Electronic device

CN119208968BActive Publication Date: 2026-10-30HONOR DEVICE CO LTD
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Patent Information

Application Number
CN202310756770.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-25
Publication Date
2026-10-30
Estimated Expiration
2043-06-25

AI Technical Summary

Technical Problem

然而,边框上设置天线缝隙形成的天线辐射体存在天线性能相对偏差的情况

Benefits of technology

[0046]第一辐射体和第二辐射体通过利用金属中板与主板的接地端实现接地的方式,可以不需要在第一辐射体和主板以及第二辐射体和主板之间额外设置接地结构件,有利于减少零部件使用数量。

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the present application provides an electronic device. The electronic device comprises a middle frame, a display screen, a back cover and a reinforcing body. The middle frame comprises at least one frame. The frame comprises a first radiator and a second radiator. The adjacent ends of the first radiator and the second radiator are arranged at intervals to form an antenna slot. The first radiator comprises a first conductive leg, and the second radiator comprises a second conductive leg. Along the thickness direction of the middle frame, the display screen and the back cover are arranged on the opposite sides of the middle frame. The reinforcing body is located between the display screen and the back cover. The first conductive leg and the second conductive leg are both arranged at intervals from the reinforcing body, and the reinforcing body is arranged opposite to the antenna slot. Along the thickness direction of the middle frame, at least one of the first conductive leg and the second conductive leg is located on the side of the reinforcing body away from the display screen.
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Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to an electronic device. Background Technology

[0002] With the explosive growth of electronic devices such as smartphones and tablets, their functions are becoming increasingly diverse. Various electronic components are integrated within the casing of these devices, such as central processing units (CPUs), intelligent algorithm chips, power management ICs (PMICs), and antennas. Antennas are devices used by electronic devices to receive or transmit electromagnetic wave signals. With the continuous development and iteration of mobile communication technology, the communication requirements of electronic devices are also becoming increasingly demanding. In related technologies, the structural design of electronic devices is becoming increasingly compact and thinner. However, the frequency bands and types that antennas in electronic devices need to cover are also increasing. Electronic devices include a mid-frame. The mid-frame includes at least one border. Setting antenna slots on the border to form multiple antenna radiators can help meet the design requirements of the antenna radiators. However, antenna radiators formed by setting antenna slots on the border may exhibit relative deviations in antenna performance. Summary of the Invention

[0003] This application provides an electronic device that enhances the structural strength of the antenna slots in the frame while ensuring that the radiator has relatively good antenna performance.

[0004] The first aspect of this application provides an electronic device, which includes a mid-frame, a display screen, a back cover, and a reinforcement.

[0005] The mid-frame includes at least one border. The border includes a first radiator and a second radiator. Adjacent ends of the first and second radiators are spaced apart to form an antenna slot. The first radiator includes a first conductive foot, and the second radiator includes a second conductive foot. Along the thickness direction of the mid-frame, the display screen and the back cover are disposed on opposite sides of the mid-frame. A reinforcement is located between the display screen and the back cover. Both the first and second conductive feet are spaced apart from the reinforcement, and the reinforcement is disposed opposite to the antenna slot. Along the thickness direction of the mid-frame, at least one of the first and second conductive feet is located on the side of the reinforcement facing away from the display screen.

[0006] In the electronic device of this application embodiment, a reinforcing body is provided at the antenna gap in the frame to enhance the structural strength of the antenna gap in the frame, reducing the possibility of deviation in the frame's load-bearing capacity and easy deformation due to a decrease in the frame's structural strength. Furthermore, at least one of the first conductive foot and the second conductive foot is located on the side of the reinforcing body facing away from the display screen. The relatively large distance between the first and second conductive feet and the display screen is beneficial for increasing the clearance of the first and second conductive feet in a confined space, thereby improving the antenna performance of the first and second radiators. Therefore, in the confined space inside the electronic device, a reinforcing body, a first conductive foot, and a second conductive foot can be simultaneously provided to enhance the structural strength of the antenna gap in the frame while reducing the possibility of relative deviation in the antenna performance of the first or second radiator due to insufficient clearance of the first or second conductive foot, ensuring that at least one of the first and second radiators has relatively good antenna performance.

[0007] In one possible implementation, along the thickness direction of the mid-frame, both the first conductive foot and the second conductive foot are located on the side of the reinforcement facing away from the display screen.

[0008] The relatively large distances between the first and second conductive feet and the display screen are beneficial for maximizing the clearance between them within a confined space, thereby improving the antenna performance of both the first and second radiators. Therefore, within the limited space inside an electronic device, a reinforcing element, the first conductive feet, and the second conductive feet can be simultaneously incorporated. This enhances the structural strength at the antenna slot in the frame while reducing the possibility of relative performance deviations between the first and second radiators due to insufficient clearance between them, ensuring relatively good antenna performance for both.

[0009] In one possible implementation, along the thickness direction of the middle frame, the orthographic projection of at least one of the first conductive foot and the second conductive foot overlaps with the orthographic projection of the reinforcement.

[0010] The reinforcement can make full use of the space on the side of the display screen where at least one of the first conductive foot and the second conductive foot faces, so that the structural design of the reinforcement, the first conductive foot and the second conductive foot is compact, which helps to reduce the space occupancy rate of the reinforcement, the first conductive foot and the second conductive foot.

[0011] In one possible implementation, the orthographic projections of the first conductive foot and the second conductive foot both overlap with the orthographic projection of the reinforcement.

[0012] The reinforcement can make full use of the space on the side of the first and second conductive feet facing the display screen, so that the structural design of the reinforcement, the first conductive foot and the second conductive foot is compact, and the space occupancy rate of the reinforcement, the first conductive foot and the second conductive foot is reduced.

[0013] In one possible implementation, at least one of the first conductive pin and the second conductive pin is provided with a contoured surface facing the back cover. The contoured surface has the same shape as the inner wall of the back cover. A gap exists between the contoured surface and the inner wall.

[0014] There is a gap between the contoured surface and the inner wall to avoid positional interference between the first or second conductive foot and the back cover. It also prevents the back cover from collapsing due to external pressure, which could cause compression of the first or second conductive foot.

[0015] In one possible implementation, the electronic device further includes an insulating filler. The insulating filler connects the reinforcement to the frame. The display screen includes a flexible connecting circuit board with a bend. The flexible connecting circuit board is located on the side of the reinforcement away from the back cover. A clearance groove is provided on the surface of the insulating filler facing the flexible connecting circuit board. The clearance groove is used to avoid the bend, preventing damage to the bend due to compression by the insulating filler.

[0016] The insulating filler can connect the frame and the reinforcement into a whole, so that the frame, reinforcement and insulating filler can form a combination, which can help to further improve the structural strength of the antenna slot in the frame and improve the impact resistance of the frame.

[0017] In one possible implementation, the reinforcement is embedded in the insulating filler. The bottom wall of the reinforcement forms a relief groove on at least a portion of the surface of the flexible connection circuit board. The reinforcement can avoid bends, while being relatively far from bends to prevent damage to the bends due to compression by the reinforcement.

[0018] In one possible implementation, the distance between the reinforcement and the first conductive leg is 0.5 mm or more.

[0019] A relatively large distance can be maintained between the reinforcement and the first conductive pin, which can help reduce the possibility that the reinforcement will have an adverse effect on the electromagnetic wave signals received or emitted by the first conductive pin.

[0020] In one possible implementation, the distance between the reinforcement and the second conductive pin is 0.5 mm or more. Maintaining a relatively large distance between the reinforcement and the second conductive pin can help reduce the adverse effects of the reinforcement on the electromagnetic wave signals received or transmitted by the second conductive pin.

[0021] In one possible implementation, the electronic device further includes a conductive connector. One of the first conductive pin and the second conductive pin is electrically connected to the reinforcement via the conductive connector.

[0022] The way the reinforcing body is electrically connected to the first conductive foot or the second conductive foot has two advantages. First, the reinforcing body helps to enhance the gap coupling strength between the first radiator and the second radiator, thereby increasing the coupling electric field strength between them and improving antenna performance. Second, the connection between the reinforcing body and the first conductive foot or the second conductive foot helps to improve the connection strength and stability between the reinforcing body and the first radiator or the reinforcing body and the second radiator, thereby improving the structural strength of the composite formed by the reinforcing body, the insulating filler, and the frame.

[0023] In one possible implementation, the reinforcing body, the conductive connector, and one of the first conductive foot and the second conductive foot are integrally formed, which helps to increase the structural strength of the reinforcing body, the conductive connector, and one of the first conductive foot and the second conductive foot, and further helps to improve the structural strength of the combination formed by the reinforcing body, the insulating filler, and the frame.

[0024] In one possible implementation, the conductive connector is a weld block. Welding one of the first and second conductive legs to the reinforcing body helps reduce processing difficulty and cost.

[0025] In one possible implementation, along the thickness direction of the middle frame, one of the first conductive foot and the second conductive foot is located on the side of the reinforcement facing away from the display screen, and the other is located on the side of the reinforcement facing the display screen.

[0026] The distance between the first or second conductive foot located on the side of the reinforcement facing away from the display screen is relatively large, which is beneficial to increase the clearance of the first or second conductive foot in a narrow space, thereby improving the antenna performance of the first or second radiator.

[0027] In one possible implementation, the reinforcement is spaced apart from the middle frame.

[0028] The reinforcement body can maintain a relatively large distance from the first radiator and from the second radiator, thereby reducing the possibility that the reinforcement body will have an adverse effect on the electromagnetic wave signals received or emitted by the first and second radiators.

[0029] In one possible implementation, the first radiator and the second radiator are spaced apart along the length of the frame.

[0030] A second aspect of this application provides an electronic device including a mid-frame, a display screen, a back cover, a reinforcing body, and a conductive connector.

[0031] The mid-frame includes at least one border. The border includes a first radiator and a second radiator. Adjacent ends of the first and second radiators are spaced apart to form an antenna slot. The first radiator includes a first conductive foot, and the second radiator includes a second conductive foot. Along the thickness direction of the mid-frame, the display screen and the back cover are disposed on opposite sides of the mid-frame. A reinforcing member is located between the display screen and the back cover. Both the first and second conductive feet are spaced apart from the reinforcing member, and the reinforcing member is positioned opposite the antenna slot. One of the first and second conductive feet is electrically connected to the reinforcing member via a conductive connector.

[0032] The way the reinforcing body is electrically connected to the first conductive foot or the second conductive foot has two advantages. First, the reinforcing body helps to enhance the gap coupling strength between the first radiator and the second radiator, thereby increasing the coupling electric field strength between them and improving antenna performance. Second, the connection between the reinforcing body and the first conductive foot or the second conductive foot helps to improve the connection strength and stability between the reinforcing body and the first radiator or the reinforcing body and the second radiator, thereby improving the structural strength of the composite formed by the reinforcing body, the insulating filler, and the frame.

[0033] In one possible implementation, along the thickness direction of the mid-frame, both the first conductive foot and the second conductive foot are located on the side of the reinforcement facing the display screen.

[0034] In one possible implementation, the reinforcing body, the conductive connector, and one of the first conductive foot and the second conductive foot are integrally formed, which helps to increase the structural strength of the reinforcing body, the conductive connector, and one of the first conductive foot and the second conductive foot, and further helps to improve the structural strength of the combination formed by the reinforcing body, the insulating filler, and the middle frame.

[0035] In one possible implementation, the conductive connector is a weld block. Welding one of the first and second conductive legs to the reinforcing body helps reduce processing difficulty and cost.

[0036] In one possible implementation, along the thickness direction of the middle frame, the orthographic projection of at least one of the first conductive foot and the second conductive foot overlaps with the orthographic projection of the reinforcement.

[0037] The reinforcement can make full use of the space on at least one side of the first conductive foot and the second conductive foot, so that the structural design of the reinforcement, the first conductive foot and the second conductive foot is compact, which helps to reduce the space occupancy rate of the reinforcement, the first conductive foot and the second conductive foot.

[0038] In one possible implementation, the orthographic projection of the reinforcing body along the thickness direction of the middle frame is a rectangle, making the shape of the reinforcing body relatively regular, which helps to reduce the processing difficulty.

[0039] In one possible implementation, the electronic device further includes an insulating filler. The insulating filler connects the reinforcement to the frame. The reinforcement includes a first groove. The opening of the first groove faces the antenna slot, so that the middle portion of the reinforcement is relatively far from the frame. A relatively large amount of insulating filler can be accommodated between the reinforcement and the frame, which helps to improve the connection strength between the reinforcement, the frame, and the insulating filler, thereby improving the structural strength of the assembly formed by the reinforcement, the insulating filler, and the frame. Alternatively, the opening of the first groove faces away from the antenna slot, so that the middle portion of the reinforcement is relatively far from the motherboard. The middle portion of the reinforcement is less likely to cause positional interference with the motherboard, avoiding a reduction in the size of the motherboard due to the need to avoid the middle portion of the reinforcement. The insulating filler covers the first groove. The insulating filler has a first protrusion that matches the shape of the first groove, which helps to increase the connection strength between the insulating filler and the reinforcement, improve the bonding force between the insulating filler and the reinforcement, and further improve the structural strength of the assembly formed by the reinforcement, the insulating filler, and the frame.

[0040] In one possible implementation, the electronic device further includes an insulating filler. The insulating filler connects the reinforcement and the frame. The reinforcement includes a first groove. The opening of the first groove faces the antenna slot. A second groove is formed on the bottom wall of the first groove. The insulating filler covers the first and second grooves. The insulating filler has a first protrusion that matches the shape of the first groove and a second protrusion that matches the shape of the second groove, thereby further increasing the connection strength between the insulating filler and the reinforcement, improving the bonding force between the insulating filler and the reinforcement, and further improving the structural strength of the assembly formed by the reinforcement, the insulating filler, and the frame.

[0041] In one possible implementation, the electronic device further includes an insulating filler. The insulating filler connects the reinforcing body and the frame. A third groove is provided on the inner wall of at least one of the first radiator and the second radiator. The insulating filler covers the third groove and has a third protrusion that matches the shape of the third groove. This facilitates further increasing the connection strength between the insulating filler and the reinforcing body, improving the bonding force between the insulating filler and the reinforcing body, and further enhancing the structural strength of the assembly formed by the reinforcing body, the insulating filler, and the frame.

[0042] In one possible implementation, the reinforcement is arc-shaped. The arc-shaped reinforcement has a smooth and gentle surface transition, a regular shape, is easy to process and manufacture, and has good stress balance when bearing stress.

[0043] In one possible implementation, the reinforcing body includes a first reinforcing segment and a second reinforcing segment that are arranged intersectingly.

[0044] The first and second reinforcing segments are embedded in the insulating filler at different angles, which helps to increase the connection strength between the insulating filler and the reinforcing body and improve the bonding force between the insulating filler and the reinforcing body.

[0045] In one possible implementation, the electronic device further includes a metal mid-plate and a main board. The metal mid-plate and the main board are located between the display screen and the back cover along the thickness direction of the mid-frame. Both a first radiator and a second radiator are electrically connected to the metal mid-plate. The main board is disposed on the metal mid-plate. The main board includes a ground terminal. The metal mid-plate is electrically connected to the ground terminal.

[0046] The first and second radiators are grounded by using the grounding terminals of the metal middle plate and the motherboard. This eliminates the need for additional grounding structures between the first radiator and the motherboard, as well as between the second radiator and the motherboard, which helps reduce the number of components used. Attached Figure Description

[0047] Figure 1 This is a structural schematic diagram of the unfolded state of the electronic device provided in an embodiment of this application;

[0048] Figure 2 This is a schematic diagram of the structure of an electronic device in a semi-folded state provided in an embodiment of this application;

[0049] Figure 3 This is a schematic diagram of the structure of an electronic device in a folded state, as provided in an embodiment of this application.

[0050] Figure 4 A partially exploded view of an electronic device provided in an embodiment of this application;

[0051] Figure 5 This is a partial exploded view of an electronic device based on related technologies.

[0052] Figure 6 This is a partial cross-sectional structural diagram of an electronic device related to the technology.

[0053] Figure 7 A partially exploded view of an electronic device provided in an embodiment of this application;

[0054] Figure 8A partial cross-sectional view of an electronic device provided in an embodiment of this application;

[0055] Figure 9 This is a simulation diagram comparing the radiation efficiency of antennas in related technologies with that of the antenna embodiments in this application.

[0056] Figure 10 A partial structural schematic diagram of an electronic device provided in an embodiment of this application;

[0057] Figure 11 A partial structural schematic diagram of an electronic device provided in another embodiment of this application;

[0058] Figure 12 A partial structural schematic diagram of an electronic device provided in yet another embodiment of this application;

[0059] Figure 13 A partial cross-sectional view of an electronic device provided in an embodiment of this application;

[0060] Figure 14 A partial structural schematic diagram of an electronic device provided in yet another embodiment of this application;

[0061] Figure 15 A partial structural schematic diagram of an electronic device provided in yet another embodiment of this application;

[0062] Figure 16 A partial structural schematic diagram of an electronic device provided in another embodiment of this application;

[0063] Figure 17 A partial cross-sectional view of an electronic device provided in an embodiment of this application;

[0064] Figure 18 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0065] Figure 19 A partial structural schematic diagram of an electronic device provided in an embodiment of this application;

[0066] Figure 20 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0067] Figure 21 A partially exploded view of an electronic device provided in yet another embodiment of this application;

[0068] Figure 22 A partial structural schematic diagram of an electronic device provided in an embodiment of this application;

[0069] Figure 23 A partial structural schematic diagram of an electronic device provided in another embodiment of this application;

[0070] Figure 24 A partial structural schematic diagram of an electronic device provided in another embodiment of this application;

[0071] Figure 25 A simulation diagram comparing the radiation efficiency of antennas in related technologies with that of the embodiments of this application;

[0072] Figure 26 A partially exploded view of an electronic device provided in another embodiment of this application;

[0073] Figure 27 for Figure 26 Enlarged view of point W in the middle;

[0074] Figure 28 A partial structural schematic diagram of an electronic device provided in an embodiment of this application;

[0075] Figure 29 A schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0076] Figure 30 This is a partially exploded structural diagram of an electronic device provided in an embodiment of this application.

[0077] Figure label:

[0078] 10. Electronic devices;

[0079] 20. Display screen;

[0080] 21. Screen body; 211. First display area; 212. Second display area; 213. Third display area;

[0081] 22. Driver chip;

[0082] 23. Flexible connection circuit board; 231. Bending section;

[0083] 24. Metal back panel;

[0084] 30. Outer shell; 31. First shell; 32. Second shell; 33. Rotating shaft device; 34. Back cover;

[0085] 40. Mid-frame; 40a. Antenna slot; 40b. Frame;

[0086] 41. First radiator; 411. First conductive pin;

[0087] 42. Second radiator; 421. Second conductive pin;

[0088] 50. Metal mid-plate;

[0089] 60. Motherboard;

[0090] 70. Battery;

[0091] 80. Reinforcing body; 80a. First groove; 80b. Second groove;

[0092] 81. First reinforcement section; 82. Second reinforcement section; 83. Third reinforcement section;

[0093] 90. Insulating filler; 90a. First protrusion; 90b. Second protrusion; 90c. Third protrusion;

[0094] 100. Copying surface;

[0095] 200. Avoidance groove;

[0096] 300. The third groove;

[0097] 400. Conductive connectors;

[0098] 500. Conductive elastic components;

[0099] Z, thickness direction. Detailed Implementation

[0100] The electronic devices in this application embodiment can be referred to as user equipment (UE) or terminals, etc. For example, electronic devices can be smartwatches, portable Android devices (PADs), personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, and other mobile or fixed terminals. This application embodiment does not specifically limit the form of the terminal device.

[0101] In the embodiments of this application, Figure 1 The structure of the electronic device 10 in its deployed state is schematically shown. See also... Figure 1As shown, the example described is a handheld device with wireless communication capabilities, specifically electronic device 10. Handheld devices with wireless communication capabilities can be, but are not limited to, foldable screen devices. This application embodiment uses a foldable screen device as an example. A foldable screen device can be a foldable phone that includes a foldable, flexible display screen.

[0102] Figure 2 The structure of the electronic device 10 in a semi-folded state is schematically shown. Figure 3 This schematically illustrates the structure of an electronic device in its folded state. See also... Figures 1 to 3 As shown, the electronic device 10 includes a display screen 20 and a housing 30. The display screen 20 can be the inner screen of the electronic device 10. The display screen 20 can be a flexible screen with bendable properties. The housing 30 can provide a mounting base for other components. The housing 30 includes a first housing 31, a second housing 32, and a pivot device 33. The first housing 31 and the second housing 32 are each connected to the pivot device 33. The first housing 31 and the second housing 32 can be respectively disposed on opposite sides of the pivot device 33. The display screen 20 is connected to the first housing 31 and the second housing 32.

[0103] The first housing 31 and the second housing 32 can each rotate and fold relative to the rotating shaft device 33, so that the first housing 31 and the second housing 32 are stacked or unfolded. In this application, when the first housing 31 and the second housing 32 are stacked, the electronic device 10 is in a folded state. When the first housing 31 and the second housing 32 move away from each other from the stacked state and unfold to the same plane, the electronic device 10 is in an unfolded state. The process of the first housing 31 and the second housing 32 moving from the folded state to the unfolded state is the unfolding process, and the process of moving from the unfolded state to the folded state is the folding process.

[0104] Figure 4 A partial exploded view of the electronic device 10 is schematically shown. See also Figure 4 As shown, both the first housing 31 and the second housing 32 may include a mid-frame 40. The mid-frame 40 includes at least one border 40b. The mid-frame 40 is visible from the outside of the electronic device 10. The display screen 20 may be disposed on one side of the mid-frame 40. The housing 30 includes a back cover 34. Along the thickness direction Z of the mid-frame 40, the display screen 20 and the back cover 34 are disposed on opposite sides of the mid-frame 40. Exemplarily, the first housing 31 and the second housing 32 may each include a back cover 34. The back cover 34 may be disposed on one side of the mid-frame 40. Exemplarily, the material of the back cover 34 may be an insulating material, such as, but not limited to, glass or plastic. The material of the mid-frame 40 may be, but not limited to, aluminum, aluminum alloy, or steel. This application does not specifically limit this. Exemplarily, along the thickness direction Z of the mid-frame 40, the display screen 20 and the back cover 34 are spaced apart.

[0105] In some possible implementations, the electronic device 10 may also include a metal mid-plate 50. The metal mid-plate 50 is disposed between the display screen 20 and the back cover 34. A mid-frame 40 is connected to the metal mid-plate 50. The mid-frame 40 may be disposed around the outer periphery of the metal mid-plate 50. A border 40b of the mid-frame 40 may be connected to the metal mid-plate 50. The metal mid-plate 50 is not visible from the outside of the electronic device 10. Exemplarily, the material of the mid-frame 40 and the metal mid-plate 50 may be the same. The metal mid-plate 50 and the mid-frame 40 may be integrally formed or welded together. Along the thickness direction Z of the mid-frame 40, the metal mid-plate 50 is located between the display screen 20 and the back cover 34.

[0106] The display screen 20 may include a screen body 21, a driver chip, a flexible connection circuit board 23, and a metal backplate. The screen body 21 is used to display images and has a pixel layer. The pixel layer includes metal traces. The driver chip is disposed on the backlight side of the screen body 21. The flexible connection circuit board 23 is electrically connected to the screen body 21. The flexible connection circuit board 23 is bent and then connected to the driver chip. The bent area of ​​the flexible connection circuit board 23 forms a bend 231. The metal backplate is disposed on the backlight side of the screen body 21. The material of the metal backplate may be, but is not limited to, copper or titanium alloy.

[0107] The display screen 20 can be bent under external force. When the electronic device 10 is in the unfolded state, the screen body 21 of the display screen 20 unfolds to present image information to the user. The screen body 21 may include a first display area 211, a second display area 212, and a third display area 213. The first display area 211 and the second display area 212 are respectively disposed corresponding to the first housing 31 and the second housing 32. The third display area 213 may be disposed corresponding to the rotating shaft device 33.

[0108] When the first housing 31 and the second housing 32 are in a folded state, the screen 21 is in a bent state. The first display area 211 and the second display area 212 of the screen 21 can be stacked on top of each other, while the third display area 213 can be bent into an arc shape, for example, the third display area 213 can be bent into a teardrop shape.

[0109] When the first housing 31 and the second housing 32 are in the unfolded state, the screen 21 is also in the unfolded state, while the first display area 211, the second display area 212, and the third display area 213 are in a flat state. The electronic device 10 can change its overall size by folding or unfolding, and it can also have a large display area when unfolded.

[0110] Electronic device 10 also includes a motherboard 60. The motherboard 60 can be located between the display screen 20 and the back cover 34 along the thickness direction Z of the mid-frame 40. The motherboard 60 can be disposed on a metal mid-plate 50. The motherboard 60 may include a ground terminal. The metal mid-plate 50 is electrically connected to the ground terminal of the motherboard 60. Electronic device 10 also includes electronic components. Electronic components are disposed on the motherboard 60. The motherboard 60 can be a printed circuit board (PCB). The electronic components can be soldered to the motherboard 60 using a soldering process.

[0111] For example, the electronic devices on the motherboard 60 may include, but are not limited to, a central processing unit (CPU), an intelligent algorithm chip, a power management IC (PMIC), or a radio frequency integrated circuit (RFIC). Since the internal space of the electronic device 10 is relatively small, the electronic devices can be integrated on the motherboard 60 to significantly reduce the size of the motherboard 60 and lower its space occupancy rate.

[0112] The electronic device 10 may also include a battery 70. The battery 70 may be disposed within the housing 30. For example, the battery 70 may be disposed between the back cover 34 and the metal mid-plate 50. The battery 70 is a structural component that can convert chemical energy into electrical energy. The battery 70 is used to provide electrical energy to the electronic device 10 to ensure its normal operation. For example, the battery 70 may provide electrical energy to the display screen 20 to display image information or complete corresponding operation commands, or the battery 70 may provide electrical energy to electronic devices to ensure their normal operation. Exemplarily, the battery 70 may be a lithium-ion battery, such as a lithium iron phosphate battery.

[0113] To ensure good communication performance of the electronic device 10, the mid-frame 40 can be used as an antenna radiator. The radiator is used to receive or transmit electromagnetic wave signals, enabling the electronic device 10 to achieve wireless communication functionality. The frame 40b of the mid-frame 40 may include a first radiator and a second radiator. Adjacent ends of the first and second radiators are spaced apart to form antenna slots. The first radiator includes a first conductive pin. The second radiator includes a second conductive pin. The first radiator can be electrically connected to the motherboard 60 via the first conductive pin, and the second radiator can be electrically connected to the motherboard 60 via the second conductive pin.

[0114] Figure 5 The partial exploded structure of an electronic device 10 of the related technology is shown schematically. Figure 6 A partial cross-sectional view of an electronic device 10 of the related art is schematically shown. See also Figure 5 and Figure 6 As shown, in related technologies, antenna slots 40a are formed on the frame 40b to create radiators M on both sides of the antenna slots 40a, which reduces the structural strength of the frame 40b itself. For example, for electronic devices 10 with narrow bezels or curved screens, creating antenna slots 40a on the frame 40b further reduces the structural strength of the frame 40b, resulting in a decrease in its load-bearing capacity. To improve the problem of reduced local structural strength of the electronic device 10, a reinforcing body 80 is provided at the position corresponding to the antenna slots 40a to enhance the structural strength of the frame 40b at the location where the antenna slots 40a are formed. The conductive feet M1 of the radiators M are provided on the side of the reinforcing body 80 facing the display screen 20. Each radiator M may include one conductive foot M1. The reinforcing body 80 and the two conductive feet M1 are spaced apart, that is, the reinforcing body 80 and the two conductive feet M1 do not contact each other, and the reinforcing body 80 and the conductive feet M1 are insulated from each other. Compared to the reinforcing element 80, the conductive pin M1 of the radiator M is closer to the display screen 20. The display screen 20 has metal structural components. For example, the metal structural components include metal traces in the pixel layer. Alternatively, the metal structural components include metal traces in the flexible interconnect circuit board 23. Alternatively, the metal structural components include a metal backplate 24 disposed on the backlight side of the screen body 21. Due to the limited internal space of the electronic device 10, the reinforcing element 80 and the conductive pin M1 are arranged in a compact manner. Therefore, the minimum distance between the conductive pin M1 and the display screen 20 is relatively small. This causes the metal structural components in the display screen 20 to adversely affect the electromagnetic wave signals received or emitted by the radiator M, resulting in a relative deviation in the antenna performance of the radiator M.

[0115] It should be noted that the minimum distance between the conductive foot M1 and the display screen 20 refers to the smallest value among the spacing between the conductive foot M1 and the pixel layer, the spacing between the conductive foot M1 and the bent portion 231 of the flexible connection circuit board 23, and the spacing between the conductive foot M1 and the metal back plate 24.

[0116] The electronic device 10 provided in this application embodiment includes a mid-frame 40 with a radiator and a reinforcing body 80. In this application embodiment, the conductive feet of the radiator and the arrangement of the reinforcing body 80 enable the reinforcing body 80 to enhance the structural strength of the mid-frame 40 at the antenna slot 40a, while ensuring that the radiator has relatively good antenna performance.

[0117] Figure 7 The partial exploded structure of the electronic device 10 is shown schematically. Figure 8 A partial cross-sectional view of the electronic device 10 is shown schematically. See also Figure 7 and Figure 8 As shown, the electronic device 10 of this application embodiment includes a display screen 20, a back cover 34, a middle frame 40, and a reinforcing body 80.

[0118] The middle frame 40 includes at least one border 40b. The border 40b includes a first radiator 41 and a second radiator 42. Adjacent ends of the first radiator 41 and the second radiator 42 are spaced apart to form an antenna slot 40a. For example, the first radiator 41 and the second radiator 42 are spaced apart along the length of the border 40b. The antenna slot 40a isolates the first radiator 41 and the second radiator 42 on both sides to reduce the possibility of mutual interference between the first radiator 41 and the second radiator 42. The first radiator 41 and the second radiator 42 can be used to receive or transmit electromagnetic wave signals to enable the electronic device 10 to perform wireless communication functions. The first radiator 41 includes a first conductive pin 411. The first radiator 41 can be electrically connected to external structural components via the first conductive pin 411, for example, the first radiator 41 can be electrically connected to the motherboard 60 via the first conductive pin 411. Exemplarily, the first conductive pin 411 and the motherboard 60 can be electrically connected via a conductive elastic element 500. The second radiator 42 includes a second conductive pin 421. The second radiator 42 can be electrically connected to external structural components via the second conductive pin 421. For example, the second radiator 42 can be electrically connected to the motherboard 60 via the second conductive pin 421. Exemplarily, the second conductive pin 421 and the motherboard 60 can be electrically connected via a conductive elastic element 500. Exemplarily, the first conductive pin 411 and the second conductive pin 421 can be positioned close to the antenna slot 40a.

[0119] The display screen 20 and the back cover 34 are disposed on the middle frame 40. Along the thickness direction Z of the middle frame 40, the display screen 20 and the back cover 34 are disposed on opposite sides of the middle frame 40. The thickness direction Z of the middle frame 40 can be the same as the thickness direction of the electronic device 10. A reinforcing body 80 is located between the display screen 20 and the back cover 34. The first conductive foot 411 and the second conductive foot 421 are both spaced apart from the reinforcing body 80, meaning that the reinforcing body 80 does not contact the first conductive foot 411 or the second conductive foot 421, and is insulated from the first conductive foot 411 or the second conductive foot 421. The reinforcing body 80 is disposed opposite to the antenna gap 40a. The reinforcing body 80 is spaced apart from the middle frame 40, so that the reinforcing body 80 and the middle frame 40 are in a non-direct contact state. The reinforcing body 80 itself is insulated from the middle frame 40. One end of the reinforcing body 80 is located on one side of the antenna slot 40a, and the other end is located on the other side of the antenna slot 40a, such that the orthographic projection of the reinforcing body 80 and the orthographic projection of the antenna slot 40a overlap in a direction perpendicular to the thickness direction Z.

[0120] Along the thickness direction Z of the mid-frame 40, at least one of the first conductive foot 411 and the second conductive foot 421 is located on the side of the reinforcement 80 facing away from the display screen 20. Therefore, relative to the reinforcement 80, at least one of the first conductive foot 411 and the second conductive foot 421 is closer to the back cover 34 and farther away from the display screen 20. The back cover 34 is an insulating structure, so the back cover 34 will not adversely affect the wireless signals received or transmitted by the first conductive foot 411 and the second conductive foot 421.

[0121] In the electronic device 10 of this application embodiment, a reinforcing body 80 is provided at the antenna slot 40a of the frame 40b to enhance the structural strength of the frame 40b at the antenna slot 40a, reducing the possibility of deviation in the load-bearing capacity of the frame 40b and easy deformation due to a decrease in the structural strength of the frame 40b. Furthermore, at least one of the first conductive foot 411 and the second conductive foot 421 is disposed on the side of the reinforcing body 80 facing away from the display screen 20. The distance between at least one of the first conductive foot 411 and the second conductive foot 421 and the display screen 20 is relatively large, which is beneficial for increasing the clearance of at least one of the first conductive foot 411 and the second conductive foot 421 in a confined space, thereby improving the antenna performance of at least one of the first radiator 41 and the second radiator 42. Therefore, within the confined space inside the electronic device 10, a reinforcing body 80, a first conductive foot 411, and a second conductive foot 421 can be simultaneously provided. This enhances the structural strength at the antenna slot 40a in the frame 40b while reducing the possibility of relative deviations in antenna performance of the first radiator 41 or the second radiator 42 due to insufficient clearance of the first conductive foot 411 or the second conductive foot 421. This ensures that at least one of the first radiator 41 and the second radiator 42 has relatively good antenna performance.

[0122] Within the confined space of the electronic device 10, the reinforcing body 80, the first conductive foot 411, and the second conductive foot 421 are arranged compactly to improve space utilization. Relative to the reinforcing body 80, both the first conductive foot 411 and the second conductive foot 421 are positioned relatively far from the display screen 20. This allows for a relatively larger minimum distance between the first conductive foot 411 and the display screen 20, as well as between the second conductive foot 421 and the display screen 20, within the limited space. This increases the clearance between the first conductive foot 411 and the second conductive foot 421, thereby improving the antenna performance of the first radiator 41 and the second radiator 42.

[0123] For example, both the first conductive foot 411 and the second conductive foot 421 are provided corresponding to the bend 231 of the flexible connecting circuit board 23 in the display screen 20. The minimum distance between the first conductive foot 411 and the bend 231 of the flexible connecting circuit board 23 can be from 1.2 mm to 1.7 mm, which is beneficial for the first conductive foot 411 to have a relatively large clearance. For example, the minimum distance between the first conductive foot 411 and the bend 231 of the flexible connecting circuit board 23 can be 1.526 mm. The minimum distance between the second conductive foot 421 and the bend 231 of the flexible connecting circuit board 23 can also be from 1.2 mm to 1.7 mm, which is beneficial for the second conductive foot 421 to have a relatively large clearance. For example, the minimum distance between the second conductive foot 421 and the bend 231 of the flexible connecting circuit board 23 can be 1.526 mm.

[0124] Along the thickness direction Z of the middle frame 40, at least one of the first conductive leg 411 and the second conductive leg 421 has an overlapping area with the orthographic projection of the reinforcing body 80. The reinforcing body 80 can make full use of the space on the side of the first conductive leg 411 and the second conductive leg 421 facing the display screen 20, so that the structural design of the reinforcing body 80, the first conductive leg 411 and the second conductive leg 421 is compact, which helps to reduce the space occupancy rate of the reinforcing body 80, the first conductive leg 411 and the second conductive leg 421.

[0125] The first conductive foot 411 is in a non-direct contact with the reinforcing body 80. Correspondingly, the second conductive foot 421 is also in a non-direct contact with the reinforcing body 80. For example, in an embodiment where the orthographic projection of the first conductive foot 411 overlaps with the orthographic projection of the reinforcing body 80, the first conductive foot 411 is located between the reinforcing body 80 and the back cover 34. In an embodiment where the orthographic projection of the second conductive foot 421 overlaps with the orthographic projection of the reinforcing body 80, the second conductive foot 421 is located between the reinforcing body 80 and the back cover 34. In an embodiment where both the orthographic projections of the first conductive foot 411 and the second conductive foot 421 overlap with the orthographic projection of the reinforcing body 80, both the first conductive foot 411 and the second conductive foot 421 are located between the reinforcing body 80 and the back cover 34.

[0126] In some feasible implementations, the material of the reinforcing body 80 may differ from the material of the frame 40b. The material of the reinforcing body 80 may be a metallic material, such as, but not limited to, aluminum or aluminum alloy. The material of the reinforcing body 80 may also be a non-metallic material, such as, but not limited to, ceramic.

[0127] In some feasible implementations, the first radiator 41 and the second radiator 42 on both sides of the antenna slot 40a can each form an antenna. The first conductive pin 411 and the second conductive pin 421 are both feed sections. The first conductive pin 411 and the second conductive pin 421 can be electrically connected to different feed points on the main board 60.

[0128] The motherboard 60 can feed wireless signals to the first radiator 41 through the corresponding power supply point and the first conductive pin 411, so that the first radiator 41 radiates wireless signals and generates an operating frequency band covering the first resonant frequency. The motherboard 60 can also feed wireless signals to the second radiator 42 through the corresponding power supply point and the second conductive pin 421, so that the second radiator 42 radiates wireless signals and generates an operating frequency band covering the second resonant frequency. Therefore, the frequencies received or transmitted by the first radiator 41 and the second radiator 42 can be different.

[0129] In some examples, of the first radiator 41 and the second radiator 42 on both sides of the antenna slot 40a, one can be a main stub and the other a parasitic stub. For example, the first radiator 41 can be a main stub. The first conductive pin 411 can be a feed section. The second radiator 42 can be a parasitic stub. The second conductive pin 421 can be a tuning section. The first conductive pin 411 of the first radiator 41 is electrically connected to the feed point of the motherboard 60, so that the motherboard 60 can feed a wireless signal to the first radiator 41, so that the first radiator 41 acts as an antenna and generates an operating frequency band covering the first resonant frequency. The second conductive pin 421 of the second radiator 42 can be electrically connected to the motherboard 60, so that the second radiator 42 acts as a parasitic stub of the first radiator 41, so that the first radiator 41 and the second radiator 42 can be coupled to generate an operating frequency band covering the second resonant frequency. In the above scheme, the parasitic stub is coupled to the main stub, and the parasitic stub can be used to excite resonance to enhance the main resonance of the main stub or expand the bandwidth of the main stub. For example, both the parasitic branch and the main branch can be used to receive or transmit electromagnetic wave signals.

[0130] For example, the first radiator 41 can support the mid-high frequency (MHB) band. For example, the mid-high frequency band ranges from 1000MHz to 3000MHz. The second radiator 42 can support the N78 band. For example, the N78 band ranges from 3300MHz to 3800MHz.

[0131] Figure 9 This is a simulation diagram comparing the radiation efficiency of antennas in related technologies with that of the embodiment in this application. The antenna is a left-handed antenna. See also... Figure 9As shown, compared to related technologies, in this embodiment, the first radiator 41 can be a main branch, and the second radiator 42 can be a parasitic branch. By placing both the first conductive foot 411 and the second conductive foot 421 on the side of the reinforcing body 80 facing away from the display screen 20, the radiation efficiency in the mid-to-high frequency band can be improved by 0.3 dB, and the radiation efficiency of the high channel in the N78 band can be improved by 0.5 dB. Furthermore, the bandwidth of both the mid-to-high frequency band and the N78 band is broadened to a certain extent. Therefore, in this embodiment, the reinforcing body 80, the first conductive foot 411, and the second conductive foot 421 can be simultaneously disposed inside the electronic device 10, and this arrangement of the reinforcing body 80, the first conductive foot 411, and the second conductive foot 421 is beneficial for improving antenna performance.

[0132] In some examples, the distance between the reinforcing member 80 and the first conductive pin 411 is 0.5 mm or more. Maintaining a relatively large distance between the reinforcing member 80 and the first conductive pin 411 reduces the likelihood of the reinforcing member 80 adversely affecting the electromagnetic wave signals received or emitted by the first conductive pin 411. For example, the minimum distance between the reinforcing member 80 and the first conductive pin 411 is 0.5 mm.

[0133] The distance between the reinforcing body 80 and the second conductive pin 421 is 0.5 mm or more. Maintaining a relatively large distance between the reinforcing body 80 and the second conductive pin 421 reduces the possibility of the reinforcing body 80 adversely affecting the electromagnetic wave signals received or emitted by the second conductive pin 421. For example, the minimum distance between the reinforcing body 80 and the second conductive pin 421 is 0.5 mm.

[0134] The distance between the reinforcing member 80 and the display screen 20 is 0.25 mm or more. Exemplarily, the minimum distance between the reinforcing member 80 and the display screen 20 is 0.25 mm. For example, the spacing between the reinforcing member 80 and the bend 231 of the flexible connection circuit board 23 can be the minimum distance between the reinforcing member 80 and the display screen 20. Alternatively, the spacing between the reinforcing member 80 and the metal backplate 24 can be the minimum distance between the reinforcing member 80 and the display screen 20. Alternatively, the spacing between the reinforcing member 80 and the pixel layer can be the minimum distance between the reinforcing member 80 and the display screen 20.

[0135] In some possible implementations, at least one of the first conductive pin 411 and the second conductive pin 421 is provided with a contoured surface 100 facing the back cover 34 (see [link]). Figure 8As shown, the contoured surface 100 has the same shape as the inner wall of the back cover 34. There is a gap between the contoured surface 100 and the inner wall to avoid positional interference between the first conductive leg 411 or the second conductive leg 421 and the back cover 34. At the same time, it can also prevent the back cover 34 from collapsing due to external pressure and causing compression to the first conductive leg 411 or the second conductive leg 421.

[0136] For example, both the first conductive foot 411 and the second conductive foot 421 include a contoured surface 100 facing the back cover 34.

[0137] For example, the inner wall of the back cover 34 facing the contour surface 100 is arc-shaped. Correspondingly, the shape of the contour surface 100 is also arc-shaped.

[0138] In some implementations, the electronic device 10 also includes an insulating filler 90. The insulating filler 90 connects the reinforcing member 80 to the frame 40b. For example, the reinforcing member 80 is embedded in the insulating filler 90. The insulating filler 90 can connect the frame 40b and the reinforcing member 80 into a whole, so that the frame 40b, the reinforcing member 80, and the insulating filler 90 can form a combined structure, thereby further improving the structural strength of the frame 40b at the antenna slot 40a and improving the impact resistance of the frame 40b. Exemplarily, a portion of the insulating filler 90 can fill the antenna slot 40a. The insulating filler 90 can insulate the first radiator 41 and the second radiator 42 on both sides of the antenna slot 40a, thereby ensuring the continuity of the frame 40b, which is beneficial to improving the structural strength of the frame 40b, while the insulating filler 90 does not affect the performance of the antenna.

[0139] For example, the insulating filler 90 can be an insulating adhesive. The frame 40b, the reinforcing body 80, and the insulating filler 90 can be formed into a composite by an injection molding process.

[0140] In some implementations, the flexible connection circuit board 23 is located on the side of the reinforcing body 80 away from the back cover 34. One end of the flexible connection circuit board 23 is connected to the screen body 21, and the other end is electrically connected to the driving chip 22 disposed on the backlight side of the screen body 21. A bend 231 is formed in the middle portion of the flexible connection circuit board 23. The reinforcing body 80 is provided corresponding to the bend 231. An avoidance groove 200 is provided on the surface of the insulating filler 90 facing the flexible connection circuit board 23. The avoidance groove 200 avoids the bend 231, preventing the bend 231 from being damaged by the pressure of the insulating filler 90. The avoidance groove 200 has an opening facing the bend 231.

[0141] At least a portion of the bend 231 can be located within the clearance groove 200, thereby improving space utilization in a confined space. The shape of the wall surface of the clearance groove 200 facing the bend 231 can match the shape of the bend 231. For example, if the bend 231 is arc-shaped, the corresponding shape of the wall surface of the clearance groove 200 facing the bend 231 is also arc-shaped. A gap exists between the wall surface of the clearance groove 200 facing the bend 231 and the bend 231.

[0142] The reinforcing body 80 forms the bottom wall of the avoidance groove 200 on at least a portion of the surface of the flexible connection circuit board 23. The reinforcing body 80 can avoid the bend 231, and at the same time, the reinforcing body 80 is relatively far away from the bend 231 to prevent the bend 231 from being damaged by the compression of the reinforcing body 80.

[0143] For example, before the insulating filler 90 is installed, the reinforcement 80 is connected to the frame 40b via a metal connector to fix the position of the reinforcement 80. Then the insulating filler 90 is installed. After the reinforcement 80, the insulating filler 90 and the frame 40b are joined, the metal connector is cut off, along with a portion of the insulating filler 90 and a portion of the reinforcement 80, thereby finally forming the clearance groove 200.

[0144] In some feasible implementations, the orthographic projections of the first conductive foot 411 and the second conductive foot 421 both overlap with the orthographic projection of the reinforcing body 80. Both the first conductive foot 411 and the second conductive foot 421 are located between the reinforcing body 80 and the back cover 34.

[0145] In some examples, Figure 10 A partial structure of the electronic device 10 is shown schematically. See also Figure 10 As shown, along the thickness direction Z of the middle frame 40, the orthographic projection of the reinforcing body 80 can be rectangular, for example, a rectangle. The relatively regular shape of the reinforcing body 80 helps reduce processing difficulty. The first conductive leg 411 and the second conductive leg 421 are spaced apart along the length direction of the reinforcing body 80. Along the width direction of the reinforcing body 80, at least one of the first conductive leg 411 and the second conductive leg 421 extends beyond the reinforcing body 80.

[0146] In some examples, Figure 11 A partial structure of the electronic device 10 is shown schematically. See also Figure 11As shown, the reinforcing body 80 includes a first groove 80a. The opening of the first groove 80a faces away from the antenna slot 40a. The middle portion of the reinforcing body 80 is closer to the antenna slot 40a. The middle portion of the reinforcing body 80 is relatively far away from the motherboard 60, making it less likely for the middle portion of the reinforcing body 80 to interfere with the motherboard 60, thus avoiding a reduction in the size of the motherboard 60 due to the need for the motherboard 60 to avoid the middle portion of the reinforcing body 80.

[0147] Figure 12 A partial structure of the electronic device 10 is shown schematically. Figure 13 A partial cross-sectional view of the electronic device 10 is shown schematically. See also Figure 12 and Figure 13 As shown, the opening of the first groove 80a faces the antenna slot 40a, so that the middle portion of the reinforcing body 80 is relatively far away from the frame 40b. A relatively large amount of insulating filler 90 can be accommodated between the reinforcing body 80 and the frame 40b, which helps to improve the connection strength between the reinforcing body 80, the frame 40b, and the insulating filler 90, thereby improving the structural strength of the assembly formed by the reinforcing body 80, the insulating filler 90, and the frame 40b. The middle portion of the reinforcing body 80 is far away from the antenna slot 40a. The insulating filler 90 covers the first groove 80a, so that the first groove 80a is embedded within the insulating filler 90. The insulating filler 90 has a first protrusion 90a that matches the shape of the first groove 80a, which helps to increase the connection strength between the insulating filler 90 and the reinforcing body 80, improve the bonding force between the insulating filler 90 and the reinforcing body 80, and further improve the structural strength of the assembly formed by the reinforcing body 80, the insulating filler 90, and the frame 40b. For example, along the thickness direction Z of the middle frame 40, the first groove 80a penetrates the reinforcing body 80.

[0148] For example, the reinforcing body 80 can be arc-shaped. The arc-shaped reinforcing body 80 has a smooth and gentle surface transition, a regular shape, is easy to process and manufacture, and has good stress balance when bearing stress. For example, the reinforcing body 80 can be circular arc-shaped.

[0149] For example, Figure 14 A partial structure of the electronic device 10 is shown schematically. See also Figure 14As shown, the reinforcing body 80 includes a first reinforcing segment 81 and a second reinforcing segment 82 that intersect. The first reinforcing segment 81 and the second reinforcing segment 82 are embedded in the insulating filler 90 at different angles, thereby increasing the connection strength between the insulating filler 90 and the reinforcing body 80 and improving the bonding force between them. Both the first reinforcing segment 81 and the second reinforcing segment 82 can be straight segments, making the reinforcing body 80 as a whole "V" shape. For example, the included angle between the first reinforcing segment 81 and the second reinforcing segment 82 can be greater than or equal to 90°. The opening of the first groove 80a faces away from the antenna slot 40a. Exemplarily, the first reinforcing segment 81 corresponds to the first conductive foot 411, and the second reinforcing segment 82 corresponds to the second conductive foot 421. Or, Figure 15 A partial structure of the electronic device 10 is shown schematically. See also Figure 15 As shown, the opening of the first groove 80a faces the antenna slot 40a.

[0150] For example, Figure 16 A partial structure of the electronic device 10 is shown schematically. Figure 17 A partial cross-sectional view of the electronic device 10 is shown schematically. See also Figure 16 and Figure 17 As shown, the opening of the first groove 80a faces the antenna slot 40a. A second groove 80b is provided on the bottom wall of the first groove 80a. The first groove 80a and the second groove 80b are connected. An insulating filler 90 covers the first groove 80a and the second groove 80b. The insulating filler 90 covers the first groove 80a and the second groove 80b, such that the first groove 80a and the second groove 80b are embedded in the insulating filler 90. The insulating filler 90 has a first protrusion 90a that matches the shape of the first groove 80a and a second protrusion 90b that matches the shape of the second groove 80b, which helps to further increase the connection strength between the insulating filler 90 and the reinforcing body 80, improve the bonding force between the insulating filler 90 and the reinforcing body 80, and further improve the structural strength of the assembly formed by the reinforcing body 80, the insulating filler 90 and the frame 40b. Exemplarily, the second groove 80b can penetrate the reinforcing body 80 along the thickness direction Z of the middle frame 40. Exemplarily, the number of second grooves 80b is at least two. The number of second protrusions 90b is equal to the number of second grooves 80b.

[0151] Furthermore, a third groove 300 may be provided on the inner wall of at least one of the first radiator 41 and the second radiator 42. That is, a third groove 300 may be provided on the inner wall of the first radiator 41, or on the inner wall of the second radiator 42, or both the first radiator 41 and the second radiator 42 may have a third groove 300. The third groove 300 faces the reinforcing body 80. Exemplarily, the second groove 80b and the third groove 300 may be staggered. The insulating filler 90 covers the third groove 300. The insulating filler 90 covers the first groove 80a, the second groove 80b, and the third groove 300, such that the first groove 80a, the second groove 80b, and the third groove 300 are embedded within the insulating filler 90. The insulating filler 90 also has a third protrusion 90c that matches the shape of the third groove 300, which helps to further increase the connection strength between the insulating filler 90 and the reinforcing body 80, improve the bonding force between the insulating filler 90 and the reinforcing body 80, and further improve the structural strength of the combination formed by the reinforcing body 80, the insulating filler 90 and the frame 40b.

[0152] In some possible implementations, the electronic device 10 also includes a metal mid-plate 50 and a main board 60. Both the metal mid-plate 50 and the main board 60 are located between the display screen 20 and the back cover 34 along the thickness direction Z of the mid-frame 40. The first radiator 41 and the second radiator 42 are both electrically connected to the metal mid-plate 50. The main board 60 may be disposed on the metal mid-plate 50. The main board 60 includes a ground terminal. The metal mid-plate 50 is electrically connected to the ground terminal to ground the first radiator 41 and the second radiator 42.

[0153] The first radiator 41 and the second radiator 42 are grounded by using the grounding terminals of the metal middle plate 50 and the main board 60. This eliminates the need for additional grounding structures between the first radiator 41 and the main board 60, as well as between the second radiator 42 and the main board 60, which helps reduce the number of components used.

[0154] In some feasible ways, Figure 18 A partial cross-sectional view of the electronic device 10 is shown schematically. Figure 19 A partial structure of the electronic device 10 is shown schematically. See also Figure 18 and Figure 19 As shown, along the thickness direction Z of the middle frame 40, the first conductive foot 411 and the second conductive foot 421 are both located on the side of the reinforcing body 80 facing away from the display screen 20. The reinforcing body 80 is positioned close to the display screen 20.

[0155] In some examples, the electronic device 10 also includes a conductive connector 400. The reinforcing body 80 is conductive. One of the first conductive foot 411 and the second conductive foot 421 is connected to the reinforcing body 80 via the conductive connector 400. Of the first radiator 41 and the second radiator 42 on both sides of the antenna slot 40a, one can be a main branch, and the other can be a parasitic branch. The reinforcing body 80 is connected to either the first radiator 41 or the second radiator 42, which is a main branch.

[0156] For example, the first radiator 41 can be a main branch. The first conductive pin 411 can be a feed section. The second radiator 42 can be a parasitic branch. The second conductive pin 421 can be a tuning section. The first conductive pin 411 of the first radiator 41 is electrically connected to the feed point of the motherboard 60, so that the motherboard 60 can feed a wireless signal to the first radiator 41, so that the first radiator 41 acts as an antenna to generate an operating frequency band covering the first resonant frequency. The second conductive pin 421 of the second radiator 42 can be electrically connected to the motherboard 60, so that the second radiator 42 acts as a parasitic branch of the first radiator 41, so that the first radiator 41 and the second radiator 42 can couple with each other to generate an operating frequency band covering the second resonant frequency.

[0157] For example, the first radiator 41 can support the mid-high frequency (MHB) band. For example, the mid-high frequency band ranges from 1000MHz to 3000MHz. The second radiator 42 can support the N78 band. For example, the N78 band ranges from 3300MHz to 3800MHz.

[0158] In this embodiment, the reinforcement 80 is electrically connected to the first conductive foot 411 or to the second conductive foot 421. On the one hand, the reinforcement 80 helps to enhance the gap coupling strength between the first radiator 41 and the second radiator 42, thereby increasing the coupling electric field strength between the first radiator 41 and the second radiator 42, which is beneficial to improving antenna performance. On the other hand, the connection between the reinforcement 80 and the first conductive foot 411 or the second conductive foot 421 helps to improve the connection strength and connection stability between the reinforcement 80 and the first radiator 41 or between the reinforcement 80 and the second radiator 42, thereby improving the structural strength of the combination formed by the reinforcement 80, the insulating filler 90 and the frame 40b.

[0159] The reinforcing body 80, the conductive connector 400, and one of the first conductive foot 411 and the second conductive foot 421 are integrally formed, which helps to increase the structural strength of the reinforcing body 80, the conductive connector 400, and the first conductive foot 411 and the second conductive foot 421, and further helps to improve the structural strength of the combination formed by the reinforcing body 80, the insulating filler 90 and the middle frame 40.

[0160] In some examples, the first conductive leg 411 is connected to the reinforcing body 80 via a conductive connector 400. The reinforcing body 80, the conductive connector 400, and the first conductive leg 411 can be made of the same material. The reinforcing body 80, the conductive connector 400, and the first conductive leg 411 are integrally formed, which helps to increase the structural strength of the reinforcing body 80, the conductive connector 400, and the first conductive leg 411, and further helps to improve the structural strength of the assembly formed by the reinforcing body 80, the insulating filler 90, and the frame 40b. Exemplarily, the materials of the reinforcing body 80, the conductive connector 400, and the first conductive leg 411 can be, but are not limited to, aluminum or aluminum alloy.

[0161] In some examples, the second conductive leg 421 is connected to the reinforcing body 80 via a conductive connector 400. The reinforcing body 80, conductive connector 400, and second conductive leg 421 can be made of the same material. The reinforcing body 80, conductive connector 400, and second conductive leg 421 are integrally formed, which helps to increase the structural strength of the reinforcing body 80, conductive connector 400, and second conductive leg 421, and further helps to improve the structural strength of the assembly formed by the reinforcing body 80, insulating filler 90, and frame 40b. Exemplarily, the materials of the reinforcing body 80, conductive connector 400, and second conductive leg 421 can be, but are not limited to, aluminum or aluminum alloy.

[0162] In some examples, the conductive connector 400 is a weld block. One of the first conductive leg 411 and the second conductive leg 421 is welded to the reinforcing body 80. After the welding operation is completed between the first conductive leg 411 and the second conductive leg 421 and the reinforcing body 80, the resulting weld block is the conductive connector 400. Exemplarily, the material of the reinforcing body 80 can be the same as the material of the frame 40b; for example, both the material of the reinforcing body 80 and the material of the frame 40b can be aluminum or an aluminum alloy.

[0163] This application also provides an electronic device 10. The electronic device 10 in this embodiment has the same structure as the electronic device 10 described above, and will not be repeated here. In the electronic device 10, the reinforcing body 80 is disposed opposite to the antenna slot 40a. The reinforcing body 80 is spaced apart from the frame 40b, and the reinforcing body 80 is insulated from the frame 40b. The first conductive foot 411 and the second conductive foot 421 are both spaced apart from the reinforcing body 80, and the reinforcing body 80 is insulated from the first conductive foot 411 and from the second conductive foot 421. The electronic device 10 also includes a conductive connector 400. One of the first conductive foot 411 and the second conductive foot 421 is electrically connected to the reinforcing body 80 through the conductive connector 400.

[0164] For example, of the first radiator 41 and the second radiator 42 on both sides of the antenna slot 40a, one can be a main branch and the other can be a parasitic branch. The reinforcement 80 is connected to the first radiator 41 or the second radiator 42, which is the main branch.

[0165] Exemplarily, the first radiator 41 can be a main branch. The first conductive pin 411 can be a feed section. The second radiator 42 can be a parasitic branch. The second conductive pin 421 can be a tuning section. The first conductive pin 411 of the first radiator 41 is electrically connected to the feed point of the motherboard 60, so that the motherboard 60 can feed a wireless signal to the first radiator 41, so that the first radiator 41 acts as an antenna to generate an operating frequency band covering the first resonant frequency. The second conductive pin 421 of the second radiator 42 can be electrically connected to the motherboard 60, so that the second radiator 42 acts as a parasitic branch of the first radiator 41, so that the first radiator 41 and the second radiator 42 can couple with each other to generate an operating frequency band covering the second resonant frequency. Exemplarily, the first radiator 41 can support mid-high frequency (MHB). For example, the mid-high frequency band range is 1000MHz to 3000MHz. The second radiator 42 can support the N78 band. For example, the N78 band range is 3300MHz to 3800MHz.

[0166] In the electronic device 10 of this application embodiment, the reinforcement 80 is electrically connected to the first conductive pin 411 or to the second conductive pin 421. On the one hand, the reinforcement 80 helps to enhance the gap coupling strength between the first radiator 41 and the second radiator 42, thereby increasing the coupling electric field strength between the first radiator 41 and the second radiator 42 on both sides of the antenna gap 40a, which helps to improve antenna performance. On the other hand, the connection between the reinforcement 80 and the first conductive pin 411 or the second conductive pin 421 helps to improve the connection strength and connection stability between the reinforcement 80 and the first radiator 41 or between the reinforcement 80 and the second radiator 42, thereby helping to improve the structural strength of the combination formed by the reinforcement 80, the insulating filler 90 and the frame 40b.

[0167] See also some of the possible implementation methods. Figure 18 and Figure 19 As shown, along the thickness direction Z of the middle frame 40, both the first conductive foot 411 and the second conductive foot 421 are located on the side of the reinforcing body 80 facing away from the display screen 20. The reinforcing body 80 is positioned close to the display screen 20. The electronic device 10 also includes a conductive connector 400. The reinforcing body 80 is conductive. One of the first conductive foot 411 and the second conductive foot 421 is connected to the reinforcing body 80 via the conductive connector 400.

[0168] In some feasible ways, Figure 20A partial cross-sectional view of the electronic device 10 is shown schematically. Figure 21 A partial exploded view of the electronic device 10 is schematically shown. See also Figure 20 and Figure 21 As shown, along the thickness direction Z of the middle frame 40, both the first conductive foot 411 and the second conductive foot 421 are located on the side of the reinforcing body 80 facing the display screen 20. The reinforcing body 80 is positioned close to the back cover 34. Compared to the reinforcing body 80, the first conductive foot 411 and the second conductive foot 421 are closer to the display screen 20 and farther away from the back cover 34.

[0169] In some examples, Figure 22 A partial structure of the electronic device 10 is shown schematically. See also Figure 22 As shown, along the thickness direction Z of the middle frame 40, the orthographic projection of the reinforcing body 80 can be rectangular, for example, a rectangle. The relatively regular shape of the reinforcing body 80 helps reduce the difficulty of processing. The reinforcing body 80 is connected to the first conductive leg 411 through a conductive connector 400.

[0170] In some examples, Figure 23 A partial structure of the electronic device 10 is shown schematically. See also Figure 23 As shown, the reinforcing body 80 includes a first groove 80a. The first groove 80a faces the antenna slot 40a. The reinforcing body 80 can be arc-shaped. The arc-shaped reinforcing body 80 has a smooth and gentle surface transition, a regular shape, is easy to process and manufacture, and has good stress balance when bearing stress. For example, the reinforcing body 80 can be circular arc-shaped. Or, Figure 24 A partial structure of the electronic device 10 is shown schematically. See also Figure 24 As shown, the reinforcing body 80 includes a first reinforcing segment 81 and a second reinforcing segment 82 that intersect. The first reinforcing segment 81 and the second reinforcing segment 82 are embedded in the insulating filler 90 at different angles, thereby increasing the connection strength between the insulating filler 90 and the reinforcing body 80 and improving the bonding force between them. Both the first reinforcing segment 81 and the second reinforcing segment 82 can be straight segments, making the reinforcing body 80 as a whole "V" shape. The first reinforcing segment 81 and the first conductive leg 411 are connected by a conductive connector 400.

[0171] In some examples, the opening of the first groove 80a may be positioned away from the antenna slot 40a. The reinforcement 80 may be arc-shaped. Alternatively, the reinforcement 80 may include an intersecting first reinforcement segment 81 and a second reinforcement segment 82.

[0172] Figure 25This is a simulation diagram comparing the radiation efficiency of antennas in related technologies with that of the embodiment of this application. The antenna is a left-handed antenna. The first radiator 41 is the main branch, while the second radiator 42 is a parasitic branch. In this embodiment, by placing the first conductive foot 411 and the second conductive foot 421 on the side of the reinforcing body 80 facing the display screen 20, and electrically connecting the reinforcing body 80 to the first conductive foot 411, the radiation efficiency at mid-to-high frequencies can be improved by 0.4 dB. Therefore, the arrangement of the reinforcing body 80, the first conductive foot 411, and the second conductive foot 421 can also help improve the structural strength at the antenna gap 40a, and at the same time help improve antenna performance.

[0173] In some examples, along the thickness direction Z of the middle frame 40, the orthographic projection of at least one of the first conductive leg 411 and the second conductive leg 421 overlaps with the orthographic projection of the reinforcing body 80. Along the thickness direction Z of the middle frame 40, the reinforcing body 80 can make full use of the space on one side of at least one of the first conductive leg 411 and the second conductive leg 421, so that the structural design of the reinforcing body 80, the first conductive leg 411 and the second conductive leg 421 is compact, which helps to reduce the space occupancy rate of the reinforcing body 80, the first conductive leg 411 and the second conductive leg 421.

[0174] For example, in embodiments where the orthographic projection of the first conductive foot 411 overlaps with the orthographic projection of the reinforcing body 80, the first conductive foot 411 is located between the reinforcing body 80 and the display screen 20. In embodiments where the orthographic projection of the second conductive foot 421 overlaps with the orthographic projection of the reinforcing body 80, the second conductive foot 421 is located between the reinforcing body 80 and the display screen 20. In embodiments where both the orthographic projections of the first conductive foot 411 and the second conductive foot 421 overlap with the orthographic projection of the reinforcing body 80, both the first conductive foot 411 and the second conductive foot 421 are located between the reinforcing body 80 and the display screen 20.

[0175] In some feasible embodiments, the first conductive leg 411 is connected to the reinforcing body 80 via a conductive connector 400. The reinforcing body 80, the conductive connector 400, and the first conductive leg 411 are integrally formed.

[0176] In some feasible implementations, the second conductive leg 421 is connected to the reinforcing body 80 via a conductive connector 400. The reinforcing body 80, the conductive connector 400, and the second conductive leg 421 are integrally formed.

[0177] In some feasible implementations, the conductive connector 400 is a solder block. One of the first conductive leg 411 and the second conductive leg 421 is welded to the reinforcing body 80.

[0178] Figure 26The partial exploded structure of the electronic device 10 is shown schematically. Figure 27 for Figure 26 Enlarged view of the area at point W. See also Figure 26 and Figure 27 As shown, this application embodiment also provides an electronic device 10. The electronic device 10 in this embodiment has the same structure as the electronic device 10 described above, and will not be repeated here. In the electronic device 10 of this embodiment, the reinforcing body 80 is located between the display screen 20 and the back cover 34. The reinforcing body 80 is disposed opposite to the antenna gap 40a. The reinforcing body 80 is spaced apart from the frame 40b, and the reinforcing body 80 is insulated from the frame 40b. The first conductive foot 411 and the second conductive foot 421 are both spaced apart from the reinforcing body 80, and both the first conductive foot 411 and the second conductive foot 421 are insulated from the reinforcing body 80. Along the thickness direction Z of the middle frame 40, one of the first conductive foot 411 and the second conductive foot 421 is located on the side of the reinforcing body 80 facing away from the display screen 20, and the other is located on the side of the reinforcing body 80 facing the display screen 20. At least one of the first conductive foot 411 and the second conductive foot 421 has an overlapping area with the orthographic projection of the reinforcing body 80.

[0179] In some examples, the reinforcement 80 includes a first reinforcement segment 81, a second reinforcement segment 82, and a third reinforcement segment 83. The first reinforcement segment 81 is connected to one end of the third reinforcement segment 83, while the second reinforcement segment 82 is connected to the other end of the third reinforcement segment 83.

[0180] For example, the first conductive foot 411 is located on the side of the first reinforcing section 81 facing the display screen 20. The second conductive foot 421 is located on the side of the second reinforcing section 82 facing away from the display screen 20. The third reinforcing section 83 passes between the first conductive foot 411 and the second conductive foot 421. Alternatively, in some other examples, the first conductive foot 411 may be located on the side of the first reinforcing section 81 facing away from the display screen 20, and the second conductive foot 421 may be located on the side of the second reinforcing section 82 facing the display screen 20.

[0181] For example, the first reinforcing segment 81 and the third reinforcing segment 83 are arranged intersectingly. For instance, the angle between the first reinforcing segment 81 and the third reinforcing segment 83 can be greater than or equal to 90°.

[0182] For example, the second reinforcing segment 82 and the third reinforcing segment 83 are arranged intersectingly. For instance, the angle between the second reinforcing segment 82 and the third reinforcing segment 83 can be greater than or equal to 90°.

[0183] In some examples, Figure 28 A partial exploded view of the electronic device 10 is schematically shown. See also Figure 28As shown, the first conductive foot 411 is electrically connected to the first reinforcing segment 81. Exemplarily, the reinforcing body 80 is a conductor. The electronic device 10 also includes a conductive connector 400. The first conductive foot 411 and the first reinforcing segment 81 are connected via the conductive connector 400. Exemplarily, the first radiator 41 can be a main branch, while the second radiator 42 can be a parasitic branch.

[0184] The way the reinforcing body 80 is electrically connected to the first conductive foot 411 has two advantages. First, the reinforcing body 80 helps to enhance the gap coupling strength between the first radiator 41 and the second radiator 42, thereby increasing the coupling electric field strength between the first radiator 41 and the second radiator 42 and thus improving antenna performance. Second, the connection between the reinforcing body 80 and the first conductive foot 411 helps to improve the connection strength and connection stability between the reinforcing body 80 and the first radiator 41, thereby improving the structural strength of the combination formed by the reinforcing body 80, the insulating filler 90 and the frame 40b.

[0185] For example, the first conductive leg 411 is connected to the first reinforcing section 81 via a conductive connector 400. The reinforcing body 80, the conductive connector 400, and the first conductive leg 411 are integrally formed.

[0186] For example, the conductive connector 400 is a solder block. The first conductive leg 411 is welded to the first reinforcing section 81.

[0187] In some feasible ways, Figure 29 The structure of the electronic device 10 is shown schematically. Figure 30 A partial exploded view of the electronic device 10 is schematically shown. See also Figure 29 and Figure 30 As shown, the electronic device 10 in this embodiment can be a flat-screen mobile phone. The technical solution of this embodiment is also applicable to flat-screen mobile phones. The outer casing 30 includes a middle frame 40 and a back cover 34. The middle frame 40 can be an annular structure. Exemplarily, the middle frame 40 can be a rectangular annular structure. The middle frame 40 includes four borders 40b, namely a left border, a top border, a right border, and a bottom border. For example, an antenna slot 40a can be provided on at least one of the left border and the right border. The two sides of the antenna slot 40a are a first radiator 41 and a second radiator 42, respectively.

[0188] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0189] The embodiments described herein are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or at least two, unless otherwise precisely specified.

[0190] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0191] In this document, the term "multiple" refers to two or at least two. The term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0192] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application. It is also understood that in the embodiments of this application, the sequence number of each process does not imply the order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: The middle frame includes at least one side frame, the side frame includes a first radiator and a second radiator, the adjacent ends of the first radiator and the second radiator are spaced apart to form an antenna slot, the first radiator includes a first conductive leg, and the second radiator includes a second conductive leg. The display screen and the back cover are disposed on opposite sides of the middle frame along the thickness direction of the middle frame; and, A reinforcing body is located between the display screen and the back cover. The reinforcing body is spaced apart from the middle frame. The first conductive foot and the second conductive foot are both spaced apart from the reinforcing body and are opposite to the antenna gap. Along the thickness direction, at least one of the first conductive leg and the second conductive leg is located on the side of the reinforcement facing away from the display screen; An insulating filler that connects the reinforcing body to the frame.

2. The electronic device according to claim 1, characterized in that, Along the thickness direction, both the first conductive foot and the second conductive foot are located on the side of the reinforcement facing away from the display screen.

3. The electronic device according to claim 2, characterized in that, Along the thickness direction, the orthographic projection of at least one of the first conductive leg and the second conductive leg overlaps with the orthographic projection of the reinforcement.

4. The electronic device according to claim 3, characterized in that, Along the thickness direction, the orthographic projections of the first conductive leg and the second conductive leg both overlap with the orthographic projection of the reinforcing body.

5. The electronic device according to claim 2, characterized in that, At least one of the first conductive foot and the second conductive foot is provided with a contoured surface facing the back cover. The contoured surface has the same shape as the inner wall of the back cover, and there is a gap between the contoured surface and the inner wall.

6. The electronic device according to any one of claims 2 to 5, characterized in that, The display screen includes a flexible connecting circuit board with a bend, the flexible connecting circuit board being located on the side of the reinforcing body away from the back cover, and the insulating filler having a relief groove on its surface facing the flexible connecting circuit board, the relief groove being used to avoid the bend.

7. The electronic device according to claim 6, characterized in that, The reinforcing body is embedded in the insulating filler, and the reinforcing body forms the bottom wall of the avoidance groove on at least a portion of the surface of the flexible connection circuit board.

8. The electronic device according to any one of claims 2 to 5, characterized in that, The distance between the reinforcing body and the first conductive foot is 0.5 mm or more; or, the distance between the reinforcing body and the second conductive foot is 0.5 mm or more.

9. The electronic device according to claim 2, characterized in that, The electronic device further includes a conductive connector, wherein one of the first conductive foot and the second conductive foot is electrically connected to the reinforcing body through the conductive connector.

10. The electronic device according to claim 9, characterized in that, The reinforcing body, the conductive connector, and one of the first conductive leg and the second conductive leg are integrally formed; or... The conductive connector is a welding block, and one of the first conductive leg and the second conductive leg is welded to the reinforcing body.

11. The electronic device according to claim 1, characterized in that, Along the thickness direction, one of the first conductive foot and the second conductive foot is located on the side of the reinforcing body facing away from the display screen, and the other is located on the side of the reinforcing body facing the display screen.

12. An electronic device, characterized in that, include: The middle frame includes at least one side frame, the side frame includes a first radiator and a second radiator, the adjacent ends of the first radiator and the second radiator are spaced apart to form an antenna slot, the first radiator includes a first conductive leg, and the second radiator includes a second conductive leg. The display screen and the back cover are disposed on opposite sides of the middle frame along the thickness direction of the middle frame; A reinforcing body is located between the display screen and the back cover. The reinforcing body is spaced apart from the middle frame. The first conductive foot and the second conductive foot are both spaced apart from the reinforcing body and are opposite to the antenna gap. A conductive connector, wherein one of the first conductive leg and the second conductive leg is electrically connected to the reinforcing body through the conductive connector; An insulating filler that connects the reinforcing body to the frame.

13. The electronic device according to claim 12, characterized in that, Along the thickness direction of the middle frame, both the first conductive foot and the second conductive foot are located on the side of the reinforcing body facing the display screen.

14. The electronic device according to claim 13, characterized in that, The reinforcing body, the conductive connector, and one of the first conductive leg and the second conductive leg are integrally formed; or... The conductive connector is a welding block, and one of the first conductive leg and the second conductive leg is welded to the reinforcing body.

15. The electronic device according to any one of claims 12 to 14, characterized in that, Along the thickness direction of the middle frame, the orthographic projection of at least one of the first conductive leg and the second conductive leg overlaps with the orthographic projection of the reinforcing body.

16. The electronic device according to any one of claims 1-5, 7, and 9-14, characterized in that, Along the length of the frame, the first radiator and the second radiator are spaced apart.

17. The electronic device according to any one of claims 1-5, 7, and 9-14, characterized in that, Along the thickness direction, the orthographic projection of the reinforcement is a rectangle.

18. The electronic device according to any one of claims 1-5, 7, and 9-14, characterized in that, The reinforcing body includes a first groove, the opening of which faces the antenna slot, or the opening of which faces away from the antenna slot. The insulating filler covers the first groove and has a first protrusion that matches the shape of the first groove.

19. The electronic device according to any one of claims 1-5, 7, and 9-14, characterized in that, The reinforcing body includes a first groove with its opening facing the antenna slot, a second groove on the bottom wall of the first groove, an insulating filler covering the first groove and the second groove, the insulating filler having a first protrusion matching the shape of the first groove and a second protrusion matching the shape of the second groove.

20. The electronic device according to claim 19, characterized in that, A third groove is provided on the inner wall of at least one of the first radiator and the second radiator, and the insulating filler covers the third groove. The insulating filler has a third protrusion that matches the shape of the third groove.

21. The electronic device according to claim 20, characterized in that, The reinforcing body is arc-shaped; or, the reinforcing body includes a first reinforcing segment and a second reinforcing segment that intersect.

22. The electronic device according to any one of claims 1-5, 7, 9-14, and 20-21, characterized in that, The electronic device further includes a metal middle plate and a motherboard. Along the thickness direction, the metal middle plate and the motherboard are both located between the display screen and the back cover. The first radiator and the second radiator are both electrically connected to the metal middle plate. The motherboard is disposed on the metal middle plate and includes a ground terminal. The metal middle plate is electrically connected to the ground terminal.

Citation Information

Patent Citations

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    CN217823234U