 4 804 away from the baffle 803 is fixedly connected to a rotating rod 805. The end of the rotating rod 805 away from the connecting rod 4 804 is fixedly connected to a connecting rod 5 806. The end of the connecting rod 5 806 away from the rotating rod 805 is fixedly connected to a gripping rod 807. There are two connecting rods 3 801. After the semiconductor etching is completed, the gripping rod 807 is rotated. The gripping rod 807 drives the baffle 803 to rotate. Since there is a notch at the bottom of the filter cartridge 703, after the baffle 803 is removed, the semiconductor falls into the feeding pipe 802 through the notch. The feeding pipe 802 is inclined, so the semiconductor will slide down with the feeding pipe 802 into the subsequent mechanism.
[0018] In use, the semiconductor is poured into the filter cartridge 703 through the feed pipe 706. Because the filter cartridge 703 has a rotating door 707 and a spring 710 on its outer side, the semiconductor compresses the spring 710 as it falls, opening the rotating door 707. Once all the semiconductor is inside the filter cartridge 703, the second motor 701 is started. The second motor 701 drives the second rotating shaft 702 to rotate, which in turn drives the filter cartridge 703 to rotate via the connecting rod 712. Because a stop 709 is provided on the outer wall of the filter cartridge 703, the rotating door 707 cannot open outwards. This prevents the semiconductor from flowing out of the filter cartridge 703 as it rotates. As the filter cartridge 703 rotates, the etching solution can thoroughly immerse the semiconductor within it. During etching, there will be no situation where one side or one part comes into contact with the inner wall of the etching tank 1, resulting in etch failure. After the semiconductor etching is completed, rotate the handle 807. The handle 807 drives the baffle 803 to rotate. Since there is a notch at the bottom of the filter cartridge 703, after the baffle 803 is removed, the semiconductor falls into the feed tube 802 through the notch. The feed tube 802 is inclined, so the semiconductor will slide down with the feed tube 802 into the subsequent mechanism. When the etched semiconductor chip is transported into the box of inclined plate 615, filter plate 614 and mounting plate 602, start motor 604. Motor 604 drives the rotating shaft 605 to rotate. The rotating shaft 605 drives the lifting rod 606 and the lever 607 to rotate. When the lifting rod 606 rotates to the mounting block 611, The mounting block 611 is then dragged upwards by the fixing block 609, thereby transporting the semiconductor inside the box consisting of the filter plate 614 and the inclined block upwards. When the bottom of the inclined block exceeds the through pipe 5, the locking piece 608 on the mounting plate 602 will lock the fixing block 610 in that position, thus stopping the inclined block and the filter plate 614 at that position. The motor 604 continues to rotate. When the lever 607 rotates to contact the locking piece 608, it moves the locking piece 608 away from the fixing block 610, causing the inclined block and the filter plate 614 to fall to the bottom. The fixing block 612 will then lock onto the stop bar 613, thus stopping the mounting block 611 at that position. In this way, the semiconductor can be mechanically removed from the etching solution, avoiding the need for manual removal. When the etching chamber 1 is opened, the toxic gas is discharged, which will not harm the health of the workers. Furthermore, it eliminates the need to use tools to remove the semiconductors one by one, saving time and avoiding damage to the tools. Since the inclined block and filter plate 614 can form a box, the semiconductors can be loaded. At the same time, the passage tube 5 extending from the bottom of the inclined block can drive the semiconductors down to the partition plate 4. Since water is injected above the partition plate 4, the semiconductors can be cleaned by falling into the water through the inclined block. During the upward process, the filter plate 614 can drain the etching liquid inside the box, preventing the etching liquid from flowing into the partition plate 4 along with the semiconductors, reducing the waste of etching liquid and also preventing the etching liquid from adhering to the semiconductors and causing harm to human health.
[0019] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. An etching device for semiconductor chip production, comprising an etching tank (1), characterized in that: The top of the etching tank (1) is fixedly connected to a slide rail (2), and the top of the slide rail (2) is slidably connected to a tank cover (3). The interior of the etching tank (1) is fixedly connected to a partition (4), and the top of the partition (4) is fixedly connected to a through pipe (5). The bottom of the through pipe (5) is provided with a transfer mechanism (6), the side of the transfer mechanism (6) is provided with a conveying mechanism (8), and the top of the conveying mechanism (8) is provided with a rotating etching mechanism (7). The rotating etching mechanism (7) includes a second motor (701), the output end of which is fixedly connected to a second rotating shaft (702), a first connecting rod (712) fixedly connected to the outer side of the second rotating shaft (702), a filter cylinder (703) fixedly connected to the end of the first connecting rod (712) away from the second rotating shaft (702), a feed pipe (706) provided at the top of the filter cylinder (703), an annular slide rail (704) slidably connected to the outer side of the filter cylinder (703), and a bracket (705) fixedly connected to the bottom of the annular slide rail (704). The filter cartridge (703) is fixedly connected to a connecting rod two (711), and a spring (710) is fixedly connected to the top of the connecting rod two (711). A rotating door (707) is fixedly connected to the end of the spring (710) away from the connecting rod two (711). A rotating shaft three (708) is rotatably connected inside the rotating door (707). A stop block (709) is fixedly connected to the outside of the filter cartridge (703). The transfer mechanism (6) includes a motor (604), the output end of which is fixedly connected to a rotating shaft (605). A lifting rod (606) is fixedly connected to the end of the rotating shaft (605) away from the motor (604). A lever (607) is fixedly connected to the side of the lifting rod (606) closest to the motor (604). A mounting block (611) is provided at the end of the lifting rod (606) away from the rotating shaft (605). 11) A frustum (603) is provided on the side near the motor (604). A mounting plate (602) is fixedly connected to the side of the frustum (603) near the motor (604). A slide rail (601) is fixedly connected to the side of the mounting plate (602). A stop bar (613) is fixedly connected to the side of the frustum (603) away from the motor (604). A clamp (608) is rotatably connected to the side of the mounting plate (602) near the motor (604). The mounting block (611) is fixedly connected to a fixing block one (609) on the side of the mounting block (611) close to the motor one (604), and a fixing block three (612) is fixedly connected to the side of the mounting block (611) away from the motor one (604). The bottom of the mounting block (611) is fixedly connected to a fixing block two (610). The conveying mechanism (8) includes a connecting rod three (801), a feeding pipe (802) is fixedly connected to the bottom end of the connecting rod three (801), a baffle (803) is provided on the top of the feeding pipe (802), a connecting rod four (804) is fixedly connected to the side of the baffle (803), a rotating rod (805) is fixedly connected to the end of the connecting rod four (804) away from the baffle (803), a connecting rod five (806) is fixedly connected to the end of the rotating rod (805) away from the connecting rod four (804), and a handle (807) is fixedly connected to the end of the connecting rod five (806) away from the rotating rod (805).