Heat dissipation structure device of electrical engineering equipment

CN119212335APending Publication Date: 2024-12-27YANCHENG TEACHERS UNIV
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Patent Information

Application Number
CN202411512197.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-28
Publication Date
2024-12-27

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Abstract

The invention discloses a heat dissipation structure device for electrical engineering equipment. The heat dissipation structure device comprises an electrical equipment shell, a heat dissipation bottom shell arranged at the bottom of the electrical equipment shell, and an electrical equipment main body arranged in the electrical equipment shell, a heat dissipation opening is formed in the top of the electrical equipment shell. According to the invention, the condition of low heat dissipation efficiency caused by limited heat dissipation area and single air circulation path due to the adoption of a simple heat dissipation structure in the existing electrical engineering equipment is changed, heat dissipation is realized by combining air cooling heat dissipation and water cooling heat dissipation, and the heat dissipation efficiency is improved by adopting a multi-layer staggered spiral heat dissipation fin structure. Air spirally flows in the equipment, the heat exchange effect is greatly improved, meanwhile, in the air cooling heat dissipation process, the heat dissipation guide plate swings left and right to dissipate heat, and the heat dissipation fan moves left and right to dissipate heat, so that the phenomenon of local overheating in the equipment can be avoided, the overall working efficiency is improved, and the service life of the equipment is prolonged. And the overall use effect is better.
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Citation Information

Patent Citations

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    CN211295810U

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