Semiconductor processing apparatus and its transfer chamber having a focus ring thickness detection device

Abstract

A semiconductor processing device and its transmission cavity equipped with a focusing ring thickness detection device are disclosed. The focusing ring thickness detection device is installed within the transmission cavity to simultaneously monitor the thickness of focusing rings in multiple processing cavities, significantly reducing device costs. The focusing ring thickness detection device includes an alignment control component and a camera component. The alignment control component controls the camera component's lifting, rotation, pitch, or translation, allowing the camera component to more accurately align with the focusing rings in different processing cavities. This greatly reduces blind spots and expands the shooting angle range. The camera component captures near-end and far-end images of the focusing ring from different shooting heights and angles. By superimposing and comprehensively judging multiple images taken at different heights and angles, the accuracy is improved. By comparing the thickness of different parts of the same focusing ring, the degree of focusing ring wear can be judged more comprehensively and accurately, further improving monitoring precision.

Description

Technical Field

[0001] The present invention relates to a semiconductor processing device and a transmission cavity having a focusing ring thickness detection device. Background Technology

[0002] A typical semiconductor processing unit consists of multiple processing chambers, where semiconductor processing processes are performed simultaneously to improve efficiency and throughput. During the etching process, the substrate to be etched is placed on an electrostatic chuck on a base within the processing chamber. Plasma is generated within the chamber to etch the substrate. A focusing ring surrounds the electrostatic chuck to regulate the electric field and temperature distribution around the substrate. The focusing ring is constantly exposed to the plasma environment, and its upper surface is easily corroded and worn away. When the wear reaches a certain level, the thickness of the focusing ring decreases, requiring timely replacement. Typically, at least one detection device is installed in each processing chamber to monitor the thickness changes of the focusing ring in real time. However, due to the space constraints within the processing chamber, the detection range of the detection device is limited, often only able to detect a localized area of ​​the focusing ring, resulting in decreased accuracy. Furthermore, at least six detection devices are required in a single semiconductor processing unit, leading to high costs. In addition, the detection device needs to be exposed to plasma and various reaction byproducts within the plasma processing chamber, requiring an additional protective layer on the exposed surface. All these factors prevent the cost of the focusing ring thickness detection device from being minimized.

[0003] The statements herein provide only background information in relation to this invention and do not necessarily constitute prior art. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor processing device and its transmission cavity with a focusing ring thickness detection device, which reduces device cost, reduces monitoring blind spots, and improves monitoring accuracy.

[0005] To achieve the above objectives, the present invention provides a transmission cavity for use in a semiconductor processing device. The transmission cavity is connected to a front-end module via a vacuum lock, and the transmission cavity connects to multiple processing cavities. A focusing ring is disposed within each processing cavity. The transmission cavity comprises:

[0006] cavity;

[0007] A robotic arm, disposed within the cavity, is used to transfer the substrate between the processing cavity and the vacuum lock;

[0008] A focusing ring thickness detection device is disposed at the top of the cavity; the focusing ring thickness detection device includes: an alignment control component connected to the top of the cavity and a camera component connected to the alignment control component, the alignment control component realizing the adjustment of the position and orientation of the camera component, so that the camera component is sequentially aligned with the focusing rings in the plurality of processing cavities.

[0009] The alignment control assembly includes a support rod and a connector; one end of the support rod is fixedly connected to the top of the cavity, and the other end of the support rod is connected to the connector, which is connected to the support rod and the camera assembly respectively.

[0010] Optionally, the alignment control component includes a first drive motor that drives the support rod to rise, fall, and rotate, thereby achieving the rising, falling, and rotating of the camera component; the connector enables the pitching of the camera component.

[0011] Optionally, the alignment control component includes a second drive motor that drives the support rod to rise and fall, thereby raising and lowering the camera component; the connector is a universal connector to enable the rotation and pitch of the camera component.

[0012] The alignment control assembly includes a sealing and protection assembly, which comprises an elastic covering layer and a sealing assembly. The elastic covering layer covers the support rod and the connector, and the sealing assembly is connected to the elastic covering layer and the top of the cavity, respectively.

[0013] The elastic coating layer is made of polymer material.

[0014] The sealing assembly includes a sealing ring, a magnetic fluid sealing device, and a bellows. The sealing ring is sleeved on the support rod, the magnetic fluid sealing device is sleeved on the sealing ring, and the bellows is connected to the magnetic fluid sealing device and the top of the cavity, respectively.

[0015] The alignment control component includes a magnetic levitation track disposed at the top of the cavity, and the camera component is movable along the magnetic levitation track to capture images of multiple focusing rings within the processing cavity.

[0016] The camera component is a monocular camera or a binocular camera.

[0017] The cavity has multiple first substrate transmission ports on its sidewalls. The transmission cavity is connected to the processing cavity through the first substrate transmission ports. At least one reference positioning mark is arranged around the first substrate transmission port.

[0018] The focusing ring thickness detection device includes: a controller, the controller circuit being connected to the alignment control component and the camera component, the controller controlling the alignment control component to realize the lifting, rotation and pitch of the camera component, and controlling the camera component to capture an image of the focusing ring in the processing cavity to calculate the thickness of the focusing ring.

[0019] The present invention also provides a semiconductor processing apparatus, comprising:

[0020] Front-end module;

[0021] The aforementioned transmission cavity;

[0022] At least one vacuum lock, one end of which is connected to the front-end module and the other end of which is connected to the transmission cavity;

[0023] Multiple processing cavities, each connected to the transmission cavity.

[0024] The processing chamber includes:

[0025] A vacuum reaction chamber, wherein a second substrate transmission port is provided on the side wall of the vacuum reaction chamber, and the second substrate transmission port is connected to the first substrate transmission port on the transmission chamber;

[0026] A base is disposed inside the vacuum reaction chamber;

[0027] An electrostatic chuck, which is mounted on the base, is used to place the substrate;

[0028] A focusing ring, which surrounds the electrostatic chuck, is used to adjust the electric field and temperature distribution around the substrate;

[0029] A cover ring, which surrounds the focusing ring, is used to support the focusing ring;

[0030] A lifting device, which is located below the focusing ring, is used to lift the focusing ring.

[0031] This invention places the focusing ring thickness detection device within the transmission cavity. The camera component in the focusing ring thickness detection device can be raised, lowered, rotated, tilted, or translated. Therefore, by setting only one focusing ring thickness detection device in the transmission cavity, the thickness of the focusing rings in multiple processing cavities connected to the transmission cavity can be monitored simultaneously, greatly reducing device costs. By rotating or translating the camera component, it can be more accurately aligned with the focusing rings in different processing cavities, significantly reducing blind spots and expanding the shooting angle range. By raising and lowering the camera component, images of the focusing ring can be captured from different shooting heights and angles. By superimposing and comprehensively judging multiple images captured at different heights and angles, accuracy is improved. By tilting the camera component, images of the near and far ends of the focusing ring can be selectively captured. By comparing the thickness of different parts of the same focusing ring, the degree of focusing ring wear can be judged more comprehensively and accurately, further improving monitoring precision. Attached Figure Description

[0032] Figure 1 This is a top view of the structure of a semiconductor processing device provided by the present invention.

[0033] Figure 2 yes Figure 1 Side sectional view.

[0034] Figure 3 This is a schematic diagram of the focusing ring thickness detection device in an embodiment of the present invention.

[0035] Figure 4 This is a schematic diagram of the working process of the focusing ring thickness detection device.

[0036] Figure 5 yes Figure 1 The view at point X shows the structure of the reference positioning mark.

[0037] Figure 6 This is a bottom view of the inside of the transmission cavity.

[0038] Figure 7 This is a schematic diagram of the focusing ring thickness detection device in another embodiment of the present invention.

[0039] Figure 8 This is a schematic diagram of a camera component in another embodiment of the present invention. Detailed Implementation

[0040] The following is based on Figures 1 to 8 The preferred embodiments of the present invention will be described in detail below.

[0041] like Figure 1 As shown, this invention provides a semiconductor processing apparatus comprising a transmission cavity 1 and multiple processing cavities 2 connected to the transmission cavity 1. The transmission cavity 1 is connected to a front-end module 4 via at least one vacuum lock 3. The front-end module 4 is an atmospheric environment used to store substrates to be processed and processed substrates. The vacuum lock 3 is used to isolate the atmospheric environment of the front-end module 4 from the vacuum environment in the transmission cavity 1, enabling the transfer of substrates between the front-end module 4 and the transmission cavity 1. The substrate to be processed from the front-end module 4 enters the transmission cavity 1 through the vacuum lock 3, is transferred through the transmission cavity 1 to each of the processing cavities 2 for etching, and the etched substrate is then transferred back to the transmission cavity 1 and then transferred to the front-end module 4 via the vacuum lock 3.

[0042] like Figure 1 and Figure 2As shown, the processing chamber 2 includes a vacuum reaction chamber 201. Inside the vacuum reaction chamber 201 is a base 202. An electrostatic chuck 203 is disposed on the base 202. A substrate is placed on the electrostatic chuck 203. A focusing ring 204 is disposed around the electrostatic chuck 203 to adjust the electric field and temperature distribution around the substrate. A covering ring 205 is disposed around the focusing ring 204 to support the focusing ring 204. Below the focusing ring 204 is a lifting device 206 for replacing the focusing ring 204. When the focusing ring 204 needs to be replaced, the lifting device 206 rises, lifting the focusing ring 204 vertically upward from its initial position to the required height, removing the old focusing ring 204. After the new focusing ring 204 is placed on the lifting device 206, the lifting device 206 descends, placing the new focusing ring 204 back to its initial position, and the etching process on the substrate continues.

[0043] A robotic arm 102 is disposed in the cavity 101 of the transmission cavity 1 for transporting the substrate. The side wall of the cavity 101 has a plurality of first substrate transmission ports 103. Correspondingly, the side wall of the vacuum reaction chamber 201 of the processing cavity 2 has a second substrate transmission port 207. Each second substrate transmission port 207 on the processing cavity 2 is matched with one first substrate transmission port 103 on the transmission cavity 1. The matched first substrate transmission ports 103 and second substrate transmission ports 207 together form a transfer port 5. The robotic arm 102 transfers the substrate between the processing cavity 2 and the transmission cavity through the transfer port 5.

[0044] A focusing ring thickness detection device 104 is disposed within the transmission cavity 1, located at the top of the cavity body 101. The focusing ring thickness detection device 104 includes an alignment control component 105 connected to the top of the cavity body 101 and a camera component 106 connected to the alignment control component 105. The alignment control component 105 controls the lifting, rotation, and pitch of the camera component 106. The focusing ring thickness detection device 104 also includes a controller (not shown in the figure). The controller circuitry connects the alignment control component 105 and the camera component 106. The controller controls the alignment control component 105 to control the lifting, rotation, and pitch of the camera component, and controls the camera component 106 to capture images of the focusing ring 204 in the processing cavity 2 to calculate the thickness of the focusing ring 204.

[0045] like Figure 3As shown, in one embodiment of the present invention, the alignment control assembly includes a support rod 107 and a connector 108. One end of the support rod 107 is connected to a drive motor 109, and the other end of the support rod 107 is connected to the connector 108. The connector 108 is connected to the camera assembly 106. In this embodiment, the camera assembly 106 is a monocular camera, and the drive motor 109 is a first drive motor. The first drive motor can output axial driving force and rotational driving force to the support rod 107, driving the support rod 107 to rise, fall, and rotate, thereby driving the connector 108 and the monocular camera 106 to rise, fall, and rotate. Accordingly, the connector 108 only needs to provide driving force to achieve the pitch of the monocular camera 106. The power line and control line of the connector 108 can be set inside the support rod 107 and led out to the outside of the transmission cavity 1 through the support rod 107 to ensure the sealing of the cavity 101 of the transmission cavity 1.

[0046] A through hole 110 is formed at the top of the cavity 101 of the transmission cavity 1. Since the drive motor 109 requires an external power supply and will generate electromagnetic interference, it is generally placed outside the transmission cavity 1, that is, above the cavity 101. The support rod 107 passes through the through hole 110, so that the connector 108 and the camera assembly 106 are located inside the cavity 101, so that the camera assembly 106 can monitor the thickness of the focusing ring 204 in each of the processing cavities 2 connected to the processing cavity 1. The through hole 110 is preferably located at the center of the top of the cavity 101, so that the distance between the support rod 107 and each of the processing cavities 2 is equal, that is, the distance between the camera assembly 106 and each of the processing cavities 2 is equal, avoiding inaccurate observations caused by unequal distances.

[0047] The support rod 107 is sealed to the top of the cavity 101 via a sealing assembly 111. The sealing assembly 111 includes a sealing ring 112, a magnetic fluid sealing device 113, and a bellows 114. The sealing ring 112 is sleeved on the support rod 107, and the magnetic fluid sealing device 113 is sleeved on the sealing ring 112 and is in close contact with the contact surface of the sealing ring 112. The bellows 114 is sleeved on the outside of the support rod 107, with one end of the bellows 114 fixedly connected to the magnetic fluid sealing device 113 and the other end fixedly connected to the top of the cavity 101. The sealing ring 112, the magnetohydrodynamic sealing device 113, and the bellows 114 seal the through hole 110, ensuring that the entire cavity 101 is in a completely sealed environment. During the lifting and rotation of the support rod 107, the sealing ring 112 moves with the support rod 107 and is in close contact with the contact surface of the support rod 107 without displacement between them, ensuring reliable sealing. The bellows 114 deforms as the support rod 107 lifts and lowers to accommodate the lifting stroke of the support rod 107. The magnetohydrodynamic sealing device 113 ensures that the support rod 107 remains well sealed when it rotates.

[0048] An elastic covering layer 115 is provided on the outside of the support rod 107 and the connector 108. One end of the elastic covering layer 115 is fixedly connected to the sealing ring 112, and the other end of the elastic covering layer 115 extends and wraps around the connector 108. The elastic covering layer 115 is made of polymer material, which does not generate particles and impurities during movement and friction. By covering the support rod 107 and the connector 108 with the elastic covering layer 115, the particles generated by the support rod 107 and the connector 108 during movement will be collected by the elastic covering layer 115 and will not fall into the cavity 101 of the transmission cavity 1, thus ensuring the cleanliness of the transmission cavity 1.

[0049] like Figure 4As shown, a focusing ring thickness detection device 104 installed inside the cavity 101 of the transmission cavity 1 can monitor the thickness of the focusing rings 204 in multiple processing cavities 2 connected to the transmission cavity 1, greatly reducing costs. When monitoring the focusing ring 204, the focusing ring 204 can remain stationary on the base 202, or the lifting device 206 can be raised to vertically lift the focusing ring 204, ensuring that the sidewalls of the focusing ring 204 are not obstructed by its outer covering ring 205. This allows the focusing ring 204 to be fully exposed in front of the lens of the camera assembly 106, enabling the camera assembly 106 to easily capture the entire thickness of the focusing ring 204, thereby improving the accuracy of monitoring. The alignment control component 105 drives the camera component 106 to rotate, allowing the camera component 106 to face the focusing ring 204 inside different processing cavities 2. The camera component 106 captures images of the focusing ring 204 inside the vacuum reaction chamber 201 of the processing cavity 2 through the transfer port 5 between the transfer cavity 1 and the processing cavity 2. The alignment control component 105 drives the camera component 106 to descend from the bottom of the cavity 101 to the lowest achievable position. During the descent, the camera component 106 can capture images of the focusing ring 204 from different heights. The alignment control component 105 can also adjust the pitch angle of the camera component 106 at the same time. The camera assembly 106 can capture images of the focusing ring 204 from different pitch angles. By superimposing and comprehensively judging the surface wear of the focusing ring, the accuracy is improved. By adjusting the pitch angle of the camera assembly 106, it is also possible to selectively capture near-end and far-end images of the focusing ring 204. By comparing the thickness of different parts of the same focusing ring 204, the degree of wear of the focusing ring can be judged more comprehensively and accurately. After the camera assembly 106 finishes capturing images, the alignment control assembly 105 drives the camera assembly 106 to the highest position to avoid interfering with the operation of the robotic arm 102.

[0050] like Figure 5As shown, in the second embodiment of the present invention, at least one reference positioning mark 116 is provided around the first substrate transmission port 103 on the side wall of the cavity 101 of the transmission cavity 1. This is used to correct the shooting height and shooting angle of the camera assembly 106, ensuring that two images taken before and after the focus ring wears out have the same shooting height and shooting angle, thus preventing errors in judging the focus ring wear caused by shooting errors. The reference positioning mark 116 can be set to any shape, such as a cross-shaped "+". When a new focus ring 204 is replaced in the processing cavity 2, the camera assembly 106 takes a reference image of the focus ring 204 at the set shooting height and shooting angle. After a long period of plasma etching, the camera assembly 106 is adjusted to the same shooting height and shooting angle as the reference image and takes another image of the focus ring 204. The wear of the focus ring 204 is calculated based on the two images taken. To ensure that the two consecutive shots have the same shooting height and angle, the camera assembly 106 is first set to wide-angle mode and focused on the reference positioning mark 116 on the side wall of the cavity 101. The height and angle of the camera assembly 106 are then corrected using the reference positioning mark 116. The reference positioning mark 116 should be located in the same position in the images in both shots to ensure that the camera assembly 106 has a stable and consistent shooting height and angle. After the shooting height and angle are corrected, the focal length of the camera assembly 106 is adjusted to focus on the focusing ring 204 in the processing cavity 2, and an image of the focusing ring 204 is captured.

[0051] In the third embodiment of the present invention, as Figure 3 As shown, the drive motor 109 is a second drive motor. This second drive motor only outputs axial driving force to the support rod 107, driving the support rod 107 to rise and fall, which in turn drives the connector 108 and the camera assembly 106 to rise and fall. The second drive motor only provides axial driving force, reducing the difficulty of motor control and lowering costs. Correspondingly, the connector 108 needs to be a universal connector to achieve the rotation and pitch of the camera assembly 106, ensuring that the alignment control component 105 can still achieve the rising, falling, rotating, and pitching of the camera assembly 106.

[0052] like Figure 6 and Figure 7As shown, in the fourth embodiment of the present invention, a magnetic levitation track 117 is provided on the top of the cavity 101 of the transmission cavity 1. At this time, no through hole is provided on the top of the cavity 101, and the entire cavity 101 is sealed. The length and shape of the magnetic levitation track 117 are adjusted according to the number and position of the processing cavities 2 connected to the transmission cavity 1. For example, if the three sides of the transmission cavity 1 are connected to the processing cavities 2, the magnetic levitation track 117 can be set as U-shaped, so that the magnetic levitation track 117 covers the range of all processing cavities 2. The support rod 107 is suspended on the magnetic levitation track 117. The support rod 107 can move along the magnetic levitation track 117. When monitoring the focusing ring 204 in different processing cavities 2, the support rod 107 can be moved along the magnetic levitation track 117 to the corresponding processing cavity 2 connected to the transmission cavity 1 at the film transfer port 5, so that the camera assembly 106 is closer to the film transfer port 5, which greatly reduces the shooting blind spot and expands the shooting angle range. The support rod 107 is magnetically suspended on the magnetic levitation track 117. The support rod 107 does not make substantial contact with the magnetic levitation track 117, and there is a distance between the support rod 107 and the top of the cavity 101. Therefore, no frictional particles are generated during the movement of the support rod 107, and the internal environment of the transmission cavity 1 is not contaminated. In this embodiment, since the support rod 107 is located inside the cavity 101, no drive motor is provided, and therefore the support rod 107 cannot be raised or lowered, thus eliminating the need for a bellows. The connector 108 can still have a mechanism for rotating and tilting the camera assembly, thus still requiring an elastic covering layer 115 and a sealing ring 112 to ensure the cleanliness of the transmission cavity 1. When not in use, the camera assembly can remain in a position that does not obstruct the robotic arm's movement, such as a corner between the openings of different processing cavities. Only when needed can the camera assembly be moved to a position directly facing the processing cavity opening, thus avoiding conflict with the position of the robotic arm. Alternatively, a drive motor can be installed on the aforementioned support rod 107, so that when the processing chamber is performing normal processes, the camera component stays above the operating height of the robotic arm, and when the focus ring thickness needs to be detected, the support rod 107 extends downward, and the camera component located at the lower end of the support rod descends to capture the side of the focus ring at a more horizontal position.

[0053] like Figure 8 As shown, in the fifth embodiment of the present invention, the camera assembly 106 adopts a binocular camera, with two cameras forming a shooting unit. The two cameras can rise, rotate, and tilt together, and the resulting graphic information can have a more 3D stereoscopic effect, making it easier to distinguish the shape and outline of the focusing ring.

[0054] This invention places the focusing ring thickness detection device within the transmission cavity. The camera component in the focusing ring thickness detection device can be raised, lowered, rotated, tilted, or translated. Therefore, by setting only one focusing ring thickness detection device in the transmission cavity, the thickness of the focusing rings in multiple processing cavities connected to the transmission cavity can be monitored simultaneously, greatly reducing device costs. By rotating or translating the camera component, it can be more accurately aligned with the focusing rings in different processing cavities, significantly reducing blind spots and expanding the shooting angle range. By raising and lowering the camera component, images of the focusing ring can be captured from different shooting heights and angles. By superimposing and comprehensively judging multiple images captured at different heights and angles, accuracy is improved. By tilting the camera component, images of the near and far ends of the focusing ring can be selectively captured. By comparing the thickness of different parts of the same focusing ring, the degree of focusing ring wear can be judged more comprehensively and accurately, further improving monitoring precision.

[0055] It should be noted that, in the embodiments of the present invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0056] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0057] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A transmission cavity for use in a semiconductor processing apparatus, the transmission cavity being connected to a front-end module via a vacuum lock, the transmission cavity connecting to multiple processing cavities, and a focusing ring being disposed in each processing cavity, characterized in that... The transmission cavity includes: cavity; A robotic arm, disposed within the cavity, is used to transfer the substrate between the processing cavity and the vacuum lock; A focusing ring thickness detection device is disposed at the top of the cavity; the focusing ring thickness detection device includes: an alignment control component connected to the top of the cavity and a camera component connected to the alignment control component, the alignment control component realizing the adjustment of the position and orientation of the camera component, so that the camera component is sequentially aligned with the focusing rings in the plurality of processing cavities.

2. The transmission cavity as described in claim 1, characterized in that, The alignment control assembly includes a support rod and a connector; one end of the support rod is fixedly connected to the top of the cavity, and the other end of the support rod is connected to the connector, which is connected to the support rod and the camera assembly respectively.

3. The transmission cavity as described in claim 2, characterized in that, The alignment control component includes a first drive motor, which drives the support rod to rise, fall, and rotate, thereby achieving the rising, falling, and rotating of the camera component; the connector enables the tilting of the camera component.

4. The transmission cavity as described in claim 2, characterized in that, The alignment control component includes a second drive motor, which drives the support rod to rise and fall, thereby raising and lowering the camera component; the connector adopts a universal connector to enable the rotation and tilting of the camera component.

5. The transmission cavity as described in claim 3 or 4, characterized in that, The alignment control assembly includes a sealing and protection assembly, which comprises an elastic covering layer and a sealing assembly. The elastic covering layer covers the support rod and the connector, and the sealing assembly is connected to the elastic covering layer and the top of the cavity, respectively.

6. The transmission cavity as described in claim 5, characterized in that, The elastic coating layer is made of polymer material.

7. The transmission cavity as described in claim 5, characterized in that, The sealing assembly includes a sealing ring, a magnetic fluid sealing device, and a bellows. The sealing ring is sleeved on the support rod, the magnetic fluid sealing device is sleeved on the sealing ring, and the bellows is connected to the magnetic fluid sealing device and the top of the cavity, respectively.

8. The transmission cavity as described in claim 1, characterized in that, The alignment control component includes a magnetic levitation track disposed at the top of the cavity, and the camera component is movable along the magnetic levitation track to capture images of multiple focusing rings within the processing cavity.

9. The transmission cavity as described in claim 1, characterized in that, The camera component is a monocular camera or a binocular camera.

10. The transmission cavity as claimed in claim 1, characterized in that, The cavity has multiple first substrate transmission ports on its sidewalls. The transmission cavity is connected to the processing cavity through the first substrate transmission ports. At least one reference positioning mark is arranged around the first substrate transmission port.

11. The transmission cavity as claimed in claim 1, characterized in that, The focusing ring thickness detection device includes: a controller, the controller circuit being connected to the alignment control component and the camera component, the controller controlling the alignment control component to realize the lifting, rotation and pitch of the camera component, and controlling the camera component to capture an image of the focusing ring in the processing cavity to calculate the thickness of the focusing ring.

12. A semiconductor processing apparatus, characterized in that, Include: Front-end module; The transmission cavity as described in any one of claims 1-11; At least one vacuum lock, one end of which is connected to the front-end module and the other end of which is connected to the transmission cavity; Multiple processing cavities, each connected to the transmission cavity.

13. The semiconductor processing apparatus as claimed in claim 12, characterized in that, The processing chamber includes: A vacuum reaction chamber, wherein a second substrate transmission port is provided on the side wall of the vacuum reaction chamber, and the second substrate transmission port is connected to a first substrate transmission port on the transmission chamber; A base is disposed inside the vacuum reaction chamber; An electrostatic chuck, which is mounted on the base, is used to place the substrate; A focusing ring, which surrounds the electrostatic chuck, is used to adjust the electric field and temperature distribution around the substrate; A cover ring, which surrounds the focusing ring, is used to support the focusing ring; A lifting device, which is located below the focusing ring, is used to lift the focusing ring.

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