Sensor matrix and image acquisition method, packaging structure and packaging method

Abstract

The present invention discloses a sensor matrix and an image acquisition method, a packaging structure and a packaging method, which relate to the field of image acquisition technology, and include a substrate and at least one image acquisition unit, wherein the sides of each two adjacent image acquisition units are tightly fixedly connected in sequence; the image acquisition units welded adjacently in sequence are respectively fixed on one side of the substrate and form an image acquisition matrix array; each image acquisition unit includes at least two image sensors, and the arrangement mode between the multiple image sensors is the same as the arrangement mode of the image acquisition units. The present invention can avoid the risk of device wear during the mechanical movement of traditional electronic devices by welding and fixing multiple image sensors arranged in a matrix array on a substrate, greatly reducing the loss of image sensors and devices connected to the image sensors, and by reducing the degree of wear of the image sensors, it is beneficial to improve the service life and reliability of the sensor system.

Description

Technical Field

[0001] The present invention relates to the field of image acquisition technology, and in particular to a sensor matrix and an image acquisition method, a packaging structure and a packaging method. Background Art

[0002] In the process of collecting images, in order to achieve effective observation of distant imaging objects, the current mainstream solution is to use a zoom lens or a mobile image sensor to obtain images. Among them, the zoom lens can be divided into an AF (Auto Focus) motor with only autofocus function and an OIS (Optical Image Stabilization) motor with both anti-shake effect according to whether it has an anti-shake effect. It is not difficult to see that the zoom lens can change the focal length within a certain range when shooting the target object, and obtain camera lenses with different widths of field of view, different sizes of images and different ranges of scenery.

[0003] Since zoom lenses can change the shooting range by changing the focal length without changing the shooting distance, zoom lenses are usually beneficial to picture composition; at the same time, as a type of lens, zoom lenses have a variable focal length and can play the role of several fixed-focus lenses, so they are helpful in reducing the amount of photographic equipment carried. However, zoom lenses are expensive and bulky, which is not conducive to promoting and expanding the audience of zoom lenses.

[0004] In addition, although both the AF motor and the OIS motor can achieve accurate focus on the object by driving the lens to move in the direction of the optical axis, and the latter can allow the lens to move in a plane perpendicular to the optical axis, both the AF motor and the OIS motor require instant movement and focusing of the moving parts during the focusing process. Due to wear and tear during the mechanical movement of electronic devices, the reliability and service life of existing image imaging devices are limited. On the other hand, due to the complex structure of the moving parts of existing image imaging devices, the response feedback speed of the moving parts is insufficient, which makes it difficult to meet the shooting requirements of high-speed moving objects, which is not conducive to ensuring the timeliness of shooting high-speed objects, resulting in great difficulty in capturing the subject with existing zoom lenses. Summary of the invention

[0005] The purpose of the present invention is to provide an image acquisition matrix array with a single distance from the lens, which can avoid the risk of device wear caused by mechanical movement of traditional electronic devices during zooming. On the other hand, the use of an image sensor array with a fixed distance from the lens can not only effectively reduce the complexity of the sensor system structure, but also improve the connection stability of the internal structure of the sensor system, which is conducive to ensuring the response feedback speed of the moving parts, meeting the needs of shooting high-speed moving objects, and ensuring the timeliness of capturing the subject.

[0006] In a first aspect, to achieve the above-mentioned purpose, the present invention provides a sensor matrix, comprising a substrate and at least one image acquisition unit, wherein the substrate is made of single crystal silicon, and the substrate can serve as a mechanical support structure of the image acquisition unit. Since the substrate is a silicon crystal thin slice, the heat generated by the image acquisition unit can be continuously transferred to prevent the image acquisition unit from overheating, and to avoid the overheating of the substrate affecting the performance of electronic devices in the image acquisition unit. A silicon dioxide layer is formed on the surface of the substrate, which can serve as an insulating layer between the image acquisition unit and the image acquisition unit to improve the insulation strength of the image acquisition unit. The sides of each two adjacent image acquisition units are tightly fixedly connected in sequence, and the adjacent sides are connected in sequence. The welded image acquisition units are respectively fixed on one side of the substrate and form an image acquisition matrix array; each of the image acquisition units includes at least two image sensors, and the arrangement of the plurality of image sensors on the horizontal and vertical planes is the same as the arrangement of the image acquisition units; the length of the image acquisition matrix array from the optical center of the lens adapted thereto is a fixed value, a transparent positioning ring is welded on the inner wall of the lens, the transparent positioning ring and the lens have a common center line, the transparent positioning ring is a transparent hard ring, a protective lens is fixed on the inner wall of the transparent positioning ring, and the protective lens can provide dust-proof, waterproof and impact-proof protection for the front lens group and the rear lens group in the lens.

[0007] As a further solution of the present invention, a first phototransistor and a processor are fixed through the top of the transparent positioning ring; a reserved belt is formed between the substrate and the image acquisition unit, and a second phototransistor is connected to the top of the reserved belt. The projection contours of the first phototransistor and the second phototransistor on the horizontal plane are independent of each other, which can prevent the light received by the second phototransistor from being blocked by the first phototransistor. The bases of the first phototransistor and the second phototransistor are respectively exposed to the external environment for receiving the irradiation of the light entering the lens. When the shading component of the lens is turned on, the external light passes through the transparent positioning ring and the reserved belt in sequence. The band reaches the image acquisition unit. When the light reaches the transparent positioning ring, the lens of the base of the first phototransistor focuses the light on the semiconductor junction, so that the collector and emitter of the first phototransistor are turned on, and the circuit connected to the first phototransistor is turned on at the same time, and the first timer is triggered to start timing. The collector of the first phototransistor is connected to the positive electrode of the power supply, and the negative electrode of the power supply is connected to the resistor. The two ends of the resistor are connected in parallel to the first timer. After the first timer starts timing, the first timing signal is transmitted to the first subtractor. Similarly, when the light passes through the transparent positioning ring and irradiates the reserved band, the base lens of the second phototransistor on the reserved band focuses the light The light is gathered on the semiconductor junction and its collector and emitter are turned on, and the circuit connected to the second phototransistor is turned on. The collector of the second phototransistor is connected to the positive electrode of the power supply, and the emitter of the second phototransistor is connected to one end of the resistor. One end of the resistor is connected to the negative electrode of the power supply and is connected in parallel to the second timer. When the second phototransistor receives light, the second timer is triggered. The second timer transmits a timing signal to the first subtractor. The first subtractor is a subtraction circuit that can subtract the first timing signal from the second timing signal and output the difference between the two. The difference enters the second subtractor and is compared with the standard interval signal. When the difference is If the standard interval signals are equal or the difference between the two is within the error range, it indicates that the distance between the transparent positioning ring and the image acquisition unit is the preset distance, and it can quickly determine that the refraction intensity of the optical lens in the lens to the light meets expectations, the relative position between the lens and the image acquisition unit is within the standard range, and the focal length and optical center of the lens have not changed, which is conducive to reducing the difficulty of inspection and maintenance of the lens; when the second subtractor compares the difference value with the standard interval signal and finds that the difference between the two exceeds the error range, it indicates that the optical lens in the lens has failed. At this time, the early warning display unit connected to the output end of the second subtractor displays a fault alarm signal.

[0008] As a further solution of the present invention, the early warning display unit is an alarm signal light, a buzzer, or a combination of the two.

[0009] As a further solution of the present invention, the image acquisition unit includes a first image sensor, a second image sensor, a third image sensor and a fourth image sensor welded on the substrate; the first image sensor, the second image sensor, the third image sensor and the fourth image sensor are arranged in a matrix array, and the first image sensor, the second image sensor, the third image sensor and the fourth image sensor can form a 1×4 or 2×2 image sensor matrix or square array, which is convenient for adapting the pixel matrix included in the image acquisition unit to form a continuous photosensitive area, and the image acquisition unit can convert the light signal reflected by the object or incident by sunlight into a one-dimensional time-series electrical signal and further amplify and process it to form a digital image, which is convenient for memory storage, and the distances between the first image sensor, the second image sensor, the third image sensor and the fourth image sensor and the optical center of the lens are equal.

[0010] As a further solution of the present invention, the first image sensor, the second image sensor, the third image sensor and the fourth image sensor respectively include a photosensitive element layer, a circuit layer, a filter layer and a microlens; each of the photosensitive element layers is grown on the same side of the substrate, the circuit layer is fixedly laid on the top surface of the photosensitive element layer, a filter layer is fixed on the top of the circuit layer, and a microlens is fixed directly above the filter layer. The focal lengths of the microlenses are the same, and the microlenses converge the light entering the lens onto the filter layer to filter out noise light. The light filtered further enters the circuit layer to process the light intensity information and output the maximum pixel.

[0011] As a further solution of the present invention, the focal lengths of the microlenses are the same, thereby ensuring that the microlenses have the same ability to converge light, so as to uniformly collect and converge the light intensity of the image sensor, maintain a gradient effect of the same light intensity as the photographed scene, and help ensure the authenticity of the imaging.

[0012] As a further solution of the present invention, each of the microlenses is a convex lens having at least one arcuate surface. The microlenses gather light onto the filter layer. The convex lens can ensure the convergence of light, which is beneficial for converging the received light to the filter layer. Specifically, the microlens may include an upward convex arcuate surface and a flat portion facing the arcuate surface, or may include an upward convex arcuate surface and a lower convex surface facing the arcuate surface. The light is converged twice by two convex portions in opposite directions, which can have a stronger light converging ability than a lens with a single upward convex arcuate surface.

[0013] As a further scheme of the present invention, the outer contour of the total photosensitive area of ​​each image acquisition unit is an overall photosensitive area, and the outer contour of the overall photosensitive area is a circular, rectangular or regular polygonal contour. The overall photosensitive area is a continuous planar area. The overall photosensitive area with a circular outer contour can adapt to the shape of the lens, and the overall photosensitive area with a rectangular outer contour can adapt to the pixel matrix with the same rectangular outer contour, which is conducive to obtaining an imaging effect that adapts to the pixel matrix and maintaining the integrity of the imaging. The overall photosensitive area with a polygonal contour is conducive to expanding the arrangement of different image sensors based on the rectangular matrix arrangement, and is convenient for the integration of image sensors.

[0014] As a further solution of the present invention, the projection outer contour of the overall photosensitive area facing the lens is located within the projection area of ​​the lens on the projection surface. By keeping the outer contour of the observed overall photosensitive area within the projection area of ​​the lens on the projection surface, the integrity of the imaging can be ensured and incomplete imaging can be avoided.

[0015] In a second aspect, a packaging structure is also proposed, the packaging structure includes a lens, an aperture, a dark box, a body, a PCB board, and a sensor matrix as described in the above scheme, the lens protects the lens assembly in the lens through a protective lens, which can reduce the wear risk of the lens assembly in the lens, the aperture is used to adjust the amount of light entering the lens, and the central axis of the aperture is collinear with the central axis of the lens;

[0016] The lens comprises a front lens group and a rear lens group, the lens can capture an optical image of an external scene and focus it on an image sensor, the front lens group and the rear lens group can respectively realize amplification, focusing and transmission of light entering the lens, the lens is connected to an aperture through the rear lens group, each of the image acquisition units is respectively fixed to the same side of a PCB board by substrate welding, the PCB board is packaged at the connection between the dark box and the body, one side of the dark box is integrally formed with a connector detachably connected to the lens, the connector is adapted to be snap-connected with the lens, the connector can fix the lens to the dark box, and is convenient for replacement, maintenance and disassembly of the lens.

[0017] In a third aspect, a packaging method is also proposed for preparing a packaging structure as described in the above scheme, wherein the packaging method includes welding a plurality of image acquisition units to one side of a substrate to obtain an image sensor matrix with the same focal length, and by fixing and welding the image acquisition units to one side of the substrate, the image sensor matrix can focus and transmit light of the same photographed scene, and the fixed image acquisition unit can avoid mechanical movement of electronic components, and prevent mechanical wear of the image acquisition unit and reduce the service life of the packaging structure. On the one hand, it can reduce the device loss of the packaging structure and reduce the image acquisition cost, and on the other hand, it is conducive to reducing the volume and weight of the packaging structure, so as to facilitate the expansion of the audience.

[0018] A PCB board welded with a plurality of image acquisition units is encapsulated inside the fuselage, and an image processing circuit welded on the PCB board can electronically correct the acquired image, reduce the degree of image distortion, and improve the accuracy of image information transmission;

[0019] A dark box is welded at the part of the body facing the center of the substrate to facilitate the formation of an inverted and upside-down image for imaging;

[0020] Assembling the lens at one end of the darkbox so that the lens is fixedly connected to the body and maintaining a fixed connection between the lens and the body can save lens focusing time and help ensure the response speed of the shutter to capture photos.

[0021] In a fourth aspect, an image acquisition method is also proposed, the image acquisition method comprising:

[0022] The packaging structure described in the above embodiment can avoid the image sensor from being worn out during the mechanical movement of the moving device.

[0023] The lens is pointed directly at the object and a certain distance is created between the lens and the object, so that the light reflected by the object enters the lens and is further focused on the photosensitive element layer;

[0024] Adjusting the height of the camera body relative to the object to be photographed can maintain the imaging range of the image after shooting;

[0025] The packaging structure is moved linearly along the central axis of the lens and images are collected synchronously. The collected image signals are converted into electrical signals by the image sensor and transmitted to the image processing circuit on the PCB for further processing.

[0026] The photographer simultaneously observes the clarity of the image in the imaging area and obtains a clear image in the field of view by adjusting the distance between the lens and the object being photographed;

[0027] When the image of the subject is clearly displayed in the image display area, press the shutter button to complete the shooting and end the image acquisition process.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] 1. The present invention can avoid the risk of device wear during mechanical movement of traditional electronic devices by welding and fixing multiple image sensors arranged in a matrix array on a substrate, greatly reduce the loss of image sensors and devices connected to the image sensors, and reduce the degree of wear of image sensors. It is beneficial to improve the service life and reliability of the sensor system, and can greatly reduce the cost of image acquisition, which is conducive to the promotion and use of image acquisition equipment, while expanding the audience using the image sensor.

[0030] 2. The present invention adopts an image sensor array with a fixed distance from the lens and an image acquisition lens with a single fixed focal length, which can not only effectively reduce the complexity of the sensor system structure, but also improve the connection stability of the internal structure of the sensor system, which is beneficial to ensure the response feedback speed of the shutter photography, meet the needs of shooting high-speed moving objects, and ensure the timeliness of capturing moving objects.

[0031] 3. The present invention receives light from the transparent positioning ring and the reserved belt respectively through the first phototransistor and the second phototransistor, and can cooperate with the timer unit and the subtractor module to output a difference signal, and receives the difference signal through the early warning display unit. When the difference signal reaches the trigger value of the early warning, the early warning display unit sends out an early warning signal alarm. According to whether the early warning display unit sends out the early warning signal, the user can quickly determine whether the distance between the lens and the image acquisition unit is a fixed expected value. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a three-dimensional partial exploded structural diagram of the present invention;

[0033] Figure 2 It is a structural diagram of the image acquisition matrix array of the present invention;

[0034] Figure 3 This is a structural diagram of the distance detection between the lens and the image acquisition matrix of the present invention;

[0035] Figure 4 This is a circuit diagram for detecting the fixed focal length of the lens of the present invention;

[0036] Figure 5 The structure diagram of the photosensitive area of ​​the circular contour of the present invention;

[0037] The descriptions of the reference numerals are as follows:

[0038] 1-lens; 101-transparent positioning ring; 102-protective lens; 2-connector; 3-aperture; 4-dark box; 5-body; 6-PCB board; 7-image acquisition unit; 701-first image sensor; 702-second image sensor; 703-third image sensor; 704-fourth image sensor; 8-substrate; 801-reserved belt; 9-first phototransistor; 10-second phototransistor; 11-warning display unit DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0040] like Figure 1 The figure shows a three-dimensional partial decomposition structure diagram of the present invention, which provides a sensor matrix, including a substrate 8 and at least one image acquisition unit 7. The substrate 8 is made of single crystal silicon. The substrate 8 can serve as a mechanical support structure of the image acquisition unit 7. Since the substrate 8 is a silicon crystal thin slice, the heat generated by the image acquisition unit 7 can be continuously transferred to prevent the image acquisition unit 7 from overheating, and to avoid the substrate 8 overheating from affecting the performance of electronic devices in the image acquisition unit 7.

[0041] Preferably, a silicon dioxide layer is formed on the surface of the substrate 8, which can serve as an insulating layer between the substrate 8 and the image acquisition unit 7 to improve the insulation strength of the image acquisition unit 7. The sides of every two adjacent image acquisition units 7 are tightly and fixedly connected in sequence, and the image acquisition units 7 welded adjacent to each other in sequence are respectively fixed on one side of the substrate 8 to form an image acquisition matrix array; each image acquisition unit 7 includes at least two image sensors, and the arrangement of the multiple image sensors on the horizontal and vertical planes is the same as the arrangement of the image acquisition units 7; the length of the image acquisition matrix array from the optical center of the lens 1 adapted thereto is a fixed value, and a transparent positioning ring 101 is welded on the inner wall of the lens 1, and the transparent positioning ring 101 is co-centering with the lens 1, and the transparent positioning ring 101 is made of crystalline silicon or a transparent resin ring, and a protective lens 102 is fixed on the inner wall of the transparent positioning ring 101, and the protective lens 102 can protect the front lens group and the rear lens group in the lens 1 from dust, water and impact.

[0042] like Figure 2The image acquisition matrix array structure diagram of the present invention is shown, the image acquisition unit 7 includes a first image sensor 701, a second image sensor 702, a third image sensor 703 and a fourth image sensor 704 welded on a substrate 8; the first image sensor 701, the second image sensor 702, the third image sensor 703 and the fourth image sensor 704 are arranged in a matrix array, and the distances between the first image sensor 701, the second image sensor 702, the third image sensor 703 and the fourth image sensor 704 and the optical center of the lens are equal. The first image sensor 701, the second image sensor 702, the third image sensor 703 and the fourth image sensor 704 form a 2×2 or 1×4 image sensor matrix, which is convenient for adapting the pixel matrix included in the image acquisition unit 7 to form a continuous photosensitive area. The image acquisition unit 7 can convert the light signal reflected by the object or the sunlight into a one-dimensional time-series electrical signal and further amplify and process it to form a digital image, which is convenient for memory storage.

[0043] Preferably, the first image sensor 701, the second image sensor 702, the third image sensor 703 and the fourth image sensor 704 respectively include a photosensitive element layer, a circuit layer, a filter layer and a microlens; each photosensitive element layer is grown on the same side of the substrate 8, the circuit layer is fixedly laid on the top surface of the photosensitive element layer, a filter layer is fixed on the top of the circuit layer, and a microlens is fixed directly above the filter layer. The focal lengths of the microlenses are the same, and the microlenses converge the light entering the lens 1 onto the filter layer to filter out noise light. The light filtered further enters the circuit layer to process the light intensity information and output the maximum pixel.

[0044] Preferably, the focal lengths of the microlenses are the same, thereby ensuring that the microlenses have the same light convergence capabilities, so as to uniformly collect and converge the light intensity of the image sensor, maintain a gradient effect of the same light intensity as the photographed scene, and help ensure the authenticity of the imaging.

[0045] Preferably, each microlens is a convex lens having at least one arcuate surface. The microlens gathers light onto the filter layer. The convex lens can ensure the convergence of light, which is conducive to converging the received light to the filter layer. Specifically, the microlens may include an upward convex arcuate surface and a flat portion facing the arcuate surface, or may include an upward convex arcuate surface and a lower convex surface facing the arcuate surface. The light is converged twice by two convex portions in opposite directions, which can have a stronger light converging ability than a lens with a single upward convex arcuate surface.

[0046] like Figure 3The figure shows the distance detection structure diagram of the lens and the image acquisition matrix of the present invention, wherein the first phototransistor 9 is fixed through the top of the transparent positioning ring 101; a reserved belt 801 is formed between the substrate 8 and the image acquisition unit 7, and the top of the reserved belt 801 is connected to the second phototransistor 10, and the projection contours of the first phototransistor 9 and the second phototransistor 10 on the horizontal plane are independent of each other, which can prevent the light received by the second phototransistor 10 from being blocked by the first phototransistor 9, and the bases of the first phototransistor 9 and the second phototransistor 10 are respectively exposed to the external environment.

[0047] like Figure 4The figure shows a local optical path detection circuit diagram of the present invention. The bases of the first phototransistor 9 and the second phototransistor 10 receive light entering the lens 1 by being exposed to the external environment. When the light shielding component of the lens 1 is turned on, the external light passes through the transparent positioning ring 101 and the reserved belt 801 in sequence to reach the image acquisition unit 7. When the light reaches the transparent positioning ring 101, the lens of the base of the first phototransistor 9 focuses the light on the semiconductor junction, so that the collector and emitter of the first phototransistor 9 are turned on, and the circuit connected to the first phototransistor 9 is turned on at the same time, and the first timer is triggered. The collector of the first phototransistor 9 is connected to the positive electrode of the power supply, and the negative electrode of the power supply is connected to the resistor. The two ends of the resistor are connected in parallel to the first timer. After the timer starts timing, the first timing signal is transmitted to the first subtractor. Similarly, when the light passes through the transparent positioning ring 101 and irradiates the reserved belt 801, the base lens of the second phototransistor 10 on the reserved belt 801 focuses the light on the semiconductor junction and turns on its collector and emitter, and at the same time turns on the circuit connected to the second phototransistor 10. The collector of the second phototransistor 10 is connected to the positive electrode of the power supply, and the emitter of the second phototransistor 10 is connected to one end of the resistor, and one end of the resistor is connected to the negative electrode of the power supply and connected in parallel to the second timer. The first timer and the second timer constitute a timer unit. When the second phototransistor 10 receives light, the second timer is triggered, and the second timer transmits a timing signal to the first subtractor. The first The subtractor is a subtraction circuit, which can subtract the first timing signal from the second timing signal and output the difference between the two. The difference enters the second subtractor and is compared with the standard interval signal. When the difference is equal to the standard interval signal or the difference between the two is within the error range, it indicates that the distance between the transparent positioning ring 101 and the image acquisition unit 7 is the preset distance, and it can quickly determine that the refraction intensity of the optical lens in the lens 1 to the light meets the expectation, the relative position between the lens 1 and the image acquisition unit 7 is within the standard range, and the focal length and optical center of the lens 1 have not changed, which is conducive to reducing the difficulty of inspection and maintenance of the lens 1; when the second subtractor finds that the difference between the difference and the standard interval signal exceeds the error range after comparing the difference, it indicates that the optical lens in the lens 1 has a fault. Fault, at this time, the early warning display unit 11 connected to the output end of the second subtractor displays a fault alarm signal, the first subtractor and the second subtractor constitute a subtractor module, and receive the light on the transparent positioning ring 101 and the reserved belt 801 respectively through the first phototransistor 9 and the second phototransistor 10, and can cooperate with the timer unit and the subtractor module to output a difference signal, and receive the difference signal through the early warning display unit 11. When the difference signal reaches the trigger value of the early warning trigger, the early warning display unit 11 sends out an early warning signal alarm. According to whether the early warning display unit 11 sends out an early warning signal, the user can quickly determine whether the distance between the lens 1 and the image acquisition unit 7 is a fixed expected value, which is convenient for the user to inspect and maintain the lens 1.

[0048] like Figure 5 The structure diagram of the circular-shaped photosensitive area of ​​the present invention is shown in FIG. The outer contour of the total photosensitive area of ​​each image acquisition unit 7 is the overall photosensitive area. The outer contour of the overall photosensitive area is circular, and the overall photosensitive area is a continuous planar area. Figure 5 The overall photosensitive area of ​​the circular outline is divided into continuous a plane area, b plane area, c plane area, d plane area and e plane area. The overall photosensitive area of ​​the circular outer outline can adapt to the shape of the lens 1, and the overall photosensitive area of ​​the rectangular outer outline can adapt to the pixel matrix of the same rectangular outer outline, which is conducive to obtaining the imaging effect of the adapted pixel matrix and maintaining the integrity of the imaging. The overall photosensitive area of ​​the polygonal outline is conducive to expanding the arrangement of different image sensors on the basis of the rectangular matrix arrangement, which is convenient for the integration of image sensors.

[0049] Preferably, the projected outer contour of the entire photosensitive area facing the lens 1 is located within the projection area of ​​the lens 1 on the projection surface. By keeping the outer contour of the observed entire photosensitive area within the projection area of ​​the lens 1 on the projection surface, the integrity of the imaging can be ensured and incomplete imaging can be avoided.

[0050] Combination Figure 1 A packaging structure is also proposed, which includes a lens 1, an aperture 3, a dark box 4, a body 5, a PCB board 6 and an image acquisition unit 7 as described above. The lens 1 protects the lens assembly in the lens 1 through a protective lens 102, which can reduce the wear risk of the lens assembly in the lens 1. The aperture 3 is used to adjust the amount of light entering the lens 1, and the central axis of the aperture 3 is collinear with the central axis of the lens 1.

[0051] Preferably, the lens 1 includes a front lens group and a rear lens group. The lens 1 can capture an optical image of an external scene and focus it on an image sensor. The front lens group and the rear lens group can respectively realize amplification, focusing and transmission of light entering the lens 1. The lens 1 is connected to the aperture 3 through the rear lens group. Each image acquisition unit 7 is respectively fixed to the same side of the PCB board 6 by welding through the substrate 8. The PCB board 6 is packaged at the connection between the dark box 4 and the body 5. A connector 2 detachably connected to the lens 1 is integrally formed on one side of the dark box 4. The connector 2 is adapted to be snap-fitted to the lens 1. The connector 2 can fixedly connect the lens 1 to the dark box 4, which is convenient for replacement, maintenance and disassembly of the lens 1.

[0052] Combination Figure 1A packaging method is also proposed for preparing a packaging structure of an image acquisition unit 7 as in the above-mentioned scheme. The packaging method includes welding a plurality of image acquisition units 7 to one side of a substrate 8 to obtain an image sensor matrix with the same focal length. By fixing and welding the image acquisition unit 7 to one side of the substrate 8, the image sensor matrix can focus and transmit light of the same photographed scene. The fixed image acquisition unit 7 can avoid mechanical movement of electronic components and prevent mechanical wear of the image acquisition unit 7 to reduce the service life of the packaging structure. On the one hand, it can reduce the device loss of the packaging structure and reduce the image acquisition cost. On the other hand, it is conducive to reducing the volume and weight of the packaging structure, which is convenient for expanding the audience.

[0053] Preferably, a PCB board 6 welded with multiple image acquisition units 7 is encapsulated inside the body 5, and the image processing circuit welded on the PCB board 6 can electronically correct the acquired image, reduce the degree of image distortion, and improve the accuracy of image information transmission. A dark box 4 is welded at a position of the body 5 facing the center of the substrate 8 to facilitate the formation of an inverted and inverted image, and to facilitate imaging. A lens 1 is assembled at one end of the dark box 4 to fix the lens 1 to the body 5. Maintaining the fixed connection between the lens 1 and the body 5 can save the focusing time of the lens 1, which is beneficial to ensuring the response speed of the shutter capture.

[0054] Combination Figure 1 , and also proposes an image acquisition method, the image acquisition method comprising:

[0055] The packaging structure made of the image sensor of the image acquisition unit 7 of the above embodiment can avoid the wear and tear of the image sensor during the mechanical movement of the moving device;

[0056] The lens 1 is pointed directly at the object to be photographed and a certain distance is formed between the object to be photographed, so that the light reflected by the object can enter the lens 1 and be further focused on the photosensitive element layer;

[0057] Adjusting the height of the fuselage 5 relative to the object to be photographed from the ground can maintain the imaging range of the image after shooting;

[0058] The packaging structure is linearly moved along the central axis of the lens 1 and images are collected synchronously. The collected image signals are converted into electrical signals by the image sensor and transmitted to the image processing circuit on the PCB board 6 for further processing.

[0059] The photographer simultaneously observes the clarity of the image in the imaging area, and obtains a clear image in the field of view by adjusting the distance between the lens 1 and the object being photographed;

[0060] When the image of the subject is clearly displayed in the image display area, press the shutter button to complete the shooting and end the image acquisition process.

[0061] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A sensor matrix, characterized in that: The sensor matrix comprises: substrate; At least one image acquisition unit, the sides of every two adjacent image acquisition units are tightly and fixedly connected in sequence; The image acquisition units welded adjacent to each other in sequence are respectively fixed on one side of the substrate to form an image acquisition matrix array; Each of the image acquisition units comprises at least two image sensors, and the arrangement of the plurality of image sensors is the same as that of the image acquisition units; The distance between the image acquisition matrix array and the optical center of the lens adapted thereto is a fixed value; A transparent positioning ring is welded on the inner wall of the lens, and the transparent positioning ring and the lens share a central line; a first phototransistor and a processor are fixed through the top of the transparent positioning ring; a reserved belt is formed between the substrate and the image acquisition unit, and a second phototransistor is connected to the top of the reserved belt, and the projection contours of the first phototransistor and the second phototransistor on the horizontal plane are independent of each other; wherein, The bases of the first phototransistor and the second phototransistor are respectively exposed to the external environment and are used to receive the irradiation of the light entering the lens. When the shading component of the lens is turned on, the external light passes through the transparent positioning ring and the reserved belt in sequence to reach the image acquisition unit; when the light reaches the transparent positioning ring, the lens of the base of the first phototransistor focuses the light on the semiconductor junction, so that the collector and emitter of the first phototransistor are turned on, and at the same time, the circuit connected to the first phototransistor is turned on, and the first timer is triggered to start timing. The collector of the first phototransistor is connected to the positive electrode of the power supply, and the negative electrode of the power supply is connected to the resistor. The two ends of the resistor are connected in parallel to the first timer. After the first timer starts timing, the first timing signal is transmitted to the first subtractor; when the light passes through the transparent positioning ring and irradiates the reserved belt, the base lens of the second phototransistor on the reserved belt focuses the light on the semiconductor junction and makes its collector and emitter turned on, and at the same time, the first timer starts timing. The circuit connected by the two phototransistors is turned on, the collector of the second phototransistor is connected to the positive electrode of the power supply, the emitter of the second phototransistor is connected to one end of the resistor, one end of the resistor is connected to the negative electrode of the power supply and is connected in parallel to the second timer. When the second phototransistor receives light, the second timer is triggered, and the second timer transmits a second timing signal to the first subtractor; the first subtractor is used to subtract the first timing signal from the second timing signal and output the difference between the two, the difference enters the second subtractor and is compared with the standard interval signal, when the difference is equal to the standard interval signal or the difference between the two is within the error range, it indicates that the distance between the transparent positioning ring and the image acquisition unit is the preset distance; when the second subtractor finds that the difference between the difference and the standard interval signal exceeds the error range after comparing the difference, it indicates that the optical lens in the lens is faulty, and at this time, the early warning display unit connected to the output end of the second subtractor displays a fault alarm signal.

2. A sensor matrix according to claim 1, characterized in that: The image acquisition unit includes a first image sensor, a second image sensor, a third image sensor and a fourth image sensor welded on the substrate; the first image sensor, the second image sensor, the third image sensor and the fourth image sensor are arranged in a matrix array, and the distances between the first image sensor, the second image sensor, the third image sensor and the fourth image sensor and the optical center of the lens are equal.

3. A sensor matrix according to claim 2, characterized in that: The first image sensor, the second image sensor, the third image sensor and the fourth image sensor respectively include a photosensitive element layer, a circuit layer, a filter layer and a microlens; each of the photosensitive element layers is grown on the same side of the substrate, the circuit layer is fixedly laid on the top surface of the photosensitive element layer, a filter layer is fixed on the top of the circuit layer, and a microlens is fixed above the filter layer.

4. A sensor matrix according to claim 3, characterized in that: The focal lengths of the micro lenses are the same.

5. A sensor matrix according to claim 3, characterized in that: Each of the microlenses is a convex lens having at least one arc-shaped surface, and the microlens gathers light onto the filter layer.

6. A sensor matrix according to claim 1, characterized in that: The outer contour of the total photosensitive area of ​​each image acquisition unit is the overall photosensitive area, and the outer contour of the overall photosensitive area is a circular, rectangular or regular polygonal contour.

7. A sensor matrix according to claim 6, characterized in that: The projection outer contour of the overall photosensitive area facing the lens is located within the projection area of ​​the lens on the projection surface.

8. A packaging structure, characterized in that: The packaging structure comprises a lens, an aperture, a dark box, a body, a PCB board and a sensor matrix as claimed in any one of claims 1 to 7; The lens includes a front lens group and a rear lens group, the lens is connected to the aperture through the rear lens group, each of the image acquisition units is fixed to the same side of the PCB board by substrate welding, the PCB board is packaged at the connection between the dark box and the body, and a connector detachably connected to the lens is integrally formed on one side of the dark box.

9. A packaging method for preparing the packaging structure according to claim 8, characterized in that: The packaging method comprises: A plurality of image acquisition units are welded to one side of a substrate to obtain an image sensor matrix having the same focal length; Encapsulating a PCB board welded with a plurality of image acquisition units inside the fuselage; Welding a dark box at a position of the fuselage facing the center of the substrate; Assemble the lens at one end of the dark box so that the lens is fixedly connected to the body.

10. An image acquisition method, characterized in that: The image acquisition method comprises: Adopting the packaging structure as claimed in claim 8; Point the lens directly at the subject and keep a certain distance from the subject; Adjust the height of the camera body relative to the object being photographed; The packaging structure is linearly moved along the central axis of the lens and images are collected synchronously; The photographer simultaneously observes the clarity of the image within the imaging area; When the image of the subject is clearly displayed in the image display area, press the shutter button to complete the shooting.

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