Display module and electronic device

Abstract

The embodiment of the application provides a display module and an electronic device comprising the display module. It relates to the technical field of display. The display module can improve the flat rigidity, improve the bending performance, weaken the light and shadow crease, etc. The display module comprises a display module and a light sensing module. The display module comprises a display screen and a support plate arranged on the back side of the display screen. The light sensing module is arranged on the side of the support plate away from the display screen. The support plate has a light transmission mirror corresponding to the light sensing module. The light transmission mirror and the support plate are integrally formed. The integrally formed support plate and light transmission mirror can improve the strength of the region in the display module, so as to improve the impact resistance and extrusion resistance.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and an electronic device comprising the display module. Background Technology

[0002] With the development of human-computer interaction technology, display has become an important element of human-computer interaction. As a result, foldable screen electronic devices have emerged, such as foldable phones.

[0003] Improving the performance of foldable electronic devices is a major challenge. This includes aspects such as good bendability when bent, high flattening rigidity, and good impact and compression resistance. Summary of the Invention

[0004] This application provides a display module and an electronic device including the display module, such as a foldable electronic device. The purpose is to improve the performance of the electronic device, such as improving its flattening stiffness and bending performance.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, this application provides a display module that can be applied to foldable electronic devices, or it can also be applied to non-foldable flat electronic devices.

[0007] The display module includes a display screen, comprising a first display area and a second display area. The under-screen area corresponding to the first display area is used to house functional modules. A groove is provided below the first display area. The display module also includes a cover plate and an optical adhesive layer. The cover plate is disposed on one side of the display surface of the display screen. The optical adhesive layer is used to fill the groove provided below the first display area. The optical adhesive layer and a light-transmitting lens are stacked. The area below the light-transmitting lens is used to house functional modules. The light-transmitting lens and a support plate are an integral structure. The support plate is disposed below the display screen.

[0008] In the display module involved in this application, external light can be received by the functional module through the cover plate, optical adhesive layer and light-transmitting lens, or the light projected by the functional module can be transmitted to the outside through the light-transmitting lens, optical adhesive layer and cover plate; in this display module, the integrated design of the light-transmitting lens and support plate can improve the impact and compression resistance of the area and improve the overall performance of the display module.

[0009] In one feasible approach, the support plate and the lens are manufactured using an injection molding process.

[0010] For example, it can be produced using a two-color injection molding process.

[0011] In one possible implementation, the light-transmitting lens includes a body portion and an extension portion disposed along the periphery of the body portion and connected to the body portion, the body portion being embedded in a support plate, and the extension portion being located on the side of the support plate away from the display screen.

[0012] Part of the light-transmitting lens is embedded in the support plate, while the other part is set on one side of the support plate. This increases the thickness of the light-transmitting lens, further improving its impact and compression resistance.

[0013] In one possible implementation, the light-transmitting lens also includes a plurality of protrusions located on the extension and arranged around the periphery of the extension; the plurality of protrusions are embedded in the support plate.

[0014] Multiple protrusions embedded in the support plate can further enhance the connection strength between the lens and the support plate.

[0015] In one feasible approach, the lens and the support plate are integrally molded injection-molded structural components.

[0016] In one possible implementation, the display screen includes a bent portion and a non-bent portion connected to the bent portion, the bent portion being capable of bending along a bend line to allow the display screen to switch between an unfolded state and a closed state.

[0017] That is, the display screen is a foldable display screen.

[0018] In one possible implementation, the cover plate includes a first non-bending region, a second non-bending region, a third non-bending region, a first bending region, and a second bending region. The first bending region connects the first non-bending region and the second non-bending region, and the second bending region connects the second non-bending region and the third non-bending region. Both the first bending region and the second bending region are capable of bending along a bending line to switch between an unfolded state and a closed state. The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

[0019] Because the thickness of the first non-bending region in the cover plate is not equal to the thickness of the second non-bending region, the cover plate is designed with an unequal thickness structure. For example, in some scenarios, in order to improve the rigidity of the first non-bending region exposed (that can present the image to the user) in the closed state, the thickness of the first non-bending region is increased. However, due to the unequal thickness design of the cover plate, the bending performance of the first bending region is basically not affected by the increase in the thickness of the first non-bending region.

[0020] Therefore, the display module provided in this application not only has high rigidity in the non-bending area, but also has superior bendability in the bending area.

[0021] In one possible implementation, the thickness of the first non-bending region is greater than the thickness of the second non-bending region.

[0022] This is such that, in the cover plate, the thickness of the first non-bent region corresponding to the first non-bent portion is greater than the thickness of the second non-bent region corresponding to the second non-bent portion. That is, in the cover plate structure, the first non-bent region is a thick region, the second non-bent region is a thin region, and the first bending region connecting the first and second non-bent regions is a thin-thickness transition zone.

[0023] In one possible implementation, the cover plate includes: a substrate and a first buffer layer, the first buffer layer being closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending region is greater than the thickness of the substrate located in the second non-bending region, and / or; the thickness of the first buffer layer located in the first non-bending region is greater than the thickness of the first buffer layer located in the second non-bending region.

[0024] In some implementations, at least one of the substrate or buffer layer in the cover plate can be designed as a structure with unequal thickness.

[0025] In one possible implementation, the cover plate includes a second buffer layer, which includes a first portion and a second portion;

[0026] The first part of the second buffer layer is located in the first non-bending region, and the second part of the second buffer layer is located in the first bending region. The elastic modulus of the first part of the second buffer layer is greater than that of the second part of the second buffer layer.

[0027] To further improve the bendability of the bending area, the second buffer layer can be designed with a structure having unequal elastic moduli.

[0028] In one possible implementation, the light-transmitting mirror is positioned at a location corresponding to the first non-region.

[0029] Secondly, this application provides an electronic device that includes a display module as described in any of the above implementation structures, and also includes a functional module disposed in the under-screen area corresponding to the first display area.

[0030] The electronic device provided in this application includes a display module in any of the above-mentioned implementation structures. The light-transmitting lens and the support plate in the display module are integrally formed, which can improve the impact resistance and compression resistance of the display module.

[0031] In one possible implementation, the functional module includes at least one of a camera module or a fingerprint recognition module.

[0032] Thirdly, this application provides a display module. The display module includes a display screen and a substrate disposed on one side of the display surface of the display screen. The display screen includes a bent portion and a non-bent portion connected to the bent portion. The bent portion can be bent along a bending line so that the display screen can switch between an unfolded state and a closed state. At least one groove is formed on the portion of the substrate corresponding to the bent portion. The groove contains a filler, and the elastic modulus of the filler is less than the elastic modulus of the substrate.

[0033] In the display module provided in this application, the bending performance of the bent portion can be improved by creating grooves in the substrate and filling these grooves with a filler having a low elastic modulus. To improve the rigidity of the non-bending portion, even if the thickness of the substrate is increased, the bending portion can still maintain high flexibility, and the bending performance will not be significantly affected.

[0034] In one possible implementation, the grooves are multiple, and the multiple grooves are arranged in a direction perpendicular to the bend line.

[0035] Arranging multiple grooves filled with filler along a direction perpendicular to the bend line can further improve the bendability of this part.

[0036] In one possible implementation, the substrate has a first surface and a second surface opposite to each other, a groove is disposed on the first surface, and there is a gap between the bottom surface of the groove and the second surface; the non-bent portion includes a first non-bent portion, a second non-bent portion, and a third non-bent portion, the bent portion includes a first bent portion and a second bent portion, the first bent portion connects the first non-bent portion and the second non-bent portion, and the second bent portion connects the second non-bent portion and the third non-bent portion; the substrate includes a first part and a second part, the first part of the substrate corresponds to the first bent portion, and the second part of the substrate corresponds to the second bent portion; when the display screen is in a closed state, the first surface of the first part is closer to the center of the arc-shaped structure formed by the display module than the second surface, and the first surface of the second part is farther away from the center of the arc-shaped structure formed by the display module than the second surface.

[0037] In electronic devices with inward and outward folds, in the inward fold portion, a groove with filling material is positioned close to the center of the arc-shaped structure, which allows the inward fold portion to achieve a smaller bending radius.

[0038] In one possible implementation, a first portion and a second portion of the substrate each have a plurality of grooves; in the first portion of the substrate, the spacing between two adjacent grooves is S1; in the second portion of the substrate, the spacing between two adjacent grooves is S2, and S1 is less than S2.

[0039] The spacing between two adjacent grooves in the inner fold is smaller than the spacing between two adjacent grooves in the outer fold, which allows the inner fold to have better bendability and the outer fold to have better rigidity.

[0040] In one possible implementation, the substrate material includes at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI); or, the filler material includes at least one of optically transparent adhesive (OCA) and optically transparent resin (OCR).

[0041] In one possible implementation, the display module further includes a planarization layer; the planarization layer is disposed on the side of the substrate away from the display screen, such that the planarization layer is an exposed surface layer of the display module; and / or, a planarization layer is disposed between the substrate and the display screen.

[0042] The surface flatness of the display module can be further optimized by using a flattening layer.

[0043] In one feasible approach, the planarization layer material includes an optically transparent resin (OCR).

[0044] In one possible implementation, the display module further includes a cover plate disposed on one side of the display surface of the display screen. The cover plate includes a substrate. The cover plate includes a first non-bent region, a second non-bent region, a third non-bent region, a first bent region, and a second bent region. The first bent region connects the first non-bent region and the second non-bent region, and the second bent region connects the second non-bent region and the third non-bent region. The first non-bent region corresponds to the first non-bent portion, the second non-bent region corresponds to the second non-bent portion, the third non-bent region corresponds to the third non-bent portion, the first bent region corresponds to the first bent portion, and the second bent region corresponds to the second bent portion. The thickness of the first non-bent region is not equal to the thickness of the second non-bent region.

[0045] The thickness of the first non-bending region is not equal to the thickness of the second non-bending region; that is, the cover plate is designed with an unequal thickness structure. For example, in some scenarios, to improve the rigidity of the first non-bending region exposed in the closed state (where the image can be presented to the user), the thickness of the first non-bending region is increased. Through the unequal thickness design of the cover plate, the increased thickness of the first non-bending region will not significantly affect the bendability of the first bending region. The electronic device provided in this embodiment not only reduces light and shadow creases but also improves the rigidity of the non-bending region and the bendability of the bending region.

[0046] In one possible implementation, the thickness of the first non-bending region is greater than the thickness of the second non-bending region.

[0047] This is such that, in the cover plate, the thickness of the first non-bent region corresponding to the first non-bent portion is greater than the thickness of the second non-bent region corresponding to the second non-bent portion. That is, in the cover plate structure, the first non-bent region is a thick region, the second non-bent region is a thin region, and the first bending region connecting the first and second non-bent regions is a thin-thickness transition zone.

[0048] In one possible implementation, the cover plate includes: a substrate and a first buffer layer, the first buffer layer being closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending region is greater than the thickness of the substrate located in the second non-bending region, and / or; the thickness of the first buffer layer located in the first non-bending region is greater than the thickness of the first buffer layer located in the second non-bending region.

[0049] In some implementations, at least one of the substrate or buffer layer in the cover plate can be designed as a structure with unequal thickness.

[0050] In one possible implementation, the cover plate includes a second buffer layer, which includes a first portion and a second portion;

[0051] The first part of the second buffer layer is located in the first non-bending region, and the second part of the second buffer layer is located in the first bending region. The elastic modulus of the first part of the second buffer layer is greater than that of the second part of the second buffer layer.

[0052] To further improve the bendability of the bending area, the second buffer layer can be designed with a structure having unequal elastic moduli.

[0053] Fourthly, this application provides a method for manufacturing a display module, the method comprising:

[0054] A substrate is provided on one side of the display surface of the display screen. The display screen includes a bent portion and a non-bent portion connected to the bent portion. The bent portion can be bent along the bending line so that the display screen can switch between an unfolded state and a closed state. At least one groove is provided on the portion of the substrate corresponding to the bent portion.

[0055] A filler is placed in the groove, and the elastic modulus of the filler is less than that of the substrate.

[0056] In the display module manufactured using the method of this application, since grooves are formed in the substrate and the grooves are filled with fillers with low elastic modulus, in order to improve the rigidity of the non-bending parts, even if the thickness of the display cover and protective layer is large, the bendability of the bending parts will not be affected.

[0057] In one feasible approach, after filling the groove in the substrate with a filler, the preparation method further includes: applying a liquid adhesive to the side of the substrate away from the display screen, and curing the liquid adhesive to form a flat layer on the surface of the display module.

[0058] By coating the surface with liquid adhesive, the surface smoothness of the display module can be improved and the "orange peel" effect can be reduced by utilizing the surface tension of the liquid adhesive.

[0059] In one feasible approach, before placing the substrate on one side of the display surface of the screen, the preparation method further includes: forming a liquid adhesive on one side of the display surface of the screen, and curing the liquid adhesive to form a flat layer on one side of the display surface of the screen.

[0060] For example, by forming a liquid adhesive between the display screen and the display cover, the surface flatness of the display module can be improved by utilizing the tension of the liquid adhesive.

[0061] In one feasible approach, the planarization layer material includes an optically transparent resin (OCR).

[0062] Fifthly, this application provides a display module, which includes: a display screen, a display cover, a protective layer, and a flattening layer. The display cover is disposed on one side of the display surface of the display screen, the protective layer is disposed on the side of the display cover away from the display screen, and a flattening layer is disposed on the side of the protective layer away from the display cover, and / or a flattening layer is disposed between the display cover and the display screen.

[0063] In the display module provided in this application, a flattening layer is provided on the side of the protective layer away from the display cover, and / or a flattening layer is provided on the display surface side of the display screen. The flattening layer can be used to optimize the surface flatness of the display module and reduce the "orange peel" phenomenon.

[0064] In one feasible approach, the planarization layer material includes an optically transparent resin (OCR).

[0065] In feasible manufacturing processes, optically transparent resin OCR is in a liquid state. Liquid optically transparent resin OCR has tension, which can be used to repair uneven surfaces and improve the surface flatness of the display module.

[0066] In one possible implementation, the display module also includes a polarizer disposed between the display cover and the display screen; a flattening layer is disposed between the polarizer and the display cover.

[0067] Sixthly, this application provides a method for manufacturing a display module, the method comprising:

[0068] A display cover is installed on one side of the display surface of the screen;

[0069] A protective layer is provided on the side of the display cover away from the display screen;

[0070] The preparation method, after setting the protective layer, also includes:

[0071] A liquid adhesive is formed on the side of the protective layer away from the display cover, and the liquid adhesive is cured to form a smooth layer on one side of the display screen; or,

[0072] Before setting the display cover, the preparation method also includes:

[0073] Liquid adhesive is applied to one side of the display surface of the screen and cured to form a smooth layer on that side.

[0074] In the method for preparing the display module provided in this application, a liquid adhesive is formed on the surface of the protective layer or on the surface of the display screen, and then the liquid adhesive is cured. The surface tension of the liquid adhesive can be used to repair the uneven surface structure, thereby improving the surface smoothness of the display module.

[0075] In one feasible approach, the liquid adhesive comprises an optically transparent resin (OCR).

[0076] In a seventh aspect, this application provides a display module, which includes a display screen and a support plate disposed on the side of the display screen away from the display surface. The display screen includes a bent portion and a non-bent portion connected to the bent portion. The bent portion can be bent along a bending line to switch the display screen between an unfolded state and a closed state. The support plate includes a first sub-support plate and a second sub-support plate stacked on top of each other. The first sub-support plate includes a first bent segment, and the second sub-support plate includes a second bent segment. The first bent segment corresponds to the bent portion, and the second bent segment corresponds to the first bent segment. The first bent segment includes a plurality of first hollow areas, and the area between two adjacent first hollow areas forms a first non-hollow area. The second bent segment includes a plurality of second hollow areas, and the area between two adjacent second hollow areas forms a second non-hollow area. When the display screen is in the unfolded state, at least a portion of the first hollow areas and the second non-hollow areas are stacked, and at least a portion of the first non-hollow areas are stacked with the second hollow areas.

[0077] In the display module provided in this application, the support plate for supporting the display screen includes a stacked first sub-support plate and a second sub-support plate. Each sub-support plate has a hollow area. When the display module is in a flattened state, the hollow and non-hollow areas of the two sub-support plates are stacked to support each other, thereby increasing the support strength of the support plate for the display module and improving the flattening rigidity of the display module.

[0078] In one possible implementation, the second sub-support plate is positioned away from the display screen relative to the first sub-support plate; when the display screen is closed, at least a portion of the second non-cutout area is separated from the first sub-support plate.

[0079] Since at least a portion of the non-cutout area of ​​the second sub-support plate, which is further away from the display screen, is separated from the first sub-support plate when the display screen is closed, the display screen can have higher bendability, for example, it can achieve a smaller bending radius.

[0080] In one possible implementation, when the display screen is in a closed state, the portion of the second non-cutout area near the bottom of the arc-shaped structure separates from the first sub-support plate.

[0081] In one possible implementation, the second bending segment is provided with a plurality of first slots parallel to the bending line, the area where the first slots are located forms a second hollow area, and the area between two adjacent first slots forms a first non-hollow area; along the extension direction of the first slot, the first slot includes a first segment and a second segment connected to each other, and the slot width of the first segment and the slot width of the second segment are not equal.

[0082] By designing the slot with a non-constant slot width, it is easy for the second sub-support plate to partially separate from the first sub-support plate when bending.

[0083] In one possible implementation, the width of the slot in the first segment is greater than the width of the slot in the second segment; the portion of the second non-cutout area near the second segment protrudes towards the second segment compared to the portion near the first segment, to form a protruding structure; when the display screen is in a closed state, the protruding structure separates from the first sub-support plate.

[0084] If the slot is designed with a structure of unequal width, a protruding structure can be formed. When bent, the protruding structure can be separated from the first sub-support plate.

[0085] In one possible implementation, the groove width of the first segment is greater than that of the second segment; and the first segment is further away from the edge of the second sub-support plate than the second segment.

[0086] This means that the first section of the groove width is brought closer to the center of the second sub-support plate, which improves the bendability of the second sub-support plate.

[0087] In one possible implementation, the first slot also includes a third segment connected to the second segment; the slot width of the third segment and the slot width of the first segment are both greater than the slot width of the second segment.

[0088] This allows for the formation of at least two protruding structures, further enhancing the bendability of the display module.

[0089] In one possible implementation, the second sub-support plate has opposing first and second surfaces arranged in a direction parallel to the bend line; the second bend segment is also provided with a plurality of second slots parallel to the bend line; the first slot extends from the first surface to the second surface, the second slot extends from the second surface to the first surface, and a second non-hollowed-out area is provided between the ends of the first slot and the second slot that are close to each other.

[0090] The hollow structure on the second sub-support plate includes not only the first slot but also the second slot, which improves the bendability.

[0091] In one possible implementation, the first sub-support plate and the second sub-support plate are connected by a connecting structure; the connecting structure is disposed in a second non-hollowed-out area between the ends of the first slot and the second slot that are close to each other.

[0092] In one possible implementation, the second cutout area further includes a third slot, the extension direction of which is consistent with the extension direction of the first slot; and a second non-cutout area is formed between the end of the third slot and the edge of the second sub-support plate.

[0093] In one possible implementation, there are multiple first slots and multiple third slots; the multiple first slots and multiple third slots are arranged alternately along a direction perpendicular to the bend line.

[0094] By utilizing multiple first slots and multiple third slots arranged in an alternating pattern, the bendability of the second sub-support plate can be further optimized.

[0095] In one possible implementation, the second sub-support plate is positioned further away from the display screen than the first sub-support plate; the first non-cutout area includes a fourth slot parallel to the bend line, the length of the fourth slot being greater than the length of the first slot.

[0096] Because the first sub-support plate is closer to the display screen than the second sub-support plate, and the slot length on the first sub-support plate is greater than the slot length on the second sub-support plate, the first sub-support plate has a smaller bending radius.

[0097] In one possible implementation, the first sub-support plate further includes a first non-bending segment, which corresponds to the non-bending portion; the density of the material in the first non-bending segment is less than the density of the material in the first bending segment.

[0098] This reduces the weight of the entire support plate.

[0099] In one possible implementation, the non-bent portion includes a first non-bent portion, a second non-bent portion, and a third non-bent portion; the bent portion includes a first bent portion and a second bent portion; the first bent portion connects the first non-bent portion and the second non-bent portion; the second bent portion connects the second non-bent portion and the third non-bent portion; the display module further includes a cover plate disposed on one side of the display surface of the display screen; the cover plate includes a first non-bent area, a second non-bent area, a third non-bent area, a first bent area, and a second bent area; the first bent area connects the first non-bent area and the second non-bent area; the second bent area connects the second non-bent area and the third non-bent area; the first non-bent area corresponds to the first non-bent portion, the second non-bent area corresponds to the second non-bent portion, the third non-bent area corresponds to the third non-bent portion, the first bent area corresponds to the first bent portion, and the second bent area corresponds to the second bent portion;

[0100] The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

[0101] Because the thickness of the first non-bending region in the cover plate is not equal to the thickness of the second non-bending region, the cover plate is designed with an unequal thickness structure. For example, in some scenarios, in order to improve the rigidity of the first non-bending region exposed (that can present the image to the user) in the closed state, the thickness of the first non-bending region is increased. However, due to the unequal thickness design of the cover plate, the bending performance of the first bending region is basically not affected by the increase in the thickness of the first non-bending region.

[0102] The display module provided in this application not only has high rigidity in the non-bending area, but also has excellent bendability in the bending area.

[0103] In one possible implementation, the thickness of the first non-bending region is greater than the thickness of the second non-bending region.

[0104] This is such that, in the cover plate, the thickness of the first non-bent region corresponding to the first non-bent portion is greater than the thickness of the second non-bent region corresponding to the second non-bent portion. That is, in the cover plate structure, the first non-bent region is a thick region, the second non-bent region is a thin region, and the first bending region connecting the first and second non-bent regions is a thin-thickness transition zone.

[0105] In one possible implementation, the cover plate includes: a substrate and a first buffer layer, the first buffer layer being closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending region is greater than the thickness of the substrate located in the second non-bending region, and / or; the thickness of the first buffer layer located in the first non-bending region is greater than the thickness of the first buffer layer located in the second non-bending region.

[0106] In some implementations, at least one of the substrate or buffer layer in the cover plate can be designed as a structure with unequal thickness.

[0107] In one possible implementation, the cover plate includes a second buffer layer, which includes a first portion and a second portion;

[0108] The first part of the second buffer layer is located in the first non-bending region, and the second part of the second buffer layer is located in the first bending region. The elastic modulus of the first part of the second buffer layer is greater than that of the second part of the second buffer layer.

[0109] To further improve the bendability of the bending area, the second buffer layer can be designed with a structure having unequal elastic moduli.

[0110] Eighthly, this application provides an electronic device including a display module and a pivot mechanism for switching the display module between an unfolded state and a closed state; wherein the pivot mechanism includes a first door panel, a second door panel, a middle door panel, and a telescopic support structure, the first door panel, the second door panel, and the middle door panel are located on the same side of the display module, and the first door panel and the second door panel are disposed opposite each other on both sides of the middle door panel, the telescopic support structure is disposed on the side of the middle door panel facing the display module and is connected to the middle door panel, the telescopic support structure includes an extended state and a compressed state; when the display module is in the unfolded state, the telescopic support structure is in the extended state, and the portion of the telescopic support structure near the display module abuts against the display module; when the display module is in the closed state, the telescopic support structure is in the compressed state.

[0111] In the electronic device disclosed in this application, a telescopic support structure is provided on the side of the middle door panel facing the display module. When the display module is in the flattened state, the telescopic support structure in the extended state can abut against the display module to support it. This allows the display module in the flattened state to have sufficient flattening rigidity and flatness. In addition, when the display module is in the closed state, the telescopic support structure is compressed, which can provide space for the bending display module and ensure the bending performance of the display module.

[0112] In one possible implementation, when the display module is in the closed state, the telescopic support structure is in a compressed state, and the portion of the telescopic support structure closest to the display module is separated from the display module.

[0113] When the telescopic support structure is in a compressed state, it separates from the display module and does not provide support to the display module, thus making the display module more flexible.

[0114] In one possible implementation, the telescopic support structure includes a support member made of shape memory material, which is connected to the middle door panel; at a first temperature, the support member is in an elongated state, with the end of the support member away from the middle door panel abutting against one side of the display module; at a second temperature, the support member is in a compressed state, with the end of the support member away from the middle door panel separating from the display module.

[0115] This embodiment uses a memory material to create a telescopic support structure, which utilizes the memory material to elongate and shorten as the temperature changes.

[0116] In one possible implementation, the telescopic support structure further includes at least one elastic element connected to the intermediate door panel; when the temperature applied to the support element changes from a first temperature to a second temperature, the elastic element in a stretched state causes the support element to switch to a compressed state; when the temperature applied to the support element changes from the second temperature to the first temperature, the support element elongates, causing the elastic element to be in a stretched state.

[0117] In one feasible approach, there are multiple elastic elements, which are spaced apart along the periphery of the support.

[0118] Arranging multiple elastic elements at intervals along the periphery of the support can improve the stability of the middle door panel's lifting and lowering.

[0119] In one feasible embodiment, the telescopic support structure includes a piezoelectric layer, a first electrode and a second electrode, and a protective layer; the piezoelectric layer is stacked between the first electrode and the second electrode, with the first electrode being closer to the middle door panel than the second electrode, and the protective layer is disposed on the side of the second electrode away from the piezoelectric layer; under a first voltage, the piezoelectric layer is in an elongated state, and the protective layer abuts against one side of the display module; under a second voltage, the piezoelectric layer is in a compressed state, and the protective layer separates from the display module.

[0120] This embodiment uses piezoelectric materials to create a telescopic support structure, which can be extended or shortened under voltage control.

[0121] In one possible implementation, the display module includes a display screen, a display cover, and a support plate. The display cover is disposed on one side of the display surface of the display screen, and the support plate is disposed on the back side of the display screen. The support plate has a hollow structure at the position opposite to the middle door panel. The telescopic support structure is in an extended state, and the portion of the telescopic support structure near the display module abuts against the portion of the support plate with the hollow structure.

[0122] In one possible implementation, the display module includes a display screen and a cover plate disposed on one side of the display surface of the display screen. The cover plate includes a first non-bent area, a second non-bent area, a third non-bent area, a first bent area, and a second bent area. The first bent area connects the first non-bent area and the second non-bent area, and the second bent area connects the second non-bent area and the third non-bent area. The first non-bent area corresponds to the first non-bent portion, the second non-bent area corresponds to the second non-bent portion, the third non-bent area corresponds to the third non-bent portion, the first bent area corresponds to the first bent portion, and the second bent area corresponds to the second bent portion.

[0123] The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

[0124] Because the thickness of the first non-bending region in the cover plate is not equal to the thickness of the second non-bending region, the cover plate is designed with an unequal thickness structure. For example, in some scenarios, in order to improve the rigidity of the first non-bending region exposed (that can present the image to the user) in the closed state, the thickness of the first non-bending region is increased. However, due to the unequal thickness design of the cover plate, the bending performance of the first bending region is basically not affected by the increase in the thickness of the first non-bending region.

[0125] The display module provided in this application not only has high rigidity in the non-bending area, but also has excellent bendability in the bending area.

[0126] In one possible implementation, the thickness of the first non-bending region is greater than the thickness of the second non-bending region.

[0127] This is such that, in the cover plate, the thickness of the first non-bent region corresponding to the first non-bent portion is greater than the thickness of the second non-bent region corresponding to the second non-bent portion. That is, in the cover plate structure, the first non-bent region is a thick region, the second non-bent region is a thin region, and the first bending region connecting the first and second non-bent regions is a thin-thickness transition zone.

[0128] In one possible implementation, the cover plate includes: a substrate and a first buffer layer, the first buffer layer being closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending region is greater than the thickness of the substrate located in the second non-bending region, and / or; the thickness of the first buffer layer located in the first non-bending region is greater than the thickness of the first buffer layer located in the second non-bending region.

[0129] In some implementations, at least one of the substrate or buffer layer in the cover plate can be designed as a structure with unequal thickness.

[0130] In one possible implementation, the cover plate includes a second buffer layer, which includes a first portion and a second portion;

[0131] The first part of the second buffer layer is located in the first non-bending region, and the second part of the second buffer layer is located in the first bending region. The elastic modulus of the first part of the second buffer layer is greater than that of the second part of the second buffer layer.

[0132] To further improve the bendability of the bending area, the second buffer layer can be designed with a structure having unequal elastic moduli.

[0133] Ninthly, this application provides a pivot mechanism capable of switching a display module between an unfolded state and a closed state. The pivot mechanism includes a first door panel, a second door panel, a middle door panel, and a telescopic support structure. The first door panel, the second door panel, and the middle door panel are located on the same side of the display module, and the first door panel and the second door panel are arranged opposite each other on both sides of the middle door panel. The telescopic support structure is arranged on the side of the middle door panel facing the display module and is connected to the middle door panel. The telescopic support structure includes an extended state and a compressed state. When the display module is in the unfolded state, the telescopic support structure is in the extended state, and the portion of the telescopic support structure near the display module abuts against the display module. When the display module is in the closed state, the telescopic support structure is in the compressed state.

[0134] In the pivot mechanism provided in this application, a telescopic support structure is provided on the side of the middle door panel facing the display module. When the display module is in the flattened state, the telescopic support structure in the extended state can abut against the display module to support it. This allows the display module in the flattened state to have sufficient flattening rigidity and flatness. In addition, when the display module is in the closed state, the telescopic support structure is compressed, which can provide space for the bending display module and ensure the bending performance of the display module.

[0135] In one possible implementation, the telescopic support structure includes a support member made of shape memory material, which is connected to the middle door panel; at a first temperature, the support member is in an elongated state, and the end of the support member away from the middle door panel is used to abut against one side of the display module; at a second temperature, the support member is in a compressed state, and the end of the support member away from the middle door panel is used to separate from the display module.

[0136] When the telescopic support structure is in a compressed state, it separates from the display module and does not provide support to the display module, thus making the display module more flexible.

[0137] In one possible implementation, the telescopic support structure further includes at least one elastic element connected to the intermediate door panel; when the temperature applied to the support element changes from a first temperature to a second temperature, the elastic element in a stretched state causes the support element to switch to a compressed state; when the temperature applied to the support element changes from the second temperature to the first temperature, the support element elongates, causing the elastic element to be in a stretched state.

[0138] In one feasible approach, there are multiple elastic elements, which are spaced apart along the periphery of the support.

[0139] In one feasible embodiment, the telescopic support structure includes a piezoelectric layer, a first electrode and a second electrode, and a protective layer; the piezoelectric layer is stacked between the first electrode and the second electrode, with the first electrode being closer to the display module than the second electrode, and the protective layer is disposed on the side of the first electrode away from the piezoelectric layer; under a first voltage, the piezoelectric layer is in an elongated state, and the protective layer abuts against one side of the display module; under a second voltage, the piezoelectric layer is in a compressed state, and the protective layer separates from the display module.

[0140] In a tenth aspect, this application provides a display screen that can be used in foldable electronic devices, or it can also be used in non-foldable flat electronic devices.

[0141] The display screen includes: a substrate, a driving array structure disposed on one side of the substrate, the driving array structure including transistors, each transistor including: a first electrode, a second electrode, a channel layer, and a gate; the channel layer is located on one side of the substrate, the gate is located on the side of the channel layer away from the substrate, and the channel layer and the gate are electrically isolated by a gate dielectric layer; an interlayer dielectric layer is disposed on the side of the gate away from the channel layer, the first electrode and the second electrode respectively penetrate the interlayer dielectric layer and the gate dielectric layer, and are electrically connected to the channel layer; wherein, the interlayer dielectric layer includes: a stacked inorganic dielectric layer and a first organic dielectric layer; the stacking direction of the inorganic dielectric layer and the first organic dielectric layer is consistent with the stacking direction of the substrate and the driving array structure.

[0142] In the display screen provided in this application, the interlayer dielectric layer includes not only an inorganic dielectric layer but also an organic dielectric layer. Compared with the inorganic dielectric layer, the organic dielectric layer has elastic deformation capability. When the display screen is subjected to impact and compression, it can improve the impact and compression resistance performance, reduce the risk of cracks and structural collapse in the interlayer dielectric, reduce the risk of short circuit between the source / drain and the gate, and even if cracks appear in the interlayer dielectric, the elastic deformation capability of the organic dielectric layer may make the cracks disappear.

[0143] In one feasible approach, the gate is covered by a first organic dielectric layer.

[0144] Because the gate is covered by an organic dielectric layer, the risk of short circuits between the gate and the source / drain due to structural collapse can be further reduced.

[0145] In one possible implementation, the first organic medium layer comprises an organic polymer obtained by in-situ polymerization of at least one first organic compound and at least one second organic compound; the organic polymer comprises a polyimide structure.

[0146] In feasible process procedures, an organic dielectric layer can be prepared using at least one first organic compound and at least one second organic compound.

[0147] In one possible implementation, the gate is electrically isolated from the first electrode by a first organic dielectric layer.

[0148] In one possible implementation, the interlayer dielectric layer further includes a second organic dielectric layer, with the inorganic dielectric layer stacked between the first and second organic dielectric layers.

[0149] If multiple organic and inorganic dielectric layers are included, the multiple organic and inorganic dielectric layers are stacked alternately.

[0150] In one feasible manner, the thickness of the inorganic dielectric layer is less than or equal to the thickness of the first organic dielectric layer.

[0151] This can improve the elastic deformation capacity of the entire interlayer medium.

[0152] In one possible implementation, the display screen further includes: a light-emitting device layer disposed on the side of the driving array structure away from the substrate; a pixel anode layer disposed on the side of the interlayer dielectric layer away from the substrate, and a first electrode electrically connected to the light-emitting device layer through the pixel anode layer.

[0153] Eleventhly, this application provides a method for manufacturing a display screen, the method comprising:

[0154] A trench layer is formed on one side of the substrate;

[0155] A gate dielectric layer and a gate are sequentially formed away from the substrate in the channel layer, so that the gate dielectric layer electrically isolates the gate and the channel layer;

[0156] An interlayer dielectric layer is formed on the side of the gate away from the channel layer. The interlayer dielectric layer includes stacked inorganic dielectric layers and organic dielectric layers.

[0157] A first electrode and a second electrode are formed, such that both the first electrode and the second electrode penetrate the interlayer dielectric layer and the gate dielectric layer, and are electrically connected to the channel layer.

[0158] In the display screen fabricated using the method provided in this application, since the interlayer dielectric layer includes an organic dielectric layer and an inorganic dielectric layer, the elastic deformation capability of the organic dielectric layer can be used to improve the impact and compression resistance of the display screen, reduce the risk of cracks and structural collapse in the interlayer dielectric, reduce the risk of short circuits between the source / drain and the gate, and even if cracks appear in the interlayer dielectric, the elastic deformation capability of the organic dielectric layer may cause the cracks to disappear.

[0159] In one feasible manner, the organic dielectric layer is prepared by: using a vapor deposition process to obtain the organic dielectric layer.

[0160] The organic dielectric layer can be prepared using a vapor deposition process, which does not complicate the manufacturing process of the display screen.

[0161] In one feasible manner, the preparation of the organic dielectric layer includes:

[0162] A first compound and a second compound are deposited on one side of the gate using a vapor deposition process;

[0163] Annealing the first and second compounds causes in-situ polymerization of the first and second compounds to form an organic polymer, wherein the organic polymer includes a polyimide structure.

[0164] In one possible implementation, forming an interlayer dielectric layer on the side of the gate away from the channel layer includes: forming an organic dielectric layer on the side of the gate away from the channel layer, such that the gate and the first electrode, and the gate and the second electrode, are electrically isolated by the organic dielectric layer.

[0165] By using an organic dielectric layer to isolate the source / drain from the gate, the risk of short circuit between the source / drain and the gate can be further reduced.

[0166] In a twelfth aspect, this application provides an electronic device including a display module and a housing. The display module includes a display screen, which includes a display area, an edge bending area located at the outer edge of the display area, and a lower frame area connected to the edge bending area. The lower frame area is located on the back side of the display area. The edge bending area has a suspended area formed after bending on the side near the center of the arc structure. At least a portion of the suspended area is filled by a first filling layer.

[0167] In the electronic device involved in this application, since the suspended area near the center of the arc-shaped structure in the edge bending region is filled with a first filling layer, the strength of the edge bending region can be improved, and the resistance to compression and impact can be enhanced.

[0168] In one possible implementation, the display module also includes a display cover plate with a gap between the display cover plate and the edge bending area of ​​the display screen, and a second filler layer is filled in the gap.

[0169] The second filler layer can further enhance the strength of the edge bending area and improve its bending and impact resistance.

[0170] In one possible implementation, the elastic modulus of the first filler layer is greater than that of the second filler layer.

[0171] This ensures the flexibility of the bendable area at the edges. Attached Figure Description

[0172] Figure 1 This is a structural diagram of a foldable electronic device;

[0173] Figure 2 This is a structural diagram of another type of foldable electronic device;

[0174] Figure 3 A structural diagram of a display module provided in an embodiment of this application;

[0175] Figure 4 A structural diagram of a light-transmitting lens provided in an embodiment of this application;

[0176] Figure 5 A structural diagram of a support plate with a light-transmitting lens provided in an embodiment of this application;

[0177] Figure 6 Structural diagrams of two types of light-transmitting lenses provided in embodiments of this application;

[0178] Figure 7 A structural diagram of a support plate with a light-transmitting lens provided in an embodiment of this application;

[0179] Figure 8 This is a structural diagram of a display cover or protective layer in a display module;

[0180] Figure 9 This is a structural diagram of a display module;

[0181] Figure 10 This application provides a structural diagram of a display cover or protective layer in a display module.

[0182] Figure 11 A structural diagram of a substrate in a display cover or protective layer provided in an embodiment of this application;

[0183] Figure 12 A structural diagram of a display module when bent, provided in an embodiment of this application;

[0184] Figure 13A , Figure 13B , Figure 13CA structural diagram of a substrate provided in an embodiment of this application;

[0185] Figure 14A , Figure 14B , Figure 14C A structural diagram of a substrate provided in an embodiment of this application;

[0186] Figure 15A and Figure 15B A structural diagram of a substrate provided in an embodiment of this application;

[0187] Figure 16A , Figure 16B , Figure 16C and Figure 16D A structural diagram of a substrate provided in an embodiment of this application;

[0188] Figure 17A , Figure 17B and Figure 17C A structural diagram of a substrate provided in an embodiment of this application;

[0189] Figure 18A and Figure 18B A structural diagram of a substrate provided in an embodiment of this application;

[0190] Figure 19 A structural diagram of a display module when bent, provided in an embodiment of this application;

[0191] Figure 20A , Figure 20B , Figure 20C A structural diagram of a display module provided in an embodiment of this application;

[0192] Figure 21 A structural diagram of a display module provided in an embodiment of this application;

[0193] Figure 22 A structural diagram of a display module provided in an embodiment of this application;

[0194] Figure 23 A structural diagram of a display module provided in an embodiment of this application;

[0195] Figure 24 A structural diagram of a display module provided in an embodiment of this application;

[0196] Figure 25 A flowchart illustrating the fabrication of a display module is provided in this application embodiment.

[0197] Figures 26A to 26D This is a cross-sectional view of the process structure after each step in a display module manufacturing method provided in this application embodiment is completed;

[0198] Figure 27 This is a structural diagram of a display module;

[0199] Figure 28 A structural diagram of a display module provided in an embodiment of this application;

[0200] Figure 29 A structural diagram of a display module when bent, provided in an embodiment of this application;

[0201] Figure 30 A structural diagram of a display module provided in an embodiment of this application;

[0202] Figure 31 A structural diagram of a display module provided in an embodiment of this application;

[0203] Figure 32 A structural diagram of a display module provided in an embodiment of this application;

[0204] Figure 33 A structural diagram of a display module provided in an embodiment of this application;

[0205] Figure 34 A structural diagram of a support plate and a display screen provided in an embodiment of this application;

[0206] Figure 35 A structural diagram of a support plate provided in an embodiment of this application;

[0207] Figure 36 A three-dimensional structural diagram of a support plate provided in an embodiment of this application;

[0208] Figure 37 for Figure 35 LL cross-section view;

[0209] Figure 38 A structural diagram of a support plate provided in an embodiment of this application;

[0210] Figure 39 A three-dimensional structural diagram of a support plate provided in an embodiment of this application;

[0211] Figure 40 for Figure 38 TT cross-section;

[0212] Figure 41 A structural diagram of a support plate provided in an embodiment of this application;

[0213] Figure 42 This application provides a structural diagram of a support plate in both its flat and bent states, as shown in the embodiments of the present application.

[0214] Figure 43 A structural diagram of a support plate provided in an embodiment of this application;

[0215] Figure 44 A structural diagram of a support plate provided in an embodiment of this application;

[0216] Figure 45 A structural diagram of a support plate provided in an embodiment of this application;

[0217] Figure 46 A structural diagram of a support plate provided in an embodiment of this application;

[0218] Figure 47 A structural diagram of a support plate provided in an embodiment of this application;

[0219] Figure 48 This is a schematic diagram showing the connection relationship between a display module and a rotating shaft mechanism when the module is flattened.

[0220] Figure 49 This is a schematic diagram showing the connection relationship between a display module and a rotating shaft mechanism when the module is bent.

[0221] Figure 50 This is a structural diagram of a foldable electronic device;

[0222] Figure 51 A schematic diagram showing the connection relationship between a display module, a pivot mechanism, and a telescopic support structure when the module is unfolded, as provided in an embodiment of this application.

[0223] Figure 52 A schematic diagram illustrating the connection relationship between a display module, a rotating shaft mechanism, and a telescopic support structure when the module is bent, as provided in an embodiment of this application.

[0224] Figure 53 A schematic diagram illustrating the connection relationship between a display module, a rotating shaft mechanism, and a telescopic support structure when the module is bent, as provided in an embodiment of this application.

[0225] Figure 54 A structural diagram of a telescopic support structure for a display module when it is unfolded, provided in an embodiment of this application;

[0226] Figure 55 This application provides a structural diagram of a telescopic support structure for a display module when it is bent, according to an embodiment of the present application.

[0227] Figure 56 A structural diagram of a telescopic support structure for a display module when it is unfolded, provided in an embodiment of this application;

[0228] Figure 57 A structural diagram of a telescopic support structure for a display module when it is unfolded, provided in an embodiment of this application;

[0229] Figure 58This application provides a structural diagram of a telescopic support structure for a display module when it is bent, according to an embodiment of the present application.

[0230] Figure 59 A schematic diagram illustrating the connection relationship between a display module and a telescopic support structure provided in an embodiment of this application;

[0231] Figure 60 This is a structural diagram of a support plate;

[0232] Figure 61 This is a structural diagram of a support plate;

[0233] Figure 62 This is a structural diagram of a display screen;

[0234] Figure 63 This is a structural diagram of a display screen;

[0235] Figure 64 A structural diagram of a display screen provided in an embodiment of this application;

[0236] Figure 65 A structural diagram of a display screen provided in an embodiment of this application;

[0237] Figure 66 This is a structural diagram of a display screen in the prior art;

[0238] Figure 67 A structural diagram of a display screen provided in an embodiment of this application;

[0239] Figures 68A to 68I This is a cross-sectional view of the process structure after each step in a display screen manufacturing method provided in this application embodiment;

[0240] Figure 69 This is a structural diagram of a display module when the display screen is unfolded.

[0241] Figure 70 This is a structural diagram of a display module when the display screen is bent.

[0242] Figure 71 This is a schematic diagram illustrating the connection relationship between a display module and a housing, provided in an embodiment of this application.

[0243] Figure 72 This is a schematic diagram illustrating the connection relationship between a display module and a housing, provided in an embodiment of this application.

[0244] Figure 73 This is a schematic diagram illustrating the connection relationship between a display module and a housing, provided in an embodiment of this application.

[0245] Figure 74 This is a schematic diagram illustrating the connection relationship between a display module and a housing, provided in an embodiment of this application.

[0246] Figure 75 This is a structural diagram of a multi-fold display module in a flattened state;

[0247] Figure 76 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0248] Figure 77 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0249] Figure 78 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0250] Figure 79 A structural diagram of a multi-fold display module in a folded state, provided in an embodiment of this application;

[0251] Figure 80 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0252] Figure 81 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0253] Figure 82 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0254] Figure 83 A structural diagram of a multi-fold display module provided in an embodiment of this application;

[0255] Figure 84 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0256] Figure 85 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0257] Figure 86 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0258] Figure 87 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0259] Figure 88 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0260] Figure 89 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0261] Figure 90 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0262] Figure 91 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0263] Figure 92 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0264] Figure 93 This is a structural diagram of a multi-fold display module with the cover plate in a flattened state, provided in an embodiment of this application.

[0265] Figure 94 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0266] Figure 95 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0267] Figure 96 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0268] Figure 97 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0269] Figure 98 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0270] Figure 99 A structural diagram of a multi-fold display module in a flattened state, provided in an embodiment of this application;

[0271] Figure 100 This is a structural diagram of a multi-fold display module in a flattened state, provided as an embodiment of this application. Detailed Implementation

[0272] The specific embodiments involved in this application are described in detail below with reference to the accompanying drawings.

[0273] This application provides an electronic device, which may be a foldable electronic device.

[0274] The electronic device may include mobile phones, tablets, smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, and other electronic products with display functions. This application does not impose any special limitations on the specific form of the aforementioned electronic devices with display functions.

[0275] For ease of explanation, the following uses a mobile phone as an example to illustrate the structure of this electronic device.

[0276] Figure 1 A structural diagram of a foldable screen phone is shown, illustrating a three-screen foldable phone. This three-screen foldable phone may include a first housing 100a, a second housing 100b, and a third housing 100c, as well as a display module 11. The display module 11 may continuously cover the first housing 100a, the second housing 100b, and the third housing 100c. The foldable screen phone may also include a first hinge mechanism and a second hinge mechanism.

[0277] The first housing 100a and the second housing 100b are disposed on both sides of the first rotating shaft mechanism and are respectively connected to the first rotating shaft mechanism. The first rotating shaft mechanism can move so that the first housing 100a and the second housing 100b are folded or unfolded relative to each other, thereby realizing the flattening and closing of the display module 11 disposed on the first housing 100a and the second housing 100b.

[0278] The second housing 100b and the third housing 100c are disposed on both sides of the second rotating shaft mechanism and are respectively connected to the second rotating shaft mechanism. The second rotating shaft mechanism can move so that the second housing 100b and the third housing 100c are folded or unfolded relative to each other, thereby realizing the flattening and closing of the display module 11 disposed on the second housing 100b and the third housing 100c.

[0279] Figure 2 The diagram shows the structure of a dual-screen foldable phone, which includes a first housing 100a, a second housing 100b, a display module 11, and a hinge mechanism. The display module 11 can continuously cover the first housing 100a and the second housing 100b. The first housing 100a and the second housing 100b are located on both sides of the hinge mechanism and are respectively connected to the hinge mechanism. Under the action of the hinge mechanism, the display module 11 can also be flattened and closed.

[0280] Foldable electronic devices can be unfolded into a flat state, folded into a closed state, or exist in an intermediate state between the two. Foldable electronic devices have at least two states: a flat state and a closed state. In some cases, a third state, an intermediate state between the flat and closed states, may be further included. The intermediate state is not unique; it can be any one or more states between the flat and closed states of the electronic device.

[0281] The above Figure 1 and Figure 2 The examples illustrate three-screen and dual-screen foldable electronic devices. The foldable electronic devices described in this application can also be devices with more screens, such as four-screen foldable, five-screen foldable, and other similar devices.

[0282] Whether Figure 1 and Figure 2 Whether it's a foldable or a non-foldable candybar electronic device, functional modules are located on the back of the display module. For example, a camera module is located on the back of the display module to enable functions such as taking photos and videos; the camera module contains an image sensor. Another example is a fingerprint recognition module located on the back of the display module to enable fingerprint recognition on the electronic device.

[0283] The image clarity of a camera module is related to the light transmittance of a display module. To improve the light transmittance of the display module, the portion of the display module corresponding to the camera module can be cut off to improve image clarity.

[0284] The fingerprint recognition module is used to emit and receive ambient light, which places certain requirements on the light transmittance of the display module. Similarly, to improve the light transmittance of the display module, the portion of the display module corresponding to the fingerprint recognition module can be cut off to increase the photosensitivity.

[0285] In the examples above, the method of cutting away material was used to improve the light transmittance of the display module. This can easily lead to a decrease in the impact and compression resistance of the camera area and ambient light area of ​​the display module. For example, in some electronic devices, the impact resistance of these areas of the display module can only reach 1 kg, which is far from the required 4.5 kg, and will seriously affect the reliability of the entire display module.

[0286] like Figure 3 This application provides a display module structure that, while ensuring high light transmittance in the camera area and ambient light area, also improves the impact and compression resistance of these areas.

[0287] See Figure 3The display module 11 may include a support bracket 111, a display panel 112, and a cover plate 110. The support bracket 111 and the cover plate 110 are disposed on opposite sides of the display panel 112. The support bracket 111 is located on the back side of the display panel 112 and serves as a support structure to support the display panel 112. The cover plate 110 is located on the display surface side of the display panel 112 and serves to protect the display panel 112 and reduce the probability of the display panel 112 being damaged.

[0288] The display surface of the display screen 112 in this application embodiment is the side of the display screen 112 used to display images to the user, while the back side of the display screen 112 refers to the side opposite to the display surface of the display screen 112.

[0289] The display screen 112 includes a first display area and a second display area. The under-screen area corresponding to the first display area is used to set up functional modules, such as a camera module, or the functional module can be a fingerprint recognition module or other types of photosensitive devices.

[0290] like Figure 3 A groove is provided below the first display area of ​​the display screen 112, and an optical adhesive layer 500 is provided in the groove. The optical adhesive layer 500 and the light-transmitting lens 400 are stacked. The functional module 300 is provided below the light-transmitting lens 400.

[0291] The light-transmitting mirror 400 and the support plate 111 are an integral structure. For example, the light-transmitting mirror 400 and the support plate 111 can be manufactured as an integral unit using an insert module injection molding process.

[0292] The optical adhesive layer 500 and the light-transmitting mirror 400 allow external light to be sensed by the functional module 300, or the light emitted by the functional module 300 can pass through the light-transmitting mirror 400, the optical adhesive layer 500, and the cover plate 110 to the outside. Furthermore, since the light-transmitting mirror 400 and the support plate 111 are integrally molded, the impact and compression resistance of this area can be improved. For example, the impact resistance of these areas can reach over 4.5 kg.

[0293] In some examples of this application, Figure 3 The optical adhesive layer 500 can be at least one of optically transparent adhesive OCA and optically transparent resin OCR.

[0294] To further enhance the connection strength and bonding force between the light-transmitting mirror 400 and the support plate 111, such as... Figure 4 and Figure 5 As shown, Figure 4 This is the three-dimensional structure of the light-transmitting lens 400 corresponding to the camera module shown in the embodiments of this application. Figure 5It is Figure 4 The diagram shows the structure of the light-transmitting mirror 400 installed in the support plate 111.

[0295] like Figure 4 and Figure 5 The light-transmitting lens 400 includes a main body 401 and an extension 402 integrated with the main body 401. The extension 402 also has a plurality of protrusions 403, which are arranged around the periphery of the extension 402 and spaced apart along the circumference of the extension 402. The main body 401, the extension 402, and the protrusions 403 are an integral structural component.

[0296] See Figure 5 The main body 401 and the protrusion 403 are disposed within the support plate 111, and the extension 402 is located on one side of the support plate 111, for example, the extension 402 is disposed on the side of the support plate 111 away from the display screen 112.

[0297] The above Figure 4 and Figure 5 The structure of the light-transmitting mirror 400 shown not only enhances the adhesion between the support plate 111 and the light-transmitting mirror 400, but also increases the thickness of the light-transmitting mirror 400 by setting the extension 402 on the side of the support plate 111 away from the display screen 112, which can further improve the display module's resistance to compression and impact.

[0298] In electronic devices with fingerprint recognition modules, the fingerprint recognition module not only needs to receive external light, but also transmits light to the outside world, such as... Figure 6 As shown, a first light-transmitting mirror 400A and a second light-transmitting mirror 400B are provided on the support plate 111. The first light-transmitting mirror 400A can be a lens that receives external light, and the second light-transmitting mirror 400B can be a lens that transmits light to the outside.

[0299] The first lens 400A and the second lens 400B can adopt the above-mentioned... Figure 6 The light-transmitting mirror structure shown includes, for example, a main body 401 and an extension 402 integrated with the main body 401. The extension 402 also includes a plurality of protrusions 403, which are arranged around the periphery of the extension 402.

[0300] See Figure 7 , Figure 7 It is Figure 6 The diagram shows the structure of the first light-transmitting lens 400A and the second light-transmitting lens 400B disposed in the support plate 111. The body portion 401 and the protrusion 403 are embedded in the support plate 111, and the extension portion 402 is located on the side of the support plate 111 away from the display screen 112.

[0301] The light-transmitting lens in this application example can not only enhance the adhesion between the support plate 111 and the light-transmitting lens 400, but also increase the thickness of the light-transmitting lens, further improving its resistance to compression and impact, and reducing film printing problems in these areas.

[0302] In some examples, such as Figure 3 The cover plate 110 may include a display cover plate 113 and a protective layer 114. The display cover plate 113 is disposed on one side of the display surface of the display screen 112, and the protective layer 114 is disposed on the side of the display cover plate 113 away from the display screen 112. Both the display cover plate 113 and the protective layer 114 are light-transmitting. Light transmitted from the display surface of the display screen 112 can pass through the display cover plate 113 and the protective layer 114 and be received by the user.

[0303] In some usage scenarios, when the protective layer 114 is damaged or falls off, the display cover 113 can still protect the display screen 112.

[0304] In other examples, cover 110 may also include other membrane structures, or cover 110 may include one of cover 113 and protective layer 114.

[0305] In this embodiment, the display panel 112 can be a flexible display, and the cover plate 110 can be a flexible structure to meet the folding requirements.

[0306] Display screen 112 may include, but is not limited to, organic light-emitting diode (OLED) displays, active-matrix organic light-emitting diode (AMOLED) displays, mini organic light-emitting diode (MLED) displays, micro organic light-emitting diode (MOLED) displays, quantum dot light-emitting diode (QLED) displays, etc.

[0307] In some examples, in display module 11, display cover 113 and protective layer 114 can be as follows: Figure 8As shown, it includes: a substrate 11D, a hard coating layer 11E, and an adhesive layer 11F. The hard coating layer 11E is disposed on one side of the substrate 11D, and the film structure including the hard coating layer 11E and the substrate 11D can be bonded to other structures through the adhesive layer 11F.

[0308] like Figure 9 The display cover 113 can be bonded to the display surface of the display screen 112 through the adhesive layer 11F in the display cover 113, and the protective layer 114 can be bonded to the hardened layer 11E of the display cover 113 through the adhesive layer 11F in the protective layer 114.

[0309] exist Figure 8 and Figure 9 In the structure of the display cover 113 or protective layer 114 shown, the elastic modulus of the substrate 11D is 1 GPa to 15 GPa and the thickness is 25 μm to 75 μm, and the thickness of the hardening layer 11E is 3 μm to 10 μm.

[0310] When this display module 11 is applied in a foldable electronic device, for example, Figure 1 The three-fold, or, Figure 2 In the two-fold device, although the bending performance of the bending part can be met, the stiffness of the non-bending part is low, resulting in poor reliability and scratch resistance of the display module. In addition, since the surface of each layer of material itself has a certain degree of roughness, it is difficult to cover the unevenness of the overall stack of display modules, which will cause obvious display unevenness, i.e., "orange peel texture" phenomenon, to be observed in the display module when the screen is off.

[0311] To improve the rigidity of non-bending sections and alleviate the "orange peel" effect, in some feasible structures, additional [materials / materials] can be added. Figure 8 and Figure 9 The thickness of the substrate 11D and the hardening layer 11E in the structure shown will reduce the bendability of the bent part. For example, it may cause wrinkles or creases in the bent part, thus reducing the display effect of the display module.

[0312] This application provides some display module structures that, while maintaining the bendability of the bent portion, can also improve the rigidity of the non-bendable portion, enhance the reliability of the non-bendable portion of the foldable screen and the scratch resistance of the surface protective film, as well as improve flatness and reduce the "orange peel" phenomenon.

[0313] like Figure 10 As shown, Figure 10 This application embodiment shows a structural diagram of the display cover plate 113 or protective layer 114 in the display module 11, and shows the structural diagram when it is in a flattened state. Figure 11 The diagram shown is a structural diagram of substrate 11D. Figure 12 It is Figure 10 The diagram shows the structure when applied to an electronic device in a folded state.

[0314] Figure 10 The cover or protective layer shown can be applied to double-fold electronic devices, or to triple-fold or more fold electronic devices.

[0315] like Figure 10 and Figure 11 The display cover 113 or the protective layer 114 both include a bent portion and a non-bent portion connected to the bent portion. The bent portion can be bent along the bending line so that the bent portion can switch between an unfolded state and a closed state.

[0316] like Figure 11 The bent portion of the substrate 11D has a groove 11H, such as Figure 10 As shown, filler 11G can be filled into the groove 11H. In some examples, the elastic modulus of filler 11G is less than the elastic modulus of substrate 11D.

[0317] Will Figure 10 The structure shown is applied in Figure 12 When in the electronic device shown, Figure 12 In the stacked bracket 111, display panel 112, and display cover 113, and the protective layer 114, the display cover 113 adopts... Figure 10 The structure shown is as follows. The adhesive layer 11F in the display cover 113 sets the display cover 113 on one side of the display surface of the display screen 112. The bent portion of the substrate 11D in the display cover 113 has a groove, and the groove is filled with a filler 11G with a low elastic modulus. The substrate of the non-bent portion of the display cover 113 does not have a groove and does not involve a filler.

[0318] In this embodiment, the bent portion of the substrate 11D in the cover plate 110 is filled with a filler 11G with a small elastic modulus. In order to improve the rigidity of the entire display module, even if the substrate 11D is thickened, the bendability of the bent portion can be guaranteed. In addition, the rigidity of the non-bent portion will also be improved, thereby improving the reliability of the foldable screen planar area and the scratch resistance of the surface protective film.

[0319] It can also improve the flatness of the overall stacking of the display module and weaken the obvious unevenness of the display module when the screen is off, namely the "orange peel" phenomenon.

[0320] In some examples, the elastic modulus of the substrate 11D can be from 1 GPa to 15 GPa. For example, it can be 1 GPa, 3 GPa, 5 GPa, 8 GPa, 10 GPa, 12 GPa, 15 GPa, etc.

[0321] In some examples, the elastic modulus of the filler 11G can be less than or equal to 5 GPa. For example, it could be 1 GPa, 3 GPa, 5 GPa, etc.

[0322] The bendability of the bent portion is improved by using a filler 11G with a low elastic modulus. The stiffness of the non-bending portion is maintained by using a substrate 11D with a high elastic modulus.

[0323] The display cover 113 or protective layer 114 filled with filler 11G can be used not only in inward folding structures but also in outward folding structures.

[0324] The substrate 11D has a first side and a second side opposite to each other, with the first side being closer to the display screen 12 than the second side. The groove 11H formed on the substrate 11D has a variety of possible structures, some of which are exemplified below.

[0325] like Figure 13A and Figure 14A The groove 11H is formed on the first surface and recessed from the first surface toward the second surface. There is a gap between the bottom surface of the groove 11H and the second surface. The groove 11H does not penetrate the substrate 11D.

[0326] like Figure 13B and Figure 14B Not only is a groove 11H formed on the first surface, but a groove 11H is also formed on the second surface. The groove 11H formed on the first surface does not penetrate the groove 11H formed on the second surface.

[0327] like Figure 13C and Figure 14C The groove 11H is formed on the second surface and is recessed from the second surface toward the first surface. There is a gap between the bottom surface of the groove 11H and the first surface. The groove 11H does not penetrate the substrate 11D.

[0328] The grooves 11H formed on the substrate 11D have various shapes, and several are provided as examples in this application.

[0329] like Figures 13A to 13C The cross-section of groove 11H is rectangular.

[0330] like Figures 14A to 14C ,as well as Figure 15A The cross-section of groove 11H is an arc-shaped structure.

[0331] like Figure 15BThe cross-section of groove 11H has an irregular serrated structure.

[0332] In other embodiments, the cross-section of the groove 11H may also be other shapes, which will not be exhaustively described by this application.

[0333] There are various ways to arrange the grooves 11H formed on the substrate 11D.

[0334] In some examples, Figure 16A and Figure 16B In this structure, each groove 11H is a strip-shaped structure, and the extending direction of the groove 11H is consistent with the extending direction of the bending line L of the bent portion. Multiple strip-shaped grooves 11H can be arranged along a direction perpendicular to the bending line L. Figure 16A In the top view, the cross-section of groove 11H is rectangular. Figure 16B In the top view, the cross-section of groove 11H is elliptical.

[0335] In other examples, such as Figure 16C and Figure 16D Multiple grooves 11H are distributed in the bend. For example, they can be arranged in a rectangular pattern in the bend. Figure 16C In the top view, the cross-section of groove 11H is circular. Figure 16D In the top view, the cross-section of groove 11H is triangular.

[0336] Figures 17A to 17C Some layout methods for groove 11H are also given. (Refer to...) Figures 17A to 17C When there are multiple grooves 11H, the multiple grooves 11H can be arranged at intervals within the substrate 11D, for example, they can be arranged at intervals along a direction perpendicular to the extension direction of the bending line L. The cross-sectional shape of these multiple grooves 11H can be as follows: Figure 17A and Figure 17B The consistency shown can also be as follows: Figure 17C The cross-sectional shapes shown are inconsistent.

[0337] In some implementations, the depth of the multiple grooves 11H can be as follows: Figure 17A and Figure 17B The consistency shown can also be as follows: Figure 17C The depths shown are inconsistent.

[0338] Figures 17A to 17C In the example, there are multiple grooves 11H provided on the bent portion, and the multiple grooves 11H are spaced apart within the substrate 11D. Figure 18A and Figure 18B In the example shown, there is one groove 11H on the bent portion. A groove 11H can be a structure with a uniform thickness or a structure with a non-uniform thickness.

[0339] In this application example, the substrate 11D can be made of a variety of materials, such as at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0340] The filler 11G has a variety of materials to choose from, such as optically clear adhesive (OCA), optically clear resin (OCR), acrylic resin, epoxy resin, etc.

[0341] The aforementioned display cover 113 with filler 11G can be applied to... Figure 19 The three-fold display module 11 shown includes an inward fold A1 and an outward fold A2. Figure 20A It shows Figure 19 The structural diagram of the inner folded portion A1 in the figure when it is in the unfolded state. Figure 20B It shows Figure 19 The structural diagram of the outwardly folded portion A2 in the figure when it is in the unfolded state.

[0342] like Figure 19 The inward fold A1 refers to the process during which the electronic device transitions from a flattened state to a closed state, and during the closed state, the display screen is located inside the electronic device. In other words, during the folding process, the display screen gradually becomes invisible to the user until, in the closed state, the display module 11 is completely hidden between the two housings. One side of the display surface of the display module 11 is hidden and invisible to the user.

[0343] like Figure 19 The outward-folded portion A2 ensures that the display screen remains visible to the user during the folding process and in the closed state. In the closed state, the user can still perform some operations on the display module 11. This can also be understood as one side of the display surface of the display module 11 being visible to the user.

[0344] The substrate 11D has a first surface and a second surface facing each other. In the inward folding portion A1, the first surface is closer to the center of the arc-shaped structure formed by the display module than the second surface. In the outward folding portion A2, the first surface is farther away from the center of the arc-shaped structure formed by the display module than the second surface.

[0345] In both the inward fold A1 and the outward fold A2, the groove 11H is formed on the first surface, and there is a gap between the bottom surface of the groove 11H and the second surface.

[0346] See Figure 20A and Figure 20B ,exist Figure 20A In the display cover 113 of the inwardly folded portion A1 shown, the distance S1 between two adjacent grooves filled with filler is less than [missing information]. Figure 20B In the display cover 113 of the outwardly folded portion A2 shown, there is a spacing S2 between two adjacent grooves filled with filler.

[0347] Compared to the outer fold A2, the bending radius of the inner fold A1 can be designed to be smaller, while the bending radius of the outer fold A2 can be designed to be larger. Furthermore, the display module 11 of the outer fold A2 is frequently located outside the entire electronic device, meaning that the strength requirements for the outer fold A2 are higher. Therefore, according to... Figure 20A and Figure 20B When designing the inner fold A1 and the outer fold A2, the inner fold A1 can be made to have a smaller elastic modulus and be more easily bent by using grooves with smaller spacing. In the outer fold A2, not only can the bendability be guaranteed, but the stiffness is not reduced.

[0348] In some embodiments, such as Figure 19 The number of grooves in the inner fold portion A1 can be greater than the number of grooves in the outer fold portion A2. This can further improve the bendability of the inner fold portion A1.

[0349] In other examples, see Figure 20A and Figure 20B ,exist Figure 20A In the display cover 113 of the inwardly folded portion A1 shown, the depth h1 of the groove is greater than that in Figure 20B In the display cover 113 of the outwardly folded portion A2 shown, the groove depth is h2. More filler with a lower elastic modulus can be filled in the inwardly folded portion A1 to further improve its bendability.

[0350] In some other embodiments, to further improve the bendability of the inwardly folded portion A1, such as... Figure 20C Grooves can be formed on both opposite sides of the substrate 11D, and the grooves on both sides can be filled with a filler 11G with a low elastic modulus. This improves bendability, allowing the inwardly folded portion A1 to have a smaller bending radius.

[0351] Since the display cover 113 or protective layer 114 with filler 11G is disposed on one side of the display surface of the display screen 112, both the display cover 113 and the protective layer 114 are light-transmitting, and the transmitted light needs to be received by the user. In order to prevent the filler 11G from affecting the light transmission effect, in some examples, the refractive index λ1 of the filler 11G and the refractive index λ2 of the substrate 11D satisfy the following condition: 0.8 ≤ λ1 / λ2 ≤ 1.2. For example, λ1 / λ2 = 0.8, or λ1 / λ2 = 1, or λ1 / λ2 = 1.2, etc.

[0352] To further improve the light transmittance of the display cover 113 or protective layer 114, some nanoparticles can be doped into the filler 11G. Nanoparticles can improve light transmittance. For example, the nanoparticles can be ZrO2, TiO2, SiO2, Al2O3, SnO2, Nb2O5, etc.

[0353] In this embodiment, the groove 11H filled with filler 11G is formed in the bent portion. This ensures good bending performance of the bent portion while preventing the filler 11G, which has a low elastic modulus, from affecting the rigidity of the bent portion. In some feasible structures, the depth h of the groove 11H and the thickness H of the substrate 11D without the groove satisfy the following condition: 0.2 ≤ h / H ≤ 0.8. For example, h / H = 0.4, h / H = 0.5, h / H = 0.6, h / H = 0.7, etc.

[0354] To prevent the filler 11G, which has a relatively low elastic modulus, from affecting the rigidity of the bent portion, in some other feasible structures, the area S1 occupied by the groove 11H and the area S2 of the ungrooved substrate 11D of the bent portion satisfy the condition: 0.3 ≤ S1 / S2 ≤ 0.9. For example, S1 / S2 = 0.4, S1 / S2 = 0.5, S1 / S2 = 0.6, S1 / S2 = 0.7, S1 / S2 = 0.8, etc.

[0355] In some examples, not only can the display cover 113 have a structure with grooves filled with a filler of low elastic modulus, but the protective layer 114 can also have this structure. For example, in Figure 21 In the display module shown, not only is a groove formed in the substrate 11D in the display cover plate 113 and filled with filler 11G1, but also a groove is formed in the substrate 11D in the protective layer 114 and filled with filler 11G2.

[0356] To improve the flexibility of the entire display module, such as Figure 21The multiple grooves in the display cover 113 and the multiple grooves in the protective layer 114 are arranged at intervals along a direction perpendicular to the bending line. There is a filler 11G2 between two adjacent fillers 11G1, and a filler 11G1 between two adjacent fillers 11G2. The flexibility of the bent portions of the stackable display cover 113 and protective layer 114 is more uniform.

[0357] The number of recesses in the cover plate 113 can be less than the number of recesses in the protective layer 114.

[0358] The spacing between two adjacent grooves in the display cover 113 is greater than the spacing between two adjacent grooves in the protective layer 114.

[0359] The display module in the example above can also include other structures. For example, Figure 22 , Figure 23 and Figure 24 As shown, Figure 22 The diagram shown is a structural diagram of a display module with a protective layer 114 and filler 11G. Figure 23 The diagram shown is a structural diagram of a display module with a display cover 113 and filler 11G. Figure 24 The diagram shows the structure of a display module in which both the protective layer 114 and the display cover 113 have filler 11G.

[0360] like Figures 22 to 24 The display module also includes a back protective layer 116, which is disposed between the display screen 112 and the support plate 111. The back protective layer 116 is disposed on the support plate 111 via an adhesive layer 115, and the display screen 112 is disposed on the back protective layer 116 via an adhesive layer 117.

[0361] like Figures 22 to 24 The display module also includes a polarizer (POL) 118, which is disposed between the display screen 112 and the display cover plate 113.

[0362] The polarizer 118 in this embodiment can be a P-type polarizer or an S-type polarizer, etc.

[0363] This application also provides a method for manufacturing a display module including a bent portion. For example... Figure 25 , Figure 25 The diagram shown is a flowchart of a feasible preparation method, wherein the preparation method includes:

[0364] S1: A display cover is provided on one side of the display surface of the display screen. The display screen includes a bent part and a non-bent part connected to the bent part. The bent part can be bent along the bending line so that the display screen can switch between an unfolded state and a closed state.

[0365] S2: A protective layer is provided on the side of the display cover away from the display screen.

[0366] At least one of the display cover or protective layer includes: a substrate and a hardening layer disposed on one side of the substrate, wherein the substrate is closer to the display screen than the hardening layer; the substrate corresponding to the bent portion has at least one groove, the groove has a filler, and the elastic modulus of the filler is less than the elastic modulus of the substrate.

[0367] A groove can be made in the display cover to fill the filler material, or a groove can be made in the protective layer to fill the filler material; both methods can be employed as follows. Figures 26A to 26D The example given is obtained.

[0368] like Figure 26A Accurate raw materials, including... Figure 26A The substrate 11D shown.

[0369] Among the selectable materials, the substrate 11D can be selected from at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0370] like Figure 26B A groove 11H is formed in the region of the bent portion of the substrate 11D.

[0371] For example, the substrate 11D can be processed by injection molding, laser cutting or etching to create the groove 11H.

[0372] like Figure 26C The filler can be applied by coating, spraying, or inkjet printing to fill the groove 11H until the thickness at this location is consistent with the thickness of other unprocessed areas, resulting in a uniform overall thickness.

[0373] Fillers can be optically clear adhesive (OCA), optically clear resin (OCR), etc.

[0374] The elastic modulus of filler 11G is less than that of substrate 11D.

[0375] like Figure 26D The filler 11G is then cured, and the curing method may include, but is not limited to, photocuring, thermal curing, radiation curing, etc.

[0376] In the different display module structures shown in this application, by changing the structure of at least one of the display cover and the protective layer, slots are made in the substrate and filled with fillers with low elastic modulus, so that the bent part of the entire display module has high bendability and the non-bending part has sufficiently high strength and rigidity. In addition, the "orange peel" phenomenon on the surface of the display module can also be improved.

[0377] Figure 27 The "orange peel" effect was demonstrated, which can be understood as an uneven surface on the display module, for example, in... Figure 27 In the process, the surface of the protective layer 114 on the outer layer of the display module is uneven. This causes light to be diffusely reflected on its surface, making it look like orange peel, which is called the "orange peel" phenomenon. The "orange peel" phenomenon will reduce the user experience.

[0378] To improve the surface flatness of the display module and reduce the "orange peel" effect, embodiments of this application also provide some display module structures, as described below.

[0379] Figure 28 This is a structural diagram of a display module provided in an embodiment of this application. The display module includes a multi-layer stacked film structure. For example, in addition to a support plate 111, a display panel 112, a display cover 113 and a protective layer 114, it may also include a planarization layer 119.

[0380] A smoothing layer 119 is disposed on the side of the protective layer 114 away from the display cover plate 113. For example, the smoothing layer 119 may be made of optically clear resin (OCR).

[0381] The display module completes the manufacturing process. Figure 28 After the support plate 111, display screen 112, display cover plate 113 and protective layer 114 are stacked, liquid optically clear resin (OCR) can be coated on the surface of the protective layer 114 away from the display cover plate 113. The optically clear resin OCR has high fluidity. The surface tension of the flowing optically clear resin OCR is used to fill the uneven structure on the surface of the protective layer 114, so that the surface achieves high flatness, eliminates the unevenness of the surface caused by the stacking of multilayer film structures, and reduces the "orange peel" phenomenon.

[0382] In some examples, such as Figure 28The protective layer 114 may include a substrate 11D and a hardening layer 11E disposed on the side of the substrate 11D away from the display cover plate 113. The substrate 11D is disposed on the display cover plate 113 via an adhesive layer 11F. A planarization layer 119 is disposed on the side of the hardening layer 11E away from the substrate 11D, serving as the outer surface of the entire display module.

[0383] Figure 29 It is Figure 28 The diagram shows the structure applied in a foldable electronic device, specifically in the folded state. A flattening layer 119 is provided on the side of the protective layer 114 away from the display cover 113, both in the bent and non-bent sections. By utilizing the flattening layer 119 exposed on the surface of the display module, the "orange peel" effect in both the bent and non-bent sections can be suppressed, preventing noticeable unevenness in the off-screen display under lighting conditions, thus improving the user experience.

[0384] Figure 30 This is a structural diagram of another display module provided in this application embodiment. A flattening layer 119 is provided on the side of the protective layer 114 away from the display cover plate 113. In the substrate 11D of the protective layer 114, a groove is formed in the region of the bending portion, and the groove is filled with a filler 11G with a low elastic modulus. The display module of this embodiment not only has greater rigidity in the non-bending portion, but also has higher bendability in the bending portion. Furthermore, the flattening layer 119 provided on the surface can also eliminate the surface unevenness caused by the stacking of multilayer film structures, reduce the "orange peel" phenomenon, and further improve the user experience of the display module.

[0385] The preparation of the following is also exemplarily provided. Figure 28 The method for manufacturing the display module shown may include:

[0386] The support plate 111, the display screen 112, the display cover 113, and the protective layer 114 are attached.

[0387] Liquid UV adhesive is sprayed or spin-coated onto the surface of the stacked modules. After a certain period of time, once the liquid UV adhesive has leveled out, UV curing is performed.

[0388] In some manufacturing processes, liquid UV adhesive can be sprayed or spin-coated onto the surface of the stacked modules. Then, a glass plate is placed on the module. After a certain period of time, once the liquid UV adhesive has filled the gap between the glass plate and the module surface, a UV curing process is applied. By utilizing the glass plate to make the module surface flat, the flatness of the glass plate's surface is transferred to the module surface.

[0389] In some other manufacturing processes, liquid UV adhesive can be sprayed or spin-coated onto the surface of the stacked modules, and then the module surface can be smoothed using a scraper or adhesive scraping process, followed by UV curing.

[0390] The above Figure 28 In the example display module, a liquid adhesive layer is applied to the module surface during the manufacturing process, and after curing, a smoothing layer 119 is formed to improve surface smoothness and reduce the "orange peel" effect.

[0391] Figure 31 This is a structural diagram of another display module provided in the embodiments of this application. The display module in this example can also improve the flatness of the module surface.

[0392] exist Figure 31 The example structure also includes a leveling layer 119. (In the above...) Figure 28 In this configuration, the flattening layer 119 is disposed on the side of the protective layer 114 away from the display cover plate 113, and the flattening layer 119 serves as the surface layer structure of the entire display module. Figure 31 In the structure shown, the flattening layer 119 is disposed between the functional layer 120 and the display cover plate 113.

[0393] exist Figure 31 In the example display module, the support plate 111, display screen 112, functional layer 120, display cover plate 113, and protective layer 114 are bonded together by adhesive layers. Each film layer has a different degree of waviness (or flatness), and the final stacking of these layers creates an uneven surface on the display module. Figure 31 During the manufacturing process of the display module, a liquid adhesive is applied to the side of the functional layer 120 away from the display screen 112. For example, the adhesive can be made of optically clear resin (OCR) and then cured to form a flat layer 119, so that the surface of the display module achieves a mirror effect.

[0394] Figure 31 In the example, the surface tension of the flowing optically transparent resin OCR is used to fill the uneven structure on the surface of the protective layer 114, so that the surface achieves high flatness, eliminates the unevenness caused by the stacking of multilayer film structures, and reduces the "orange peel" phenomenon.

[0395] In some examples, the viscosity of the liquid optical adhesive is 5-50 mPa·s, the surface tension is 25-50 nN / m, the curing shrinkage rate is ≤15%, the low temperature modulus is ≤300 kPa, the room temperature modulus is ≤50 kPa, the high temperature modulus is ≥5 kPa, and the Tg is ≤-10℃.

[0396] In preparation Figure 31When the structure shown is used, the following method can be employed:

[0397] Adhesive support plate 111, display screen 112 and functional layer 120.

[0398] Liquid UV adhesive is sprayed or spin-coated onto the surface of the stacked layer structure. After a certain period of time, once the liquid UV adhesive has leveled out, UV curing is applied to form a smooth layer 119. Alternatively, liquid UV adhesive can be sprayed or spin-coated onto the surface of the stacked layer structure, and then a glass plate can be placed on the module. After a certain period of time, once the liquid UV adhesive fills the gap between the glass plate and the module surface, UV curing is applied to form a smooth layer 119. Or, liquid UV adhesive can be sprayed or spin-coated onto the surface of the stacked layer structure, and then the module surface can be leveled using a scraper or a scraping process, followed by UV curing to form a smooth layer 119.

[0399] A display cover plate 113 and a protective layer 114 are then provided on the side of the flat layer 119 away from the functional layer 120.

[0400] Figure 32 This is a structural diagram of another display module provided in this application embodiment. A flattening layer 119 is provided between the display cover plate 113 and the functional layer 120. In the substrate 11D of the protective layer 114, a groove is formed in the region of the bending portion, and the groove is filled with a filler with a low elastic modulus. The display module of this embodiment not only has greater rigidity in the non-bending portion, but also has higher bendability in the bending portion. Furthermore, the flattening layer 119 provided on the surface can eliminate the surface unevenness caused by the stacking of multilayer film structures, reduce the "orange peel" phenomenon, and further improve the user experience of the display module.

[0401] Figure 33 This is a structural diagram of another display module provided in an embodiment of this application. In this example, a flattening layer 119 is provided between the display cover plate 113 and the functional layer 120. The flattening layer 119 can also be provided on the side of the protective layer 114 away from the display cover plate 113. In this way, by applying multiple layers of liquid adhesive, the surface tension of the liquid optical adhesive can be fully utilized, resulting in a display module with high surface flatness and achieving a mirror effect.

[0402] During use, the flexible display screen of an electronic device containing a display module is subjected to cyclic bending stress, which can easily lead to defects such as creep and local horizontal lines. In order to mitigate these defects, as mentioned above, a support plate 111 is provided on one side of the back of the display screen 112. The bendable support plate 111 compensates for the bending defects of the display screen 112.

[0403] The support plate is designed with non-bending and bending areas. The non-bending area has high rigidity, ensuring the flatness and reliability of the screen; the bending area has lower rigidity, ensuring bending characteristics while also providing some screen support. However, under prolonged, high-frequency, and harsh operating conditions, the flattening rigidity of the bending area is usually insufficient, making the display module prone to defects such as creases, horizontal lines, and dents, and affecting the display module's resistance to compression and impact.

[0404] The embodiments of this application provide some novel support plate structures that not only have high bendability but also improve flattening stiffness.

[0405] like Figure 34 , Figure 34 The diagram illustrates the positional relationship between the support plate 111 and the display screen 112. The support plate 111 is disposed on one side of the back of the display screen 112. Since the display screen 112 involved in this embodiment is a bendable screen structure, the support plate 111 correspondingly includes a bent section and a non-bent section connected to the bent section. For example, in... Figure 34 The example shows a bent segment and two non-bent segments located on either side of the bent segment. In some examples, more bent and non-bent segments can be included, for example, it can be applied to electronic devices with three or more folds.

[0406] See Figure 35 In this embodiment, the support plate 111 includes a stacked first sub-support plate 1111 and a second sub-support plate 1112. In other examples, a third sub-support plate or more sub-support plates may also be included. This application uses two stacked sub-support plates as an example for illustration.

[0407] like Figure 35 and Figure 36 , Figure 35 This is a top view of the first sub-support plate 1111. Figure 36 yes Figure 35 A three-dimensional view of a portion of the structure of the first sub-support plate 1111. Figure 35 and Figure 36 In the bent section (which can be called the first bent section) of the first sub-support plate 1111 shown, a plurality of first hollow structures 1111A are provided. The area where the first hollow structure 1111A is located forms a hollow area, thereby forming a plurality of first hollow areas. The area between two adjacent first hollow areas in the first bent section can be called the first non-hollow area.

[0408] The first hollow structure 1111A in the bent section of the first sub-support plate 1111 can be: such as Figure 37 As shown, Figure 37 It is along Figure 35The cross-sectional view after LL is shown shows that the first sub-support plate 1111 has opposing M1 and M2 surfaces. In the first bent section of the first sub-support plate 1111, the first hollow structure 1111A extends from the M1 surface to the M2 surface.

[0409] like Figure 38 and Figure 39 , Figure 38 This is a top view of the second sub-support plate 1112. Figure 39 yes Figure 38 A three-dimensional view of a portion of the structure of the second sub-support plate 1112. Figure 38 and Figure 39 In the bent section (which can be called the second bent section) of the second sub-support plate 1112 shown, a plurality of second hollow structures 1112A are provided. The area where the second hollow structure 1112A is located forms a hollow area, forming a plurality of second hollow areas. Similarly, the area between two adjacent second hollow areas in the second bent section can be called a second non-hollow area.

[0410] The second hollow structure 1112A in the second bent section of the second sub-support plate 1112 can be: such as Figure 40 As shown, Figure 40 It is along Figure 38 The cross-sectional view of TT after cutting shows that the second sub-support plate 1112 has opposing M3 and M4 surfaces. In the bent section of the second sub-support plate 1112, the second hollow structure 1112A extends from the M3 surface to the M4 surface.

[0411] Figure 41 A structural diagram showing the stacked first sub-support plate 1111 and the second sub-support plate 1112 is provided, and is a schematic diagram of the structure in a flattened state. The first hollowed-out area is at least partially stacked with the second non-hollowed-out area, and the second hollowed-out area is at least partially stacked with the first non-hollowed-out area.

[0412] In some examples given in this application, the first hollow area and the second non-hollow area are at least partially overlapped, and the second hollow area and the first non-hollow area are at least partially overlapped, which can be: the first hollow structure 1111A and the second hollow structure 1112A are basically arranged alternately.

[0413] Alternatively, the orthographic projection of the first hollowed-out area on the first surface may at least partially coincide with the orthographic projection of the second non-hollowed-out area on the first surface, and the orthographic projection of the second hollowed-out area on the first surface may at least partially coincide with the orthographic projection of the first non-hollowed-out area on the first surface. The first surface is parallel to the surface of either the first or second sub-support plate.

[0414] Alternatively: along the stacking direction of the first sub-support plate 1111 and the second sub-support plate 1112 (e.g. Figure 41 (in the P direction), the orthographic projection of the first hollow structure 111A on the second sub-support plate 1112 covers at least a portion of the non-hollow area of ​​the second sub-support plate 1112, and the orthographic projection of the second hollow structure 1112A on the first sub-support plate 1111 covers at least a portion of the non-hollow area of ​​the first sub-support plate 1111.

[0415] Both the first sub-support plate 1111 and the second sub-support plate 1112 have a hollow structure. When flattened, the first sub-support plate 1111 and the second sub-support plate 1112 support each other and are connected to form a whole structure. This can improve the flattening rigidity and strength of the display module, and greatly improve the display module's resistance to compression, impact and creases.

[0416] Figure 42 The diagram shows the stacked structure of the first sub-support plate 1111 and the second sub-support plate 1112. This is to clearly demonstrate the difference in structure between the support plates in their flattened and closed states. Figure 42 Figure A shows part of the structure when the support plate is unfolded. Figure 42 Figure B shows a portion of the structure when the support plate is bent.

[0417] See Figure 42 In this example, the second sub-support plate 1112 is located further away from the display module 11 than the first sub-support plate 1111, and the bending radius of the second sub-support plate 1112 is greater than that of the first sub-support plate 1111.

[0418] When the support plate 111 is in the closed state, at least a portion of the second sub-support plate 1112 is separated from the first sub-support plate 1111. For example, in Figure 42 In the case where the support plate is in a flattened state, the second non-hollowed-out areas (1) and (2) of the second sub-support plate 1112 adjacent to the second hollowed-out structure 1112A are both in contact with the first sub-support plate 1111 located thereon. When the support plate is in the flattened state, Figure 42 When B is in the closed state, portions (1) and (2) of the second non-hollowed-out region will warp and separate from the first sub-support plate 1111. For example, portions of the second non-hollowed-out region (1) and (2) near the bottom of the arc-shaped structure may separate from the first sub-support plate 1111.

[0419] Because the first sub-support plate 1111 and the second sub-support plate 1112 are partially separated in the closed state of the support 111, the support plate 111 can be ensured to have good bending performance.

[0420] The embodiments of this application provide a structure comprising at least two stacked sub-support plates, with a hollow structure provided on each sub-support plate. When the display module is flat, the hollow structures on the two opposite sub-support plates support each other, improving the flattening rigidity of the bent portion. When the display module is closed, the two opposite sub-support plates partially separate, ensuring bending performance.

[0421] The first hollow structure 1111A of the bent area of ​​the first sub-support plate 1111 has a variety of possible structures. For example, in Figure 35 and Figure 36 In the first hollow structure 1111A, there are multiple strip-shaped slots, and the extension direction of each slot is parallel to the bending line L of the bending area.

[0422] like Figure 36 The first sub-support plate 1111 has a first surface and a second surface opposite to each other, and the arrangement direction of the first surface and the second surface is parallel to the bending line L of the bending region. The slotting includes slot A1, slot A2, and slot A3, and the extension directions of slots A1, A2, and A3 are all parallel to the bending line L of the bending region.

[0423] Slot A1 is formed from the first surface towards the second surface, but does not extend through to the second surface. Slot A2 is formed from the second surface towards the first surface, but does not extend through to the first surface. There is a gap S between the end of slot A1 near slot A2 and the end of slot A2 near slot A1, meaning there is a non-openwork area between slots A1 and A2. One end of slot A3 has a gap between it and the first surface, and the other end also has a gap between it and the second surface; that is, there is a non-openwork area between the two opposite ends of slot A3 and the outer edge of the first sub-support plate 1111.

[0424] Multiple slots A1 and multiple slots A3 are arranged alternately along a direction perpendicular to the bend line L, and multiple slots A2 and multiple slots A3 are also arranged alternately along a direction perpendicular to the bend line L.

[0425] exist Figure 36 In the example, slots A1, A2, and A3 have constant widths along their extension direction. In some feasible configurations, the widths of slots A1, A2, and A3 may be equal or unequal.

[0426] The second hollow structure 1112A in the bent area of ​​the second sub-support plate 1112 has a variety of possible structures. For example, in Figure 38 and Figure 39 In the middle, the second hollow structure 1112A includes multiple strip-shaped slots, and the extension direction of each slot is parallel to the bending line L of the bending area.

[0427] See Figure 39 The second sub-support plate 1112 has a first surface and a second surface opposite to each other, and the arrangement direction of the first surface and the second surface is parallel to the bending line L of the bending region. The slotting includes slot B1, slot B2, and slot B3, and the extension directions of slots B1, B2, and B3 are all parallel to the bending line L of the bending region.

[0428] Slot B1 is formed from the first surface towards the second surface, but does not extend through the second surface. Slot B2 is formed from the second surface towards the first surface, but does not extend through the first surface. One end of the third slot B3 has a gap between it and the first surface, and the other end also has a gap between it and the second surface.

[0429] Multiple slots B1 and multiple slots B3 are arranged alternately along a direction perpendicular to the bend line L, and multiple slots B2 and multiple slots B3 are also arranged alternately along a direction perpendicular to the bend line L.

[0430] Figure 43 A portion of the structure of the aforementioned second sub-support plate 1112 was cut off. Figure 44 Shown Figure 43 Detailed diagram of slot B1 or slot B2.

[0431] like Figure 43 and Figure 44 Along the extension direction of these grooves, the width of groove B3 is a constant value, while the widths of grooves B1 and B2 vary. For example, in groove B1, from the first face to the second face, groove B1 is initially a constant value, then increases, then decreases, and then increases again. The portion with a smaller groove width, compared to the portion with a larger groove width, will form a protruding structure bulging into groove B1. Similarly, in groove B2, from the second face to the first face, groove B2 is initially a constant value, then increases, then decreases, and then increases again. Like groove B1, the portion with a smaller groove width, compared to the portion with a larger groove width, will form a protruding structure bulging into groove B2. Figure 44 Along the extending direction of slot B1, slot B1 includes a first segment and a second segment connected together. The width of the first segment and the width of the second segment are not equal, and the width of the first segment is greater than the width of the second segment. In the second non-perforated area of ​​the second sub-support plate 1112, the portion near the second segment protrudes towards the second segment compared to the portion near the first segment, forming a protruding structure. In some examples, when the display screen is in a closed state, the protruding structure is separated from the first sub-support plate 1111.

[0432] exist Figure 44In the middle, slot B1 also includes a third segment, which is connected to the second segment. The width of the slot in the third segment is greater than the width of the slot in the first segment. It also includes a fourth segment connected to the third segment. The width of the slot in the fourth segment is smaller than the width of the slot in the third segment, thus forming two protruding structures.

[0433] To further improve the bendability of the support plate in the bending area, such as Figure 44 The first segment, which has a larger groove width, is further away from the edge of the second sub-support plate 1112 than the second segment, which has a smaller groove width.

[0434] In the embodiments provided in this application, since the first sub-support plate 1111 is closer to the display screen than the second sub-support plate 1112, the first sub-support plate 1111 has a smaller bending radius than the second sub-support plate 1112 when the display screen is bent. In order to improve the bendability of the first sub-support plate 1111, the length of the slots A1 and A2 opened on the first sub-support plate 1111 can be greater than the length of the slots B1 and B2 opened on the second sub-support plate 1112.

[0435] Because protruding structures are formed in slots B1 and B2, protruding into the slots, when the support plate is in Figure 42 When in the closed state shown by B, the protruding structure is easy to separate from the first sub-support plate 1111, making the multi-layer stacked support plate easy to bend and improving the bending performance of the support plate.

[0436] Figure 45 This is a structural diagram of another second sub-support plate 1112 provided in an embodiment of this application. (And the above...) Figure 38 The second sub-support plate 1112 in the example has the same structure: it includes slots B1 and B2, as well as slot B3, and the extension directions of slots B1, B2 and B3 are all parallel to the bending line L of the bending area.

[0437] and the above Figure 38 The second sub-support plate 1112 in the example differs in structure as follows: Figure 46 The structures of slots B1 and B2 are both similar to... Figure 38 The structures of slots B1 and B2 are different. Figure 46 In the above, slot B1 or slot B2 includes a protruding structure that protrudes into the slot. Figure 38 In the middle, slot B1 or slot B2 includes two protruding structures.

[0438] In other examples, slot B1 or slot B2 may include more protruding structures.

[0439] In the different slots B1 or B2 shown above, the portion with a larger slot width is substantially far from the outer edge of the second sub-support plate 1112. This can further improve the flexibility of the second sub-support plate 1112 and enhance its bendability.

[0440] There are various ways to connect the first sub-support plate 1111 and the second sub-support plate 1112. For example, they can be connected by welding, magnetic attraction, mechanical fasteners, adhesive bonding, etc.

[0441] Figure 47 This is a structural diagram of a connection using an adhesive layer, as shown in an embodiment of this application. Figure 47 The black areas represent the locations of the adhesive layer. Since slots A1 and A2 on the first sub-support plate 1111 are not continuous, non-perforated areas are formed where slots A1 and A2 are close to each other; similarly, slots B1 and B2 on the second sub-support plate 1112 are also not continuous, forming non-perforated areas where slots B1 and B2 are close to each other. In feasible processes, such as... Figure 47 The two non-cutout areas can be bonded together using an adhesive layer.

[0442] To further enhance the connection strength between the first sub-support plate 1111 and the second sub-support plate 1112, such as Figure 47 Alternatively, an adhesive layer can be used to bond the non-bending area of ​​the first sub-support plate 1111 adjacent to the bending area to the non-bending area of ​​the second sub-support plate 1112 adjacent to the bending area.

[0443] The multi-layered stacked support plate provided in this application embodiment, when flattened, achieves force transfer from the bending area to the non-bending area through the alternating arrangement of the upper and lower layers with hollow structures, thus significantly improving the flattening rigidity of the display module; when bent, since the lower sub-support plate portion away from the display screen separates from the upper sub-support plate, the rigidity of the display module is kept at a low level during bending; when bent and stretched, since each sub-support plate includes a hollow structure, each layer does not obstruct each other during stretching, and each sub-support plate has good tensile performance.

[0444] The above embodiments all illustrate the structure of the bent section of the support plate in the display module. The support plate also includes a non-bent area corresponding to the display screen, such as... Figure 34 The support plate 111 also includes two non-bending sections located on both sides of the bending section.

[0445] In some feasible structures, the bent and non-bent sections of the support plate can be made of different materials. For example, the bent sections can be made of materials with higher density and better mechanical properties, such as stainless steel or titanium alloy, while the non-bent sections can be made of lightweight carbon fiber. In this way, while ensuring that the support plate has the characteristics of flattening rigidity, bending flexibility, and easy stretching, the weight of the entire support plate can also be reduced, achieving a thinner and lighter design.

[0446] In the foldable electronic device described in this application, the housings located on both sides of the pivot mechanism can be flattened and closed under the drive of the pivot mechanism.

[0447] Figure 48 and Figure 49 A simplified schematic diagram is shown of the rotating shaft mechanism 200 in two different states. Figure 48 The diagram shows the state of the display module 11 and the rotating mechanism 200 when the electronic device is in a flattened state. Figure 49 The diagram shows the state of the display module 11 and the rotating mechanism 200 when the electronic device is in the closed state.

[0448] Reference Figure 48 and Figure 49 The pivot mechanism 200 includes a first door panel 202, a second door panel 203, and a middle door panel 201. The first door panel 202 and the second door panel 203 are arranged on opposite sides of the middle door panel 201.

[0449] The rotating mechanism 200 also includes a main shaft 204, and the first door panel 202, the middle door panel 201, and the second door panel 203 are located on the same side of the main shaft 204. Figure 49 The display module 11 is supported on one side of the first door panel 202, the middle door panel 201, and the second door panel 203, and the main shaft 204 is located on the other side of the first door panel 202, the middle door panel 201, and the second door panel 203.

[0450] In the rotating mechanism 200, the first door panel 202 and the second door panel 203 can move towards or away from each other to realize the flattening or closing of the display module.

[0451] During the rotation of the first door panel 202 and the second door panel 203, the middle door panel 201 can move toward the main shaft 204 or away from the main shaft 204.

[0452] like Figure 48 When the electronic device is in a flattened state, the first door panel 202, the middle door panel 201, and the second door panel 203 are in the same plane and support the flattened display module 11. When the electronic device changes from a flattened state to a closed state, such as Figures 48 to 49As shown, the first door panel 202 rotates relative to the main shaft 204 in the rotation direction P1, and the second door panel 203 rotates relative to the main shaft 204 in the opposite direction P2. The ends of the first door panel 202 and the second door panel 203 away from the main shaft 204 approach each other, and the ends of the first door panel 202 and the second door panel 203 near the main shaft 204 move away from each other, causing the display module 11 to bend between the first door panel 202 and the second door panel 203. As the first door panel 202 and the second door panel 203 approach each other relative to the main shaft 204, the middle door panel 201 rotates along... Figure 49 The movement shown in direction P3 is closer to the main shaft 204. For example, the distance between the middle door panel 201 and the main shaft 204 can be determined by... Figure 48 D1 is reduced to Figure 50 D2. The first door panel 202, the middle door panel 201 and the second door panel 203 form a nearly triangular receiving cavity, in which the display module 11 is received and can be shaped like a teardrop.

[0453] When an electronic device changes from a closed state to a flattened state, such as Figures 49 to 48 As shown, the first door panel 202 rotates relative to the main shaft 204 in a direction opposite to the rotation direction P1, and the second door panel 203 rotates relative to the main shaft 204 in a direction opposite to the direction P2. That is, the first door panel 202 and the second door panel 203 are opposite to each other, causing the display module 11 to unfold.

[0454] like Figure 50 The display module 11 can continuously cover the first housing 100a, the hinge mechanism 200, and the second housing 100b of the foldable electronic device. Region A corresponds to and is fixedly connected to the second housing 100b. Region E also corresponds to and is fixedly connected to the second housing 100b. Region B is fixedly connected to the first door panel 202 of the hinge mechanism, region D is fixedly connected to the second door panel 203 of the hinge mechanism, and region C is opposite to the middle door panel 201 and can move relative to the middle door panel 201.

[0455] exist Figures 48 to 50 In the example electronic device, when the electronic device is in a flattened state, the bent area of ​​the display module 11 (such as...) Figure 50 Regions B, C, and D in the display module 11 require additional structural support to provide sufficient rigidity, strength, and flatness; when the electronic device is in a closed state, the bending areas of the display module 11 (such as...) Figure 50 Regions B, C, and D in the diagram need to have sufficient bendability.

[0456] The embodiments of this application provide some feasible structures that enable the bending area of ​​the display module 11 to not only ensure flatness and rigidity during unfolding, but also to have sufficient bending performance.

[0457] like Figure 51 and Figure 52 As shown, Figure 51 This is a structural diagram of the display module 11 in a flattened state, as provided in an embodiment of this application. Figure 52 This is a structural diagram of the display module 11 in a closed state, as provided in an embodiment of this application.

[0458] This example also includes a telescopic support structure 205, which is disposed on the side of the middle door panel 201 facing the display module 11 and is fixedly connected to the middle door panel 201.

[0459] In this embodiment, since the telescopic support structure 205 is fixedly connected to the middle door panel 201, the telescopic support structure 205 can move synchronously with the middle door panel 201. For example, when the display module 11 switches from a flat state to a closed state, the middle door panel 201 with the telescopic support structure 205 moves away from the display module 11, providing more space for the bent display module 11.

[0460] Figure 51 and Figure 52 In the example, the telescopic support structure 205 includes an extended state and a compressed state. When the display module 11 is in the flattened state, the telescopic support structure 205 is in the extended state, and the portion of the telescopic support structure 205 near the display module 11 abuts against the display module 11; when the display module 11 is in the closed state, the telescopic support structure 205 switches to the compressed state.

[0461] When the display module 11 is in a flattened state, the telescopic support structure 205 abuts against the display module 11 to support the flattened display module 11, thereby improving the flattening rigidity and flatness of the display module.

[0462] When the display module 11 is in the closed state, the telescopic support structure 205 retracts, providing sufficient clearance and ensuring that the bent part of the display module 11 has high bendability, thereby reducing stress and lowering the possibility of creases appearing in the display module.

[0463] In some feasible structures, such as Figure 52 When the display module 11 is in the closed state, the telescopic support structure 205 switches to the compressed state, and the part of the telescopic support structure 205 near the display module 11 separates from the display module 11 and does not contact the display module 11.

[0464] In other possible structures, such as Figure 53 When the display module 11 is in the closed state, the telescopic support structure 205 switches to the compressed state, and the part of the telescopic support structure 205 near the display module 11 comes into contact with the display module 11. In order to ensure the bendability of the display module 11, the telescopic support structure 205 basically does not apply any support force to the display module 11.

[0465] The telescopic support structure 205 has various achievable structures, such as support members made of shape memory materials, support members made of piezoelectric materials, piston structures, truss structures, etc. Some achievable structures are shown below as examples.

[0466] like Figure 54 and Figure 55 As shown, the telescopic support structure 205 may include a support member 2051 made of shape memory material. When the temperature reaches a certain value, the crystal structure inside the shape memory material will change, resulting in a change in shape, achieving elongation and contraction.

[0467] In this example, the support member 2051 made of shape memory material can be electrically connected to a controller, which can then adjust the temperature of the support member 2051. For instance, when the display module 11 is in a flattened state, the temperature applied to the support member 2051 is a first temperature, such as... Figure 55 The support member 2051 shown extends, and the end of the extended support member 2051 abuts against the back of the display module 11, providing support to the display module 11. For example, when the display module 11 is in the closed state, the temperature applied to the support member 2051 is a second temperature, such as... Figure 55 The support member 2051 shown retracts, and the retracted support member 2051 separates from the display module 11, giving the bent display module 11 sufficient clearance.

[0468] The memory materials involved in the embodiments of this application may include at least one of nickel and titanium. Of course, other types of memory materials may also be selected.

[0469] In other examples, such as Figure 54 and Figure 55 In the middle, the telescopic support structure 205 may also include an elastic element 2052, one end of which is fixed relative to the middle door panel 201.

[0470] When display module 11 is in Figure 55 When in the closed state shown, the elastic element 2052 is in a free state, the support element 2051 is compressed, the entire telescopic support structure 205 is in a compressed state, and is separated from the display module 11.

[0471] When display module 11 is in Figure 54When the flattened state is shown, a high temperature is applied to the support member 2051. Under the excitation of the high temperature, the support member 2051 elongates and drives the elastic member 2052 to stretch, so that the telescopic support structure 205 is in an elongated state and abuts against the display module 11, giving the display module 11 sufficient support force.

[0472] exist Figure 54 and Figure 55 In the structure shown, the elastic element 2052 can be a spring, a sheet, etc.

[0473] In some feasible structures, there can be one or more elastic elements 2052. When there are multiple elastic elements 2052, they can be arranged at intervals along the periphery of the support member 2051. The forces applied by the multiple elastic elements 2052 are relatively symmetrical and uniform, which enables the middle door panel 201 to move smoothly and reduces the probability of tilting during movement.

[0474] To further enhance the stability of the telescopic support structure 205 during expansion and contraction, and to ensure that the telescopic support structure 205 expands and contracts along a straight line, the telescopic support structure 205 may also include a guide structure. For example... Figure 56 The guiding structure can be a guide post 2058, the extension direction of which is consistent with the movement direction of the middle door panel 201, and the elastic element 2052 passes through the guide post 2058. When the elastic element 2052 is elongated and compressed, it will expand and contract along the extension direction of the guide post 2058, which allows the relatively fixed middle door panel 201 and the telescopic support structure to move together in a straight line.

[0475] In some examples, the elastic element 2052 can be made of elastic resistance wire, and the elastic element 2052 is connected to the support element 2051 through a heat-conducting structure. Furthermore, the elastic resistance wire is electrically connected to a controller, and the controller heats the elastic element 2052. The elastic element 2052 transfers heat to the support element 2051 through the heat-conducting structure, causing the support element 2051 to deform.

[0476] For example, the elastic element 2052 and the support element 2051 can be placed inside the housing, and the housing can be filled with a thermally conductive medium. The thermally conductive medium acts as a thermally conductive structure to conduct the heat of the elastic resistance wire to the support element 2051. As another example, a thermally conductive rod can be used to connect the elastic resistance wire and the support element 2051, that is, the thermally conductive rod is used as a thermally conductive structure to realize the heat conduction between the elastic element 2052 and the support element 2051.

[0477] Figure 57 and Figure 58This is another telescopic support structure 205 provided in the embodiments of this application. The telescopic support structure 205 includes a base 2053, a first electrode 2054 disposed on one side of the base 2053, a piezoelectric layer 2055, and a second electrode 2056, wherein the piezoelectric layer 2055 is disposed between the first electrode 2054 and the second electrode 2056, and the first electrode 2054 is closer to the middle door panel 201 than the second electrode 2056; the telescopic support structure 205 also includes a protective layer 2057, which is disposed on the side of the second electrode 2056 away from the piezoelectric layer 2055.

[0478] The first electrode 2054 and the second electrode 2056 are used to apply voltage to the voltage layer 2055, causing the piezoelectric layer 2055 to deform.

[0479] For example, at the first voltage, the piezoelectric layer 2055, as Figure 57 The piezoelectric layer 2055 is in an elongated state, and the protective layer 2057 abuts against one side of the display module 11; the piezoelectric layer 2055, under the second voltage, such as Figure 58 The piezoelectric layer 2055 is in a compressed state, and the protective layer 2057 is separated from the display module 11.

[0480] like Figure 59 , Figure 59 The structure that the display module 11 can achieve is shown. The display module 11 includes a support plate 111, a display screen 112, a functional layer 120, and a display cover plate 113.

[0481] A support plate 111 and a display cover plate 113 are disposed on opposite sides of the display screen 112. The support plate 111 is located on the back of the display screen 112 and serves as a support structure for supporting the display screen 112. The display cover plate 113 is disposed on one side of the display surface of the display screen 112. The display cover plate 113 is light-transmitting, and light transmitted from the display surface of the display screen 112 can pass through the display cover plate 113 and be received by the user. Furthermore, a functional layer 120 is stacked between the display screen 112 and the display cover plate 113; for example, the functional layer 120 may be a polarizer.

[0482] When the display module 11 is in the flattened state, the portion of the telescopic support structure 205 in the extended state that is close to the display module 11 abuts against the support plate 111.

[0483] Figure 59 The structure of the support plate 111 can be adopted Figure 60 and Figure 61 The structure shown in the example.

[0484] exist Figure 60In the middle, the area of ​​the support plate 111 opposite to the middle door panel 201 is provided with a hollow structure 111A. The hollow structure 111A is used to reduce the strength of the area, improve the bending performance of the area, and improve the crease phenomenon.

[0485] like Figure 59 and Figure 60 The portion of the telescopic support structure 205 near the display module 11 abuts against the portion of the support plate 111 with the hollow structure 111A.

[0486] By utilizing the hollow structure 111A of the support plate 111 and the cooperation of the telescopic support structure 205, when the display module 11 is in a flattened state, the part of the support plate 111 with the hollow structure 111A also has sufficient rigidity and strength, so that the part has a high degree of flatness, improving the reliability of the display module 11, improving its resistance to compression and impact, and also reducing the probability of creases, horizontal lines and dents.

[0487] Figure 61 This is a structural diagram of another type of support plate 111 provided in the embodiments of this application. In this support plate 111, there is no hollow structure at the position opposite to the middle door panel 201.

[0488] In the display module of foldable electronic devices, the display screen (also known as the display panel) is the core functional structure, used to display information and provide an interactive interface for users. For example, organic light-emitting diode (OLED) displays, active-matrix organic light-emitting diode (AMOLED) displays, or active-matrix organic light-emitting diode (AMOLED) displays can be selected.

[0489] Figure 62 The diagram shows a schematic of a display screen 112. The display screen 112 includes a substrate 1121, a driving array layer 1122, a light-emitting device layer 1123, and an encapsulation layer 1124 stacked sequentially on the substrate 1121.

[0490] The substrate 1121 serves as a support structure to support other film layers located thereon. The material of the substrate 1121 can be at least one of polyethylene terephthalate (PET), polyimide (PI), and polyimide CPI. These materials are flexible materials, which makes the display screen bendable.

[0491] The driving array layer 1122 is used to drive the light-emitting device layer 1123. The driving array layer 1122 has multiple transistors, such as thin film transistors (TFTs), which can be arranged in an array.

[0492] The light-emitting device layer 1123 includes multiple pixels, which can also be arranged in an array. In some examples, multiple thin-film transistors can be electrically connected to multiple pixels in a one-to-one manner, with each thin-film transistor driving the corresponding pixel to emit light, thereby realizing the display function.

[0493] The encapsulation layer 1124 is used to encapsulate the light-emitting device layer 1123, protect the light-emitting device layer 1123, and prevent external moisture from entering the light-emitting device layer 1123 and affecting the device performance.

[0494] Figure 63 The structure of the driving array layer 1122 in the display screen 112 is shown. The transistors in the driving array layer 1122 for driving the light-emitting device layer 1123 include: a first electrode 1122B, a second electrode 1122C, a channel layer 1122A, and a gate 1122D. The driving array layer 1122 also includes a gate dielectric layer 1122F for electrically isolating the gate 1122D and the channel layer 1122A, and also includes an interlayer dielectric layer 1122E, which is used to electrically isolate the first electrode 1122B and the gate 1122D, and to electrically isolate the second electrode 1122C and the gate 1122D.

[0495] In the embodiments of this application, one of the first electrode 1122B and the second electrode 1122C is the source electrode, and the other electrode is the drain electrode.

[0496] The channel layer 1122A is disposed on one side of the substrate 1121, and the gate 1122D is disposed on the side of the channel layer 1122A away from the substrate 1121. The channel layer 1122A and the gate 1122D are electrically isolated by the gate dielectric layer 1122F disposed between the channel layer 1122A and the gate 1122D.

[0497] like Figure 63 An interlayer dielectric layer 1122E is disposed on the side of the gate 1122D away from the gate dielectric layer 1122F. The first electrode 1122B and the second electrode 1122C penetrate the interlayer dielectric layer 1122E and the gate dielectric layer 1122F, and make ohmic contact with the channel layer 1122A to achieve electrical connection. The interlayer dielectric layer 1122E electrically isolates the gate 1122D from the first electrode 1122B and from the second electrode 1122C, enabling the transistor to have a switching function.

[0498] Figure 63 In the given example, the interlayer dielectric layer 1122E plays a crucial role in the device's performance. The interlayer dielectric layer 1122E can be made of inorganic materials such as SiO2 or SiN, and its thickness is approximately 0.6 micrometers.

[0499] Inorganic materials such as SiO2 or SiN have poor bending resistance, impact resistance, and mechanical stability. As a result, when electronic devices are subjected to impact or pressure, the interlayer dielectric layer 1122E at the point of stress is prone to cracking and structural collapse. This can cause short circuits between the gate 1122D and the first electrode 1122B, or between the gate 1122D and the second electrode 1122C, causing the transistor to lose its switching characteristics and resulting in cracked bright spots on the screen.

[0500] Cracks and structural collapses in the 1122E interlayer dielectric layer under stress constitute permanent damage and are irreparable. Since both SiO2 and SiN are transparent materials, they cannot absorb ultraviolet light, leading to poor negative bias thermal illumination stress (NBTIS) stability in transistor devices and shortening the lifespan of the display screen.

[0501] In order to suppress the phenomenon of cracks and permanent damage caused by structural collapse in the interlayer dielectric layer 1122E under stress, this application provides some display screen structures. The display screen can be used not only in bi-fold electronic devices, but also in electronic devices with more folds. The specific display screen structures are as follows.

[0502] Figure 64 This is a structural diagram of a display screen provided in an embodiment of this application. This example and the above... Figure 63 The differences in the example display 112 include: Figure 63 In this context, the interlayer dielectric (ILD) 1122E consists only of dielectric layers made of inorganic materials; Figure 64 In the middle, the interlayer dielectric layer 1122E includes stacked inorganic dielectric layer 1122E1 and organic dielectric layer 1122E2, and the stacking direction of inorganic dielectric layer 1122E1 and organic dielectric layer 1122E2 is as follows: Figure 64 The H direction in the middle, the H direction is Figure 62 The stacking orientation of the substrate 1121, driving array layer 1122, light-emitting device layer 1123 and encapsulation layer 1124.

[0503] Since the interlayer dielectric layer in this application example includes not only an inorganic dielectric layer but also an organic dielectric layer, the organic dielectric layer has elastic deformation capability. This improves the bending and impact resistance of the display screen, reduces the risk of cracks and structural collapse in the interlayer dielectric layer, and reduces the probability of short circuits between the first electrode and / or the second electrode and the gate.

[0504] Even if the display screen develops cracks in the interlayer dielectric layer due to external impact, the organic dielectric layer has an elastic deformation capability, giving it a self-healing function. This will insulate the first electrode from the gate and the second electrode from the gate, ensuring electrical insulation between the source / drain and the gate.

[0505] The interlayer dielectric layer 1122E provided in this application embodiment can be a two-layer structure comprising an inorganic dielectric layer and an organic dielectric layer, or a three-layer, four-layer, or even more-layer structure. For example, Figure 64 This demonstrates a two-layer structure comprising an inorganic dielectric layer and an organic dielectric layer. For example, Figure 65 The structure shown is a three-layer structure consisting of an inorganic dielectric layer and an organic dielectric layer.

[0506] exist Figure 65 In the middle, the interlayer dielectric layer 1122E includes stacked inorganic dielectric layer 1122E1 and organic dielectric layer 1122E2, as well as inorganic dielectric layer 1122E3, with organic dielectric layer 1122E2 stacked between inorganic dielectric layer 1122E1 and inorganic dielectric layer 1122E3.

[0507] In some examples, along the direction away from the substrate, the interlayer dielectric layer 1122E may include an organic dielectric layer, an inorganic dielectric layer, and an organic dielectric layer. Alternatively, it may consist of an organic dielectric layer, an inorganic dielectric layer, an organic dielectric layer, and an inorganic dielectric layer.

[0508] When the interlayer dielectric layer includes multiple organic dielectric layers and multiple inorganic dielectric layers, the organic dielectric layers and inorganic dielectric layers can be stacked alternately.

[0509] In this application, because the organic dielectric layer has elastic deformation capability, it has a self-healing function, which allows the source drain and gate, which are electrically connected together, to be electrically isolated by the elastic deformation of the organic dielectric layer.

[0510] To reduce the risk of cracks and structural collapse in the interlayer medium and improve repair efficiency, such as Figure 64 This allows the gate 1122D to be electrically isolated from the first electrode 1122B, and from the second electrode 1122C by an organic dielectric layer 1122E2.

[0511] See Figure 65The structure outlined in the dashed box includes the channel layer 1122A, the first electrode 1122B, the second electrode 1122C, and the gate 1122D, which is the core structure of the transistor.

[0512] exist Figure 65 A light-emitting device layer 1123 is disposed on the side of the driving array layer 1122 away from the substrate 1121, and light from the light-emitting device layer 1123 can be projected onto the driving array layer 1122. Figure 65 The side of these film structures away from the substrate 1121, outlined by the dashed lines, forms an organic dielectric layer 1122E2. The organic dielectric layer 1122E2 can absorb ultraviolet light to protect the transistor device and improve its negative bias thermal illumination stress (NBTiS) stability.

[0513] Figure 66 This is a partial structural diagram of the display screen 112 in the prior art. In order to suppress the light from the self-emissive device layer 1123 from being projected onto the driving array layer 1122 and affecting the working performance of the transistors, the display screen also includes a light shielding layer. The orthogonal projection of the light shielding layer onto the channel layer 1122A at least covers the channel layer 1122A to suppress the effect of light on the electron migration of the channel layer 1122A.

[0514] In order to enable the electronic device to have touchscreen unlocking function, such as Figure 66 An under-display fingerprint recognition structure can be provided on the side of the substrate 1121 away from the transistor. If a light shielding layer is provided in this structure, it will affect the light waves other than the ultraviolet band transmitted to the under-display fingerprint recognition structure, thus weakening the sensitivity of fingerprint recognition.

[0515] In the embodiments of this application, such as Figure 65 Since an organic dielectric layer is stacked in the interlayer dielectric layer 1122E, it can be omitted. Figure 66 The light-shielding layer shown in the image utilizes an organic dielectric layer to absorb ultraviolet light. This does not affect the transmission of other wavelengths of light to the under-display fingerprint recognition structure, thus improving screen transmittance and fingerprint recognition sensitivity.

[0516] In this embodiment, the material of the inorganic dielectric layer can be at least one of SiOx or SiNx. For example, in Figure 65 In the process, the inorganic dielectric layer 1122E1 is made of SiNx, and the inorganic dielectric layer 1122E3 is made of SiOx.

[0517] In the embodiments of this application, the organic medium layer involved is an organic polymer C obtained by in-situ polymerization of at least one organic compound A and at least one organic compound B.

[0518] Organic compound A involved in the embodiments of this application may be at least one of the following compounds:

[0519]

[0520] Organic compound B can be at least one of the following compounds:

[0521]

[0522] For example, when organic compound A (also called monomer A) is selected from the following compounds, and organic compound B (also called monomer B) is selected from the following compounds, the principle of in-situ polymerization is as follows:

[0523]

[0524] Of the three reaction formulas described above, the first formula uses one organic compound A and one organic compound B for in-situ polymerization; the second formula uses two organic compounds A (including organic compounds A1 and A2) and one organic compound B for in-situ polymerization; and the third formula uses two organic compounds B (including organic compounds B1 and B2) and one organic compound A for in-situ polymerization. The resulting organic polymer includes a polyimide structure.

[0525] In some selectable process steps, a vapor deposition process can be used to co-evaporate at least one organic compound A and at least one organic compound B onto the substrate surface. Utilizing the principle of in-situ polymerization, a uniform and dense polymer film is formed on the substrate surface. The organic dielectric layer prepared using this method exhibits bidirectional bending resistance, high tensile strength, and high temperature resistance, meeting the temperature requirements of subsequent processes. The specific fabrication method of this display screen will be described in detail below with reference to the accompanying drawings.

[0526] See Figure 67 The display screen provided in this application embodiment also includes a buffer layer 1125. The buffer layer 1125 may include a single layer structure or two or more film layer structures. For example, it may include stacked SiNx layers and SiOx layers.

[0527] By providing a buffer layer 1125 between the substrate 1121 and the driving array layer 1122, the working performance of the transistors in the driving array layer 1122 can be protected by the buffer layer 1125, and the migration of impurity ions in the substrate 1121 to the channel layer of the transistors can be suppressed.

[0528] like Figure 67 It may also include a planarization layer (PLN) 1122G, which is disposed on the side of the interlayer dielectric layer 1122 away from the buffer layer 1125, and covers the first electrode 1122B and the second electrode 1122C. It may also include a pixel anode layer 1122H. For example, in this example, when the first electrode 1122B is the anode, the pixel anode layer 1122H is electrically connected to the first electrode 1122B through a conductive via penetrating the planarization layer 1122G.

[0529] The pixel anode layer 1122H can be electrically connected to the pixel of the light-emitting device layer 1123 located on the driving array layer 1122, so as to realize the control of the pixel by the transistor.

[0530] In some selectable processes, such as Figure 67 It also includes a pixel define layer (PDL) 1122I. In the display, multiple pixels arranged in an array are integrated... Figure 67 Correspondingly, in the light-emitting device layer 1123, multiple pixels arranged in an array are also integrated as transistors shown. The pixel definition layer 1122I can isolate adjacent pixels.

[0531] The following, with reference to the accompanying drawings, exemplarily illustrates a method for manufacturing a display screen:

[0532] like Figure 68A The surface of substrate 1121 is cleaned to remove surface particles, and then SiNx, SiOx and a-Si are sequentially deposited on the surface of substrate 1121. The stacked SiNx and SiOx form a buffer layer.

[0533] In some examples, the thickness of SiNx can be 100 nm, the thickness of SiOx can be 300 nm, and the thickness of a-Si can be 45 nm.

[0534] Individual film structures can be deposited using plasma-enhanced chemical vapor deposition (PECVD). Alternatively, chemical deposition or physical deposition processes can also be employed.

[0535] The a-Si can be converted into Poly-Si by using the excimer laser annealing (ELA) process.

[0536] like Figure 68BPoly-Si is patterned using an etching process to form the channel layer 1122A of the transistor.

[0537] The channel layer 1122A can be surface cleaned to remove surface particles.

[0538] like Figure 68C A gate dielectric layer 1122F is formed on one side of the channel layer 1122A using a deposition process, so that the channel layer 1122A is covered by the gate dielectric layer 1122F. The gate dielectric layer 1122F can be made of SiOx material.

[0539] The 1122F gate dielectric layer is cleaned to remove surface particles.

[0540] like Figure 68D A metal layer is deposited on the gate dielectric layer 1122F by sputtering. For example, a Mo metal layer with a thickness of 300 nm can be deposited.

[0541] like Figure 68E The metal layer is patterned using an etching process to form the gate 1122D.

[0542] The gate 1122D is surface cleaned to remove surface particles.

[0543] like Figure 68F An inorganic dielectric layer 1122E2 is deposited on the surface of the gate 1122D. The material of the inorganic dielectric layer 1122E2 can be SiOx, and the thickness can be 100nm.

[0544] like Figure 68G The diaminodiphenyl ether and pyromellitic tetracarboxylic anhydride are co-evaporated onto an inorganic dielectric layer 1122E2 using a vapor deposition process, with a molar ratio of 1:1. For example, the evaporation rate can be 2 Å / s, and the thickness can be 620 nm.

[0545] The above-mentioned vapor-deposited substances can be subjected to high-temperature annealing, for example, the annealing temperature can be 362℃ and the annealing time can be 30min, so that the two organic compounds, diaminodiphenyl ether and pyromellitic anhydride, can undergo in-situ condensation polymerization to form an organic dielectric layer 1122E1.

[0546] The organic dielectric layer 1122E1 was surface-cleaned to remove surface particles.

[0547] like Figure 68H The via is etched down to the channel layer, and the via is filled with conductive material to form the first electrode 1122B and the second electrode 1122C.

[0548] Source and drain metal layers are formed by sputtering and depositing metals Ti, Al, and Ti.

[0549] In this process, the thickness of metallic Ti can be 62 nm, and the thickness of metallic Al can be 600 nm.

[0550] The source and drain metal layers are patterned using an etching process to form source and drain traces.

[0551] The surfaces of the source and drain lines are cleaned to remove surface particles.

[0552] like Figure 68I A planarization layer 1122G is deposited on the surface of the source and drain electrode traces, and an anode contact hole is formed.

[0553] ITO, Ag and ITO are sputtered onto the surface of the planarization layer 1122G to form the pixel anode layer 1122H.

[0554] In this process, the thickness of ITO can be 62nm, and the thickness of metallic Ag can be 100nm.

[0555] The surface of the pixel anode layer 1122H is cleaned to remove surface particles.

[0556] A pixel definition layer 1122I is formed on the surface of the pixel anode layer 1122H using a deposition process. Figure 68I The structure shown.

[0557] The interlayer dielectric layer prepared using this process comprises a stacked organic dielectric layer and an inorganic dielectric layer. In other processes, the layers can be adjusted... Figure 68G and Figure 68H The process shown can be used to fabricate interlayer dielectric layers with different structures. For example, an inorganic dielectric layer can be fabricated first, followed by an organic dielectric layer using vapor deposition, and then an inorganic dielectric layer can be fabricated on top of the organic dielectric layer. This process can produce the aforementioned interlayer dielectric layers. Figure 65 The structure shown.

[0558] In the display module, the display driver integrated circuit (DDIC) and the touch panel integrated circuit (TPIC) are important components of the display touch imaging system. They integrate components such as resistors, regulators, and power transistors, and are responsible for driving the display panel and controlling the drive current.

[0559] Figure 69 and Figure 70 This shows one of the package structures for the display driver chip DDIC. Figure 70 It is along Figure 69The cross-sectional view of the MM direction, this type of packaging structure can be called chip on panel (COP) package.

[0560] like Figure 69 and Figure 70 The edge portion of the display screen 112 is bent so that the display screen 112 forms a display area AA and a lower border area CC, as well as an edge bending area BB connecting the display area AA and the lower border area CC.

[0561] Figure 69 and Figure 70 The display area AA includes: the bent portion as described in the above embodiment and the non-bent portion connected to the bent portion. Both the bent portion and the non-bent portion connected to the bent portion serve as display areas for showing the image to the user. Figure 69 and Figure 70 The edge bend area BB and the bottom border area CC are both treated as non-display parts.

[0562] The display driver chip 13 is located on the lower bezel area CC. Other electronic components 14, such as touch chip (TPIC), capacitors, resistors, etc., are located on the circuit board 12 electrically connected to the main circuit board, such as on a flexible printed circuit (FPC). The circuit board 12 extends in a direction parallel to the lower bezel area CC. The circuit board 12 is then connected to the lower bezel area CC through a bonding structure 16, thereby realizing the signal interconnection between the electronic components 14 on the circuit board 12 and the display driver chip 13.

[0563] like Figure 71 After the edge bending area BB is bent, in order to improve the strength of the area between the display area AA and the lower border area CC, some film structures are also set in the area between the display area AA and the lower border area CC. For example, see Figure 71 The film structure includes a support plate 111 and a screen support layer 123. The screen support layer 123 is connected to the display area AA of the display screen 112 through a filling layer 121, and the support plate 111 is connected to the lower bezel area CC of the display screen 112 through a filling layer 122.

[0564] Figure 71 The film structure stacked in the area between the display area AA and the lower border area CC is just one example; some film structures can be added or removed.

[0565] In some examples, such as Figure 71The edge bending area BB of the display screen 112 is suspended in the air. The entire edge bending area BB is in a natural bending state. In order to prevent interference and impact between structural components, sufficient clearance space needs to be reserved between the display module and the housing 100. As the bending radius of the edge bending area BB becomes smaller and smaller, the impact resistance and compression resistance of the edge bending area BB becomes worse and worse.

[0566] To improve the impact and compression resistance of the edge bending area BB, embodiments of this application provide some achievable structures, as shown in the following examples.

[0567] like Figure 72 As shown, Figure 72 This is a partial structural diagram of the display module provided in an embodiment of this application. The display screen 112 of the display module includes a display area AA, a lower border area CC, and an edge bending area BB connecting the display area AA and the lower border area CC.

[0568] See Figure 72 The side of the edge-bending region BB closest to the center of the arc-shaped structure is filled by the first fill layer 171. In one example, at least a portion of the suspended area of ​​the edge-bending region BB near the center of the arc-shaped structure can be filled by the first fill layer 171, for example, the suspended area can be filled by the first fill layer 171.

[0569] exist Figure 72 In the example shown, the first filler layer 171 fills the suspended area near the center of the arc structure in the edge bending region BB, which can improve the strength of the edge bending region BB and enhance its resistance to compression and impact.

[0570] Figure 73 This is a partial structural diagram of another display module provided in an embodiment of this application. Figure 73 In this configuration, the display cover 113, located on one side of the display surface of the display screen 112, extends beyond the edges of other layers in the display module to protect other layers, such as the display screen 112 and the polarizer (which serves as the functional layer 120). In some scenarios, see... Figure 73 The display cover 113 needs to be close to the housing 100 and fixed relative to the housing 100, so that the entire display module is relatively fixed to the housing.

[0571] To provide a certain amount of bending freedom for the edge bending area BB of the flexible display screen 112, such as Figure 73 This indicates that there is a gap between the cover plate 113 and the edge bending area BB. To improve the compression and impact resistance of the edge bending area BB, such as... Figure 73 As shown, a second filler layer 172 can be filled in the gap between the display cover 113 and the edge bending area BB.

[0572] Figure 74 This is a partial structural diagram of another display module provided in an embodiment of this application. Figure 74 In this process, not only is a second filling layer 172 filled in the gap between the display cover plate 113 and the edge bending area BB, but the edge bending area BB is also filled with a first filling layer 171 on the side near the center of the arc structure. This can further improve the strength of the edge bending area BB and enhance its resistance to bending and impact.

[0573] In some examples, the elastic modulus of the first filler layer 171 and the second filler layer 172 is relatively small. For example, the elastic modulus may be ≥5 MPa.

[0574] use Figure 74 In the example shown, the elastic modulus of the first filler layer 171 can be greater than the elastic modulus of the second filler layer 172.

[0575] The first filler layer 171 and the second filler layer 172 can be made of a variety of materials. For example, they can be silicone, moisture-curing adhesive, etc.

[0576] In the feasible manufacturing process, after the various layers of the display module are stacked, adhesive is applied to the edge bending area (BB) while it is flattened (the amount of adhesive is precisely controlled by calculation, and overflow space is reserved to ensure that the adhesive can fill the area after bending). After UV irradiation for pre-curing, the surface of the adhesive is shaped but still retains fluidity, allowing it to fill the corresponding area according to the shape of the bending zone. The bending process is carried out in this state. Finally, thermosetting (e.g., curing temperature less than or equal to 65°C) is used to finally cure the adhesive, achieving the designed performance and improving the reliability of the edge bending area (BB).

[0577] In foldable electronic devices, multi-fold designs are increasingly favored by users, such as tri-fold electronic devices. When the electronic device is in the closed state, the non-bending area of ​​the display module is exposed. To improve the ability of this exposed non-bending area to resist external damage, the thickness of this non-bending area can be increased to improve rigidity and strength.

[0578] like Figure 75As shown, the various film layers in the display module 11 are connected together, forming a sheet-like integrated structure. For example, the protective layer 114 in the cover plate 110 is a continuous integrated structure in both the non-bending and bending areas, with each area having the same thickness. Similarly, the display cover plate 113 in the cover plate 110 has the same thickness in each area. When it is necessary to increase the thickness of the non-bending area B1 in the display module, the thickness of other areas (such as bending area A1, non-bending area B2, bending area A2, and non-bending area B3) will also increase accordingly, resulting in a larger overall thickness when the device is folded.

[0579] Even though increasing the thickness of the display module 11 improves the rigidity of the non-bending area B1, the thicker screen will affect the bending performance of the bending areas A1 and A2, increase the rebound force of the bending areas A1 and A2, and reduce the user experience.

[0580] This application provides some display module embodiments that can not only improve the stiffness of the exposed non-bending areas, but also without weakening the bendability of the bending areas.

[0581] Figure 76 This is a structural diagram of a display module according to an embodiment of this application. The display screen 112 in the display module 11 includes: a first non-bent portion, a second non-bent portion, a third non-bent portion, a first bent portion, and a second bent portion; the first bent portion connects the first non-bent portion and the second non-bent portion, and the second bent portion connects the second non-bent portion and the third non-bent portion.

[0582] The cover plate 110 in the display module 11 includes a first non-bending region, a second non-bending region, and a third non-bending region, a first bending region connecting the first non-bending region and the second non-bending region, and a second bending region connecting the second non-bending region and the third non-bending region.

[0583] The first non-bent portion of the display screen 112 corresponds to the first non-bent area of ​​the cover plate 110, the first bent portion of the display screen 112 corresponds to the first bent area of ​​the cover plate 110, the second non-bent portion of the display screen 112 corresponds to the second non-bent area of ​​the cover plate 110, the second bent portion of the display screen 112 corresponds to the second bent area of ​​the cover plate 110, and the third non-bent portion of the display screen 112 corresponds to the third non-bent area of ​​the cover plate 110.

[0584] The first bending area, the first bending portion, the second bending area, and the second bending portion can all bend along the bending line to switch between an unfolded state and a closed state.

[0585] Figure 76 Taking a three-screen folding screen as an example, in other examples, it is possible to... Figure 76 Based on the structure shown, more bending and non-bending areas can be added to form electronic devices such as four-screen folding and five-screen folding.

[0586] like Figure 76 The thickness of the first non-bending area of ​​the cover plate 110 is d1, and the thickness of the second non-bending area is d2. The thicknesses d1 and d2 are not equal; for example, the thickness d1 can be greater than the thickness d2.

[0587] Figure 77 This is a structural diagram of another display module provided in an embodiment of this application. And the above... Figure 76 Similarly, the thickness of the first non-bending area of ​​the cover plate 110 is d1, and the thickness of the second non-bending area is d2. The thicknesses d1 and d2 are not equal, with d1 being greater than d2.

[0588] Figure 78 This is a structural diagram of another display module provided in an embodiment of this application. And the above... Figure 76 and Figure 77 Similarly, in cover plate 110, the thickness d1 of the first non-bending region is not equal to the thickness d2 of the second non-bending region, with thickness d1 being greater than thickness d2.

[0589] The thickness dimensions mentioned in the embodiments of this application refer to: such as Figure 76 The dimensions along the stacking direction (P direction) of multiple film layers.

[0590] Figure 76 , Figure 77 and Figure 78 In the three different examples of the module 11 shown, the thickness d4 of the first bent region of the cover plate 110 is not constant, but gradually decreases along the direction away from the first non-bent region, or from the first non-bent region to the second non-bent region, so that the thickness d2 is less than the thickness d1.

[0591] like Figures 76 to 78 In the cover plate 110, the first non-bending area is a thick area, the second non-bending area is a thin area, and the first bending area connecting the first non-bending area and the second non-bending area is a thin-thickness transition area.

[0592] Figure 76 , Figure 77 and Figure 78 The differences between the three different examples of module 11 shown include:

[0593] Figure 76In the cover plate 110, the thickness of the second bending region is d5, the thickness of the third non-bending region is d3, and the thicknesses d2, d5, and d3 are equal. The first non-bending region is a thick region, the first bending region is a thickness transition region, and the second non-bending region, the second bending region, and the third non-bending region are thin regions of equal thickness.

[0594] and the above Figure 76 compared to, Figure 77 In the example shown, not only is the thickness d4 of the first bent region not a constant value, but the thickness d2 of the second non-bent region is also not a constant value. In some examples, the thickness of the first bent region and the second non-bent region of the cover plate 110 gradually decreases along the direction away from the first non-bent region, which can mask the visual effect of uneven thickness of the entire display module.

[0595] exist Figure 77 In the case of the cover plate 110, the thickness of the second bent area and the third non-bent area are equal. That is, the thickness d5 is equal to the thickness d3.

[0596] exist Figure 77 In the diagram, the first non-bending region is the thickest region, the first bending region and the second non-bending region are the transitional regions between thick and thin regions, and the second bending region and the third non-bending region are thin regions of equal thickness.

[0597] and the above Figure 76 and Figure 77 In comparison, Figure 78 In this design, not only are the thicknesses of the first bent area and the second non-bent area of ​​the cover plate 110 not constant, but the thicknesses of the second bent area and the third non-bent area of ​​the cover plate 110 are also not constant. Along the direction away from the first non-bent area, the thicknesses of the first bent area, the second non-bent area, the second bent area, and the third non-bent area of ​​the cover plate 110 gradually decrease. This further masks the visual effect of uneven thickness across the entire display module.

[0598] Figure 79 It is Figure 76 The present application provides a structural diagram of the display module 11 after bending. The thickness of the exposed (visible to the user when folded) first non-bending area is greater than the thickness of the non-exposed (invisible to the user when folded) second non-bending area. The first bending area connected to the exposed first non-bending area is designed with an unequal thickness structure. Even if the thickness of the first non-bending area is increased to improve its rigidity and strength, it will not affect the bendability of the bending area. Nor will it increase the thickness of other areas, so the overall thickness will not be significantly increased when the device is in a folded state.

[0599] In some examples, the above Figures 76 to 78The example's folded area can form an inward fold, or it can form an outward fold. For example, Figure 79 As shown in the folded configuration, the first folded area forms an outward folded area, and the second folded area forms an inward folded area. The first non-folded area is exposed and visible to the user, while the second and third non-folded areas are opposite and not visible to the user.

[0600] like Figure 80 , Figure 80 This is a structural diagram of a display module according to an embodiment of this application. The thickness of the display cover plate 113 located in the first non-bending region is greater than the thickness located in the second non-bending region. Along the direction away from the first non-bending region, the thickness of the display cover plate 113 located in the first bending region gradually decreases.

[0601] exist Figure 80 In this process, the thickness of the protective layer 114 is equal in all bending areas and in all non-bending areas.

[0602] Figure 81 This is a structural diagram of another display module provided in the embodiments of this application. In this structure, the thickness of the protective layer 114 located in the first non-bending region is greater than the thickness located in the second non-bending region, and the thickness of the protective layer 114 located in the first bending region gradually decreases along the direction away from the first non-bending region.

[0603] exist Figure 81 In the middle, it is shown that the thickness of the cover plate 113 is equal in each bending area and each non-bending area.

[0604] Figure 82 This is a structural diagram of another display module provided in an embodiment of this application. And the above... Figure 81 In contrast, in this structure, along the direction away from the first non-bending region, the thickness of the first bending region and the thickness of the second non-bending region in the protective layer 114 gradually decrease, thus widening the thickness transition area of ​​the protective layer 114.

[0605] Figure 83 This is a structural diagram of another display module provided in an embodiment of this application. (And the above...) Figure 81 and Figure 82 In contrast, in this example, in the protective layer 114, the thicknesses of the first bent region, the second non-bent region, the third non-bent region, and the third non-bent region gradually decrease along the direction away from the first non-bent region. This further widens the thickness transition area of ​​the protective layer 114.

[0606] The above Figures 81 to 83In this example, the protective layer 114 is designed with an uneven thickness structure. In other examples, the uneven thickness transition zone can be set in other film layer structures, for example, in the display cover plate 113. Figures 81 to 83 The structure shown.

[0607] Some examples provided in this application, such as Figure 84 The display cover 113 or protective layer 114 may include: substrate 11D and buffer layer 11B.

[0608] The substrate 11D and the buffer layer 11B can be connected by an adhesive layer 11C, and an adhesive layer 11A connects these stacked film structures to other layer structures. In some examples, when Figure 84 When the protective layer 114 is shown, the structure including the substrate 11D, the adhesive layer 11C and the buffer layer 11B can be connected to the display cover plate 113 using the adhesive layer 11A.

[0609] Among the available materials, the substrate 11D can be selected from at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0610] In some examples, the buffer layer 11B is an elastomer film material, and the elastic modulus of the buffer layer 11B is less than that of the substrate 11D. The buffer layer 11B can be selected from at least one of the following elastomer film materials: thermoplastic polyurethane elastomer (TPU), thermoplastic polyamide elastomer (TPAE), etc.

[0611] The adhesive layers 11A and 11C can be selected from at least one of the following: optically clear adhesive (OCA), optically clear resin (OCR), acrylic resin, epoxy resin, etc.

[0612] See Figure 84 In this embodiment, the buffer layer 11B located in the first bending region is designed with an unequal thickness structure. Along the direction away from the first non-bending region, the thickness of the buffer layer 11B located in the first bending region gradually decreases, making the protective layer 114 or the display cover plate 113 located in the first bending region a transition zone of thickness.

[0613] exist Figure 84 In this process, the thickness of substrate 11D can be from 25 μm to 75 μm. The thicknesses of adhesive layer 11A and adhesive layer 11C can be from 25 μm to 50 μm.

[0614] The thickness of the buffer layer 11B located in the first non-bending region is 75 μm to 150 μm, and the thickness of the buffer layer 11B located in the second non-bending region, the second bending region, and the third non-bending region is 25 μm to 75 μm.

[0615] Figure 85 This is a structural diagram of another display cover plate 113 or protective layer 114 provided in an embodiment of this application. In this example, the substrate 11D located in the first bending region is designed with an uneven thickness structure. Along the direction away from the first non-bending region, the thickness of the substrate 11D located in the first bending region gradually decreases, making the protective layer 114 or display cover plate 113 located in the first bending region a thickness transition zone.

[0616] Figure 86 This is a structural diagram of another display cover 113 or protective layer 114 provided in an embodiment of this application. (The above...) Figure 85 In contrast, not only is the buffer layer 11B located in the first bending region designed with an uneven thickness structure, but the buffer layer 11B located in the second non-bending region is also designed with an uneven thickness structure. This is to reduce the visual effect of uneven thickness of the entire display module.

[0617] Figure 87 This application provides a structural diagram of another display cover plate 113 or protective layer 114. In some examples, the thickness of the buffer layer 11B is relatively large, for example, reaching 100 μm. Due to the thickness of the buffer layer, the strain generated on the upper and lower surfaces of the film material when the display module is bent is more likely to enter the plastic deformation stage.

[0618] When the display module is bent, it enters a plastic deformation stage to reduce the strain generated on the upper and lower surfaces of the display module, thereby improving its bendability. In some examples, such as... Figure 87 The buffer layer 11B includes a first buffer layer 11B1 and a second buffer layer 11B2. The first buffer layer 11B has a uniform thickness, while the second buffer layer 11B2, located in the first bending region, is designed with a non-uniform thickness. The non-uniformly thick second buffer layer 11B2 is located further away from the display screen than the uniformly thick first buffer layer 11B1, meaning it is closer to the interface visible to the user. In other examples, the uniformly thick first buffer layer 11B1 may also be closer to the interface visible to the user than the non-uniformly thick second buffer layer 11B2.

[0619] See Figure 87 The first buffer layer 11B1 is connected to the second buffer layer 11B2 through the adhesive layer 11E, and the second buffer layer 11B2 is connected to the substrate 11D through the adhesive layer 11C.

[0620] Figure 88This is a structural diagram of another display cover plate 113 or protective layer 114 provided in the embodiments of this application. In some optional processes, a coating process can be used to bond the buffer layer 11B to the substrate 11D. The adhesive layer used to connect the buffer layer 11B and the substrate 11D can be removed, reducing the overall thickness of the display module without weakening the rigidity of the non-bending area or the bendability of the bending area.

[0621] Figure 88 The material of the buffer layer 11B in the example can be at least one of the following: thermoplastic polyurethane elastomer, silicone gel, and shear thickening material.

[0622] See Figure 88 In this example, the buffer layer 11B located in the first bending region is designed as a structure with unequal thickness, while the thickness of each region of the substrate 11D is equal.

[0623] Figure 89 This is a structural diagram of another display cover plate 113 or protective layer 114 provided in the embodiments of this application. In some optional processes, a coating process can also be used to bond the buffer layer 11B to the substrate 11D. In this example, the buffer layer 11B can be made of an adhesive material, such as optically transparent adhesive (OCA). This buffer layer 11B is not only an elastomer film material, but also has a connecting function, eliminating the need for an adhesive layer 11A. This can further reduce the thickness of the display module.

[0624] See Figure 89 In this example, the buffer layer 11B located in the first bending region is designed as a structure with unequal thickness, while the thickness of each region of the substrate 11D is equal.

[0625] To improve the stiffness of the exposed non-bending regions without compromising the bendability of the bending regions, embodiments of this application also provide some feasible structures, as follows:

[0626] Figure 90 This is a structural diagram of a display module according to an embodiment of this application. In the cover plate 110 of the display module 11, the elastic modulus of the first non-bending region is greater than that of the first bending region. The cover plate 110 includes a hard region with a larger elastic modulus and a soft region with a smaller elastic modulus.

[0627] In some examples, when the cover plate 110 includes a display cover or a protective layer, hard and soft areas can be provided in at least one of the display cover and the protective layer. For example, Figure 91 This is a structural diagram of a display cover plate 113 or protective layer 114 provided in an embodiment of this application. It includes a substrate 11D and a buffer layer 11B, which are connected by an adhesive layer 11C.

[0628] like Figure 91 The buffer layer 11B includes a hard region 11B01 (also called the first part) and a soft region 11B02 (also called the second part). The elastic modulus of the hard region 11B01 is greater than that of the soft region 11B02. The hard region 11B01 is located in the first non-bending region, and the soft region 11B02 may be located in at least one of the first bending region and the second bending region.

[0629] exist Figure 91 In this structure, the hard region 11B01 and the soft region 11B02 are a single, interconnected structure. In some optional process steps, a buffer layer material can be coated onto the substrate first, and then cured in sections by UV (ultraviolet light) to obtain buffer materials with different hardnesses. In other optional process steps, the buffer layer material can be heated in sections to obtain portions with different elastic moduli, thus creating hard and soft regions.

[0630] The buffer layer 11B is divided into a hard region 11B01 and a soft region 11B02 with different elastic moduli. The hard region 11B01 is located in the first non-bending region, which can improve the stiffness of the first non-bending region. The soft region 11B02 with a smaller elastic modulus is located in the bending region to ensure that the bending region has better bendability.

[0631] exist Figure 91 In the middle, the elastic modulus of the buffer layer 11B (which can be called the third part) located in the second non-bending region and the third non-bending region can be less than the elastic modulus of the hard region 11B01 and greater than the elastic modulus of the soft region 11B02.

[0632] In some examples, in order to improve the stiffness of the second and third non-bending regions, the elastic modulus of the buffer layer 11B located in the second and third non-bending regions can be equal to the elastic modulus of the hard region 11B01.

[0633] When the elastic modulus of the buffer layer 11B located in the second and third non-bending regions is less than the elastic modulus of the hard region 11B01 but greater than the elastic modulus of the soft region 11B02, a buffer material can be coated first, at which point its modulus is lower. Then, it can be cross-linked by local UV curing or heating. By controlling the UV energy or heating temperature, a portion with a lower modulus and a portion with a higher modulus can be obtained.

[0634] Figure 92 This is a structural diagram of another display cover plate 113 or protective layer 114 provided in the embodiments of this application. It includes a substrate 11D and a buffer layer 11B, which are connected by an adhesive layer 11C.

[0635] In this example, the buffer layer 11B includes a hard portion 11B11 with a higher elastic modulus and a soft portion 11B12 with a lower elastic modulus, which are joined together. The hard portion 11B11 is located in a first non-bending region, and the soft portion 11B12 is located in at least one of the first bending region and the second bending region.

[0636] In some examples, such as Figure 92 The hard part 11B11 and the soft part 11B12 can be joined together using an adhesive layer 11B13. For example, when an adhesive layer 11C is applied to one side of the buffer layer 11B, the adhesive can overflow into the gap between the hard part and the soft part, thereby bonding the hard part and the soft part together.

[0637] See Figure 92 In order to improve the stiffness of the second and third non-bending regions, the elastic modulus of the buffer layer 11B located in the second and third non-bending regions can be equal to the elastic modulus of the hard part.

[0638] In other examples, the elastic modulus of the buffer layer 11B located in the second and third non-bending regions can be less than the elastic modulus of the hard portion and greater than the elastic modulus of the soft portion.

[0639] exist Figure 92 In the example, the rigid portion 11B11 can be made of at least one of polyethylene terephthalate (PET) and transparent polyimide (CPI). The soft portion 11B12 can be made of at least one of thermoplastic polyurethane elastomer (TPU) and thermoplastic polyamide elastomer (TPAE).

[0640] Figure 93 This is a structural diagram of another display cover 113 or protective layer 114 provided in an embodiment of this application. The buffer layer 11B includes a first buffer layer 11B1 and a second buffer layer 11B2. The first buffer layer 11B1 includes a hard region 11B01 with a larger elastic modulus and a soft region 11B02 with a smaller elastic modulus. In the second buffer layer 11B2, the portion located in the first bending region has a unequal thickness structure. This embodiment combines the unequal thickness design and unequal elastic modulus design of the buffer layer.

[0641] When the display module is in a folded state and the first non-bent area is exposed, the first bending area connecting the first and second non-bent areas needs to have sufficient resistance to external impacts. For example, when a folded electronic device is dropped, the first bending area may be damaged by the impact of the hinge mechanism on one side and the ground.

[0642] This application provides some novel display modules 11, such as... Figure 94 A buffer pad 127 is provided on the side of the support plate 111 away from the display screen 112. The buffer pad 127 is located on the support plate 111 at a position opposite to the first bending area.

[0643] In some examples, in order to improve the bendability of the support plate 111, a hollow structure 111a (which may be called a bamboo book) is provided in the part opposite to the first bending area, and a buffer pad 127 is provided at the position opposite to the hollow structure 111a.

[0644] The cushioning pad 127 can be a single membrane structure or a multi-layer membrane structure.

[0645] For example, the cushioning pad 127 can be selected from at least one of the following materials: stainless steel (SUS), thermoplastic polyurethane elastomer (TPU elastomer), porous foam material, PET film material, etc.

[0646] Figure 95 This is a structural diagram of another display module provided in an embodiment of this application. In this embodiment, the buffer pad 127 is disposed within the support plate 111. For example, a groove can be formed in the support plate 111, and the buffer pad 127 can be disposed within the groove, which is located at a position opposite to the first bending area.

[0647] Figure 96 This is a structural diagram of another display module provided in an embodiment of this application. In this embodiment, the buffer pad 127 is disposed on the rotating shaft mechanism 200 located on one side of the display module.

[0648] like Figures 94 to 96 Because it includes a buffer pad 127, when the first bending area is subjected to an external impact, the buffer pad 127 can reduce the degree of damage to the display module.

[0649] Figure 97 This is a structural diagram of another display module provided in an embodiment of this application. In this structure, not only is the display cover plate 113 located in the first bending area designed with an unequal thickness, but a buffer pad 127 is also provided on the side of the support plate 111 away from the display screen 112. This not only improves the rigidity of the exposed non-bending parts, but also does not weaken the bendability of the bending parts, and can also reduce the degree of damage to the bending parts of the display module, thereby improving the performance of the display module.

[0650] In other examples, the various regions of the protective layer 114 can be designed as structures of unequal thickness.

[0651] like Figure 98As shown, the cover plate (e.g., display cover, protective layer) located on one side of the display surface of the display screen 112 is designed with a structure of unequal elastic modulus. Furthermore, a buffer pad 127 is disposed on the support plate 111 at a position opposite to the first bending area. This not only optimizes the bendability of the bent portion of the display module but also improves the impact and compression resistance of the bent portion.

[0652] When the cover plate 110 is designed as a structure with unequal thickness or unequal modulus as shown above, such as Figure 99 As shown, a functional module 300 can be provided on the side of the support plate 111 away from the display screen 112. The cover plate 110 has an uneven thickness structure. In order to improve the impact and compression resistance of the display module 11, the light-transmitting mirror 400 provided in the support plate 111 can be designed as an integral structure with the support plate 111. Alternatively, a groove can be made in the display screen 112 at the position corresponding to the light-transmitting mirror 400, and an optical adhesive layer 500 can be provided in the groove.

[0653] In other examples, it is also possible Figure 99 The cover plate 110 shown is designed as a non-uniform modulus structure.

[0654] Figure 99 The cover plate 110 has an unequal thickness structure or an unequal modulus structure, which will not be elaborated here, but can be referred to the above structural description.

[0655] When the cover plate 110 is designed as a structure with unequal thickness or unequal modulus as shown above, such as Figure 100 As shown, the support plate 111 can be designed as a structure including a first sub-support plate 1111 and a second sub-support plate 1112. A hollow structure is provided on each sub-support plate. When the display module is flat, the hollow structures on the two opposite sub-support plates support each other, which improves the flattening rigidity of the bent part. When the display module is bent, the two opposite sub-support plates are partially separated, which ensures the bending performance.

[0656] The structure that can be achieved by the first sub-support plate 1111 and the second sub-support plate 1112 can refer to the structure described above.

[0657] The cover plate 110 shown above is designed with an unequal thickness structure or an unequal modulus structure. Alternatively, a telescopic support structure 205 can be provided on the side of the rotating shaft mechanism 200 away from the display module.

[0658] The telescopic support structure 205 includes an extended state and a compressed state. When the display module 11 is in the flattened state, the telescopic support structure 205 is in the extended state, and the portion of the telescopic support structure 205 near the display module 11 abuts against the display module 11; when the display module 11 is in the closed state, the telescopic support structure 205 switches to the compressed state.

[0659] When the display module 11 is in a flattened state, the telescopic support structure 205 abuts against the display module 1 to support the flattened display module 11, thereby improving the flattening rigidity and flatness of the display module.

[0660] When the display module 11 is in the closed state, the telescopic support structure 205 retracts, providing sufficient clearance and ensuring that the bent part of the display module 11 has high bendability, thereby reducing stress and lowering the possibility of creases appearing in the display module.

[0661] The structure that can be achieved by the telescopic support structure 205 can be referred to the above.

[0662] The display screen structure of the aforementioned display module 11, for example, includes not only inorganic dielectric layers but also organic dielectric layers in the interlayer dielectric layer. This structure can also be applied to display modules with unequal thickness or unequal modulus structures. Specific display screen structures can be found in the above structural description.

[0663] When the cover plate 110 is designed as a structure with unequal thickness or unequal modulus, as shown above, in order to improve the impact and compression resistance of the edge bending area BB, a filler layer can be filled on the side of the edge bending area BB near the center of the arc, or a filler layer can be filled in the gap between the cover plate and the edge bending area BB. The structure of these filler layers and the materials that can be selected are not described in detail here, but can be referred to the above description.

[0664] In some examples, when the cover plate 110 is designed as a structure with unequal thickness or unequal modulus as shown above, grooves can be formed at the corresponding bent portions of the cover plate's substrate, and the grooves can be filled with a filler material with a lower elastic modulus. The structure of the grooves can be referred to in the examples above.

[0665] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0666] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display screen includes a first display area and a second display area. The under-screen area corresponding to the first display area is used to set up functional modules. A groove is provided below the first display area. A cover plate is disposed on one side of the display surface of the display screen; An optical adhesive layer is used to fill the groove provided below the first display area. The optical adhesive layer and the light-transmitting lens are stacked. The functional module is provided below the light-transmitting lens. The light-transmitting lens and the support plate are an integral structure. The support plate is provided below the display screen and is used to support the display screen. The light-transmitting lens includes: Body part; An extension portion disposed along the periphery of the main body portion and connected to the main body portion; The main body is disposed within the support plate, and the extension is located on the side of the support plate away from the display screen; The light-transmitting lens also includes a plurality of protrusions, which are located on the extension and are arranged around the periphery of the extension; The plurality of protrusions are disposed within the support plate.

2. The display module according to claim 1, characterized in that, The light-transmitting mirror and the support plate are integrally molded injection-molded structural components.

3. The display module according to claim 1 or 2, characterized in that, The cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area, and a second bending area. The first bending area connects the first non-bending area and the second non-bending area, and the second bending area connects the second non-bending area and the third non-bending area. Both the first bending area and the second bending area can be bent along a bending line to switch between an unfolded state and a closed state. The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

4. The display module according to claim 3, characterized in that, The thickness of the first non-bending region is greater than the thickness of the second non-bending region.

5. The display module according to claim 4, characterized in that, The cover plate includes: A substrate and a first buffer layer, wherein the first buffer layer is closer to the display screen than the substrate; The thickness of the substrate located in the first non-bending region is greater than the thickness of the substrate located in the second non-bending region, and / or; The thickness of the first buffer layer located in the first non-bending region is greater than the thickness of the first buffer layer located in the second non-bending region.

6. The display module according to claim 5, characterized in that, From the first non-bending region to the second non-bending region, the thickness of the first buffer layer located in the first bending region gradually decreases.

7. The display module according to claim 5, characterized in that, The cover plate includes: The second buffer layer includes a first part and a second part; The first part of the second buffer layer is located in the first non-bending region, and the second part of the second buffer layer is located in the first bending region. The elastic modulus of the first part of the second buffer layer is greater than that of the second part of the second buffer layer.

8. An electronic device, characterized in that, include: The display module as described in any one of claims 1 to 7; The functional module is located in the under-screen area corresponding to the first display area.

9. The electronic device according to claim 8, characterized in that, The functional modules include a camera module.

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